Wafer holder for vacuum chamber

Abstract

This utility model discloses a wafer support for a vacuum cavity, relating to the technical field of wafer support. The utility model aims to solve the problem of wafer transfer accuracy. It includes a cavity and a support, with the support installed within the cavity. The support is arc-shaped and concentric with the cavity. The support includes a pair of symmetrically arranged lower universal supports, a first upper support, and a second upper support. The pair of lower universal supports are installed in the cavity using perforated screws. The first and second upper supports are respectively installed on the lower universal supports on both sides using ordinary screws. The support structure is simple and has low overall manufacturing cost. By setting the support to an arc shape concentric with the cavity, it ensures that the wafer falls precisely in the center position when the robotic arm picks up and places the wafer, guaranteeing transfer accuracy.

Description

Technical Field

[0001] This utility model relates to the technical field of PECVD process equipment, specifically a wafer support for a vacuum chamber. Background Technology

[0002] PECVD processes need to be performed in a vacuum or low-pressure environment to maintain plasma stability and avoid gas contamination. The loadlock module, as the transition area between the wafer and the vacuum chamber, needs to be evacuated quickly and kept clean. The wafer support, in turn, needs to have high vacuum compatibility (low outgassing rate) and high temperature resistance (typically withstanding 300-500°C). Utility Model Content

[0003] To address the aforementioned problems, specifically those raised in the background section, this invention provides a wafer support for a vacuum chamber, comprising a chamber and a support. The support is installed within the chamber and is arc-shaped, concentric with the chamber. The support includes a pair of symmetrically arranged lower universal supports, a first upper support, and a second upper support. The pair of lower universal supports are installed in the chamber using perforated screws, while the first and second upper supports are respectively installed on the lower universal supports on both sides using ordinary screws.

[0004] A further feature of this invention is that the working end of the bracket on the inner wall is provided as a pair of protruding base plates, and a ramp is provided at the connection between the base plates and the inner wall.

[0005] A further feature of this invention is that the base plate is provided with hemispherical protrusions.

[0006] A further feature of this invention is that the diameter of the protrusion is set to one millimeter.

[0007] A further feature of this invention is that the protrusions are subjected to hard anodizing treatment.

[0008] The beneficial technical effects of this utility model are as follows: the support structure is simple and the overall manufacturing cost is low. By setting the support to an arc shape concentric with the cavity, it is ensured that the wafer falls exactly in the center position when the robot picks up and places the wafer, thus ensuring wafer transfer accuracy. The lower support is fixed to the cavity with screws with holes to prevent local gas residue from causing the cavity to fail to draw the base pressure. The bump height is set to 1mm, which can reduce contact stress and prevent the high-temperature wafer after the process from warping and deforming and contacting the support, causing relative sliding and generating particles, which would affect cleanliness. There is a slope transition between the wafer support surface and the top surface of the support, which increases the movement space when placing the wafer and avoids collisions when placing the wafer. The bumps are hard anodized to improve the corrosion resistance, wear resistance, weather resistance, and insulation of the part in contact with the wafer, thereby increasing the service life. Attached Figure Description

[0009] Figure 1 A schematic diagram of the overall structure of this solution is shown.

[0010] Figure 2 A perspective view of the internal connection of the bracket is shown.

[0011] Figure 3 A schematic diagram of the main structure of the support is shown.

[0012] Figure 4 A top view of the support structure is shown.

[0013] The attached diagram shows: 1. Lower general-purpose bracket; 2. First upper bracket; 3. Second upper bracket; 4. Cavity; 5. Screw with hole; 6. Ordinary screw. Detailed Implementation

[0014] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0015] This utility model proposes a wafer support for a vacuum chamber. The chamber 4 is a circular cavity, and the support is made of 6061 aluminum. The support is symmetrically arranged inside the chamber 4 and is set as an arc structure concentric with the chamber 4 to ensure that the wafer falls exactly in the center when the robot handles the wafer, thus ensuring wafer transfer accuracy. The support is divided into upper and lower layers. The lower layer is connected to the chamber 4 by a hole screw 5, and the upper and lower layers are connected by ordinary screws 6 to prevent local gas residue from causing the chamber to fail to draw the base pressure. The lower layer uses a lower general-purpose support 1, which is symmetrically arranged inside the chamber 4. The upper layer uses a first upper support 2 and a second upper support 3, which are respectively arranged on the lower layer through support 1 on both sides.

[0016] The working surface of the support is set on the arc-shaped inner wall. The working surface is a base plate symmetrically set on the inner wall of the support. A ramp transition is set between the base plate and the support 1 to increase the movement space when placing the wafer and avoid collisions when placing the wafer.

[0017] The base plate is equipped with hemispherical bumps with a height of one millimeter to prevent the high-temperature wafer after the process from warping and deforming and coming into contact with the support, causing relative sliding and generating particles that would affect cleanliness. The bumps are treated with hard anodizing to improve the corrosion resistance, wear resistance, weather resistance, and insulation of the part in contact with the wafer, thereby increasing its service life.

[0018] Although the present invention has been described with reference to preferred embodiments, various modifications can be made to it and components can be replaced with equivalents without departing from the scope of the present invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0019] In the description of this utility model, terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0021] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0022] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A wafer support for a vacuum cavity, comprising a cavity (4) and a support, wherein the support is installed in the cavity (4), characterized in that: The bracket is set in an arc shape and is concentric with the cavity (4). The bracket includes a pair of symmetrically arranged lower universal brackets (1), a first upper bracket (2) and a second upper bracket (3). The pair of lower universal brackets (1) are installed in the cavity (4) by open screws (5). The first upper bracket (2) and the second upper bracket (3) are respectively installed on the lower universal brackets (1) on both sides by ordinary screws (6).

2. The wafer holder for a vacuum chamber according to claim 1, wherein: The working end of the bracket on the inner wall is configured as a pair of protruding base plates, and the connection between the base plates and the inner wall is provided with a ramp.

3. The wafer holder for a vacuum chamber according to claim 2, wherein: The base plate is provided with hemispherical protrusions.

4. The wafer holder for a vacuum chamber according to claim 3, wherein: The height of the protrusion is set to one millimeter.

5. The wafer holder for a vacuum chamber according to claim 3 or 4, wherein: The protrusions are subjected to hard anodizing treatment.

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