Heat exchanger and engine
By introducing Peltier structures and semiconductor particle arrays into the heat exchanger, the problem of insufficient freshwater heating and cooling capacity in the existing technology has been solved, enabling temperature regulation of the engine under different operating conditions and stable lubricating oil performance, thereby improving the efficiency and reliability of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WEICHAI POWER CO LTD
- Filing Date
- 2025-06-06
- Publication Date
- 2026-07-10
Smart Images
Figure CN224480062U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of refrigeration technology, and in particular relates to a heat exchanger and an engine. Background Technology
[0002] Marine heat exchangers are important equipment used on ships to achieve heat transfer and exchange, and are widely used in various systems of ships.
[0003] Shell-and-tube heat exchangers are a common type of marine heat exchanger. They are indirect heat exchangers that use the walls of tube bundles enclosed in a shell as the heat transfer surface.
[0004] Existing marine shell-and-tube heat exchangers have the following disadvantages due to their structure:
[0005] 1. It can only cool fresh water, but cannot heat it. When the engine is starting or under low speed and low load conditions, the temperature of the fresh water used to cool the engine may be lower than the optimal operating temperature range. This will cause the internal temperature of the engine to be too low, making it difficult to ignite the combustible mixture or causing slow combustion, resulting in a decrease in engine power. In addition, the lubricating oil will also become more viscous due to the low temperature, increasing the resistance to the movement of machine parts, leading to difficulties in mechanical operation and poor combustion.
[0006] 2. The temperature of seawater outside the ship is strongly correlated with the ambient air temperature. Especially when the ambient temperature is high, the cooling capacity of seawater is limited and the cooling efficiency is low. The seawater in the heat exchanger cannot quickly cool the fresh water to the required temperature, resulting in the fresh water temperature being higher than the optimal operating temperature range. This causes the lubricating oil temperature to rise and the viscosity to decrease, resulting in poor lubrication effect on the engine, aggravating the wear of moving parts, and leading to major engine damage accidents. Utility Model Content
[0007] This utility model aims to at least partially solve one of the technical problems in the related art.
[0008] On one hand, embodiments of this application propose a heat exchanger, including a shell and heat exchange tubes. The shell defines a cavity within itself and includes an inlet and an outlet for a medium to be cooled, communicating with the cavity. The cavity is used to contain the medium to be cooled. The shell also includes a shell portion, at least a portion of which is a Peltier structure. The heat exchange tubes are disposed within the cavity and are used to transport the heat exchange medium when the cavity contains the medium to be cooled, so that the medium to be cooled and the heat exchange medium can exchange heat.
[0009] According to one aspect of the embodiments of this application, the Peltier structure includes a first substrate, a semiconductor particle group, and a second substrate connected sequentially from the inside out, wherein one of the first substrate and the second substrate can form a cold end substrate and the other can form a hot end substrate.
[0010] According to one aspect of the present application, a first metal coating is disposed between the first substrate and the semiconductor particle group.
[0011] According to one aspect of the embodiments of this application, the thickness of the first metal coating is 30nm-60nm.
[0012] According to one aspect of the present application, a second metal coating is disposed between the second substrate and the semiconductor particle group.
[0013] According to one aspect of the embodiments of this application, the thickness of the second metal coating is 30nm-60nm.
[0014] According to one aspect of the embodiments of this application, the inlet and outlet of the medium to be cooled are spaced apart along the flow direction of the medium to be cooled.
[0015] According to one aspect of the present application, the heat exchanger further includes a first adapter connected to the shell portion, and the inlet of the medium to be cooled is disposed at the first adapter.
[0016] According to one aspect of the present application, the heat exchanger further includes a second adapter connected to the shell portion, and the outlet of the medium to be cooled is disposed at the second adapter.
[0017] According to one aspect of the present application, the housing further includes a first end cap and a second end cap, both of which are sealed to the housing portion, and at least one of the first end cap and the second end cap is detachably connected to the housing portion.
[0018] On the other hand, embodiments of this application also propose an engine, including a controller and a heat exchanger as described above. The heat exchanger further includes a water tank, which is connected to the shell and communicates with the cavity. A temperature sensor is disposed inside the water tank, and the controller is electrically connected to the temperature sensor and the shell.
[0019] The heat exchanger provided in this application includes a shell and heat exchange tubes. When the medium to be cooled needs to be heated, it enters the cavity through the medium inlet. Since at least a portion of the shell is a Peltier structure, the shell can heat the medium to be cooled. The medium, heated to a suitable temperature, flows out through the medium outlet. When the medium to be cooled needs to be cooled, it enters the cavity through the medium inlet. The heat exchange tubes within the cavity transport the heat exchange medium, allowing heat exchange between the heat exchange medium and the medium to be cooled, thus cooling the medium. When the heat exchange medium transported by the heat exchange tubes cannot cool the medium to a suitable temperature, the shell, being at least a portion of the shell, can further cool the medium. The medium, cooled to a suitable temperature, flows out through the medium outlet. Therefore, this heat exchanger can achieve both heating and deep cooling of the medium to be cooled. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the structure of a heat exchanger provided in one embodiment of the present invention;
[0022] Figure 2 A schematic diagram of the shell structure provided in one embodiment of this utility model. Figure 1 ;
[0023] Figure 3 A schematic diagram of the shell structure provided in one embodiment of this utility model. Figure 2 ;
[0024] Figure 4 A schematic diagram of the internal structure of a heat exchanger provided in one embodiment of the present invention;
[0025] Figure 5 A flowchart of a control method for a heat exchanger provided in one embodiment of the present invention.
[0026] The annotations in the attached figures are explained as follows:
[0027] 1. Heat exchanger;
[0028] 11. Outer shell; 111. Shell portion; 1111. First substrate; 1112. Semiconductor particle assembly; 1113. Second substrate; 112. First end cap; 113. Second end cap; 114. Cavity; 115. Inlet of cooling medium; 116. Outlet of cooling medium; 117. First metal coating; 118. Second metal coating;
[0029] 12. Heat exchanger tubes;
[0030] 13. Water tank;
[0031] 14. First adapter; 141. First sealing groove;
[0032] 15. Second adapter; 151. Second sealing groove;
[0033] 16. Third adapter; 161. Heat exchange medium inlet;
[0034] 17. Fourth adapter; 171. Heat exchange medium outlet;
[0035] 18. Fold the edges;
[0036] 2. Controller;
[0037] 3. Temperature sensor. Detailed Implementation
[0038] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.
[0039] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movement of components in a specific posture (as shown in the figures). If the specific posture changes, the directional indication will also change accordingly. The terms "comprising" and "having," and any variations thereof, in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.
[0040] Please see Figure 1 and Figure 4 On one hand, embodiments of this application provide a heat exchanger 1, which includes a housing 11 and heat exchange tubes 12. The housing 11 defines a cavity 114 within itself and includes an inlet 115 and an outlet 116 for a medium to be cooled, both communicating with the cavity 114. The cavity 114 is used to contain the medium to be cooled. The housing 11 also includes a shell portion 111, at least a portion of which is a Peltier structure. The heat exchange tubes 12 are disposed within the cavity 114 and are used to transport the heat exchange medium when the cavity 114 contains the medium to be cooled, so that the medium to be cooled and the heat exchange medium can exchange heat.
[0041] In some embodiments, the outer shell 11 can have various structures, such as a cylinder or a cuboid.
[0042] In some embodiments, the shape of the cooling medium inlet 115 can be circular or polygonal. For example, the cooling medium inlet 115 is circular.
[0043] In some embodiments, the shape of the cooling medium outlet 116 can be circular or polygonal. The shape of the cooling medium outlet 116 can be the same as or different from the shape of the cooling medium inlet 115. For example, the cooling medium outlet 116 is circular.
[0044] In some embodiments, the medium to be cooled may be, but is not limited to, fresh water. The heat exchange medium may be, but is not limited to, seawater.
[0045] In some embodiments, the number of heat exchange tubes 12 is not limited, and the number of heat exchange tubes 12 is designed according to the heat dissipation requirements of the engine under common operating conditions.
[0046] In some embodiments, the heat exchange tube 12 may be made of a thermally conductive metal. Specifically, the heat exchange tube 12 may be made of, but is not limited to, aluminum or copper.
[0047] The heat exchanger 1 provided in this application includes a shell 11 and heat exchange tubes 12. When the medium to be cooled needs to be heated, the medium enters the cavity 114 through the medium inlet 115. Since at least a portion of the shell 111 has a Peltier structure, the shell 111 can heat the medium to be cooled. After being heated to a suitable temperature, the medium to be cooled flows out through the medium outlet. When the medium to be cooled needs to be cooled, the medium enters the cavity 114 through the medium inlet 115. The heat exchange tubes 12, which are disposed in the cavity 114, transport the heat exchange medium, enabling heat exchange between the heat exchange medium and the medium to be cooled, thereby cooling the medium to be cooled. When the heat exchange medium transported by the heat exchange tubes 12 cannot cool the medium to a suitable temperature, since at least a portion of the shell 111 has a Peltier structure, the shell 111 can further cool the medium to be cooled. After being cooled to a suitable temperature, the medium to be cooled flows out through the medium outlet. Therefore, this heat exchanger 1 can achieve both heating and deep cooling of the medium to be cooled.
[0048] Please see Figures 2 to 4 In some embodiments, the Peltier structure includes a first substrate 1111, a semiconductor particle group 1112, and a second substrate 1113 connected sequentially from the inside out. One of the first substrate 1111 and the second substrate 1112 can form a cold-end substrate, and the other can form a hot-end substrate. When the medium to be cooled needs to be heated, it enters the cavity 114 through the medium inlet 115. The first substrate 1111 forms the hot-end substrate, and the second substrate 1113 forms the cold-end substrate, thus heating the medium. After being heated to a suitable temperature, the medium flows out through the medium outlet 116. When the medium to be cooled needs to be cooled, it enters the cavity 114 through the medium inlet 115. The heat exchange tube 12 disposed within the cavity 114 transports the heat exchange medium, allowing heat exchange between the heat exchange medium and the medium to be cooled, thereby cooling the medium. When the heat exchange medium transported by the heat exchange tube 12 is unable to cool the medium to a suitable temperature, the first substrate 1111 forms a cold end substrate and the second substrate 1113 forms a hot end substrate, thereby achieving further cooling of the medium to be cooled. The medium to be cooled, after being cooled to a suitable temperature, flows out from the medium outlet 116. Therefore, the heat exchanger 1 can achieve both heating and deep cooling of the medium to be cooled.
[0049] In some embodiments, the first substrate 1111 may be made of metal. Specifically, the first substrate 1111 is a steel plate. For example, the material of the first substrate 1111 is Q235 steel.
[0050] In some embodiments, the second substrate 1113 may be made of metal. The second substrate 1113 and the first substrate 1111 may be made of the same or different materials. Specifically, the second substrate 1113 is a steel plate. For example, the material of the second substrate 1113 is Q235 steel.
[0051] In some embodiments, the semiconductor particle assembly 1112 includes P-type semiconductors and N-type semiconductors. When energized, one end of the semiconductor particle assembly 1112 forms a cold end for cooling, and the other end forms a hot end for heating. At this time, a first substrate 1111 or a second substrate 1113 connected to the cold end of the semiconductor particle assembly 1112 forms a cold end substrate, and a first substrate 1111 or a second substrate 1113 connected to the hot end of the semiconductor particle assembly 1112 forms a hot end substrate. Furthermore, the material of the semiconductor particle assembly 1112 may be, but is not limited to, bismuth antimonide.
[0052] In some embodiments, a first metal coating 117 is provided between the first substrate 1111 and the semiconductor particle group 1112. By providing the first metal coating 117 between the first substrate 1111 and the semiconductor particle group 1112, the thermal conductivity of the shell 111 interface can be improved, thereby improving the efficiency of heating or cooling the medium to be cooled in the cavity 114.
[0053] Furthermore, the first metal coating 117 may be, but is not limited to, a silver coating.
[0054] In some embodiments, the thickness of the first metal coating 117 is 30nm-60nm. Setting the thickness of the first metal coating 117 to 30nm-60nm can minimize costs while meeting the thermal conductivity requirements of the shell portion 111 interface. For example, the thickness of the first metal coating 117 can be 30nm, 40nm, 50nm, 60nm, or any combination of two of the above values.
[0055] In some embodiments, a second metal coating 118 is provided between the second substrate 1113 and the semiconductor particle group 1112. By providing the second metal coating 118 between the second substrate 1113 and the semiconductor particle group 1112, the thermal conductivity of the shell 111 interface can be improved, thereby improving the efficiency of heating or cooling the medium to be cooled in the cavity 114.
[0056] Furthermore, the second metal coating 118 may be, but is not limited to, a silver coating.
[0057] In some embodiments, the thickness of the second metal coating 118 is 30 nm to 60 nm. Setting the thickness of the second metal coating 118 to 30 nm to 60 nm can minimize costs while meeting the thermal conductivity requirements of the shell portion 111 interface. For example, the thickness of the second metal coating 118 can be 30 nm, 40 nm, 50 nm, 60 nm, or any combination of two of the above values.
[0058] In some embodiments, the cooling medium inlet 115 and the cooling medium outlet 116 are spaced apart along the flow direction of the cooling medium. By spaced apart the cooling medium inlet 115 and the cooling medium outlet 116 along the flow direction of the cooling medium, on the one hand, the cooling medium entering the cavity 114 from the cooling medium inlet 115 can fully exchange heat with the heat exchange medium in the heat exchange tube 12, and on the other hand, the shell portion 111 can fully heat or cool the cooling medium entering the cavity 114 from the cooling medium inlet 115.
[0059] Please see Figure 1 and Figure 4 In some embodiments, the heat exchanger 1 further includes a first adapter 14, which is connected to the housing 111, and a medium inlet 115 is disposed on the first adapter 14. By providing the first adapter 14 connected to the housing 111 and disposing of the medium inlet 115 on the first adapter 14, external devices can be connected to the heat exchanger 1 through the first adapter 14, facilitating the entry of the medium to be cooled from the external devices into the cavity 114 through the medium inlet 115.
[0060] In some embodiments, the first adapter 14 can be connected to the housing 111 by welding or can be integrally formed with the housing 111.
[0061] In some embodiments, a first sealing groove 141 is provided on the connecting surface of the first adapter 14. The first sealing groove 141 is arranged around the inlet 115 of the medium to be cooled. A first sealing element is provided in the first sealing groove 141. The heat exchanger 1 achieves a sealed connection with the external equipment through the first sealing groove 141 on the first adapter 14 and the first sealing element therein.
[0062] In some embodiments, the first seal may be, but is not limited to, made of rubber.
[0063] In some embodiments, the heat exchanger 1 further includes a second adapter 15, which is connected to the housing 111, and a cooling medium outlet 116 is disposed on the second adapter 15. By providing a second adapter 15 connected to the housing 111 and a cooling medium inlet 115 disposed on the second adapter 15, external devices can be connected to the heat exchanger 1 through the second adapter 15, and the cooling medium can flow into the external devices from the cavity 114 through the cooling medium outlet 116.
[0064] In some embodiments, the second adapter 15 can be connected to the housing 111 by welding or can be integrally formed with the housing 111.
[0065] In some embodiments, a second sealing groove 151 is provided on the connecting surface of the second adapter 15. The second sealing groove 151 is arranged around the outlet 116 of the medium to be cooled. A second sealing element is provided in the second sealing groove 151. The heat exchanger 1 achieves a sealed connection with the external equipment through the second sealing groove 151 on the second adapter 15 and the second sealing element therein.
[0066] In some embodiments, the second seal may be, but is not limited to, made of rubber.
[0067] In some embodiments, the outer casing 11 further includes a first end cap 112 and a second end cap 113, both of which are sealed to the casing portion 111, and at least one of the first end cap 112 and the second end cap 113 is detachably connected to the casing portion 111. By configuring both the first end cap 112 and the second end cap 113 to be sealed to the casing portion 111, leakage of the medium to be cooled within the cavity 114 from the connection between the first end cap 112 and the casing portion 111 or from the second end cap 113 and the casing portion 111 is prevented. By configuring at least one of the first end cap 112 and the second end cap 113 to be detachably connected to the casing portion 111, when the heat exchange tube 12 is damaged, the first end cap 112 or the second end cap 113 can be removed from the casing portion 111, and the heat exchange tube 12 can be taken out for maintenance.
[0068] In some embodiments, at least one of the first end cap 112 and the second end cap 113 may be detachably connected to the housing 111 by means of screwing, or at least one of the first end cap 112 and the second end cap 113 may be detachably connected to the housing 111 by means of inserting one into the other.
[0069] In some embodiments, the first end cap 112 may be made of metal. Specifically, the first end cap 112 is made of gray cast iron. For example, the material of the first end cap 112 is HT200.
[0070] In some embodiments, the second end cap 113 may be made of metal. The material of the second end cap 113 may be the same as or different from that of the first end cap 112. Specifically, the material of the second end cap 113 is gray cast iron. For example, the material of the second end cap 113 is HT200.
[0071] In some embodiments, along the flow direction of the medium to be cooled, both ends of the shell portion 111 are respectively provided with flanges 18, which are bent and connected to the shell portion 111. A first connecting hole is provided on the flange 18, and a second connecting hole is provided on the first end cap 112. The first end cap 112 is connected to the shell portion 111 by a first fastener passing through the first and second connecting holes. A third connecting hole is provided on the second end cap 113, and the second end cap 113 is connected to the shell portion 111 by a second fastener passing through the first and third connecting holes. Exemplarily, the first fastener can be a bolt and a nut, and the second fastener can also be a bolt and a nut.
[0072] In some embodiments, the heat exchanger 1 further includes a third adapter 16, which is connected to the first end cap 112 or the second end cap 113, and the heat exchange medium inlet 161 is disposed at the third adapter 16.
[0073] Furthermore, the third adapter 16 can be connected to the first end cap 112 or the second end cap 113 by welding, or it can be integrally formed with the first end cap 112 or the second end cap 113.
[0074] In some embodiments, the heat exchanger 1 further includes a fourth adapter 17, which is connected to the first end cap 112 or the second end cap 113, and the heat exchange medium outlet 171 is disposed at the fourth adapter 17.
[0075] Furthermore, the fourth adapter 17 can be connected to the first end cap 112 or the second end cap 113 by welding, or it can be integrally formed with the first end cap 112 or the second end cap 113.
[0076] Please see Figure 1 and Figure 4 This application also proposes an engine, including a controller 2 and a heat exchanger 1 as described above. The heat exchanger 1 further includes a water tank 13, which is connected to the shell 111 and communicates with the cavity 114. A temperature sensor 3 is disposed inside the water tank 13, and the controller 2 is electrically connected to the temperature sensor 3 and the shell 111. Since the engine includes the aforementioned heat exchanger 1, it also has the advantage of being able to heat and deeply cool the medium to be cooled.
[0077] Please see Figures 1 to 5This application also proposes a control method for the aforementioned heat exchanger. When the controller 2 is powered on, and the temperature sensor 3 in the water tank 13 detects that the temperature of the medium to be cooled is lower than the set temperature, i.e., the first set value (e.g., 60°), the controller 2 controls the end of the semiconductor particle group 1112 connected to the first substrate 1111 to form a hot end for heating, and the end connected to the second substrate 1113 to form a cold end for cooling. At this time, the first substrate 1111 forms a hot end substrate, the second substrate 1113 forms a cold end substrate, and the heat exchanger 1 heats the medium to be cooled in the cavity 114.
[0078] When the temperature sensor 3 in the water tank 13 detects that the temperature of the medium to be cooled is higher than the set temperature, i.e. the second set value (e.g., 80°), the controller 2 controls the semiconductor particle group 1112 to form a cold end for cooling at one end connected to the first substrate 1111 and a hot end for heating at the other end connected to the second substrate 1113. At this time, the first substrate 1111 forms a cold end substrate and the second substrate 1113 forms a hot end substrate, and the heat exchanger 1 cools the medium to be cooled in the cavity 114.
[0079] When the temperature sensor 3 inside the water tank 13 detects that the temperature of the medium to be cooled is between the first set value (e.g., 60°) and the second set value (e.g., 80°), the controller 3 performs a power-off operation, that is, the semiconductor particle group 1112 does not work.
[0080] In some embodiments, controller 2 may be, but is not limited to, a computer control module (ECU, electronic control unit).
[0081] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0082] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0083] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0084] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0085] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0086] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A heat exchanger, characterized in that, include: The housing defines a cavity therein and includes an inlet and an outlet for a medium to be cooled communicating with the cavity, the cavity being used to contain the medium to be cooled, and the housing also includes a shell portion, at least a portion of which is a Peltier structure; A heat exchange tube is disposed within the cavity. The heat exchange tube is used to transport the heat exchange medium when the cavity contains the medium to be cooled, so that the medium to be cooled and the heat exchange medium can exchange heat.
2. The heat exchanger according to claim 1, characterized in that, The Peltier structure includes a first substrate, a semiconductor particle group, and a second substrate connected sequentially from the inside out. One of the first substrate and the second substrate can form a cold end substrate, and the other can form a hot end substrate.
3. The heat exchanger according to claim 2, characterized in that, A first metal coating is disposed between the first substrate and the semiconductor particle group.
4. The heat exchanger according to claim 3, characterized in that, The thickness of the first metal coating is 30nm-60nm.
5. The heat exchanger according to claim 2, characterized in that, A second metal coating is disposed between the second substrate and the semiconductor particle group.
6. The heat exchanger according to claim 5, characterized in that, The thickness of the second metal coating is 30nm-60nm.
7. The heat exchanger according to claim 1, characterized in that, Along the flow direction of the medium to be cooled, the inlet and outlet of the medium to be cooled are spaced apart.
8. The heat exchanger according to claim 1, characterized in that, The heat exchanger further includes a first adapter, which is connected to the shell, and the inlet of the medium to be cooled is disposed at the first adapter; And / or, the heat exchanger further includes a second adapter connected to the shell, and the outlet of the medium to be cooled is disposed at the second adapter.
9. The heat exchanger according to claim 1, characterized in that, The outer casing also includes a first end cap and a second end cap, both of which are sealed to the casing portion, and at least one of the first end cap and the second end cap is detachably connected to the casing portion.
10. An engine, characterized in that, The engine includes a controller and a heat exchanger as described in any one of claims 1-9. The heat exchanger further includes a water tank connected to the shell and communicating with the cavity. A temperature sensor is disposed inside the water tank. The controller is electrically connected to the temperature sensor and the shell.