A multifunctional patch device for chip packaging

Abstract

The utility model discloses a multifunctional paster device for chip packaging, which comprises a base, a detachable paster strip arranged on the base and a placement plate, a plurality of chip grooves are arranged on the paster strip, the placement plate is arranged on the upper side of the base and can rotate, a plurality of storage positions are uniformly arranged on the placement plate to place a plurality of patches, a pressing plate is rotatably arranged at one end of the storage position, a pressing groove is arranged on the pressing plate and communicates with the storage position, so that the patch in the storage position can slide into the pressing groove. Compared with the prior art, the utility model has the advantages that when the patch is pasted, the chip cover plate in the pressing groove and the chip in the chip groove can be effectively pasted together through the rotation of the pressing plate when the chip cover plate is slidably fixed in the pressing groove; a plurality of chips can be pasted simultaneously through the plurality of chip grooves, and the efficiency is higher.

Description

Technical Field

[0001] This utility model relates to the field of chip mounting, specifically a multifunctional chip mounting device for chip packaging. Background Technology

[0002] Package designation refers to the housing used to mount semiconductor integrated circuit chips. It not only serves to mount, fix, seal, and protect the chip, and enhance its electrical and thermal performance, but also connects the chip's contacts to the package's pins via wires. These pins, in turn, connect to other devices on the printed circuit board, thus enabling the connection between the internal chip and external circuitry. On one hand, it isolates the chip from the external environment, preventing impurities in the air from corroding the chip's circuitry and causing a decline in electrical performance; on the other hand, packaged chips are easier to install and transport.

[0003] Currently, when performing small-batch surface mount technology (SMT) assembly, only one chip can be mounted on the cover plate at a time, and the loading of the cover plate is quite time-consuming. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the above-mentioned technical problems and provide a multifunctional chip packaging device.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is: a multifunctional chip mounting device for chip packaging, comprising:

[0006] Base, removable patch strips and placement plate mounted on the base;

[0007] The patch strip has multiple chip slots;

[0008] The placement plate is rotatably located on the upper side of the base;

[0009] The placement plate is evenly provided with multiple storage positions for placing multiple patches;

[0010] One end of the storage position is rotatably provided with a pressing plate, and the pressing plate is provided with a pressing groove. The pressing groove is connected to the storage position so that the patch of the storage position can slide into the pressing groove.

[0011] When the pressing plate rotates, the patch in the pressing groove can fit with the chip in the chip slot.

[0012] Preferably, the base is provided with a placement groove, the patch strip can be placed in the placement groove and limited, and the chip slots are evenly arranged on the upper side of the patch strip.

[0013] Preferably, a rotating seat is provided on one side of the base, a fixed shaft is fixedly provided on the inner side of the rotating seat, and one end of the placement plate is rotatably sleeved on the outer side of the fixed shaft.

[0014] Preferably, one end of the pressing plate is connected to a rotating rod that is rotatably sleeved on the outside of the fixed shaft.

[0015] Preferably, one end of the storage position is provided with a sliding plate connected by a spring.

[0016] Preferably, the placement plate is connected to a limiting rod on the outside of the storage position.

[0017] Preferably, the two inner walls of the pressing groove are hinged with extrusion plates, and the other end of the extrusion plates is connected to a spring embedded in the inner wall of the pressing groove.

[0018] Preferably, the placement plate is provided with a limiting groove on one side of the pressing plate, a spring is connected in the limiting groove, and the other end of the spring is connected to a limiting plate.

[0019] Preferably, one end of the pressing plate is connected to a gripping rod, and the placement plate is provided with a rotating groove for placing the gripping rod.

[0020] Preferably, the patch strip is provided with a gripping groove.

[0021] The advantages of this utility model compared with the prior art are as follows:

[0022] During chip mounting, when the chip cover is slidably fixed in the pressing groove, the rotation of the pressing plate can effectively bond the chip cover in the pressing groove and the chip in the chip groove.

[0023] Multiple chip slots allow for simultaneous chip placement, resulting in higher efficiency.

[0024] Multiple chip covers can be placed in the storage compartment. After the pressing plate rotates and attaches the cover, the chip can be quickly loaded into the pressing slot again, which is more efficient. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0026] Figure 2 This is a schematic diagram of the structure of the pressing plate of this utility model in the rotating state.

[0027] Figure 3 This is a schematic diagram of the limiting plate structure of this utility model.

[0028] Figure 4 This is a schematic diagram of the extrusion plate structure of this utility model.

[0029] As shown in the figure: 1. Base; 2. Patch strip; 3. Placement plate; 4. Chip slot; 5. Storage position; 6. Pressing plate; 7. Pressing groove; 8. Placement groove; 9. Rotating seat; 10. Fixed shaft; 11. Rotating rod; 12. Sliding plate; 13. Limiting rod; 14. Extrusion plate; 15. Limiting plate; 16. Holding rod; 17. Holding groove; 18. Limiting groove; 19. Rotating groove. Detailed Implementation

[0030] In the description of this utility model, it should be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. Additionally, the term "comprising" and any variations thereof are intended to cover non-exclusive inclusion.

[0031] Please see the appendix Figures 1-4 A multifunctional chip mounting device for chip packaging, comprising:

[0032] Base 1, removable patch strip 2 and placement plate 3 mounted on base 1;

[0033] The patch strip 2 is provided with multiple chip slots 4;

[0034] The placement plate 3 is rotatably located on the upper side of the base 1;

[0035] The placement plate 3 is evenly provided with multiple storage positions 5 for placing multiple patches;

[0036] One end of the storage position 5 is rotatably provided with a pressing plate 6, and the pressing plate 6 is provided with a pressing groove 7. The pressing groove 7 is connected to the storage position 5 so that the patch of the storage position 5 can slide into the pressing groove 7.

[0037] When the pressing plate 6 rotates, the patch in the pressing groove 7 can be attached to the chip in the chip groove 4.

[0038] Specifically, multiple chips can be pre-placed in the mounting strip 2 and placed directly on the base 1 before the cover plate is attached, improving efficiency. The placement plate 3 can rotate on the base 1 and can be attached and stored together, saving space. Multiple unattached cover plates can be placed in the storage position 5, facilitating quick loading. In the pressing groove 7, the rotation of the pressing plate 6 facilitates the attachment of the mounting cover plate to the chip in the chip slot 4.

[0039] In some specific embodiments, the base 1 is provided with a placement groove 8, the patch strip 2 can be placed in the placement groove 8 and limited, and the chip slots 4 are evenly arranged on the upper side of the patch strip 2.

[0040] Specifically, after the chip slot 4 on the patch strip 2 is attached, the patch strip 2 is removed and replaced with another patch strip 2 to facilitate continuous patching operations.

[0041] In some specific embodiments, a rotating seat 9 is provided on one side of the base 1, and a fixed shaft 10 is fixedly provided on the inner side of the rotating seat 9. One end of the placement plate 3 is rotatably sleeved on the outer side of the fixed shaft 10.

[0042] Specifically, this allows the placement plate 3 to rotate on the rotating seat 9.

[0043] In some specific embodiments, one end of the pressing plate 6 is connected to a rotating rod 11 that is rotatably sleeved on the outside of the fixed shaft 10.

[0044] Specifically, the pressing plate 6 can rotate on the outside of the rotating rod 11, which facilitates the tight bonding of the pressing plate 6 and the patch strip 2.

[0045] In some specific embodiments, one end of the storage position 5 is connected to a sliding plate 12 via a spring.

[0046] Specifically, after the chip cover plate in the pressing groove 7 is attached, and after the rotating and placing plate 3 is attached, the unattached cover plate in the storage position 5 can be squeezed and slid into the pressing groove 7 by the spring and the sliding plate 12.

[0047] In some specific embodiments, the placement plate 3 is connected to a limiting rod 13 on the outside of the storage position 5.

[0048] Specifically, it facilitates the stable sliding of the chip cover plate within the storage position 5 via the limiting rod 13.

[0049] In some specific embodiments, the two inner walls of the pressing groove 7 are hinged with a pressing plate 14, and the other end of the pressing plate 14 is connected to a spring embedded in the inner wall of the pressing groove 7.

[0050] Specifically, when the chip cover is pressed into the extrusion groove, the extrusion plate 14 is pressed and fixed by the action of the spring.

[0051] In some specific embodiments, the placement plate 3 is provided with a limiting groove 18 on one side of the pressing plate 6, a spring is connected in the limiting groove 18, and a limiting plate 15 is connected to the other end of the spring.

[0052] Specifically, when the pressing plate 6 rotates away from the placement plate 3, the fiberboard slides out of the limiting groove 18 through the spring and the limiting plate 15 to limit the uninstalled patch cover plate in the storage position 5 and prevent it from sliding out.

[0053] In some specific embodiments, one end of the pressing plate 6 is connected to a gripping rod 16, and the placement plate 3 is provided with a rotating groove 19 for placing the gripping rod 16.

[0054] Specifically, the pressing plate 6 is rotated by manually gripping the grip lever 16.

[0055] In some specific embodiments, the patch strip 2 is provided with a gripping groove 17.

[0056] Specifically, it facilitates manual handling by gripping and picking up the patch strip 2.

[0057] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0058] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A multifunctional chip mounting device for chip packaging, characterized in that, include: Base (1), removable patch strip (2) and placement plate (3) provided on base (1); The patch strip (2) is provided with multiple chip slots (4); The placement plate (3) is rotatably located on the upper side of the base (1); The placement plate (3) is evenly provided with multiple storage positions (5) for placing multiple patches; One end of the storage position (5) is rotatably provided with a pressing plate (6), and the pressing plate (6) is provided with a pressing groove (7). The pressing groove (7) can communicate with the storage position (5) so that the patch of the storage position (5) can slide into the pressing groove (7). When the pressing plate (6) rotates, the patch in the pressing groove (7) can be attached to the chip in the chip groove (4).

2. The multifunctional chip mounting device for chip packaging according to claim 1, characterized in that, The base (1) is provided with a placement groove (8), the patch strip (2) can be placed in the placement groove (8) and the chip slot (4) is evenly arranged on the upper side of the patch strip (2).

3. A multifunctional chip mounting device for chip packaging according to claim 2, characterized in that, The base (1) has a rotating seat (9) on one side, and a fixed shaft (10) is fixedly provided on the inner side of the rotating seat (9). One end of the placement plate (3) is rotatably sleeved on the outer side of the fixed shaft (10).

4. A multifunctional chip mounting device for chip packaging according to claim 1, characterized in that, One end of the pressing plate (6) is connected to a rotating rod (11) that is rotatably sleeved on the outside of the fixed shaft (10).

5. A multifunctional chip mounting device for chip packaging according to claim 1, characterized in that, One end of the storage position (5) is connected to a sliding plate (12) via a spring.

6. A multifunctional chip mounting device for chip packaging according to claim 1, characterized in that, The placement plate (3) is connected to a limiting rod (13) on the outside of the storage position (5).

7. A multifunctional chip mounting device for chip packaging according to claim 1, characterized in that, The two inner walls of the pressing groove (7) are hinged with a pressing plate (14), and the other end of the pressing plate (14) is connected to a spring embedded in the inner wall of the pressing groove (7).

8. A multifunctional chip mounting device for chip packaging according to claim 1, characterized in that, The placement plate (3) is provided with a limiting groove (18) on one side of the pressing plate (6), and a spring is connected in the limiting groove (18), and the other end of the spring is connected to a limiting plate (15).

9. A multifunctional chip mounting device for chip packaging according to claim 1, characterized in that, One end of the pressing plate (6) is connected to a gripping rod (16), and the placement plate (3) is provided with a rotating groove (19) for placing the gripping rod (16).

10. A multifunctional chip mounting device for chip packaging according to claim 1, characterized in that, The patch strip (2) is provided with a gripping groove (17).

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