A raw material positioning device for a high-power TVS diode for vehicles

Abstract

This utility model discloses a positioning device for high-power TVS diode raw materials in automotive applications. It includes a carbon mold base plate with multiple frames on it. Each frame has multiple carbon mold cover plates that cooperate with the base plate to fix the frames. The cover plates have slots for placement. Small solder pads and primary solder pads are placed on the frames. A chip is placed on the primary solder pad, a secondary solder pad is placed on the chip, and a connecting piece is placed on the secondary solder pad. The device achieves rapid and accurate positioning of the frames on the base plate by engaging the frame positioning pins with the frame positioning holes on the carbon mold base plate, laying the foundation for consistent batch assembly. The cover plate positioning posts of the carbon mold cover plates align with the cover plate positioning holes on the base plate, and the positioning pin receiving holes avoid interference with the frame positioning pins, ensuring precise positioning and preventing interference when the cover plates are fastened. This further secures the frames and each layer of raw materials, preventing component displacement during assembly.

Description

Technical Field

[0001] This utility model relates to the field of automotive diode technology, specifically to a positioning device for raw materials of high-power TVS diodes for automobiles. Background Technology

[0002] The high-power DO-218AB packaged TVS diode for automotive applications is a core automotive component. It is a semiconductor device specifically designed for automotive circuit protection. It is designed to resist damage to sensitive electronic components by transient voltages and is suitable for circuit systems in new energy vehicles and 12V / 24V network protection in traditional vehicles.

[0003] Currently, the industry uses automated assembly machines for production, utilizing trays to support the frame and solder paste as the solder, which also serves a positioning function. First, solder paste is applied to the soldering surface of the frame. Then, the chip is placed on the solder paste on the frame's soldering surface. Next, more solder paste is applied to the chip surface and to the areas on the frame where it contacts the connector. Finally, the connector is placed on top of the solder paste on the chip surface and on the solder paste where the frame and connector contact each other.

[0004] However, the dispensing machine's control over solder paste quantity can be flawed, leading to uneven solder paste application and inconsistent solder thickness after soldering. Furthermore, the pressure applied during chip placement can cause uneven solder paste spread, resulting in chip tilting and inconsistent solder thickness, thus affecting product application and reliability. Simultaneously, volatile flux gases in the solder paste can be trapped, forming solder voids, reducing thermal and electrical conductivity, and impacting surge energy dissipation. Moreover, the active flux in the solder paste may corrode the plastic package or metallization layer of TVS diodes, requiring additional cleaning steps and affecting the cleanliness of subsequent soldering ovens, increasing workload and costs.

[0005] To address this, a positioning device for raw materials of high-power TVS diodes for automotive applications is proposed. Summary of the Invention

[0006] The purpose of this invention is to provide a positioning device for raw materials of high-power TVS diodes for automobiles, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a positioning device for raw materials of high-power TVS diodes for automobiles, comprising a carbon mold base plate, wherein the carbon mold base plate is provided with multiple frames, and the frames are provided with multiple carbon mold cover plates that cooperate with the carbon mold base plate to fix the multiple frames, and the carbon mold cover plates are provided with placement grooves.

[0008] Small solder pads and primary solder pads are placed on the frame. A chip is placed on the primary solder pad, a secondary solder pad is placed on the chip, and a connecting piece is placed on the secondary solder pad.

[0009] Preferably, the upper surface of the carbon mold base plate is provided with a cover plate positioning hole, and the lower surface of the carbon mold cover plate is provided with a cover plate positioning post that matches the cover plate positioning hole.

[0010] Preferably, the upper surface of the carbon mold base plate is also equipped with a plurality of frame positioning pins, and the frame is provided with frame positioning holes that are adapted to the frame positioning pins.

[0011] Preferably, the carbon mold cover plate has a positioning pin receiving hole for accommodating the frame positioning pin.

[0012] Preferably, multiple connecting rods are installed on both sides of the upper surface of the multiple carbon mold cover plates.

[0013] Preferably, the inner top of the placement slot is provided with a beveled surface.

[0014] Preferably, the inner side of the placement groove is adapted to the outer side of the connecting piece.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] 1. The device uses the frame positioning pins and frame positioning holes of the carbon mold base plate to achieve rapid and accurate positioning of the frame on the base plate, laying the foundation for consistency in batch assembly. The cover plate positioning pins of the carbon mold cover plate are connected to the cover plate positioning holes of the base plate, and the positioning pin receiving holes avoid the frame positioning pins, so that the cover plate is fastened without interference and the position is accurate, further fixing the frame and each layer of raw materials and preventing the parts from shifting during the assembly process.

[0017] 2. Solder pads are pre-formed with a fixed shape and volume, resulting in excellent uniformity and consistency, eliminating the problem of uneven solder thickness after product soldering. Furthermore, solder pads contain no flux, unlike the liquid flux in solder paste, which splatters at high temperatures, reducing the risks of bridging and solder balls. There is also no risk of flux contamination, minimizing furnace contamination and process adjustments. Simultaneously, solder pads release less gas during melting, ensuring a lower void ratio, higher mechanical strength, and denser solder joints. They also exhibit superior vibration and fatigue resistance compared to solder paste, making them suitable for the automotive industry. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the structure of a single carbon mold cover plate after it has been removed;

[0020] Figure 3 This is a schematic diagram of the frame positioning pin of this utility model;

[0021] Figure 4This is a schematic diagram of the structure of the cover plate positioning post of this utility model;

[0022] Figure 5 This is a schematic diagram of the structure of the placement groove of this utility model;

[0023] Figure 6 This is an exploded view of the structure of the solder pad, chip, and connector of this utility model.

[0024] In the diagram: 1. Frame; 2. Primary solder pad; 3. Small solder pad; 4. Chip; 5. Secondary solder pad; 6. Connecting piece; 7. Carbon mold base plate; 8. Carbon mold cover plate; 9. Connecting rod; 10. Cover plate positioning hole; 11. Frame positioning pin; 12. Frame positioning hole; 13. Cover plate positioning post; 14. Placement groove; 15. Beveled surface; 16. Positioning pin receiving hole. Detailed Implementation

[0025] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0026] Please see Figure 1-6 This utility model provides a technical solution: a positioning device for high-power TVS diode raw materials for automotive applications, including a carbon mold base plate 7. The carbon mold base plate 7 serves as the basic load-bearing structure of the entire device, providing stable support for the installation and positioning of subsequent components. Multiple frames 1 are provided on the carbon mold base plate 7, and each frame 1 serves as a load-bearing base for the raw materials. A carbon mold cover plate 8 is provided on each frame 1, which cooperates with the carbon mold base plate 7 to restrict and fix the position of the frame 1, preventing displacement of the frame 1 during assembly. A placement groove 14 is provided on the carbon mold cover plate 8, which is used to pre-position the subsequently placed solder pieces and connecting pieces 6, ensuring the accuracy of the placement position of the connecting pieces 6.

[0027] Small solder pads 3 and primary solder pads 2 are placed on the frame 1. The primary solder pads 2 serve as the welding medium between the chip 4 and the frame 1, providing a stable mounting base for the chip 4. Secondary solder pads 5 are placed on the chip 4. The secondary solder pads 5 serve as the welding medium between the chip 4 and the connecting piece 6, achieving a reliable connection between the chip 4 and the connecting piece 6.

[0028] like Figure 3 and Figure 4 As shown: The upper surface of the carbon mold base plate 7 is provided with a cover plate positioning hole 10, and the lower surface of the carbon mold cover plate 8 is provided with a cover plate positioning post 13 that matches the cover plate positioning hole 10. The cover plate positioning hole 10 and the cover plate positioning post 13 cooperate to guide the carbon mold cover plate 8 to be accurately fastened on the carbon mold base plate 7, avoid the carbon mold cover plate 8 from shifting when fastened, ensure the accurate fixing position of the carbon mold cover plate 8 to the frame 1, and thus improve the overall positioning accuracy of each raw material.

[0029] like Figure 3 and Figure 4 As shown: Several frame positioning pins 11 are also installed on the upper surface of the carbon mold base plate 7. The frame 1 is provided with frame positioning holes 12 that are adapted to the frame positioning pins 11. The frame positioning pins 11 cooperate with the frame positioning holes 12 to quickly position the frame 1 in the preset position of the carbon mold base plate 7, ensuring that the frame 1 is evenly distributed and uniformly positioned on the carbon mold base plate 7, thus ensuring the consistency of positioning of each raw material during batch assembly.

[0030] like Figure 3 and Figure 4 As shown: The carbon mold cover plate 8 is provided with a positioning pin receiving hole 16 for accommodating the frame positioning pin 11. The positioning pin receiving hole 16 can accommodate the frame positioning pin 11 when the carbon mold cover plate 8 is fastened, so as to avoid interference between the frame positioning pin 11 and the carbon mold cover plate 8 and thus prevent the cover plate from closing, while further strengthening the fixing effect of the frame 1.

[0031] like Figure 1 and Figure 2 As shown: Multiple connecting rods 9 are installed on both sides of the upper surface of multiple carbon mold cover plates 8. The connecting rods 9 can connect two carbon mold cover plates 8 into a whole, which makes it convenient for operators to fasten or disassemble multiple carbon mold cover plates 8, reducing the tediousness of individual operations, improving the overall assembly efficiency, and avoiding positional deviation when operating individual cover plates.

[0032] like Figure 5 As shown: The inner top of the placement groove 14 is provided with a beveled surface 15. The beveled surface 15 can guide the connecting piece 6 and the welding piece when they are placed into the placement groove 14, reduce the difficulty of alignment when the connecting piece 6 is placed, avoid the connecting piece 6 from colliding with the edge of the placement groove 14 and causing damage to the parts, and at the same time ensure that the connecting piece 6 can fall smoothly into the preset position of the placement groove 14, reducing assembly errors.

[0033] like Figure 5 As shown: the inner side of the placement groove 14 is adapted to the outer side of the connecting piece 6. This adaptation structure can form a circumferential limit on the connecting piece 6 to prevent the connecting piece 6 from shifting in the placement groove 14.

[0034] Working principle: First, using the carbon mold base plate 7 as the core load-bearing foundation, the frame positioning pins 11 on its surface precisely engage with the frame positioning holes 12 on the frame 1, quickly positioning and placing multiple frames 1 in the preset positions on the carbon mold base plate 7. Then, the carbon mold cover plate 8 is fastened so that the cover plate positioning pins 13 on its lower surface precisely align with the cover plate positioning holes 10 on the carbon mold base plate 7. At the same time, the frame positioning pins 11 extend into the positioning pin receiving holes 16 on the cover plate to avoid interference between the two, ensuring a tight fit between the carbon mold cover plate 8 and the carbon mold base plate 7, thereby completing the work of fixing and limiting the position of the frame 1.

[0035] Subsequently, raw materials are placed on frame 1 through placement slot 14 according to the assembly sequence. First, small solder pads 3 and primary solder pads 2 are placed in their corresponding areas on frame 1. Then, chip 4 is placed stably on primary solder pad 2. Next, secondary solder pads 5 are stacked on top of chip 4, and finally, connecting piece 6 is placed. At the same time, the fitting structure inside placement slot 14 and outside connecting piece 6 forms a circumferential limit on connecting piece 6, preventing connecting piece 6 from shifting in the slot and ensuring accurate stacking of each layer of raw materials.

[0036] The entire process utilizes the synergistic effect of multiple positioning structures to achieve precise positioning and stable fixation of various raw materials for automotive high-power TVS diodes, providing a stable assembly foundation for subsequent welding and other processes, and effectively improving assembly accuracy and efficiency.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning device for raw materials of high-power TVS diodes for automobiles, characterized in that: Includes a carbon mold base plate (7), on which multiple frames (1) are provided, and on which multiple carbon mold cover plates (8) are provided that cooperate with the carbon mold base plate (7) to fix the multiple frames (1), and the carbon mold cover plates (8) are provided with placement grooves (14). Small solder pads (3) and primary solder pads (2) are placed on the frame (1), a chip (4) is placed on the primary solder pad (2), a secondary solder pad (5) is placed on the chip (4), and a connecting piece (6) is placed on the secondary solder pad (5).

2. The positioning device for high-power TVS diode raw materials for automobiles according to claim 1, characterized in that: The upper surface of the carbon mold base plate (7) is provided with a cover plate positioning hole (10), and the lower surface of the carbon mold cover plate (8) is provided with a cover plate positioning post (13) that is compatible with the cover plate positioning hole (10).

3. The positioning device for high-power TVS diode raw materials for automobiles according to claim 1, characterized in that: The upper surface of the carbon mold base plate (7) is also equipped with a plurality of frame positioning pins (11), and the frame (1) is provided with frame positioning holes (12) that are compatible with the frame positioning pins (11).

4. The positioning device for high-power TVS diode raw materials for automobiles according to claim 3, characterized in that: The carbon mold cover plate (8) is provided with a positioning pin receiving hole (16) for accommodating the frame positioning pin (11).

5. The positioning device for raw materials of high-power TVS diodes for automobiles according to claim 1, characterized in that: Multiple connecting rods (9) are installed on both sides of the upper surface of the multiple carbon mold cover plates (8).

6. The positioning device for raw materials of high-power TVS diodes for automobiles according to claim 1, characterized in that: The inner top of the placement slot (14) is provided with a beveled surface (15).

7. The positioning device for high-power TVS diode raw materials for automobiles according to claim 1, characterized in that: The inner side of the placement groove (14) is adapted to the outer side of the connecting piece (6).

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