Electronic component for measuring an electric current, printed circuit board and measuring arrangement

Abstract

The invention relates to an electronic component for measuring an electric current, comprising a code applied to a terminal element, characterized in that the terminal element has a raised area on which the code is applied. It further relates to a printed circuit board suitable for connection to such an electronic component and to a measuring arrangement comprising such an electronic component.

Description

[0001] The invention relates to an electronic component for measuring an electrical current, comprising a code applied to a connection element, wherein the connection element has a raised area on which the code is applied. Furthermore, it relates to a circuit board suitable for connection to such an electronic component and a measuring arrangement comprising such an electronic component.

[0002] A resistor arrangement for measuring currents (a "shunt") typically comprises a resistance element made of resistive material and connecting elements made of highly conductive material. The voltage drop across the resistor when current flows is tapped, and the current is determined from this, based on the resistance value. The measurement and evaluation electronics are often mounted on a printed circuit board (PCB) located directly on the shunt.

[0003] Due to high demands on current measurement accuracy and to ensure product traceability, it is necessary to include individual, i.e., product-specific information with each shunt. In addition to a sequential number that uniquely identifies each product, such product-specific information can include the actual resistance value (e.g., determined from an individual measurement) (at room temperature) as well as information on the temperature dependence of the resistance value (TCR curve).

[0004] The options for applying a data matrix code (DMC) to a shunt are limited due to space constraints: The DMC must not be concealed by the PCB. The areas required for contact between the shunt and the surrounding busbars are also not available for applying the DMC. The same applies to the outer areas of the connection elements, where means for connecting the shunt to an external circuit are provided.

[0005] DE 11 2016 002 799 T5 describes a current sensing resistor in which product-specific information is stored in a code display section on the shunt.

[0006] DE 20 2022 104 228 U1 describes an electronic component in which the code display section is mounted in a recess of the shunt surface.

[0007] DE 11 2021 002 813 T5 discloses a shunt resistor with two electrodes connected to a resistance element. An insulating plate is coupled to the electrodes via a melting material, and a marking or label can be applied to the insulating plate.

[0008] It is the object of the present invention to enable a compact application of a code on an electronic component and to enable a process-reliable and high positioning accuracy between the electronic component and the PCB for contacting.

[0009] This object is achieved by an electronic component having the features of claim 1, a printed circuit board according to claim 12, and a measuring arrangement according to claim 13. Advantageous embodiments with expedient further developments of the invention are specified in the dependent claims.

[0010] The invention described above makes it easier to position the electronic component on a circuit board. Furthermore, unlike a recessed design, the code is better protected from dirt particles, slowing down code abrasion. Shadowing caused by the edge of a recess is also avoided, allowing the reader to have greater positioning tolerances.

[0011] In order to realize a shunt resistor whose positioning is also as simple as possible, in one embodiment two conductive connection elements can be connected to one another via a resistive element which requires a higher electrical resistance in relation to the connection elements, the raised area extending perpendicular to the cover surface of the connection elements.

[0012] The raised area of ​​the electronic component can be formed as an embossed portion, as this facilitates the manufacture of the component. To further optimize the positioning of the electronic component, the raised area can be non-circular, so that rotation of the circuit board about the axis parallel to the height of the raised area is prevented; the raised area thus not only limits the translational degrees of freedom in the plane of the component but also one rotational degree of freedom. In a further embodiment, the raised area can be formed multiple times, thereby further optimizing the electronic component as a positioning aid. Furthermore, for the same reason, one of the raised areas can be applied to one of the connection elements.The raised portions of the two connection elements preferably extend in the same direction for positioning purposes, i.e., the raised portions are arranged on the same side of the connection elements. To ensure additional robustness when connecting the printed circuit board and electronic component and to improve accuracy through a raised guide position in two directions, in one embodiment, one of the raised portions can be arranged above and one below a central axis in the longitudinal extension.

[0013] In a further embodiment, for security purposes, both raised areas can have a code containing, for example, product-specific information. Furthermore, the code can be designed as an optoelectronically readable code and / or a data matrix code; a group of such codes includes, for example, QR codes and barcodes. An RFID code would also be conceivable on one of the raised areas and is not excluded from the invention. A code as described above can be applied as a laser engraving.

[0014] In the present embodiment, the code is located closer to the resistive element than to the free end of the connector element, relative to a transverse axis running through the center of the connector element. This simplifies positioning of the circuit board and also reduces the likelihood of deformation due to mechanical stress near the resistive element. For the same purpose, the circuit board has a precisely fitting recess for each raised area of ​​the electronic component.

[0015] An electronic component as described above can be used in a corresponding measuring arrangement, which can comprise a printed circuit board mentioned above. Preferably, a raised area of ​​the electronic component can protrude beyond the printed circuit board on the side facing away from the electronic component or be flush with the surface of the printed circuit board on this side. However, it is also possible for the thickness of the printed circuit board to be selected such that the surface of the printed circuit board protrudes beyond a raised area, thus ending within the recess of the printed circuit board.

[0016] The features and feature combinations mentioned above in the description, as well as the features and feature combinations mentioned below in the description of the figures and / or shown alone in the figure, can be used not only in the respective combination specified, but also in other combinations or on their own, without departing from the scope of the invention. Thus, embodiments are also considered to be encompassed and disclosed by the invention that are not explicitly shown or explained in the figure, but which emerge and can be produced through separate feature combinations from the explained embodiments.

[0017] Further advantages, features, and details of the invention will become apparent from the claims, the following description of preferred embodiments, and the drawings. Herein: Fig. 1 a plan view of an electronic component as a shunt resistor, Fig. 2 a side view of the electronic component from Fig. 1, Fig. 3 one of the Fig. 1 corresponding representation of an electronic component as a shunt resistor with two elevations, and Fig. 4 a side view of the electronic component from Fig. 3.

[0018] Fig. 1 shows an electronic component 1 for measuring an electrical current, wherein two conductive connection elements 2 are connected to one another via a resistive element 4 - indicated by a dashed line - which requires a higher electrical resistance compared to the connection elements 2, and the raised area 5 extends perpendicular to the top surface of the connection elements 2. The connection element 2 has a raised area 5 on which a code 3 is applied. The raised area 5 makes the component 1 easier to position on a printed circuit board 8, and the code 3 also ensures product traceability. Furthermore, the raised area 5 - unlike a recess - can prevent shading of the code 3 and ensure the readability of the code 3. For this purpose, a precisely fitting recess 9 is formed in the printed circuit board 8 for each raised area 5 of the electronic component 1.In the embodiment shown, the raised area 5 is not circular in order to prevent the rotation of the circuit board 8 about the axis parallel to the height of the raised area 5, thereby optimizing the positioning process.

[0019] Fig. Figure 2 shows the electronic component 1 in a side view. The two conductive connection elements 2 are connected to each other via an element 4 that is resistive relative to the connection elements 2, and the raised region 5 extends perpendicular to the top surface of the connection elements 2. This arrangement creates a shunt resistor with simplified positioning. In the present embodiment, the raised region 5 is formed as an embossed portion; the embossed portion is also easy to implement, thereby optimizing the entire manufacturing process.

[0020] Fig. Figure 3 shows an electronic component 1 according to the invention, in which the raised region 5 is formed multiple times. Each raised region 5 added to the first raised region 5 can, but does not necessarily have to, be shaped like the first raised region 5, as in Fig. 3. Due to the multiple formation, the rotation of the circuit board 8 about the axis parallel to the height of the raised area 5 is additionally and thereby more strongly prevented, even if the raised area 5 is circular. Furthermore, the Fig. 3 that at least one of the raised regions 5 is applied to one of the connection elements 2, which further increases the stability of the connection between the printed circuit board 8 and the electronic component 1. For the same reason, in the present embodiment, one of the raised regions 5 is arranged above and one below a central axis 7 in the longitudinal extension of this axis. The code 3 of the electronic component 1 is located closer to the resistive element 4 than to the free end of the connection element 2 with respect to a transverse axis 6 running in the center of the connection element 2. Deformations caused by mechanical stresses in the vicinity of the resistive element 4 are thus less likely, and positioning on the printed circuit board 8 is also made easier. Fig. For security reasons, the raised areas 5 shown in Figure 3 can both have a code 3. Each further raised area 5 can also have a code 3. The code 3 is designed as an optoelectronically readable code and / or as a data matrix code; a group of such codes includes, for example, QR codes and barcodes, whereby the design of the code 3 as an RFID code would also be conceivable.

[0021] In Fig. Figure 4 shows that the raised areas 5 of the two connecting elements 2 extend in the same direction for positioning purposes. An extension of raised areas 5 in the opposite direction for additional fastening measures is not excluded.

[0022] An electronic component 1 as described above can be used in a corresponding measuring arrangement. LIST OF REFERENCE SYMBOLS: 1 Electronic component 2 connecting element 3 Code 4 Resistive element 5 Elevated area 6 Transverse axis 7 Central axis 8 circuit board 9 Recess

Claims

[1] Electronic component (1) for measuring an electric current, with a code (3) applied to a connection element (2), characterized by that the connecting element (2) has a raised area (5) which is formed integrally with the connecting element (2) and on which the code (3) is applied. [2] Electronic component (1) according to claim 1, characterized by that two conductive connecting elements (2) are connected to one another via a resistive element (4) which requires a higher electrical resistance in relation to the connecting elements (2), and the raised region (5) extends perpendicular to the cover surface of the connecting elements (2). [3] Electronic component (1) according to one of claims 1 or 2, characterized by that the raised area (5) is formed as an embossing. [4] Electronic component (1) according to one of claims 1 to 3, characterized by that the raised area (5) is not circular. [5] Electronic component (1) according to one of claims 1 to 4, characterized by that the raised area (5) is formed multiple times. [6] Electronic component (1) according to claim 5, characterized by that at least one of the raised areas (5) is applied to one of the connecting elements (2). [7] Electronic component (1) according to one of claims 5 or 6, characterized by that the code (3) is located closer to the resistive element (4) than to the free end of the connecting element (2) with respect to a transverse axis (6) running in the center of the connecting element (2). [8] Electronic component (1) according to one of claims 6 or 7, characterized by that the raised areas (5) of the two connecting elements (2) extend in the same direction. [9] Electronic component (1) according to one of claims 7 or 8, characterized bythat of the raised regions (5) with respect to a central axis (7) in the longitudinal extension, one is arranged above and one below this axis. [10] Electronic component (1) according to one of claims 6 to 9, characterized by that both raised areas (5) have a code (3). [11] Electronic component (1) according to one of claims 1 to 10, characterized by that the code (3) is designed as an optoelectronically readable code. [12] Printed circuit board (8) suitable for connection to an electronic component (1) according to one of claims 1 to 11, characterized by that a precisely fitting recess (9) is formed for each raised area (5) of the electronic component (1). [13] Measuring arrangement with an electronic component (1) according to one of claims 1 to 11. [14] Measuring arrangement according to claim 13, characterized by that a printed circuit board according to claim 12 is present.

Images