Multi-purpose container for transporting and testing a MEMS assembly

Abstract

The invention relates to a multi-purpose container (36) for transporting and testing MEMS assemblies (30), in particular a micromirror array (32) with sensitive surfaces (34). The multi-purpose container (36) has a lower part (64) and a removable upper part (62). The MEMS assembly (30) contained in the closed multi-purpose container (36) can be pressurized or vacuum-controlled via at least one pressure port (48), temperature-controlled via a temperature control (52) of a cylinder wall (46), and electrically connected from the outside via at least one electrical connection (50). Furthermore, the invention relates to the use of the multi-purpose container (36) for transporting and testing MEMS assemblies (30), in particular micromirror arrays (32) with sensitive surfaces (34).

Description

Technical field

[0001] The invention relates to a multi-purpose container for transporting and testing a MEMS assembly, in particular at least one micromirror array with sensitive surfaces, wherein the multi-purpose container comprises a lower part and a removable upper part, as well as a removable insert on the upper part. Furthermore, the invention relates to the use of the multi-purpose container for transporting and testing MEMS assemblies, in particular micromirror arrays with sensitive surfaces. State of the art

[0002] Current solutions involve using separate containers for transporting and testing MEMS assemblies, for example, micromirror arrays with sensitive surfaces. This necessitates repacking the handling-sensitive microelectromechanical components from the transport container to the container suitable for testing, which can pose a potential risk of damage or contamination of the sensitive surfaces. The solution proposed according to the invention aims to overcome this problem. Description of the invention

[0003] According to the invention, a multi-purpose container is proposed for transporting and testing a MEMS assembly, in particular at least one micromirror array with sensitive surfaces, wherein the multi-purpose container has a lower part and a removable upper part, as well as a removable insert on the upper part. The MEMS assembly contained in the closed multi-purpose container can be pressurized or vacuum-controlled via at least one pressure port, temperature-controlled via a cylinder wall, and electrically contacted from the outside via at least one electrical connection.

[0004] The multi-purpose container proposed according to the invention can advantageously simplify the handling of MEMS assemblies having sensitive surfaces, since repacking can be avoided and tests can be carried out in the multi-purpose container proposed according to the invention.

[0005] Advantageously, the multi-purpose container proposed according to the invention is designed such that its upper part is provided with a transparent insert, in particular a glass insert, for testing the MEMS assembly using a laser device.

[0006] The multi-purpose container proposed according to the invention is further characterized in that, in its closed state, it holds the MEMS assembly in a receiving chuck which includes a receiving opening for receiving a handling attachment of the MEMS assembly. This allows the MEMS assembly to be transported and, if necessary, tested, to be received within the multi-purpose container with minimal vibration.

[0007] In an advantageous further development of the multi-purpose container proposed according to the invention, it is designed such that its interior is divided by the receiving liner into an upper, first chamber, a middle, second chamber, and a lower, third chamber. The first, upper chamber serves to pressurize the MEMS assembly or, alternatively, to apply a vacuum. The second, middle chamber serves to hold the MEMS assembly and to regulate its temperature, either by heating or cooling. The lower, third chamber serves to establish an electrical contact between the MEMS assembly and the lower part, as well as to provide access to electrical contacts through the lower part to the outside.

[0008] In the multi-purpose container proposed according to the invention, it is advantageously provided that the upper, first chamber with the MEMS assembly contained therein can be pressurized with overpressure or vacuum via the pressure connection.

[0009] Furthermore, the multi-purpose container advantageously features a middle, second chamber, which serves to hold and secure the MEMS assembly. This middle chamber also provides a seal against vacuum or overpressure. Another function of this middle, second chamber is to ensure temperature control of the MEMS assembly during transport and / or test runs. This temperature control can involve either cooling or heating.

[0010] Furthermore, the multi-purpose container proposed according to the invention also has a lower, third chamber, which essentially serves to establish an electrical contact between the MEMS assembly housed in the multi-purpose container and the lower part via the electrical contacts of the MEMS assembly. The electrical contacts are routed to the outside through the lower part, so that they are contacted during transport of the multi-purpose container and during test runs. Such intermediate contacting is necessary to protect the sensitive surfaces of the MEMS assembly from contamination while still enabling electrical contact during transport and / or during test runs.

[0011] In the multi-purpose container proposed according to the invention, the cylinder wall of the lower part has connections provided, particularly on its second end face, through which a cooling or heating medium flows through the cylinder wall and either cools or heats it.

[0012] In the multi-purpose container proposed according to the invention, it is further provided that the MEMS assembly in the multi-purpose container is electrically contacted at ring contacts of the handling attachment by means of a ring insert which is electrically contacted with at least one E-connection on the second end face of the lower part.

[0013] Furthermore, the present invention relates to the use of the multi-purpose container for transporting and testing MEMS assemblies, in particular micromirror arrays with optically sensitive surfaces. Advantages of the invention

[0014] Advantageously, the multi-purpose container proposed according to the invention allows MEMS assemblies, particularly micromirror arrays with highly sensitive surfaces, to be packaged within it without needing to be removed until, for example, these components are delivered to an end customer. The multi-purpose container proposed according to the invention contains all interfaces for media supply and / or electrical connections, such that an electrical connection is provided, for example, from the outside via a ring insert that contacts the MEMS assembly.

[0015] Furthermore, the multi-purpose container proposed according to the invention offers the possibility of heating the MEMS assembly to higher temperatures, for example between 100 °C and 200 °C, via temperature control; alternatively, cooling is also possible using a temperature control medium. Particularly advantageously, the upper part of the multi-purpose container, which can be, for example, cylindrical, has a transparent insert in the form of a glass insert. This allows the MEMS assembly to be tested with a laser while packaged inside the multi-purpose container, without having to remove the sensitive components from the mounting housing inside the lower part of the multi-purpose container.

[0016] All connections for media, be it temperature control media or electricity, as well as connections for a positive or negative pressure supply, are provided in the multi-purpose container, so that tests can be carried out after appropriate connection at the corresponding interfaces, whereby the sensitive MEMS components can remain essentially vibration-free inside the multi-purpose container proposed according to the invention.

[0017] The multi-purpose container proposed according to the invention ensures the protection of the MEMS assembly contained therein against contamination after it leaves the cleanroom environment. Furthermore, the MEMS assembly is effectively protected against mechanical stresses resulting from transport. Additionally, handling operations on the MEMS assembly during transport, test runs, and shipment to the end customer are minimized. Moreover, the risk of damage or contamination of the sensitive surfaces associated with these processes can be significantly reduced. Brief description of the drawings

[0018] The invention is described in more detail below with reference to the drawings and the following description.

[0019] They show: Fig. 1. Schematic representation in meridional section of a projection exposure system suitable for EUV projection lithography, Fig. 2 a schematic representation of the essential components of the multi-purpose container proposed according to the invention, Fig. 3 a perspective top view of the first end face of the multi-purpose container with a transparent insert embedded in it, Fig. 4 A perspective view of the multi-purpose container from its underside, showing the lid and connections for temperature control media. Fig. 5 the perspective view of a longitudinal section through the multi-purpose container with a MEMS assembly located on a handling attachment inside, here exemplified as a micromirror array, Fig. 6.1 to 6.4 different assembly states of the lower part of the multi-purpose container. Embodiments of the invention

[0020] In the following description of embodiments of the invention, identical or similar elements are designated by the same reference numerals, and repeated descriptions of these elements are omitted in individual cases. The figures represent the subject matter of the invention only schematically.

[0021] The following will first refer to the Fig. 1. The essential components of a projection exposure system 1 for microlithography are described as an example. The description of the basic structure of the projection exposure system 1 and its components is not to be understood as restrictive.

[0022] One embodiment of a lighting system 2 of the projection exposure system 1 has, in addition to a light or radiation source 3, a lighting optic 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the radiation source 3 can also be provided as a separate module from the rest of the lighting system 2. In this case, the lighting system 2 does not include the radiation source 3.

[0023] A reticule 7 arranged in the object field 5 is exposed. The reticule 7 is held by a reticule holder 8. The reticule holder 8 can be moved, particularly in one scanning direction, via a reticule displacement drive 9.

[0024] In the Fig. Figure 1 shows a Cartesian xyz coordinate system for illustrative purposes. The x-direction runs perpendicular to the plane of the drawing. The y-direction runs horizontally, and the z-direction runs vertically. The scan direction runs in the Fig. 1 along the y-direction. The z-direction runs perpendicular to the object plane. 6.

[0025] The projection exposure system 1 comprises a projection optic 10. The projection optic 10 serves to image the object field 5 onto an image field 11 in an image plane 12. The image plane 12 is parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.

[0026] A structure on the reticulum 7 is imaged onto a photosensitive layer of a wafer 13 located in the image plane 12 within the image field 11. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be moved, particularly along the y-direction, via a wafer transfer drive 15. The movement of the reticulum 7 via the reticulum transfer drive 9 and of the wafer 13 via the wafer transfer drive 15 can be synchronized.

[0027] Radiation source 3 is an EUV radiation source. Radiation source 3 emits, in particular, illumination radiation 16, which is also referred to below as useful radiation, illumination radiation, or illumination light. The illumination radiation 16 has a wavelength in the range between 5 nm and 30 nm. Radiation source 3 can be a plasma source, for example, an LPP source (laser-produced plasma) or a DPP source (gas-discharged produced plasma). It can also be a synchrotron-based radiation source. Radiation source 3 can be a free-electron laser (FEL). Radiation source 3 can be a tin-based or xenon-based EUV radiation source.

[0028] The illumination radiation 16 emanating from the radiation source 3 is focused by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and / or hyperboloid reflective surfaces. The at least one reflective surface of the collector 17 can be illuminated by the illumination radiation 16 at grazing incidence (Gl), i.e., with angles of incidence greater than 45°, or at normal incidence (NI), i.e., with angles of incidence less than 45°. The collector 17 can be structured and / or coated to optimize its reflectivity for the illumination radiation 16 and to suppress stray light.

[0029] After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 can represent a separation between a radiation source module, comprising the radiation source 3 and the collector 17, and the illumination optics 4.

[0030] The illumination optics 4 comprise a deflecting mirror 19 and, downstream in the beam path, a first faceted mirror 20. The deflecting mirror 19 can be a planar deflecting mirror or, alternatively, a mirror with an effect that influences the beam shape beyond the mere deflection effect. Alternatively or additionally, the deflecting mirror 19 can be designed as a spectral filter that separates a useful wavelength of the illumination radiation 16 from stray light of a different wavelength. If the first faceted mirror 20 is arranged in a plane of the illumination optics 4 that is optically conjugate to the object plane 6 as the field plane, it is also referred to as a field faceted mirror. The first faceted mirror 20 comprises a plurality of individual first facets 21, which are also referred to as field facets in the following. Of these facets 21, the following are in the Fig. 1 only some examples are shown.

[0031] The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or semicircular border contour. The first facets 21 can be designed as planar facets or alternatively as convexly or concavely curved facets.

[0032] As is known, for example, from DE 10 2008 009 600 A1, the first facets 21 can themselves each be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 20 can in particular be designed as a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.

[0033] Between the collector 17 and the deflecting mirror 19, the illumination radiation 16 runs horizontally, i.e. along the y-direction.

[0034] In the beam path of the illumination optics 4, a second faceted mirror 22 is arranged downstream of the first faceted mirror 20. If the second faceted mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil faceted mirror. The second faceted mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first faceted mirror 20 and the second faceted mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1, and US 6,573,978.

[0035] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

[0036] The second facets 23 can also be macroscopic facets, which may, for example, have round, rectangular, or hexagonal edges, or alternatively, facets composed of micromirrors. Reference is also made to DE 10 2008 009 600 A1 in this regard.

[0037] The second facets 23 can have planar or alternatively convex or concave curved reflective surfaces.

[0038] The illumination optics 4 thus form a double-faceted system. This basic principle is also known as a honeycomb condenser (Fly's Eye Integrator).

[0039] It can be advantageous not to arrange the second faceted mirror 22 exactly in a plane that is optically conjugate to a pupil plane of the projection optics 10. In particular, the second faceted mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as described, for example, in DE 10 2017 220 586 A1.

[0040] With the aid of the second faceted mirror 22, the individual first facets 21 are imaged into the object field 5. The second faceted mirror 22 is the last beam-shaping, or indeed the last, mirror for the illumination radiation 16 in the beam path before the object field 5.

[0041] In another embodiment of the illumination optics 4, not shown, a transmission optic can be arranged in the beam path between the second faceted mirror 22 and the object field 5, which contributes in particular to imaging the first facets 21 into the object field 5. The transmission optic can have exactly one mirror, or alternatively two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4.

[0042] The transmission optics may in particular include one or two mirrors for normal incidence (NI mirrors, Normal Incidence mirrors) and / or one or two mirrors for grazing incidence (GI mirrors, Gracing Incidence mirrors).

[0043] The lighting optics 4, in the version shown in the Fig. Figure 1 shows exactly three mirrors after the collector 17, namely the deflecting mirror 19, the first faceted mirror 20 and the second faceted mirror 22.

[0044] In a further embodiment of the lighting optics 4, the deflecting mirror 19 can also be omitted, so that the lighting optics 4 after the collector 17 can then have exactly two mirrors, namely the first faceted mirror 20 and the second faceted mirror 22.

[0045] The mapping of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optic into the object plane 6 is regularly only an approximate mapping.

[0046] The projection optics 10 comprise a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.

[0047] In the Fig. In the example shown, the projection optics 10 comprise six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or any other number of mirrors Mi are also possible. The projection optics 10 is a doubly obscured optic. The penultimate mirror M5 and the last mirror M6 each have an aperture for the illumination radiation 16. The projection optics 10 has an image-side numerical aperture that is greater than 0.5 and can also be greater than 0.6, for example, 0.7 or 0.75.

[0048] The reflective surfaces of the mirrors Mi can be designed as freeform surfaces without an axis of rotational symmetry. Alternatively, the reflective surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflective surface shape. The mirrors Mi, like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0049] The projection optics 10 has a large object-image offset in the y-direction between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction can be approximately as large as a z-distance between the object plane 6 and the image plane 12.

[0050] The projection optics 10 can be anamorphic. In particular, they have different image scales βx, βy in the x and y directions. The two image scales βx, βy of the projection optics 10 are preferably (βx, βy) = (+ / - 0.25, ± 0.125). A positive image scale β indicates a projection without image inversion. A negative sign for the image scale β indicates a projection with image inversion.

[0051] The projection optics 10 thus lead to a reduction in the x-direction, that is, in the direction perpendicular to the scan direction, in a ratio of 4:1.

[0052] The projection optics 10 lead to a reduction of 8:1 in the y-direction, that is, in the scan direction.

[0053] Other magnification ratios are also possible. Magnification ratios with the same sign and absolute values ​​in the x and y directions, for example with absolute values ​​of 0.125 or 0.25, are also possible.

[0054] The number of intermediate image planes in the x- and y-directions in the beam path between the object field 5 and the image field 11 can be the same or, depending on the design of the projection optics 10, different. Examples of projection optics 10 with different numbers of such intermediate images in the x- and y-directions are known from US 2018 / 0074303 A1.

[0055] Each pupil facet 23 is assigned to exactly one of the field facets 21 to form an illumination channel for illuminating the object field 5. This can result, in particular, in illumination according to Köhler's principle. The far field is divided into a multitude of object fields 5 by means of the field facets 21. The field facets 21 generate a plurality of images of the intermediate focus on the pupil facets 23 assigned to each of them.

[0056] The field facets 21 are each superimposed on the reticulum 7 by an associated pupil facet 23 to illuminate the object field 5. The illumination of the object field 5 is particularly homogeneous. It preferably exhibits a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0057] The illumination of the entrance pupil of the projection optics 10 can be geometrically defined by the arrangement of the pupil facets 23. By selecting the illumination channels, in particular the subset of pupil facets 23 that guide light, the intensity distribution in the entrance pupil of the projection optics 10 can be adjusted. This intensity distribution is also referred to as the illumination setting or illumination pupil filling.

[0058] Another preferred pupil uniformity in the area of ​​defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by a redistribution of the illumination channels.

[0059] Further aspects and details of the illumination of the object field 5 and, in particular, the entrance pupil of the projection optics 10 are described below.

[0060] The projection optics 10 can, in particular, have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

[0061] The entrance pupil of the projection optics 10 cannot always be illuminated exactly by the second faceted mirror 22. When the projection optics 10 image the center of the second faceted mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found where the pairwise determined separation of the aperture rays is minimized. This surface represents the entrance pupil or a surface conjugate to it in real space. In particular, this surface exhibits a finite curvature.

[0062] The projection optics 10 may have different entrance pupil positions for the tangential and sagittal beam paths. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second faceted mirror 22 and the reticle 7. This optical element can accommodate the different positions of the tangential and sagittal entrance pupils.

[0063] During the Fig. In the arrangement of the components of the illumination optics 4 shown in Figure 1, the second faceted mirror 22 is arranged in a surface conjugate to the entrance pupil of the projection optics 10. The first faceted mirror 20 is arranged at an angle to the object plane 6. The first faceted mirror 20 is arranged at an angle to an arrangement plane defined by the deflecting mirror 19.

[0064] The first faceted mirror 20 is arranged at an angle to an arrangement plane defined by the second faceted mirror 22.

[0065] Using the projection exposure system 1, at least a portion of the reticulum 7 in the object field 5 is imaged onto an area of ​​a photosensitive layer on the wafer 13 in the image field 11 for the lithographic fabrication of a micro- or nanostructured component, in particular a semiconductor component, for example a microchip. Depending on whether the projection exposure system 1 is configured as a scanner or a stepper, the reticulum 7 and the wafer 13 are moved continuously in the y-direction in scanner mode or stepwise in stepper mode, synchronized over time.

[0066] Depending on the design, individual components or component assemblies described above, such as the EUV collector 17, the illumination optics 4, or the projection optics 10, can also be components of a mask inspection device or a mask metrology device. A mask inspection system is generally known from US 10,042,248 B2, DE 102 20 815 A1, and WO 2012 / 101 269 A1. The projection optics 10 or imaging optics of such a mask inspection device or mask metrology device can be designed such that a magnifying projection or imaging from the object field 5 onto the image field 11 takes place. In the projection exposure system 1 described above, components such as micromirror arrays 32 are used as MEMS assemblies 30.

[0067] According to the representation Fig. Figure 2 shows a schematic view of essential components of the multi-purpose container 36 proposed according to the invention.

[0068] Out of Fig. Figure 2 shows that a MEMS assembly 30 is located inside a multi-purpose container 36. This assembly is, for example, a micromirror array 32 having sensitive surfaces 34. This array is mounted on a stamp-shaped handling attachment 33. The MEMS assembly 30 shown schematically here could also be another microelectromechanical assembly or component. From the illustration according to Fig. Figure 2 shows that the MEMS assembly 30 is embedded in a schematically depicted receiving housing 54. A seal 58, which can be, for example, a ring seal, runs between an upper end face 56 of the receiving housing 54 (shown only schematically here) and a bottom face of the MEMS assembly 30. An upper first end face 40 of the multi-purpose container 36 has a transparent insert, for example, a glass insert 42. A test on the optically sensitive surface 34 of the micromirror array 32, which can be performed using a laser device, can be carried out via this transparent insert without having to remove the MEMS assembly 30 from the multi-purpose container 36.

[0069] Furthermore, according to the schematic representation Fig. 2 shows that the handling extension 33 of the MEMS assembly 30 extends through a receiving opening 74, which may be designed as a receiving bore, for example, of the receiving chuck 54, until the lower end of the handling extension 33 is enclosed by a ring insert 60.

[0070] The aforementioned ring insert 60 can, for example, provide electrical contact to contacts 76 - see illustration according to Fig. 5 - which are formed at the lower end of the handling attachment 33.

[0071] From the representation according to Fig. Figure 2 further shows that at least one electrical connection 50 runs in the area of ​​a second end face 44, i.e., on the underside of the multi-purpose container 36. This connection can be electrically contacted in the lower area of ​​the multi-purpose container 36 with the ring insert 60 via corresponding leads, which in turn contacts contacts 76 on the outside of the handling attachment 33. The electrical contact between the MEMS assembly 30 and the ring insert 60 is made via a lead that is part of the MEMS assembly 30 and is located in Fig. 2 is indicated.

[0072] Fig. Figure 3 shows a perspective view of the multi-purpose container 36 proposed according to the invention from its first end face 40.

[0073] Out of Fig. Figure 3 shows that the first end face 40 has the aforementioned transparent insert, shown here in the form of a glass insert 42. A laser device attached to the first end face 40 allows tests to be carried out on the sensitive surface 34 of the MEMS assembly 30 contained inside the closed multi-purpose container 36. Thanks to the glass insert 42, it is not necessary to remove the MEMS assembly 30 to be tested in order to carry out tests using a laser device.

[0074] From the representation according to Fig. Figure 3 further shows that the multi-purpose container 36 is essentially designed as a cylinder 38. The multi-purpose container 36 comprises an upper part 62 and a lower part 64. An insert ring 66 runs between the upper part 62 and the lower part 64. A cylinder wall of the multi-purpose container 36, designed as a cylinder 38, is identified by reference numeral 46.

[0075] Fig. Figure 4 shows the multi-purpose container 36 proposed according to the invention in a perspective view from its second end face 44, i.e. its underside.

[0076] Fig. Figure 4 shows that a lid 88 is recessed into the second end face 44 of the multi-purpose container 36. The centrally formed lid 88 has an opening 86, which in this case is rectangular. Furthermore, the perspective view according to Fig. 4, that in the lower part 64, a temperature control 52 can be implemented at connections 90 for temperature control media, which acts as cooling or heating depending on the media used. The channels that extend from the connections 90 on the second end face 44 of the lower part 64 through the cylinder wall 46 are not shown in detail. By appropriately supplying the connections 90 with the temperature control media, be it cooling media or heating media, a corresponding temperature control 52 of the cylinder wall 46 can be achieved.

[0077] According to the representation Fig. Figure 5 shows a longitudinal section through a closed multi-purpose container 36 in which a MEMS assembly 30 having the handling attachment 33 is located.

[0078] From the half-section shown in perspective, according to Fig. Figure 5 shows that the handling attachment 33 of the MEMS assembly 30 extends vertically through the receiving opening 74 of the receiving chuck 54. The sensitive surface 34 is located on the upper side of the MEMS assembly 30 to be transported and tested, shown here, for example, as a micromirror array 32. The stamp-shaped handling attachment 33 extends through the receiving opening 74, which is configured, for example, as a receiving bore, and through the receiving chuck 54. At the lower end of the handling attachment 33, the illustration shows... Fig. 5. A number of contacts 76 are available, which can be electrically connected, for example, via the ring insert 60. The electrical connection is made via an electrical cable with a connector, which is part of the MEMS assembly 30. This is in Fig. Figure 2 shows the electrical contact on the ring insert 60 via a plug contact.

[0079] From the longitudinal section shown in perspective according to Fig. Figure 5 shows that the interior of the multi-purpose container 36 is divided by the receiving chuck 54 into an upper, first chamber 68, a middle, second chamber 70 adjoining it, and a lower, third chamber 72. The upper, first chamber 68 serves as a vacuum or overpressure chamber, the middle, second chamber 70 adjoining it serves as a chamber for temperature control media, whereas the lower, third chamber 72 serves as a chamber for establishing the electrical contact with the ring insert 60.

[0080] In the Fig. In the closed state of the multi-purpose container 36 shown in Figure 5, the upper part 62, the insert ring 66 and the lower part 64 are essentially in contact with each other, so that a pressure-tight packaging of the MEMS assembly 30 is achieved inside the multi-purpose container 36.

[0081] While the glass insert 42 is accommodated on the upper surface of the upper part 62 at the first end face 40, the lid 88 is provided on the second end face 44, i.e., at the bottom of the lower part 64, which seals the lower, third chamber 72 to the outside. Through the lid 88, electrical connections 50 are routed into the interior of the multi-purpose container 36 via the rectangular opening 86, for example, to enable electrical contact between the MEMS assembly 30 and the ring insert 60, thus allowing external electrical contact of the MEMS assembly 30, in the form of a micromirror array 32.

[0082] According to the representations, Fig. Figures 6.1 to 6.4 show various stages of the assembly of the lower part 64 of the multi-purpose container 36 proposed according to the invention.

[0083] The Fig. Figures 6.1 to 6.4 also show the multi-part structure of the multi-purpose container 36 and the various chambers 68, 70, 72 that are formed in it.

[0084] Fig. 6.1 shows that the receiving opening 74 of the receiving chuck 54 is still free of the handling attachment 33 of the MEMS assembly 30. Fig. Figure 6.1 shows that the lower part 64 is placed on the insert ring 66. The middle, second chamber 70 has two opposing first inner annular spaces 80 and second inner annular spaces 82. The inner annular spaces 80 and 82 are offset from each other vertically with respect to the receiving opening 74. These first and second inner annular spaces 80 and 82 serve to supply the temperature control medium via channels (not shown) from the underside of the multi-purpose container 36. An intermediate plate 78 rests on a projection of the cylinder wall 46 and is sealed by a gasket 84.

[0085] Fig. Section 6.2 shows that at this stage of the assembly of the lower part 64 of the multi-purpose container 36, the MEMS assembly 30, in the form of a micromirror array 32 with sensitive surfaces 34, is embedded. Electrical contact between the handling attachment 33 and the ring insert 60 is made by means of an electrical cable with a contact connector.

[0086] From the representation according to Fig. 6.3 shows that the lower, third chamber 72 can be closed by means of the lid 88 as part of the assembly of the multi-purpose container 36.

[0087] Fig. 6.4 shows that at this stage of the assembly of the lower part 64 of the multi-purpose container 36, the MEMS assembly 30, in the form of the micromirror array 32 with sensitive surfaces 34, is embedded in the receiving chuck 54. The upper part 62 is placed on the insert ring 66, which is located on the upper end face 56 of the lower part 64. In the state according to Fig. 6.4 The MEMS assembly 30 to be transported and tested is received without vibration inside the multi-purpose container 36 proposed according to the invention.

[0088] The invention is not limited to the embodiments described here and the aspects highlighted therein. Rather, within the scope specified by the claims, a multitude of modifications are possible that fall within the bounds of what is considered skilled in the art. QUOTES INCLUDED IN THE DESCRIPTION

[0000] This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature

[0000] DE 10 2008 009 600 A1 [0032, 0036] US 2006 / 0132747 A1

[0034] EP 1 614 008 B1

[0034] US 6,573,978

[0034] DE 10 2017 220 586 A1

[0039] US 2018 / 0074303 A1

[0054] US 10,042,248 B2

[0066] DE 102 20 815 A1

[0066] WO 2012 / 101 269 A1

[0066]

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