IC chip mounting device, IC chip mounting method

The IC chip mounting device and method improve the bonding between IC chips and antennas in RFID inlays by using precise positioning and UV curing, addressing the challenges of connection strength and conductivity in existing technologies.

JP7885311B2Active Publication Date: 2026-07-06SATO CO LTD
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Patent Information

Application Number
JP2024223808
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-12-26
Filing Date
2024-12-19
Publication Date
2026-07-06
Estimated Expiration
2040-12-25

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Abstract

To improve the productivity in a manufacturing process of an inlay.SOLUTION: The IC chip-equipped device includes: a conveyance unit for conveying an antenna continuous body on a predetermined conveyance surface, the antenna continuous body including antennas for an inlay continuously formed on a base material; an IC chip arrangement unit for arranging an IC chip on a photo-curing adhesive provided in a predetermined reference position of each antenna of the antenna continuous body; and a light beam radiation unit in which the IC chip is arranged, the light beam radiation unit radiating a light beam to the adhesive on each antenna of the antenna continuous body conveyed by the conveyance unit. The light beam radiation unit radiates the light beam while pressing the IC chip on the adhesive toward the antennas.SELECTED DRAWING: Figure 9
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Citation Information

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