Overmolding encapsulation process and encapsulated article made therefrom

a technology of encapsulation and overmolding, which is applied in the direction of transportation and packaging, basic electric elements, coatings, etc., can solve the problems of loss of the ability to directly mount the chip to the board, the sensitiveness of the electronic device, and the limited configuration of the molds

Inactive Publication Date: 2002-06-20
JOHNSON MARK S +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This method provides a reliable, leak-proof encapsulation for asymmetric designs and allows for direct board mounting of chip scale packaged dies, enhancing protection and assembly flexibility while maintaining the advantages of CSP.

Problems solved by technology

It is well known that electronic devices are sensitive and thus require protection from physical and environmental conditions which may degrade or completely ruin them.
However, because mechanical clamps must be applied in a symmetrical fashion, i.e. equal and opposite clamping forces, the configuration of the molds is limited to symmetrical designs.
With the CSP, the chip is already mounted to a substrate such that the ability to directly mount the chip to a board is lost.

Method used

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  • Overmolding encapsulation process and encapsulated article made therefrom
  • Overmolding encapsulation process and encapsulated article made therefrom
  • Overmolding encapsulation process and encapsulated article made therefrom

Examples

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Embodiment Construction

[0034] FIG. 1 illustrates a substrate 10 which may be used in conjunction with the method of the present invention. The description of the method of the present invention in connection with the substrate 10 is for purposes of illustration only, and not limitation. It is anticipated that the method and molds of the present invention may be used to encapsulate a large variety of articles, both electrical and non-electrical. In FIG. 1, the substrate is a known flexible substrate suitable for receiving electrical devices 12 in openings 14. The electrical device may be any type of device, although a memory device is shown in FIG. 1.

[0035] The electrical device 12 may be connected to a first side 16 of the substrate 10 by any known means, e.g. lamination, adhesion, etc. The device 12 may be of a type in which electrical connections extend from the center of the device. The device 12 is positioned such that the electrical connections 18 of the device 12 extend through opening 14 to a secon...

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Abstract

A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.

Description

[0001] This is a continuation-in-part application of U.S. patent application Ser. No. 09 / 255,554 filed on Feb. 22, 1999.[0002] 1. Field of the Invention[0003] The invention relates to a method of encapsulating an article and, more specifically, to a method of overmolding an article and an overmolded encapsulated article made therefrom.[0004] 2. Description of the Background[0005] It is well known that electronic devices are sensitive and thus require protection from physical and environmental conditions which may degrade or completely ruin them. Therefore, it is well known in the art to protect electronic devices from these conditions by sealing them with a protective encapsulation material. This "packaging" of the electronic devices protects them from the conditions which may degrade them and allows the devices to be transported and handled, and thus allows them to be easily configured with other components.[0006] One prior-art method for encapsulating devices is the "transfer-mold...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): H01L21/00H01L21/56H01L23/29H01L23/31
CPCH01L21/56Y10T428/23H01L23/293H01L23/3121H01L2224/4824H01L2924/14H01L2924/1433H01L2924/15311B29C45/14418B29C45/14655H01L24/48B29C2045/14672Y10T428/239Y10T428/1352H01L21/565H01L2924/181H01L2224/05599H01L2224/85399H01L2924/00014H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207
InventorJOHNSON, MARK S.BOLKEN, TODD O.
OwnerJOHNSON MARK S