Miniature image capture lens

Abstract

A miniature image capture lens is disclosed comprising an aperture diaphragm having an aperture through which an image is captured and a wafer-level lens system, including a first surface disposed on a first substrate, a second substrate with a first side bonded to the first substrate, a second surface disposed on a second side of the second substrate, and a third surface disposed on a third substrate, wherein the first surface, the second surface and the third surface are aspherical and the following conditions are satisfied:L / fe<1.7;f1 / fe=0.5˜1.5;f2 / fe=−1˜−1.5; and−2<f3 / fe<2, whereinL: total track length (TTL) from the first surface to an image plane,fe: effective focal length of whole lens system,f1: effective focal length of the first surface,f2: effective focal length of the second surface, andf3: effective focal length of the third surface.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]This invention relates to a lens system, and more particularly relates to a wafer-level miniature image capture lens.[0003]2. Description of the Related Art[0004]Mobile phones or personal computers employing imaging devices have become popular due to employment of solid-state image capture elements such as a CCD (a charged coupled device) type image sensors, a CMOS (a complementary metal oxide semiconductor) type image sensors and the like, allowing for higher performance and miniaturization of imaging devices. Additionally, there is demand for further miniaturization of image capture lenses loaded on the imaging devices.[0005]However, despite demands, limits for further miniaturization of image capture lenses are being reached, as for the conventional image capture lenses, because they are true three dimensional (3-D) structures and sensors therein need to also be miniaturized, it is difficult to control accuracy of la...

AI Technical Summary

Problems solved by technology

However, despite demands, limits for further miniaturization of image capture lenses are being reached, as for the conventional image capture lenses, because they are true three dimensional (3-D) structures and sensors therein need to also be miniaturized, it is difficult to control accuracy of lateral shift and tilt for each lens surface nor to handle tiny lens during fabrication.

However, despite the smaller volume, conventional 3-D lens currently outperform wafer-level lenses.

Additionally, it is relatively more difficult to design a optical lens system with small enough aberration, good enough modulation transfer function (MTF), for wafer-level lenses, especially when Nyquist frequency is higher, than for conventional three dimensional (3-D) lenses.

Images