Solar photovoltaic bypass core components

Abstract

The present invention discloses a solar photovoltaic bypass core component, including a plurality of bypass diode chips and a core component substrate, wherein the bypass diode chips are loaded on the core component substrate, and each bypass diode chip and the core component substrate are bonded by connected metal sheets to form a loop; the solar photovoltaic bypass core component also includes an external plastic package, which covers the bypass diode chip and is fixedly connected to the core component substrate; the core component substrate is designed with waterproof grooves around, which adopt a "V" shape design, and the depth is 1 / 10 of the substrate, and the width of the V-shaped opening is the same as the depth, and the waterproof grooves enhance the bonding force between the bypass diode chip and the core component substrate, and prevent external moisture or water from entering the bypass diode chip. The component increases a plug-in structure, which can be directly inserted to avoid welding, and can also adopt traditional welding, directly weld once, and avoid the cumbersome process.

Description

Technical Field

[0001] The present invention relates to the field of semiconductors, in particular to a solar photovoltaic bypass core component. Background Art

[0002] Bypass diodes are diodes connected in reverse parallel to the ends of the solar silicon cell stack in a solar module. They effectively prevent silicon cells from burning out due to the hot spot effect and are a crucial component of photovoltaic solar panels. They are designed to prevent solar cells from becoming overheated and damaged by overheating when they are blocked by strong sunlight. They are commonly used in bypass diodes in monocrystalline and polycrystalline silicon photovoltaic (PV) panels to protect photovoltaic cells from overheating when low shunt current or high shunt impedance is present.

[0003] Most existing photovoltaic solar panels are single components that need to be installed on site. The bypass diodes need to be soldered to the substrate one by one and then the substrate is fixed to the casing one by one. The process is complicated and prone to assembly errors. Summary of the Invention

[0004] In order to solve the deficiencies of the prior art, the present invention proposes a solar photovoltaic bypass core component, which has an additional plug-in structure and can be directly inserted without welding. It can also use traditional welding and directly weld in one go, avoiding cumbersome processes.

[0005] The present invention adopts the following technical solutions:

[0006] The solar photovoltaic bypass core component includes multiple bypass diode chips, multiple groups of core component substrates, and a substrate frame. The bypass diode chips are loaded on the core component substrate. Each bypass diode chip is bonded to the core component substrate through connected metal sheets to form a loop. Multiple groups of core component substrates constitute the substrate frame. The solar photovoltaic bypass core component also includes an external plastic package. The external plastic package covers the bypass diode chip to form a main body, which is fixedly connected to the core component substrate. The core component substrate is designed with waterproof grooves around it. The waterproof grooves adopt a "V" shape design with a depth of 1 / 10 of the substrate. The width of the V opening is the same as the depth. The waterproof grooves enhance the bonding strength between the bypass diode chip and the core component substrate, while preventing external moisture or water from entering the bypass diode chip.

[0007] Furthermore, the bypass diode chip is designed with an oblique hook structure around it, the height of the oblique hook structure is about 4-5 times the thickness of the substrate, and the oblique hook structure maintains an angle of 40-50° with the core component substrate, fully and effectively locking the upper part of the body.

[0008] Furthermore, the connecting metal sheets are designed with two structures: flat hooks and oblique hooks.

[0009] Furthermore, the height of the flat hook is approximately 2-3 times the thickness of the substrate, and the length of the flat hook is 2-3 times the thickness of the substrate.

[0010] Furthermore, the oblique hook has the same inclination angle as the oblique hooks around the wafer.

[0011] Furthermore, the angle between the side surface of the solar photovoltaic bypass core component body and the substrate is 102-105 degrees, and the designed total height of the solar photovoltaic bypass core component is 5-7 times the thickness of the substrate.

[0012] Furthermore, the bypass diode chip is loaded on the core component substrate through a pluggable structure.

[0013] Furthermore, a positioning circular hole is added to the core component substrate, and the circular hole is of a transparent design and is used to position the core component substrate and the external plastic package shell to prevent the core component substrate from vibrating and shifting.

[0014] Furthermore, the bypass diode chip pins with square holes are electrodes, and a plug is provided on the core component substrate housing. The electrode is directly inserted into the plug, and then the component is locked to the core component substrate housing through the positioning circular hole.

[0015] Furthermore, an oblique angle design is made on the substrate frame on the upper and lower sides of the plastic package body to form a "V" shape and an inverted "V" shape design.

[0016] The beneficial technical effects achieved by adopting the above technical solution are:

[0017] The material substrate frame adopts a symmetrical structural design. Through reasonable arrangement, the copper utilization rate is as high as 74.1%, which reduces costs while achieving energy conservation and environmental protection.

[0018] The top and bottom of the plastic package body are beveled on the substrate frame to form a "V" shape and an inverted "V" shape. This can increase the insulation distance between the substrate frame and enhance product safety.

[0019] The flat hook and oblique hook design of the cross section can prevent the material from forming delamination at weak points, and the connected metal sheets are designed into a flat hook structure, which can optimize the structure of the metal sheets, facilitate production, and enhance the strength of the product.

[0020] The core component has a low overall height and can be used in smaller spaces, helping users reduce the thickness of the product.

[0021] The frame's beveled hooks provide a stronger bond between the plastic encapsulant and the frame, preventing delamination and cracking of the core component. The 40-50° tilt angle ensures convenient storage and use of the substrate frame, allowing for stacking and saving space without compromising the performance or size of the raw materials and semi-finished products.

[0022] This core component has a high degree of integration, which saves users from complicated production processes and reduces 5-6 operations, which is beneficial to energy conservation and environmental protection and improves work efficiency.

[0023] The positioning holes allow for quick assembly and precise positioning, and can also prevent damage such as shaking and vibration caused by positioning errors during use and transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of solar photovoltaic bypass core components.

[0025] Figure 2 for Figure 1 side view.

[0026] Figure 3 for Figure 1 Schematic diagram of the substrate structure.

[0027] Figure 4 for Figure 1 Schematic diagram of the external plastic packaging structure.

[0028] Figure 5 This is a schematic diagram of the core component substrate structure.

[0029] Figure 6 This is a schematic diagram of the dimensions of each component block of the core component substrate.

[0030] Figure 7 Schematic diagram of the assembly of solar photovoltaic bypass core components.

[0031] Figure 8 for Figure 4 side view.

[0032] Figure 9 for Figure 4 Installation diagram.

[0033] Figure 10 A schematic diagram of the circuit structure.

[0034] In the figure, 1. bypass diode chip, 2. body, 3. core component substrate, 4. substrate frame. DETAILED DESCRIPTION

[0035] Combined with attachment Figures 1 to 10 The specific structure of the present invention is further described:

[0036] The solar photovoltaic bypass core component includes multiple bypass diode chips 1, multiple groups of core component substrates 3, and a substrate frame 4. The bypass diode chips are loaded on the core component substrate. Each bypass diode chip is bonded to the core component substrate through connected metal sheets to form a loop. Multiple groups of core component substrates constitute the substrate frame. The solar photovoltaic bypass core component also includes an external plastic package. The external plastic package covers the bypass diode chip to form a main body 2, which is fixedly connected to the core component substrate. The core component substrate is designed with waterproof grooves around it. The waterproof grooves adopt a "V" shape design with a depth of 1 / 10 of the substrate. The width of the V opening is the same as the depth. The waterproof grooves enhance the bonding strength between the bypass diode chip and the core component substrate, while preventing external moisture or water from entering the bypass diode chip.

[0037] The bypass diode chip is designed with an oblique hook structure around it. The height of the oblique hook structure is about 4-5 times the thickness of the substrate. The oblique hook structure maintains an angle of 40-50 degrees with the core component substrate, fully and effectively locking the upper part of the body.

[0038] The connecting metal sheets are designed with two structures: flat hook and oblique hook.

[0039] The height of the flat hook is about 2-3 times the thickness of the substrate, and the length of the flat hook is about 2-3 times the thickness of the substrate. The inclined hook has the same inclination angle as the inclined hooks around the wafer.

[0040] The angle between the side of the solar photovoltaic bypass core component and the substrate is 102-105 degrees, and the total height of the solar photovoltaic bypass core component is designed to be 5-7 times the thickness of the substrate. This design can effectively protect the chip from damage, reduce production difficulty, and facilitate production.

[0041] The bypass diode chip is mounted on the core component substrate in a pluggable structure. The pluggable contacts ensure the replaceability of this core component, allowing for quicker and more convenient replacement.

[0042] A positioning circular hole is added to the core component substrate. The circular hole is a transparent design and is used to position the core component substrate and the external plastic shell to prevent the core component substrate from vibrating and displacing.

[0043] The pins of the bypass diode chip with square holes are electrodes. A plug is provided on the core component substrate housing. The electrode is directly inserted into the plug, and then the component is locked to the core component substrate housing through the positioning circular hole.

[0044] The substrate frame is beveled on the top and bottom of the plastic package body, forming a "V" shape and an inverted "V" shape. This increases the insulation distance between the substrate frame and the plastic package body, enhancing product safety.

[0045] Of course, the above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above-mentioned embodiments. It should be noted that all equivalent substitutions and obvious deformation forms made by any technician familiar with the field under the guidance of this specification fall within the substantive scope of this specification and should be protected by the present invention.

Claims

1. Solar photovoltaic bypass core component, characterized in that, The invention comprises a plurality of bypass diode chips (1), a plurality of core component substrates (3), and a substrate frame (4); the bypass diode chips (1) are mounted on the core component substrate (3); each bypass diode chip (1) is bonded to the core component substrate (3) via a connected metal sheet to form a loop; and the plurality of core component substrates (3) form the substrate frame (4); The solar photovoltaic bypass core component also includes an external plastic package, which is covered outside the bypass diode chip (1) to form a body (2), and the body (2) is fixedly connected to the core component substrate (3); The core component substrate (3) is designed with waterproof grooves around its periphery. The waterproof grooves are designed in a "V" shape, with a depth of 1 / 10 of the substrate. The width of the V-shaped opening is the same as the depth. The waterproof grooves enhance the bonding strength between the bypass diode chip (1) and the core component substrate (3), while preventing external moisture or water from entering the bypass diode chip (1). The bypass diode chip (1) is designed with an oblique hook-shaped structure around its periphery. The height of the oblique hook-shaped structure is 4-5 times the thickness of the substrate. The oblique hook-shaped structure maintains an angle of 40-50° with the core component substrate (3), fully and effectively locking the upper part of the body (2). The connecting metal sheet is designed with two structures: flat hook and oblique hook; The inclined hook has the same inclination angle as the inclined hooks around the wafer; The bypass diode chip (1) is loaded on the core component substrate (3) via a pluggable structure; The core component substrate (3) is provided with a positioning circular hole, which is designed to be transparent and is used to position the core component substrate (3) and the external plastic package shell to prevent the core component substrate (3) from vibrating or shifting. The pins of the bypass diode chip (1) with square holes are electrodes, a plug is provided on the shell of the core component substrate (3), the electrode is directly inserted into the plug, and then the component is locked onto the shell of the core component substrate (3) through the positioning circular hole; On the upper and lower sides of the main body (2), a bevel design is made on the base plate frame (4) to form a "V" shape and an inverted "V" shape.

2. The solar photovoltaic bypass core component according to claim 1, characterized in that: The height of the flat hook is 2-3 times the thickness of the substrate, and the length of the flat hook is 2-3 times the thickness of the substrate.

3. The solar photovoltaic bypass core component according to claim 1, characterized in that: The angle between the side surface of the solar photovoltaic bypass core component body (2) and the substrate is 102-105°, and the designed total height of the solar photovoltaic bypass core component is 5-7 times the thickness of the substrate.

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