A printed circuit ion transfer tube

Abstract

A printed circuit ion migration tube comprises a PCB circuit board stack and a sleeve; the PCB circuit board stack comprises a sheet PCB board, an electrode ring and a resistor; the middle part of the sheet PCB board comprises a hollow part for configuring the sleeve, and the electrode ring is configured on one surface of the sheet PCB board through a printed circuit process; the electrode ring is circular, and includes at least two electrode ring lead grooves at the edge of the sheet PCB board, and the electrode ring lead grooves include welding points, and the welding points are electrically connected to the electrode ring; a plurality of the PCB circuit board stacks pass through the sleeve and configure the electrode rings together in the same direction, and the resistor is bridged to two adjacent lead grooves through the welding points.

Description

Technical Field

[0001] The invention relates to a printed circuit ion migration tube. Background Art

[0002] The ion migration tube is the main analytical component of the ion migration spectrometer. It is mainly formed by alternating electrode rings and insulating rings to form a cylindrical tube. An ion receiving plate is placed at one end of the tube to receive the ions to be measured, and an ion gate device is provided at the other end to control the ions to be measured to enter the ion migration tube. During analysis, the ion migration tube needs to generate an electric field that changes uniformly along the axis of the migration tube through the electrode ring. The common electric field strength changes are 220-240V / cm. Generally, metal rings plus polytetrafluoroethylene or ceramic rings are used as the insulating layer between the metal rings. Generally, the thickness of the metal ring is about 1mm, and the thickness of the insulating layer is about 6mm. The thickness and density of the electrode ring directly affect the uniformity of the electric field change in the migration tube. The thinner the electrode ring and the greater the density of the electrode ring, the more conducive it is to form a stable and uniform electric field in the ion migration tube. The uniformly changing electric field is conducive to improving the separation effect and sensitivity of the ion migration spectrometer. Because of this, many researchers bevel the edge of the metal ring electrode into a wedge shape to obtain a relatively thin electrode edge to improve the uniformity of the electric field. However, this method has limited effect. The electrode thickness is still at the millimeter level, and it cannot greatly improve the performance of the ion mobility spectrometer. In addition, the electrodes and insulating rings are installed alternately, which requires the processing accuracy of the insulating rings and electrode rings to be extremely high. The processing error of the electrode is superimposed on the processing error of the insulating ring, which greatly increases the assembly error. The increase in this error also increases the possibility of uneven electric field in the ion mobility tube. At the same time, the cost of processing metal electrode sheets or ceramic electrode sheets with uniform thickness is relatively high, especially the ceramic electrode sheet has a low yield rate, and the cost of the product is relatively high. Summary of the invention

[0003] In order to overcome the problems of the prior art, the present invention provides a printed circuit ion transfer tube.

[0004] A printed circuit ion migration tube, comprising a PCB circuit board stack and a sleeve;

[0005] The PCB circuit board stack includes a sheet PCB board, an electrode ring and a resistor; the middle part of the sheet PCB board includes a hollow part for configuring the sleeve, and the electrode ring is configured on one surface of the sheet PCB board through a printed circuit process; the electrode ring is circular, and includes at least two electrode ring lead grooves at the edge of the sheet PCB board, and the electrode ring lead groove includes a soldering point, and the soldering point is electrically connected to the electrode ring; a plurality of the PCB circuit board stacks pass through the sleeve and configure the electrode rings together in the same direction, and the resistor is bridged to two adjacent lead grooves through a soldering point.

[0006] Preferably, the solder joints in the electrode ring lead groove on the same sheet PCB board are arranged on one side of the electrode ring lead groove, and the solder joints in adjacent lead grooves on the same sheet PCB board are not located on the same side, and the lead grooves of each PCB circuit board stack are staggered.

[0007] Preferably, the thickness of the electrode ring is 35 μm, and the thickness error is within ±7%.

[0008] Preferably, the sheet-like PCB board comprises a through hole for configuring a fixing column, and each of the sheet-like PCB boards is fixed by the fixing column.

[0009] Preferably, the outer diameter of the sheet PCB board is 40 mm, the inner diameter is 14 mm, and the thickness of the board is 2 mm;

[0010] The inner diameter of the electrode ring is 15 mm, and the outer diameter is 17 mm.

[0011] Preferably, the fixing column is made of polyetheretherketone material.

[0012] Preferably, the PCB circuit board stack is 40 sheets, and the resistance value of the resistor is 440KΩ.

[0013] Preferably, the electrode ring lead groove includes two welding points with different depths.

[0014] Preferably, there are two electrode ring lead grooves, and the electrode ring lead grooves are arranged at 90° in the circumferential direction.

[0015] Preferably, the electrode ring lead grooves on the printed circuit ion transfer tube are arranged in a staggered manner.

[0016] Beneficial effects of the present invention:

[0017] The printed circuit ion transfer tube provided by the present invention uses printed circuit board technology to manufacture the ion transfer tube electrode ring, which is easier to control processing errors and assembly errors, while having higher precision and being able to produce a higher density of electrode rings, thereby making the magnetic field more sensitive. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a sheet-shaped PCB board of a printed circuit ion transfer tube of the present invention;

[0019] Figure 2 A top view of the printed circuit ion transfer tube of the present invention;

[0020] Figure 3 A first perspective side view of the printed circuit ion transfer tube of the present invention;

[0021] Figure 4It is a side view from a second viewing angle of the printed circuit ion transfer tube of the present invention. DETAILED DESCRIPTION

[0022] The present invention will be further described below in conjunction with the accompanying drawings: Figure 1 As shown, a printed circuit ion migration tube includes a PCB circuit board stack and a sleeve 9;

[0023] The PCB circuit board stack includes a sheet PCB board 1, an electrode ring 2 and a resistor 3; the middle part of the sheet PCB board 1 includes a hollow part 8 for configuring the sleeve 9, and the electrode ring 2 is configured on one surface of the sheet PCB board 1 through a printed circuit process; the electrode ring 2 is circular, and includes at least two electrode ring lead grooves 4 located at the edge of the sheet PCB board 1, and the electrode ring lead grooves 4 include solder joints, and the solder joints are electrically connected to the electrode ring 2; there are two electrode ring lead grooves 4, and the electrode ring lead grooves are arranged at 90 degrees in the circumferential direction. The soldering points in the electrode ring lead groove on the same sheet PCB board 1 are arranged on one side of the electrode ring lead groove 4, that is, the soldering points in the adjacent lead grooves 4 on the same sheet PCB board 1 are not on the same side, and only soldering point 1 5 is arranged in one of the two lead grooves 4, and only soldering point 2 6 is arranged in the other, so that when staggered, one soldering point is ensured to be on the left and the other soldering point is on the right, and the lead grooves 4 of each PCB circuit board stack are staggered; when configured, the lead grooves 4 are staggered, so that when resistor 3 is configured, it is ensured that resistor 3 is not short-circuited. Resistor 3 connects the electrode rings 2 of the adjacent upper and lower sheet PCB boards 1, and so on and so forth, which is equivalent to the electrode rings 2 and resistor 3 being configured in series at intervals.

[0024] A plurality of PCB circuit board stacks pass through the sleeve and arrange the electrode rings together in the same direction, and the resistor is connected across two adjacent lead grooves through a solder joint. The thickness of the electrode ring is 35 μm, and the thickness error is within ±7%.

[0025] The sheet PCB board includes a through hole 7 for configuring a fixing column, and each sheet PCB board is fixed by a fixing column. The outer diameter of the sheet PCB board is 40 mm, the inner diameter is 14 mm, and the thickness of the board is 2 mm;

[0026] The inner diameter of the electrode ring is 15 mm, and the outer diameter is 17 mm. The fixing column is made of polyetheretherketone material. The PCB circuit board stack has 40 sheets, and the resistance value of the resistor is 440KΩ.

[0027] There is a drift gas inlet pipe at the tail of the sleeve 9 made of polyetheretherketone material, and its flow direction is from the tail of the migration tube to the ionization source. The gas is heated to about 200 degrees Celsius by a heating module near the air inlet. The entire ion migration tube can be heated by adding a heating film between the electrode and the ion migration tube or adding a heating component to the outer surface of the electrode. When in use, after the sample passes through the ion source and becomes ions, it passes through the ion sieve door and enters the ion migration tube of the patent solution. The different types of ions of the sample ions are separated and reach the receiving electrode of the detector or detection module, and the analysis results are obtained after signal processing.

[0028] The embodiments described above are merely descriptions of preferred implementation modes of the present invention and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A printed circuit ion transfer tube, characterized in that: Including PCB circuit board stack and sleeve; The PCB circuit board stack includes a sheet PCB board, an electrode ring and a resistor; the middle part of the sheet PCB board includes a hollow part for configuring the sleeve, the electrode ring is configured on one surface of the sheet PCB board through a printed circuit process, and the electrode ring is configured on an inner surface of the sheet PCB board through a printed circuit process; the electrode ring is circular, and includes at least two electrode ring lead grooves at the edge of the sheet PCB board, and the electrode ring lead groove includes a solder point, and the solder point is electrically connected to the electrode ring; a plurality of PCB circuit board stacks connect the electrode rings through the sleeve The resistor is connected to two adjacent lead grooves through a solder joint. The solder joints in the electrode ring lead grooves on the same sheet PCB are arranged on one side of the electrode ring lead grooves, and the solder joints in the adjacent lead grooves on the same sheet PCB are not on the same side. The lead grooves of each PCB circuit board stack are arranged in a staggered manner. The electrode ring lead grooves include two solder joints with different depths. There are two electrode ring lead grooves, which are arranged at 90 degrees in the circumferential direction. The electrode ring lead grooves on the printed circuit ion migration tube are arranged in a staggered manner. The thickness of the electrode ring is 35 μm, and the thickness error is within ±7%.

2. The printed circuit ion transfer tube according to claim 1, characterized in that: The sheet-like PCB board includes through holes for configuring fixing columns, and each of the sheet-like PCB boards is fixed by the fixing columns.

3. The printed circuit ion transfer tube according to claim 1, characterized in that: The outer diameter of the sheet PCB board is 40 mm, the inner diameter is 14 mm, and the thickness of the board is 2 mm; the inner diameter of the electrode ring is 15 mm, and the outer diameter is 17 mm.

4. The printed circuit ion transfer tube according to claim 2, characterized in that: The fixing column is made of polyetheretherketone material.

5. The printed circuit ion transfer tube according to claim 1, characterized in that: The PCB circuit board stack consists of 40 sheets, and the resistance value of the resistor is 440KΩ.

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