Waterproof fingerprint module and electronic equipment

Abstract

The present invention provides a waterproof fingerprint module and an electronic device, which relate to the technical field of fingerprint modules. The waterproof fingerprint module comprises a fingerprint recognition chip, a circuit substrate and a support member. The fingerprint recognition chip comprises a first plane and a second plane, the first plane is electrically connected to the circuit substrate, the support member comprises a first mounting surface and a second mounting surface opposite to the first mounting surface, the first mounting surface is connected to the second plane of the fingerprint recognition chip through a first adhesive layer, and the second mounting surface is connected to the circuit substrate through a second adhesive layer. By arranging multiple planar adhesive layers on the outer side of the fingerprint recognition chip, the stability of the adhesive layer is enhanced, the adhesive area is expanded, the single adhesive layer is prevented from affecting the waterproof performance due to the presence of bubbles, and the water vapor penetration is prevented from affecting the electrical connection between the fingerprint recognition chip and the circuit substrate, thereby improving the waterproof performance of the fingerprint module.

Description

Technical Field

[0001] The present invention relates to the technical field of fingerprint modules, and in particular to a waterproof fingerprint module and an electronic device. Background Art

[0002] The information interaction between mobile terminal users has increased exponentially. At the same time, various types of telecommunications fraud and identity theft have occurred frequently. The security of user ID information recognition technology has become a research hotspot. In mobile Internet interaction, biometric technology is gradually being recognized by the public as an emerging interactive technology under the guidance of the times. The application of a new type of safe and reliable fingerprint recognition technology in various electronic devices has brought good news to mobile Internet terminal users.

[0003] At present, the traditional fingerprint module structure only realizes the waterproof function by setting a layer of waterproof glue on the periphery of the fingerprint chip. However, due to the presence of gas between the bottom of the fingerprint chip and the circuit substrate during the filling glue wrapping process, the filling glue cannot be completely wrapped, and the glue is a flowing liquid. The entire glue filling process cannot be accurately controlled, and products with insufficient waterproof function often flow out, affecting product quality. Summary of the invention

[0004] In view of this, an object of the embodiments of the present invention is to provide a waterproof fingerprint module and an electronic device to improve the problem that the waterproof performance of the existing fingerprint module cannot meet the requirements.

[0005] The technical solution adopted by the present invention is as follows:

[0006] An embodiment of the present invention provides a waterproof fingerprint module, which includes a circuit substrate, a support member and a fingerprint recognition chip. The fingerprint recognition chip and the support member are both arranged on the circuit substrate, and the support member is arranged on the periphery of the fingerprint recognition chip. The fingerprint recognition chip includes a first plane and a second plane forming a stepped structure, the first plane protrudes relative to the second plane, and the first plane is electrically connected to the circuit substrate. The support member includes a first mounting surface and a second mounting surface opposite to the first mounting surface, the first mounting surface is connected to the second plane of the fingerprint recognition chip through a first adhesive layer, and the second mounting surface is connected to the circuit substrate through a second adhesive layer.

[0007] Furthermore, the support member includes a gasket and a metal ring, the gasket is connected to the circuit substrate, the metal ring is arranged on the gasket, and the metal ring is arranged on the periphery of the fingerprint recognition chip.

[0008] Furthermore, the gasket is annular, and the first mounting surface and the second mounting surface are formed on the gasket.

[0009] Furthermore, a chamfer is formed on the periphery of the fingerprint recognition chip, the chamfer of the fingerprint recognition chip is connected to the second plane, and a waterproof glue is provided at the connection between the chamfer and the second mounting surface.

[0010] Furthermore, the metal ring includes a bonding surface, and the bonding surface is bonded to the second mounting surface of the gasket through a third adhesive layer.

[0011] Furthermore, a chamfer is formed on the inner circumference of the metal ring, and the chamfer of the metal ring is connected to the bonding surface.

[0012] Furthermore, a first chamfer is provided on the outer periphery of the support member, the first chamfer of the support member is connected to the second mounting surface, and waterproof glue is provided at the connection between the first chamfer and the second mounting surface.

[0013] Furthermore, a second chamfer is provided on the inner periphery of the support member, and the second chamfer is connected to the second mounting surface.

[0014] Furthermore, the waterproof fingerprint module also includes a protective layer, and the protective layer is arranged on a side surface of the fingerprint recognition chip away from the circuit substrate.

[0015] An embodiment of the present invention provides an electronic device, which includes a device body and a waterproof fingerprint module. The waterproof fingerprint module includes a circuit substrate, a support and a fingerprint recognition chip. The fingerprint recognition chip and the support are both arranged on the circuit substrate. The support is arranged on the periphery of the fingerprint recognition chip. The fingerprint recognition chip includes a first plane and a second plane forming a stepped structure. The first plane protrudes relative to the second plane. The first plane is electrically connected to the circuit substrate. The support includes a first mounting surface and a second mounting surface opposite to the first mounting surface. The first mounting surface is connected to the second plane of the fingerprint recognition chip through a first adhesive layer, and the second mounting surface is connected to the circuit substrate through a second adhesive layer. The waterproof fingerprint module is arranged on the device body.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention provides a waterproof fingerprint module and electronic equipment. The waterproof fingerprint module includes a fingerprint recognition chip, a circuit substrate and a support member. The fingerprint recognition chip includes a first plane and a second plane. The support member includes a first mounting surface and a second mounting surface opposite to the first mounting surface. The first mounting surface is connected to the second plane of the fingerprint recognition chip through a first adhesive layer, and the second mounting surface is connected to the circuit substrate through a second adhesive layer. By arranging multiple planar adhesive layers on the outer side of the fingerprint recognition chip, the adhesive area is expanded, and the problem of incomplete adhesive filling due to bubbles and the like is avoided, and water vapor penetration is prevented from affecting the electrical connection between the fingerprint recognition chip and the circuit substrate. The original single waterproof adhesive is optimized into multiple planar adhesive layers, and the adhesive layer area is increased, which can greatly enhance the waterproof effect and significantly improve the waterproof performance of the module.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A schematic diagram of an existing fingerprint module is shown.

[0021] Figure 2 A schematic diagram of a waterproof fingerprint module provided by a first embodiment of the present invention is shown.

[0022] Figure 3 A schematic diagram of a waterproof fingerprint module provided by a first embodiment of the present invention is shown.

[0023] Figure 4 A schematic diagram of a waterproof fingerprint module provided by a second embodiment of the present invention is shown.

[0024] Figure 5 A schematic diagram of a waterproof fingerprint module provided by a second embodiment of the present invention is shown.

[0025] Figure 6 A schematic diagram of an electronic device is shown.

[0026] Icons: 10-fingerprint module; 101-appearance protection layer; 102-fingerprint chip; 103-metal ring; 104-substrate; 105-waterproof glue; 20-waterproof fingerprint module; 210-circuit substrate; 211-conductive material; 213-second glue layer; 215-waterproof glue; 230-support; 231-first mounting surface; 232-second mounting surface; 233-first glue layer; 241-gasket; 243-metal ring; 2431-bonding surface; 2432-third glue layer; 250-fingerprint recognition chip; 251-first plane; 253-second plane; 255-third plane; 270-protective layer; 40-electronic device; 41-device body. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0028] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0029] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0030] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly stipulated and limited, the terms "set", "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements.

[0031] In the description of the present invention, it should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. The terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of more restrictions, the elements defined by the sentence "comprise one..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0032] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0033] See also Figure 1 , Figure 1 The structure diagram of the existing fingerprint module 10 is shown, which includes an appearance protection layer 101, a fingerprint chip 102, a metal ring 103 and a substrate 104, wherein the fingerprint chip 102 is fixed on the substrate 104 by a conductive material, the metal ring is fixed on the substrate by a glue layer, and the appearance protection layer 101 is arranged on the surface of the fingerprint chip 102. Water vapor enters the module through the gap between the metal ring 103 and the fingerprint chip 102. The waterproof glue 105 wraps the conductive material between the fingerprint chip 102 and the substrate 104 to realize the waterproof function of the module body.

[0034] In the existing actual fingerprint module manufacturing process, since there is gas between the bottom of the fingerprint chip 102 and the substrate 104 during the filling glue wrapping process, the filling glue often cannot be completely wrapped, and the glue is a flowing liquid. The entire glue filling process cannot be accurately controlled, and products with insufficient waterproof function often flow out, causing losses.

[0035] First embodiment

[0036] This embodiment provides a waterproof fingerprint module 20 to improve the problem of insufficient waterproof function of the existing fingerprint module 10 .

[0037] See also Figure 2 , Figure 2 A schematic diagram of a waterproof fingerprint module 20 provided in this embodiment is shown.

[0038] The waterproof fingerprint module 20 includes a circuit substrate 210, a support member 230, a fingerprint recognition chip 250 and a protective layer 270. The fingerprint recognition chip 250 and the support member 230 are both arranged on the circuit substrate 210, and the support member 230 is arranged on the periphery of the fingerprint recognition chip 250. The fingerprint recognition chip 250 includes a first plane 251 and a second plane 253 forming a stepped structure, the support member 230 includes a first mounting surface 231 and a second mounting surface 232 opposite to the first mounting surface 231, the first plane 251 of the fingerprint recognition chip 250 is electrically connected to the circuit substrate 210, and the second plane 253 of the fingerprint recognition chip 250 is connected to the first mounting surface 231 of the support member 230 through the first adhesive layer 233. The second mounting surface 232 of the support member 230 is connected to the circuit substrate 210 through the second adhesive layer 213, and the protective layer 270 is arranged on the fingerprint recognition chip 250. Compared with the traditional fingerprint module 10, the waterproof fingerprint module 20 provided in this embodiment has a first adhesive layer 233 set between the fingerprint recognition chip 250 and the support member 230, and a second adhesive layer 213 set between the support member 230 and the circuit substrate 210. The first adhesive layer 233 and the second adhesive layer 213 have a planar support, which is more stable, and the connection between the fingerprint recognition chip 250 and the circuit substrate 210 is isolated from the outside world, thereby increasing the adhesive layer area and avoiding the problem of insufficient waterproof performance due to incomplete filling due to bubbles and other reasons.

[0039] The fingerprint recognition chip 250 includes a first plane 251 , a second plane 253 and a third plane 255 , wherein the first plane 251 and the second plane 253 form a stepped structure, the first plane 251 protrudes relative to the second plane 253 , and the third plane 255 is a surface opposite to the first plane 251 and the second plane 253 .

[0040] For example, in this embodiment, the fingerprint recognition chip 250 includes a plastic package, a wafer, a gold wire and a circuit substrate. The wafer is fixed on the circuit substrate by gluing with glue, and the wafer is electrically connected to the circuit substrate by the gold wire. The plastic package wraps the wafer and the gold wire to fix it on the circuit substrate. Therefore, the circuit substrate actually includes a circuit area and a non-circuit area around the circuit area. After the fingerprint recognition chip 250 is packaged, the non-circuit area of ​​the circuit substrate can be removed by mechanical processing, so that the fingerprint recognition chip 250 forms a stepped structure. In this embodiment, the first plane 251 protrudes relative to the second plane 253, that is, the first plane 251 includes the circuit area of ​​the circuit substrate of the fingerprint recognition chip 250, and the second plane 253 is a stepped surface formed after removing the non-circuit area. It should be noted that the position of the wafer, the gold wire and the circuit substrate can also be fixed by a mold injection molding method, and the fingerprint recognition chip 250 including a stepped structure can be made by injection molding.

[0041] The first plane 251 of the fingerprint recognition chip 250 is connected to the circuit substrate 210, which not only fixes the fingerprint recognition chip 250 on the circuit substrate 210, but also realizes the electrical connection between the fingerprint recognition chip 250 and the circuit substrate 210 to complete the signal transmission.

[0042] The first plane 251 of the fingerprint recognition chip 250 can be fixedly connected to the circuit substrate 210 through the conductive material 211. For example, the conductive material 211 can be solder paste or ACF film (Anisotropic Conductive Film, ACF), but is not limited thereto. The fingerprint recognition chip 250 can be fixedly connected to the circuit substrate 210 through solder paste or ACF film. The second plane 253 of the fingerprint recognition chip 250 is connected to the support member 230.

[0043] The support member 230 is disposed on the circuit substrate 210 and disposed on the periphery of the fingerprint recognition chip 250. The support member 230 is used to support the fingerprint recognition chip 250 on one hand, providing a support surface for stably setting the glue layer, and on the other hand, is sleeved on the periphery of the fingerprint recognition chip 250 to protect the fingerprint recognition chip 250.

[0044] The support member 230 includes a first mounting surface 231 and a second mounting surface 232 opposite to the first mounting surface 231. A first adhesive layer 233 is provided between the first mounting surface 231 of the support member 230 and the second plane 253 of the fingerprint recognition chip 250, and the first mounting surface 231 of the support member 230 and the second plane 253 of the fingerprint recognition chip 250 are bonded through the first adhesive layer 233. The first adhesive layer 233 is more stable because it is supported by the first mounting surface 231 of the support member 230 and the second plane 253 of the fingerprint recognition chip 250. The first adhesive layer 233 firmly bonds the fingerprint recognition chip 250 to the support member 230, and at the same time fills the gap between the first mounting surface 231 of the support member 230 and the second plane 253 of the fingerprint recognition chip 250, which can prevent water vapor from penetrating through the gap between the support member 230 and the fingerprint recognition chip 250, thereby improving the waterproof performance of the waterproof fingerprint module 20.

[0045] The first adhesive layer 233 may be made of a glue material with waterproof properties, such as ASEC301403 or Loctite 3128, but is not limited thereto. Compared with the conventional waterproof adhesive 215 that only wraps the connection surface, the waterproof fingerprint module 20 provided in this embodiment improves the waterproof performance of the waterproof fingerprint module 20 by providing the first adhesive layer 233.

[0046] The second mounting surface 232 of the support member 230 is connected to the circuit substrate 210 via the second adhesive layer 213. The second adhesive layer 213 is disposed between the second mounting surface 232 of the support member 230 and the circuit substrate 210. The support with two planes is more stable and has a better waterproof effect. The second adhesive layer 213 firmly adheres the support member 230 to the circuit substrate 210, and completely fills the gap between the second mounting surface 232 of the support member 230 and the circuit substrate 210, preventing moisture from penetrating through the gap between the support member 230 and the circuit substrate 210, thereby affecting the electrical connection between the fingerprint recognition chip 250 and the circuit substrate 210.

[0047] The second adhesive layer 213 may be a waterproof adhesive layer that is the same as or different from the first adhesive layer 233 , and may be made of, for example, ASEC301403 or Loctite 3128.

[0048] A first chamfer is provided on the periphery of the support member 230, and the first chamfer of the support member 230 is connected to the second mounting surface 232 of the support member 230. A waterproof glue 215 is provided at the connection between the first chamfer and the second mounting surface 232, and the waterproof glue 215 completely wraps the second glue layer 213, so that the second glue layer 213 is isolated from the outside and prevents moisture from penetrating. The first chamfer can guide the waterproof glue 215 so that the waterproof glue 215 completely wraps the second glue layer 213, thereby improving the waterproof performance of the waterproof fingerprint module 20.

[0049] The waterproof glue 215 may be glue with better waterproof performance, such as Loctite UF3808, but is not limited thereto.

[0050] The support member 230 is disposed on the periphery of the fingerprint recognition chip 250, the inner periphery of the support member 230 is adjacent to the fingerprint recognition chip 250, and the inner periphery of the support member 230 is provided with a second chamfer. The second chamfer of the support member 230 is connected to the second mounting surface 232. The inner periphery of the support member 230 is formed with a second chamfer to prevent the fingerprint recognition chip 250 or the circuit substrate 210 from being cut by the internal edges and corners.

[0051] The waterproof fingerprint module 20 includes a protective layer 270, which is disposed on a side surface of the fingerprint recognition chip 250 away from the circuit substrate 210, namely, the third plane 255. The protective layer 270 is used to protect the fingerprint recognition chip 250. The protective layer 270 can be made of glass, sapphire, ceramic, paint and other materials, but is not limited thereto. The protective layer 270 can also be used to print a logo, etc.

[0052] The size of the protection layer 270 is comparable to the area of ​​the fingerprint recognition chip 250 , so that the fingerprint recognition chip 250 can be completely covered without exceeding the range of the fingerprint recognition chip 250 .

[0053] In this embodiment, the support member 230 may be an integral metal ring 243 made of metal, but is not limited thereto. Figure 3 In order to improve the waterproof performance of the waterproof fingerprint module 20 as much as possible, the area of ​​the second adhesive layer 213 between the support member 230 and the circuit substrate 210 can be increased without affecting the size of other components, that is, the area of ​​the second mounting surface 232 of the support member 230 is increased.

[0054] It should also be noted that, in this embodiment, the circuit substrate 210 may be a conventional circuit board or a flexible circuit board, but is not limited thereto.

[0055] Second embodiment

[0056] See also Figure 4 This embodiment provides a waterproof fingerprint module 20. The basic principle of the waterproof fingerprint module 20 provided in this embodiment is roughly the same as that of the waterproof fingerprint module 20 provided in the first embodiment. In order to briefly describe this embodiment, the same parts will not be described in detail. For the details not introduced in this embodiment, please refer to the relevant content in the first embodiment.

[0057] The waterproof fingerprint module 20 includes a circuit substrate 210, a support member 230, a fingerprint recognition chip 250 and a protective layer 270. The fingerprint recognition chip 250 and the support member 230 are both arranged on the circuit substrate 210, and the support member 230 is arranged on the periphery of the fingerprint recognition chip 250. The fingerprint recognition chip 250 includes a first plane 251 and a second plane 253 forming a stepped structure, the support member 230 includes a first mounting surface 231 and a second mounting surface 232 opposite to the first mounting surface 231, the first plane 251 of the fingerprint recognition chip 250 is electrically connected to the circuit substrate 210, and the second plane 253 of the fingerprint recognition chip 250 is connected to the first mounting surface 231 of the support member 230 through the first adhesive layer 233. The second mounting surface 232 of the support member 230 is connected to the circuit substrate 210 through the second adhesive layer 213, and the protective layer 270 is arranged on the fingerprint recognition chip 250. Compared with the traditional fingerprint module, the waterproof fingerprint module 20 provided in this embodiment has a first adhesive layer 233 set between the fingerprint recognition chip 250 and the support member 230, and a second adhesive layer 213 set between the support member 230 and the circuit substrate 210, so as to isolate the connection between the fingerprint recognition chip 250 and the circuit substrate 210 from the outside world, increase the area of ​​the adhesive layer, and avoid the problem of insufficient waterproof performance caused by incomplete filling due to bubbles and the like.

[0058] In this embodiment, the support member 230 includes a gasket 241 and a metal ring 243 . The gasket 241 is connected to the circuit substrate 210 , and the metal ring 243 is disposed on the gasket 241 . The metal ring 243 is disposed on the periphery of the fingerprint identification chip 250 .

[0059] The gasket 241 is annular, and the first mounting surface 231 and the second mounting surface 232 are formed on the gasket 241 , and are two opposite surfaces on the gasket 241 .

[0060] The second plane 253 of the fingerprint recognition chip 250 is connected to the first mounting surface 231 of the gasket 241 through the first adhesive layer 233. The periphery of the fingerprint recognition chip 250 is chamfered, and the chamfer of the fingerprint recognition chip 250 is connected to the second plane 253. A waterproof glue 215 is provided at the connection between the chamfer of the fingerprint recognition chip 250 and the second plane 253, and the waterproof glue 215 wraps the first adhesive layer 233 to prevent moisture from penetrating from the gap between the second plane 253 of the fingerprint recognition chip 250 and the first mounting surface 231 of the gasket 241. The chamfer can guide the waterproof glue 215 so that the waterproof glue 215 completely wraps the first adhesive layer 233. The third adhesive layer 2432 can be made of a glue material with waterproof properties, for example, it can be ASEC301403 or Loctite 3128 and other materials, but is not limited thereto.

[0061] The second mounting surface 232 of the gasket 241 is connected to the circuit substrate 210 through the second adhesive layer 213 .

[0062] The metal ring 243 is disposed on the gasket 241, and the metal ring 243 is disposed on the periphery of the fingerprint identification chip 250. The metal ring 243 includes a bonding surface 2431, and the bonding surface of the metal ring 243 is connected to the first mounting surface 231 of the gasket 241 through the third adhesive layer 2432. The third adhesive layer 2432 firmly adheres the metal ring 243 to the gasket 241, and can also prevent moisture from penetrating through the gap between the metal ring 243 and the gasket 241.

[0063] The third adhesive layer 2432 may be an adhesive layer with waterproof performance that is the same as or different from the first adhesive layer 233 and the second adhesive layer 213 , and may be made of materials such as ASEC301403 or Loctite 3128.

[0064] The inner circumference of the metal ring 243 is chamfered, and the chamfer of the inner circumference of the metal ring 243 is connected to the bonding surface 2431 of the metal ring 243. In this embodiment, the metal ring 243 is arranged on the periphery of the fingerprint recognition chip 250. By providing a chamfer on the inner circumference of the metal ring 243, the metal ring 243 can be prevented from cutting the fingerprint recognition chip 250, thereby improving the quality of the product.

[0065] The waterproof fingerprint module 20 includes a protective layer 270, which is disposed on a side surface of the fingerprint recognition chip 250 away from the circuit substrate 210, namely, the third plane 255. The protective layer 270 is used to protect the fingerprint recognition chip 250. The protective layer 270 can be made of glass, sapphire, ceramic, paint, etc., but is not limited thereto. The protective layer 270 can also be used to print a logo, etc.

[0066] The size of the protection layer 270 is comparable to the area of ​​the fingerprint recognition chip 250 , so that the fingerprint recognition chip 250 can be completely covered without exceeding the range of the fingerprint recognition chip 250 .

[0067] It should be noted that, in this embodiment, the waterproof performance of the waterproof fingerprint module 20 can be improved by increasing the area of ​​the second adhesive layer 213, see Figure 5 , that is, the area of ​​the second mounting surface of the gasket 241 is correspondingly increased.

[0068] It should also be noted that, in this embodiment, the circuit substrate 210 may be a conventional circuit board or a flexible circuit board, but is not limited thereto.

[0069] Third embodiment

[0070] This embodiment provides an electronic device 40, see Figure 6 The electronic device 40 includes a device body and a waterproof fingerprint module 20 provided in any one of the first embodiment or the second embodiment, and the waterproof fingerprint module 20 is connected to the device body. The electronic device 40 includes but is not limited to a mobile phone, a tablet computer, a laptop computer, etc. For example, the waterproof fingerprint module 20 can be set on any plane or curved surface of the electronic device 40. The waterproof fingerprint module 20 is electrically connected to the device body 41 to transmit the identified fingerprint and other information to the device body 41.

[0071] In summary, the present invention provides a waterproof fingerprint module and electronic device, the waterproof fingerprint module includes a fingerprint recognition chip, a circuit substrate and a support member, the fingerprint recognition chip includes a first plane and a second plane, the support member includes a first mounting surface and a second mounting surface opposite to the first mounting surface, the first mounting surface is connected to the second plane of the fingerprint recognition chip through a first adhesive layer, and the second mounting surface is connected to the circuit substrate through a second adhesive layer. By arranging multiple planar adhesive layers on the outside of the fingerprint recognition chip, the adhesive area is expanded, and the problem of incomplete adhesive filling due to bubbles and the like is avoided, and water vapor penetration is prevented from affecting the electrical connection between the fingerprint recognition chip and the circuit substrate. The original single waterproof glue is optimized into multiple planar adhesive layers, and the adhesive layer area is increased, which can greatly enhance the waterproof effect and significantly improve the waterproof performance of the module.

[0072] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A waterproof fingerprint module, It is characterized in that The waterproof fingerprint module includes a circuit substrate, a support and a fingerprint recognition chip, the fingerprint recognition chip and the support are both arranged on the circuit substrate, the support is arranged on the periphery of the fingerprint recognition chip, the fingerprint recognition chip includes a first plane and a second plane forming a stepped structure, the first plane is protruding relative to the second plane, the first plane is electrically connected to the circuit substrate, the support includes a first mounting surface and a second mounting surface opposite to the first mounting surface, the first mounting surface is connected to the second plane of the fingerprint recognition chip through a first adhesive layer plane, and the second mounting surface is connected to the circuit substrate through a second adhesive layer plane; The first adhesive layer plane fills the gap between the first mounting surface and the second plane of the fingerprint recognition chip, and the second adhesive layer plane completely fills the gap between the second mounting surface and the circuit substrate; The periphery of the fingerprint recognition chip is chamfered, the chamfer of the fingerprint recognition chip is connected to the second plane, a waterproof glue is provided at the connection between the chamfer and the second mounting surface, and the waterproof glue wraps the first glue layer plane and the second glue layer plane; A first chamfer is arranged on the outer periphery of the support member, the first chamfer of the support member is connected to the second mounting surface, and waterproof glue is arranged at the connection between the first chamfer and the second mounting surface.

2. The waterproof fingerprint module according to claim 1, It is characterized in that The support member includes a gasket and a metal ring, the gasket is connected to the circuit substrate, the metal ring is arranged on the gasket, and the metal ring is arranged on the periphery of the fingerprint recognition chip.

3. The waterproof fingerprint module according to claim 2, It is characterized in that The gasket is annular, and the first mounting surface and the second mounting surface are formed on the gasket.

4. The waterproof fingerprint module according to claim 3, It is characterized in that The metal ring comprises a bonding surface, and the bonding surface is bonded to the second mounting surface of the gasket via a third adhesive layer.

5. The waterproof fingerprint module according to claim 4, It is characterized in that The inner circumference of the metal ring forms a chamfer, and the chamfer of the metal ring is connected to the bonding surface.

6. The waterproof fingerprint module according to claim 1, It is characterized in that A second chamfer is arranged on the inner periphery of the support member, and the second chamfer is connected to the second mounting surface.

7. The waterproof fingerprint module according to claim 1, It is characterized in that The waterproof fingerprint module also includes a protective layer, which is arranged on a side surface of the fingerprint recognition chip away from the circuit substrate.

8. An electronic device, It is characterized in that The electronic device comprises a device body and a waterproof fingerprint module as described in any one of claims 1 to 7, and the waterproof fingerprint module is arranged on the device body.

Images