Camera module

Abstract

The present invention relates to a camera module, comprising: a circuit board; a photosensitive chip, which is arranged on the circuit board; and a package body, which is arranged on the circuit board and packages at least part of the structure of the photosensitive chip, wherein the package body comprises an outer side surface, an inner side surface and a top surface, wherein the top surface is opposite to the circuit board and connects the outer side surface and the inner side surface, and the inner side surface comprises an arc surface connected to the photosensitive chip and a vertical surface connected to the top surface, wherein the vertical surface is perpendicular to the circuit board. The camera module is provided with an arc surface connected to the photosensitive chip and a vertical surface connected to the top surface on the inner side surface of the package body, and the portion of the inner side surface connected to the top surface is arranged to be vertical, rather than the traditional tilt, so that the area of ​​the top surface can be increased, thereby providing more colloid bearing area, so that the lens assembly arranged on the top surface can be fixed more securely.

Description

Technical Field

[0001] The present invention relates to the field of camera technology, and in particular to a camera module. Background Art

[0002] In recent years, camera modules for acquiring images have been increasingly widely used in personal electronic products, the automotive field, the medical field, and the like. For example, camera modules have become one of the standard accessories for portable electronic devices such as smartphones and tablet computers. Camera modules used in portable electronic devices can not only acquire images, but also help portable electronic devices realize functions such as instant video calls. The trend of increasingly thin and light portable electronic devices requires the overall size of camera modules to be smaller and smaller. However, the lens assembly in the camera module is generally fixed by gluing. If the size of the carrier carrying the lens assembly is too small, the carrier cannot provide enough glue to securely fix the lens assembly, which will affect the stability of the imaging capability of the camera module. Summary of the invention

[0003] The present invention aims to provide a camera module with both smaller size and better imaging capability.

[0004] A camera module, comprising:

[0005] Circuit boards;

[0006] A photosensitive chip is disposed on the circuit board; and

[0007] A packaging body is arranged on a circuit board and encapsulates at least part of the structure of a photosensitive chip, wherein the packaging body includes an outer side surface, an inner side surface and a top surface, wherein the top surface is opposite to the circuit board and connects the outer side surface and the inner side surface, and the inner side surface includes an arc surface connected to the photosensitive chip and a vertical surface connected to the top surface, wherein the vertical surface is perpendicular to the circuit board.

[0008] In one embodiment, the inner side surface further includes an inclined surface connecting the arc surface and the vertical surface. Providing the inclined surface can make the upper larger and lower smaller structure of the cavity formed by the package body more obvious, which is beneficial to demoulding the package body after molding.

[0009] In one embodiment, the photosensitive chip has an optical axis, and one end of the inclined surface connected to the vertical surface is away from the optical axis, and the angle between the inclined surface and the optical axis is 30±5°. The angle of the inclined surface is set at the above specific value, which can meet the convenience of demolding after the package is formed, and will not affect the width size of the top surface, so that the colloid carrying capacity of the top surface is limited.

[0010] In one embodiment, the radius of the arc surface is 0.10±0.02 mm. The radius of the arc surface is set at the above specific value, which can not only meet the convenience of demoulding after the package is formed, but also will not affect the width of the top surface, so that the colloid carrying capacity of the top surface is limited.

[0011] In one embodiment, the arc surface is concave toward the outer side surface.

[0012] In one embodiment, the arc surface is convex facing away from the outer side surface. The specific shapes of the arc surface are diversified, so the range of molds for molding the package body is wider, which is convenient for flexibly controlling the molding cost of the package body.

[0013] In one embodiment, the height of the vertical surface is 0.14±0.05 mm.

[0014] In one embodiment, the thickness of the circuit board is 0.40±0.05 mm, and the thickness of the package is 0.41±0.05 mm. By controlling the vertical, circuit board, and package dimensions, the overall size of the camera module can be miniaturized while achieving better imaging functions.

[0015] In one embodiment, the package is annular, the photosensitive chip includes a non-photosensitive area and a photosensitive area, and the package encapsulates at least part of the non-photosensitive area of ​​the photosensitive chip. Due to the protection of the package, the electrical connection between the photosensitive chip and the circuit board can be prevented from being damaged during the manufacturing process of the above-mentioned camera module.

[0016] In one embodiment, the distance from the end of the curved surface of the package body close to the photosensitive chip to the photosensitive area is 0.14±0.05 mm. Separating the package body by a specific distance from the photosensitive area is helpful for ensuring the imaging quality and miniaturization of the camera module.

[0017] In one embodiment, the package body includes a plurality of outer side surfaces connected end to end, at least one end of the outer side surface connected to the top surface is slanted close to the optical axis, and the angle between the outer side surface and the optical axis is 10±5°. The at least one outer side surface is inclined to facilitate the demoulding of the package body and the miniaturization of the camera module.

[0018] In one embodiment, the photosensitive chip is electrically connected to the circuit board through a wire, and the wire is wrapped by the package. The wire is wrapped by the package to prevent the wire from moving. At the same time, the wire is in a sealed environment, which can reduce the contact between the wire and water vapor in the air and extend the service life of the wire.

[0019] In one embodiment, a lens assembly is further included, which is fixedly connected to the top surface of the package body. The external light signal is focused by the lens assembly and received by the photosensitive chip.

[0020] The camera module has an inner side surface of the package body provided with an arc surface connected to the photosensitive chip and a vertical surface connected to the top surface. The portion of the inner side surface connected to the top surface is set vertically instead of being tilted in the traditional way, so that the area of ​​the top surface can be increased, thereby providing more colloid bearing area, so that the lens assembly set on the top surface can be fixed more securely. On the other hand, the portion of the inner side surface connected to the photosensitive chip retains the arc surface design, which is conducive to the demoulding of the package body. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic top view of a camera module provided by an embodiment of the present invention;

[0022] Figure 2 For along Figure 1 Schematic cross-sectional view of the AA line;

[0023] Figure 3 for Figure 2 An enlarged schematic diagram of the circle I portion;

[0024] Figure 4 for Figure 2 Schematic enlargement of circle II. DETAILED DESCRIPTION

[0025] like Figure 1 and Figure 2 As shown, a camera module provided by one embodiment of the present invention includes a circuit board 10, a photosensitive chip 20 and a packaging body 30.

[0026] The circuit board 10 may be a printed circuit board, and in some embodiments, the circuit board 10 may be a flexible circuit board. Circuits are formed on the circuit board 10, and these circuits are electrically connected to other components in the electronic device (such as a mobile terminal such as a mobile phone) used by the camera module.

[0027] In some embodiments, the circuit board 10 includes two substrates and a flexible member connecting the two substrates, and components such as the photosensitive chip 20 and the package 30 are arranged on one of the substrates. Electronic components may also be arranged on the other substrate, and the electronic components may be resistors, capacitors, diodes, triodes, potentiometers, relays or drivers. It is understood that, for example, Figure 1 As shown, electronic components 104 may also be disposed on the substrate where the photosensitive chip 20 and the package body 30 are located. The electronic components 104 may be resistors, capacitors, diodes, transistors, potentiometers, relays or drivers.

[0028] The photosensitive chip 20 is disposed on the circuit board 10. The photosensitive chip 20 is electrically connected to the circuit on the circuit board 10. The photosensitive surface 201 of the photosensitive chip 20 is away from the circuit board 10 to receive the light signal, and the photosensitive chip 20 converts the light signal into an electrical signal and transmits it to an external image processing device or image storage device through the circuit board 10.

[0029] The photosensitive chip 20 has an optical axis L. The geometric center of the photosensitive chip 20 is on the optical axis L. The photosensitive chip 20 includes a non-photosensitive area 21 and a photosensitive area 22. The non-photosensitive area 21 surrounds the photosensitive area 22. The upper surface of the photosensitive area 22 defines the photosensitive surface 201.

[0030] The photosensitive chip 20 is electrically connected to the circuit board 10 via the wire 202. Specifically, one end of the wire 202 is connected to the contact on the non-photosensitive area 21 of the photosensitive chip 20, and the other end of the wire 202 is connected to the corresponding contact on the circuit board 10. In some other embodiments, the photosensitive chip 20 can also be electrically connected directly to the contact on the circuit board 10 by welding without the wire 202.

[0031] The package body 30 is disposed on the circuit board 10 and encapsulates at least part of the structure of the photosensitive chip 20. The package body 30 is used to protect the connection between the photosensitive chip 20 and the circuit board 10 from external interference during the manufacturing and circulation links, so as to ensure the reliability of the connection between the photosensitive chip 20 and the circuit board 10. In one embodiment, the package body 30 encapsulates the non-photosensitive areas 21 around the photosensitive chip 20 on the circuit board 10. In some other embodiments, the package body 30 can also encapsulate the non-photosensitive area 21 of one side or part of the side of the photosensitive chip 20 on the circuit board 10. In the mass production process, the photosensitive chip 20 is first fixedly connected to the large circuit board 10, and then the package body 30 is formed, and then the large circuit board 10 is divided into independent units. Due to the protection of the package body 30, the electrical connection between the photosensitive chip 20 and the circuit board 10 can be prevented from being damaged during the division process.

[0032] In the embodiment where the electrical connection between the photosensitive chip 20 and the circuit board 10 is formed by the wire 202, the wire 202 can be wrapped by the package 30. The wire 202 is wrapped by the package 30, which can prevent the wire 202 from moving. At the same time, the wire 202 is in a sealed environment, which can reduce the contact between the wire 202 and the water vapor in the air, and extend the service life of the wire 202.

[0033] The electronic components 104 disposed on the circuit board 10 may also be wrapped by the packaging body 30. The electronic components 104 are wrapped by the packaging body 30, which can protect the electronic components 104 from external interference and prevent the electronic components 104 from contacting with water vapor in the air, thereby extending the service life.

[0034] Also refer to Figure 3 and Figure 4 The package body 30 includes an outer side surface 301, a top surface 302 and an inner side surface 303. The top surface 302 connects the outer side surface 301 and the inner side surface 303 and is opposite to the circuit board 10. The end of the outer side surface 301 away from the top surface 302 is connected to the circuit board 10, and the end of the inner side surface 303 away from the top surface 302 is connected to the circuit board 10 or connected to the photosensitive chip 20. For example, when the inner side surface 303 encapsulates the photosensitive chip 20 on the corresponding side, it is connected to the photosensitive chip 20, and when the inner side surface 303 does not encapsulate the photosensitive chip 20 on the corresponding side, it is connected to the circuit board 10.

[0035] In one embodiment, the package body 30 is annular, and it can be understood that the outer side surface 301, the top surface 302 and the inner side surface 303 are all annular. In one embodiment, the package body 30 has a square frame structure, and thus includes four outer side surfaces 301 connected end to end, four top surfaces 302 connected end to end and four inner side surfaces 303 connected end to end.

[0036] like Figure 2 and Figure 4 As shown in FIG. 1 , at least one end of the outer side surface 301 connected to the top surface 302 is slanted close to the optical axis L, and the angle between the outer side surface 301 and the optical axis L is 10±5°.

[0037] Setting the outer side surface 301 to be inclined relative to the optical axis L can facilitate the demoulding of the package body 30, and at the same time can reduce the volume occupied by the package body 30, which is conducive to the miniaturization of the camera module. In some embodiments, the four outer side surfaces 301 can be inclined relative to the optical axis L, and the angles can be equal or unequal. In the mass production process, since multiple photosensitive chips 20 are injection molded and packaged on a large circuit board at one time, and then the circuit board and the package body are separated by a cutting process to obtain multiple independent units, the photosensitive chip 20 injection molded in the middle part, the part of the outer side surface 301 of the package body obtained by cutting is perpendicular to the circuit board, that is, parallel to the optical axis L.

[0038] The top surface 302 is opposite to the circuit board 10 and is arranged parallel to the circuit board 10 . The top surface 302 is used to carry the lens assembly.

[0039] like Figure 2 and Figure 3 As shown in the figure, the inner side surface 303 is surrounded to form a cavity 304. The photosensitive area 22 of the photosensitive chip 20 is placed in the cavity 304, and the photosensitive surface 201 is exposed in the cavity 304 to receive external light signals. At least part of the non-photosensitive area 21 of the photosensitive chip 20 is wrapped by the packaging body 30.

[0040] The inner side surface 303 includes a curved surface 305 connected to the photosensitive chip 20 and a vertical surface 306 connected to the top surface 302, and the vertical surface 306 is perpendicular to the circuit board 10. The portion of the inner side surface 303 connected to the top surface 302 is set vertically, rather than the traditional tilt, so that the area of ​​the top surface 302 can be increased, thereby providing more colloid bearing area, so that the lens assembly set on the top surface 302 can be fixed more securely. On the other hand, the portion of the inner side surface 303 connected to the photosensitive chip 20 still has the setting of the curved surface 305, so from the overall point of view, the cavity 304 still has a structure of large top and small bottom, so as to facilitate the demolding of the package 30 after molding. In some embodiments, the curved surface 305 is an arc surface with a radius of 0.10±0.02mm. The radius of the curved surface 305 needs to take into account the convenience of demolding and the overall size of the package 30. The curved surface 305 is set so that the cavity 304 still has a structure of large top and small bottom, so as to facilitate the demolding of the package 30 after molding. If it is too small, it will not be helpful for the convenience of demoulding. If it is too large, the width of the top surface 302 of the package body 30 will be small, which will affect the colloid carrying capacity.

[0041] The distance d between one end of the arc surface 305 of the package body 30 close to the photosensitive chip 20 and the photosensitive area 22 of the photosensitive chip 20 is 0.14±0.05mm. The package body 30 will be used to carry the colloid used to fix the lens assembly later. If it is too close to the photosensitive area 22 of the photosensitive chip 20, the colloid will contaminate the photosensitive chip 20 during the gluing process, affecting the imaging quality of the camera module. If the package body 30 is too far away from the photosensitive chip 20, it is not conducive to the miniaturization of the camera module. Therefore, in some embodiments, the above distance d is set to a maximum value of 0.19mm and a minimum value of 0.09mm. Through experimental verification, it is found that the above distance can not only better form the camera module without making the processing and manufacturing cost too high, but also ensure the imaging quality of the camera module.

[0042] Figure 2 and Figure 3 In the embodiment shown, the arc surface 305 is concave toward the outer side surface 301. In some other embodiments, the arc surface 305 may be convex away from the outer side surface 301. The specific shape of the arc surface 305 can be diversified, so the range of mold selection for molding the package body 30 is wider, which is convenient for flexibly controlling the molding cost of the package body 30.

[0043] In some embodiments, the thickness T1 of the circuit board 10 is 0.40±0.05 mm, and the thickness T2 of the package body 30 is 0.41±0.05 mm. Furthermore, the height h of the vertical surface 306 is 0.14±0.05 mm. The arc length of the arc surface 305 is 0.1 mm.

[0044] In some embodiments, the inner side surface 303 also includes a slope 307 connecting the arc surface 305 and the vertical surface 306. The slope 307 is provided to make the upper large and lower small structure of the cavity 304 more obvious, which is conducive to the demolding of the package 30 after molding. More specifically, the end of the slope 307 connected to the vertical surface 306 is swayed away from the optical axis L, and the angle between the slope 307 and the optical axis L is 30±5°. The angle of the slope 307 needs to take into account the convenience of demolding and the overall size of the package 30. If the angle between the slope 307 and the optical axis L is too large, the width of the top surface 302 of the package 30 is small and the colloid carrying capacity is affected. Conversely, if the angle between the slope 307 and the optical axis L is too small, it is not helpful for the convenience of demolding.

[0045] In some embodiments, the camera module further includes a lens assembly, which is fixed to the top surface 302 of the package body 30 by colloid bonding. The external light signal is received by the photosensitive chip 20 through the focusing of the lens assembly. The lens assembly may include a lens, and in some embodiments, the lens may be directly disposed on the top surface 302 of the package body 30. The lens assembly may include a lens barrel for fixing the lens, and in some embodiments, the lens barrel may be directly disposed on the top surface 302 of the package body 30. In some embodiments, the lens assembly may also include a bracket for fixing the lens barrel, and the bracket may be disposed on the top surface 302 of the package body 30.

[0046] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A camera module, characterized in that include: Circuit boards; A photosensitive chip is arranged on the circuit board, and the photosensitive chip has an optical axis; and A packaging body, the packaging body is annular, is disposed on the circuit board and encapsulates at least part of the structure of the photosensitive chip, the packaging body includes an outer side surface, an inner side surface and a top surface, the top surface is opposite to the circuit board and connects the outer side surface and the inner side surface, the inner side surface includes a curved surface connected to the photosensitive chip and a vertical surface connected to the top surface, and the vertical surface is perpendicular to the circuit board; The inner side surface also includes an inclined surface connecting the arc surface and the vertical surface, one end of the inclined surface connected to the vertical surface is slanted away from the optical axis, and the angle between the inclined surface and the optical axis is 30±5°.

2. The camera module according to claim 1, characterized in that: The radius of the arc surface is 0.10±0.02 mm.

3. The camera module according to claim 1, characterized in that: The arc surface is concave toward the outer side surface.

4. The camera module according to claim 1, characterized in that: The arc surface is convex facing away from the outer side surface.

5. The camera module according to claim 1, characterized in that: The height of the vertical surface is 0.14±0.05 mm.

6. The camera module according to claim 1, characterized in that: The thickness of the circuit board is 0.40±0.05 mm, and the thickness of the package body is 0.41±0.05 mm.

7. The camera module according to claim 1, characterized in that: The photosensitive chip includes a non-photosensitive area and a photosensitive area, and the packaging body encapsulates at least part of the non-photosensitive area of ​​the photosensitive chip.

8. The camera module according to claim 7, characterized in that: The distance from one end of the arc surface of the package body close to the photosensitive chip to the photosensitive area is 0.14±0.05 mm.

9. The camera module according to claim 7, characterized in that: The package body comprises a plurality of outer side surfaces connected end to end, one end of at least one of the outer side surfaces connected to the top surface is slanted close to the optical axis, and the angle between the outer side surface and the optical axis is 10±5°.

10. The camera module according to claim 1, characterized in that: The photosensitive chip is electrically connected to the circuit board via a wire, and the wire is wrapped by the packaging body.

11. The camera module according to claim 1, characterized in that: It also includes a lens assembly, which is fixedly connected to the top surface of the packaging body.

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