Pico Projector

Through split design and efficient heat dissipation measures, the problem of heat influence of optical head system in micro projectors is solved, and the operation comfort and portability are improved.

CN109739066BActive Publication Date: 2025-02-14VEKEN TECH CO LTD
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Patent Information

Application Number
CN201910103489.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-02-01
Publication Date
2025-02-14
Estimated Expiration
2039-02-01

AI Technical Summary

Technical Problem

In existing micro projectors, the heat generated by the optical head system affects the normal operation of the host system, resulting in discomfortable operation and affects portable performance.

Method used

A split micro projector is designed, and the optical head system is set separately from the host system. The optical head system uses a metal shell and a heat conductor for heat dissipation, and improves flexibility through a rotating interface. The main system is equipped with operating buttons and heat dissipation is performed using a metal thermal equalization cover and carbon nanomaterials.

Benefits of technology

Effectively isolate the heat of the optical head system, avoid affecting the operation of the host system, improve operating comfort and portability, and do not require additional support.

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Abstract

The embodiment of the present invention provides a micro projector, including an optical head system and a host system; the optical head system includes an optical head housing, an optical machine driving board and an optical machine optical path module electrically connected to the optical machine driving board, and the optical machine driving board and the optical machine optical path module are located in the optical head housing; the host system includes a host housing and a host system board, and the host system board is located in the host housing, and an operation button is arranged on the host housing; the optical head housing is rotatably pivoted to the host housing through a rotating shaft, and the optical head housing and the host housing are respectively located at two ends of the rotating shaft in the axial direction of the rotating shaft, and the optical machine driving board is electrically connected to the host system board through a connecting line. The micro projector can prevent the heat emitted by the optical head system from affecting the operation of the host system, and at the same time can improve the comfort and portability of the product.
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Description

Technical Field

[0001] The embodiments of the present invention relate to the field of projection technology, and in particular to a micro projector. Background Art

[0002] With the development of projection technology, projection equipment is increasingly tending towards small size, high power and low noise. The optical head system and host system of existing micro projectors are usually located in the same housing. Due to the compact internal structure of the micro projector, it is impossible to form an effective natural air convection duct. The heat generated by the optical head system with a large heat generation is often easily accumulated inside the housing and cannot be dissipated. This heat will cause the temperature of the internal components of the projector to be too high, affecting the normal operation of the host system with a lower heat generation.

[0003] At the same time, the shell of the existing micro projector is provided with operation buttons, which is the main area of ​​human-computer interaction. When the above micro projector is operated, the heat generated by the optical head system causes the temperature of the entire projector shell to be high, thereby affecting the comfort of operating the projector.

[0004] In addition, in different projection application scenarios, existing micro projectors often require the support of accessories such as brackets, which affects the portability of the projector. Summary of the invention

[0005] In view of this, the technical problem to be solved by the embodiments of the present invention is to provide a micro projector to overcome the problem in the prior art that the heat generated by the optical head system affects the normal operation of the host system, thereby achieving the technical effect of effective heat dissipation and improving operating comfort and portability.

[0006] In order to solve the above technical problems, an embodiment of the present invention provides a micro projector, including an optical head system and a host system; the optical head system includes an optical head housing, an optical machine driving board and an optical machine optical path module electrically connected to the optical machine driving board, and the optical machine driving board and the optical machine optical path module are located in the optical head housing; the host system includes a host housing and a host system board, the host system board is located in the host housing, and operation buttons are arranged on the host housing; the optical head housing is rotatably pivoted to the host housing through a rotating shaft, the optical head housing and the host housing are respectively located at two ends of the rotating shaft in the axial direction of the rotating shaft, and the optical machine driving board is electrically connected to the host system board through a connecting line.

[0007] Furthermore, the optical head housing is made of metal material, and includes a cylindrical housing body and side wall heat sinks respectively located on opposite sides of the housing body.

[0008] Furthermore, a metal heat conductive sheet is provided in the shell body, and the heat generated by the optical head system is conducted to the two side wall heat sinks and the shell body through the metal heat conductive sheet for heat dissipation.

[0009] Furthermore, the surface of the metal heat conductive sheet is coated with graphite material.

[0010] Furthermore, the metal heat conductive sheet includes a first metal heat conductive sheet and a second metal heat conductive sheet; the first metal heat conductive sheet is attached to the optical machine driving board, and is arranged on two opposite sides of the optical machine driving board with the optical machine optical path module; the second metal heat conductive sheet is attached to the heating element of the optical machine optical path module, and is arranged on two opposite sides of the optical machine optical path module with the optical machine driving board.

[0011] Furthermore, the first metal heat conductive sheet is bent to form an end portion, and the end portion is attached to a side wall heat sink far away from the host system; the second metal heat conductive sheet is also bent to form an end portion, and the end portion is attached to a side wall heat sink close to the host system.

[0012] Furthermore, the shell body and the side wall heat sink far away from the host system are connected by a heat insulating material or a heat conducting material; the shell body and the side wall heat sink close to the host system are connected by a heat conducting material.

[0013] Furthermore, the first metal heat conductive sheet is bent to form an end portion, and the end portion is attached to the two side wall heat sinks; the second metal heat conductive sheet is planar and attached to the shell body.

[0014] Furthermore, the shell body and the two side wall heat sinks are connected via a heat insulating material.

[0015] Furthermore, the optical head system also includes an inner frame bracket, which is located in the optical head housing, and the optical path module and the optical drive board are fixedly mounted on the inner frame bracket; the rotating shaft is a hollow rotating shaft, one end of which is fixed on the inner frame bracket, and the connecting line is passed through the rotating shaft.

[0016] Furthermore, the host system also includes a metal heat balance cover, which is attached to the inner surface of the host shell and is located between the host shell and the components on the host system board, and is connected to the heating components on the host system board through a heat conducting medium.

[0017] Furthermore, the surface of the metal heat balance cover is coated with carbon nanomaterial.

[0018] Furthermore, a plurality of heat dissipation through holes are provided on the mainframe shell at positions corresponding to the metal heat balance cover.

[0019] Furthermore, the host housing is made of plastic material.

[0020] Furthermore, the host system board has a charge and discharge circuit, and the host system also includes a battery cell that can receive electricity and discharge electricity to external devices. The battery cell is located in the host housing and is electrically connected to the charge and discharge circuit of the host system board.

[0021] Compared with the prior art, in the embodiment of the present invention, the optical head system and the host system are separately arranged, so that the optical head system and the host system are isolated from each other, which can prevent the heat emitted by the optical head system from affecting the operation of the host system. At the same time, operation buttons are set on the host system. When the above-mentioned micro-projector is operated, the human body will hardly come into contact with the optical head system with high heat, thereby avoiding discomfort to the human body caused by overheating. The above-mentioned split design can effectively distribute the heat dissipation distribution, disperse the heat of the part that the human body often touches, and concentrate it in the non-contact area for centralized heat dissipation, thereby improving the comfort of product use. In addition, the optical head system can be rotatably pivoted on the host system, and the host system can serve as the support base of the optical head system. This split setting can better solve various flexible projection application scenarios, and does not require the support of accessories such as brackets, thereby improving the portability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0023] Figure 1 It is a three-dimensional schematic diagram of a preferred embodiment of the present invention.

[0024] Figure 2 yes Figure 1 A three-dimensional schematic diagram of one of the usage states of the embodiment shown.

[0025] Figure 3 yes Figure 1 A schematic diagram of an exploded view of the optical head system in the illustrated embodiment.

[0026] Figure 4 yes Figure 1 A schematic partial cross-sectional view of the optical handpiece system in the illustrated embodiment.

[0027] Figure 5 yes Figure 1 An exploded schematic diagram of the host system in the illustrated embodiment.

[0028] Figure 6 yes Figure 1A partial cross-sectional schematic diagram of a host system in the illustrated embodiment. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in the field based on the embodiments in the embodiments of the present invention should fall within the scope of protection of the embodiments of the present invention.

[0030] See also Figures 1 to 6 , is a preferred embodiment of the present invention, the micro projector includes an optical head system 1 and a host system 2. The optical head system 1 includes an optical head housing 11, an optical machine driving board 12 and an optical machine optical path module 13 electrically connected to the optical machine driving board 12, the optical machine driving board 12 and the optical machine optical path module 13 are located in the optical head housing 11. The host system 2 includes a host housing 21 and a host system board 22, the host system board 22 is located in the host housing 21, and an operation button 211 is provided on the host housing 21. The optical head housing 11 is rotatably pivoted to the host housing 21 through a rotating shaft 3, the optical head housing 11 and the host housing 21 are respectively located at two ends of the rotating shaft 3 in the axial direction of the rotating shaft 3, and the optical machine driving board 12 is electrically connected to the host system board 21 through a connecting line (not shown in the figure).

[0031] The optical head system 1 and the host system 2 of the above-mentioned micro-projector are separately arranged, so that the optical head system 1 and the host system 2 are isolated from each other, which can prevent the heat emitted by the optical head system 1 from affecting the operation of the host system 2. At the same time, an operation button 211 is set on the host system 2. When the above-mentioned micro-projector is operated, the human body will hardly come into contact with the optical head system 1 with high heat, thereby avoiding discomfort to the human body caused by overheating; the above-mentioned split design can effectively distribute the heat dissipation distribution, disperse the heat of the part that the human body often touches, and concentrate it in the non-contact area for centralized heat dissipation, thereby improving the comfort of product use. In addition, the optical head system 1 can be rotatably pivoted on the host system 2, and the host system 2 can serve as the support base of the optical head system 1. This split design can better solve various flexible projection application scenarios, and does not require the support of accessories such as brackets, thereby improving the portability of the product.

[0032] For details, please refer to Figure 3 and Figure 4The optical head system 1 can use a laser optical machine, which has less heat than a DLP (Digital Light Processing) optical machine. It does not need to install a necessary fan like an ordinary DLP optical machine, thereby saving space and avoiding noise generated by the fan. The optical head system 1 also includes an inner frame bracket 14, which is located in the optical head housing 11, and the optical machine optical path module 13 and the optical machine driving board 12 are fixedly installed on the inner frame bracket 14.

[0033] The optical head housing 11 is made of metal material, which includes a cylindrical housing body 111 and side wall radiators 112 respectively located on opposite sides of the housing body 111. The housing body 111 and the side wall radiators 112 together enclose an internal space for accommodating the optical machine driving board 12 and the optical machine optical path module 13. The optical machine optical path module 13 and the optical machine driving board 12 are installed in the housing 111 in an upper and lower stacked manner, which can reduce the occupied space. The side wall radiators 112 of the optical head housing 11 are made of aluminum alloy profiles, and nano materials are sprayed on the surface of the profiles to enhance the heat dissipation performance. Each side wall radiator 112 includes a substrate 1121 and a plurality of heat dissipation fins 1122. The substrate 1121 is closed at the end of the housing body 111, and the heat dissipation fins 1122 are extended outward from the outer surface of the substrate 1121. A metal heat conductive sheet is disposed in the housing body 111 of the optical head system 1 , and the heat generated by the optical head system 1 is conducted to the heat sinks 112 on both side walls and the housing body 111 through the metal heat conductive sheet for heat dissipation.

[0034] The metal heat conductive sheet can be made of copper foil, and its surface is coated with graphite material. Graphite material has high thermal conductivity in the X and Y directions, and copper has high thermal conductivity in the Z direction. Combining the advantages of the two, the metal heat conductive sheet can more quickly conduct the heat generated in the optical head system 1 to the side wall heat sink 112 and the shell body 111, thereby dissipating the heat.

[0035] Specifically, the metal heat conductive sheet includes a first metal heat conductive sheet 15 and a second metal heat conductive sheet 16. The first metal heat conductive sheet 15 is attached to the optical machine driving board 12, and is disposed on opposite sides of the optical machine driving board 12 with the optical machine optical path module 13. The first metal heat conductive sheet 15 is bent out of an end portion, and the end portion is attached to a side wall heat sink 112 away from the host system 2. In this way, the heat generated by the optical machine driving board 12 can be conducted to one of the side wall heat sinks 112 through the first metal heat conductive sheet 15, and dissipated through the side wall heat sink 112. The second metal heat conductive sheet 16 is installed on the inner frame bracket 14, and is attached to the heating element (not shown in the figure) of the optical machine optical path module 13, and is disposed on opposite sides of the optical machine optical path module 13 with the optical machine driving board 12. The second metal heat conductive sheet 16 is bent out of an end portion, and the end portion is attached to the side wall heat sink 112 close to the host system 2 to transfer the heat generated by the optical path module 13 of the optical machine to the other side wall heat sink 112 of the optical machine housing 11. In this embodiment, the housing body 111 and the two side wall heat sinks 112 are connected by heat conductive materials, so that the two side wall heat sinks 112 can transfer the heat to the housing body 111 through the heat conductive materials, and further assist in heat dissipation through the housing body 111. This heat dissipation method can prevent the surface temperature of the housing body 111 from being too high and causing burns. The side wall heat sink 112 is usually a part that cannot be touched by hands, and can give full play to its heat dissipation function to ensure that the internal optical path module 13 and the optical drive board 12 can work normally.

[0036] Of course, the shell body 111 and the side wall radiator 112 far from the host system 2 can be connected by heat insulating materials, and the shell body 111 and the side wall radiator 112 close to the host system 2 can be connected by heat conductive materials. In this way, the heat generated by the host driving board 12 is transferred to the side wall radiator 112 far from the host system 2 through the first metal heat conductive sheet 15, and will not be thermally connected with the shell body 111. The heat generated by the optical path module 13 is transferred to the side wall radiator 112 close to the host system 2 through the second metal heat conductive sheet 16, and can be further transferred to the shell body 111 through the heat conductive material, so that the surface temperature of the shell body 111 is not too high and is in a thermal equilibrium state with the surrounding environment.

[0037] In another embodiment of the present invention, the ends of the first metal heat conductive sheet 15 can also be attached to the two side wall heat sinks 112 at the same time to conduct the heat generated by the optical engine driving board 12 to the two side wall heat sinks 112 of the optical engine housing 11; and the second metal heat conductive sheet 16 is in a planar shape, without bending the ends, and the second metal heat conductive sheet 16 is attached to the housing body 111, and the heat generated by the optical engine optical path module 13 can be conducted to the housing body 111 through the second metal heat conductive sheet 16 for heat dissipation. Since the heat generated by the optical engine driving board 12 is relatively large, and the heat generated by the optical engine optical path module 13 is relatively small, the housing body 111 and the two side wall heat sinks 112 are connected by heat insulating materials, so that heat cross-talk can be prevented, that is, the higher heat on the side wall heat sink 112 can be prevented from being conducted to the housing body 111, affecting the normal operation of the optical engine optical path module 13.

[0038] Please also read Figure 5 and Figure 6 The host housing 21 of the host system 2 includes an upper cover 212 and a lower cover 213. The operation button 211 is mounted on the upper cover 212. The host system 2 also includes a key board 23. The key board 23 is located between the button 211 and the host system board 22 and is electrically connected to the host system board 22. The host housing 21 is provided with a plurality of connector ports (not shown in the figure), and the connector ports at least include a USB (Universal Serial Bus) interface and an audio input interface.

[0039] The host system 2 also includes a metal heat balance cover 24, the shape of which is consistent with the inner surface shape of the upper cover 212 of the host housing 21, the metal heat balance cover 24 is attached to the inner surface of the upper cover 212 of the host housing 21, and is located between the upper cover 212 of the host housing 21 and the components (not shown in the figure) on the host system board 22, and the metal heat balance cover 24 is connected to the heating components (such as chips, etc.) on the host system board 22 through a heat conductive medium such as a heat conductive adhesive. The metal heat balance cover is made of metal materials with good thermal conductivity such as aluminum and copper, and mainly plays a role in heat dissipation and shielding. It can evenly conduct the heat generated by the host system 2 to the upper cover 212 of the host housing 21, balance the heat, and perform spatial heat dissipation, thereby preventing the local temperature of the host housing 21 from being too high.

[0040] The main body shell 21 is preferably made of plastic material to reduce the temperature sensitivity of the human body. Of course, the main body shell 21 can also be made of metal material. A number of evenly distributed heat dissipation holes 2121 are opened on the upper cover 212 of the main body shell 21 at the position corresponding to the metal heat balance cover 24 to facilitate heat dissipation. The surface of the metal heat balance cover 24 can be coated with carbon nanomaterials to enhance radiative heat dissipation, and the radiative heat dissipation is mainly dissipated through the heat dissipation holes 2121 on the main body shell 21.

[0041] Please also read Figure 1 and Figure 2 The above-mentioned shaft 3 is a hollow shaft, one end of which is fixed to the inner frame bracket 14 in the optical head system 1, and the optical head system can rotate with the shaft 3. The connecting wire is inserted into the shaft 3. From the appearance of the product, the connecting wire will not be seen in the gap between the optical head housing 11 and the host housing 21, and there will be no problem of poor connection of the connecting wire caused by rotation, so that the practicality and aesthetics of the product can be taken into account. Of course, the shaft 3 can also be a solid shaft, and the connecting wire can be connected to the optical head system 2 and the host system 1 in parallel outside the shaft 3.

[0042] When assembling the above-mentioned micro projector, the shaft 3 is first fixed to the inner frame bracket 14 of the optical head system 1, and the optical path module 13, the optical drive board 12 and the inner frame bracket 14 are assembled into a whole, and then inserted into the shell body 111, and the side wall heat sinks 112 at both ends of the shell body 111 are encapsulated to complete the assembly of the optical head system 1. Then, the other end of the shaft 3 is installed as a whole into the host shell 11 of the host system 1, and the host shell 11 is positioned by the vertical end face and fastened with screws to ensure accurate positioning.

[0043] The connection line between the optical head system 2 and the host system 1 may include audio and video connection lines, power lines, control lines, etc. One end of the connection line is welded to the FPC (Flexible Printed Circuit) soft cable to connect to the optical machine driving board 12, and the other end is connected to the socket to connect to the host system 1.

[0044] In addition, the host system board 22 also has a charging and discharging circuit, and the host system 2 also includes a battery 25 that can receive power and discharge to external devices. The battery 25 is located in the host housing 21 and is located on the side of the host system board 22 away from the metal heat balance cover 24, and is electrically connected to the charging and discharging circuit of the host system board 22. In this embodiment, the charging and discharging circuit is a fast charging and discharging circuit, which supports the QC3.0 protocol and the PD2.0 protocol, supports fast power reception and fast discharge to external devices, and can complete the fast charging function at 5V, 9V, and 12V gears. The charging and discharging circuit can be in the fast charging mode of the micro projector, that is, when the projection system is turned off, to quickly discharge a single external device at 5V, 9V, and 12V gears through the fast charging protocol, or accept fast charging from a fast charging adapter; it can also discharge the external device while turning on the projection system, or discharge while receiving power. In this mode, it can be charged and discharged simultaneously or separately in the 5V state. The internal battery 25 is powered, and in the micro-projection startup mode, and when an external hard disk is connected, 5V is used to supply power according to current demand. In the above state, the external power adapter also uses 5V to supply power according to current requirements.

[0045] Compared with the traditional micro-projector, which sets the optical head system and the host system in the same internal space, the heat generated by the optical head system with a higher heat generation affects the normal operation of the host system with a lower heat generation. The micro-projector of the embodiment of the present invention sets the optical head system 1 and the host system 2 separately, so that the optical head system 1 and the host system 2 are isolated from each other, which can prevent the heat emitted by the optical head system 1 from affecting the operation of the host system 2. At the same time, an operation button 211 is set on the host system 2. When the above-mentioned micro-projector is operated, the human body will hardly come into contact with the optical head system 1 with a higher heat generation, thereby avoiding discomfort to the human body caused by overheating and improving the comfort of product use. In addition, the optical head system 1 can be rotatably pivoted to the host system 2, and the host system 2 can serve as the support base of the optical head system 1, so as to better solve various flexible projection application scenarios, without the support of accessories such as brackets, and improve the portability of the product.

[0046] The above embodiments are only preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be regarded as equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A micro projector, comprising an optical head system and a host system; the optical head system comprises an optical machine driving board and an optical machine optical path module electrically connected to the optical machine driving board; the host system comprises a host system board; the optical machine driving board is electrically connected to the host system board through a connecting line; characterized in that: The optical head system also includes an optical head shell, the optical machine driving board and the optical machine optical path module are located in the optical head shell, the optical head shell is made of metal material, and includes a cylindrical shell body and side wall radiators respectively located on opposite sides of the shell body, a metal heat conductive sheet is arranged in the shell body, the heat generated by the optical head system is conducted to the side wall radiators and the shell body through the metal heat conductive sheet for heat dissipation, the metal heat conductive sheet includes a first metal heat conductive sheet and a second metal heat conductive sheet, the first metal heat conductive sheet is attached to the optical machine driving board, and is arranged on opposite sides of the optical machine driving board with the optical machine optical path module, the first metal heat conductive sheet is bent out of an end portion, the end portion is attached to the side wall radiator away from the host system, the second metal heat conductive sheet It is attached to the heating element of the optical path module of the optical machine, and is arranged on the opposite sides of the optical path module with the optical machine driving board. The second metal heat conductive sheet is also bent out of an end portion, and the end portion is attached to the side wall radiator close to the host system; the host system also includes a host shell and a metal thermal balance cover, the host system board is located in the host shell, and operation buttons are arranged on the host shell. The metal thermal balance cover is attached to the inner surface of the host shell, and is located between the host shell and the components on the host system board, and is connected to the heating element on the host system board through a heat conductive medium; the optical head shell is rotatably pivoted to the host shell through a rotating shaft, and the optical head shell and the host shell are respectively located at two ends of the rotating shaft in the axial direction of the rotating shaft.

2. The micro-projector according to claim 1, characterized in that: The surface of the metal heat conducting sheet is coated with graphite material.

3. The micro-projector according to claim 1, wherein: The shell body is connected to the side wall radiator far away from the host system through a heat insulating material or a heat conducting material; the shell body is connected to the side wall radiator close to the host system through a heat conducting material.

4. The micro-projector according to claim 1, wherein: The first metal heat conducting sheet is bent to form an end portion, and the end portion is attached to the two side wall heat sinks; the second metal heat conducting sheet is planar and attached to the shell body.

5. The micro-projector according to claim 4, characterized in that: The shell body and the two side wall radiators are connected via heat insulation material.

6. The micro-projector according to claim 1, wherein: The optical head system also includes an inner frame bracket, which is located in the optical head housing, and the optical path module and the optical drive board are fixedly mounted on the inner frame bracket; the rotating shaft is a hollow rotating shaft, one end of which is fixed on the inner frame bracket, and the connecting line is passed through the rotating shaft.

7. The micro projector as claimed in claim 1, characterized in that The surface of the metal heat balance cover is coated with carbon nanomaterials.

8. The micro-projector according to claim 1, wherein: A plurality of heat dissipation through holes are provided on the mainframe shell at positions corresponding to the metal heat balance cover.

9. The micro-projector according to claim 1, wherein: The host shell is made of plastic material.

10. The micro-projector according to any one of claims 1 to 9, characterized in that: The host system board has a charge and discharge circuit, and the host system further includes a battery cell capable of receiving electricity and discharging electricity to external devices. The battery cell is located in the host housing and is electrically connected to the charge and discharge circuit of the host system board.

Citation Information

Patent Citations

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    CN103838066A

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    CN209400845U