Double-sided probe station and wafer loading method

Abstract

The present invention discloses a double-sided probe station. The double-sided probe station includes a frame; a wafer table connected to the frame, and the wafer table can move relative to the frame; a mounting portion fixed to the frame; a clamping fixture including a first stop portion; the first stop portion is provided with a first test hole, and a positioning concave ring is provided along the first test hole; a guide portion is installed on the mounting portion; the guide portion is provided with a guide through hole; the guide through hole includes a deflection adjustment conical hole and an alignment straight hole, the deflection adjustment conical hole is connected with the alignment straight hole, and a wafer is placed in the deflection adjustment conical hole, and under the action of gravity, the wafer falls into the alignment straight hole; the alignment straight hole corresponds to the positioning concave ring, so that after the wafer is placed from the deflection adjustment conical hole, the wafer passes through the alignment straight hole and enters the positioning concave ring, and the grain area of ​​the wafer corresponds to the first test hole.

Description

Technical Field

[0001] The invention relates to a double-sided probe station and a wafer loading method. Background Art

[0002] Some existing wafers (such as double-sided wafers) have a small distance between the grain area and the boundary, and the size is less than 2mm. After the wafer is placed, the force-bearing area (non-grain area) is small, such as Figure 5 As shown, d<2mm. The conventional vacuum adsorption method of the wafer is prone to cause damage to the wafer, because the wafer is easily damaged by colliding with other components, thereby affecting the automatic loading of double-sided semiconductor wafers. Existing manufacturers generally use manual loading, but manual loading is inefficient and the damage rate is still high. Summary of the invention

[0003] In order to solve the problem of wafer loading, the present invention provides a double-sided probe station and a wafer loading method.

[0004] The technical solution of the present invention is: a double-sided probe station, the double-sided probe station comprises:

[0005] frame;

[0006] A wafer stage connected to the frame, wherein the wafer stage can move relative to the frame;

[0007] A mounting portion, fixed to the frame;

[0008] The clip fixture comprises a first stopper; the first stopper is provided with a first test hole, and a positioning concave ring is provided along the first test hole;

[0009] A guide portion is mounted on the mounting portion; the guide portion is provided with a guide through hole; the guide through hole includes a deflection adjustment tapered hole and an alignment straight hole, the deflection adjustment tapered hole is connected with the alignment straight hole, a wafer is placed in the deflection adjustment tapered hole, and under the action of gravity, the wafer falls into the alignment straight hole;

[0010] The alignment hole corresponds to the positioning concave ring, so that after the wafer is placed through the deflection-adjusting tapered hole, the wafer enters the positioning concave ring through the alignment hole, and the grain area of ​​the wafer corresponds to the first test hole.

[0011] Furthermore, the clip fixture also includes a first abutment; the first abutment is provided with a second test hole, and a fixed convex ring is provided along the second test hole; the first stop portion can be connected to the first abutment, the fixed convex ring stops at the chip, and the first test hole corresponds to the second test hole, and the chip is located between the first stop portion and the first abutment.

[0012] Furthermore, the double-sided probe station includes a first adsorption portion, which is provided with a plurality of vacuum suction cups for adsorbing a first abutting portion; the first adsorption portion is connected to the mounting portion through a slider to separate / connect the first abutting portion from the first stop portion.

[0013] Furthermore, the wafer platform is connected to the frame via a slide rail and a slide groove.

[0014] Furthermore, the double-sided probe station also includes a first positioning mechanism,

[0015] The first positioning mechanism includes a lifting part and a cantilever part, the lifting part is provided with a placement plane, and the placement plane is provided with a vacuum adsorption hole; the lifting part is connected to the cantilever part bearing, so that the lifting part can rotate relative to the cantilever part; the cantilever part is connected to a first driving part, the first driving part is connected to the lifting part through a synchronous belt, and the first driving part controls the rotation of the lifting part; the cantilever part is slidably connected to the frame, and the lifting part can move along the conducting direction of the guide through hole.

[0016] A wafer loading method,

[0017] S1: Align the guide through hole with the positioning concave ring; the first stop portion is provided with a first test hole, and a positioning concave ring is provided along the first test hole; the guide portion is provided with a guide through hole;

[0018] S2: The wafer is placed on the placement plane of the first positioning mechanism, and the first positioning mechanism moves along the conducting direction of the guide through hole. Under the action of the wafer's gravity, the wafer stops at the placement plane and passes through the guide through hole. Finally, the wafer stops at the positioning concave ring under the action of gravity; and the grain area of ​​the wafer corresponds to the first test hole;

[0019] S3: placing a first abutment on a side of the wafer away from the first stop; the first abutment is provided with a second test hole, and a fixing convex ring is provided along the second test hole; the fixing convex ring abuts against the wafer, and the first test hole corresponds to the second test hole, and the wafer is located between the first stop and the first abutment;

[0020] S4: The first stopper is fixedly connected to the first abutting portion.

[0021] Furthermore, the guide through hole includes an adjustment tapered hole and an alignment hole, the adjustment tapered hole is connected to the alignment hole, the wafer is placed in the adjustment tapered hole, and under the action of gravity, the wafer passes through the alignment hole and falls into the positioning concave ring.

[0022] Further, in step S2,

[0023] The method comprises: the wafer stops at the placement plane through the guide through hole, the first positioning mechanism lifts the wafer away from the positioning concave ring, and when the wafer leaves the guide part, the vacuum adsorption hole on the placement plane adsorbs the wafer on the placement plane; and the placement plane rotates.

[0024] Furthermore, after the placement plane rotates, the first positioning mechanism descends, and the vacuum is disconnected before the wafer enters the guide portion, so that the wafer stops at the placement plane through the guide hole under the action of gravity.

[0025] The beneficial effects of the present invention are: solving the problem of loading wafers with a grain area that is close to the edge, facilitating the automated production of wafers and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the double-sided probe station from the first perspective;

[0027] Figure 2 is a schematic diagram of the first gear;

[0028] Figure 3 It is a schematic diagram of the guide part;

[0029] Figure 4 is a schematic diagram of the first contact part;

[0030] Figure 5 is a schematic diagram of a wafer;

[0031] Figure 6 is a schematic diagram of a first positioning mechanism;

[0032] Figure 7 This is a schematic diagram of the double-sided probe station from the second perspective. DETAILED DESCRIPTION

[0033] To facilitate those skilled in the art to understand the technical solution of the present invention, the technical solution of the present invention is further described in detail below in conjunction with specific embodiments.

[0034] like Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, the double-sided probe station 100 includes,

[0035] The frame 20 ensures that the double-sided probe station 100 has a stable structure;

[0036] The wafer stage 30 is connected to the frame 20. The wafer stage 30 can move relative to the frame 20. The wafer stage 30 can drive the double-sided wafer to move relative to the frame 20, so that the double-sided wafer can meet the requirements of different positions such as loading and unloading and testing;

[0037] The mounting portion 40 is fixed to the frame 20;

[0038] The clamping fixture 50 includes a first stopper 51; the first stopper 51 is provided with a first test hole 511, and a positioning concave ring 512 is provided along the first test hole 511; the size of the positioning concave ring 512 needs to meet two basic requirements, one is that the double-sided wafer can be accommodated in the positioning concave ring 512, and the other is that the grain area of ​​the double-sided wafer corresponds to the first test hole 511; thereby meeting the requirements for placing the double-sided wafer and not affecting the test;

[0039] The guide part 60 is mounted on the mounting part 40; the guide part 60 is provided with a guide through hole 61; the guide through hole 61 includes a deflection adjustment tapered hole 611 and an alignment straight hole 612, the deflection adjustment tapered hole 611 is connected with the alignment straight hole 612, and the wafer is placed in the deflection adjustment tapered hole 611, and under the action of gravity, the wafer falls into the alignment straight hole 612; the difficulty of placing the double-sided wafer into the positioning concave ring 512 is reduced by the guide part 60, replacing the conventional manual placement of the double-sided wafer into the positioning concave ring 512, thereby improving the production efficiency of the double-sided wafer; and reducing the conventional manual placement of the double-sided wafer directly into the positioning concave ring 512, which causes damage to the double-sided wafer, and the double-sided wafer is a brittle material and is easily damaged;

[0040] The alignment hole 612 corresponds to the positioning concave ring 512, so that after the chip is placed into the deflection tapered hole 611, the chip enters the positioning concave ring 512 through the alignment hole 612, and the grain area of ​​the chip corresponds to the first test hole 511; the double-sided wafer can automatically fall into the positioning concave ring 512, thereby improving efficiency; the problem of automatic loading of double-sided wafers is solved, and it is convenient to realize fully automatic testing of double-sided wafers.

[0041] Those skilled in the art can also use a vacuum suction cup to absorb the double-sided wafer, scan the boundary of the double-sided wafer with the positioning concave ring 512 by a camera, and then move the double-sided wafer to about 1 cm above the positioning concave ring 512, and the vacuum suction cup works to make the double-sided wafer fall into the positioning concave ring 512; the distance of the double-sided wafer above the positioning concave ring 512 cannot be too large, if it is too large, the double-sided wafer may be damaged after falling into the positioning concave ring 512; the distance of the double-sided wafer above the positioning concave ring 512 cannot be too small, to prevent the vacuum suction cup from mistakenly operating the double-sided wafer to directly press the double-sided wafer against the positioning concave ring 512, thereby damaging the double-sided wafer; since the camera needs to scan the boundary of the double-sided wafer, the camera's field of view needs to be larger; and the double-sided probe station 100 only requires the camera to take a position close to the center of the double-sided wafer for the alignment scanning of the double-sided wafer, so the technical solution of the present invention can reduce the requirements for the scanning camera and reduce the cost of the double-sided probe station 100.

[0042] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the clamping fixture 50 also includes a first abutment 52; the first abutment 52 is provided with a second test hole 521, and a fixing convex ring 522 is provided along the second test hole 521; the first stop portion 51 can be connected to the first abutment 52, the fixing convex ring 522 stops at the chip, and the first test hole 511 corresponds to the second test hole 521, and the chip is located between the first stop portion 51 and the first abutment 52; thereby, the double-sided wafer is fixed along the edge by the first stop portion 51 and the first abutment 52, so that the grain areas on both sides of the double-sided wafer correspond to the first test hole 511 and the second test hole 521 respectively, thereby meeting the test requirements for the grain area.

[0043] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the double-sided probe station 100 includes a first adsorption portion 70, and the first adsorption portion 70 is provided with a plurality of vacuum suction cups, and the plurality of vacuum suction cups are used to adsorb the first abutment portion 52; the first adsorption portion 70 is connected to the mounting portion 40 through a slider, so that the first abutment portion 52 is separated from / connected to the first stop portion 51; when the first abutment portion 52 needs to be separated from the first stop portion 51, the first adsorption portion 70 adsorbs the first abutment portion 52 and moves relative to the mounting portion 40 along the slider; when the first abutment portion 52 needs to be connected to the first stop portion 51, the first abutment portion 52 adsorbed on the first adsorption portion 70 is moved toward the first stop portion 51 through the slider, the first adsorption portion 70 is separated from the first abutment portion 52, and the first abutment portion 52 is pressed on the double-sided wafer under the action of gravity. On the wafer; the movement of the wafer stage 30 relative to the frame 20 is determined by software parameters to ensure that when the wafer stage 30 is separated / connected at the first abutment 52, the wafer stage 30 has a determined position relative to the first adsorption portion 70, which is easy to operate and reliable to use; the wafer stage 30 is connected to the frame 20 through a slide rail slot, and the slide rail slot includes at least two groups to meet the X- and Y-direction movements of the wafer stage 30 and the movement requirements of the wafer stage 30 in the plane along the frame 20; the double-sided probe station 100 also includes a locking portion 80, which is connected to the wafer stage 30, and the locking portion 80 is a rotary clamping cylinder to realize the pressing of the first abutment 52 and the first stop portion 51, to ensure that the position of the double-sided wafer is reliable and meet the test requirements.

[0044] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, the double-sided probe station 100 further includes a first positioning mechanism 90, which is installed below the mounting portion 40, so that the first positioning mechanism 90 lifts up the double-sided wafer from below to prevent damage to the double-sided wafer caused by adsorption from above;

[0045] The first positioning mechanism 90 includes a lifting part 91 and a cantilever part 92. The lifting part 91 is provided with a placement plane 911. The placement plane 911 is provided with a vacuum adsorption hole for adsorbing the double-sided wafer on the placement plane 911 to prevent the double-sided wafer from being rotated, adjusted and fixed; the lifting part 91 is connected to the cantilever part 92 with a bearing so that the lifting part 91 can rotate relative to the cantilever part 92 to meet the angle adjustment of the double-sided wafer and meet the test requirements; the cantilever part 92 is connected to a first driving part 921. The first driving part 921 is connected to the lifting part 91 through a synchronous belt, and the first driving part 921 controls the rotation of the lifting part 91, and drives the lifting part 91 to rotate through the first driving part 921; the cantilever part 92 is slidably connected to the frame 20, and the lifting part 91 can move along the conducting direction of the guide through hole 61, so that the lifting part 91 drives the double-sided wafer to move along the guide through hole 61, thereby ensuring that the double-sided wafer is aligned along the guide through hole 61, which is used to adjust the angle and place the double-sided wafer into the positioning concave ring 512; preventing the double-sided wafer from falling directly and being damaged.

[0046] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, a wafer loading method,

[0047] S1: Align the guide through hole 61 with the positioning concave ring 512; the first stopper 51 is provided with a first test hole 511, and a positioning concave ring 512 is provided along the first test hole 511; the guide part 60 is provided with a guide through hole 61; so that the wafer passing through the guide through hole 61 can be placed into the positioning concave ring 512 under the action of gravity;

[0048] S2: The wafer is placed on the placement plane 911 of the first positioning mechanism 90, and the first positioning mechanism 90 moves along the conducting direction of the guide through hole 61. Under the action of the wafer's gravity, the wafer stops at the placement plane 911 and passes through the guide through hole 61. Finally, the wafer stops at the positioning concave ring 512 under the action of gravity; and the crystal grain area of ​​the wafer corresponds to the first test hole 511; the speed of the wafer passing through the guide through hole 61 and the speed of the wafer falling into the positioning concave ring 512 are reduced to prevent the wafer from being damaged by free fall under the action of gravity;

[0049] S3: A first abutment 52 is placed on a side of the wafer away from the first stopper 51; the first abutment 52 is provided with a second test hole 521, and a fixing convex ring 522 is provided along the second test hole 521; the fixing convex ring 522 abuts against the wafer, and the first test hole 511 corresponds to the second test hole 521, and the wafer is located between the first abutment 51 and the first abutment 52; the first abutment 51 and the first abutment 52 are respectively attached to both sides of the wafer to achieve positioning of the wafer; the test probe can simultaneously test the die through the first test hole 511 and the second test hole 521 respectively;

[0050] S4: The first stopper 51 is fixedly connected to the first abutting portion 52 to fix the wafer relative to the wafer stage 30, thereby ensuring that the motion trajectory during the test process is stable and reliable.

[0051] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, the guide through hole 61 includes an adjustment tapered hole 611 and an alignment straight hole 612, and the adjustment tapered hole 611 is connected with the alignment straight hole 612. The chip is placed in the adjustment tapered hole 611, and under the action of gravity, the chip passes through the alignment straight hole 612 and then falls into the positioning concave ring 512; the chip enters the guide through hole 61 through the adjustment tapered hole 611, which reduces the difficulty of the chip falling from the guide through hole 61 under the action of gravity, and at the same time, the adjustment tapered hole 611 also has the function of adjusting the center of the chip relative to the alignment straight hole 612.

[0052] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 As shown, in step S2,

[0053] The process includes: the wafer stops at the placement plane 911 through the guide hole 61; the first positioning mechanism 90 lifts the wafer away from the positioning recessed ring 512; when the wafer leaves the guide portion 60, the vacuum adsorption hole on the placement plane 911 adsorbs the wafer on the placement plane 911; the placement plane 911 rotates; this process completes the adjustment of the wafer angle to meet the test requirements.

[0054] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, after the placement plane 911 rotates, the first positioning mechanism 90 descends, and the vacuum is disconnected before the chip enters the guide portion 60, so that the chip stops on the placement plane 911 through the guide hole 61 under the action of gravity; that is, the use of vacuum adsorption of the chip is to ensure stability and reliability during the chip angle adjustment process. Since there may be obstructions when the chip enters the guide hole 61 and is placed in the first stop portion 51, the use of vacuum adsorption of the chip may damage the chip.

[0055] After the test is completed, the first abutting portion 52 is separated, the first stopper 51 is moved to a position aligned with the guide through hole 61 , and the wafer is lifted by the first positioning mechanism 90 to separate the wafer from the first stopper 51 .

[0056] The above are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. It should be recognized that non-creative deformations and changes made by those skilled in the art after understanding the technical solution of the present invention should also fall within the scope of protection and disclosure of the present invention.

Claims

1. A double-sided probe station (100), characterized in that: The double-sided probe station (100) comprises: Rack(20); A wafer carrier (30) connected to the frame (20), wherein the wafer carrier (30) is movable relative to the frame (20); A mounting portion (40) fixed to the frame (20); The wafer clamp (50) comprises a first stopper (51) and a first abutting portion (52); the first stopper (51) is provided with a first test hole (511), a positioning concave ring (512) is provided along the first test hole (511), the first abutting portion (52) is provided with a second test hole (521), and a fixing convex ring (522) is provided along the second test hole (521); the first stopper (51) can be connected to the first abutting portion (52), the fixing convex ring (522) abuts against a wafer, and the first test hole (511) corresponds to the second test hole (521), and the wafer is located between the first stopper (51) and the first abutting portion (52); A guide portion (60) is mounted on the mounting portion (40); the guide portion (60) is provided with a guide through hole (61); the guide through hole (61) comprises a deflection adjustment conical hole (611) and an alignment straight hole (612); the deflection adjustment conical hole (611) is connected to the alignment straight hole (612); a wafer is placed in the deflection adjustment conical hole (611), and under the action of gravity, the wafer falls into the alignment straight hole (612); The alignment straight hole (612) corresponds to the positioning concave ring (512), so that after the wafer is placed through the deflection-adjusting conical hole (611), the wafer enters the positioning concave ring (512) through the alignment straight hole (612), and the grain area of ​​the wafer corresponds to the first test hole (511).

2. The double-sided probe station (100) according to claim 1, characterized in that: The double-sided probe station (100) comprises a first adsorption portion (70), wherein the first adsorption portion (70) is provided with a plurality of vacuum suction cups, and the plurality of vacuum suction cups are used to adsorb a first abutting portion (52); the first adsorption portion (70) is connected to the mounting portion (40) via a slider, so that the first abutting portion (52) is separated from / connected to the first stop portion (51).

3. The double-sided probe station (100) according to claim 1, characterized in that: The wafer support platform (30) is connected to the frame (20) via a slide rail and a slide groove.

4. The double-sided probe station (100) according to claim 1, characterized in that: The double-sided probe station (100) further comprises a first positioning mechanism (90), the first positioning mechanism (90) comprising a lifting part (91) and a cantilever part (92), the lifting part (91) being provided with a placement plane (911), the placement plane (911) being provided with a vacuum adsorption hole; the lifting part (91) is bearing-connected to the cantilever part (92), so that the lifting part (91) can rotate relative to the cantilever part (92); the cantilever part (92) is connected to a first driving part (921), the first driving part (921) is connected to the lifting part (91) via a synchronous belt, and the first driving part (921) controls the rotation of the lifting part (91); the cantilever part (92) is slidably connected to the frame (20), and the lifting part (91) can move along the conducting direction of the guide through hole (61).

5. A wafer loading method for loading wafers by the double-sided probe station as claimed in claim 4, characterized in that: S1: aligning the guide through hole (61) with the positioning concave ring (512); the first stop portion (51) is provided with a first test hole (511), and a positioning concave ring (512) is provided along the first test hole (511); the guide portion (60) is provided with a guide through hole (61); S2: The wafer is placed on the placement plane (911) of the first positioning mechanism (90), and the first positioning mechanism (90) moves along the conducting direction of the guide through hole (61). Under the action of the wafer's gravity, the wafer stops at the placement plane (911) and passes through the guide through hole (61), and finally the wafer stops at the positioning concave ring (512) under the action of gravity; and the crystal grain area of ​​the wafer corresponds to the first test hole (511); S3: placing a first abutment portion (52) on a side of the wafer away from the first stop portion (51); the first abutment portion (52) is provided with a second test hole (521), and a fixing convex ring (522) is provided along the second test hole (521); the fixing convex ring (522) abuts against the wafer, and the first test hole (511) corresponds to the second test hole (521), and the wafer is located between the first stop portion (51) and the first abutment portion (52); S4: fixedly connecting the first stopper (51) and the first abutment (52).

6. The wafer loading method according to claim 5, characterized in that: The guide through hole (61) comprises a deflection adjustment conical hole (611) and an alignment straight hole (612); the deflection adjustment conical hole (611) is connected to the alignment straight hole (612); a wafer is placed in the deflection adjustment conical hole (611); under the action of gravity, the wafer passes through the alignment straight hole (612) and then falls into the positioning concave ring (512).

7. A wafer loading method according to claim 5, characterized in that: In step S2, The method comprises: the wafer stops at the placement plane (911) through the guide through hole (61), the first positioning mechanism (90) lifts the wafer away from the positioning concave ring (512), and when the wafer is separated from the guide part (60), the vacuum adsorption hole on the placement plane (911) adsorbs the wafer on the placement plane (911); and the placement plane (911) rotates.

8. A wafer loading method according to claim 7, characterized in that: After the placement plane (911) rotates, the first positioning mechanism (90) descends, and the vacuum is disconnected before the wafer enters the guide portion (60), so that the wafer stops at the placement plane (911) through the guide through hole (61) under the action of gravity.

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