Electric pump

Abstract

The embodiment of the present invention discloses an electric pump, which includes a PCB board, the PCB board is formed with a power input port, the electric pump also includes a common mode filter, the common mode filter includes a common mode inductor, and the common mode inductor is arranged adjacent to the power input port; along the direction perpendicular to the plane where the PCB board is located, no wiring is arranged at the wiring film layer in the PCB board corresponding to the common mode inductor. Through the technical solution of the present invention, the common mode signal in the power signal transmitted through the power input port is effectively filtered out, the electromagnetic compatibility of the PCB board is enhanced, and then the electromagnetic compatibility of the electric pump is enhanced.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of electronic products, and in particular to an electric pump. Background Art

[0002] Electronic products generally use PCB (Printed Circuit Board) boards to achieve effective control of various parameters. For example, electric pumps are generally provided with PCB boards to achieve control of various working parameters of the motor in the electric pump.

[0003] The PCB board is generally provided with a power input port for transmitting power signals to the electronic components on the PCB board. However, the power signals transmitted through the power input port contain interference signals that affect the power signals, and the interference signals in the power signals affect the working performance of the electronic components on the PCB board. In addition, with the increase in the number of electronic components on the PCB board, how to reasonably layout the electronic components on the PCB board to improve the electromagnetic compatibility of the PCB board has become a problem that needs to be solved urgently. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides an electric pump, which effectively filters out the common-mode signal in the power signal transmitted through the power input port by arranging the electric pump to include a common-mode filter and not arranging a wiring film layer in the PCB board corresponding to the common-mode inductor, and furthermore, arranging the common-mode inductor in the common-mode filter adjacent to the power input port, thereby enhancing the electromagnetic compatibility of the PCB board, and thereby enhancing the electromagnetic compatibility of the electric pump.

[0005] In a first aspect, an embodiment of the present invention provides an electric pump, comprising a stator assembly, a rotor assembly and a PCB board, wherein the stator assembly comprises a coil, the rotor assembly comprises a permanent magnet, the coil is electrically connected to the PCB board, the coil generates an excitation magnetic field after being energized, the rotor assembly rotates in the excitation magnetic field, the PCB board is formed with a power input port, the electric pump further comprises a common mode filter, the common mode filter comprises a common mode inductor, and the common mode inductor is arranged adjacent to the power input port;

[0006] Along a direction perpendicular to the plane where the PCB board is located, no routing is arranged at a location of the wiring film layer in the PCB board corresponding to the common mode inductor.

[0007] The electric pump also includes:

[0008] A first filter, wherein the first filter is disposed adjacent to the common mode filter, and along a direction parallel to the plane where the PCB board is located, a distance from the first filter to the power input port is greater than a distance from the common mode filter to the power input port;

[0009] The first filter includes a first capacitor, a second capacitor and a differential mode inductor. The first capacitor and the second capacitor are connected in parallel and the first capacitor and the second capacitor are respectively arranged on both sides of the differential mode inductor.

[0010] The PCB board is formed with a communication interface, and the electric pump includes a TVS tube and a magnetic bead. The communication interface is electrically connected to the TVS tube and the magnetic bead respectively. The TVS tube is used to absorb interference signals in the communication signal transmitted via the communication interface, and the magnetic bead is used to absorb abnormal high-frequency signals in the communication signal transmitted via the communication interface.

[0011] The electric pump also includes:

[0012] A motor driving module, wherein the motor driving module comprises a plurality of thin film transistors, wherein the plurality of thin film transistors are arranged on the same side of the PCB board, and all the thin film transistors in the motor driving module are concentratedly arranged in a first continuous area on the PCB board, and along a direction parallel to the plane where the PCB board is located, the area of ​​the first continuous area is less than half of the area of ​​the PCB board.

[0013] The PCB board is formed with a three-phase hole, all the thin film transistors in the motor driving module are arranged adjacent to the three-phase hole, and a ground wire electrically connected to the thin film transistor wraps a portion of the PCB board.

[0014] The electric pump also includes:

[0015] A sampling element and an integrated chip, wherein a vertical projection of the sampling element on the PCB board does not overlap with a vertical projection of the motor drive module on the PCB board and a vertical projection of the integrated chip on the PCB board;

[0016] Along a direction perpendicular to the plane where the PCB board is located, a wiring film layer in the PCB board is provided with wiring corresponding to the thin film transistor, the integrated chip and the sampling element;

[0017] The two ends of the sampling element are electrically connected to the corresponding ports of the integrated chip through two wiring lines located in the wiring film layer of the PCB board, and the diameters and lengths of the two wiring lines are equal.

[0018] The electric pump also includes:

[0019] A motor drive module and an integrated chip, the PCB board includes two sides provided with electronic components, the motor drive module and the integrated chip are located on different sides of the PCB board, and the vertical projection of the motor drive module on the PCB board does not overlap with the vertical projection of the integrated chip on the PCB board.

[0020] Along a direction parallel to the plane where the PCB board is located, a heat dissipation area is formed between the motor drive module and the integrated chip;

[0021] Along a direction parallel to the plane where the PCB board is located, the integrated chip is arranged closer to the geometric center of the PCB board than the motor driving module.

[0022] The electric pump also includes:

[0023] A motor driving module, wherein the motor driving module comprises a plurality of thin film transistors, wherein the plurality of thin film transistors are arranged on the same side of the PCB board, wherein a side of the PCB board where the thin film transistor is not arranged is provided with an exposed pad corresponding to the thin film transistor, wherein a vertical projection of the pad on the PCB board covers a vertical projection of the corresponding thin film transistor on the PCB board, and a heat dissipation structure is arranged on the pad.

[0024] The electric pump also includes:

[0025] An integrated chip, a side of the PCB board where the integrated chip is not provided is provided with an exposed pad, a vertical projection of the pad on the PCB board covers a corresponding vertical projection of the integrated chip on the PCB board, and a heat dissipation structure is provided on the pad.

[0026] An embodiment of the present invention provides an electric pump. The electric pump includes a common-mode filter. The common-mode filter can filter out useless signals, i.e., common-mode signals, in a power signal transmitted through a power input port. No routing is arranged at a location where a wiring film layer in a PCB board corresponds to a common-mode inductor. This effectively avoids the problem that the routing of a wiring film layer in a PCB board corresponding to a common-mode filter affects the absorption of common-mode signals by the common-mode filter. In addition, by arranging the common-mode inductor in the common-mode filter near the power input port, the length of the routing between the common-mode inductor and the power input port is reduced, the difficulty of routing is reduced, the electromagnetic compatibility of the PCB board is enhanced, and thus the electromagnetic compatibility of the electric pump is enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the structure of an electric pump provided by an embodiment of the present invention;

[0029] Figure 2A schematic diagram of the structure of one side of a PCB board provided by an embodiment of the present invention;

[0030] Figure 3 A schematic diagram of the circuit connection relationship of electronic components on a PCB board provided by an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of the structure of the other side of a PCB board provided by an embodiment of the present invention;

[0032] Figure 5 A schematic diagram of the circuit connection relationship between a communication interface, a TVS tube and a magnetic bead provided in an embodiment of the present invention;

[0033] Figure 6 A schematic diagram of the circuit connection relationship of a motor drive module provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described through implementation methods with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] An embodiment of the present invention provides an electric pump, including a stator assembly, a rotor assembly and a PCB board, the stator assembly including a coil, the rotor assembly including a permanent magnet, the coil being electrically connected to the PCB board, generating an excitation magnetic field when the coil is energized, the rotor assembly rotating in the excitation magnetic field, the PCB board being formed with a power input port, the electric pump also including a common mode filter, the common mode filter including a common mode inductor, the common mode inductor being arranged adjacent to the power input port, and no routing is arranged at a location of a wiring film layer in the PCB board corresponding to the common mode inductor in a direction perpendicular to a plane where the PCB board is located.

[0036] The PCB board is generally provided with a power input port for transmitting power signals to the electronic components on the PCB board. However, the power signals transmitted through the power input port contain interference signals that affect the power signals, and the interference signals in the power signals affect the working performance of the electronic components on the PCB board. In addition, with the increase in the number of electronic components on the PCB board, how to reasonably layout the electronic components on the PCB board to improve the electromagnetic compatibility of the PCB board has become a problem that needs to be solved urgently.

[0037] The embodiment of the present invention arranges the electric pump to include a common-mode filter, which can filter out useless signals, i.e., common-mode signals, in the power signal transmitted through the power input port, and no routing is arranged at the location where the wiring film layer in the PCB board corresponds to the common-mode inductor, thereby effectively avoiding the problem that the routing of the wiring film layer in the PCB board corresponding to the common-mode filter affects the absorption of the common-mode signal by the common-mode filter. In addition, by arranging the common-mode inductor in the common-mode filter near the power input port, the length of the routing between the common-mode inductor and the power input port is reduced, the difficulty of routing is reduced, the electromagnetic compatibility of the PCB board is enhanced, and thus the electromagnetic compatibility of the electric pump is enhanced.

[0038] The above is the core idea of ​​the present invention. The technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Figure 1 Schematic diagram of the structure of an electric pump provided by an embodiment of the present invention. Figure 1 As shown, the electric pump 100 includes a housing 60, a stator assembly 601, a rotor assembly 602 and a PCB board 90. The stator assembly 601, the rotor assembly 602 and the PCB board 90 are arranged in an inner cavity formed by the housing 60. The stator assembly 601 includes a coil, and the rotor assembly 602 includes a permanent magnet. The coil is electrically connected to the PCB board 90. When the coil is energized, an excitation magnetic field is generated, and the rotor assembly 602 rotates in the excitation magnetic field.

[0040] Figure 2 A schematic diagram of the structure of one side of a PCB board provided by an embodiment of the present invention, Figure 3 A schematic diagram of the circuit connection relationship of electronic components on a PCB provided by an embodiment of the present invention. Figure 2 and Figure 3 The PCB board is formed with a power input port 6, the electric pump also includes a common mode filter 4, the common mode filter 4 includes a common mode inductor L1, the common mode inductor L1 is arranged adjacent to the power input port 6, and along a direction perpendicular to the plane where the PCB board is located, no routing is arranged at the wiring film layer in the PCB board corresponding to the common mode inductor L1.

[0041] Exemplary, combined Figure 2 and Figure 3 The electric pump may include a power module, which is used to provide power signals to various electronic components on the PCB board via a power input port. The power module can be set on the PCB board through a power input port 61 and a power input port 62 on the PCB board. The power input port 61 can be electrically connected to the positive end of the power module, and the power input port 62 can be electrically connected to the negative end of the power module.

[0042] Specifically, refer to Figure 3 The circuit connection relationship between the common-mode filter 4 and the power input port 6 shown in the figure is that the common-mode signal in the power signal transmitted by the power input port 6 is a useless signal. The common-mode filter 4 can filter out the common-mode signal in the power signal transmitted via the power input port 6. Since the power signal transmitted by the power input port 6 first passes through the common-mode filter 4, the common-mode inductor L1 is set adjacent to the power input port 6. The proximity here can be understood as a relative concept. Figure 2 For example, the common-mode inductor L1 is closer to the power input ports 61 and 62 on the PCB board relative to the motor drive module 1, which reduces the length of the wiring between the common-mode inductor L1 and the power input port 6, reduces the difficulty of wiring, enhances the electromagnetic compatibility of the PCB board, and further enhances the electromagnetic compatibility of the electric pump. In addition, if the wiring film layer in the PCB board is arranged to be arranged to be arranged to be in correspondence with the common-mode inductor L1 in the direction perpendicular to the plane where the PCB board is located, it will affect the absorption of the common-mode signal by the common-mode filter 4. Therefore, in the direction perpendicular to the plane where the PCB board is located, the wiring film layer in the PCB board is not arranged to be arranged to be in correspondence with the common-mode inductor L1, which can ensure that the common-mode filter 4 effectively filters out the common-mode signal.

[0043] Figure 4 This is a schematic diagram of the structure of the other side of a PCB board provided by an embodiment of the present invention. It should be noted that: Figure 2 The structure of one side of the PCB board shown is similar to Figure 4 The structure on the other side of the PCB is opposite. Figure 2 The PCB board is flipped along the vertical symmetry axis to obtain Figure 4 The PCB board structure shown in Figure 2 The A area in Figure 4 In the D region, Figure 2 The B area in Figure 4 The C region.

[0044] Combination Figure 2 , Figure 3 and Figure 4 The PCB board may further include a first filter. The first filter may be, for example, a π filter. The first filter may include a first capacitor C1, a second capacitor C2, and a differential mode inductor L. Since the first capacitor C1, the second capacitor C2, and the differential mode inductor L are arranged in the shape of a "π" shape, the first capacitor C1 and the second capacitor C2 may be arranged in parallel, and the first capacitor C1 and the second capacitor C2 may be arranged with a differential mode inductor L, respectively, that is, the vertical projection of the first capacitor C1 on the PCB board and the vertical projection of the second capacitor C2 on the PCB board may be arranged to be located at the vertical projection of the differential mode inductor L on the PCB board, respectively. Here, the first capacitor C1, the second capacitor C2, and the differential mode inductor L may be arranged to be located at different sides of the PCB board, or may be located at the same side of the PCB board.

[0045] In addition, refer to Figure 3 The circuit connection relationship between the first filter and the common mode filter 4 and the power input port 6 shown is that the first filter can be set adjacent to the common mode filter 4, and the distance from the first filter to the power input port 6 is greater than the distance from the common mode filter 4 to the power input port 6 along the direction parallel to the plane where the PCB board is located, that is, the first capacitor C1, the second capacitor C2 and the differential mode inductor L are set adjacent to the common mode filter 4, and the distance from the first capacitor C1, the second capacitor C2 and the differential mode inductor L to the power input port 6 is greater than the distance from the common mode filter 4 to the power input port 6 along the direction parallel to the plane where the PCB board is located. Specifically, the first filter can effectively suppress the low-frequency conduction signal in the power signal output by the power module via the power input port 6 and the common mode filter 4, and the first filter can be set adjacent to the common mode filter 4 to effectively improve the electromagnetic compatibility of the PCB board. The PCB board can also prevent the reverse connection of the thin film transistor 9, and the anti-reverse connection thin film transistor 9 can be placed near the first filter.

[0046] The PCB board may also be formed with a communication interface, and the electric pump may also include a TVS tube (Transient Voltage Suppressor) and a magnetic bead. Figure 5 A schematic diagram of the circuit connection relationship between a communication interface, a TVS tube, and a magnetic bead provided in an embodiment of the present invention. Figure 2 , Figure 4 and Figure 5 The communication interface 10 is electrically connected to the TVS tube 72 and the magnetic bead 71 respectively. The TVS tube 72 is used to absorb interference signals in the communication signal transmitted via the communication interface 10, and the magnetic bead 71 is used to absorb abnormal high-frequency signals in the communication signal transmitted via the communication interface 10.

[0047] Exemplarily, the communication signal transmitted by the host computer 100 via the communication interface 10 passes through the TVS tube 72 and the magnetic bead 71. The TVS tube 72 can absorb the interference signal in the communication signal, and the magnetic bead 71 can absorb the abnormal high-frequency signal in the communication signal to inhibit the further transmission of the interference signal. Exemplarily, the magnetic bead 71 and the TVS tube 72 can be arranged near the communication interface 10 to improve the electromagnetic compatibility of the PCB board.

[0048] like Figure 4 As shown, the electric pump may further include a motor drive module 1, Figure 6 A schematic diagram of the circuit connection relationship of a motor drive module provided by an embodiment of the present invention. Figure 4 and Figure 6The motor driving module 1 includes a plurality of thin film transistors T, and all the thin film transistors T in the motor driving module 1 are concentrated in a first continuous area EE on the PCB board. In a direction parallel to the plane where the PCB board is located, the area of ​​the first continuous area EE is less than half of the area of ​​the PCB board. Exemplarily, the motor driving module 1 can be a three-phase bridge circuit, and the motor driving module 1 includes six thin film transistors T, and every two thin film transistors T constitute a branch of the motor driving module 1, for example, the thin film transistor T1 and the thin film transistor T2 form a branch, the thin film transistor T3 and the thin film transistor T4 form a branch, and the thin film transistor T5 and the thin film transistor T6 form a branch, with a total of three branches. All the thin film transistors T in the motor driving module 1 are concentrated in a first continuous area EE on the PCB board. In a direction parallel to the plane where the PCB board is located, the area of ​​the first continuous area EE is less than half of the area of ​​the PCB board, so that the six thin film transistors T in the motor driving module 1 are concentrated and arranged adjacent to each other on the PCB board, so that the loop area of ​​the power line and the ground line of the motor driving module 1 is small, and electromagnetic radiation interference is effectively reduced.

[0049] Combination Figure 2 , Figure 4 and Figure 6 , the PCB board is formed with three-phase holes U, V and W, all the thin film transistors T in the motor drive module 1 are arranged adjacent to the three-phase holes U, V and W, and the ground wire electrically connected to the thin film transistor T wraps part of the PCB board. Exemplarily, two thin film transistors T on each branch can be arranged adjacent to the corresponding three-phase holes, reducing the length of the connecting wire between the thin film transistor T and the corresponding three-phase hole, and enhancing the electromagnetic compatibility of the PCB board, for example, the thin film transistor T1 and the thin film transistor T2 are arranged adjacent to the three-phase hole U, the thin film transistor T3 and the thin film transistor T4 are arranged adjacent to the three-phase hole V, and the thin film transistor T5 and the thin film transistor T6 are arranged adjacent to the three-phase hole W. In addition, the three-phase holes U, V and W and the grounding hole GND can be arranged in a centralized manner to avoid the welding holes being too dispersed to increase the wiring difficulty, and also affect the electromagnetic compatibility of the PCB board. Exemplarily, when the thin film transistor in the motor drive module 1 is arranged on the PCB board, the power supply end of the thin film transistor can be arranged away from the edge of the PCB board, and the grounding end of the thin film transistor can be arranged adjacent to the edge of the PCB board, so that the ground wire electrically connected to the thin film transistor T can wrap a larger area of ​​the circuit in the PCB board, which can also enhance the electromagnetic compatibility of the PCB board.

[0050] Combination Figure 2 and Figure 4, the PCB board may further include a sampling element Rs and an integrated chip 2, and the vertical projection of the sampling element Rs on the PCB board may be set to not overlap with the vertical projection of the motor drive module 1 on the PCB board and the vertical projection of the integrated chip 2 on the PCB board. Specifically, the current flowing through the thin film transistor T in the motor drive module 1 flows through the sampling element Rs, and the current flowing through the sampling element Rs is relatively large, and the sampling element Rs has a relatively serious temperature rise phenomenon. By setting the vertical projection of the sampling element Rs on the PCB board to not overlap with the vertical projection of the motor drive module 1 on the PCB board and the vertical projection of the integrated chip 2 on the PCB board, relative to the vertical projection of the sampling element Rs on the PCB board and the vertical projection of the motor drive module 1 on the PCB board or the vertical projection of the integrated chip 2 on the PCB board partially overlap, it is beneficial to the heat dissipation of the sampling element Rs, the integrated chip 2 and the motor drive module 1, and improves the problem that the temperature rise of the sampling element Rs, the integrated chip 2 and the motor drive module 1 seriously affects the performance of the PCB board. Here, the sampling resistor Rs and the integrated chip 2 are exemplarily set to be located on the same side of the PCB board.

[0051] Along the direction perpendicular to the plane where the PCB board is located, the wiring film layer in the PCB board is provided with routing lines corresponding to the thin film transistor T, the integrated chip 2 and the sampling element Rs. Specifically, the PCB board can be a multi-layer board, which includes, in addition to the two outermost film layers for providing electronic components, a multi-layer wiring film layer in the middle for connecting the wiring lines of the electronic component wires. For the motor drive module 1, the integrated chip 2 and the sampling element Rs with severe temperature rise, by providing metal routing lines at the wiring film layer in the PCB board corresponding to the thin film transistor T, the integrated chip 2 and the sampling element Rs in the motor drive module 1, it is beneficial to the heat dissipation of the thin film transistor T, the integrated chip 2 and the sampling element Rs in the motor drive module 1. On the basis of providing routing lines at the wiring film layer in the PCB board corresponding to the thin film transistor T, the integrated chip 2 and the sampling element Rs, the line width of the routing lines can be increased to enhance the heat dissipation of the thin film transistor T, the integrated chip 2 and the sampling element Rs in the motor drive module 1, and improve the problem that the temperature rise of the sampling element Rs, the integrated chip 2 and the motor drive module 1 seriously affects the performance of the PCB board.

[0052] like Figure 6As shown, the two ends of the sampling resistor Rs are electrically connected to the corresponding ports of the integrated chip 2 through two wires 51 and 52 located in the wiring film layer of the PCB board, that is, one end of the sampling resistor is electrically connected to the SHP end of the integrated chip 2 through a wire 51, and the other end of the sampling resistor Rs is electrically connected to the PGND end of the integrated chip 2 through a wire 52. The diameter and length of the two wires 51 and 52 can be set equal. Specifically, the current flowing through the sampling resistor Rs is the current flowing through the motor coil. The drive current flowing through the motor coil can be measured by collecting the current flowing through the sampling resistor Rs. By setting the diameter and length of the two wires 51 and 52 electrically connected to the two ends of the sampling resistor Rs equal, that is, setting the resistance of the two wires 51 and 52 equal, the accuracy of the collected motor drive current is improved.

[0053] Combination Figure 2 and Figure 4 The electric pump may further include a motor drive module 1 and an integrated chip 2, and the PCB board includes two sides provided with electronic components. Figure 2 and Figure 4 The two sides of the PCB board are respectively shown with electronic components, the motor drive module 1 and the integrated chip 2 are located on different sides of the PCB board, and the vertical projection of the motor drive module 1 on the PCB board does not overlap with the vertical projection of the integrated chip 2 on the PCB board. Figure 4 2 shows a vertical projection 21 of the motor driver module 1 on the PCB board. It can be seen that the motor driver module 1 and the integrated chip 2 are located on different sides of the PCB board, and the vertical projection of the motor driver module 1 on the PCB board does not overlap with the vertical projection of the integrated chip 2 on the PCB board.

[0054] The motor drive module 1 can provide a driving current to the motor to rotate the motor. The integrated chip 2 is used to provide a control signal to the motor drive module 1 and other electronic components on the PCB board. The PCB board includes a plurality of film layers arranged in a stacked manner. The film layers located on both sides are used to set the electronic components required to control the rotation of the motor. The motor drive module 1 and the integrated chip 2 heat up more severely when current passes through. Arranging the motor drive module 1 and the integrated chip 2 on different sides of the PCB board is more conducive to heat dissipation of the motor drive module 1 and the integrated chip 2 which heat up more severely than arranging the motor drive module 1 and the integrated chip 2 on the same side of the PCB board.

[0055] Combination Figure 2 and Figure 4, it is set that the vertical projection of the motor driving module 1 on the PCB board and the vertical projection of the integrated chip 2 on the PCB board do not overlap, relative to the vertical projection of the motor driving module 1 on the PCB board and the vertical projection of the integrated chip 2 on the PCB board There is a partial overlap, along the direction parallel to the plane where the PCB board is located, the distance between the motor driving module 1 and the integrated chip 2 is increased, which is beneficial to the heat dissipation between the motor driving module 1 and the integrated chip 2, and effectively improves the problem that the temperature rise of the motor driving module 1 and the integrated chip 2 seriously affects the performance of the PCB board.

[0056] Combination Figure 2 and Figure 4 , along the direction parallel to the plane where the PCB board is located, a heat dissipation area is formed between the motor drive module 1 and the integrated chip 2 (here, the vertical projection of the integrated chip 2 on the PCB board is used as an example to illustrate the integrated chip 2). It should be noted that the present invention does not limit the shape of the heat dissipation area, and the heat dissipation area can be a regular shape or an irregular shape. In addition, along the direction parallel to the plane where the PCB board is located, the integrated chip 2 can be arranged closer to the geometric center of the PCB board than the motor drive module 1. The shape of the PCB board is generally a regular figure. For example, when the shape of the PCB board is a circle, its geometric center is the center of the circle of the PCB board; when the shape of the PCB board is a rectangle, its geometric center is the intersection of the two diagonals of the PCB board; when the shape of the PCB board is a regular hexagon, its geometric center is the intersection of the diagonals of the PCB board. Setting the integrated chip 2 closer to the geometric center of the PCB board than the motor drive module 1 can effectively prevent the static electricity in the edge area of ​​the PCB board from affecting the performance of the integrated chip.

[0057] Combination Figure 2 and Figure 4 , along the direction parallel to the plane where the PCB board is located, the distance between the farthest points of the heat dissipation area, that is, along the direction parallel to the plane where the PCB board is located, the distance L1 between the points closest to the motor drive module 1 and the integrated chip 2 can be greater than or equal to 10mm and less than or equal to 58mm. Along the direction parallel to the plane where the PCB board is located, if the distance between the farthest points of the heat dissipation area is too small, the distance between the integrated chip 2 and the motor drive module 1, which has a more serious temperature rise, is too small, which is not conducive to the heat dissipation of the integrated chip 2 and the motor drive module 1 to improve the problem that the temperature rise of the integrated chip 2 and the motor drive module 1 seriously affects the performance of the PCB board. In addition, considering the size limitation of the PCB board, along the direction parallel to the plane where the PCB board is located, the distance between the farthest points of the heat dissipation area cannot be too large.

[0058] Combination Figure 2 and Figure 4, the shape of the PCB board can be set as a circle by way of example. Along the diameter direction of the PCB board, here, the diameter of the PCB board in the horizontal direction is taken as an example. The PCB board includes a first semicircular area CC and a second semicircular area DD. Then, the motor drive module 1 can be set to be located in the first semicircular area CC, and the integrated chip 2 can be located in the second semicircular area DD. The integrated chip 2 and the motor drive module 1 are located on different sides of the PCB board. By way of example, the shape of the PCB board can also be set to be a rectangle. Along the symmetry axis direction of the PCB board, the PCB board includes a first rectangular area and a second rectangular area. The motor drive module can be set to be located in the first rectangular area, and the integrated chip can be located in the second rectangular area. Similarly, the integrated chip and the motor drive module are located on different sides of the PCB board. The embodiment of the present invention does not limit the shape of the PCB board.

[0059] Combination Figure 2 and Figure 4 The motor driving module 1 may include a plurality of thin film transistors T, where six thin film transistors T1 to T6 are exemplarily shown, and the plurality of thin film transistors T are arranged on the same side of the PCB board, and a bare pad 3 corresponding to the thin film transistor T is arranged on the side of the PCB board where the thin film transistor T is not arranged, where the pad 3 is exemplarily arranged in a one-to-one correspondence with the thin film transistor T, and the vertical projection of the pad 3 on the PCB board covers the vertical projection of the corresponding thin film transistor T on the PCB board, and the thin film transistors T1 to T6 are arranged in a one-to-one correspondence with the pads 31 to 36, that is, the vertical projections of the pads 31 to 36 on the PCB board correspond to and cover the vertical projections of the thin film transistors T1 to T6 on the PCB board, respectively. Specifically, the main electronic device constituting the motor driving module 1 is the thin film transistor T, so the heat dissipation effect of the thin film transistor T determines the heat dissipation effect of the motor driving module 1. The exposed pad 3 is to remove the rosin material wrapping the pad 3 in the PCB board to expose the metal pad 3. By arranging the exposed pad 3 corresponding to the thin film transistor T on the side of the PCB board where the thin film transistor T is not arranged, and the vertical projection of the pad 3 on the PCB board covers the vertical projection of the corresponding thin film transistor T on the PCB board, it is beneficial to the heat dissipation of the thin film transistor T in the motor driving module 1 with more serious temperature rise, and improves the problem that the temperature rise of the motor driving module 1 seriously affects the performance of the PCB board.

[0060] Similarly, a bare pad may be provided on the side of the PCB board where the integrated chip 2 is not provided, that is, a bare pad is provided corresponding to the projection area 21 ( Figure 4(not shown in the figure), and the vertical projection of the pad on the PCB board is set to cover the vertical projection of the integrated chip 2 on the PCB board. Similarly, by setting an exposed pad on the side of the PCB board where the integrated chip 2 is not set, and setting the vertical projection of the pad on the PCB board to cover the corresponding vertical projection of the integrated chip 2 on the PCB board, it is beneficial to the heat dissipation of the integrated chip 2 with more serious temperature rise, and improves the problem that the temperature rise of the integrated chip 2 seriously affects the performance of the PCB board.

[0061] Exemplarily, a heat dissipation structure can be provided on an exposed pad, that is, a heat dissipation structure can be provided on an exposed pad of a thin film transistor in a corresponding motor drive module, or a heat dissipation structure can be provided on an exposed pad of a corresponding integrated chip, which is also beneficial to the heat dissipation of a motor drive module and an integrated chip with a more serious temperature rise phenomenon. Exemplarily, the heat dissipation structure can be, for example, a thermally conductive adhesive, thermally conductive silicone grease, or a heat sink. When the PCB board is used to control the rotation of a motor in a water pump, the heat dissipation structure can use thermally conductive adhesive, and when the PCB board is used to control the rotation of a motor in an oil pump, the heat dissipation structure can use thermally conductive silicone grease.

[0062] Combination Figure 2 and Figure 4 The electric pump may also include a burning module 8, which is mainly used to input debugging and downloading programs to the integrated chip 2. The burning module 8 can be set close to the integrated chip 2 for easy burning. A pad-type burning module can be used to avoid using a surface-mount pin-type burning module 8 to conduct the arc to the integrated chip 2 and cause the integrated chip 2 to burn.

[0063] Exemplarily, electronic components such as capacitors, resistors and diodes are arranged around the integrated chip. The electronic components such as capacitors, resistors and diodes can be arranged adjacent to corresponding ports of the integrated chip to reduce the length of the connecting leads and improve the electromagnetic compatibility of the PCB board.

[0064] The embodiment of the present invention arranges the electric pump to include a common-mode filter, which can filter out useless signals, i.e., common-mode signals, in the power signal transmitted through the power input port, and no wiring is arranged at the location where the wiring film layer in the PCB board corresponds to the common-mode inductor, thereby effectively avoiding the problem that the wiring film layer in the PCB board corresponds to the common-mode filter 4 and the wiring affects the absorption of the common-mode signal by the common-mode filter 4. In addition, by arranging the common-mode inductor in the common-mode filter near the power input port, the length of the wiring between the common-mode inductor and the power input port is reduced, the difficulty of wiring is reduced, the electromagnetic compatibility of the PCB board is enhanced, and thus the electromagnetic compatibility of the electric pump is enhanced.

[0065] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An electric pump, comprising a stator assembly, a rotor assembly and a PCB board, wherein the stator assembly comprises a coil, the rotor assembly comprises a permanent magnet, the coil is electrically connected to the PCB board, the coil generates an excitation magnetic field when energized, and the rotor assembly rotates in the excitation magnetic field, characterized in that: The PCB board is formed with a power input port, the electric pump further includes a common mode filter, the common mode filter includes a common mode inductor, and the common mode inductor is arranged adjacent to the power input port; the electric pump further includes a motor drive module, and the common mode inductor is closer to the power input port than the motor drive module; Along a direction perpendicular to the plane where the PCB board is located, no routing is arranged at a location of the wiring film layer in the PCB board corresponding to the common mode inductor.

2. The electric pump according to claim 1, characterized in that: Also includes: A first filter, wherein the first filter is disposed adjacent to the common mode filter, and along a direction parallel to the plane where the PCB board is located, a distance from the first filter to the power input port is greater than a distance from the common mode filter to the power input port; The first filter includes a first capacitor, a second capacitor and a differential mode inductor. The first capacitor and the second capacitor are connected in parallel and are arranged on both sides of the differential mode inductor.

3. The electric pump according to claim 1 or 2, characterized in that: The PCB board is formed with a communication interface, and the electric pump includes a TVS tube and a magnetic bead. The communication interface is electrically connected to the TVS tube and the magnetic bead respectively. The TVS tube is used to absorb interference signals in the communication signal transmitted via the communication interface, and the magnetic bead is used to absorb abnormal high-frequency signals in the communication signal transmitted via the communication interface.

4. The electric pump according to claim 1 or 2, characterized in that: The motor driving module includes a plurality of thin film transistors, which are arranged on the same side of the PCB board. All the thin film transistors in the motor driving module are concentrated in a first continuous area on the PCB board. Along a direction parallel to the plane where the PCB board is located, the area of ​​the first continuous area is less than half of the area of ​​the PCB board.

5. The electric pump according to claim 4, characterized in that: The PCB board is formed with a three-phase hole, all the thin film transistors in the motor driving module are arranged adjacent to the three-phase hole, and a ground wire electrically connected to the thin film transistor wraps a portion of the PCB board.

6. The electric pump according to claim 4, characterized in that: Also includes: A sampling element and an integrated chip, wherein a vertical projection of the sampling element on the PCB board does not overlap with a vertical projection of the motor drive module on the PCB board and a vertical projection of the integrated chip on the PCB board; Along a direction perpendicular to the plane where the PCB board is located, a wiring film layer in the PCB board is provided with wiring corresponding to the thin film transistor, the integrated chip and the sampling element; The two ends of the sampling element are electrically connected to the corresponding ports of the integrated chip through two wiring lines located in the wiring film layer of the PCB board, and the diameters and lengths of the two wiring lines are equal.

7. The electric pump according to claim 1 or 2, characterized in that: Also includes: The integrated chip includes two sides on which electronic components are arranged, the motor drive module and the integrated chip are located on different sides of the PCB board, and the vertical projection of the motor drive module on the PCB board does not overlap with the vertical projection of the integrated chip on the PCB board.

8. The electric pump according to claim 7, characterized in that Along a direction parallel to the plane where the PCB board is located, a heat dissipation area is formed between the motor drive module and the integrated chip; Along a direction parallel to the plane where the PCB board is located, the integrated chip is arranged closer to the geometric center of the PCB board than the motor driving module.

9. The electric pump according to claim 1 or 2, characterized in that: The motor driving module includes a plurality of thin film transistors, which are arranged on the same side of the PCB board, and a side of the PCB board where the thin film transistors are not arranged is provided with an exposed pad corresponding to the thin film transistor, the vertical projection of the pad on the PCB board covers the vertical projection of the corresponding thin film transistor on the PCB board, and a heat dissipation structure is arranged on the pad.

10. The electric pump according to claim 1 or 2, characterized in that: Also includes: An integrated chip, a side of the PCB board where the integrated chip is not provided is provided with an exposed pad, a vertical projection of the pad on the PCB board covers a corresponding vertical projection of the integrated chip on the PCB board, and a heat dissipation structure is provided on the pad.

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