A multi-station sample stage for in-situ electrochemical detection chips under scanning electron microscope

Abstract

The present invention discloses a multi-station sample stage for an in-situ electrochemical detection chip of a scanning electron microscope, the multi-station sample stage comprising a sample stage bracket, a sample stage, a sample stage circuit board, a chip fixing device, a core-wire connector, a circuit board at a flange, a fixing flange and an I / O interface; the sample stage bracket is coaxially arranged with the sample stage; the sample stage circuit board is arranged on the top of the sample stage; the chip fixing device is arranged on the sample stage; one end of the core-wire connector is connected to the circuit board of the sample stage, and the other end is connected to the circuit board of the flange; the circuit board at the flange is fixedly connected to the fixing flange; the I / O interface is centrally arranged on the fixing flange. The present invention has the function of observing samples at multiple stations at the same time, realizes the comparison of the in-situ electrochemical detection chip detecting samples with the change of the controlled potential under different controlled potential environments, and improves the detection efficiency.

Description

Technical Field

[0001] The invention belongs to the field of in-situ characterization of a scanning electron microscope, and in particular relates to a multi-station sample stage for an in-situ electrochemical detection chip of a scanning electron microscope. Background Art

[0002] Scanning electron microscope (SEM) is a microscopic morphology observation method between transmission electron microscope and optical microscope. It can directly use the material properties of the sample surface material for microscopic imaging and observe the fine structure of various samples on the uneven surface. Its sample carrier and sample stage are equipped with an in-situ detection chip, which can achieve atomic resolution. The in-situ detection chip can integrate physical and chemical functions to achieve patterning and functionalization. It has extremely high application value in molecular biology, chemical engineering, and medical semiconductor electronic materials. A visual window is built in the scanning electron microscope, and external fields such as thermal fields, light fields, and electrochemical fields are introduced to observe the samples in real time and dynamically in situ. Researchers can capture the dynamic sensing of samples to the environment through in-situ technology, including important information such as size, morphology, and crystal structure changes. The morphological changes of materials at the atomic scale under the action of external fields are increasingly becoming the basis of material research and development.

[0003] Currently, the in-situ electrochemical sample detection used in scanning electron microscopy is all single-chip detection. Multiple detections are required to achieve the comparison of the changes in the controlled potential of the in-situ electrochemical detection chip under different controlled potential environments. This is inefficient. Summary of the invention

[0004] The present invention provides a multi-station sample stage for an in-situ electrochemical detection chip under a scanning electron microscope, the purpose of which is to realize the comparison of the in-situ electrochemical detection chip under different controlled potential environments, reveal the law of the detection sample changing with the controlled potential, and greatly improve the detection efficiency.

[0005] The present invention provides a multi-station sample stage for in-situ electrochemical detection chips of a scanning electron microscope, the multi-station sample stage comprising a sample stage bracket, a sample holding stage, a sample stage circuit board, a chip fixing device, a core-wire connector, a circuit board at a flange, a fixing flange and an I / O interface; the sample stage bracket is coaxially arranged with the sample holding stage; the sample stage circuit board is arranged on the top of the sample holding stage; the chip fixing device is arranged on the sample holding stage; one end of the core-wire connector is connected to the sample stage circuit board circuit, and the other end is connected to the circuit board circuit at the flange; the circuit board at the flange is fixedly connected to the fixing flange; the I / O interface is centrally arranged on the fixing flange.

[0006] By adopting the above technology, it is possible to compare the in-situ electrochemical detection chips under different controlled potential environments, reveal the law of changes in the detection samples with the controlled potential, and greatly improve the detection efficiency.

[0007] Preferably, a circular array of circular holes is provided on the sample stage bracket; a center hole is provided at the center of the sample stage bracket; and threaded holes are provided on the sides of the sample stage bracket.

[0008] Preferably, a boss is provided on the sample holding table; grooves are arranged in an array on the boss; and fixing ears are symmetrically provided on both sides of the boss.

[0009] By adopting the above technology, the sample table has the function of observing samples at multiple stations at the same time. The specific sample table bracket is provided with 8 circumferential holes and 1 center hole, and 9 threaded holes are drilled on the side. The center hole is used to fix the sample table. The groove is used to hold the sample. By setting the array groove, multi-station observation can be achieved in a limited space, improving efficiency.

[0010] Preferably, the sample stage circuit board consists of a substrate, a sample stage circuit, a pressure sheet contact and a core wiring contact; the sample stage circuit is fixedly arranged on the substrate; one end of the sample stage circuit is connected to the pressure sheet contact, and the other end is connected to the core wiring contact.

[0011] By adopting the above technology, the structure of the sample stage circuit board has a high degree of symmetry, which is more convenient for manufacturing and production, and at the same time, it can ensure the space of the scanning electron microscope. The specific sample stage circuit board consists of a substrate, a sample stage circuit, 16 pressure contacts and 20 core wiring contacts. Among them, the sample stage circuit, the pressure contact and the core wiring contact are made of circuit metal materials such as gold, silver, platinum, and copper, which are evaporated on the substrate by thermal evaporation. The conductive efficiency can be improved by using circuit metal materials such as gold, silver, platinum, and copper to evaporate on the substrate by thermal evaporation. The 20 core wiring contacts are concentrated in a row at the front end of the substrate, which is convenient for wiring. And the 16 pressure contacts are marked with A1~A4, B1~B4, C1~C4, and D1~D4. In this way, the pressure contacts and the core wiring contacts can be quickly connected to the sample stage circuit through identification.

[0012] Preferably, the chip fixing device includes a chip press head device and a press head positioning spring sheet; the press head positioning spring sheet is arranged on one side of the chip press head device, and is used to press the chip press head device; the chip press head device is composed of a chip press head, a pressing sheet and a chip press head shaft; the pressing sheet is fixedly connected to the chip press head; the chip press head shaft is inserted into the chip press head.

[0013] Particularly, the pressure head positioning spring piece is L-shaped, a through hole is provided on the pressure head positioning spring piece, and the pressure head positioning spring piece is a spring piece made of beryllium copper through heat treatment.

[0014] Among them: the pressing sheet is made of materials with good electrical and thermal conductivity such as beryllium copper. The chip pressing head is made of insulating materials such as PEEK.

[0015] Preferably, the circuit board at the flange is composed of a second substrate, a circuit at the flange, an I / O terminal pin hole and a core cable pin hole; the circuit at the flange is symmetrically arranged on the second substrate; one end of the circuit at the flange is connected to the I / O terminal pin hole, and the other end is connected to the core cable pin hole.

[0016] Among them, there are 16 I / O pin holes, and 20 core-wire pin holes. The circuit at the flange, the input and output I / O pin holes and the core-wire pin holes are made of gold, silver, platinum, copper and other circuit metal materials evaporated on the substrate by thermal evaporation. The 20 core-wire pin holes are arranged in two rows, one above the other, and are concentrated at the front end of the substrate. The 16 input and output I / O pin holes are marked with A1~A4, B1~B4, C1~C4, D1~D4, and surround the center hole of the circuit board at the flange. The input and output I / O pin holes and the core-wire pin holes are connected correspondingly through the circuit at the flange.

[0017] Preferably, the fixing flange is provided with threaded holes; the threaded holes are arranged in a circumferential array around the flange for fixing the circuit board. Specifically, the circuit board at the flange is fixed to the fixing flange by screws. The I / O interface is screwed to the fixing flange. The I / O interface is used to connect to an external signal source to transmit signals.

[0018] Particularly, the number of the grooves is 2-12.

[0019] Particularly, there are four grooves.

[0020] Compared with the prior art, the present invention has the following beneficial effects: the multi-station sample stage for an in-situ electrochemical detection chip of a scanning electron microscope provided by the present invention has the function of simultaneously observing samples at multiple stations. The multi-station sample stage can realize the comparison of in-situ electrochemical detection chips under different potential control environments, reveal the law of the detection samples changing with the potential control, and greatly improve the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional structural diagram of a multi-station sample stage according to an embodiment of the present invention;

[0022] Figure 2 A three-dimensional structural diagram of a sample stage support according to an embodiment of the present invention;

[0023] Figure 3 A three-dimensional structural diagram of a four-station sample stage according to an embodiment of the present invention;

[0024] Figure 4A front view of a sample stage circuit board according to an embodiment of the present invention;

[0025] Figure 5 A three-dimensional structural diagram of a chip pressing head device according to an embodiment of the present invention;

[0026] Figure 6 A three-dimensional structural diagram of a pressure head positioning spring sheet according to an embodiment of the present invention;

[0027] Figure 7 It is a front view of a circuit board at a flange of an embodiment of the present invention;

[0028] Figure 8 It is a three-dimensional structural diagram of the fixing flange according to an embodiment of the present invention. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0030] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0031] Please see attached Figure 1 As shown: The embodiment of the present invention discloses a multi-station sample stage for an in-situ electrochemical detection chip of a scanning electron microscope, such as Figure 1 As shown, the multi-station sample stage includes a sample stage bracket 1, a sample holding stage 2, a sample stage circuit board 3, a chip fixing device 110, a core-wire connector 6 (20 core-wire connector), a circuit board 7 at a flange, a fixed flange 8, and an I / O interface 9; wherein the sample stage bracket 1 is coaxially arranged with the sample holding stage 2; the sample stage circuit board 3 is arranged on the top of the sample holding stage 2; the chip fixing device 110 is arranged on the sample holding stage 2, and the chip fixing device 110 includes a chip pressing head device 4 and a pressing head positioning spring sheet 5; one end of the core-wire connector 6 is connected to the sample stage circuit board circuit 3, and the other end is connected to the circuit board 7 at the flange; the circuit board 7 at the flange is fixedly connected to the fixed flange 8; and the I / O interface 9 is centrally arranged on the fixed flange 8.

[0032] By adopting the above technology, when using, first place the sample chip array on the sample holding table 2, then after vacuuming and testing, install the overall multi-station sample table into the vacuum chamber of the scanning electron microscope, then connect the I / O interface 9 to the external electrochemical workstation, and input different controlled potential voltages to the chips at different stations A1~A4, B1~B4, C1~C4, D1~D4 to perform sample testing and observation. The entire use process is simple and easy to operate. In summary, the sample holding table 2 has the function of simultaneously observing samples at multiple stations, which can realize the comparison of in-situ electrochemical detection chips under different controlled potential environments, reveal the law of detection samples changing with controlled potential, and greatly improve detection efficiency.

[0033] like Figure 2 As shown, the surface of the sample stage bracket 1 has 8 circumferential holes 10 arranged in a circular array at intervals and a center hole 11 in the center. A screw passes through the center hole 11 to fix the sample stage bracket 1 to the sample table 2. The circumferential holes 10 and the center hole 11 are aligned with the corresponding holes of the sample table 2 to ensure that the sample stage bracket 1 and the sample table 2 can be coaxially arranged. In addition to supporting the horizontal arrangement of samples on the sample table 2 of this embodiment, the sample stage bracket 1 structure can also support the circumferential arrangement form through the 8 circumferential holes 10, adjust the arrangement direction of the sample table 2, making the entire application more powerful and more convenient to operate. 9 threaded holes 12 are drilled on the side, and a dovetail groove for quickly mounting the workbench on the corresponding inspection device is provided at the bottom of the sample stage bracket 1.

[0034] like Figure 3 As shown, a transversely arranged boss 13 is provided in the middle of the sample holding table 2, and four spaced grooves for placing samples are provided above the boss 13, that is, a four-station sample table. Fixed ears 14 are symmetrically provided on the front and rear sides of the boss 13, with 8 fixed ears 14 on each side, and a chip press head device 4 is rotatably provided between every two fixed ears 14.

[0035] like Figure 5 As shown, the chip press device 4 is composed of a chip press 19, a pressing plate 20 and a chip press shaft 21. The pressing plate 20 is inserted into the chip press 19 by a tight fit; the chip press 19 is fixed between the fixing ears 14 of the press device through the chip press shaft 21. When closed and energized, the bottom surface of the pressing plate 20 contacts the pressing plate contact 17, and the other end of the pressing plate 20 contacts the chip electrode. In order to ensure good contact between the chip press device 4 and the in-situ electrochemical detection chip, the pressing plate 20 is made of a material with good electrical conductivity and thermal conductivity such as beryllium copper. In order to better ensure the electrical conduction capability of the contact, a layer of metal Ag or metal Au thin film with better electrical conductivity is usually added to the beryllium copper material of the pressing plate 20. The chip press 19 is made of insulating materials such as PEEK.

[0036] like Figure 6 As shown, the pressure head positioning spring sheet 5 is an L-shaped spring sheet made of beryllium copper through a specific heat treatment method; the pressure head positioning spring sheet 5 is pressed on the chip pressure head 19 and fixed on the four-station sample holding table 2 by fixing screws; when the sample chip to be tested is placed on the sample holding table 2, the screws used to fix the pressure head positioning spring sheet 5 are first loosened, and then the pressure sheet 20 is pulled up to drive the chip pressure head 19 to rotate around the fixed ear 14, and the sample chip to be tested is placed in the groove of the boss 13, and then the pressure sheet 20 in the fixed ears 14 on both sides of the boss 13 is pressed down to make the end of the pressure sheet 20 contact with the chip electrode, and then the pressure head positioning spring sheet 5 is pressed on the outside of the chip pressure head 19, and the head positioning spring sheet 5 is fixed on the sample holding table 2 by screws, and the installation of the sample chip to be tested is completed.

[0037] like Figure 4 As shown, the sample stage circuit board 3 is composed of a substrate 15, a sample stage circuit 16, 16 pressure sheet contacts 17 and 20 core-line contacts 18. The sample stage circuit 16, the pressure sheet contacts 17 and the core-line contacts 18 are made of circuit metal materials such as gold, silver, platinum, copper, etc., which are evaporated on the substrate 15 by thermal evaporation. The 20 core-line contacts 18 are arranged in a row at the front end of the substrate 15. The 16 pressure sheet contacts 17 are marked with A1~A4, B1~B4, C1~C4, D1~D4. The pressure sheet contacts 17 and the core-line contacts 18 are connected to each other through the sample stage circuit 16, the bottom surface of the pressure sheet 20 is in contact with the pressure sheet contact 17, and the other end of the pressure sheet 20 is in contact with the chip electrode. When closed and energized, each sample chip to be tested forms an independent circuit. The structure of the sample stage circuit board 3 is highly symmetrical.

[0038] By adopting the above technology, during installation, quick docking is carried out directly according to the marked A1~A4, B1~B4, C1~C4, D1~D4, so that the circuit layout of the sample table circuit board 3 is simple, intuitive, and convenient for production. At the same time, there is a good correspondence between the sample table circuit board 3, the core cable connector 6 and the flange circuit board 7.

[0039] One end of the 20-core cable connector 6 is connected to the 20 core cable contacts 18, and the other end is connected to the 20 core cable pin holes 25 of the circuit board 7 at the flange.

[0040] like Figure 7As shown, the flange circuit board 7 is composed of a substrate 22, a flange circuit 23, 16 input / output I / O pin holes 24 and 20 core wire pin holes 25, and a center hole 26 is opened in the center. The flange circuit 23, the input / output I / O pin holes 24 and the core wire pin holes 25 are made of circuit metal materials such as gold, silver, platinum, and copper, which are evaporated on the substrate 22 by thermal evaporation. The 20 core wire pin holes 25 are arranged in two rows, one above the other, and are concentrated at the front end of the substrate 22. The 16 input / output I / O pin holes 24 are marked with A1~A4, B1~B4, C1~C4, and D1~D4, and surround the center hole 26 of the flange circuit board 7. The input / output I / O pin holes 24 and the core wire pin holes 25 are correspondingly connected through the flange circuit 23. The flange circuit board 7 has a highly symmetrical structure.

[0041] By adopting the above technology, the circuit layout of the circuit board 7 at the flange is simple, intuitive, and convenient for production and manufacturing; there is a good correspondence between the circuit board 7 at the flange, the 20-core cable connector 6 and the sample table circuit board 3.

[0042] like Figure 8 As shown, the center of the fixed flange 8 is provided with a large threaded hole 27 for fixing the input / output I / O interface 9 and four small threaded holes 28 for fixing the flange circuit board 7. The flange circuit board 7 is fixed to the fixed flange 8 by screws. The input / output I / O interface 9 is locked to the fixed flange 8. The I / O interface 9 is connected to an external signal source for transmitting input and output signals.

[0043] It should be pointed out that the present embodiment specifically and preferentially adopts a four-station sample stage working position mode, and other working position modes such as two-station, three-station or five-station can also be adopted within the scope permitted by the structural space.

[0044] To sum up: when in use, first loosen the screws used to fix the pressure head positioning spring sheet 5, place the sample chip to be tested in the groove of the boss 13, corresponding to the four positions A1~A4, B1~B4, C1~C4, and D1~D4, and then fix the head positioning spring sheet 5 on the sample holding table 2 by screws, and the installation of the sample chip to be tested is completed; after the sample chip is installed and vacuum tested, the overall multi-position sample stage is installed in the vacuum chamber of the scanning electron microscope; the I / O interface 9 is connected to the external electrochemical workstation, and different controlled potential voltages are input to the chips at different positions A1~A4, B1~B4, C1~C4, and D1~D4 for sample detection and observation. One clamping can obtain the experimental results comparison under four different controlled potentials, thereby improving the detection efficiency.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that after reading the specification of this application, the technicians can still modify or replace the specific implementation mode of the present invention with equivalents, but these modifications or changes do not deviate from the scope of protection of the pending claims of the present application.

Claims

1. A multi-station sample stage for in-situ electrochemical detection chips under scanning electron microscope, Features: The multi-station sample stage comprises a sample stage bracket, a sample stage, a sample stage circuit board, a chip fixing device, a core-wire connector, a circuit board at a flange, a fixing flange and an I / O interface; the sample stage bracket is coaxially arranged with the sample stage; the sample stage circuit board is arranged on the top of the sample stage; the chip fixing device is arranged on the sample stage; one end of the core-wire connector is connected to the circuit of the sample stage circuit board, and the other end is connected to the circuit of the circuit board at the flange; the circuit board at the flange is fixedly connected to the fixing flange; the I / O interface is centrally arranged on the fixing flange; The sample stage circuit board comprises a substrate, a sample stage circuit, a pressure sheet contact and a core wiring contact; the sample stage circuit is fixedly arranged on the substrate; one end of the sample stage circuit is connected to the pressure sheet contact, and the other end is connected to the core wiring contact; The chip fixing device includes a chip press head device and a press head positioning spring sheet; the press head positioning spring sheet is arranged on one side of the chip press head device and is used to press the chip press head device; the chip press head device is composed of a chip press head, a pressing sheet and a chip press head shaft; the pressing sheet is fixedly connected to the chip press head; the chip press head shaft is inserted into the chip press head.

2. A multi-station sample stage for an in-situ electrochemical detection chip for a scanning electron microscope according to claim 1, Features: The sample stage bracket has a circumferential array of circumferential holes; the sample stage bracket has a center hole at the center; and the sample stage bracket has a threaded hole on the side.

3. The multi-station sample stage for the in-situ electrochemical detection chip of a scanning electron microscope according to claim 1, Features: A boss is provided on the sample holding table; grooves are arranged in an array on the boss; and fixing ears are symmetrically provided on both sides of the boss.

4. The multi-station sample stage for an in-situ electrochemical detection chip for a scanning electron microscope according to claim 1, Features: The pressure head positioning spring piece is L-shaped, a through hole is provided on the pressure head positioning spring piece, and the pressure head positioning spring piece is a spring piece made of beryllium copper through heat treatment.

5. The multi-station sample stage for the in-situ electrochemical detection chip of a scanning electron microscope according to claim 1, Features: The flange circuit board is composed of a second substrate, a flange circuit, an I / O terminal pin hole and a core cable pin hole; the flange circuit is symmetrically arranged on the second substrate; one end of the flange circuit is connected to the I / O terminal pin hole, and the other end is connected to the core cable pin hole.

6. The multi-station sample stage for an in-situ electrochemical detection chip for a scanning electron microscope according to claim 1, Features: The fixing flange is provided with threaded holes; and a circumferential array of threaded holes around the threaded holes is provided for fixing the circuit board at the flange.

7. The multi-station sample stage for the in-situ electrochemical detection chip of a scanning electron microscope according to claim 3, Features: The number of the grooves is 2-12.

8. The multi-station sample stage for the in-situ electrochemical detection chip of a scanning electron microscope according to claim 7, Features: There are four grooves.

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