A strip-shaped LED circuit board and processing method and LED light strip

Abstract

The present invention discloses a strip-shaped LED circuit board and a processing method and an LED light strip, including a strip-shaped LED circuit board and a processing method in which LED light-emitting elements can be arranged in sequence in the same electrode direction along the length direction, which has the advantages of streamlined process, simple structure, convenient production and use of the circuit board, saving time and cost, reducing damage to the environment, and realizing the standard arrangement of LED light-emitting elements, good light-emitting effect and more beautiful appearance. At the same time, the present invention provides a method of using continuous and integrated slitting of metal foil, setting an electrode conversion line and using a "yin" and "yang" pattern matching slitting scheme, which solves the problems of material saving, current diversion by printing conductive ink or welding conductor method, and disorderly arrangement of electronic components due to the inability to convert electrodes, easy errors, and poor product light-emitting effect, etc., making the production and use of the circuit board more cost-saving, more convenient and more beautiful.

Description

Technical Field

[0001] The present invention relates to a circuit board, and more specifically, to a strip-shaped LED circuit board and a processing method thereof, and an LED light strip. Background Art

[0002] The traditional method of making circuit boards generally involves coating various adhesives on the carrier material, then laminating it with copper foil to make a substrate, then using anti-etching ink or dry film to make the required pattern on the substrate, and then etching to obtain the circuit layer, and then making a solder mask or applying a protective film to make the circuit board. Traditional processes use a large amount of chemicals, acids, alkalis and other materials, emit a large amount of waste gas and various hazardous wastes, and consume a large amount of electricity, which pollutes the environment. After etching one square meter of copper foil in the above process, only one square meter of single-layer circuit boards can be made, which consumes a lot of energy.

[0003] On this basis, a Chinese patent appeared: CN201010232487 - Single-sided circuit board made of juxtaposed flat wires and its manufacturing method. The method discloses that four flat wires 2" at four electrode positions a, b, c, and d are juxtaposed and hot-pressed on an insulating material with adhesive properties, and then the flat wire positions to be disconnected are cut to make a circuit board 1". This patent makes it possible to achieve this without chemical etching.

[0004] In the application of LED, the invention adopts a design structure that the lamp bead components 3" are connected in series in a unit, and then multiple units are connected in parallel. Since the small unit is a series structure, the "negative" line of the first lamp bead component 3" must be connected to the "positive" line of the next lamp bead component, and so on, forming a series circuit with a break 4" in between. Figure 1As shown, the technical solution disclosed in the invention is limited by the juxtaposed parallel lines made by the juxtaposed arrangement, and there are the following technical problems that the technical solution disclosed in the invention cannot overcome: (i) The flat wire 2" used in the technical solution disclosed in the invention is made of a round wire by die rolling or by cutting a metal foil in advance according to the required size, which increases the pre-production cost and scrap rate and the difficulty of later processing. Since the flat wire is first made, and then the flat wires are arranged in parallel to form electrode lines parallel to each other in the length direction, and then the straight lines are cut to achieve the purpose of blocking the direction of current, conductive ink or welding conductors must be used to connect where connection is required, which increases the difficulty of discharge and production processes. More importantly, the quality stability is greatly reduced and the guarantee is low. (ii) Also, since its circuit layers are parallel and juxtaposed, each of its The flat wire circuit extends straight along the length direction, and the wire is disconnected by a break to block the flow of current. The wire positions of the parallel wire circuit are connected by conductive ink or welding conductors to guide the current. Due to its structural limitations, the technical solution disclosed in the invention cannot keep the coordinate position of the electrode of the LED light-emitting electronic component at the same line position. The current can only enter from the wire circuit of the first electrode line position a on the left side of the juxtaposed parallel lines and connect to the second electrode line position b through the resistor component. The "positive pole" of the first LED lamp bead component 3" is installed on the wire circuit of the second electrode line position b, and the "negative pole" of the LED lamp bead component 3" is installed on the wire circuit of the third electrode line position c. The current passes through the LED lamp bead component 3" from the second electrode line position b and is guided to the wire circuit of the juxtaposed parallel third electrode line position c. Then, the "positive pole" of the second lamp bead component 3" must be installed on the wire line of the third electrode line c that is juxtaposed in parallel, and the "negative pole" of the lamp bead component 3" is installed on the wire line of the second electrode line b, and the current is guided to the wire line of the second electrode line b through the second lamp bead component 3". Then, the "positive pole" of the next LED lamp bead component 3" must be installed on the wire line of the second electrode line b, and the "negative pole" of the LED lamp bead component 3" is installed on the wire line of the third electrode line c, and the third electrode line c and the fourth electrode line d at the current output end of the unit are connected through a resistor component. In this way, the electrode position of the LED light-emitting electronic component must be constantly switched between the juxtaposed parallel left and right wire lines, which increases the difficulty of patch installation of the LED lamp bead component 3" and increases the quality risk. At the same time, since the arrangement of the LED lamp bead components 3" is constantly swapped left and right, the light-emitting effect of the LED is greatly reduced, and the aesthetics of the product is seriously affected. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a strip-shaped LED circuit board and a processing method that can arrange LED light-emitting elements in sequence in the same electrode direction along the length direction in view of the above-mentioned deficiencies in the prior art, which has the advantages of streamlined process, simple structure, convenient production and use of the circuit board, saving time and cost, reducing damage to the environment, and realizing the standard arrangement of LED light-emitting elements, good light-emitting effect and more beautiful appearance. At the same time, the present invention provides a method of using continuous and integrated slitting of metal foil, setting an electrode conversion line and using a "yin" and "yang" pattern matching slitting scheme, which solves the problems of material saving, current diversion by printing conductive ink or welding conductor method, and disorderly arrangement of electronic components due to the inability to convert electrodes, easy errors, and poor product light-emitting effect, etc., making the production and use of the circuit board more cost-effective, more convenient and more beautiful.

[0006] The technical solution of the present invention is as follows: a strip-type LED circuit board, including a carrier layer with several units arranged along the length direction, the carrier layer is provided with a straight-through circuit along the length direction, wherein: several branch circuits with electrode position conversion are arranged in sequence along the length direction of the carrier layer, the branch circuits are made by continuous slitting of metal foil, metal plate or metal strip, including a conversion circuit segment for converting the electrode position and two straight circuit segments centered on the conversion circuit segment and extending in opposite directions symmetrically along the length direction, several branch circuits are arranged in sequence along the length direction and laminated on the carrier layer, the ends of the straight circuit segments are spaced apart from the adjacent conversion section circuits, the branch circuits located between the units are provided with fractures, and a solder resist layer is provided on the circuit layer of the single-sided board. The solder resist layer is formed by printing solder resist ink on the circuit layer or laminating a protective film with a pre-opened solder pad window.

[0007] The present invention adopts the above technical solution, and provides a conversion circuit that is arranged along the length direction of the circuit board and has a width direction electrode position conversion. The conversion circuit converts the electrode position to achieve the arrangement of LED light-emitting elements in the same electrode direction along the length direction of the circuit board. The conversion circuit is composed of a sub-circuit with electrode position conversion arranged in sequence along the length direction, a conversion circuit segment and two straight line segments extending in the length direction in the opposite direction symmetrically with the conversion circuit segment as the center. The two straight line segments in the sub-circuit are located at different electrode positions in the width direction of the circuit board and are staggered, not opposite to each other but oppositely symmetrical. The electrode position conversion connection is achieved between the adjacent ends through the conversion line segment. The rear straight line segment of the previous sub-circuit is opposite to the front straight line segment of the next sub-circuit in the width direction and parallel to the length direction. According to this arrangement, the straight line segments between the sub-circuit arranged in sequence along the length direction are located at two corresponding electrode positions and connected end to end to form two straight extension lines, and the ends of the straight line segments formed therebetween are spaced apart from the adjacent conversion segment lines.

[0008] In the above-mentioned strip-type LED circuit board, the break is set on the conversion line section of the branch line. The break is set at the unit length truncation position set equidistantly in the length direction. The break is located at the conversion line section and belongs to the least line truncation position, and the truncation position is easy to identify.

[0009] The above-mentioned method for processing a strip-type LED circuit board is to arrange a circuit combination cutting line on a metal foil, metal plate or metal strip that is consistent with the straight-through circuit and the branch circuit on the carrier layer, and to use a round knife mold or a flat knife mold or laser cutting to continuously and integrally cut the straight-through circuit and the branch circuit. The straight-through circuit and the branch circuit are made by continuous and integrally cutting on the metal foil, metal plate or metal strip using a round knife mold or a flat knife mold or laser cutting. A branch circuit with electrode position conversion is made, that is, an integrated branch circuit consisting of a conversion circuit segment and two straight line segments extending in opposite directions symmetrically along the length direction with the conversion circuit segment as the center, and a corresponding integrated branch circuit is arranged in the length direction of the circuit board. The two straight line segments are located at different electrode positions in the width direction of the circuit board and are staggered, not opposite but oppositely symmetrical, and the electrode position conversion connection is realized between the adjacent ends through the conversion line segment.

[0010] In the above-mentioned strip-type LED circuit board, the straight-through circuits and branch circuits are arranged in a "yin-yang" matching manner. After continuous and integrated slitting by a circular knife mold, a flat knife mold or laser cutting, the straight-through circuits and branch circuits of the "yin" and "yang" parts are respectively discharged by a transfer carrier, and then transferred and laminated onto the carrier layer respectively.

[0011] In the above-mentioned strip-type LED circuit board processing method, there are two straight-through lines located at two electrode positions in the horizontal direction, the branch line is located between the two straight-through lines, and the straight line segments of the branch line extending in opposite directions are respectively located at two electrode positions staggered in the horizontal direction. The two straight line segments are located at different electrode positions in the width direction of the circuit board and are staggered, not opposite but oppositely symmetrical, and the electrode position conversion connection is realized between the adjacent ends by converting the line segments.

[0012] In the above-mentioned strip-type LED circuit board, the conversion line segment of the sub-circuit is a horizontal line or a curve or an oblique line with a certain angle to the length direction, and when several sub-circuits are combined, their conversion line segments are parallel. The sub-circuits arranged in sequence in the length direction have conversion line segments arranged in the same direction, so they are arranged in parallel in sequence.

[0013] In the above-mentioned strip-type LED circuit board, the straight line segments extending symmetrically in opposite directions are respectively located at two transversely staggered electrode positions.

[0014] In the above-mentioned strip-type LED circuit board, the fracture formed by cutting the circuit board is that the circuit layer is cut alone, or the circuit layer and the carrier layer are cut together, or the circuit layer and the solder resist layer are cut together, or the circuit layer, the carrier layer and the solder resist layer are cut together.

[0015] The above-mentioned strip-type LED circuit board has a carrier layer made of PI, PET, PC, PVC, glass fiber cloth, aluminum, copper, steel, iron, or phenolic board material.

[0016] The above-mentioned strip-type LED circuit board, the circuit layer of the circuit board is made of metal materials such as copper, aluminum, steel, iron, or copper, aluminum, steel, iron, or their alloy materials, or the surface of the metal materials such as copper, aluminum, steel, iron, etc. is electroplated or chemically plated to cover the outer surface of the circuit layer of the circuit board with a layer of solderable metal such as nickel, tin, copper, silver, gold, etc. in whole or in part.

[0017] In the above-mentioned strip-type LED circuit board, the solder resist layer or protective film layer on the welding surface of the circuit board is an ink-type solder resist, which is made of materials such as PI, PET, PC, and PVC.

[0018] The above-mentioned strip-type LED circuit board is a flexible circuit board or a rigid single-sided circuit board, which can be processed into a double-sided circuit board or a multi-layer circuit board by conventional methods. That is, a double-layer or multi-layer circuit board can be set on the basis of a single-sided circuit board, and electrical connection points are set in the thickness direction to connect them.

[0019] A method for processing a strip-type LED circuit board comprises a carrier layer with a plurality of units arranged along a length direction, the carrier layer being provided with a straight-through circuit along the length direction, wherein: a circuit combination of a plurality of sub-circuits with electrode position conversion is arranged in sequence along the length direction of the carrier layer, the sub-circuits are made by continuous slitting of metal foil, metal plate or metal strip, and include a conversion circuit segment for converting the electrode position and two straight circuit segments centered on the conversion circuit segment and extending in opposite directions and symmetrically along the length direction, the plurality of sub-circuits are sequentially arranged and laminated on the carrier layer along the length direction, the ends of the straight circuit segments are spaced apart from the adjacent conversion circuit segments, fractures are provided on the sub-circuits between the units, solder resist ink is printed on the circuit layer of the single-sided board, or a protective film with a solder pad window pre-opened is laminated to form a solder resist layer to manufacture the strip-type LED circuit board.

[0020] In the above-mentioned method for processing a strip-type LED circuit board, the fracture is set on the conversion circuit section of the branch circuit.

[0021] The above-mentioned strip-type LED circuit board processing method arranges a circuit combination cutting line consistent with the straight-through circuit and the branch circuit on the carrier layer on the metal foil, metal plate or metal strip, and uses a circular knife mold or a flat knife mold or laser cutting to continuously and integrally cut the straight-through circuit and the branch circuit.

[0022] In the above-mentioned method for processing a strip-shaped LED circuit board, the through-circuit and the branch-circuit are arranged in a "yin-yang" matching manner, and after continuous and integrated slitting and cutting by a circular knife mold or a flat knife mold or laser cutting, the through-circuit and the branch-circuit of the "yin" part and the "yang" part are respectively discharged by a transfer carrier, and then transferred and laminated to the carrier layer. Through the above production process, one square area of ​​copper foil can be made into a two-square circuit board, which greatly reduces the production cost.

[0023] The fracture formed by cutting off the circuit board is that the circuit layer is cut alone, or the circuit layer and the carrier layer are cut together, or the circuit layer and the solder resist layer are cut together, or the circuit layer, the carrier layer and the solder resist layer are cut together.

[0024] The circuit layer processing method of the circuit board of the present invention adopts the above technical solution. After the circuit pattern is carefully designed, the required circuit is arranged in a "yin-yang" matching arrangement. After cutting with a knife die opened by an automatic circular knife machine, the "yin" part of the pattern and the "yang" part of the pattern are respectively discharged by a transfer carrier, and then transferred to the circuit board carrier layer respectively, and then the solder mask layer or protective film layer is made by a method well known in the circuit board industry to produce a circuit board. The waste material is only set with a connection point for the convenience of waste discharge, that is, the disconnected circuit or connection point is cut off on the "yang" pattern and the "yin" pattern.

[0025] The "yang" pattern is the pattern required for the normal circuit layer, while the "yin" pattern is designed as a mirror image of the yang pattern or a pattern after the "yang" pattern is offset to the left or right by a certain distance. The "yin" pattern is consistent with the "yang" pattern, but because it is necessary to separate the "yin" pattern from the "yang" pattern after cutting, in order to ensure that the electrode position coordinates of the pattern after the "yin" pattern and the "yang" pattern are not shifted, the "yin" pattern needs to be designed with connection points to connect the separate circuit patterns to ensure that the "yin" pattern is not deformed or shifted (its original principle is the same as window paper-cutting, leaving the connection line to prevent the pattern from being deformed or shifted). After the design is completed, the design pattern is processed into a circular knife mold. The reverse side of the "yin" pattern is the same or similar to the "yang" pattern, and the functions achieved are the same.

[0026] During processing, (i) first, a peelable protective film with self-adhesive force is used, the adhesive force of the protective film is about 30-80 grams, the copper foil is laminated on it, and it is cut by a die cutter on an automatic circular knife machine and then cut continuously under pressure to ensure that all die cutter lines cut the copper foil. (ii) Then a peelable protective film is laminated on its surface, the adhesive force of the peelable protective film is about 30-80 grams, preferably 65 grams, and then the "yin" pattern is separated from the "yang" pattern together with the peelable protective film laminated on the surface, wherein the "yang" pattern is combined with a layer of peelable protective film, and the "yin" pattern is combined with another layer of peelable protective film, so that two "yin" and "yang" circuit layers are made. (iii) Then, the "positive" and "negative" circuit layers are respectively laminated on the adhesive surface of the selected substrate with thermosetting adhesive, and after being fixed by a hot pressing roller at 150 degrees, the peelable protective film is removed, and the circuit layer is completed on the substrate. Then, the disconnection points on the "positive" image are cut off and the fixed graphics on the "negative" image are cut off together with the connection points and disconnection points. (iv) The solder mask or protective film layer is made using methods well known in the circuit board industry to produce a circuit board. The entire production process does not use chemical materials, water, and consumes less electricity. It also makes full use of waste materials, reduces environmental pollution to a minimum, and reduces product costs.

[0027] An LED light strip has pad windows arranged in sequence in the length direction of the strip-shaped LED circuit board, and LED light-emitting elements with the same electrode direction are arranged in sequence on the pad windows.

[0028] The present invention adopting the above technical solution can realize the arrangement of LED light-emitting elements in sequence while maintaining the same electrode direction along the length direction. Through lines extending straight through in the length direction are arranged on both sides of the circuit board, and branch lines are arranged in sequence in the length direction between the through lines on both sides, and the rear straight line segment of the previous branch line is opposite to the front straight line segment of the next branch line in the width direction and parallel to the length direction. LED light-emitting elements are respectively arranged between the rear straight line segment of the previous branch line and the front straight line segment of the next branch line in the width direction, and the LED light-emitting elements are arranged in sequence while maintaining the same electrode direction along the length direction. According to this arrangement, the straight line segments between the branch lines arranged in sequence along the length direction are located at the corresponding positive electrode positions and negative electrode positions, and are connected end to end to form two straight extension lines, and the ends of the straight line segments formed therebetween are spaced apart from the adjacent conversion segment lines.

[0029] The strip-shaped LED circuit board and processing method of the present invention have streamlined procedures, simple structure, and the production and use of the circuit board are more cost-effective, more convenient and more beautiful, and save time and cost, reduce damage to the environment, and realize the arrangement of LED light-emitting elements in a standardized manner, with good luminous effect, and solve the problems of material saving, current diversion by printing conductive ink or welding conductor method, and disorderly arrangement of electronic components due to the inability to convert electrodes, easy to make mistakes, and poor product luminous effect. At the same time, the present invention provides a method of using continuous and integrated slitting of metal foil, setting an electrode conversion line and using a "yin" and "yang" pattern matching slitting scheme, which solves the problems of material saving, current diversion by printing conductive ink or welding conductor method, and disorderly arrangement of electronic components due to the inability to convert electrodes, easy to make mistakes, and poor product luminous effect, making the production and use of the circuit board more cost-effective, more convenient and more beautiful. At the same time, it has streamlined procedures, simple structure, saves time and cost, and reduces damage to the environment.

[0030] The present invention is particularly suitable for flexible circuit boards for use with LED light strips. The LED light-emitting elements in the small unit are in a series structure, and the LED light-emitting elements can be arranged in sequence along the length direction of the circuit board by converting the electrode position through the conversion line. The limitation of arranging the LED light-emitting elements in series on the parallel lines in the unit commonly used in LED applications is solved, that is, because the small unit is in a series structure, the "negative" line of the first lamp bead must be connected to the "positive" line of the next LED light-emitting element, and so on, forming a series loop. That is, the structural limitation that the "positive and negative poles" of the LED light-emitting elements arranged in sequence must be swapped. The electrode conversion line designed by the present invention can play a role in directly setting and adjusting the "positive and negative" polar coordinate positions, that is, providing a conversion line that is arranged along the length direction of the circuit board and has a width direction electrode position conversion. By converting the electrode position through the conversion line, the LED light-emitting elements can be arranged in sequence along the length direction of the circuit board in the same electrode direction. The technical effect of making the product more standardized and beautiful. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The present invention will be further described in detail below with reference to the embodiments in the accompanying drawings, but this does not constitute any limitation to the present invention.

[0032] Figure 1 It is a structural schematic diagram of the implementation status of a traditional circuit board light strip;

[0033] Figure 2 It is a schematic diagram of the planar structure of the circuit board of the present invention;

[0034] Figure 3 yes Figure 2 A schematic diagram of the structure of one of the unit lines in the middle length direction;

[0035] Figure 4 yes Figure 3 AA cross-sectional structural diagram;

[0036] Figure 5 yes Figure 3 BB cross-sectional structure diagram;

[0037] Figure 6 This is a schematic diagram of the structure of one of the branch lines;

[0038] Figure 7 The invention is a tangent line diagram of a through line and a branch line arranged in a "yin-yang" matching manner on a metal foil, a metal plate or a metal strip.

[0039] Figure 8 yes Figure 1 The solder mask layer and pad window structure diagram are formed on this basis;

[0040] Fig. 9 yes Figure 8 Schematic diagram of CC cross-section structure;

[0041] Fig.10 It is a schematic diagram of the structure of an LED light strip using the circuit board of the present invention;

[0042] Fig.11 yes Fig.10 DD cross-sectional structure diagram;

[0043] Fig.12 It is a structural schematic diagram of another LED light strip using the circuit board of the present invention;. DETAILED DESCRIPTION

[0044] like Figures 2 to 12As shown, a strip-type LED circuit board includes a carrier layer 1 with a plurality of units arranged along the length direction, and is designed to include four electrode positions of a first electrode position a, a second electrode position b, a third electrode position c, and a fourth electrode position d. Straight-through lines 2 are arranged on both sides of the carrier layer 1 along the length direction, respectively located at the first electrode position a and the fourth electrode position d. A branch line 3 is located between the two straight-through lines 2. A plurality of branch lines 3 with electrode position conversion are arranged in sequence between the two straight-through lines 2 along the length direction of the carrier layer 1. The branch lines 3 are made of metal foil, metal plate, or metal strip by continuous slitting, and include conversion electrodes. A conversion line segment 31 at a pole position and two straight line segments 32 extending in opposite directions symmetrically along the length direction with the conversion line segment 31 as the center, that is, the front straight line segment 32 of a branch line 3 is located at the second electrode position b, and the rear straight line segment 32 is located at the third electrode position c, a plurality of branch lines 3 are sequentially arranged and laminated on the carrier layer 1 along the length direction, the ends of the straight line segments 32 are spaced from the adjacent conversion segment lines 31, and the branch lines 3 located between the units are provided with fractures 33, and the circuit layer of the single-sided board is printed with solder resist ink or laminated with a protective film with a pre-opened pad window to form a solder resist layer 4.

[0045] The break 33 is arranged on the conversion line section 31 of the branch line 3, and may also be arranged on the straight line section 32.

[0046] The through line 2 and the branch line 3 are made by continuous and integral cutting on a metal foil, a metal plate or a metal strip by using a round knife mold or a flat knife mold or laser cutting.

[0047] A circuit combination slitting line consistent with the straight-through circuit 2 and the branch circuit 3 on the carrier layer 1 is arranged on a metal foil, a metal plate or a metal belt, and is made by continuous and integral slitting using a round knife mold, a flat knife mold or laser cutting.

[0048] like Figure 7 As shown, the straight-through line 2 and the branch line 3 are arranged in a "yin-yang" matching manner. After continuous and integral slitting by a circular knife mold or a flat knife mold or laser cutting, the "yin" and "yang" parts of the straight-through line 2 and the branch line 3 are respectively discharged by a transfer carrier, and then transferred and laminated onto the carrier layer 1 respectively.

[0049] The conversion line segment 31 of the branch line 3 is a horizontal line or a curve or an oblique line with a certain angle to the length direction. When a plurality of branch lines 3 are combined, the conversion line segments 31 are parallel. Two straight line segments 32 are symmetrically extended in opposite directions along the length direction with the conversion line segment 31 as the center. Since the straight line segment 32 is located at different electrode positions of the third electrode position c and the fourth electrode position d, it avoids eccentric force of the pulling force during transfer. The angle between the conversion line segment 31 and the line position is preferably 5 to 45 degrees.

[0050] The straight line sections 32 of the branch lines 3 extending in opposite directions symmetrically are respectively located at two transversely offset electrode positions.

[0051] The circuit board can be a flexible circuit board or a rigid circuit board.

[0052] The fracture 33 formed by cutting the circuit board is that the circuit layer is cut alone, or the circuit layer and the carrier layer are cut together, or the circuit layer and the solder resist layer are cut together, or the circuit layer, the carrier layer and the solder resist layer are cut together.

[0053] The circuit board is a single-sided circuit board, which can be processed into a double-sided circuit board or a multi-layer circuit board by conventional methods.

[0054] A method for processing a strip-type LED circuit board comprises a carrier layer 1 having a plurality of units arranged along a length direction, the carrier layer 1 being provided with a straight-through circuit 2 along a length direction, and a circuit combination of a plurality of branch circuits 3 with electrode position conversion being arranged in sequence along a length direction of the carrier layer 1, the branch circuit 3 being made by continuous slitting of a metal foil, a metal plate or a metal strip, and comprising a conversion circuit segment 31 for converting the electrode position and two straight circuit segments 32 centered on the conversion circuit segment 31 and extending in opposite directions and symmetrically along a length direction, the plurality of branch circuits 3 being arranged in sequence along a length direction and laminated on the carrier layer 1, the ends of the straight circuit segments 32 being spaced apart from the adjacent conversion circuit segments 31, and the branch circuits 3 located between the units being provided with fractures 33, and solder resist ink being printed on the circuit layer of a single-sided board or a protective film with a solder pad window pre-opened thereon to form a solder resist layer 4 to manufacture a strip-type LED circuit board.

[0055] The break 33 is provided on the switching line section 31 of the branch line 3 .

[0056] The through line 2 and the branch line 3 are made by continuous and integral cutting on a metal foil, a metal plate or a metal strip by using a round knife mold or a flat knife mold or laser cutting.

[0057] A circuit combination slitting line consistent with the straight-through circuit 2 and the branch circuit 3 on the carrier layer 1 is arranged on a metal foil, a metal plate or a metal belt, and is made by continuous and integral slitting using a round knife mold, a flat knife mold or laser cutting.

[0058] like Figure 7 As shown, the straight-through line 2 and the branch line 3 are arranged in a "yin-yang" matching manner. After continuous and integral slitting by a circular knife mold or a flat knife mold or laser cutting, the "yin" and "yang" parts of the straight-through line 2 and the branch line 3 are respectively discharged by a transfer carrier, and then transferred and laminated onto the carrier layer 1 respectively.

[0059] The fracture 33 formed by cutting the circuit board is that the circuit layer is cut alone, or the circuit layer and the carrier layer 1 are cut together, or the circuit layer and the solder resist layer 4 are cut together, or the circuit layer, the carrier layer 1 and the solder resist layer 4 are cut together.

[0060] like Figure 7 As shown, the circuit layer processing method of the circuit board of the present invention adopts the above technical solution. After the circuit pattern is carefully designed, the required circuit is arranged in a "yin-yang" matching arrangement. After cutting with a knife die opened by an automatic circular knife machine, the "yin" part figure F and the "yang" part figure E are respectively discharged by a transfer carrier, and then transferred to the circuit board carrier layer respectively, and then the solder mask layer or protective film layer is made by a method well known in the circuit board industry to produce a circuit board. The waste material is only set with a connection point for the convenience of waste discharge, that is, the disconnected circuit or connection point is cut off on the "yang" figure and the "yin" figure.

[0061] The "yang" part of the pattern is the pattern required for the normal circuit layer, while the "yin" part of the pattern is designed as a mirror image of the partial pattern or a pattern after the "yang" part of the pattern is offset to the left or right by a certain distance. The yin part of the pattern is consistent with the yang part of the pattern, but because it is necessary to separate the "yin" part of the pattern from the "yang" part of the pattern after cutting, in order to ensure that the coordinates of the pattern after the separation of the "yin" part of the pattern from the "yang" part of the pattern do not shift, the "yin" part of the pattern needs to be designed with connection points to connect the separate circuit patterns to ensure that the pattern of the "yin" part of the pattern does not deform or shift (its original principle is similar to the paper-cut window decoration, leaving the connection line to prevent the pattern from deforming and shifting). After the design is completed, the design pattern is processed into a circular knife mold.

[0062] During processing, (i) first, a peelable protective film with self-adhesive force is used, the adhesive force of the protective film is about 30-80 grams, the copper foil is laminated on it, and it is cut by a die cutter on an automatic circular knife machine and then cut continuously under pressure to ensure that all die cutter lines cut the copper foil. (ii) Then a peelable protective film is laminated on its surface, the adhesive force of the peelable protective film is about 30-80 grams, preferably 65 grams, and then the "yin" pattern is separated from the "yang" pattern together with the peelable protective film laminated on the surface, wherein the "yang" pattern is combined with a layer of peelable protective film, and the "yin" pattern is combined with another layer of peelable protective film, so that two "yin" and "yang" circuit layers are made. (iii) Then, the "positive" and "negative" circuit layers are respectively laminated on the adhesive surface of the selected substrate with thermosetting adhesive, and after being fixed by a hot pressing roller at 150 degrees, the peelable protective film is removed, and the circuit layer is completed on the substrate. Then, the disconnection points on the "positive" image are cut off and the fixed graphics on the "negative" image are cut off together with the connection points and disconnection points. (iv) The solder mask or protective film layer is made using methods well known in the circuit board industry to produce a circuit board. The entire production process does not use chemical materials, water, and consumes less electricity. It also makes full use of waste materials, reduces environmental pollution to a minimum, and reduces product costs.

[0063] The specific production steps of the circuit board of the present invention are detailed as follows:

[0064] The present invention adopts the "Hadeshen" brand fully intelligent die-cutting machine and adopts new fully automated technology for production. The equipment includes M1# to M10# working positions. The process flow is as follows:

[0065] Step (1), preparing a substrate with adhesive on one side;

[0066] Step (ii) design a "yin" and "yang" symmetrical circuit layer drawing according to the engineering drawing (note: the "yin" part of the circuit has more connection points for fixing the graphics than the "yang" part of the circuit) and make a circular knife mold according to the drawing.

[0067] Step (iii): install the substrate (carrier layer 1), copper foil and other materials on the material station of the fully automatic circular knife machine.

[0068] Step (iv), pre-coat the copper foil at the M1 station of the circular knife machine (pressure is about 1 kg), and cut the copper foil with a circular knife die at the M2 station.

[0069] Step (V): Use a peelable protective film to laminate on the copper foil surface cut on the M2 station at the M3 work station, and discharge the "female" part of the circuit together with the peelable protective film, and immediately laminate it on another substrate (carrier layer 1), and use a 150°C roller to heat press to remove the peelable protective film and set it aside.

[0070] Step (six), the "positive" circuit layer left after the "negative" pattern is transferred out is hot-pressed with a 150° C. roller and then a fracture 33 is processed on the M5 work station.

[0071] Step (seven), processing the pad window of the protective film on the M6 ​​work station.

[0072] Step (eight), laminating the protective film layer 4 on the M7 working position and hot pressing.

[0073] Step (IX): a single-sided circuit board is produced by forming a "positive" circuit layer in strips on the M8 work station.

[0074] Step (10), install the "female" part of the circuit hot-pressed in step (5) on another circular knife machine, and use the M2 workstation to cut off the waste discharge connection point.

[0075] Step (eleven), machining and cutting off the fracture 33 on the M3 work station.

[0076] Step (twelve), processing the pad window of the protective film on the M4 work station.

[0077] Step (thirteen), process the laminated protective film layer 4 at the M5 work station and heat-press and cure it with a hot pressing roller at 150 degrees.

[0078] Step (fourteen), divide it into strips on the M6 ​​work station, and through the above steps, a single-sided strip-type LED flexible circuit board made of a "negative" circuit layer is made.

[0079] like Figure 8 , Fig. 9 , Fig.10 and Fig.11 As shown, an LED light strip is made of a single-sided circuit board made of a "positive" circuit layer, such as Fig.12 The single-sided circuit board shown is made using a "female" circuit layer.

[0080] The pad windows 34 are sequentially arranged in the length direction of the strip-shaped LED circuit board, and the LED light-emitting elements 5 with the same electrode direction are sequentially arranged on the pad windows 34 .

[0081] When mounting LED light-emitting electronic components on the above-mentioned single-sided strip-type LED flexible circuit board, a design structure is used in which the LED light-emitting elements 5 in the unit are connected in series, and then multiple units are connected in parallel. The straight line segment 32 at the second electrode position b at the head end of each unit and the straight line 2 at the first electrode position a are connected through a resistor element 6, and the straight line 2 at the first electrode position a is connected to the positive electrode. The straight line segment 32 at the third electrode position c at the end of each unit and the straight line 2 at the fourth electrode position d are connected through a resistor element 6, and the straight line 2 at the fourth electrode position d is connected to the negative electrode. As shown in the figure, three LED light-emitting elements 5 are arranged in the small unit, but they are not limited to three according to actual needs. The positive poles of the three LED light-emitting elements 5 are all arranged on the straight line segment 32 at the second electrode position b, and the negative poles are correspondingly arranged on the straight line segment 32 at the third electrode position c. Arrange along the length direction according to the following line positions: LED light-emitting elements 5 are respectively arranged between the last straight line segment 32 of the previous branch line 3 and the first straight line segment 32 of the next branch line 3 in the width direction, and the LED light-emitting elements 5 are arranged in sequence in the same electrode position (second electrode position b, third electrode position c) along the length direction. Straight-through lines 2 are respectively arranged on both sides of the carrier layer 1 along the length direction, located at the first electrode position a and the fourth electrode position d, the first straight line segment 32 of a branch line 3 is located at the second electrode position b, and the last straight line segment 32 is located at the third electrode position c. According to this arrangement, the straight line segment 32 on the left side along the length direction is located at the second electrode position b, and the straight line segment 32 on the right side is located at the third electrode position c.

[0082] In summary, the present invention has been made into actual samples and tested for multiple times as described in the specification and the drawings. From the results of the test, it can be proved that the present invention can achieve its intended purpose, and its practical value is beyond doubt. The above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention in any form. Any person with ordinary knowledge in the technical field, if it does not depart from the scope of the technical features of the present invention, uses the equivalent embodiments of the technical content disclosed by the present invention to make partial changes or modifications, and does not depart from the technical features of the present invention, all still fall within the scope of the technical features of the present invention.

Claims

1. A strip-shaped LED circuit board, comprising a carrier layer (1) having a plurality of units arranged along a length direction, wherein the carrier layer (1) has a straight-through circuit (2) arranged along the length direction, characterized in that: A plurality of branch lines (3) with electrode position conversion are sequentially arranged along the length direction of the carrier layer (1); the branch lines (3) are made by continuous slitting of metal foil, metal plate or metal strip, and include a conversion line segment (31) for converting the electrode position and two straight line segments (32) centered on the conversion line segment (31) and extending in opposite directions symmetrically along the length direction; the plurality of branch lines (3) are sequentially arranged on the carrier layer (1) along the length direction, and the ends of the straight line segments (32) are spaced apart from the adjacent conversion line segments (31); the branch lines (3) located between the units are provided with fractures (33); and a solder resist layer (4) is provided on the line layer including the through line (2) and the branch lines (3); when the plurality of branch lines (3) are combined, the conversion line segments (31) are parallel; The through-circuit (2) and the branch-circuit (3) are arranged in a "yin-yang" matching manner, and after continuous and integral slitting by a circular knife die or a flat knife die or laser cutting, the "yin" circuit layer and the "yang" circuit layer having the through-circuit (2) and the branch-circuit (3) are respectively discharged by a transfer carrier, and then respectively transferred and laminated onto the carrier layer (1).

2. A strip-shaped LED circuit board according to claim 1, characterized in that: A line combination slitting line that is consistent with the straight-through line (2) and the branch line (3) on the carrier layer (1) is formed on a metal foil, metal plate or metal strip, and the straight-through line (2) and the branch line (3) are cut continuously and integrally using a round knife die or a flat knife die or laser cutting.

3. The strip-shaped LED circuit board according to claim 1, characterized in that: The conversion line section (31) of the branch line (3) is a horizontal line or a curve or an oblique line that forms a certain angle with the length direction.

4. The strip-shaped LED circuit board according to claim 1, characterized in that: The through line (2) has two electrodes located at two transverse electrode positions, the branch line (3) is located between the two through lines (2), and the straight line sections (32) of the branch line (3) extending symmetrically in opposite directions are respectively located at two transversely staggered electrode positions.

5. The strip-shaped LED circuit board according to claim 1, characterized in that: The fracture (33) formed by cutting off the circuit board is the circuit layer cut alone, the circuit layer and the carrier layer cut together, the circuit layer and the solder resist layer cut together, or the circuit layer, the carrier layer and the solder resist layer cut together.

6. The strip-shaped LED circuit board according to claim 1, characterized in that: The pad windows (34) are arranged in sequence in the length direction of the circuit board, and the pad windows (34) between the parallel and opposite straight line segments (32) of adjacent branch lines (3) are arranged opposite to each other in the same width direction.

7. A strip-shaped LED circuit board according to any one of claims 1 to 6, characterized in that: The circuit board is a single-sided circuit board of a flexible circuit board or a rigid circuit board, which is processed into a double-sided circuit board or a multi-layer circuit board for use.

8. A method for processing a strip-shaped LED circuit board, comprising a carrier layer (1) having a plurality of units arranged along a length direction, wherein the carrier layer (1) has a straight-through circuit (2) arranged along the length direction, characterized in that: A circuit combination of a plurality of branch circuits (3) with electrode position conversion is sequentially arranged along the length direction of the carrier layer (1), the branch circuits (3) being made by continuous slitting of metal foil, metal plate or metal strip, and comprising a conversion circuit segment (31) for converting the electrode position and two straight circuit segments (32) centered on the conversion circuit segment (31) and extending in opposite directions and symmetrically along the length direction, the plurality of branch circuits (3) are sequentially arranged and laminated on the carrier layer (1) along the length direction, the ends of the straight circuit segments (32) being spaced apart from the adjacent conversion circuit segments (31), and the branch circuits (3) located between the units being provided with fractures (33), and solder resist ink is printed on the circuit layer of the single-sided board or a protective film with a solder pad window pre-opened is laminated to form a solder resist layer (4) to produce a strip-type LED circuit board; The through-circuit (2) and the branch-circuit (3) are arranged in a "yin-yang" matching manner, and after continuous and integral slitting by a circular knife die or a flat knife die or laser cutting, the "yin" circuit layer and the "yang" circuit layer having the through-circuit (2) and the branch-circuit (3) are respectively discharged by a transfer carrier, and then respectively transferred and laminated onto the carrier layer (1).

9. A method for processing a strip-shaped LED circuit board according to claim 8, characterized in that: A line combination slitting line that is consistent with the straight-through line (2) and the branch line (3) on the carrier layer (1) is formed on a metal foil, metal plate or metal strip, and the straight-through line (2) and the branch line (3) are cut continuously and integrally using a round knife die or a flat knife die or laser cutting.

10. The method for processing a strip-shaped LED circuit board according to claim 8, characterized in that: The fracture (33) formed by cutting the circuit board is the circuit layer cut alone, the circuit layer and the carrier layer (1) cut together, the circuit layer and the solder resist layer (4) cut together, or the circuit layer and the carrier layer (1) and the solder resist layer (4) cut together.

11. An LED light strip, characterized in that: Solder pad windows (34) are sequentially arranged in the length direction of the strip-shaped LED circuit board according to any one of claims 1 to 7, and LED light-emitting elements (5) with the same electrode direction are sequentially arranged on the solder pad windows (34).

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