LED structure with built-in IC

Abstract

The embodiment of the present invention discloses an LED structure with a built-in IC, comprising an insulating seat and a conductive foot integrally inlaid with the insulating seat, wherein the insulating seat is recessed from the top to form a reflective cup, and the conductive foot comprises a first conductive foot and a second conductive foot, wherein the first conductive foot is provided with an IC mounting area for mounting an LED driver IC, and the second conductive foot is provided with an LED chip mounting area for mounting an LED chip, and both the IC mounting area and the LED chip mounting area are arranged on the bottom of the reflective cup; wherein the position of the IC mounting area on the reflective cup is lower than the position of the LED chip mounting area on the reflective cup, so that after the LED driver IC is mounted on the IC mounting area, the distance between the end surface of the LED driver IC away from the IC mounting area and the bottom of the reflective cup is equal to a preset distance.

Description

Technical Field

[0001] The invention relates to the technical field of LEDs, and in particular to an LED structure with a built-in IC. Background Art

[0002] LED products are widely used in the lighting and display industries due to their advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free and environmental protection, and have become one of the most watched products in recent years.

[0003] The packaging of LED products is to integrate the LED chip and the LED driver IC together for packaging, wherein the LED chip, LED driver IC and conductive pins are connected together by bonding wires to transmit chip electrical signals and dissipate chip heat. However, the existing LED driver IC and LED chip are both installed on the IC mounting area and LED chip mounting area on the bottom of the reflective cup, wherein the IC mounting area, LED chip mounting area and the bottom of the reflective cup are located on the same plane, thereby increasing the length of the bonding wires, and further increasing the manufacturing cost of the LED products. Summary of the invention

[0004] In view of this, the present invention provides an LED structure with a built-in IC, which can effectively solve the above problems.

[0005] According to a first aspect of an embodiment of the present invention, there is provided an LED structure with a built-in IC, comprising:

[0006] An insulating seat, which is recessed from the top and forms a reflective cup;

[0007] A conductive foot, integrally inlaid with the insulating seat, comprising a first conductive foot and a second conductive foot, wherein the first conductive foot is provided with an IC mounting area for mounting an LED driver IC, and the second conductive foot is provided with an LED chip mounting area for mounting an LED chip, and the IC mounting area and the LED chip mounting area are both arranged on the bottom of the reflective cup;

[0008] The position of the IC mounting area on the reflective cup is lower than the position of the LED chip mounting area on the reflective cup, so that after the LED driver IC is installed in the IC mounting area, the distance between the end surface of the LED driver IC away from the IC mounting area and the bottom of the reflective cup is equal to a preset distance.

[0009] In the LED structure of the present invention, the LED driver IC is filled on the IC mounting area by inorganic materials.

[0010] In the LED structure of the present invention, the inorganic material is one or more of aluminum oxide, magnesium oxide, aluminum nitride, boron nitride, silicon nitride or silicon carbide.

[0011] In the LED structure of the present invention, the first conductive leg is formed by bending a conductive sheet, and a first groove recessed inwardly is provided on the end surface of the first conductive leg to form the IC mounting area.

[0012] In the LED structure of the present invention, the depth of the first groove is matched with the thickness of the LED driver IC.

[0013] In the LED structure of the present invention, the first conductive foot is formed by bending a conductive sheet, the first conductive foot includes a first conductive surface and a second conductive surface, and the second conductive surface is bent downward to form the IC mounting area.

[0014] In the LED structure of the present invention, the depth of the downward bending of the second conductive surface matches the thickness of the LED driver IC.

[0015] In the LED structure of the present invention, the conductive pins further include a third conductive pin having an LED chip fixing area and a fourth conductive pin having a cathode fixing area, and the LED chip fixing area and the cathode fixing area are located on the same plane as the LED chip mounting area.

[0016] In the LED structure of the present invention, the insulating seat is further provided with a first annular groove and a second annular groove, the first annular groove is connected to the reflective cup through the second annular groove, and the depth of the first annular groove is greater than the depth of the second annular groove.

[0017] According to a first aspect of an embodiment of the present invention, there is provided an LED structure with a built-in IC, comprising:

[0018] An insulating seat, which is recessed from the top and forms a reflective cup;

[0019] A conductive foot, integrally inlaid with the insulating seat, comprising a first conductive foot and a second conductive foot, wherein the first conductive foot is provided with an IC mounting area for mounting the LED driver IC, and the second conductive foot is provided with a first LED chip mounting area for mounting the LED chip, and the IC mounting area and the first LED chip mounting area are both arranged on the bottom of the reflective cup;

[0020] The position of the IC mounting area on the reflective cup is not higher than the position of the LED chip mounting area on the reflective cup, the transmission rate of the LED driver IC is 80-150 Kbps; and / or the LED driver IC is filled on the reflective cup in sequence through silicon dioxide and high borosilicate.

[0021] The technical solution provided by the embodiments of the present application may include the following beneficial effects: the present application designs an LED structure, including an insulating seat and a conductive foot, wherein the insulating seat is recessed from the top and forms a reflective cup, and the conductive foot includes a first conductive foot having an IC mounting area and a second conductive foot having an LED chip mounting area. When the IC mounting area and the LED chip mounting area are arranged on the bottom of the reflective cup, the position of the IC mounting area is lower than the position of the LED chip mounting area, so that after the LED driver IC is installed in the IC mounting area, the distance between the end face of the LED driver IC away from the IC mounting area and the bottom of the reflective cup is equal to a preset distance, thereby reducing the length of the bonding wire connected to the LED driver IC and saving a lot of manufacturing costs.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0024] Figure 1 It is a structural schematic diagram of an LED structure with a built-in IC provided by an embodiment of the invention;

[0025] Figure 2 yes Figure 1 A schematic diagram of the structure of the LED in another angle;

[0026] Figure 3 yes Figure 1 Schematic diagram of the LED structure in FIG.

[0027] Figure 4 yes Figure 1 A cross-sectional schematic diagram of an LED structure;

[0028] Figure 5 yes Figure 1 A partial structural diagram of an LED structure in FIG.

[0029] Figure 6 yes Figure 1 A partial cross-sectional schematic diagram of an LED structure;

[0030] Figure 7 yes Figure 1 A partial structural diagram of an LED structure in FIG.

[0031] Figure 8 yes Figure 1 A schematic diagram of the structure of the first conductive foot in FIG.

[0032] Fig. 9 yes Figure 1 Schematic diagram of the electrical connection between the LED driver IC and the LED chip;

[0033] Fig.10 yes Fig. 9 A schematic diagram of the structure of the insulating seat;

[0034] Fig.11 yes Figure 1 A schematic diagram of the structure of the insulating base;

[0035] Fig.12 yes Figure 1 A schematic diagram of the structure of the insulating base at another angle;

[0036] Fig.13 yes Figure 1 A schematic diagram of the structure of the insulating cover;

[0037] Fig.14 is a cross-sectional view of an LED structure with a built-in IC provided by another embodiment of the invention;

[0038] Fig.15 yes Fig.14 Schematic diagram of the LED structure in FIG.

[0039] Fig.16 yes Fig.14 A partial structural diagram of an LED structure;

[0040] Fig.17 yes Fig.14 A partial structural diagram of an LED structure;

[0041] Fig.18 yes Fig.14 Schematic diagram of the structure of the first conductive foot.

[0042] Description of reference numerals:

[0043] 10. Insulating seat; 111. Reflective cup; 112. First annular groove; 113. Second annular groove;

[0044] 20, conductive foot; 21, first conductive foot; 211, IC mounting area; 212, first conductive surface; 213, second conductive surface; 22, second conductive foot; 221, LED chip mounting area; 23, third conductive foot; 231, LED chip fixing area; 24, fourth conductive foot; 241, cathode fixing area;

[0045] 30. LED driver IC;

[0046] 40. LED chips;

[0047] 50. Protective glue;

[0048] 60. Bonding wire. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0051] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0052] like Figures 1 to 3As shown, the present application provides an LED structure with built-in IC, including an insulating seat 10 and a conductive foot 20, wherein the insulating seat 10 is concave from the top and forms a reflective cup 111, and the conductive foot 20 includes a first conductive foot 21 and a second conductive foot 22. In this embodiment, the first conductive foot 21 is provided with an IC mounting area 211 for mounting an LED driver IC 30, and the second conductive foot 22 is provided with an LED chip mounting area 221 for mounting an LED chip 40. When the IC mounting area 211 and the LED chip mounting area 221 are arranged on the bottom of the reflective cup 111, the position of the IC mounting area 211 on the reflective cup 111 is lower than the position of the LED chip mounting area 221 on the reflective cup 111, and the end surface of the LED chip mounting area 221 is just located in the same plane as the bottom of the reflective cup 111, so that after the LED driver IC 30 is mounted on the IC mounting area 211, the distance between the end surface of the LED driver IC 30 away from the IC mounting area 211 and the bottom of the reflective cup 111 is equal to the preset distance.

[0053] Among them, the preset distance can be any dimension smaller than the thickness of the LED driver IC30. Its purpose is to allow the LED driver IC30 to sink into the bottom of the reflective cup 111. This not only ensures that the LED chip 40 is located above the LED driver IC30, but also avoids the LED driver IC30 blocking the light of the LED chip 40, and effectively improves the brightness of the LED structure without increasing the manufacturing cost of the LED structure.

[0054] Since the conductive pin 20, the LED driver IC 30 and the LED chip 40 are electrically connected via the bonding wire 60, specifically, the height of the bonding wire 60 decreases from the highest point until the end is welded to the conductive pin 20, the LED driver IC 30 or the LED chip 40. Therefore, when the LED driver IC 30 sinks to the bottom of the reflective cup 111, the position of the highest point of the bonding wire 60 decreases, thereby reducing the use length of the bonding wire 60, thereby saving the manufacturing cost of the LED structure.

[0055] Among them, since the packaging structure of the LED is composed of a composite of inorganic and organic materials, when the SMT process is performed on the back end of the LED structure, the thermal expansion coefficients of the inorganic material and the organic material are different. Therefore, the stress generated by the inorganic material and the organic material are also different, which can easily cause the bonding wire 60 to be punched or broken. The present application reduces the use length of the bonding wire 60, thereby reducing the impact force on the bonding wire 60 during the SMT process, avoiding undesirable phenomena such as punching or breaking of the bonding wire 60.

[0056] In an optional embodiment, if Figures 4 to 6 As shown, the LED driving IC 30 is filled on the IC mounting area 211 by an inorganic material.

[0057] At present, when processing the LED structure, firstly, epoxy glue or silicone is used to bond the bottom of the LED driver IC 30 and the LED chip 40 to the conductive foot 20 and solidify, then the bonding wire 60 is respectively welded to the LED driver IC 30, the LED chip 40 and the conductive foot 20, and the protective glue 50 is filled in the reflective cup 111 to surround the LED driver IC 30, wherein the surface of the protective glue 50 is at least flush with the light emitting surface of the LED driver IC 30, and the protective glue 50 is solidified into a protective layer, and then a lens is placed to complete the packaging of the LED structure, wherein the LED driver IC 30 is The dynamic IC 30 is made of semiconductor silicon material, the LED chip 40 is made of gallium nitride or aluminum gallium phosphide material, and the protective glue 50 is generally composed of a variety of organic materials and inorganic materials, which will affect the moisture-sensitive properties of the LED structure and also restrict the reliability of the LED structure. That is, the protective glue 50 is damp due to excessive temperature, which makes it impossible to perform high-temperature SMT process. Otherwise, the protective glue 50 inside the reflective cup 111 is prone to expand due to water vapor due to high temperature. The stress generated in this process may cause the bonding wire 60 in the LED structure to break and fail.

[0058] The present application has applied for filling inorganic materials into the IC mounting area 211 where the LED driver IC 30 is sunken, and even to the bottom of the reflective cup 111, so as to reduce the contact area between the LED driver IC 30 and the protective glue 50. The inorganic material has a low thermal expansion coefficient and belongs to a solid material. This can alleviate the influence of thermal stress release on the LED structure. Moreover, the organic material changes with the temperature, causing the expansion coefficient to change, that is, the temperature change will cause the internal stress of the organic material to change, thereby breaking the bonding wire 60, and then causing the failure of the entire LED structure.

[0059] In an optional embodiment, the inorganic material may be one or more of aluminum oxide, magnesium oxide, aluminum nitride, boron nitride, silicon nitride or silicon carbide. For example, when the inorganic material is hexagonal boron nitride, since the expansion coefficient of hexagonal boron nitride is equivalent to that of quartz and the thermal conductivity is 10 times that of quartz, it has excellent thermal shock resistance and will not be damaged even after 100 cycles at 1200-20°C, thereby alleviating the impact of thermal stress release on the LED structure.

[0060] In an optional embodiment, if Figure 7As shown, the conductive pin 20 also includes a third conductive pin 23 having an LED chip fixing area 231 and a fourth conductive pin 24 having a cathode fixing area 241, wherein the LED chip fixing area 231 and the cathode fixing area 241 are located on the same plane as the LED chip mounting area 221, wherein the number of conductive pins 20 in the LED structure is mainly designed according to the driving mode of the LED structure, and the present application does not impose any restrictions. In the following embodiments, the LED structure is mainly described by taking four conductive pins as an example, wherein the first conductive pin 21 is used for grounding, the second conductive pin 22 is used for connecting to a power source, the third conductive pin 23 is used for signal output, and the fourth conductive pin 24 is used for signal input. For other numbers of conductive pins, this embodiment will not be repeated here.

[0061] In an optional embodiment, if Figures 5 to 7 As shown, there are three LED chips 40, two of which are mounted on the LED chip mounting area 221, and another LED chip 40 is mounted on the LED chip fixing area 231. In this embodiment, there are nine bonding wires 60, seven of which are provided on the LED driver IC 30, and are respectively electrically connected to the first conductive pin 21, the second conductive pin 22, the third conductive pin 23, the fourth conductive pin 24 and the three LED chips 40, and the other two are respectively used to electrically connect one of the LED chips 40 on the LED chip mounting area 221, the LED chip 40 on the LED chip fixing area 231 and the second conductive pin 22.

[0062] In an optional embodiment, if Figures 7 to 9 As shown, the first conductive foot 21 is formed by bending a conductive sheet, and a first groove recessed inwardly is provided on an end surface of the first conductive foot 21 to form an IC mounting area 221 .

[0063] Specifically, the first conductive pin 21, the second conductive pin 22, the third conductive pin 23, and the fourth conductive pin 24 can all be made by cutting a metal sheet and then bending it, or directly forming it in one step by a stamping process, which has extremely high production efficiency and correspondingly low cost, so the production efficiency of the entire LED structure is also greatly improved and the production cost is reduced at the same time. In addition, since the LED structure can put the first conductive pin 21, the second conductive pin 22, the third conductive pin 23, and the fourth conductive pin 24 into the mold accordingly, and use the injection molding process to design the conductive pin 20 and the insulating seat 10 to be integrally inlaid, not only the manufacturing cost of the LED structure is saved, but also the subsequent assembly of the LED structure is reduced.

[0064] In an optional embodiment, the depth of the first groove is adapted to the thickness of the LED driver IC 30. Specifically, the depth of the first groove is approximately equal to the thickness of the LED driver IC 30. After the first conductive foot 21 is stamped, the depth of the first groove is processed to be consistent with the thickness of the LED driver IC 30 using a grinding process, so that the LED driver IC 30 can be completely sunk into the first groove.

[0065] In an optional embodiment, if Figures 9 to 13 As shown, the insulating seat 10 includes an insulating base 12 and an insulating cover 11, wherein the insulating base 12 and the insulating cover 11 can be integrally formed or connected together using glue or other fasteners. In this embodiment, the insulating base 12 is provided with a first concave cavity 121, a second concave cavity 122, a third concave cavity 123 and a fourth concave cavity 124, wherein the first conductive foot 21, the second conductive foot 22, the third conductive foot 23 and the fourth conductive foot 24 are respectively mounted on the first concave cavity 121, the second concave cavity 122, the third concave cavity 123 and the fourth concave cavity 124.

[0066] In addition, the insulating base 12 is provided with a plurality of fifth recesses 125 on a side facing away from the conductive pin 20 , so as to receive one end of the first conductive pin 21 , the second conductive pin 22 , the third conductive pin 23 and the fourth conductive pin 24 extending from the insulating base 12 .

[0067] like Figures 14 to 18 As shown, the present invention also provides an LED structure with a built-in IC. The LED structure in this embodiment is different from the LED structure in the above embodiment in that the first conductive foot 21 includes a first conductive surface 212 and a second conductive surface 213, and the second conductive surface 213 is bent downward to form the above IC mounting area.

[0068] Specifically, a gap is provided between the first conductive surface 212 and the second conductive surface 213 , and the gap is mainly used to facilitate the bending of the second conductive surface 213 . The structure is simple but practical.

[0069] In an optional embodiment, the depth of the downward bending of the second conductive surface 213 matches the thickness of the LED driver IC 30 so that the LED driver IC 30 can be completely sunk into the bottom of the reflective cup 111 , thereby being filled with no material.

[0070] In an optional embodiment, the insulating base 10 is further provided with a first annular groove 112 and a second annular groove 113, wherein the first annular groove 112 is connected to the reflective cup 111 through the second annular groove 113. In this embodiment, the depth of the first annular groove 112 is greater than the depth of the second annular groove 113. After adopting the above technical solution, the contact area of ​​the insulating base, the protective glue and the lens can be increased, so that the packaging of the LED structure is more secure.

[0071] like Figures 1 to 18 As shown, the present invention also provides an LED structure with built-in IC, including an insulating base 10 and a conductive foot 20 integrally inlaid with the insulating base 10, wherein the insulating base 10 is recessed from the top and forms a reflective cup 11, and the conductive foot 20 includes a first conductive foot 21 and a second conductive foot 21, the first conductive foot 21 is provided with an IC mounting area 211 for mounting an LED driver IC 30, and the second conductive foot 22 is provided with an LED chip mounting area 221 for mounting the LED chip 40, when the IC mounting area 211 and the LED chip 221 mounting area are arranged on the bottom of the reflective cup 11, the position of the IC mounting area 211 on the reflective cup 111 is not higher than the position of the LED chip mounting area 221 on the reflective cup 111. In this embodiment, the transmission rate of the LED driver IC 30 is 80-150 Kbps, and the LED driver IC 30 is sequentially filled on the reflective cup 11 by silicon dioxide and high borosilicate, which can play a diffuse reflection role, so that the light color transmittance of the LED chip reaches more than 92%, the light attenuation is lower, and the color mixing is more uniform. In addition, by filling with silicon dioxide and high borosilicate, the LED structure is not subject to the risk of mechanical strength deterioration due to environmental changes, thereby increasing the service life of the product.

[0072] In an optional embodiment, a protective coating is provided on the outer side of the LED structure to improve the waterproof property of the product, effectively prevent moisture intrusion, and enhance the reliability of the product.

[0073] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0074] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0075] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0076] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0077] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An LED structure with a built-in IC, characterized in that: include: An insulating seat, which is recessed from the top and forms a reflective cup; A conductive foot, integrally inlaid with the insulating seat, comprising a first conductive foot and a second conductive foot, wherein the first conductive foot is provided with an IC mounting area for mounting an LED driver IC, and the second conductive foot is provided with an LED chip mounting area for mounting an LED chip, and the IC mounting area and the LED chip mounting area are both arranged on the bottom of the reflective cup; The position of the IC mounting area on the reflective cup is lower than the position of the LED chip mounting area on the reflective cup, so that after the LED driver IC is mounted on the IC mounting area, the distance between the end surface of the LED driver IC away from the IC mounting area and the bottom of the reflective cup is equal to a preset distance; The LED structure includes a protective glue composed of a plurality of organic materials and inorganic materials, the LED driver IC is filled on the IC mounting area through the inorganic material, and the protective glue is filled in the reflective cup; The first conductive leg is formed by bending a conductive sheet, and a first groove recessed inwards is provided on the end surface of the first conductive leg to form an IC mounting area, and the depth of the first groove is adapted to the thickness of the LED driver IC; or, The first conductive foot includes a first conductive surface and a second conductive surface, the second conductive surface is bent downward to form the IC mounting area, the depth of the second conductive surface bent downward matches the thickness of the LED driver IC, and a gap is provided between the first conductive surface and the second conductive surface.

2. The LED structure according to claim 1, characterized in that: The inorganic material is one or more of aluminum oxide, magnesium oxide, aluminum nitride, boron nitride, silicon nitride or silicon carbide.

3. The LED structure according to claim 1, characterized in that: The conductive pins further include a third conductive pin having an LED chip fixing area and a fourth conductive pin having a cathode fixing area. The LED chip fixing area and the cathode fixing area are located on the same plane as the LED chip mounting area.

4. The LED structure according to claim 1, characterized in that: The insulating seat is further provided with a first annular groove and a second annular groove, the first annular groove is connected with the reflective cup through the second annular groove, and the depth of the first annular groove is greater than the depth of the second annular groove.

5. An LED structure with a built-in IC, characterized in that: include: An insulating seat, which is recessed from the top and forms a reflective cup; A conductive foot, integrally inlaid with the insulating seat, includes a first conductive foot and a second conductive foot, the first conductive foot is provided with an IC mounting area for mounting an LED driver IC, the second conductive foot is provided with an LED chip mounting area for mounting an LED chip, and the IC mounting area and the LED chip mounting area are both arranged on the bottom of the reflective cup; The position of the IC mounting area on the reflective cup is not higher than the position of the LED chip mounting area on the reflective cup, and the transmission rate of the LED driver IC is 80-150 Kbps; and / or the LED driver IC is filled on the reflective cup in sequence through silicon dioxide and high borosilicate; The LED structure includes a protective glue composed of a plurality of organic materials and inorganic materials, the LED driver IC is filled on the IC mounting area through the inorganic material, and the protective glue is filled in the reflective cup; The first conductive leg is formed by bending a conductive sheet, and a first groove recessed inwards is provided on the end surface of the first conductive leg to form an IC mounting area, and the depth of the first groove is adapted to the thickness of the LED driver IC; or, The first conductive foot includes a first conductive surface and a second conductive surface, the second conductive surface is bent downward to form the IC mounting area, the depth of the second conductive surface bent downward matches the thickness of the LED driver IC, and a gap is provided between the first conductive surface and the second conductive surface.

Images