Signal connection structure based on interference fit and quantum chip packaging box

Abstract

A signal connection structure based on interference fit and a quantum chip packaging box body, the signal connection structure based on interference fit, comprising: a shell, on which a connector mounting hole is provided; a signal connector, used to be installed in the connector mounting hole, comprising a connector shell; wherein the connector shell and the connector mounting hole are in an interference fit state. In extremely low temperature application scenarios, the close contact and light leakage of the connector, the circuit board and the packaging box body are ensured, the connection strength of the connector, the circuit board and the packaging box body is enhanced, and the gap between the connector and the packaging box body is reduced or avoided, effectively ensuring the connection strength of the connector and the packaging box body and the signal quality of the quantum processor.

Description

Technical Field

[0001] The present disclosure belongs to the technical field of integrated circuit packaging, and relates to a signal connection structure based on interference fit and a quantum chip packaging box, in particular to a signal connection structure based on interference fit for connecting a quantum chip with an external signal connector with high reliability at extremely low temperatures (near absolute zero), and a quantum chip packaging box including the signal connection structure. Background Art

[0002] In the implementation of superconducting quantum computing, connecting the quantum processor with the peripheral circuit is an indispensable step. The superconducting quantum processor packaging box is the first-level device connected to the quantum processor. How to connect and fan out the various performance pins of the superconducting quantum processor and ensure that the interference with the signal performance on the line is minimized has become a design problem in the industry.

[0003] No matter how the quantum chip is connected to the first-level connection line, the connection size will eventually be enlarged to a macroscopic acceptable level through a standard or non-standard connector. How to connect the connector to the quantum processor packaging box with high performance and high reliability becomes a problem that needs to be solved.

[0004] The technical difficulty is that the connector that seems to be well connected to the box at room temperature will separate from the material in an extremely low temperature environment due to the different thermal expansion coefficients of the materials, resulting in light leakage (the leakage of a single photon is enough to cause the quantum processor to receive considerable noise), which seriously affects the operation of the quantum processor. On the other hand, the material separation caused by the different thermal expansion coefficients of the materials can easily reduce the connection strength between the connector and the circuit board, and easily cause detachment during the plugging and unplugging of the connector, causing damage to the connector and even the packaging shell.

[0005] In addition, how to ensure the tightness of the connection even at low temperatures is also crucial. Summary of the invention

[0006] 1. Technical issues to be resolved

[0007] The present disclosure provides a signal connection structure and a quantum chip packaging box based on interference fit to at least partially solve the technical problems raised above.

[0008] (II) Technical solution

[0009] One aspect of the present disclosure provides a signal connection structure based on interference fit, comprising: a shell 1, on which a connector mounting hole 8 is provided; a signal connector, used to be installed in the connector mounting hole 8, comprising a connector shell 4; wherein the connector shell 4 and the connector mounting hole 8 are in an interference fit state.

[0010] In some embodiments of the present disclosure, the signal connector further includes: an outer conductor 5, which is arranged at an upper position inside the connector housing 4; an insulator 6, which is arranged at a lower position inside the connector housing 4; and an inner conductor 7, which passes through the inside of the insulator 6.

[0011] In some embodiments of the present disclosure, the signal connection structure is installed on at least one of a top cover or a base of a packaging box body, and the packaging box body is sealed on the outside and has a containing space on the inside.

[0012] In some embodiments of the present disclosure, the signal connection structure serves as two components or one of the components of a packaging box body, which includes a first shell and a second shell. The shapes of opposite sides of the first shell and the second shell are complementary. Connector mounting holes are provided on the first shell and / or the second shell, and the correspondingly installed connector shells are in an interference fit with the connector mounting holes.

[0013] In some embodiments of the present disclosure, the second shell serves as a base, and the first shell serves as a top cover. A boss is provided on the base, and a corresponding groove is provided on the top cover. The depth of the groove is greater than the protruding height of the boss.

[0014] In some embodiments of the present disclosure, the accommodating space is used to place a PCB board, and the PCB board is used to place a quantum chip.

[0015] In some embodiments of the present disclosure, the size of the connector housing 4 and the size of the connector mounting hole 8 are in an interference fit state.

[0016] In some embodiments of the present disclosure, the connector housing 4 and the connector mounting hole 8 are matched in size, and according to the different thermal expansion coefficients of the materials, the materials of the two are set to be in an interference fit state.

[0017] In some embodiments of the present disclosure, the signal connection structure can be used in a working environment of 10 mK to room temperature.

[0018] According to another aspect of the present disclosure, a quantum chip packaging box is provided, wherein the quantum chip packaging box comprises any signal connection structure mentioned in the present disclosure.

[0019] (III) Beneficial effects

[0020] It can be seen from the above technical solutions that the signal connection structure based on interference fit and the quantum chip packaging box provided by the present disclosure have the following beneficial effects:

[0021] 1. By designing the size of the connector shell so that it has an interference fit with the connector mounting hole reserved on the package shell, the connection strength problem between the connector and the circuit board is transferred to the connection between the connector and the mounting hole of the package box body, and different connection strength requirements can be achieved by adjusting the degree of interference fit. Due to the interference fit, no gap will be formed between the connector mounting hole reserved in the package box body and the connector shell, and a light-proof effect is achieved. In this way, in extremely low temperature application scenarios, the close contact and light leakage of the connector, the circuit board and the package box body are guaranteed, the connection strength of the connector, the circuit board and the package box body is enhanced, and the gap between the connector and the package box body is reduced or avoided, effectively ensuring the connection strength between the connector and the package box body and the signal quality of the quantum processor.

[0022] 2. The signal connection structure can be used as the top cover or base of the packaging box or as both the top cover and the base. It can be adaptively set according to the actual signal output needs. The quantum chip packaging box containing the signal connection structure has good signal transmission capability, sealing and connection reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of a signal connection structure based on interference fit according to an embodiment of the present disclosure.

[0024]

Explanation of symbols

[0025] 1-first housing; 2-PCB board;

[0026] 3-second housing; 4-connector housing;

[0027] 5-outer conductor; 6-insulator;

[0028] 7-inner conductor; 8-connector mounting hole. DETAILED DESCRIPTION

[0029] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0030] The signal connection structure based on interference fit disclosed in the present invention can be only Figure 1As shown in the figure, a packaging component of the packaging box body, such as a top cover or a base, the top cover or the base is used for the external output of the electrical signal. Of course, in some embodiments, the signal connection structure can also be used for the packaging of quantum chips, including the overall structure of the package; in other embodiments, when the signal connection structure is used for the packaging of quantum chips, the two corresponding packaging components are the above-mentioned signal connection structure based on interference fit, so that the output of electrical signals can be achieved on both surfaces. Any technical concept that can be applied in an extremely low temperature environment (for example, a minimum temperature of 10mK) based on the interference fit of the connector housing and the connector mounting hole set on the shell is within the protection scope of the present disclosure.

[0031] First embodiment

[0032] In a first exemplary embodiment of the present disclosure, a signal connection structure based on interference fit is provided.

[0033] Figure 1 It is a schematic diagram of a signal connection structure based on interference fit according to an embodiment of the present disclosure.

[0034] Reference Figure 1 As shown, the signal connection structure based on interference fit of the present invention comprises: a shell 1, on which a connector mounting hole 8 is provided; a signal connector, used to be installed in the connector mounting hole 8, comprising a connector shell 4; wherein the connector shell 4 and the connector mounting hole 8 are in an interference fit state.

[0035] In the present disclosure, the signal connection structure is installed on at least one of a top cover or a base of a packaging box body. The packaging box body is sealed on the outside and has a containing space inside for placing a quantum processor, such as a quantum chip.

[0036] Figure 1 The example in the figure shows the case where the signal connection structure based on interference fit of the present embodiment is used as the top cover of the packaging box body. Of course, in other embodiments, the signal connection structure can be used alone as the base of the packaging box body, or when signals are output on both sides of the packaging box body, one signal connection structure is used as the top cover and the other signal connection structure is used as the base. The shell shapes of the two signal connection structures need to be set accordingly, which will be introduced in the following embodiments.

[0037] In this embodiment, the signal connection structure based on interference fit is used for signal transmission of quantum chips and can be used in a working environment of 10mK to room temperature. In particular, it has good connection strength in an extremely low temperature environment and can ensure close contact and no light leakage between the connector and the circuit board and the packaging box.

[0038] In this embodiment, the signal connector further includes: an outer conductor 5 disposed at an upper position inside the connector housing 4; an insulator 6 disposed at a lower position inside the connector housing 4; and an inner conductor 7 passing through the inside of the insulator 6.

[0039] In order to ensure the high-frequency characteristics of signal transmission, the conventional connector and the circuit board are generally connected electrically by surface welding. In order to facilitate the assembly of the package shell, a hole equal to or slightly larger than the size of the connector is reserved on the package box for installation, but this will inevitably form a gap. Moreover, because the connector and the circuit board are welded on a very small surface area, the connection strength is poor and the tensile force that can be withstood is small. It is very easy for the connector and the circuit board to be separated and damaged due to the plug-in and unplug operation between the signal line and the connector. In addition, due to the particularity of the use scenario of the quantum chip package box, it needs to work in an extremely low temperature environment. Therefore, the connector that seems to be well connected to the package box at room temperature will cause material separation, light leakage, and poor connection strength between the connector and the circuit board in an extremely low temperature environment due to the different thermal expansion coefficient characteristics of the material. Because the leakage of a single photon is enough to make the quantum processor receive considerable noise, the traditional assembly process will produce problems such as insufficient connection strength at low temperatures and light leakage affecting the signal-to-noise ratio of the quantum processor.

[0040] The present invention designs the size of the connector shell so that it is in an interference fit with the reserved mounting hole on the packaging shell, thereby transferring the connection strength problem between the connector and the circuit board to the connection between the connector and the mounting hole of the packaging box body, and can achieve different connection strength requirements by adjusting the degree of interference fit. Due to the interference fit, no gap is formed between the reserved hole of the packaging box body and the connector shell, and a light-proof effect is achieved. In this way, in extremely low temperature application scenarios, the close contact and light-proof of the connector, the circuit board and the packaging box body are guaranteed, the connection strength of the connector, the circuit board and the packaging box body is enhanced, and the gap between the connector and the packaging box body is reduced or avoided.

[0041] Of course, in this embodiment, there are many ways to make the connector housing 4 and the connector mounting hole 8 in an interference fit state, such as: the connector housing 4 and the connector mounting hole 8 are matched in size, and according to the different thermal expansion coefficients of the materials, the materials of the two are set to make them in an interference fit state, such as making the thermal expansion coefficient of the material of the shell 1 greater than the material of the connector housing 4, then in the case of extremely low temperature, the shrinkage degree of the connector housing 4 is less than the shrinkage degree of the shell 1, corresponding to the interference fit effect at extremely low temperature, so that the connection gap disappears, and this situation corresponds to the state of interference fit can still be maintained under room temperature environment, so it can be applied regardless of extremely low temperature environment or room temperature environment. For another example: by designing the relative size of the connector housing 4 and the connector mounting hole 8, the connector housing 4 and the connector mounting hole 8 are both in an interference fit state within the use temperature range. And it is also possible to achieve different connection strength requirements by adjusting the degree of interference fit, which has strong practicality. The above adjustment methods can be freely combined, for example, the size or material setting is performed separately, or the material matching is added when the size meets the interference fit to adjust the degree of interference fit.

[0042] Second embodiment

[0043] In a second exemplary embodiment of the present disclosure, a signal connection structure based on interference fit is provided. The signal connection structure of this embodiment has not only a signal connection function but also a chip packaging function.

[0044] The signal connection structure is simultaneously one of two components or one of the components of a packaging box body, which includes a first shell and a second shell. The shapes of opposite sides of the first shell and the second shell are complementary. Connector mounting holes are provided on the first shell and / or the second shell, and the correspondingly installed connector shell is in an interference fit with the connector mounting hole.

[0045] In this embodiment, the signal connection structure based on interference fit is used as the top cover of the packaging box (for example Figure 1 The corresponding packaging box body realizes signal output on the top cover or the base. Compared with the first embodiment, the signal connection structure further includes: a second shell body arranged opposite to the first shell body serving as the top cover or the base, the first shell body and the second shell body form a packaging box body which is sealed externally and has an accommodating space internally, and the accommodating space is used to place the quantum chip.

[0046] That is, the signal connection structure based on interference fit of this embodiment includes: a first shell 1, on which a connector mounting hole 8 is provided; a signal connector, which is used to be installed in the connector mounting hole 8, including a connector shell 4; and a second shell 3, which is arranged opposite to the first shell 1 to form a packaging box body that is sealed on the outside and has an accommodating space on the inside, wherein the connector shell 4 and the connector mounting hole 8 are in an interference fit state.

[0047] Reference Figure 1 As shown, the first shell 1 of this embodiment is exemplified by a top cover, and the second shell 3 is exemplified by a base. The second shell 3 and the first shell 1 have a complementary shape on one side thereof, forming a packaging box body which is sealed on the outside and has a placement space on the inside.

[0048] Among them, the shapes of the first shell (such as the top cover) and the second shell (such as the base) are complementary. In one example, an upward boss is provided on the base for carrying the PCB board and the quantum chip. A groove is provided on the surface of the top cover opposite to the base. The depth of the groove is greater than the protruding height of the boss, which is used to form an accommodating space. The PCB board can be placed in the accommodating space formed above. After the top cover and the base are connected, an externally sealed packaging box body is formed.

[0049] Of course, in other embodiments, the first shell and the second shell may be other types of packaging forms and components, and are not limited to the two parts of the top cover and the base in this embodiment, and can also be expanded and changed on this basis.

[0050] In this embodiment, the packaging box has a placement space for a PCB board inside, and the PCB board is used to place the quantum chip. After the quantum chip and the PCB board are connected with leads, electrical signals are transmitted through the signal connection end of the PCB board and the connector.

[0051] The signal connection structure in this embodiment has not only the signal connection function but also the chip packaging function. Of course, in this embodiment, the signal connection is performed on the first shell 1 as an example. In other embodiments, the signal connection can also be performed on the second shell, that is, a connector mounting hole is set on the second shell and the connector mounting hole and the connector shell to be installed are set in the form of interference fit.

[0052] Third embodiment

[0053] In a third exemplary embodiment of the present disclosure, a signal connection structure based on interference fit is provided. The difference between the signal connection structure of this embodiment and the signal connection structure of the second embodiment is that in this embodiment, the signal connection structure based on interference fit also serves as a top cover of the packaging box body (for example, Figure 1The signal connection structure includes a first shell and a second shell, and the shapes of the first shell and the second shell on opposite sides are complementary. The second shell and the first shell form a sealed package box body with an external seal and an internal accommodation space.

[0054] In this embodiment, connector mounting holes are provided on both the first shell and the second shell, and the connector housing of the connector to be mounted is in an interference fit state with the corresponding connector mounting hole. In this embodiment, both shells (the first shell and the second shell) of the signal connection structure are used for signal transmission, which expands the path of signal output.

[0055] Fourth embodiment

[0056] In a fourth exemplary embodiment of the present disclosure, a quantum chip packaging box is provided, comprising any one of the integrated signal connection structures of the present disclosure.

[0057] The signal connection structure based on interference fit can be used as the top cover or base of the packaging box or as both the top cover and the base. It can be adaptively set according to actual signal output needs. The quantum chip packaging box containing the signal connection structure has good signal transmission capability, sealing and connection reliability.

[0058] In summary, the present disclosure provides a signal connection structure and quantum chip packaging box body with interference fit, by designing the size of the connector shell, so that it is in an interference fit state with the connector mounting hole reserved on the packaging shell, thereby transferring the connection strength problem between the connector and the circuit board to the connection between the connector and the mounting hole of the packaging box body, and different connection strength requirements can be achieved by adjusting the degree of interference fit. Due to the interference fit, the reserved connector mounting hole of the packaging box body and the connector shell will not form a gap, and the light-proof effect is also achieved. In this way, in the application scenario of extremely low temperature, the close contact and light leakage of the connector, the circuit board and the packaging box body are guaranteed, the connection strength of the connector, the circuit board and the packaging box body is enhanced, and the gap between the connector and the packaging box body is reduced or avoided, effectively ensuring the connection strength of the connector and the packaging box body and the signal quality of the quantum processor. In addition, the signal connection structure can be used as the top cover or base of the packaging box body or as both the top cover and the base, and can be adaptively set according to the actual signal output needs. The quantum chip packaging box body containing the signal connection structure has good signal transmission capability, sealing and connection reliability.

[0059] It should be noted that, regardless of room temperature, low temperature or extremely low temperature, as long as the interference fit form or effect is used to ensure close contact and no light leakage under extremely low temperature conditions, it belongs to the protection scope. Moreover, the form of interference fit is not limited to whether it is a design that utilizes different thermal expansion coefficients of different materials or sizes. Any form that can achieve interference fit is within the protection scope of this disclosure.

[0060] It should also be noted that the directional terms mentioned in the embodiments, such as "upper", "lower", "front", "back", "left", "right", etc., are only reference directions of the drawings and are not intended to limit the scope of protection of the present disclosure. The shapes and sizes of the components in the drawings do not reflect the actual size and proportion, but only illustrate the contents of the embodiments of the present disclosure. In addition, in the claims, any reference symbol between brackets should not be constructed as a limitation on the claims.

[0061] The ordinal numbers used in the specification and claims, such as "first", "second", "third", etc., to modify the corresponding elements, do not themselves mean that the element has any ordinal number, nor do they represent the order of one element and another element, or the order of the manufacturing method. The use of these ordinals is only used to make a component with a certain name clearly distinguishable from another component with the same name. Furthermore, the words "comprise" or "include" do not exclude the existence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the existence of multiple such elements. Unless there are technical obstacles or contradictions, the above-mentioned various embodiments of the present disclosure can be freely combined to form additional embodiments, and these additional embodiments are all within the scope of protection of the present disclosure.

[0062] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present disclosure. It should be understood that the above description is only a specific embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. A signal connection structure based on interference fit, characterized in that: include: A housing (1) having a connector mounting hole (8) provided thereon; A signal connector, used to be installed in the connector installation hole (8), comprising a connector housing (4), wherein the signal connection structure is installed on at least one of a top cover or a base of a packaging box body, the packaging box body is sealed on the outside and has a containing space on the inside, the containing space is used to place a PCB board, and the PCB board is used to place a quantum chip; The connector housing (4) and the connector mounting hole (8) are in an interference fit state, so as to ensure close contact between the connector, the circuit board and the packaging box body and prevent light leakage; Among them, the signal connection structure can be used in extremely low temperature working environment near absolute zero; The thermal expansion coefficient of the material of the shell (1) is greater than the thermal expansion coefficient of the material of the connector shell (4), so that under extremely low temperature conditions, the degree of contraction of the connector shell (4) is less than the degree of contraction of the shell (1), so as to maintain the interference fit state.

2. The signal connection structure according to claim 1, characterized in that: The signal connector further comprises: An outer conductor (5) is arranged at an upper position inside the connector housing (4); an insulator (6) arranged at a lower position inside the connector housing (4); and An inner conductor (7) is arranged inside the insulator (6).

3. The signal connection structure according to claim 1, characterized in that: The signal connection structure is simultaneously one of two components or one of the components of a packaging box body, which includes a first shell and a second shell. The shapes of opposite sides of the first shell and the second shell are complementary. Connector mounting holes are provided on the first shell and / or the second shell, and the correspondingly installed connector shell is in an interference fit with the connector mounting hole.

4. The signal connection structure according to claim 3, characterized in that: A boss is arranged on the second shell, and a groove is correspondingly arranged on the first shell, wherein the depth of the groove is greater than the protruding height of the boss.

5. A quantum chip packaging box, characterized in that: A signal connection structure comprising any one of claims 1 to 4.

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