Electronic component cooling device

Abstract

The present invention discloses an electronic component cooling device, which comprises a liquid collecting part, an air collecting part, a heat sink, a fin assembly and a plurality of connecting pipes, wherein the air collecting part is provided with an air collecting cavity; the liquid collecting part is provided with a liquid collecting cavity, and the liquid collecting cavity has a cooling medium; the upper end of the connecting pipe is connected to the air collecting part, the lower end of the connecting pipe is connected to the liquid collecting part, and the connecting pipe is provided with a plurality of flow channels for connecting the air collecting cavity and the liquid collecting cavity; the heat sink is provided with electronic components, and is connected to the lower end of one side end of the connecting pipe, so as to transfer the heat generated by the electrical components to the lower end of the connecting pipe; the fin assembly is connected to the upper end of the other side end of the connecting pipe. The present invention can improve the heat dissipation efficiency, save space, reduce the heat dissipation cost, and can avoid damaging the electronic components and improve the safety of heat dissipation.

Description

Technical Field

[0001] The invention relates to an electronic component cooling device. Background Art

[0002] At present, with the rapid development of graphics card technology, the GPU on the graphics card can already generate heat equivalent to that of the CPU, so the heat dissipation of electronic components is not only for the CPU, but also for high-power chips. At present, the industry mainly uses heat sinks, water-cooled radiators or micro air-conditioning systems to achieve the heat dissipation of electronic components, but the heat dissipation efficiency of heat sinks is low, and there is a risk of leakage and damage to electronic components when water-cooled radiators are in direct contact with electronic components. Micro air-conditioning systems are costly, occupy a large space, and consume a lot of energy. Summary of the invention

[0003] The technical problem to be solved by the present invention is to overcome the defects of the prior art and provide an electronic component cooling device, which can improve heat dissipation efficiency, save space, reduce heat dissipation costs, avoid damage to electronic components, and improve the safety of heat dissipation.

[0004] In order to solve the above technical problems, the technical solution of the present invention is: an electronic component cooling device, which includes a liquid collecting component, a gas collecting component, a heat sink, a fin assembly and a plurality of connecting pipes, wherein:

[0005] The gas collecting component is provided with a gas collecting cavity;

[0006] The liquid collecting component is provided with a liquid collecting cavity, and the liquid collecting cavity contains a cooling medium;

[0007] The upper end of the connecting tube is connected to the gas collecting component, and the lower end of the connecting tube is connected to the liquid collecting component. The connecting tube is provided with a plurality of flow channels for connecting the gas collecting cavity and the liquid collecting cavity.

[0008] The heat sink is mounted with electronic components and is connected to the lower end of one side of the connecting tube so as to transfer the heat generated by the electronic components to the lower end of the connecting tube;

[0009] The fin assembly is connected to the upper end portion of the other side end of the connecting pipe.

[0010] In order to further improve the heat dissipation effect, in the length direction of the connecting pipe, the heat dissipation plate is fitted with the lower half of the connecting pipe, and the fin assembly is fitted with the upper half of the connecting pipe.

[0011] In order to further facilitate the filling of cooling medium, the liquid collecting component is also provided with a filling port connected to the liquid collecting cavity.

[0012] A specific solution of the liquid collecting component is further provided, wherein the liquid collecting component is a liquid collecting pipe with both ends blocked, and the lower end of the connecting pipe is sequentially connected to the liquid collecting pipe along the length direction of the liquid collecting pipe.

[0013] A specific solution of the gas collecting component is further provided, wherein the gas collecting component is a gas collecting pipe with both ends blocked, and the upper end of the connecting pipe is sequentially connected to the gas collecting pipe along the length direction of the gas collecting pipe.

[0014] A specific solution of the connecting pipe is further provided, wherein the connecting pipe is a flat pipe, and the flow channels are arranged in sequence along the width direction of the flat pipe;

[0015] The heat sink is connected to one end of the flat tube in the width direction, and the fin assembly is connected to the other end of the flat tube in the width direction.

[0016] A specific solution of the heat sink is further provided, wherein the heat sink is provided with assembly grooves corresponding to the flat tubes one by one and adapted to the corresponding flat tubes, and one end of the flat tube in the width direction is embedded in the corresponding assembly groove.

[0017] To further improve the heat dissipation effect, in the width direction of the flat tube, the portion of the flat tube embedded in the assembly groove accounts for 1 / 3 of the width of the flat tube.

[0018] A specific solution of the fin assembly is further provided, wherein the fin assembly comprises a plurality of fins;

[0019] The flat tubes are sequentially connected between the liquid collecting component and the gas collecting component, one fin is connected between any two adjacent flat tubes, and the fins are in contact with the other ends of the two flat tubes in the width direction.

[0020] To further improve the heat dissipation effect, in the width direction of the flat tube, the portion where the fins are in contact with the flat tube accounts for 2 / 3 of the width of the flat tube.

[0021] After adopting the above technical scheme, the circulation channels are uniformly arranged in sequence along the width direction of the flat tube. In the width direction of the flat tube, the portion of the flat tube embedded in the assembly groove accounts for 1 / 3 of the width of the flat tube, and the portion of the fins that fit the flat tube accounts for 2 / 3 of the width of the flat tube, so that about 1 / 3 of the circulation channels in the flat tube are located in the assembly groove, and the remaining about 2 / 3 of the circulation channels are located in the fin assembly. The heat generated by the electronic components is transferred to the heat sink, and then to the lower end of the flat tube and the liquid collecting component, so that the cooling medium in the liquid collecting cavity absorbs heat and vaporizes, and then flows from the circulation channel located in the assembly groove to the gas collecting cavity. The fin assembly has a large heat exchange surface area, which accelerates the heat dissipation of the upper end of the flat tube, so that the gaseous cooling medium in the gas collecting cavity is pre-cooled and liquefied, and flows from the circulation channel located in the fin assembly to the liquid collecting cavity under the action of gravity, forming a heat transfer cycle, which plays a role in cooling the electronic components. The entire heat dissipation process does not require energy consumption, which reduces the heat dissipation cost, and has high heat dissipation efficiency, small size, and space saving. In addition, the cooling medium does not come into direct contact with electronic components, avoiding damage to electronic components and improving the safety of heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a right side view of the electronic component cooling device of the present invention;

[0023] Figure 2 It is a front view of the electronic component cooling device of the present invention;

[0024] Figure 3 It is a structural schematic diagram of the electronic component cooling device of the present invention;

[0025] Figure 4 It is a schematic structural diagram of the heat dissipation plate of the present invention. DETAILED DESCRIPTION

[0026] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments in conjunction with the accompanying drawings.

[0027] like Figures 1 to 4 As shown, an electronic component cooling device comprises a liquid collecting component 1, a gas collecting component 2, a heat sink 3, a fin assembly 4 and a plurality of connecting pipes, wherein:

[0028] The gas collecting component 2 is provided with a gas collecting cavity;

[0029] The liquid collecting component 1 is provided with a liquid collecting cavity, and the liquid collecting cavity contains a cooling medium;

[0030] The upper end of the connecting tube is connected to the gas collecting component 2, and the lower end of the connecting tube is connected to the liquid collecting component 1. The connecting tube is provided with a plurality of flow channels 5 for connecting the gas collecting cavity and the liquid collecting cavity.

[0031] The heat sink 3 is mounted with electronic components and is connected to the lower end of one side of the connecting tube so as to transfer the heat generated by the electronic components to the lower end of the connecting tube;

[0032] The fin assembly 4 is connected to the upper end of the other side end of the connecting tube and is used to accelerate the heat dissipation of the upper end of the connecting tube; specifically, the heat generated by the electronic components is transferred to the heat sink 3, and then to the lower end of the connecting tube and the liquid collecting component 1, so that the cooling medium in the liquid collecting cavity absorbs heat and vaporizes, and flows from the flow channel 5 in the connecting tube close to the heat sink 3 to the gas collecting cavity. The fin assembly 4 has a large heat exchange surface area, which accelerates the heat dissipation of the upper end of the connecting tube, so that the gaseous cooling medium in the gas collecting cavity is pre-cooled and liquefied, and flows from the flow channel 5 in the connecting tube close to the fin assembly 4 to the liquid collecting cavity under the action of gravity, forming a heat transfer cycle, which plays a role in cooling the electronic components. The entire heat dissipation process does not require energy consumption, reduces the heat dissipation cost, and has high heat dissipation efficiency, small size, and space saving. Moreover, the cooling medium does not directly contact the electronic components, thereby avoiding damage to the electronic components and improving the safety of heat dissipation.

[0033] like Figure 1 , 2 As shown, in the length direction of the connecting pipe, the heat sink 3 is fitted with the lower half of the connecting pipe, and the fin assembly 4 is fitted with the upper half of the connecting pipe, so as to obtain the best heat dissipation effect.

[0034] like Figure 1 As shown, the liquid collecting component 1 is also provided with a filling port 6 communicated with the liquid collecting chamber so as to fill the cooling medium into the liquid collecting chamber.

[0035] like Figure 1 , 2 As shown, the liquid collecting component 1 can be a liquid collecting pipe with both ends blocked, and the lower end of the connecting pipe is sequentially connected to the liquid collecting pipe along the length direction of the liquid collecting pipe.

[0036] like Figure 1 , 2 As shown, the gas collecting component 2 may be a gas collecting pipe with both ends blocked, and the upper ends of the connecting pipes are sequentially connected to the gas collecting pipe along the length direction of the gas collecting pipe.

[0037] like Figures 1 to 3As shown, the connecting pipe is a flat tube 7, and the flow channels 5 are arranged in sequence along the width direction of the flat tube 7;

[0038] The heat sink 3 is connected to one end of the flat tube 7 in the width direction, and the fin assembly 4 is connected to the other end of the flat tube 7 in the width direction. Specifically, the specific structure of the flat tube 7 is the prior art and is not described in detail in this embodiment. In this embodiment, the flat tube 7 adopts a microchannel aluminum flat tube.

[0039] like Figure 1 , 3 As shown in , 4 , the heat sink 3 is provided with an assembly groove 8 which corresponds to the flat tube 7 one by one and is adapted to the corresponding flat tube 7 , and one end portion of the flat tube 7 in the width direction is embedded in the corresponding assembly groove 8 .

[0040] In this embodiment, in the width direction of the flat tube 7 , the portion of the flat tube 7 embedded in the assembly groove 8 accounts for 1 / 3 of the width of the flat tube 7 , so as to improve the heat dissipation performance.

[0041] like Figures 1 to 3 As shown, the fin assembly 4 includes a plurality of fins 9, and the fins 9 have a large contact area with the air, which can accelerate the transfer of heat to the air;

[0042] The flat tubes 7 are connected in sequence between the liquid collecting component 1 and the gas collecting component 2, and a fin 9 is connected between any two adjacent flat tubes 7. The fin 9 is fitted with the other end portions of the two flat tubes 7 in the width direction. In the present embodiment, the fin 9 is a corrugated fin, and the corrugated fin is made of 0.07 mm aluminum foil.

[0043] like Figure 3 As shown, in the width direction of the flat tube 7, the portion where the fin 9 fits with the flat tube 7 occupies 2 / 3 of the width of the flat tube 7; specifically, the circulation channels 5 are uniformly arranged in sequence along the width direction of the flat tube 7, and in the width direction of the flat tube 7, the portion where the flat tube 7 is embedded in the assembly groove 8 occupies 1 / 3 of the width of the flat tube 7, and the portion where the fin 9 fits with the flat tube 7 occupies 2 / 3 of the width of the flat tube 7, so that about 1 / 3 of the circulation channels 5 in the flat tube 7 are located in the assembly groove 8, and the remaining about 2 / 3 of the circulation channels 5 are located in the fin assembly 4, so as to achieve the best cooling effect, wherein the cooling medium absorbs heat and vaporizes, and flows from the circulation channels 5 located in the assembly groove 8 to the gas collecting cavity, and the gaseous cooling medium is pre-cooled and liquefied, and flows from the circulation channels 5 located in the fin assembly 4 to the liquid collecting cavity.

[0044] In this embodiment, all components are connected by brazing.

[0045] The working principle of the present invention is as follows:

[0046] The circulation channels 5 are uniformly arranged in sequence along the width direction of the flat tube 7. In the width direction of the flat tube 7, the portion of the flat tube 7 embedded in the assembly groove 8 accounts for 1 / 3 of the width of the flat tube 7, and the portion of the fin 9 that fits the flat tube 7 accounts for 2 / 3 of the width of the flat tube 7, so that about 1 / 3 of the circulation channels 5 in the flat tube 7 are located in the assembly groove 8, and the remaining about 2 / 3 of the circulation channels 5 are located in the fin assembly 4. The heat generated by the electronic components is transferred to the heat sink 3, and then to the lower end of the flat tube 7 and the liquid collecting part 1, so that the cooling medium in the liquid collecting cavity absorbs heat and vaporizes, and then flows from the flow channel 5 located in the assembly groove 8 to the gas collecting cavity. The fin assembly 4 has a large heat exchange surface area, which accelerates the heat dissipation of the upper end of the flat tube 7, so that the gaseous cooling medium in the gas collecting cavity is pre-cooled and liquefied, and flows from the flow channel 5 located in the fin assembly 4 to the liquid collecting cavity under the action of gravity, forming a heat transfer cycle, which plays a role in cooling the electronic components. The entire heat dissipation process does not require energy consumption, reduces the heat dissipation cost, and has high heat dissipation efficiency, small size, and saves space. In addition, the cooling medium does not directly contact the electronic components, avoiding damage to the electronic components and improving the safety of heat dissipation.

[0047] The specific embodiments described above further illustrate the technical problems, technical solutions and beneficial effects solved by the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0048] In the description of the present invention, it is necessary to understand that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0049] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0051] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0052] In the present invention, unless otherwise clearly specified and limited, a first feature being above or below a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, a first feature being above, above, and above a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being below, below, and below a second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

Claims

1. An electronic component cooling device, characterized in that: It comprises a liquid collecting component (1), a gas collecting component (2), a heat sink (3), a fin assembly (4) and a plurality of connecting pipes; The gas collecting component (2) is provided with a gas collecting cavity; The liquid collecting component (1) is provided with a liquid collecting cavity, and the liquid collecting cavity contains a cooling medium; The upper end of the connecting tube is connected to the gas collecting component (2), and the lower end of the connecting tube is connected to the liquid collecting component (1), and the connecting tube is provided with a plurality of flow channels (5) for connecting the gas collecting cavity and the liquid collecting cavity; The heat sink (3) is mounted with electronic components and is connected to the lower end of one side of the connecting tube so as to transfer heat generated by the electronic components to the lower end of the connecting tube; The fin assembly (4) is connected to the upper end of the other side end of the connecting pipe; The connecting tube is a flat tube (7), the circulation channels (5) are arranged in sequence along the width direction of the flat tube (7), the heat sink (3) is connected to one end of the flat tube (7) in the width direction, and the fin assembly (4) is connected to the other end of the flat tube (7) in the width direction; The heat dissipation plate (3) is provided with an assembly groove (8) which corresponds one-to-one with the flat tube (7) and is adapted to the corresponding flat tube (7); one end of the flat tube (7) in the width direction is embedded in the corresponding assembly groove (8); The fin assembly (4) comprises a plurality of fins (9), the flat tubes (7) are sequentially connected between the liquid collecting component (1) and the gas collecting component (2), one fin (9) is connected between any two adjacent flat tubes (7), and the fins (9) are in contact with the other ends of the two flat tubes (7) in the width direction; Wherein, in the width direction of the flat tube (7), the portion of the flat tube (7) embedded in the assembly groove (8) accounts for 1 / 3 of the width of the flat tube (7); Wherein, in the width direction of the flat tube (7), the portion where the fin (9) and the flat tube (7) are in contact accounts for 2 / 3 of the width of the flat tube (7).

2. The electronic component cooling device according to claim 1, characterized in that: In the length direction of the connecting pipe, the heat dissipation plate (3) is fitted with the lower half of the connecting pipe, and the fin assembly (4) is fitted with the upper half of the connecting pipe.

3. The electronic component cooling device according to claim 1, characterized in that: The liquid collecting component (1) is also provided with a filling port (6) which is in communication with the liquid collecting chamber.

4. The electronic component cooling device according to claim 1, characterized in that: The liquid collecting component (1) is a liquid collecting pipe with both ends blocked, and the lower end of the connecting pipe is sequentially connected to the liquid collecting pipe along the length direction of the liquid collecting pipe.

5. The electronic component cooling device according to claim 1, characterized in that: The gas collecting component (2) is a gas collecting pipe with both ends blocked, and the upper ends of the connecting pipes are sequentially connected to the gas collecting pipe along the length direction of the gas collecting pipe.

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