A three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface and a manufacturing method thereof

Abstract

The present invention discloses a three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface, comprising: an optical chip, one end of which is provided with an optical interconnection structure and a groove; a conductive through hole, which runs through the optical chip; a first wiring layer, which is arranged on the front side of the optical chip and is electrically connected to the conductive through hole; a second wiring layer, which is arranged on the back side of the optical chip and is electrically connected to the conductive through hole; an electric chip, which is arranged above the front side of the optical chip and is electrically connected to the first wiring layer; a cover plate, which is arranged above the optical interconnection structure and the groove of the optical chip; a plastic sealing layer, which integrally seals the front side of the optical chip, the electric chip and the cover plate; and an external solder ball, which is arranged below the back side of the optical chip and is electrically connected to the second wiring layer.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface and a manufacturing method thereof. Background Art

[0002] As the amount of communication data increases, the transmission rate of optical modules is required to be higher and higher. At present, the standard rate of the next generation of optical interconnection is 56Gbps and 112Gbps. In the case of high-speed interconnection, the transmission loss, crosstalk and reflection caused by the interconnection leads between chips cannot be ignored, and the parasitic inductance of the interconnection leads also greatly affects the performance. Therefore, the interconnection between the optical chip and the electrical chip should be as short as possible, and it is best to use flip-chip soldering to interconnect.

[0003] The current packaging method for optoelectronic chips is to lay the silicon photonic chip and the electric chip flat on the substrate, interconnect them by wire bonding or flip-chip, and not perform plastic sealing. Alternatively, the electric chip is stacked on the silicon photonic chip to form a three-dimensional interconnection structure, and the optical coupling part is still bonded to the electric chip by optical fiber or FA, and the entire package is not plastic sealed.

[0004] With the development of silicon photonics technology, optical devices and electrodes can be simultaneously fabricated on a silicon photonics chip through CMOS technology, and it is relatively easy to interconnect with the electrical chip. Plastic packaging can ensure the reliability of the packaging interconnection. Therefore, people prefer to use a common plastic packaging method to package silicon photonics chips and electrical chips. However, the optical coupling position of the silicon photonics chip cannot be contaminated, and space for coupling needs to be left, which is another problem.

[0005] In view of the problems that the existing optoelectronic chip packaging methods have, such as the inability to perform plastic sealing, poor reliability of packaging interconnection, large packaging area and poor performance, the present invention proposes a three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface and a manufacturing method thereof. The electrical chip and the optical chip are stacked and then plastic sealed, which ensures the reliability of the packaging interconnection, while realizing optical coupling of the optical chip, achieving shorter electrical interconnection and smaller packaging area, thereby achieving higher performance. Summary of the invention

[0006] In view of the problems that existing optoelectronic chip packaging methods have, such as the inability to perform plastic packaging, poor reliability of packaging interconnection, large packaging area, and poor performance, according to one embodiment of the present invention, a three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface is provided, including:

[0007] An optical chip, one end of which has an optical interconnection structure and a groove;

[0008] A conductive through hole, wherein the conductive through hole passes through the optical chip;

[0009] A first wiring layer, which is disposed on the front side of the optical chip and is electrically connected to the conductive through hole;

[0010] A second wiring layer, the second wiring layer is disposed on the back side of the optical chip and is electrically connected to the conductive through hole;

[0011] an electrical chip, the electrical chip being disposed above the front surface of the optical chip and electrically connected to the first wiring layer;

[0012] A cover plate, the cover plate being disposed above the optical interaction structure and the groove of the optical chip;

[0013] A plastic sealing layer, wherein the plastic sealing layer integrally seals the front surface of the optical chip, the electrical chip and the cover plate; and

[0014] An external solder ball is disposed below the back surface of the optical chip and is electrically connected to the second wiring layer.

[0015] In one embodiment of the present invention, one end of the cover plate leaks out from the plastic packaging layer, and together with the optical interconnection structure and the groove, forms a hollow optical coupling structure.

[0016] In one embodiment of the present invention, the optical chip is a laser or a modulator or a detector or an integrated optical chip with an optical interconnection structure.

[0017] In one embodiment of the present invention, the optical interconnection structure is a grating, a spot converter or a waveguide structure.

[0018] In one embodiment of the present invention, the electric chip is flip-chip soldered on the first wiring layer; or the electric chip is face-mounted on the front side of the optical chip and then electrically connected to the first wiring layer through wire bonding.

[0019] In one embodiment of the present invention, the hollow optical coupling structure is further provided with an optical fiber coupling efficiency enhancement structure coupled to the optical interconnection structure.

[0020] In one embodiment of the present invention, the optical fiber coupling efficiency enhancement structure is a lens or an isolator.

[0021] In another embodiment of the present invention, a method for manufacturing a three-dimensional optoelectronic chip packaging structure with an optical interconnection interface is provided, comprising:

[0022] An optical interconnection structure is formed at the position where optical coupling is required for the optical chip wafer, and a groove is made between two adjacent chips;

[0023] Prepare metal vias and rewiring layers on optical chip wafers;

[0024] Assembling the electrical chip and cover plate on the top surface of the optical chip wafer;

[0025] Plastic seal the top surface of the optical chip wafer;

[0026] forming external solder balls below the wiring layer on the back side of the optical chip wafer; and

[0027] Segmentation forms a single package structure.

[0028] In another embodiment of the present invention, the step of preparing metal vias and a rewiring layer on an optical chip wafer further comprises:

[0029] Forming a blind hole from the front side of the optical chip wafer downward;

[0030] forming a metal via fill within the blind hole;

[0031] Thinning the back side of the optical chip wafer to achieve back side leakage of the conductive vias;

[0032] forming a wiring layer on the front side of the optical chip wafer; and

[0033] A wiring layer is formed on the back side of the optical chip.

[0034] In another embodiment of the present invention, the top surface of the optical chip wafer is assembled with an electric chip by flip-chip soldering the electric chip on the wiring layer, or by face-mounting the electric chip on the front surface of the optical chip and then electrically connecting it to the wiring layer through wire bonding.

[0035] The present invention provides a three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface and a manufacturing method thereof. First, an optical interconnection structure and a groove are made at the edge of a silicon photonic chip; next, a metal through hole is formed in the silicon photonic chip that penetrates the upper and lower surfaces, and a wiring layer electrically connected to the metal through hole is formed on the upper and lower surfaces; then, an electric chip and a cover plate patch are stacked on the silicon photonic chip, and a hollow optical coupling structure is formed between the cover plate; next, the packaging structure on the upper surface of the silicon photonic chip is plastic-sealed, and an external solder ball electrically connected to the wiring layer on the lower surface of the silicon photonic chip is formed, thereby forming a three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface. The three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface based on the present invention adopts plastic sealing after stacking the electric chip and the optical chip, which ensures the reliability of the packaging interconnection, and can also realize the optical coupling of the optical chip, realize shorter electrical interconnection, and smaller packaging area, thereby realizing higher performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to further illustrate the above and other advantages and features of various embodiments of the present invention, a more specific description of various embodiments of the present invention will be presented with reference to the accompanying drawings. It will be understood that these drawings only depict typical embodiments of the present invention and are therefore not to be considered as limiting the scope thereof. In the accompanying drawings, for clarity, identical or corresponding parts will be represented by identical or similar reference numerals.

[0037] Figure 1 A cross-sectional schematic diagram of a three-dimensional optoelectronic chip packaging structure 100 with an optical interconnection interface according to an embodiment of the present invention is shown.

[0038] Figure 2 A cross-sectional schematic diagram 200 is shown of optical coupling between the optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface and an external optical fiber according to an embodiment of the present invention.

[0039] FIG. 3A to FIG. 3F A schematic cross-sectional diagram of a process for forming the optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface according to an embodiment of the present invention is shown.

[0040] Figure 4 A flow chart 400 for forming the optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface according to an embodiment of the present invention is shown.

[0041] Figure 5 A cross-sectional schematic diagram of a three-dimensional optoelectronic chip packaging structure 500 with an optical interconnection interface according to yet another embodiment of the present invention is shown.

[0042] Figure 6 A cross-sectional schematic diagram 600 is shown of optical coupling between the optoelectronic chip three-dimensional packaging structure 500 with an optical interconnection interface and an external optical fiber according to another embodiment of the present invention.

[0043] Figure 7 A cross-sectional schematic diagram of a three-dimensional optoelectronic chip packaging structure 700 with an optical interconnection interface according to yet another embodiment of the present invention is shown.

[0044] Figure 8 A cross-sectional schematic diagram 800 is shown of optical coupling between the optoelectronic chip three-dimensional packaging structure 700 with an optical interconnection interface and an external optical fiber according to yet another embodiment of the present invention. DETAILED DESCRIPTION

[0045] In the following description, the present invention is described with reference to various embodiments. However, those skilled in the art will recognize that various embodiments may be implemented without one or more specific details or with other replacement and / or additional methods, materials or components. In other cases, well-known structures, materials or operations are not shown or described in detail to avoid obscuring aspects of various embodiments of the present invention. Similarly, for the purpose of explanation, specific quantities, materials and configurations are set forth to provide a comprehensive understanding of embodiments of the present invention. However, the present invention may be implemented without specific details. In addition, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.

[0046] In this specification, reference to "one embodiment" or "the embodiment" means that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present invention. The phrase "in one embodiment" appearing in various places in this specification does not necessarily all refer to the same embodiment.

[0047] It should be noted that the embodiments of the present invention describe the process steps in a specific order, but this is only for the convenience of distinguishing the steps, and does not limit the sequence of the steps. In different embodiments of the present invention, the sequence of the steps can be adjusted according to the process adjustment.

[0048] The present invention provides a three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface and a manufacturing method thereof. First, an optical interconnection structure and a groove are made at the edge of a silicon photonic chip; next, a metal through hole is formed in the silicon photonic chip that penetrates the upper and lower surfaces, and a wiring layer electrically connected to the metal through hole is formed on the upper and lower surfaces; then, an electric chip and a cover plate patch are stacked on the silicon photonic chip, and a hollow optical coupling structure is formed between the cover plate; next, the packaging structure on the upper surface of the silicon photonic chip is plastic-sealed, and an external solder ball electrically connected to the wiring layer on the lower surface of the silicon photonic chip is formed, thereby forming a three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface. The three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface based on the present invention adopts plastic sealing after stacking the electric chip and the optical chip, which ensures the reliability of the packaging interconnection, and can also realize the optical coupling of the optical chip, realize shorter electrical interconnection, and smaller packaging area, thereby realizing higher performance.

[0049] Combine the following Figure 1 A three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface according to an embodiment of the present invention is described in detail. Figure 1 FIG. 1 is a cross-sectional schematic diagram of a three-dimensional optoelectronic chip packaging structure 100 with an optical interconnection interface according to an embodiment of the present invention. Figure 1As shown, the optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface further includes an optical chip 110, a conductive through hole 120, a first wiring layer 130, a second wiring layer 140, an electrical chip 150, a cover plate 160, a plastic layer 170, an external solder ball 180, an optical interconnection structure 111 and an optical coupling structure 190.

[0050] The optical chip 110 may be an active optoelectronic chip such as a laser, a modulator, a detector, or an optoelectronic integrated chip of multiple structures, and its material may be a silicon optical chip or an indium, gallium, arsenic, phosphorus compound semiconductor material or silicon carbide, silicon nitride material. An optical interconnection structure 111 is also provided at the edge of the optical chip 110, and the optical interconnection structure 111 may be a grating, a pattern spot converter, or a waveguide structure.

[0051] The conductive via 120 is disposed through the optical chip 110. In one embodiment of the present invention, the conductive via 120 is a standard TSV conductive via, and the via filling material is metal copper formed by electroplating.

[0052] The first wiring layer 130 is disposed above the optical chip 110 and is electrically connected to the conductive via 120 to achieve redistribution of the chip pad position. In one embodiment of the present invention, the first wiring layer 130 can be a single-layer wiring layer or a multi-layer wiring layer, and a dielectric layer is also disposed between the same-layer wiring layers and between adjacent layers of metal to play an insulating and protective role.

[0053] The second wiring layer 140 is disposed below the optical chip 110 and is electrically connected to the conductive via 120. An external pad is disposed on the outermost wiring layer. In one embodiment of the present invention, the second wiring layer 140 is similar to the first wiring layer 130 and can also be a single-layer wiring layer or a multi-layer wiring layer. A dielectric layer is also disposed between the wiring layers of the same layer and between adjacent layers of metal to play an insulating and protective role.

[0054] The electrical chip 150 is a chip related to the optical chip 110 and needs to be interconnected, including a driver chip, an amplifier chip, a signal processing chip, an ASIC chip, a power chip, etc. The electrical chip 150 is assembled on the first wiring layer 130 on the upper surface of the optical chip by flip-chip bonding or wire bonding.

[0055] The cover plate 160 is fixedly disposed above the optical interconnect structure 111 at the edge of the optical chip 110. In one embodiment of the present invention, the cover plate 160 may be made of glass, silicon, organic material, or the like.

[0056] The plastic encapsulation layer 170 covers the upper surface of the optical chip 110 , and encapsulates the first wiring layer 130 , the electrical chip 150 and the cover plate 160 .

[0057] The external solder balls 180 are disposed on the external solder pads of the second wiring layer 140 below the optical chip 110. In one embodiment of the present invention, the external solder balls 180 may be BGA solder balls formed by a ball implantation process, or may be conductive copper pillars.

[0058] The optical coupling structure 190 is a hollow structure, which is composed of the groove at the edge of the optical chip 110, the optical interconnection structure 111 and the cover plate 160. It is used to align and connect with the external optical fiber to realize the function of optical coupling.

[0059] Figure 2 A cross-sectional schematic diagram 200 is shown of optical coupling between the optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface and an external optical fiber according to an embodiment of the present invention. Figure 2 As shown, the structure 200 for optically coupling the optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface with an external optical fiber further includes an optoelectronic chip three-dimensional packaging structure 210 / 100 with an optical interconnection interface, a substrate 220, an optical fiber 230, and an optical fiber coupler 240. The optoelectronic chip three-dimensional packaging structure 210 / 100 with an optical interconnection interface and the optical fiber coupler 240 are fixedly arranged on the substrate 220, and the optical fiber 230 is aligned and coupled to the optical coupling structure 190 of the optoelectronic chip three-dimensional packaging structure 210 / 100 with an optical interconnection interface through the optical fiber coupler 240, so as to achieve a highly efficient optical signal coupling connection.

[0060] Combine the following FIG. 3A to FIG. 3F as well as Figure 4 A method for forming the optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface according to an embodiment of the present invention will be described in detail. FIG. 3A to FIG. 3F A schematic cross-sectional diagram of a process for forming the optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface according to an embodiment of the present invention is shown; Figure 4 A flow chart 400 for forming the optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface according to an embodiment of the present invention is shown.

[0061] First, in step 410, Figure 3A As shown, an optical interconnection structure is formed at the position where the optical chip wafer needs to be optically coupled, and a groove is made between two adjacent chips. The optical interconnection structure can be a grating, a pattern spot converter or a waveguide structure; the groove is formed by etching according to the setting and is part of the optical coupling structure of the packaging structure.

[0062] Next, at step 420, Figure 3BAs shown, metal vias and rewiring layers are prepared on the optical chip wafer. In a specific embodiment of the present invention, a blind hole is formed from the front side of the optical chip wafer downward by laser via, mechanical via or etching via process, and then a metal via is filled by electroplating, and then the back side of the optical chip wafer is thinned to achieve back leakage of the conductive via, and then the wiring layers on the front and back sides are manufactured. In another embodiment of the present invention, the wiring layers on the front and back sides of the optical chip wafer can be single-layer or multi-layer.

[0063] Then, in step 430, if Figure 3C As shown, the electric chip and the cover plate are assembled on the top surface of the optical chip wafer. In one embodiment of the present invention, the electric chip is welded and mounted on the top surface of the optical chip wafer by flip-chip welding or wire bonding process, and is electrically connected to the wiring layer, and further electrically connected to the metal through-hole inside the optical chip. The cover plate can be fixedly arranged at the corresponding position above the groove of the optical chip by bonding, bonding and other processes.

[0064] Next, at step 440, if Figure 3D As shown, the top surface of the optical chip wafer is plastic-sealed. The plastic-sealing layer covers the upper surface of the optical chip, and covers the top wiring layer, the electrical chip and the cover plate.

[0065] Then, in step 450, if Figure 3E As shown, external solder balls are formed below the wiring layer on the back side of the optical chip wafer. In one embodiment of the present invention, bumps or conductive copper pillars can be formed by electroplating, or BGA solder balls can be formed by ball planting process.

[0066] Finally, at step 460, if Figure 3F As shown, the segmentation forms a single package structure.

[0067] Next, combine Figure 5 A three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface according to another embodiment of the present invention is described in detail. Figure 5 FIG. 5 is a cross-sectional schematic diagram of a three-dimensional optoelectronic chip packaging structure 500 with an optical interconnection interface according to another embodiment of the present invention. Figure 5 As shown, the optoelectronic chip three-dimensional packaging structure 500 with an optical interconnection interface further includes an optical chip 510, a conductive through hole 520, a first wiring layer 530, a second wiring layer 540, an electrical chip 550, a cover plate 560, a plastic layer 570, an external solder ball 580, an optical interconnection structure 511 and an optical coupling structure 590.

[0068] The optoelectronic chip three-dimensional packaging structure 500 with an optical interconnection interface is different from the aforementioned optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface only in that the shape of the cover plate 560 is different, resulting in a different shape of the optical coupling structure.

[0069] Figure 6 A cross-sectional schematic diagram 600 is shown of optical coupling between the optoelectronic chip three-dimensional packaging structure 500 with an optical interconnection interface and an external optical fiber according to another embodiment of the present invention. Figure 6 As shown, the structure 600 for optically coupling the optoelectronic chip three-dimensional packaging structure 500 with an optical interconnection interface and the external optical fiber further comprises an optoelectronic chip three-dimensional packaging structure 610 / 500 with an optical interconnection interface, a substrate 620, an optical fiber 630, and an optical fiber coupler 640. The optoelectronic chip three-dimensional packaging structure 610 / 500 with an optical interconnection interface and the optical fiber coupler 640 are fixedly arranged on the substrate 620, and the optical fiber 630 is aligned to the optical coupling structure 590 of the optoelectronic chip three-dimensional packaging structure 610 / 500 with an optical interconnection interface through the optical fiber coupler 640, but does not enter the optical coupling structure 590, so as to achieve a high-efficiency optical signal coupling connection.

[0070] Next, combine Figure 7 A three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface according to yet another embodiment of the present invention will be described in detail. Figure 7 FIG. 2 is a cross-sectional schematic diagram of a three-dimensional optoelectronic chip packaging structure 700 with an optical interconnection interface according to yet another embodiment of the present invention. Figure 7 As shown, the optoelectronic chip three-dimensional packaging structure 700 with an optical interconnection interface further includes an optical chip 710, a conductive through hole 720, a first wiring layer 730, a second wiring layer 740, an electrical chip 750, a cover plate 760, a plastic encapsulation layer 770, an external solder ball 780, an optical interconnection structure 711, an optical coupling structure 790 and an optical fiber coupling efficiency enhancement structure 795.

[0071] The optoelectronic chip three-dimensional packaging structure 700 with an optical interconnection interface is different from the aforementioned optoelectronic chip three-dimensional packaging structure 100 with an optical interconnection interface only in that a fiber coupling efficiency enhancement structure 795 is added to the optical coupling structure 790, and the fiber coupling efficiency enhancement structure 795 can be a lens or an isolator.

[0072] Figure 8 A cross-sectional schematic diagram 800 is shown of optical coupling between the optoelectronic chip three-dimensional packaging structure 700 with an optical interconnection interface and an external optical fiber according to another embodiment of the present invention. Figure 8As shown, the structure 800 for optically coupling the optoelectronic chip three-dimensional packaging structure 700 with an optical interconnection interface and the external optical fiber further comprises the optoelectronic chip three-dimensional packaging structure 810 / 700 with an optical interconnection interface, a substrate 820, an optical fiber 830, and an optical fiber coupler 840. The optoelectronic chip three-dimensional packaging structure 810 / 700 with an optical interconnection interface and the optical fiber coupler 840 are fixedly arranged on the substrate 820, and the optical fiber 830 is aligned to the optical fiber coupling efficiency enhancement structure 795 and the optical coupling structure 790 of the optoelectronic chip three-dimensional packaging structure 810 / 700 with an optical interconnection interface through the optical fiber coupler 840, but does not enter the optical coupling structure 790, so as to achieve a high-efficiency optical signal coupling connection.

[0073] Based on the three-dimensional packaging structure of the optoelectronic chip with an optical interconnection interface and its manufacturing method provided by the present invention, first, an optical interconnection structure and a groove are made on the edge of the silicon photonic chip; next, a metal through hole penetrating the upper and lower surfaces is formed in the silicon photonic chip, and a wiring layer electrically connected to the metal through hole is formed on the upper and lower surfaces; then, the electric chip and the cover plate patch are stacked on the silicon photonic chip, and a hollow optical coupling structure is formed between the cover plate; next, the packaging structure on the upper surface of the silicon photonic chip is plastic-sealed, and an external solder ball electrically connected to the wiring layer on the lower surface of the silicon photonic chip is formed, thereby forming a three-dimensional packaging structure of the optoelectronic chip with an optical interconnection interface. The three-dimensional packaging structure of the optoelectronic chip with an optical interconnection interface based on the present invention adopts the method of plastic-sealing after stacking the electric chip and the optical chip, which ensures the reliability of the packaging interconnection, and at the same time can realize the optical coupling of the optical chip, realize shorter electrical interconnection, and smaller packaging area, thereby realizing higher performance.

[0074] Although various embodiments of the present invention are described above, it should be understood that they are presented as examples only and not as limitations. It is obvious to those skilled in the relevant art that various combinations, modifications and changes can be made thereto without departing from the spirit and scope of the present invention. Therefore, the breadth and scope of the present invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should only be defined according to the attached claims and their equivalents.

Claims

1. A three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface, comprising: An optical chip, one end of which has an optical interconnection structure and a groove; A conductive through hole, wherein the conductive through hole passes through the optical chip; A first wiring layer, which is disposed on the front side of the optical chip and is electrically connected to the conductive through hole; A second wiring layer, the second wiring layer is disposed on the back side of the optical chip and is electrically connected to the conductive through hole; an electrical chip, the electrical chip being disposed above the front surface of the optical chip and electrically connected to the first wiring layer; A cover plate, the cover plate being arranged above the optical interconnection structure and the groove of the optical chip; A plastic sealing layer, wherein the plastic sealing layer integrally seals the front surface of the optical chip, the electrical chip and the cover plate; as well as an external solder ball, the external solder ball being arranged below the back surface of the optical chip and electrically connected to the second wiring layer, One end of the cover plate leaks out from the plastic packaging layer, and together with the optical interconnection structure and the groove, forms a hollow optical coupling structure.

2. The optoelectronic chip three-dimensional packaging structure with an optical interconnection interface according to claim 1, characterized in that: The optical chip is a laser or a modulator or a detector or an integrated optical chip with an optical interconnection structure.

3. The optoelectronic chip three-dimensional packaging structure with an optical interconnection interface according to claim 1, characterized in that: The optical interconnection structure is a grating, a spot converter or a waveguide structure.

4. The optoelectronic chip three-dimensional packaging structure with an optical interconnection interface according to claim 1, characterized in that: The electric chip is flip-chip soldered on the first wiring layer; or the electric chip is face-up mounted on the front surface of the optical chip and then electrically connected to the first wiring layer through wire bonding.

5. The optoelectronic chip three-dimensional packaging structure with an optical interconnection interface according to claim 1, characterized in that: The hollow optical coupling structure is also provided with an optical fiber coupling efficiency enhancement structure coupled to the optical interconnection structure.

6. The optoelectronic chip three-dimensional packaging structure with an optical interconnection interface according to claim 5, characterized in that: The optical fiber coupling efficiency enhancement structure is a lens or an isolator.

7. A method for manufacturing a three-dimensional packaging structure of an optoelectronic chip with an optical interconnection interface, comprising: An optical interconnection structure is formed at the position where optical coupling is required for the optical chip wafer, and a groove is made between two adjacent chips; Prepare metal vias and rewiring layers on optical chip wafers; Assembling the electrical chip and cover plate on the top surface of the optical chip wafer; Plastic sealing is performed on the top surface of the optical chip wafer to form a plastic sealing layer; forming external solder balls below the wiring layer on the back side of the optical chip wafer; as well as Divide into a single package structure, One end of the cover plate leaks out from the plastic packaging layer, and together with the optical interconnection structure and the groove, forms a hollow optical coupling structure.

8. The method for manufacturing the optoelectronic chip three-dimensional packaging structure with an optical interconnection interface according to claim 7, characterized in that: The step of preparing metal vias and a rewiring layer on the optical chip wafer further comprises: Forming a blind hole from the front side of the optical chip wafer downward; forming a metal via fill within the blind hole; Thinning the back side of the optical chip wafer to achieve back side leakage of the conductive vias; forming a wiring layer on the front side of the optical chip wafer; and A wiring layer is formed on the back side of the optical chip.

9. The method for manufacturing the optoelectronic chip three-dimensional packaging structure with an optical interconnection interface according to claim 7, characterized in that: The electrical chip is assembled on the top surface of the optical chip wafer by flip-chip welding the electrical chip on the wiring layer, or by face-mounting the electrical chip on the front surface of the optical chip and then electrically connecting it to the wiring layer through wire bonding.

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