A FPC circuit board bending device

Abstract

The present invention provides a FPC circuit board bending assembly, including a support platform; a position adjustment mechanism, the position adjustment mechanism is fixedly arranged on the support platform; a micro-rolling die mechanism, the micro-rolling die mechanism is fixedly connected to the position adjustment mechanism, and the micro-rolling die mechanism is linked to the position adjustment mechanism for position adjustment; a bottom mold mechanism, the bottom mold mechanism is fixedly arranged on the support platform, and the bottom mold mechanism is located below the micro-rolling die mechanism; the material is roll-formed by the cooperation between the micro-rolling die mechanism and the bottom mold mechanism; a profiling die pressing mechanism, the profiling die pressing mechanism is fixedly arranged on the support platform, and the front end of the material is pressed by the profiling die pressing mechanism. The advantages of the present invention are: the design principle of multiple rolling bending by needle rollers can fundamentally avoid many problems caused by the die pressing method, such as damage to the FPC circuit board, rebound after bending, etc.

Description

Technical Field

[0001] The invention relates to the field of FPC circuit board production, and in particular to a FPC circuit board bending assembly. Background Art

[0002] With the rapid development of science and technology, among electrical components, the application of FPC (flexible printed circuit board) in high-tech products such as smart phones and smart computers has gradually increased. FPC is a highly reliable and extremely flexible printed circuit board. FPC has the characteristics of high wiring density, light weight, thin thickness and good bendability.

[0003] In order to better utilize the internal space of the product and optimize the product structure, the FPC circuit board can be partially bent according to needs. However, due to its flexible characteristics, the bending action is hindered. Currently, most of the bending actions are performed manually. When the quantity is large, some semi-automatic equipment such as die pressing will be used for bending.

[0004] However, the manual bending method is extremely inefficient and can no longer meet the actual use needs. The existing semi-automatic die pressing equipment uses upper and lower pressing films for bending, and the upper and lower pressing film method not only has the risk of breaking the bending part, but also has the problem of bending rebound; therefore, it is urgent to develop an FPC circuit board equipment that can avoid breaking or rebounding of the bending part. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a bending part assembly of an FPC circuit board, through which the problem of bending part breakage or bending rebound existing in the existing semi-automatic die pressing equipment can be solved.

[0006] The present invention is implemented as follows: a FPC circuit board bending assembly, the bending assembly comprising:

[0007] a support platform;

[0008] a position adjustment mechanism, the position adjustment mechanism being fixedly mounted on the support platform;

[0009] a micro-roller mold mechanism, the micro-roller mold mechanism is fixedly connected to the position adjustment mechanism, and the micro-roller mold mechanism is linked to the position adjustment mechanism for position adjustment;

[0010] A bottom mold mechanism, the bottom mold mechanism is fixedly mounted on the support platform and is located below the micro-rolling mold mechanism; the micro-rolling mold mechanism and the bottom mold mechanism cooperate with each other to roll-form the material;

[0011] A profiling die pressing mechanism is fixed on the support platform and presses the front end of the material.

[0012] Furthermore, the bending device also includes:

[0013] A control device is fixedly arranged inside the support platform, and the position adjustment mechanism, the bottom mold mechanism and the contour mold pressing mechanism are all electrically connected to the control device.

[0014] Furthermore, the position adjustment mechanism comprises:

[0015] a first horizontal slide, wherein the first horizontal slide is fixed on the support platform through a first bottom support frame;

[0016] a vertical slide, the vertical slide being fixedly connected to the sliding end of the first horizontal slide, and being linked to the vertical slide by the first horizontal slide to move horizontally;

[0017] a first L-shaped plate, the upper portion of which is fixedly connected to the sliding end of the vertical slide, and the first L-shaped plate is linked to the vertical slide to move vertically;

[0018] A first adjustment plate, wherein two ends of the lower horizontal surface of the first L-shaped plate are respectively provided with an arc-shaped slot hole, and the first adjustment plate is locked to the bottom of the first L-shaped plate through the arc-shaped slot hole;

[0019] A second adjusting plate, the upper end of which is fixedly connected to the front end of the first adjusting plate, and the lower part of which is ring-shaped with a plurality of fixing holes.

[0020] Furthermore, the micro-rolling mold mechanism comprises:

[0021] a third adjusting plate, the third adjusting plate being locked on the fixing hole;

[0022] A rolling die fixing plate, the rolling die fixing plate is located below the third adjustment plate; an optical axis insertion hole is respectively provided at both ends of the rolling die fixing plate, and a linkage piece is provided at the middle of the upper surface of the rolling die fixing plate;

[0023] Two optical axes, the upper end of each optical axis passes through the optical axis insertion hole and is fixedly connected to the linkage sheet;

[0024] A floating plate, the floating plate is located below the rolling mold fixing plate; a spring is sleeved on the lower end of each optical axis, and the bottom of the optical axis is fixedly connected to the floating plate;

[0025] A rolling die support, the rolling die support is fixedly arranged at the bottom of the floating plate; both ends of the rolling die support are respectively provided with an extension part extending downward; each of the extension parts is fixedly provided with a miniature bearing;

[0026] A roller needle, two ends of which are respectively sleeved with the two miniature bearings.

[0027] Furthermore, the micro-rolling mold mechanism also includes:

[0028] Two cover plates, each of the extension parts is provided with a step hole; the micro bearing is embedded in the step hole from the outer end of the extension part, and the cover plate covers the outer end of the extension part.

[0029] Furthermore, the bottom mold mechanism comprises:

[0030] a second L-shaped plate, the second L-shaped plate being fixedly mounted on the support platform;

[0031] a second horizontal slide, the second horizontal slide being fixedly mounted on one vertical side of the second L-shaped plate;

[0032] A lifting cylinder, the back of which is fixedly connected to the sliding end of the second horizontal slide, and the lifting cylinder is linked to the second horizontal slide to move horizontally;

[0033] a third L-shaped plate, the lower end of which is fixedly connected to the movable end of the lifting cylinder;

[0034] A manual translation platform, the manual translation platform is fixedly mounted on a horizontal plane at the upper end of the third L-shaped plate;

[0035] a movable plate, the movable plate is fixedly connected to the manual translation platform, and the movable plate is manually translated by the manual translation platform;

[0036] At least one bottom mold is fixed on the upper surface of the movable plate.

[0037] Furthermore, the profiling die pressing mechanism comprises:

[0038] a second bottom support frame, the second bottom support frame being fixedly mounted on the support platform;

[0039] a fourth L-shaped plate, the third L-shaped plate being fixedly mounted on the second bottom support frame;

[0040] a profiling cylinder, the profiling cylinder being vertically fixed to the front end of the fourth L-shaped plate, with the movable end of the profiling cylinder facing downward;

[0041] An adapter block, the adapter block is fixedly connected to the movable end of the profiling cylinder, and the adapter block is linked to move up and down by the profiling cylinder;

[0042] A profiling mold is fixed on the adapter block.

[0043] The advantages of the present invention are:

[0044] 1. The design principle of multiple rolling and bending by needle rollers is adopted. The bending section of the FPC circuit board can be rolled and bent multiple times through the cooperation of the position adjustment mechanism, micro-rolling die mechanism, bottom die mechanism and contour die clamping mechanism. This can fundamentally avoid many problems caused by the die pressing method, such as damage to the FPC circuit board, rebound after bending, etc.

[0045] 2. Multiple bottom molds can be set on the bottom mold mechanism, so that different bottom molds can be selected according to the material error during the specific implementation, which helps to improve the qualified rate of finished products after bending;

[0046] 3. After manually fine-tuning the micro-rolling die mechanism, the FPC circuit board can be automatically rolled and bent through the cooperation of the position adjustment mechanism, the micro-rolling die mechanism, the bottom die mechanism and the contour die clamping mechanism, so the degree of automation is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The present invention will be further described below in conjunction with embodiments with reference to the accompanying drawings.

[0048] Figure 1 It is an overall structural diagram of a FPC circuit board bending assembly of the present invention.

[0049] Figure 2 The present invention is a structural schematic diagram of a position adjustment mechanism for a bending portion of an FPC circuit board.

[0050] Figure 3 It is a partial enlarged view of a micro-rolling die mechanism in the bending assembly of an FPC circuit board of the present invention.

[0051] Figure 4 The present invention is a structural schematic diagram of a contour mold pressing mechanism in the assembly of a bending part of an FPC circuit board.

[0052] Figure 5 The present invention is a schematic structural diagram of a bottom layer mold mechanism in a FPC circuit board bending assembly.

[0053] Figure 6 It is a schematic diagram of material bending according to the present invention.

[0054] Figure 7 The invention discloses a circuit principle block diagram of a bending part of an FPC circuit board.

[0055] Description of reference numerals:

[0056] 100-bending assembly, 200-material, 300-jig, 1-support table, 2-position adjustment mechanism, 21-first horizontal slide, 22-first bottom support frame, 23-vertical slide, 24-first L-shaped plate, 25-first adjustment plate, 251-arc slot, 26-second adjustment plate, 261-fixing hole, 3-micro roller die mechanism, 31-third adjustment plate, 32-roller die fixing plate, 321-optical axis socket, 322-linkage plate, 33-optical axis, 34-floating plate, 35-spring, 36-rolling mold bracket, 361-extension part, 362-step hole, 37-miniature bearing, 38-needle roller, 39-cover plate, 4-bottom mold mechanism, 41-second L-shaped plate, 42-second horizontal slide, 43-lifting cylinder, 44-third L-shaped plate, 45-manual translation table, 46-movable plate, 47-bottom mold, 5-contact mold clamping mechanism, 51-second bottom support frame, 52-fourth L-shaped plate, 53-contact cylinder, 54-adapter block, 55-contact mold, 6-control device. DETAILED DESCRIPTION

[0057] Please refer to Figures 1 to 7 As shown, a preferred embodiment of a FPC circuit board bending assembly 100 of the present invention, the bending assembly 100 comprises:

[0058] A support platform 1, which is used to support the entire bending device 100;

[0059] a position adjustment mechanism 2, the position adjustment mechanism 2 is fixedly mounted on the support platform 1, and the position adjustment mechanism 2 is used to achieve position adjustment;

[0060] A micro-roller mold mechanism 3, wherein the micro-roller mold mechanism 3 is fixedly connected to the position adjustment mechanism 2, and the micro-roller mold mechanism 3 is linked to the position adjustment mechanism 2 to adjust the position;

[0061] A bottom mold mechanism 4, the bottom mold mechanism 4 is fixed on the support platform 1, and the bottom mold mechanism 4 is located below the micro-rolling mold mechanism 3; the micro-rolling mold mechanism 3 and the bottom mold mechanism 4 cooperate with each other to roll-form the material 200 (i.e., the FPC circuit board);

[0062] A profiling die pressing mechanism 5 is fixed on the support platform 1 and presses the front end of the material 200 (ie, the FPC circuit board) through the profiling die pressing mechanism 5 .

[0063] In the specific implementation, the material 200 needs to be placed on a jig 300, and the jig 300 is arranged at a position between the micro-rolling die mechanism 3, the bottom mold mechanism 4 and the contour mold clamping mechanism 5. Specifically, the bottom mold mechanism 4 is located below the jig 300, so that the required lower mold is provided by the bottom mold mechanism 4; the micro-rolling die mechanism 3 and the contour mold clamping mechanism 5 are located above the jig 300, so that the front end of the material 200 placed on the jig 300 is clamped by the contour mold clamping mechanism 5, and the bending part of the material 200 placed on the jig 300 is roll-formed by the micro-rolling die mechanism 3.

[0064] In the present invention, the bending device 100 further includes:

[0065] A control device 6, wherein the control device 6 is fixedly arranged inside the support platform 1, and the position adjustment mechanism 2, the bottom mold mechanism 4 and the contour mold clamping mechanism 5 are all electrically connected to the control device 1, so that the position adjustment mechanism 2, the bottom mold mechanism 4 and the contour mold clamping mechanism 5 are controlled by the control device 6 to work automatically, thereby improving the degree of automation.

[0066] In the present invention, please focus on Figure 2 As shown, the position adjustment mechanism 2 includes:

[0067] A first horizontal slide 21, wherein the first horizontal slide 21 is fixed on the support platform 1 through a first bottom support frame 22;

[0068] a vertical slide 23, the vertical slide 23 is fixedly connected to the sliding end of the first horizontal slide 21, and the vertical slide 23 is moved horizontally by the first horizontal slide 21 to achieve horizontal adjustment; in a specific implementation, the first horizontal slide 21 and the vertical slide 23 are both electrically connected to the control device 6, so that the control device 6 controls the operation of the first horizontal slide 21 and the vertical slide 23;

[0069] a first L-shaped plate 24, the upper portion of which is fixedly connected to the sliding end of the vertical slide 23, and the first L-shaped plate 24 is linked to the vertical slide 23 to move vertically, so as to achieve vertical adjustment;

[0070] A first adjustment plate 25, wherein both ends of the lower horizontal surface of the first L-shaped plate 25 are provided with an arc-shaped slot hole 251, and the first adjustment plate 25 is locked to the bottom of the first L-shaped plate 24 through the arc-shaped slot hole 251. In a specific implementation, the first adjustment plate 25 can be locked to the bottom of the second L-shaped plate 24 by bolts or screws; the arc-shaped slot hole 251 is used to rotate and adjust along the arc direction by manual fine adjustment when necessary;

[0071] A second adjustment plate 26, the upper end of which is fixedly connected to the front end of the first adjustment plate 25, and the lower part of the second adjustment plate 26 is provided with a plurality of fixing holes 261, and the fixing holes 261 are used to achieve angular adjustment in the circumferential direction.

[0072] When the position adjustment mechanism 2 is used in practice, the control device 6 can be used to control the first horizontal slide 21 to adjust the micro-roller mold mechanism 3 in the horizontal direction, and control the vertical slide 23 to adjust the micro-roller mold mechanism 3 in the vertical direction; at the same time, the first adjustment plate 25 can be manually adjusted to achieve fine rotation adjustment of the micro-roller mold mechanism 3 in the arc direction, and the position of the fixing hole 261 on the second adjustment plate 26 can be manually adjusted to achieve circumferential angle adjustment of the micro-roller mold mechanism 3.

[0073] In the present invention, please focus on Figure 2 and Figure 3 As shown, the micro-rolling die mechanism 3 includes:

[0074] a third adjustment plate 31, wherein the third adjustment plate 31 is locked on the fixing hole 261. In a specific implementation, the angle adjustment in the circumferential direction can be achieved by adjusting the position where the third adjustment plate 31 is locked on the fixing hole 261;

[0075] A rolling die fixing plate 32, the rolling die fixing plate 32 is located below the third adjustment plate 31; an optical axis insertion hole 321 is respectively provided at both ends of the rolling die fixing plate 32, and a linkage piece 322 is provided in the middle of the upper surface of the rolling die fixing plate 32;

[0076] Two optical axes 33, the upper end of each optical axis 33 passes through the optical axis insertion hole 321 and is fixedly connected to the linkage piece 322;

[0077] A floating plate 34, the floating plate 34 is located below the rolling die fixing plate 32; a spring 35 is sleeved on the lower end of each optical axis 33, and the bottom of the optical axis 33 is fixedly connected to the floating plate 34; during operation, under the action of the spring 35, the floating plate 34 can float in the up and down directions;

[0078] A rolling mold bracket 36, the rolling mold bracket 36 is fixedly mounted on the bottom of the floating plate 34; both ends of the rolling mold bracket 36 are respectively provided with an extension portion 361 extending downward; each of the extension portions 361 is fixedly provided with a micro bearing 37;

[0079] A needle roller 38, two ends of which are respectively sleeved with the two micro bearings 37. When working, the needle roller 38 can be used to roll and form the material 200 (ie, the FPC circuit board).

[0080] The micro-rolling die mechanism 3 also includes:

[0081] Two cover plates 39 are provided with a step hole 362 on each of the extension portions 361; the micro bearing 37 is embedded in the step hole 362 from the outer end of the extension portion 361, and the cover plate 39 is covered on the outer end of the extension portion 361 to achieve the entire micro bearing 37 being enclosed inside the extension portion 361.

[0082] In the present invention, please focus on Figure 5 As shown, the bottom mold mechanism 4 includes:

[0083] a second L-shaped plate 41, wherein the second L-shaped plate 41 is fixed on the support platform 1;

[0084] a second horizontal slide 42, the second horizontal slide 42 being fixedly arranged on a vertical side of the second L-shaped plate 41; in a specific implementation, the second horizontal slide 42 is electrically connected to the control device 6, so as to control the operation of the second horizontal slide 42 through the control device 6;

[0085] a lifting cylinder 43, the back of which is fixedly connected to the sliding end of the second horizontal slide 42, and the lifting cylinder 43 is linked to the second horizontal slide 42 to move horizontally; in a specific implementation, the lifting cylinder 43 is electrically connected to the control device 6, so that the lifting cylinder 43 can be controlled to work through the control device 6;

[0086] a third L-shaped plate 44, the lower end of which is fixedly connected to the movable end of the lifting cylinder 43;

[0087] A manual translation platform 45, the manual translation platform 45 is fixedly mounted on the horizontal plane of the upper end of the third L-shaped plate 44; the manual translation platform 45 is used for manual translation, and the manual translation platform 45 is a common manual translation component in the prior art, and will not be described in detail here;

[0088] a movable plate 46, wherein the movable plate 46 is fixedly connected to the manual translation platform 45, and the movable plate 46 is manually translated by the manual translation platform 45;

[0089] At least one bottom mold 47 is fixed on the upper surface of the movable plate 46. In a specific implementation, a plurality of different bottom molds 47 can be set at the front end of the upper surface of the movable plate 46 to facilitate selection of different bottom molds 47 according to the error of the material 200.

[0090] In the present invention, please focus on Figure 4 As shown, the profiling die pressing mechanism 5 comprises:

[0091] a second bottom support frame 51, wherein the second bottom support frame 51 is fixed on the support platform 1;

[0092] a fourth L-shaped plate 52, wherein the fourth L-shaped plate 52 is fixedly mounted on the second bottom support frame 51;

[0093] a profiling cylinder 53, the profiling cylinder 53 is vertically fixed to the front end of the fourth L-shaped plate 52, and the movable end of the profiling cylinder 53 is downward; in a specific implementation, the profiling cylinder 53 is electrically connected to the control device 6, so that the control device 6 controls the operation of the profiling cylinder 53;

[0094] An adapter block 54, the adapter block 54 is fixedly connected to the movable end of the profiling cylinder 53, and the adapter block 54 is linked to move up and down by the profiling cylinder 53;

[0095] A profiling mold 55 is fixed on the transfer block 54 .

[0096] When the profiling die pressing mechanism 5 is working, the control device 6 controls the profiling cylinder 53 to link the profiling die 55 to descend, and makes the profiling die 55 reach the front half of the bending section of the material 200 (i.e., the FPC circuit board), that is, to press the front half of the bending section of the FPC circuit board.

[0097] In addition, it should be noted that: in the prior art, the implementation procedures for controlling the operation of various cylinders, slides, etc. through the control device 6 (such as a PLC controller) are well known to those skilled in the art and can be directly obtained from the prior art during specific implementation without the need for creative labor.

[0098] The working principle of the bending device 100 of the present invention is as follows:

[0099] Please refer to Figure 6As shown, when the material 200 (i.e., the FPC circuit board) needs to be bent, the material 200 needs to be placed on the jig 300 first; then, the control device 6 controls the profiling cylinder 53 to link the profiling mold 55 to descend, and makes the profiling mold 55 reach the front half of the bending section of the material 200; then, the control device 6 controls the lifting cylinder 43 to lift the selected bottom mold 47 to the specified position, and at the same time controls the position adjustment mechanism 2 to link the needle roller 38 on the micro-rolling mechanism 3 to descend, and cooperate with the bottom mold 47 to roll the material 200 into shape; in order to prevent the material from rebounding, the control device 6 can control the position adjustment mechanism 2 to link the needle roller 38 to perform multiple rolling, and ensure that the material 200 stops rolling only after there is no rebound; after the rolling is completed, the control device 6 controls the profiling mold 55, the bottom mold 47 and the needle roller 38 to return to their positions.

[0100] In summary, the present invention has the following advantages:

[0101] 1. The design principle of multiple rolling and bending by needle rollers is adopted. The bending section of the FPC circuit board can be rolled and bent multiple times through the cooperation of the position adjustment mechanism, micro-rolling die mechanism, bottom die mechanism and contour die clamping mechanism. This can fundamentally avoid many problems caused by the die pressing method, such as damage to the FPC circuit board, rebound after bending, etc.

[0102] 2. Multiple bottom molds can be set on the bottom mold mechanism, so that different bottom molds can be selected according to the material error during the specific implementation, which helps to improve the qualified rate of finished products after bending;

[0103] 3. After manually fine-tuning the micro-rolling die mechanism, the FPC circuit board can be automatically rolled and bent through the cooperation of the position adjustment mechanism, the micro-rolling die mechanism, the bottom die mechanism and the contour die clamping mechanism, so the degree of automation is high.

[0104] Although the specific implementation modes of the present invention are described above, those skilled in the art should understand that the specific implementation modes described are only illustrative and are not intended to limit the scope of the present invention. Equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A FPC circuit board bending assembly, characterized in that: The bending assembly comprises: a support platform; a position adjustment mechanism, the position adjustment mechanism being fixedly mounted on the support platform; a micro-roller mold mechanism, the micro-roller mold mechanism is fixedly connected to the position adjustment mechanism, and the micro-roller mold mechanism is linked to the position adjustment mechanism for position adjustment; A bottom mold mechanism, the bottom mold mechanism is fixedly mounted on the support platform and is located below the micro-rolling mold mechanism; the micro-rolling mold mechanism and the bottom mold mechanism cooperate with each other to roll-form the material; a profiling die pressing mechanism, the profiling die pressing mechanism is fixedly mounted on the support platform and presses the front end of the material through the profiling die pressing mechanism; A control device, the control device is fixedly arranged inside the support platform, and the position adjustment mechanism, the bottom mold mechanism and the contour mold pressing mechanism are all electrically connected to the control device; The position adjustment mechanism comprises: a first horizontal slide, wherein the first horizontal slide is fixed on the support platform through a first bottom support frame; A vertical slide, which is fixedly connected to the sliding end of the first horizontal slide and is linked to the vertical slide by the first horizontal slide to move horizontally; a first L-shaped plate, the upper portion of which is fixedly connected to the sliding end of the vertical slide, and the first L-shaped plate is linked to the vertical slide to move vertically; A first adjustment plate, wherein two ends of the lower horizontal surface of the first L-shaped plate are respectively provided with an arc-shaped slot hole, and the first adjustment plate is locked to the bottom of the first L-shaped plate through the arc-shaped slot hole; A second adjusting plate, the upper end of which is fixedly connected to the front end of the first adjusting plate, and the lower part of which is ring-shaped with a plurality of fixing holes.

2. The FPC circuit board bending assembly according to claim 1, characterized in that: The micro-rolling die mechanism comprises: a third adjusting plate, the third adjusting plate being locked on the fixing hole; A rolling die fixing plate, the rolling die fixing plate is located below the third adjustment plate; an optical axis insertion hole is respectively provided at both ends of the rolling die fixing plate, and a linkage piece is provided at the middle of the upper surface of the rolling die fixing plate; Two optical axes, the upper end of each optical axis passes through the optical axis insertion hole and is fixedly connected to the linkage sheet; A floating plate, the floating plate is located below the rolling mold fixing plate; a spring is sleeved on the lower end of each optical axis, and the bottom of the optical axis is fixedly connected to the floating plate; A rolling die support, the rolling die support is fixedly arranged at the bottom of the floating plate; both ends of the rolling die support are respectively provided with an extension part extending downward; each of the extension parts is fixedly provided with a miniature bearing; A roller needle, two ends of which are respectively sleeved with the two miniature bearings.

3. The FPC circuit board bending assembly according to claim 2, characterized in that: The micro-rolling die mechanism also includes: Two cover plates, each of the extension parts is provided with a step hole; the micro bearing is embedded in the step hole from the outer end of the extension part, and the cover plate covers the outer end of the extension part.

4. The FPC circuit board bending assembly according to claim 1, characterized in that: The bottom mold mechanism comprises: a second L-shaped plate, the second L-shaped plate being fixedly mounted on the support platform; a second horizontal slide, the second horizontal slide being fixedly mounted on one vertical side of the second L-shaped plate; A lifting cylinder, the back of which is fixedly connected to the sliding end of the second horizontal slide, and the lifting cylinder is linked to the second horizontal slide to move horizontally; a third L-shaped plate, the lower end of which is fixedly connected to the movable end of the lifting cylinder; A manual translation platform, the manual translation platform is fixedly mounted on a horizontal plane at the upper end of the third L-shaped plate; a movable plate, the movable plate is fixedly connected to the manual translation platform, and the movable plate is manually translated by the manual translation platform; At least one bottom mold is fixed on the upper surface of the movable plate.

5. The FPC circuit board bending assembly according to claim 4, characterized in that: The profiling die pressing mechanism comprises: a second bottom support frame, the second bottom support frame being fixedly mounted on the support platform; a fourth L-shaped plate, the third L-shaped plate being fixedly mounted on the second bottom support frame; a profiling cylinder, the profiling cylinder being vertically fixed to the front end of the fourth L-shaped plate, with the movable end of the profiling cylinder facing downward; An adapter block, the adapter block is fixedly connected to the movable end of the profiling cylinder, and the adapter block is linked to move up and down by the profiling cylinder; A profiling mold is fixed on the adapter block.

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