A manual cutting device for wafers and glass sheets
By designing a manual cutting device including a base, a rotating table and a top cover, the clamping structure of the rotating table and slides can achieve accurate clamping and cutting of samples, the problem of large and low precision in the prior art is solved. , provides a high-precision, inexpensive cutting solution suitable for laboratory use.
Patent Information
- Application Number
- CN202010028358.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-01-10
- Publication Date
- 2025-01-10
- Estimated Expiration
- 2040-01-10
AI Technical Summary
The existing wafer cutting devices are large and not suitable for manual operation, and are not accurate enough to meet the needs of accurate and micro sample cutting in the laboratory.
A manual cutting device including a base, a rotating table and a top cover is designed. The clamping structure of the rotating table and slide is combined with a locking mechanism to achieve accurate clamping and cutting of the sample. The core component is made of non-magnetic 316L stainless steel to support it. The components are made of weak magnetic 304 stainless steel, which has high strength and wear resistance.
It provides a small, convenient and high-precision cutting device suitable for laboratory use, can accurately cut wafers and glass sheets, reducing experimental costs, and is suitable for scientific researchers engaged in research in related fields.
Smart Images

Figure CN111136813B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of wafer cutting, and in particular to a manual cutting device for wafers and glass sheets. Background Art
[0002] For many people engaged in research in materials science and condensed matter physics, it is crucial to prepare a single crystal epitaxial film with novel properties. In order to save costs, the existing laboratory sample preparation tends to be miniaturized. It is a common method in the laboratory to split the same film grown on a single crystal substrate into two or several pieces for different performance characterizations. In the cutting process, corresponding cutting devices are required to ensure accuracy and convenience, but some existing cutting devices are relatively large and suitable for batch cutting, and the accuracy is not enough. The research and development of cutting schemes or devices that are urgently needed by scientific researchers engaged in such work is particularly important. Summary of the invention
[0003] Purpose of the invention: The present invention aims to overcome the defects of the prior art and provide a manual cutting device for wafers and glass sheets.
[0004] Technical solution: A manual cutting device for wafers and glass sheets, comprising a base, a rotating table and a top cover, wherein the base has a groove, the rotating table can rotate in the groove, the rotating table has a placement area, the top cover has a top cover through hole, and the rotating table also has a locking mechanism for locking the relative position of the rotating table and the base.
[0005] Furthermore, the top end of the groove has a step portion, and the top cover can be placed on the step portion.
[0006] Furthermore, the top cover is a rectangle with rounded corners.
[0007] Furthermore, the top cover through hole at the top cover is a long strip through hole.
[0008] Optionally, the top cover through hole is a rectangular through hole, and preferably, the length of the through hole is greater than 5 times the width.
[0009] Optionally, the top cover through hole is a long straight-edge through hole.
[0010] Furthermore, a fixed shaft is provided in the groove, and the rotating table is fixed to the fixed shaft via a bearing.
[0011] Furthermore, the locking mechanism is a fixing screw, and the fixing screw passes through the rotating table to lock the relative position of the rotating table and the base.
[0012] Furthermore, the placement area has a first protrusion on one side and a second protrusion on the other side, and the two ends of the placement area respectively have a slide and a slide fixing unit that locks the relative position of the slide and the placement area, the second protrusion has a notch, the notch has a pin unit passing through the notch, and the pin unit has a pin fixing unit that locks the relative position of the pin unit and the placement area.
[0013] Further, the slide has a through slot, and the slide fixing unit is a slide fixing screw passing through the through slot of the slide; the ejector unit has a through slot, and the ejector fixing unit is an ejector fixing screw passing through the through slot of the ejector unit; the rotating table has a first threaded hole cooperating with the slide fixing screw and a second threaded hole cooperating with the ejector fixing screw.
[0014] Further, the first protrusion has a straight side, the second protrusion has a straight side, and the straight side of the first protrusion is parallel to the straight side of the second protrusion.
[0015] Furthermore, the first protrusion and the second protrusion both have scales.
[0016] Furthermore, the second protrusion is a strip-shaped protrusion, and the first protrusion has a straight edge and an arc-shaped edge.
[0017] Furthermore, the rotating table is cylindrical.
[0018] Beneficial effects: The cutting device of the present invention is small in size and convenient for laboratory use. The cutting operation is easy to use and the cutting precision is high. In addition, the core components of the device (rotating table, slide, slide needle, top cover) are made of non-magnetic 316L stainless steel (not limited to 316L stainless steel), and the base and other supporting components (base, cutting pen holder) are made of weakly magnetic 304 stainless steel (not limited to 304 stainless steel), which has the characteristics of high strength, wear resistance, stability, etc. The present invention has a certain degree of targeted use and provides a precise and inexpensive cutting solution for people engaged in research in related fields. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 is a schematic diagram of a cutting device;
[0020] Figure 2 It is a schematic diagram of the cutting step operation;
[0021] Figure 3 The images are XRR (X-ray reflection) and XRD (X-ray diffraction) data before and after cutting. DETAILED DESCRIPTION
[0022] Figure numerals: 1 base; 1.1 fixed shaft; 2 bearing; 3 slide; 3.1 slide fixing screw; 4 ejector; 4.1 ejector fixing screw; 5 top cover; 5.1 top cover through hole; 7 rotating table; 7.1 first protrusion; 7.2 second protrusion; 7.3 locking mechanism.
[0023] Combination Figure 1 , 2 A manual cutting device for wafers and glass sheets comprises a base 1, a rotating table 7 and a top cover 5, wherein the base has a groove, the rotating table 7 can rotate in the groove, the rotating table 7 has a placement area, the top cover 5 has a top cover through hole 5.1, and the rotating table 7 also has a locking mechanism 7.3 for locking the relative position of the rotating table 7 and the base 1.
[0024] The top of the groove has a step portion, and the top cover 5 can be placed on the step portion. The top cover 5 is a rectangle with rounded corners. The top cover through hole at the top cover 5 is a long strip through hole 5.1. A fixed shaft 1.1 is provided in the groove, and the rotating table 7 is fixed to the fixed shaft through a bearing 2. The locking mechanism 7.3 is a fixing screw, and the fixing screw passes through the rotating table to lock the relative position of the rotating table and the base. One side of the placement area has a first protrusion 7.1, and the other side has a second protrusion 7.2. The two ends of the placement area respectively have a slide 3 and a slide fixing unit 3.1 that locks the relative position of the slide and the placement area. The second protrusion 7.2 has a notch, and the notch has an ejector unit 4 that passes through the notch, and the ejector unit 4 has an ejector fixing unit 4.1 that locks the relative position of the ejector unit and the placement area. The slide 3 has a through slot, and the slide fixing unit is a slide fixing screw 3.1 passing through the through slot of the slide; the ejector unit 4 has a through slot, and the ejector fixing unit is an ejector fixing screw 4.1 passing through the through slot of the ejector unit; the rotating table 7 has a first threaded hole matched with the slide fixing screw 3.1 and a second threaded hole matched with the ejector fixing screw 4.1. The first protrusion 7.1 has a straight edge, and the second protrusion 7.2 has a straight edge, and the straight edge of the first protrusion is parallel to the straight edge of the second protrusion. The first protrusion 7.1 and the second protrusion 7.2 both have scales.
[0025] In addition, the base 1 is square, which is convenient for aligning square samples. A standard hole is set below the base 1 to fix it to the optical platform for more stable operation. The connection between the base 1 and the top cover 5 adopts a square and round combination sinking mode, which can not only fix the direction of the top cover, but also avoid the situation that the milling cutter cannot process strict right angles in production operations, and save production costs while also having a certain aesthetic feeling. The center of the base is a boss (or fixed axis) used to connect the bearing and the rotating table. The rotating table has a threaded through hole, which can be fixed at a specific angle with a fixing screw. The rotating table, the slide, and the ejector together constitute a set of fixtures for precisely clamping the sample. The top cover through hole 5.1 is a long strip through hole. The top cover through hole 5.1 acts as a slide rail for the cutting pen tip, which is consistent with the diameter of the cutting pen tip and is directly opposite to the center of the rotating table. The cutting pen uses diamond as the pen tip and can be widely used for cutting various crystals and glass samples.
[0026] The present invention is a cutting device for single crystal epitaxial films or small glass sheets prepared in a laboratory, and the specific implementation steps are as follows (taking four square samples as an example):
[0027] 1) First, place the square sample on the rotating table and fix the sample to the center position using the scales on the rotating table and the slide;
[0028] 2) Secondly, tighten the slide fixing screw and the ejector fixing screw to clamp the sample firmly;
[0029] 3) Again, adjust the angle of the rotating table and lock the rotating table with the rotating table fixing screws;
[0030] 4) Again, put the top cover on;
[0031] 5) Again, insert the cutting pen into the long hole of the top cover, touch the surface of the sample, and adjust the strength;
[0032] 6) Again, cut the sample along the long hole;
[0033] 7) Again, take out the sample and separate it into two pieces with appropriate force or rotate the top cover 90° to continue the cutting operation.
[0034] The following is a specific cutting example: a 5*5mm single crystal epitaxial film sample is cut, and the XRR and XRD images before and after cutting are compared (using a 9kW multifunctional rotating target diffractometer from Rigaku SmartLab series). Figure 3 As shown, from the XRR, the oscillation peaks of the film remain the same after cutting, indicating that the roughness and thickness have not changed, and the damage to the sample surface by the present invention is almost non-existent. From the XRD, the oscillation peaks of the film sample have not changed, and the peak intensity has not changed. The present invention is effective for cutting high-quality epitaxial films.
[0035] Although the present invention has been illustrated and described with respect to the preferred embodiments, it will be appreciated by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.
Claims
1. A manual cutting device for wafers and glass sheets, characterized in that: The utility model comprises a base, a rotating table and a top cover, wherein the base has a groove, the rotating table can rotate in the groove, the rotating table has a placement area, the top cover has a top cover through hole, and the rotating table also has a locking mechanism for locking the relative position of the rotating table and the base; one side of the placement area has a first protrusion, and the other side has a second protrusion, both ends of the placement area respectively have a slide and a slide fixing unit for locking the relative position of the slide and the placement area, the second protrusion has a notch, the notch has an ejector unit passing through the notch, and the ejector unit has an ejector fixing unit for locking the relative position of the ejector unit and the placement area.
2. The manual cutting device for wafers and glass sheets according to claim 1, characterized in that: The top end of the groove has a stepped portion, and the top cover can be placed on the stepped portion.
3. The manual cutting device for wafers and glass sheets according to claim 2, characterized in that: The top cover is a rectangle with rounded corners.
4. The manual cutting device for wafers and glass sheets according to claim 1, characterized in that: The top cover through hole at the top cover is a long strip through hole.
5. The manual cutting device for wafers and glass sheets according to claim 1, characterized in that: A fixed shaft is arranged in the groove, and the rotating platform is fixed to the fixed shaft via a bearing.
6. The manual cutting device for wafers and glass sheets according to claim 1, characterized in that: The locking mechanism is a fixing screw, which passes through the rotating table to lock the relative position of the rotating table and the base.
7. The manual cutting device for wafers and glass sheets according to claim 1, characterized in that: The slide has a through slot, and the slide fixing unit is a slide fixing screw passing through the through slot of the slide; the ejector unit has a through slot, and the ejector fixing unit is an ejector fixing screw passing through the through slot of the ejector unit; the rotating table has a first threaded hole that cooperates with the slide fixing screw and a second threaded hole that cooperates with the ejector fixing screw.
8. The manual cutting device for wafers and glass sheets according to claim 1, characterized in that: The first protrusion has a straight side, the second protrusion has a straight side, and the straight side of the first protrusion is parallel to the straight side of the second protrusion.
9. The manual cutting device for wafers and glass sheets according to claim 1, characterized in that: The first protrusion and the second protrusion both have scales thereon.
Citation Information
Patent Citations
Size-adjustable silicon wafer cutting device and operation method thereof
CN110216800A
Manual cutting device for wafers and glass sheets
CN211762657U