Crystal oscillator chip mounting device and crystal oscillator chip mounting method

Abstract

The present invention provides a crystal oscillator chip loading device and a crystal oscillator chip loading method, including: a chip loading mechanism for chip loading; a crystal oscillator loading mechanism for crystal oscillator loading; a first turntable mechanism for receiving the crystal oscillator from the crystal oscillator loading mechanism, and transferring the crystal oscillator to the chip after the crystal oscillator is glued, and also for transferring the chip after the crystal oscillator is loaded; a second turntable mechanism for receiving the chip from the chip loading mechanism, and also for loading the chip to the first turntable mechanism; a glue dispensing mechanism for dispensing glue on the crystal oscillator and the crystal oscillator after the chip is loaded; a detection mechanism for detecting the crystal oscillator after the glue is dispensed and the crystal oscillator after the chip is glued; and a feeding mechanism for unloading the crystal oscillator loaded with the chip from a swing plate. The crystal oscillator chip loading device and the crystal oscillator chip loading method provided by the present invention have high precision in glue dispensing and loading, fast speed, stable quality, and can greatly improve productivity.

Description

Technical Field

[0001] The present invention belongs to the technical field of crystal oscillator manufacturing, and more specifically, relates to a crystal oscillator chip mounting device and a crystal oscillator chip mounting method. Background Art

[0002] A tiny quartz crystal resonator is called a crystal oscillator for short. A crystal element that adds a chip inside the package to form an oscillation circuit is called a crystal oscillator. Its products are generally packaged in metal shells, but there are also glass shells, ceramics or plastic packages. In this era of electronics and electrical appliances, the demand for crystal oscillators is increasing. However, at this stage, many crystal oscillators are still manually glued to the crystal oscillator by dispensing glue, which is inefficient, has high labor costs, and requires operators to have skilled craftsmanship. For mass production companies, this method has low production efficiency and unstable product quality. Summary of the invention

[0003] The purpose of the present invention is to provide a crystal oscillator chip mounting device to solve the technical problems of low production efficiency and unstable production quality caused by manual dispensing in the prior art.

[0004] To achieve the above object, the technical solution adopted by the present invention is: to provide a crystal oscillator chip carrying device, comprising:

[0005] A chip loading mechanism, used for loading chips;

[0006] Crystal oscillator feeding mechanism, used for crystal oscillator feeding;

[0007] The first turntable mechanism is used to receive the crystal oscillator from the crystal oscillator feeding mechanism, and transfer the crystal oscillator to the chip after the crystal oscillator is glued, and is also used to transfer the chip after the crystal oscillator is loaded;

[0008] a second turntable mechanism, used for receiving chips from the chip loading mechanism, and also for loading chips onto the first turntable mechanism;

[0009] Glue dispensing mechanism, used for dispensing glue on the crystal oscillator and the crystal oscillator with the chip mounted;

[0010] A testing mechanism, used to test the crystal oscillator after dispensing and the crystal oscillator after dispensing with glue after mounting the chip; and

[0011] The unloading mechanism is used to unload the crystal oscillator plate carrying the chip.

[0012] In one embodiment, the chip loading mechanism includes a material box mechanism, which includes at least one material box, a lifting assembly, a material picking assembly and a translation assembly, wherein one of the material boxes is placed at the moving end of the lifting assembly, the material box includes a plurality of stacked and spaced material trays, the material trays have a plurality of chip accommodating cavities for placing chips, the lifting assembly is used to lift the material box for the material picking assembly to pick up materials, and the translation assembly is used to transfer an empty material box from which the chips have been taken.

[0013] In one embodiment, the material box mechanism also includes a support frame, which includes a base frame and an upper frame. The translation assembly is arranged on the base frame to transfer an empty material box placed on the base frame, and the material picking assembly is fixed to the upper frame to grab a material tray in the material box suspended above the base frame.

[0014] In one embodiment, the lifting assembly includes a lifting motor, a lead screw driven by the lifting motor, a lead screw slider connected to the lead screw, and a carrier plate fixed to the lead screw slider, and the material box is placed on the carrier plate.

[0015] In one embodiment, the chip loading mechanism also includes a swinging plate mechanism for receiving the chip tray from the material picking component, the swinging plate mechanism includes an XY moving module, a clamp that moves with the XY moving module and is used to limit the tray, and a pushing component for fixing the tray, the clamp is arranged on one side of the second turntable mechanism, so that the pressing mechanism on the second turntable mechanism drives the suction nozzle to grab the chip from the tray of the clamp.

[0016] In one embodiment, the first turntable mechanism includes a first rotating drive member and a first turntable driven to rotate by the first rotating drive member, the first turntable has at least eight workstations, each of which has a placement table for placing a crystal oscillator, wherein the eight workstations are a crystal oscillator loading station, a first dispensing station, a first detection station, a first loading station, a loading detection station, a second dispensing station, a second detection station and a unloading station arranged in sequence; the discharge port of the crystal oscillator loading mechanism is arranged at the crystal oscillator loading station, the number of the dispensing mechanisms is at least two, which are respectively arranged at the first dispensing station and the second dispensing station, the number of the detection mechanisms is three, which are respectively arranged at the first detection station, the loading detection station and the second detection station, one of the workstations of the second turntable mechanism is arranged at the first loading station, and the unloading mechanism is arranged at the unloading station.

[0017] In one embodiment, the first turntable further has a crystal oscillator positioning station, which is disposed between the crystal oscillator loading station and the first glue dispensing station, and a crystal oscillator positioning mechanism for positioning the crystal oscillator is disposed at the crystal oscillator positioning station.

[0018] In one embodiment, the second turntable mechanism includes a second rotating drive member and a second turntable driven to rotate by the second rotating drive member, the second turntable has at least three workstations, each of which has a suction nozzle for adsorbing chips, wherein the three workstations are a chip loading station, a chip positioning station and a second loading station arranged in sequence, the discharge port of the chip loading mechanism is arranged at the chip loading station, the chip positioning station is provided with a four-claw positioning mechanism for positioning the chip, and the second loading station is arranged above the first loading station.

[0019] In one embodiment, the unloading mechanism includes a third turntable mechanism, which includes a third rotating drive member and a third turntable driven to rotate by the third rotating drive member, and the third turntable has at least two workstations, each of which has a suction nozzle for adsorbing chips, wherein the two workstations are a first crystal oscillator transfer station and a second crystal oscillator transfer station, the first crystal oscillator transfer station is located above the unloading station, and the second crystal oscillator transfer station is located above the unloading mechanism.

[0020] The present invention also provides a crystal oscillator chip mounting method, which is applied to the above-mentioned crystal oscillator chip mounting device, and is characterized in that it includes the following steps:

[0021] The crystal oscillator is loaded onto the first turntable mechanism through the crystal oscillator loading mechanism, and the chip is loaded onto the second turntable mechanism through the chip loading mechanism;

[0022] The first turntable mechanism drives the crystal oscillator to rotate to the dispensing mechanism and the detection mechanism. After the dispensing mechanism dispenses glue to the crystal oscillator, the detection mechanism detects the crystal oscillator after dispensing glue.

[0023] The first turntable mechanism drives the tested crystal oscillator to the second turntable mechanism, and the second turntable mechanism mounts the chip on the crystal oscillator and transfers it to the testing mechanism for testing;

[0024] The first turntable mechanism drives the crystal oscillator to rotate to another dispensing mechanism and another detection mechanism. After the dispensing mechanism dispenses glue to the crystal oscillator again, the detection mechanism detects the crystal oscillator again.

[0025] The first turntable mechanism drives the mechanism to rotate to the unloading mechanism.

[0026] The beneficial effects of the crystal oscillator chip mounting device and the crystal oscillator chip mounting method provided by the present invention are as follows: compared with the prior art, the crystal oscillator chip mounting device of the present invention includes a chip loading mechanism, a crystal oscillator loading mechanism, a first turntable mechanism, a second turntable mechanism, a glue dispensing mechanism, a detection mechanism and a material unloading mechanism. The chip loading mechanism loads the chip onto the second turntable, the crystal oscillator loading mechanism is used to load the crystal oscillator onto the first turntable, the crystal oscillator is transferred to the second turntable mechanism after being glued by the glue dispensing mechanism and detected by the detection mechanism, the second turntable mechanism mounts the chip on the crystal oscillator, and then the crystal oscillator is transferred to the material unloading mechanism after being glued and detected again. The crystal oscillator chip mounting device and the mounting method provided by the present invention have high precision in glue dispensing and mounting, fast speed, stable quality, and can greatly improve productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0028] Figure 1 A top view of a crystal oscillator chip mounting device provided in an embodiment of the present invention;

[0029] Figure 2 A three-dimensional structural diagram of a vibration mechanism provided by an embodiment of the present invention;

[0030] Figure 3 The three-dimensional structure of the material box mechanism provided by the embodiment of the present invention Figure 1 ;

[0031] Figure 4 The three-dimensional structure of the material box structure provided by the embodiment of the present invention Figure 2 ;

[0032] Figure 5 A three-dimensional structural diagram of a plate swing mechanism provided in an embodiment of the present invention;

[0033] Figure 6 A three-dimensional structural diagram of a first turntable mechanism provided in an embodiment of the present invention;

[0034] Figure 7 A three-dimensional structural diagram of a crystal oscillator positioning mechanism provided in an embodiment of the present invention;

[0035] Figure 8 A three-dimensional structural diagram of a dispensing mechanism provided in an embodiment of the present invention;

[0036] Fig. 9 A three-dimensional structural diagram of a detection mechanism provided by an embodiment of the present invention;

[0037] Fig.10 A three-dimensional structural diagram of a second turntable mechanism provided in an embodiment of the present invention;

[0038] Fig.11 A three-dimensional structural diagram of a four-claw positioning mechanism provided in an embodiment of the present invention.

[0039] Among them, the reference numerals in the figure are:

[0040] 1-crystal oscillator feeding mechanism; 11-vibration mechanism; 111-vibration plate; 112-direct vibration track; 113-direct vibration generator; 12-manipulator; 2-chip feeding mechanism; 21-material box mechanism; 211-lifting assembly; 2111-lifting motor; 2112-screw; 2113-carrier; 212-translation assembly; 2121-translation motor; 2122-belt assembly; 2123-push rod; 21 3- material picking assembly; 2131- material picking motor; 2132- conveyor belt assembly; 2133- material picking claw; 214- material box; 215- support frame; 2151- bottom frame; 2152- upper frame; 216- micro switch; 217- clamping cylinder; 22- swing plate mechanism; 221- XY moving module; 222- fixture; 2221- limit bar; 2222- stop block; 223- push assembly; 2231 -limit push cylinder; 2232-limit cylinder slide rail; 2233-limit cylinder push block; 2234-corner limit piece; 3-first turntable mechanism; 31-first rotary drive member; 32-first turntable; 4-second turntable mechanism; 41-second rotary drive member; 42-second turntable; 5-third turntable mechanism; 6-unloading mechanism; 71-crystal oscillator positioning mechanism; 711-crystal oscillator positioning cylinder; 712-positioning cylinder slide rail; 713-positioning cylinder slider; 714-corner positioning member; 72-four-claw positioning mechanism; 721-positioning motor; 722-cam; 723-positioning claw; 724-elastic member; 8-glue dispensing mechanism; 81-X-axis assembly; 82-Y-axis assembly; 83-Z-axis assembly; 84-needle nozzle assembly; 9-detection mechanism; 91-lens fixing plate; 92-lens; 93-light source fixing plate; 94-light source. DETAILED DESCRIPTION

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0042] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0043] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0045] The crystal oscillator chip mounting device provided in the embodiment of the present invention is now described.

[0046] See also Figure 1 In one embodiment, the crystal oscillator chip loading device includes a chip loading mechanism 2, a crystal oscillator loading mechanism 1, a first turntable mechanism 3, a second turntable mechanism 4, a glue dispensing mechanism 8, a detection mechanism 9, a feeding mechanism 6, etc. The crystal oscillator loading mechanism 1 is used to transfer the crystal oscillator to the first turntable mechanism 3. After the first turntable mechanism 3 receives the crystal oscillator, the crystal oscillator rotates with the first turntable mechanism 3 to the position where the glue dispensing mechanism 8 is located. The glue dispensing mechanism 8 dispenses glue on the crystal oscillator at this location. The crystal oscillator after dispensing glue rotates with the first turntable mechanism 3 to the detection mechanism 9. The detection mechanism 9 detects the crystal oscillator after dispensing glue to detect whether the dispensing position is accurate. The chip loading mechanism 2 is used to transfer the chip to the second turntable mechanism 4. The second turntable mechanism 4 transfers the chip to the crystal oscillator that has been glued and detected, so that the chip is mounted on the crystal oscillator. After the crystal oscillator carries the chip, it continues to rotate with the first turntable mechanism 3 to the glue dispensing mechanism 8. The glue dispensing mechanism 8 dispenses glue on the crystal oscillator after the chip is carried again. After dispensing glue, it rotates with the first turntable mechanism 3 to the detection mechanism 9. The detection mechanism 9 performs another detection. After the test, the qualified products are transferred through the unloading mechanism 6 and unloaded on the plate. The dispensing mechanism 8 used for the two dispensing can be the same dispensing mechanism 8 or different dispensing mechanisms 8; the testing mechanism 9 used for the two tests can be the same testing mechanism 89 or different testing mechanisms 9.

[0047] The crystal oscillator chip mounting equipment in the above-mentioned embodiment has high precision in dispensing and mounting, high speed, stable quality, and can greatly improve productivity.

[0048] In one embodiment of the crystal oscillator feeding mechanism 1, the crystal oscillator feeding mechanism 1 includes a vibration mechanism 11 and a manipulator 12. The crystal oscillator is fed in bulk. The bulk crystal oscillator is fed into the vibration mechanism 11, and the crystal oscillators are discharged one by one by the vibration mechanism 11, and then transferred to the first turntable mechanism 3 by the manipulator 12. Figure 2 The vibration mechanism 11 includes a vibration disk 111, a direct vibration track 112 and a direct vibration generator 113. One end of the direct vibration track 112 is connected to the outlet of the vibration disk 111, and the other end of the direct vibration track 112 is used to discharge materials. The direct vibration generator 113 is used to vibrate the direct vibration track 112. When the vibration disk 111 is working, the crystal oscillators are arranged one by one on the direct vibration track 112, and the crystal oscillators are continuously moved to the discharge end of the direct vibration track 112 through the vibration of the direct vibration track 112. The manipulator 12 takes the material from the discharge end of the direct vibration track 112 and transfers the crystal oscillator to the first turntable 32. The type of the manipulator 12 is not limited here, and it can be a three-axis manipulator. Alternatively, the manipulator 12 includes a rotating motor, a rotating rod and a suction nozzle. The length direction of the rotating rod is arranged along the radial direction of the rotating motor. The suction nozzle is fixed to the end of the rotating rod. When the rotating motor is working, the rotating rod swings, causing the suction nozzle to swing with the rotating rod, so that the suction nozzle can move between the discharge end of the straight vibration track 112 and the crystal oscillator loading station of the first turntable mechanism 3. Such a manipulator 12 has a simple structure and can meet the needs of short-distance material transmission.

[0049] See also Figure 3 and Figure 4In one embodiment of the chip loading mechanism 2, the chip is loaded into a material box 214. The chip loading mechanism 2 includes a material box mechanism 21, and the material box mechanism 21 includes a material box 214, a lifting component 211, a material taking component 213 and a translation component 212. One of the material boxes 214 is placed at the moving end of the lifting component 211, and the movement of the lifting component 211 can drive the material box 214 to move up and down. The material box 214 includes a plurality of stacked and spaced material trays, each of which has a plurality of chip placement cavities for placing chips. The translation component 212 is used to transfer the empty material box 214 from which the chips have been taken. More specifically, when it is necessary to take the material, the lifting component 211 raises the material box 214 to a height corresponding to the material taking component 213, and the material taking component 213 extends into the interior of the material box 214 to clamp one of the material trays, and then transfers the material tray to the swinging plate mechanism 22, or directly extends into the interior of the material box 214 to clamp one of the chips, and then directly transfers it to the second turntable mechanism 4. After the chips on the tray are taken out, the lifting assembly 211 moves to make the other tray the same height as the taking assembly 213, and repeats this process to complete the taking out of one of the boxes 214. After one of the boxes 214 has taken out the chips, the lifting assembly 211 lowers the box 214 to the translation assembly 212, and the translation assembly 212 carries away the empty box 214. When one of the boxes 214 is taking out the chips, the other box 214 filled with chips can be placed in the waiting position, which is set directly above the box 214 that is taking out the chips.

[0050] Furthermore, the material box mechanism 21 also includes a support frame 215, the support frame 215 includes a bottom frame 2151 and an upper frame 2152, the translation assembly 212 is arranged on the bottom frame 2151, the empty material box 214 is transferred on the bottom frame 2151 by the translation assembly 212, and the material taking assembly 213 is fixed to the upper frame 2152, and has a certain distance from the bottom frame 2151 to prevent the material box 214 of the translation assembly 212 from interfering with the material box 214 being taken. The material taking assembly 213 can grab the material tray in the material box 214 suspended above the bottom frame 2151, and the material taking assembly 213 transfers the material tray to the swinging mechanism 22 after grabbing the material tray.

[0051] Optionally, the material box mechanism 21 further includes a clamping cylinder 217 . Specifically, when loading material boxes 214, two or more material boxes 214 can be placed on the carrier 2113, and the carrier 2113 rises to align the height of the lowest material box 214 with the material picking assembly 213. After picking up the materials, all the chips in the material box 214 are taken out, and then the clamping cylinder 217 clamps the material box 214 above the empty material box 214, and the carrier 2113 drives the empty material box 214 to descend to the translation assembly 212, and separates the empty material box 214 that has been picked up from the material box 214 that has not been picked up. The clamping cylinder 217 can prevent the material box 214 that has not been picked up from falling, so that multiple material boxes 214 can be placed on the carrier 2113 at the same time for picking up materials, which can speed up the picking efficiency. There is no need to replace the material box 214 after each material box 214 has finished picking up materials. The material box 214 can be replaced after all the materials in the multiple material boxes 214 have been picked up.

[0052] Optionally, the lifting assembly 211 includes a lifting motor 2111, a lead screw 2112, a lead screw slider, and a carrier plate 2113. The lifting motor 2111 drives the lead screw 2112 to rotate, the lead screw slider is connected to the lead screw 2112 and moves up and down relative to the lead screw 2112, the carrier plate 2113 is fixed to the lead screw slider, the carrier plate 2113 also moves up and down, and the material box 214 for taking materials is placed on the carrier plate 2113, so that the material box 214 can move up and down. Furthermore, the carrier plate 2113 can move to the translation assembly 212, and the translation assembly 212 can also move the material box 214 filled with chips to the carrier plate 2113, and then move up and down with the carrier plate 2113.

[0053] Optionally, the translation assembly 212 includes a translation motor 2121, a belt assembly 2122, and a push rod 2123. The push rod 2123 is fixed to the belt assembly 2122. The translation motor 2121 drives the belt assembly 2122 to translate, and the belt assembly 2122 drives the push rod 2123 to translate. The push rod 2123 is vertically arranged to push the material box 214. When the material box 214 has finished taking materials and is moved down from the lifting assembly 211 to the translation assembly 212, the translation assembly 212 works, and the push rod 2123 pushes the material box 214 to move, so as to clear the space below the material box 214 that is taking materials.

[0054] Optionally, the translation assembly 212 further includes a micro switch 216, which is disposed at the rear end of the translation assembly 212, and the rear end is the end away from the carrier 2113. When the placement space on the translation assembly 212 is filled with empty material boxes 214, the push rod 2123 will continue to push the empty material boxes 214 to move toward the rear end, and the material boxes 214 at the rear end will trigger the micro switch 216, and the micro switch 216 will feedback information to the operator through sound, light or display screen, reminding the operator that the material box 214 has been taken out, and the operator does not need to watch the chip loading mechanism 2.

[0055] Optionally, the material picking assembly 213 includes a material picking motor 2131, a conveyor belt assembly 2132, and a material picking claw 2133. The material picking motor 2131 drives the conveyor belt assembly 2132 to move, and the conveyor belt assembly 2132 drives the material picking claw 2133 to move, so that the material tray can be clamped and dragged to the swing plate mechanism 22. The movement direction of the conveyor belt assembly 2132 is horizontal, so that the material picking claw 2133 can extend between two material trays to clamp the material tray. The specific structure of the material picking claw 2133 is not limited here, and it only needs to be able to clamp the material tray.

[0056] See also Figure 5 In one embodiment of the chip loading mechanism 2, the chip loading mechanism 2 includes a material box mechanism 21, and also includes a swing plate mechanism 22 for receiving chips from the material picking component 213. The swing plate mechanism 22 includes an XY moving module 221, a clamp 222 and a pushing component 223. The clamp 222 is connected to the XY moving module 221. The clamp 222 is used to position the material tray received from the material picking component 213. The pushing component 223 is used to push the material tray to fix the material tray in the clamp 222 after the material tray is placed in the clamp 222, so as to prevent the material tray from moving relative to the clamp 222. More specifically, when the material picking component 213 clamps the material tray from the material box 214, the XY moving module 221 moves the clamp 222 close to the material box 214, the material picking claw 2133 drags the material tray from the material box 214 to the clamp 222, and then the pushing component 223 pushes the material tray tightly and fixes it in the clamp 222. More specifically, the clamp 222 has two parallel limiting bars 2221, and also has a stopper 2222 arranged at one end of the limiting bars 2221 facing away from the material box 214. When the material tray is transferred from the material box 214 to the clamp 222, it is limited between the two limiting bars 2221 and can only move in the dragging direction of the material taking component 213. The moving end of the pushing component 223 is provided with a corner limiting piece 2234, and the corner limiting piece 2234 has a groove matching the corner shape of the material tray. The corner limiting piece 2234 pushes the material tray from one of the corners of the material tray, so that the other end of the material tray facing away from the corner abuts against the stopper 2222, and cannot continue to move along the dragging direction of the material taking component 213, so that the material tray is fixed in the clamp 222. After the tray is clamped in the fixture, the chip is aligned with the chip loading station of the second turntable mechanism 4 in sequence through the action of the XY moving module 221, and the pressing mechanism at the chip loading station drives the suction nozzle to suck up the chip. When all the chips in the tray are transferred, the XY moving module 221 moves the empty tray close to the material box 214, and the material taking component 213 of the material box mechanism 21 drags the empty tray back into the material box 214, and the lifting component 211 works, and then the next tray is loaded.

[0057] Optionally, the pushing assembly 223 includes a limit pushing cylinder 2231, a limit cylinder push block 2233, a limit cylinder slide rail 2232 and a corner limit piece 2234. The limit cylinder push block 2233 is connected to the moving end of the limit pushing cylinder 2231, and the corner limit piece 2234 is fixed to the limit cylinder push block 2233. The limit cylinder push block 2233 is slidably connected to the limit cylinder slide rail 2232, which can guide the movement of the limit cylinder push block 2233.

[0058] See also Figure 1 and Figure 6 In one embodiment of the first turntable mechanism 3, the first turntable mechanism 3 includes a first rotating drive member 31 and a first turntable 32, the first rotating drive member 31 drives the first turntable 32 to rotate, and the first turntable 32 has at least eight stations, each of which has a placement table for placing the crystal oscillator. The eight stations are a crystal oscillator loading station, a first dispensing station, a first detection station, a first loading station, a loading detection station, a second dispensing station, a second detection station, and a discharging station, which are arranged in sequence. After the crystal oscillator is loaded from the crystal oscillator loading station, it passes through the first dispensing, the first detection, chip loading, the second detection, the second dispensing, and the third detection in sequence, and then flows from the discharging station to the discharging mechanism 6. The discharge port of the crystal oscillator feeding mechanism 1 is located at the crystal oscillator feeding station, specifically, the manipulator 12 transfers the crystal oscillator at the discharge port to the placement table of the crystal oscillator loading station. The number of dispensing mechanisms 8 is at least two, which are respectively arranged at the first dispensing station and the second dispensing station. Of course, the first turntable 32 may also be provided with two first glue dispensing stations, which are used to dispense glue at two different positions of the crystal oscillator, and two second glue dispensing stations may also be provided, which are also used to dispense glue again at two different positions of the crystal oscillator. In this embodiment, the number of glue dispensing mechanisms 8 is four. The number of detection mechanisms 9 is three, which are respectively provided at the first detection station, the loading detection station and the second detection station. The structures of each detection mechanism 9 may be the same or different, and the specific detection mechanism 9 is selected according to the specific content to be detected. In addition, one of the stations of the second turntable mechanism 4 is provided at the first loading station. When the chip moved with the second turntable mechanism 4 is transferred to the first loading station, it can be directly pasted on the crystal oscillator at the first loading station. The unloading mechanism 6 is provided at the unloading station, and unloads the material from the unloading station.

[0059] Furthermore, the first turntable 32 also has a crystal oscillator positioning station, so that the first turntable 32 has at least nine stations. The number of stations of the first turntable 32 is not limited here, and the number of stations can be selected according to the production rhythm. The crystal oscillator positioning station is arranged between the crystal oscillator loading station and the first glue dispensing station, and a crystal oscillator positioning mechanism 71 for positioning the crystal oscillator is arranged at the crystal oscillator positioning station. Before the crystal oscillator is glued, after being positioned by the crystal oscillator positioning mechanism 71, the glue dispensing position can be made more accurate.

[0060] Optionally, see Figure 7 The crystal oscillator positioning mechanism 71 includes a crystal oscillator positioning cylinder 711, a positioning cylinder slider 713, a positioning cylinder slide rail 712, and a corner positioning member 714. The positioning cylinder slider 713 is connected to the moving end of the crystal oscillator positioning cylinder 711, and the corner positioning member 714 is fixed to the positioning cylinder slider 713. The positioning cylinder slider 713 is slidably connected to the positioning cylinder slide rail 712, and can guide the movement of the positioning cylinder slider 713. The corner positioning member 714 has a groove that matches the shape of the crystal oscillator corner. When the positioning cylinder slider 713 pushes it to move, it will abut against the inner wall of the crystal oscillator placement position of the first turntable 32 to achieve the positioning of the crystal oscillator.

[0061] Optionally, see Figure 8 The glue dispensing mechanism 8 includes an X-axis assembly 81, a Y-axis assembly 82, a Z-axis assembly 83 and a needle nozzle assembly 84 connected in sequence, so that the needle nozzle assembly 84 can move in three axes to achieve glue dispensing of the crystal oscillator. The specific structures of the X-axis assembly 81, the Y-axis assembly 82, and the Z-axis assembly 83 are not limited here, and can be driven by a motor or a cylinder. The needle nozzle assembly 84 is used to drip glue downward, and the needle nozzle assembly 84 can be any structure in the prior art.

[0062] Optionally, see Fig. 9 The detection mechanism 9 includes a lens fixing plate 91, a lens 92, a light source fixing plate 93 and a light source 94. The lens 92 is arranged above the light source 94. The light source 94 irradiates the crystal oscillator. The lens 92 takes a picture of the crystal oscillator to detect whether the dispensing position and dispensing amount meet the requirements, so as to prevent defective products from flowing into subsequent workstations.

[0063] See also Fig.10In one embodiment of the second turntable mechanism 4, the second turntable mechanism 4 includes a second rotating drive member 41 and a second turntable 42. The second turntable 42 is driven to rotate by the second rotating drive member 41, and the second turntable 42 has at least three stations, and each station has a suction nozzle for adsorbing the chip. The three stations are a chip loading station, a chip positioning station and a second loading station arranged in sequence. After the chip loading mechanism 2 transfers the chip to the chip loading station, the chip is positioned and then transferred to the first loading station of the first turntable 32 at the second loading station, so that the chip is pasted on the crystal oscillator of the first turntable 32. The discharge port of the chip loading mechanism 2 is set at the chip loading station, and the pressing mechanism on the chip loading station drives the suction nozzle to move to absorb the chip in the chip loading mechanism 2 into the second turntable 42 mechanism 4. A four-claw positioning mechanism 72 for positioning the chip is provided at the chip positioning station, so that the chip is positioned and then mounted with the crystal oscillator to improve the mounting accuracy. The second loading station is arranged above the first loading station. When the chip moves to the second loading station, the pressing mechanism at the second loading station drives the suction nozzle to move down and place the chip on the crystal oscillator at the first loading station, thereby completing the pasting of the chip and the crystal oscillator.

[0064] Optionally, see Fig.11 The four-claw positioning mechanism 72 includes a positioning motor 721, a cam 722 disposed at the moving end of the positioning motor 721, four positioning claws 723 abutting against the outer wall of the cam 722, and an elastic member 724 for retracting the four positioning claws 723. When the motor is working, the cam 722 rotates to push open the four positioning claws 723, so that the four positioning claws 723 are opened, and the chip is placed in the four positioning claws 723. The motor rotates to return the cam 722, and the elastic member 724 pulls back the four positioning claws 723 to clamp the chip and position the chip.

[0065] In one embodiment of the crystal oscillator loading device, the unloading mechanism 6 includes a third turntable mechanism 5, which is used to receive the crystal oscillator (referred to as the product) after the chip is loaded, and transfer the product to the unloading mechanism 6. The third turntable mechanism 5 includes a third rotating drive member and a third turntable, and the third rotating drive member drives the third turntable to rotate. The third turntable has at least two stations, each of which has a suction nozzle for adsorbing the chip, wherein the two stations are specifically the first crystal oscillator transfer station and the second crystal oscillator transfer station. The suction nozzle of the first crystal oscillator transfer station is used to suck the product from the second turntable mechanism 4, and the suction nozzle of the second crystal oscillator transfer station is used to transfer the product to the unloading mechanism 6. Among them, the first crystal oscillator transfer station is located above the unloading station of the first turntable 32, and the second crystal oscillator transfer station is located above the unloading mechanism 6. The number of stations of the third turntable is not limited here, and it can be greater than two, and can be selected according to the production rhythm. Optionally, the third turntable mechanism 5 and the second turntable mechanism 4 have the same structure, and the number of stations can be the same or different.

[0066] Optionally, the unloading mechanism 6 further includes a swing plate mechanism having the same structure as the chip loading mechanism 2 .

[0067] An embodiment of the present invention further provides a crystal oscillator chip mounting method, which can be applied to the crystal oscillator chip mounting device in any of the above embodiments, and the method comprises the following steps:

[0068] The crystal oscillator is loaded onto the first turntable mechanism 3 through the crystal oscillator loading mechanism 1, and the chip is loaded onto the second turntable mechanism 4 through the chip loading mechanism 2;

[0069] The first turntable mechanism 3 drives the crystal oscillator to rotate to the glue dispensing mechanism 8 and the detection mechanism 9. After the glue dispensing mechanism 8 dispenses glue to the crystal oscillator, the detection mechanism 9 detects the crystal oscillator after the glue dispensing;

[0070] The first turntable mechanism 3 drives the tested crystal oscillator to the second turntable mechanism 4, and the second turntable mechanism 4 mounts the chip on the crystal oscillator;

[0071] The first turntable mechanism 3 drives the crystal oscillator to rotate to another dispensing mechanism 8 and another detection mechanism 9. After the dispensing mechanism 8 dispenses glue to the crystal oscillator again, the detection mechanism 9 detects the crystal oscillator again.

[0072] The first turntable mechanism 3 drives the mechanism to rotate to the unloading mechanism 6 .

[0073] There can be two dispensing mechanisms 8, one for the first dispensing and one for the second dispensing; there can also be four dispensing mechanisms 8, one for the first dispensing at different positions of the crystal oscillator and one for the second dispensing. There can be three detection mechanisms 9, one for the detection after the first dispensing, the detection after the chip is loaded and the detection after the second dispensing.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A crystal oscillator chip-mounted device, characterized in that: include: A chip loading mechanism, used for loading chips; Crystal oscillator feeding mechanism, used for crystal oscillator feeding; The first turntable mechanism is used to receive the crystal oscillator from the crystal oscillator feeding mechanism, and transfer the crystal oscillator to the chip after the crystal oscillator is glued, and is also used to transfer the chip after the crystal oscillator is loaded; a second turntable mechanism, used for receiving chips from the chip loading mechanism, and also for loading chips onto the first turntable mechanism; Glue dispensing mechanism, used for dispensing glue on the crystal oscillator and the crystal oscillator with the chip mounted; A testing mechanism, used to test the crystal oscillator after dispensing and the crystal oscillator after dispensing with glue after mounting the chip; and The unloading mechanism is used to unload the crystal oscillator plate carrying the chip.

2. The crystal oscillator chip mounting device according to claim 1, characterized in that: The chip loading mechanism includes a material box mechanism, which includes at least one material box, a lifting component, a material picking component and a translation component, wherein one of the material boxes is placed at the moving end of the lifting component, the material box includes a plurality of stacked and spaced material trays, the material trays have a plurality of chip accommodating cavities for placing chips, the lifting component is used to lift the material box for the material picking component to pick up materials, and the translation component is used to transfer an empty material box from which chips have been taken.

3. The crystal oscillator chip mounting device according to claim 2, characterized in that: The material box mechanism also includes a support frame, which includes a base frame and an upper frame. The translation assembly is arranged on the base frame to transfer an empty material box placed on the base frame, and the material picking assembly is fixed to the upper frame to grab a material tray in the material box suspended above the base frame.

4. The crystal oscillator chip mounting device according to claim 2, characterized in that: The lifting assembly includes a lifting motor, a lead screw driven by the lifting motor, a lead screw slider connected to the lead screw, and a carrier plate fixed to the lead screw slider, and the material box is placed on the carrier plate.

5. The crystal oscillator chip mounting device according to claim 2, characterized in that: The chip loading mechanism also includes a swinging plate mechanism for receiving the chip tray from the material picking component, the swinging plate mechanism includes an XY moving module, a clamp that moves with the XY moving module and is used to limit the tray, and a pushing component for fixing the tray, the clamp is arranged on one side of the second turntable mechanism, so that the pressing mechanism on the second turntable mechanism drives the suction nozzle to grab the chip from the tray of the clamp.

6. The crystal oscillator chip mounting device according to claim 1, characterized in that: The first turntable mechanism includes a first rotating drive member and a first turntable driven to rotate by the first rotating drive member, the first turntable has at least eight stations, each station has a placement table for placing a crystal oscillator, wherein the eight stations are a crystal oscillator loading station, a first dispensing station, a first detection station, a first loading station, a loading detection station, a second dispensing station, a second detection station and a unloading station arranged in sequence; the discharge port of the crystal oscillator loading mechanism is arranged at the crystal oscillator loading station, the number of the dispensing mechanisms is at least two, which are respectively arranged at the first dispensing station and the second dispensing station, the number of the detection mechanisms is three, which are respectively arranged at the first detection station, the loading detection station and the second detection station, one of the stations of the second turntable mechanism is arranged at the first loading station, and the unloading mechanism is arranged at the unloading station.

7. The crystal oscillator chip mounting device according to claim 6, characterized in that: The first turntable also has a crystal oscillator positioning station, which is arranged between the crystal oscillator loading station and the first glue dispensing station. The crystal oscillator positioning station is provided with a crystal oscillator positioning mechanism for positioning the crystal oscillator.

8. The crystal oscillator chip mounting device according to claim 6, characterized in that: The second turntable mechanism includes a second rotating drive member and a second turntable driven to rotate by the second rotating drive member, the second turntable has at least three stations, each station has a suction nozzle for adsorbing chips, wherein the three stations are a chip loading station, a chip positioning station and a second loading station which are arranged in sequence, the discharge port of the chip loading mechanism is arranged at the chip loading station, the chip positioning station is provided with a four-claw positioning mechanism for positioning the chip, and the second loading station is arranged above the first loading station.

9. The crystal oscillator chip mounting device according to claim 6, characterized in that: The unloading mechanism includes a third turntable mechanism, which includes a third rotating drive member and a third turntable driven to rotate by the third rotating drive member, the third turntable has at least two workstations, each of which has a suction nozzle for adsorbing chips, wherein the two workstations are a first crystal oscillator transfer station and a second crystal oscillator transfer station, the first crystal oscillator transfer station is located above the unloading station, and the second crystal oscillator transfer station is located above the unloading mechanism.

10. A crystal oscillator chip mounting method, applied to a crystal oscillator chip mounting device according to any one of claims 1 to 9, characterized in that: The following steps are involved: The crystal oscillator is loaded onto the first turntable mechanism through the crystal oscillator loading mechanism, and the chip is loaded onto the second turntable mechanism through the chip loading mechanism; The first turntable mechanism drives the crystal oscillator to rotate to the dispensing mechanism and the detection mechanism. After the dispensing mechanism dispenses glue to the crystal oscillator, the detection mechanism detects the crystal oscillator after dispensing glue. The first turntable mechanism drives the tested crystal oscillator to the second turntable mechanism, and the second turntable mechanism mounts the chip on the crystal oscillator and transfers it to the testing mechanism for testing; The first turntable mechanism drives the crystal oscillator to rotate to another dispensing mechanism and another detection mechanism. After the dispensing mechanism dispenses glue to the crystal oscillator again, the detection mechanism detects the crystal oscillator again. The first turntable mechanism drives the mechanism to rotate to the unloading mechanism.

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