LED display module
By setting the column electrode, row electrode and LED light emitting chip on a substrate in the LED display module and connecting it through leads, the electrical failure problem caused by vias is solved, the module thickness is reduced, and the thickness is provided is provided. LED display module.
Patent Information
- Application Number
- CN201811325885.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2018-11-08
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2038-11-08
AI Technical Summary
The circuit board of the existing LED display module needs to pass through holes to achieve crossing between lines, resulting in electrical failures easily occur at the vias. In addition, traditional horizontal structure chips need to reserve wire bonding electrodes, and the size is difficult to reduce, resulting in the module thickness being unable to be reduced. .
The column electrode, row electrode and LED light emitting chip are arranged on a substrate and connected through leads to avoid through holes, so as to achieve the circuit basically completed on the substrate surface and reduce the substrate thickness.
It solves the problem of crossing electrical failure between lines, reduces the module thickness, and provides a thin LED display module.
Smart Images
Figure CN111162157B_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of LED display modules, and in particular to an LED display module. Background Art
[0002] As the LED chip manufacturing process is constantly improving, the brightness of the chip is constantly increasing, and the chip area required to achieve the same brightness is getting smaller and smaller. Using a smaller chip area can reduce the manufacturing cost of display screen devices.
[0003] In the future, the Mini LED market will further expand, the dot pitch of the display screen will further decrease, and the brightness requirements of a single pixel will become lower and lower. The use of larger area LED chips must reduce the chip current density, and the chip luminous efficiency cannot be fully utilized. The use of smaller area LED chips will be an important trend of Mini LED display. Micro LED (chip area less than 100*100μm 2 ) chips came into being.
[0004] In terms of display effect, smaller Micro LED chip display devices can show ultra-high contrast and are an important direction for the development of LED display devices. Traditional horizontal structure chips are difficult to reduce in size because they need to reserve wire bonding electrodes.
[0005] Currently, Micro LED chips are mainly packaged using a flip-chip structure, which brings an important problem. The chip size is small, and the welding precision is extremely high. Moreover, after welding, the welding thrust is low due to the small electrode area, which makes it easy for the chip to fall off or have poor welding.
[0006] Currently, LED display modules are mainly made of multi-layer circuit boards with complex circuits. Circuit boards usually require vias to achieve crossover between circuits. Electrical failures are prone to occur at the vias. The use of multi-layer circuit boards leads to problems such as the inability to reduce the thickness of the module. Summary of the invention
[0007] The present application provides an LED display module, which is used to solve the technical problem that the current LED display module circuit board usually requires vias to achieve the crossing between circuits and electrical failure is easy to occur at the vias. At the same time, the circuits are basically completed on the surface of the substrate, which reduces the thickness of the substrate and thus reduces the thickness of the display module, providing a thin LED display module.
[0008] In view of this, the first aspect of the present application provides an LED display module, including: column electrodes, row electrodes, leads, LED light-emitting chips, a substrate and packaging glue;
[0009] The column electrodes, the row electrodes and the LED light-emitting chip are arranged on the substrate;
[0010] The chip electrodes of the LED light-emitting chip are respectively connected to the corresponding column electrodes and row electrodes through leads;
[0011] The column electrodes are spaced apart from the row electrodes, and the LED light emitting chips are distributed between the column electrodes and the row electrodes;
[0012] The column electrodes spaced apart from the row electrodes are connected via the lead wires;
[0013] The packaging glue covers the substrate on which the column electrodes, the row electrodes and the LED light-emitting chip are arranged.
[0014] Preferably, the column electrodes are distributed in an array on the substrate; the row electrodes are arranged in a continuous manner in a transverse direction, the row electrodes separate the column electrodes, and the column electrodes in the same column are connected via the lead wires.
[0015] Preferably, the row electrodes are composed of at least one row electrode group, and one row electrode group includes at least one row electrode;
[0016] The row electrode groups are spaced apart from the column electrodes;
[0017] The row electrodes in a group of row electrodes are arranged in parallel.
[0018] Preferably, the LED light-emitting chip is composed of at least one group of LED light-emitting chip groups;
[0019] The LED light-emitting chip groups are distributed in an array on the substrate, the number of the LED light-emitting chip groups is the same as the number of the column electrodes, and a group of the LED light-emitting chip groups corresponds to one column electrode, and the chip electrodes of the LED light-emitting chips in a group of the LED light-emitting chip groups are connected to the corresponding column electrodes through the leads;
[0020] The number of the LED light-emitting chips in a group of the LED light-emitting chip groups is the same as the number of the row electrodes in a group of the row electrode groups connected to each other, and the other chip electrodes of the LED light-emitting chips in the LED light-emitting chip groups are respectively connected to the corresponding row electrodes in the row electrode groups through the leads, and the corresponding LED light-emitting chips in each of the LED light-emitting chip groups in a row share the corresponding row electrodes.
[0021] Preferably, the column electrodes or the row electrodes are separately arranged on the surface of the substrate.
[0022] Preferably, the column electrodes or the row electrodes are electrodes formed of a conductive material or electrodes formed of a mixture of a conductive material and an adhesive.
[0023] Preferably, the substrate is a light-transmitting substrate, and the light-emitting surface of the LED light-emitting chip is placed and installed facing the light-transmitting substrate;
[0024] At least one chip electrode is arranged on the back of the LED light-emitting chip, and the chip electrode is electrically connected to the corresponding row electrode and / or column electrode through the lead wires;
[0025] The packaging glue layer is a non-light-transmitting layer.
[0026] Preferably, the LED light-emitting chip is fixed on the substrate by light-transmitting die-bonding adhesive.
[0027] Preferably, a reflective layer is provided on a side of the chip body of the LED light-emitting chip away from the substrate.
[0028] Preferably, the substrate comprises a transparent layer and a semi-transmissive layer;
[0029] The semi-transparent layer is arranged between the transparent layer and the LED light-emitting chip;
[0030] The semi-transmissive layer comprises one or more of optical scattering particles, optical absorption particles or fluorescent particles;
[0031] Or the substrate is a light-transmitting substrate having one or more of optical scattering particles, optical absorption particles or fluorescent particles as a whole.
[0032] The second aspect of the present application provides an LED display module packaging method, which is used to package an LED display module as described in the first aspect, comprising the steps of:
[0033] Fixing the column electrodes, row electrodes and LED light-emitting chips on the substrate;
[0034] Connect the column electrodes, row electrodes and LED light-emitting chip through wire bonding;
[0035] Encapsulation is performed using encapsulation glue.
[0036] It can be seen from the above technical solutions that this application has the following advantages:
[0037] The present application provides an LED display module, comprising: column electrodes, row electrodes, leads, LED light-emitting chips, substrates and packaging glue; column electrodes, row electrodes and LED light-emitting chips are arranged on the substrate; the column electrodes are connected to the chip electrodes of the LED light-emitting chips through leads, and the row electrodes are connected to the other chip electrodes of the LED light-emitting chips through leads; the column electrodes and the row electrodes are spaced apart, and the LED light-emitting chips are distributed between the column electrodes and the row electrodes; the spaced row electrodes or column electrodes are connected through leads; the packaging glue covers the substrate on which the column electrodes, row electrodes and LED light-emitting chips are arranged. The present application arranges the column electrodes, row electrodes and LED light-emitting chips on a layer of circuit board, connects them through leads, and does not require vias, thereby solving the technical problem that the current LED display module circuit board usually requires vias to achieve the crossing between circuits and electrical failure is easy to occur at the vias. At the same time, the circuits are basically completed on the surface of the substrate, reducing the thickness of the substrate and thus reducing the thickness of the display module, providing a thin LED display module. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] In order to more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0039] Figure 1 A top view of the structure of an LED display module provided in this application;
[0040] Figure 2 A top view detail diagram of an LED display module provided in this application;
[0041] Figure 3 This is one of the front views of an LED display module provided in this application;
[0042] Figure 4 This is the second front view of an LED display module provided in this application. DETAILED DESCRIPTION
[0043] The present application provides an LED display module for solving the technical problem that the current LED display module circuit board usually requires vias to achieve the crossing between circuits and electrical failure is easily caused at the vias.
[0044] In order to make the purpose, features, and advantages of the invention of this application more obvious and easy to understand, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described below are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0045] See also Figure 1 and Figure 2 , an embodiment of an LED display module provided by the present application includes: a column electrode 1, a row electrode 2, a lead 3, an LED light-emitting chip 4, a substrate 5 and a packaging glue 6;
[0046] The substrate 5 is provided with column electrodes 1, row electrodes 2 and LED light emitting chips 4;
[0047] It should be noted that the column electrodes 1 and the row electrodes 2 can be formed by printing or the like, and the LED light emitting chip 4 can be fixed on the substrate 5 by a light-transmitting die-bonding adhesive 4-4;
[0048] Two chip electrodes of the LED light emitting chip 4 are respectively connected to the corresponding column electrode 1 and row electrode 2 through the lead wires 3;
[0049] It should be noted that the LED light emitting chip 4 generally includes two chip electrodes, one chip electrode generally leads to at least one lead 3, and the column electrode 1 can be connected to multiple leads 3, such as Figure 1 and Figure 2 As shown, the LED light-emitting chip 4 is composed of at least one group of LED light-emitting chip groups, and the LED light-emitting chip groups are distributed in an array on the substrate 5. The number of LED light-emitting chip groups is the same as the number of column electrodes 1, and one group of LED light-emitting chip groups corresponds to one column electrode 1. The column electrode 1 and the row electrode 2 are distributed at intervals, and the LED light-emitting chip 4 is distributed between the column electrode 1 and the row electrode 2; the column electrode 1 can be "T" shaped or in other shapes; Figure 1 In the example shown, one row is column electrode 1 and the other row is row electrode 2, so it is called alternate distribution; in addition, another case is that the column electrodes 1 corresponding to the chip groups on the same column are connected as a whole, separating the row electrodes 2. In this case, multiple leads 3 are required to connect the row electrodes 2, while the column electrodes do not need leads 3 because they are connected as a whole. The following will describe the two cases:
[0050] The first case, such as Figure 1As shown, the column electrodes 1 and the row electrodes 2 are arranged at intervals, and the LED light-emitting chips 4 are arranged between the column electrodes 1 and the row electrodes 2. One row is the column electrode 1 and the other row is the row electrode 2, so it is called an interval arrangement; the column electrodes 1 are separated by the row electrodes 2, so they need to be connected by leads 3. According to the electrode connection principle of the LED light-emitting chip 4, the column electrodes 1 are generally connected one by one; because the column electrodes 1 and the row electrodes 2 are arranged at intervals, there is generally at least one row electrode 2 under the leads 1-2 connecting the column electrodes 1-1; the separated column electrodes 1 are connected by leads 3;
[0051] Different from the first case, in the second case, the column electrodes 1 are connected together from top to bottom and do not need to be connected by leads 3, so the row electrodes 2 are divided into multiple parts, and the separated row electrodes 2 are connected by leads 3. If a row of chip groups corresponds to three column electrodes 2, the separated row electrode parts need to be connected by three leads 3 respectively.
[0052] The packaging glue 6 covers the substrate 5 on which the column electrodes 1 , the row electrodes 2 and the LED light-emitting chip 4 are arranged.
[0053] The present application arranges column electrodes 1, row electrodes 2 and LED light-emitting chips 4 on a layer of circuit board, and electrically connects the spaced column electrodes or the spaced row electrodes through leads 3, without the need for via conduction, thereby solving the technical problem that the current LED display module circuit board usually requires vias to achieve the crossing between circuits and electrical failure is prone to occur at the vias. At the same time, for modules that require multi-layer circuit boards to achieve electrical connection, the method of the present invention can reduce the thickness of the substrate and thus reduce the thickness of the module.
[0054] An embodiment of an LED display module provided by the present application will be described in detail below.
[0055] See also Figure 1 and Figure 2 , an embodiment of an LED display module provided by the present application includes: a column electrode 1, a row electrode 2, a lead 3, an LED light-emitting chip 4, a substrate 5 and a packaging glue 6;
[0056] The substrate 5 is provided with column electrodes 1, row electrodes 2 and LED light emitting chips 4;
[0057] The column electrode 1 is connected to one chip electrode of the LED light emitting chip 4 through the lead wire 3, and the row electrode 2 is connected to another chip electrode of the LED light emitting chip 4 through the lead wire 3;
[0058] The column electrodes 1 and the row electrodes 2 are spaced apart, and the LED light emitting chip 4 is distributed between the column electrodes 1 and the row electrodes 2;
[0059] The column electrodes 1 spaced apart from the row electrodes 2 are connected via leads 3;
[0060] The packaging glue 6 covers the substrate 5 on which the column electrodes 1 , the row electrodes 2 and the LED light-emitting chip 4 are arranged.
[0061] like Figure 1 As shown, the column electrodes 1 are distributed in an array on the substrate 5; the row electrodes are arranged continuously in a horizontal direction, the row electrodes separate the column electrodes, and the column electrodes in the same column are connected by leads.
[0062] Figure 1 There are 16 column electrodes 1 in total, and the column electrodes 1 in the same column are connected by leads 3. The column electrode 1 is a conductive material, such as metal gold, silver, copper, metal oxide, or a mixture of a conductive material and an adhesive. The main function of the column electrode 1 is to form a conductive circuit on the surface of the substrate 5. The leads 3 between the column electrodes 1 are generally metal filaments. At least one row electrode 2 passes under the leads 1-2 between the column electrodes 1-1. The column electrode 1 is a common electrode, which is used to connect the common anode or common cathode of the LED light-emitting chip 4. Figure 2 The electrode 1-1 in is one of the column electrodes 1;
[0063] like Figure 1 and Figure 2 As shown, the row electrode 2 is composed of at least one row electrode group, and one row electrode group includes at least one row electrode 2; Figure 1 In the example of FIG. 4 , there are four row electrode groups, one row electrode group includes three row electrodes 2. Figure 2 , row electrodes 2-1, 2-2 and 2-3 respectively;
[0064] The row electrode group and the column electrode 1 are spaced apart from each other; Figure 1 As shown, one row is a column electrode 1, and one row is a row electrode group; the row electrodes 2 in a row electrode group are arranged in parallel.
[0065] like Figure 1 and Figure 2 As shown, the LED light emitting chip 4 is composed of at least one group of LED light emitting chip groups; Figure 1 In the example, there are 16 groups of LED light emitting chips, each group of LED light emitting chips has 3 LED light emitting chips 4; there are a total of 48 LED light emitting chips 4.
[0066] The LED light-emitting chip groups are distributed in an array on the substrate 5. The number of the LED light-emitting chip groups is the same as the number of the column electrodes 1. One group of LED light-emitting chip groups corresponds to one column electrode 1. One chip electrode of the LED light-emitting chip 4 in one group of LED light-emitting chip groups is connected to the corresponding column electrode 1 through a lead 3. Figure 1In the example, there are 16 groups of LED light-emitting chip groups, corresponding to and connected to the 16 column electrodes 1.
[0067] The number of LED light-emitting chips 4 in a group of LED light-emitting chip groups is the same as the number of row electrodes 2 in a group of row electrodes connected to each other, and the other chip electrode of the LED light-emitting chip 4 in the LED light-emitting chip group is connected to the row electrode 2 in the row electrode group through the lead 3, and the row electrodes corresponding to a row of chip groups are connected respectively, that is, the corresponding LED light-emitting chips 4 in each LED light-emitting chip group in a row share the corresponding row electrode. Figure 1 In the example, a group of LED light-emitting chip groups includes 3 LED light-emitting chips 4, which correspond to and are connected to 3 row electrodes 2 in a row electrode group, and the first LED light-emitting chip 4 on the left in each LED light-emitting chip group is connected to the bottom row electrode 2 in a row electrode group, and so on, the corresponding LED light-emitting chips 4 in each LED light-emitting chip group in a row share the corresponding row electrode. Figure 2 As shown, different row electrodes 2 are connected to another chip electrode of different chips in the LED light-emitting chip group.
[0068] The column electrodes 1 or the row electrodes 2 are separately arranged on the surface of the substrate 5. The column electrodes 1 and the row electrodes 2 can be distributed around the chip or below the chip. The row electrodes 2 or the column electrodes 1 can be separately arranged electrodes.
[0069] The column electrode 1 or the row electrode 2 is specifically an electrode formed of a conductive material or a mixture electrode of a conductive material and an adhesive.
[0070] Furthermore, the substrate 5 is a light-transmitting substrate, and the light-emitting surface of the LED light-emitting chip 4 is placed and installed facing the light-transmitting substrate;
[0071] At least one chip electrode is disposed on the back side (non-light-emitting side) of the LED light-emitting chip 4, and the chip electrode is electrically connected to the corresponding row electrode and column electrode through the lead wire 3;
[0072] The packaging glue layer is a non-light-transmitting layer (the packaging glue 6 is non-light-transmitting).
[0073] The LED light-emitting chip 4 is specifically fixed on the substrate 5 by a transparent die-bonding adhesive 4-4. A reflective layer 4-3 is provided on a side of the chip body of the LED light-emitting chip 4 away from the substrate 5. The substrate 5 includes a transparent layer and a semi-transparent layer; the semi-transparent layer is provided between the transparent layer and the LED light-emitting chip 4; the semi-transparent layer has one or more of optical scattering particles, optical absorption particles or fluorescent particles.
[0074] like Figure 3As shown, the LED light-emitting chip 4 is fixed on the glass substrate by a light-transmitting solid crystal glue 4-4, wherein electrodes 4-1 and 4-2 are arranged on the upper surface of the chip, and a reflective layer 4-3 is arranged under the electrodes. The electrodes 4-1, 4-2 and the reflective layer 4-3 can be a one-layer or multi-layer structure. The light emitted by the chip is reflected by the reflective layer 4-3 and passes through the light-transmitting solid crystal glue 4-4 and the substrate 5 to be emitted outward.
[0075] The substrate 5 is a light-transmitting substrate. Furthermore, the substrate may contain one or more of optical scattering particles, optical absorption particles or fluorescent particles.
[0076] Specifically, in this embodiment, the substrate 5 includes a transparent layer 5 - 1 and a semi-transparent layer 5 - 2 , and the semi-transparent layer 5 - 2 contains one or more of optical scattering particles, optical absorption particles or fluorescent particles.
[0077] In other embodiments, the substrate may also be a light-transmitting substrate that is mixed with one or more of optical scattering particles, optical absorption particles or fluorescent particles.
[0078] like Figure 4 As shown, the chip, bonding wires 3, circuits, etc. are finally sealed by encapsulation glue 6 (opaque colloid) to complete the LED display module packaging. Furthermore, the encapsulation glue is an overall opaque encapsulation glue or the encapsulation glue is formed by setting a high reflective material on the surface of the translucent colloid to form an opaque encapsulation glue.
[0079] The present application solves the technical problems that current LED display module circuit boards usually require vias to achieve crossover between circuits and electrical failures are easily caused at the vias, as well as the problem that traditional horizontal structure chips are difficult to reduce in size due to the need to reserve bonding electrodes.
[0080] The present application provides a LED display module packaging method, which is used to package an LED display module as in the above embodiment, comprising the steps of:
[0081] Fixing the column electrodes, row electrodes and LED light-emitting chips on the substrate;
[0082] Connect the column electrodes, row electrodes and LED light-emitting chip through wire bonding;
[0083] Encapsulation is performed using encapsulation glue.
[0084] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. An LED display module, characterized in that: include: Column electrodes, row electrodes, leads, LED light-emitting chips, substrates and packaging glue; The column electrodes, the row electrodes and the LED light-emitting chip are arranged on the substrate; The chip electrodes of the LED light-emitting chip are respectively connected to the corresponding column electrodes and the row electrodes through the lead wires; The column electrodes are spaced apart from the row electrodes, and the LED light emitting chips are distributed between the column electrodes and the row electrodes; The packaging glue covers the substrate provided with the column electrodes, the row electrodes and the LED light emitting chip; The row electrodes are arranged in a continuous manner in a horizontal direction, the column electrodes are in a "T" shape, the row electrodes separate the column electrodes, and the column electrodes in the same column are connected by the lead wires; The column electrodes are separately arranged on the surface of the substrate.
2. The LED display module according to claim 1, characterized in that: The row electrodes are composed of at least one row electrode group, and one row electrode group includes at least one row electrode; The row electrode groups are spaced apart from the column electrodes; The row electrodes in a group of row electrodes are arranged in parallel.
3. The LED display module according to claim 2, characterized in that: The LED light-emitting chip is composed of at least one group of LED light-emitting chip groups; The LED light-emitting chip groups are distributed in an array on the substrate, the number of the LED light-emitting chip groups is the same as the number of the column electrodes, and a group of the LED light-emitting chip groups corresponds to one column electrode, and the chip electrodes of the LED light-emitting chips in a group of the LED light-emitting chip groups are connected to the corresponding column electrodes through the leads; The number of the LED light-emitting chips in a group of the LED light-emitting chip groups is the same as the number of the row electrodes in a group of the row electrode groups connected to each other, and the other chip electrodes of the LED light-emitting chips in the LED light-emitting chip groups are respectively connected to the corresponding row electrodes in the row electrode groups through the leads, and the corresponding LED light-emitting chips in each of the LED light-emitting chip groups in a row share the corresponding row electrodes.
4. The LED display module according to claim 1, characterized in that: The column electrodes or the row electrodes are specifically electrodes formed of a conductive material or electrodes formed of a mixture of a conductive material and an adhesive.
5. The LED display module according to any one of claims 1 to 4, characterized in that: The substrate is a light-transmitting substrate, and the light-emitting surface of the LED light-emitting chip is placed and installed facing the light-transmitting substrate; At least one chip electrode is arranged on the back of the LED light-emitting chip, and the chip electrode is electrically connected to the corresponding row electrode and / or column electrode through the lead wires; The packaging glue layer is a non-light-transmitting layer.
6. The LED display module according to claim 1, characterized in that: The LED light-emitting chip is specifically fixed on the substrate by light-transmitting die-bonding adhesive.
7. The LED display module according to claim 1, characterized in that: A reflective layer is provided on a side of the chip body of the LED light emitting chip away from the substrate.
8. The LED display module according to claim 1, characterized in that: The substrate comprises a transparent layer and a semi-transparent layer; The semi-transparent layer is arranged between the transparent layer and the LED light-emitting chip; The semi-transmissive layer comprises one or more of optical scattering particles, optical absorption particles or fluorescent particles; Or the substrate is a light-transmitting substrate having one or more of optical scattering particles, optical absorption particles or fluorescent particles as a whole.