Automatic wafer screening machine

Abstract

The present invention relates to an automatic wafer screening machine, which is connected to the electric control box signal, and includes a base, a roller arranged on the base and provided with at least two groups of screening holes with different apertures, a first motor arranged on one side of the roller, a lifting mechanism arranged on the other side of the roller, a connecting rod used to connect the first motor and the lifting mechanism and pass through the roller, and a blocking mechanism arranged on the connecting rod and movable along the axial length direction of the connecting rod, wherein the blocking mechanism moves along the connecting rod so that the target object moves to the target screening hole for screening. By providing the blocking mechanism, the blocking mechanism moves the target object to the target screening hole for screening, which is convenient and quick; by providing a first cylinder for screening out debris and a second cylinder connected to the first cylinder and used to screen wafers, the first cylinder is used to screen out debris to facilitate the screening of the target object.

Description

Technical Field

[0001] The invention relates to an automatic wafer screening machine, belonging to the technical field of semiconductor manufacturing. Background Art

[0002] During the production process, after the wafer is cut into wafers, the wafers need to be split. However, during the splitting process, there will be connected and broken pieces. Therefore, in order to quickly screen out the wafers after the splitting process, a wafer screening machine is needed to screen out the unnecessary products. However, the screening device in the prior art has a low screening efficiency. Summary of the invention

[0003] The purpose of the present invention is to provide a convenient and fast automatic wafer screening machine capable of filtering different target objects.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic wafer screening machine, which is connected to the signal of an electric control box, comprises a base, a drum arranged on the base and provided with at least two groups of screening holes with different apertures, a first motor arranged on one side of the drum, a lifting mechanism arranged on the other side of the drum, a connecting rod connecting the first motor and the lifting mechanism and passing through the drum, and a blocking mechanism arranged on the connecting rod and movable along the axial length direction of the connecting rod, wherein the blocking mechanism moves along the connecting rod so that the target object moves to the target screening hole for screening.

[0005] Furthermore, at least part of the connecting rod is a gear shaft, and the blocking mechanism includes a blocking plate sleeved on the gear shaft, a gear arranged on one side of the blocking plate and meshing with the gear shaft, and a second motor arranged on the other side of the blocking plate and connected to the gear.

[0006] Furthermore, the diameter of the baffle plate is equal to the diameter of the drum.

[0007] Furthermore, a guide shaft is arranged in the drum, and the baffle plate is connected to the guide shaft.

[0008] Furthermore, the drum comprises a first cylinder body for screening out debris and a second cylinder body connected to the first cylinder body and for screening wafers, and at least two groups of screening holes are arranged on the second cylinder body.

[0009] Furthermore, the first cylinder is provided with a plurality of evenly arranged screening holes, and the automatic wafer screening machine also includes a spiral fan blade arranged in the first cylinder and connected to the connecting rod.

[0010] Furthermore, the lifting mechanism includes a lifting electric cylinder and a bearing seat connected to the lifting electric cylinder and used to support the connecting rod.

[0011] Furthermore, the automatic wafer screening machine also includes a universal ball bearing for connecting the first motor and the connecting rod.

[0012] Furthermore, at least two openings are provided on the base, and the automatic wafer screening machine also includes a drawer connected to the openings.

[0013] Furthermore, the automatic wafer screening machine also includes an electric control box connected to the base and a button mechanism connected to the signal of the electric control box.

[0014] The beneficial effects of the present invention are: by providing a blocking mechanism, the blocking mechanism moves the target object to the target screening hole for screening, which is convenient and quick;

[0015] By providing a first cylinder for screening out broken materials and a second cylinder connected to the first cylinder and for screening wafers, the first cylinder is used for screening out broken materials to facilitate screening of target objects.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of the automatic wafer screening machine of the present invention.

[0018] Figure 2 Another structural schematic diagram of the automatic wafer screening machine of the present invention.

[0019] Figure 3 It is another structural schematic diagram of the automatic wafer screening machine of the present invention.

[0020] Figure 4 It is another structural schematic diagram of the automatic wafer screening machine of the present invention. DETAILED DESCRIPTION

[0021] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0022] See also Figure 1 and Figure 3In a preferred embodiment of the present invention, an automatic wafer screening machine comprises a base 1, a drum 2 arranged on the base 1 and provided with at least two groups of screening holes 221 with different apertures, a first motor 5 arranged on one side of the drum 2, a lifting mechanism 3 arranged on the other side of the drum 2, a connecting rod 10 for connecting the first motor 5 and the lifting mechanism 3 and penetrating the drum 2, and a blocking mechanism 7 arranged on the connecting rod 10 and movable along the axial length direction of the connecting rod 10, wherein the blocking mechanism 7 moves along the connecting rod 10 so that the target object moves to the target screening hole 221 for screening. In this embodiment, the target object is a wafer. Of course, in other embodiments, the target object may also be other objects, depending on the actual situation, and no specific limitation is made here. Among them, skirts 23 are arranged on both sides of the drum 2, and the purpose of the skirts 23 is to prevent the target object from moving out of the drum 2. Of course, in other embodiments, other objects may also be arranged on the drum 2, as long as the same purpose is achieved, and no specific limitation is made here, depending on the actual situation. The lifting mechanism 3 includes a lifting cylinder 31 and a bearing seat 32 connected to the lifting cylinder 31 and used to support the connecting rod 10. The lifting cylinder 31 is lifted and lowered to drive the bearing seat 32 to lift and lower, thereby driving one end of the connecting rod 10 to lift and lower. The automatic wafer screening machine also includes a universal ball bearing 51 for connecting the first motor 5 and the connecting rod 10. The universal ball bearing 51 can transmit the rotational force output by the first motor 5 to the connecting rod 10.

[0023] The automatic wafer screening machine further includes a support platform 4 disposed on the base 1, the first motor 5 is connected to the support platform 4, and the universal ball bearing 51 passes through the support platform 4 and is connected to the first motor 5. A sensor is also disposed on each group of screening holes 221, and the sensor is used to detect whether there is a target object at the group of screening holes 221.

[0024] In this embodiment, five groups of screening holes 221 are provided, and the diameters of the five groups of screening holes 221 gradually decrease from the side close to the first motor 5 to the side away from the first motor 5. Of course, in other embodiments, the number of screening holes 221 may also be other, which is not specifically limited here and depends on the actual situation. The drum 2 includes a first cylinder 21 for screening out debris and a second cylinder 22 connected to the first cylinder 21 and used for screening wafers. As mentioned above, the five groups of screening holes 221 are arranged on the second cylinder 22. A number of evenly arranged screening holes 211 are arranged on the first cylinder 21. The automatic wafer screening machine also includes a spiral blade 6 arranged in the first cylinder 21 and connected to the connecting rod 10. The spiral blade 6 is fixedly connected to the first cylinder 21. The purpose of this arrangement is that the spiral blade 6 rotates synchronously with the first cylinder 21 to protect the target object from being scratched by the blade. The spiral blade 6 rotates counterclockwise to send the target into the second cylinder 22, and the spiral blade 6 rotates clockwise to send the target out of the first cylinder 21. As described above, in this embodiment, the first cylinder 21 is arranged close to the lifting mechanism 3, and the second cylinder 22 is arranged close to the first motor 5.

[0025] Please combine Figure 2 and Figure 4 , at least part of the connecting rod 10 is a gear shaft. In this embodiment, the connecting rod 10 arranged in the second cylinder 22 is a gear shaft. Accordingly, the blocking mechanism 7 includes a blocking plate 71 sleeved on the gear shaft, a gear 72 arranged on one side of the blocking plate 71 and meshed with the gear shaft, and a second motor 73 arranged on the other side of the blocking plate 71 and connected to the gear 72. When the second motor 73 is started, the second motor 73 rotates to drive the gear 72 to rotate, and the gear 72 meshes with the gear shaft to move along the gear shaft, thereby driving the blocking plate 71 to move relative to the gear shaft. The change in the rotation direction of the second motor 73 drives the blocking plate 71 to move forward or backward on the gear shaft. In this embodiment, the diameter of the blocking plate 71 is equal to the diameter of the drum 2 to prevent the target from flowing out from the gap between the blocking plate 71 and the second cylinder 22. A guide shaft is arranged in the drum 2, and the blocking plate 71 is connected to the guide shaft. As described above, the guide shaft is disposed in the second cylinder 22, and the baffle plate 71 moves along the guide shaft.

[0026] At least two openings 11 are provided on the base 1, and the automatic wafer screening machine further includes a drawer 12 connected to the opening 11. In this embodiment, two openings 11 are provided, and correspondingly, two drawers 12 are provided. One of the openings 11 is provided directly below the first cylinder 21, and the other opening 11 is provided directly below the second cylinder 22. Of course, in other embodiments, the number of the openings 11 may be other, depending on the actual situation, and is not specifically limited here, but depends on the actual situation.

[0027] The automatic wafer screening machine further includes an electric control box 8 connected to the base 1 and a button mechanism 9 connected to the electric control box 8 by signal. The electric control box 8 is arranged on one side of the base 1, and the button mechanism 9 is arranged on the base 1. The button mechanism 9 is used to start and close the first motor 5, the second motor 73 and the lifting mechanism 3. The button mechanism 9 is a conventional structure and will not be described in detail here.

[0028] The implementation process of the automatic wafer screening machine of the present invention is as follows: start the second motor 73 so that the second motor 73 drives the baffle plate 71 to move to the target screening hole 221, then pour the target object into the first cylinder 21, and start the lifting mechanism 3 to raise the drum 2 to be flush with the support platform 4. Start the first motor 5 so that the first motor 5 rotates counterclockwise, the first motor 5 rotates counterclockwise and then drives the connecting rod 10 to rotate, the connecting rod 10 rotates counterclockwise to drive the spiral blade 6 to rotate counterclockwise and then drives the drum 2 to rotate to screen the target object for crushed materials, and the target object after the crushed materials are screened is transported by the spiral blade 6 to the second cylinder 22 until it is screened at the baffle plate 71. When the material reaches the target screening hole 221, the sensor at the target screening hole 221 detects the presence of the material and prompts, and screens the material. After the screening is completed, the second motor 73 is started to move the baffle plate 71 to the screening hole 221 with the largest aperture, so that all the target objects fall from the screening hole 221 to be collected.

[0029] In summary: by providing the blocking mechanism 7, the blocking mechanism 7 moves the target object to the target screening hole 221 for screening, which is convenient and quick;

[0030] By providing a first cylinder 21 for screening out scraps and a second cylinder 22 connected to the first cylinder 21 and for screening wafers, the first cylinder 21 is used to screen out scraps to facilitate screening of target objects.

[0031] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0032] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An automatic wafer screening machine, connected to an electric control box signal, characterized in that: The invention comprises a base, a drum arranged on the base and provided with at least two groups of screening holes with different apertures, a first motor arranged on one side of the drum, a lifting mechanism arranged on the other side of the drum, a connecting rod for connecting the first motor and the lifting mechanism and passing through the drum, and a blocking mechanism arranged on the connecting rod and movable along the axial length direction of the connecting rod, wherein the blocking mechanism moves along the connecting rod so that the target object moves to the target screening hole for screening, at least part of the connecting rod is a gear shaft, and the blocking mechanism comprises a blocking plate sleeved on the gear shaft, a gear arranged on one side of the blocking plate and meshing with the gear shaft, and a gear arranged on the A second motor is located on the other side of the baffle plate and connected to the gear, the diameter of the baffle plate is equal to the diameter of the drum, the drum includes a first cylinder for screening out debris and a second cylinder connected to the first cylinder and for screening wafers, at least two groups of screening holes are arranged on the second cylinder, and the first cylinder is provided with a plurality of evenly arranged screening holes, the automatic wafer screening machine also includes a spiral fan blade arranged in the first cylinder and connected to the connecting rod, the spiral fan blade is fixedly connected to the first cylinder, and a sensor is also provided on each group of screening holes, and the sensor is used to detect whether there is a target object at the group of screening holes.

2. The automatic wafer screening machine according to claim 1, characterized in that: A guide shaft is arranged in the drum, and the baffle plate is connected to the guide shaft.

3. The automatic wafer screening machine according to claim 1, characterized in that: The lifting mechanism includes a lifting electric cylinder and a bearing seat connected to the lifting electric cylinder and used for supporting the connecting rod.

4. The automatic wafer screening machine according to claim 1, characterized in that: The automatic wafer screening machine also includes a universal ball bearing for connecting the first motor and the connecting rod.

5. The automatic wafer screening machine according to claim 1, characterized in that: At least two openings are arranged on the base, and the automatic wafer screening machine also includes a drawer connected to the openings.

6. The automatic wafer screening machine according to claim 1, characterized in that: The automatic wafer screening machine also includes an electric control box connected to the base and a button mechanism connected to the electric control box signal.

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