Memory module test temperature control device, control method, computer equipment and storage medium

Abstract

The present invention relates to a memory module test temperature control device, control method, computer equipment and storage medium. The control device includes: a test mainboard, a temperature control module, a high temperature cover assembly and a hollow plate. A plurality of memory modules to be tested are plugged into the test mainboard. The hollow plate is arranged above the test mainboard. The top of the memory module passes through the hollow plate and partially exposes above the hollow plate. The high temperature cover assembly is arranged above the hollow plate and is covered around the memory module. The input end of the temperature control module is connected to the test mainboard, and the output end is connected to the high temperature cover assembly. The temperature control module receives the memory temperature data from the test mainboard, and sends a temperature control instruction to the high temperature cover assembly to adjust the test temperature of the memory module. By arranging the hollow plate above the test mainboard and placing the high temperature cover assembly on the hollow plate, the temperature control space of the high temperature cover assembly is reduced to speed up the temperature adjustment. At the same time, the test mainboard and the high temperature cover assembly can be separated to improve the service life.

Description

Technical Field

[0001] The present invention relates to the field of memory module testing, and more specifically to a memory module testing temperature control device, a control method, a computer device and a storage medium. Background Art

[0002] The industry currently uses high-temperature cabinets to perform high-temperature tests on DRAM memory modules. By placing the test motherboard in the high-temperature cabinet and setting the temperature of the high-temperature cabinet, the DRAM memory module can be tested at high temperature under the system. At the same time, the test equipment used in the test process is expensive and scarce.

[0003] The existing DRAM memory module testing has the following specific shortcomings:

[0004] 1. DRAM memory module system under high temperature test memory plug and unplug inconvenient, test equipment is expensive, cost is high:

[0005] 2. The motherboard is tested for memory system at high temperature in a high temperature cabinet. The working environment temperature of the motherboard is high, which affects the operation of the motherboard components and reduces the test performance;

[0006] 3. The high temperature cabinet can only control the ambient temperature of the DRAM memory module, but cannot accurately control the surface temperature of the DRAM memory module;

[0007] 4. The high temperature cabinet has a large temperature control space and high test power consumption.

[0008] Therefore, in order to solve the above problems, there is a need to provide a memory module test temperature control device and control method. Summary of the invention

[0009] The purpose of the present invention is to overcome the defects of the prior art and provide a memory module test temperature control device, a control method, a computer device and a storage medium.

[0010] To achieve the above object, the present invention adopts the following technical solutions:

[0011] In the first aspect, the present invention proposes a memory module test temperature control device, comprising a test mainboard, a temperature control module, a high-temperature cover assembly and a hollow plate, wherein a plurality of memory modules to be tested are plugged into the test mainboard, a through hole is opened on the hollow plate, the hollow plate is arranged above the test mainboard, the top of the memory module passes through the hollow plate and is partially exposed above the hollow plate, the high-temperature cover assembly is arranged above the hollow plate, and is covered around the memory module, the input end of the temperature control module is connected to the test mainboard, and the output end is connected to the high-temperature cover assembly, the temperature control module receives the memory temperature data from the test mainboard, and sends temperature control instructions to the high-temperature cover assembly to adjust the test temperature of the memory module.

[0012] In a second aspect, the present invention provides a memory module test temperature control method, comprising the following steps:

[0013] Obtain memory temperature data of the memory module from the test motherboard and transmit it to the temperature control module;

[0014] Compare the acquired memory temperature data with the target test temperature to obtain a comparison result of the memory temperature and the target test temperature;

[0015] If the comparison result shows that the memory temperature is greater than the target test temperature, the temperature control module sends a cooling instruction to start the fan to cool the memory module;

[0016] If the comparison result shows that the memory temperature is lower than the target test temperature, the temperature control module sends a heating instruction to start the heating plate to cool the memory module.

[0017] In a third aspect, the present invention provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the memory module test temperature control method as described above when executing the computer program.

[0018] In a fourth aspect, the present invention provides a storage medium storing a computer program, which, when executed by a processor, can implement the memory module test temperature control method as described above.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention arranges a hollow plate above the test mainboard, the top of the memory module passes through the hollow plate and is exposed above the hollow plate, and a high-temperature cover assembly is placed on the hollow plate, thereby reducing the temperature control space of the high-temperature cover assembly and accelerating temperature regulation. At the same time, by arranging the hollow plate on the test mainboard, the test mainboard and the high-temperature cover assembly can be effectively separated, thereby avoiding the test mainboard from overheating during use, increasing the service life of the test equipment, and reducing the test cost.

[0020] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of the structure of a memory module test temperature control device provided by an embodiment of the present invention;

[0023] Figure 2 A schematic structural diagram of a memory module test temperature control device from another angle provided by an embodiment of the present invention;

[0024] Figure 3 A schematic structural diagram of a high temperature cover assembly of a memory module test temperature control device provided by an embodiment of the present invention;

[0025] Figure 4 A schematic diagram of the structure of a hollow plate of a memory module test temperature control device provided by an embodiment of the present invention;

[0026] Figure 5 A schematic block diagram of the structure of a memory module test temperature control device provided by an embodiment of the present invention;

[0027] Figure 6 A schematic block diagram of the structure of a memory module test temperature control device provided by another embodiment of the present invention;

[0028] Figure 7 A schematic diagram of a flow chart of a memory module test temperature control method provided by an embodiment of the present invention;

[0029] Figure 8 A schematic block diagram of a memory module test temperature control method provided by an embodiment of the present invention;

[0030] Fig. 9 A schematic block diagram of a computer device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0033] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0034] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0035] refer to Figure 1-6 The present invention provides a memory module test temperature control device, comprising a test mainboard 10, a temperature control module 20, a high temperature cover assembly 40 and a hollow plate 30, wherein a plurality of memory modules 50 to be tested are plugged into the test mainboard 10. Figure 4 As shown, a through hole 31 is opened on the hollow plate 30, and the hollow plate 30 is arranged above the test main board 10. The top of the memory module 50 passes through the hollow plate 30 and is partially exposed above the hollow plate 30. The high-temperature cover assembly 40 is arranged above the hollow plate 30, and the cover is arranged on all sides of the memory module 50. The input end of the temperature control module 20 is connected to the test main board 10, and the output end is connected to the high-temperature cover assembly 40. The temperature control module 20 receives the memory temperature data from the test main board 10, and sends a temperature control instruction to the high-temperature cover assembly 40 to adjust the test temperature of the memory module 50.

[0036] like Figure 5 As shown, when in use, a temperature sensor is provided on the memory module 50, and the temperature sensor is used to obtain the memory temperature data of the memory module 50 and transmit it to the test motherboard 10. The temperature sensor can measure the temperature of the memory surface, and the test program can be used to access the PCIE address space of the test motherboard 10 to read the temperature data of the temperature sensor, that is, the memory temperature data. After obtaining the memory temperature data, the memory temperature data is sent to the temperature control module 20 through the serial port of the test motherboard 10. The temperature control module 20 issues a temperature control instruction according to the received memory temperature data, controls the corresponding components to start, and adjusts the test temperature of the memory module 50. In the process of adjusting the temperature, the temperature data of the memory module 50 can be received at intervals in real time, and the temperature of the memory module 50 can be continuously adjusted.

[0037] refer to Figure 2 The hollow plate 30 is arranged above the test main board 10 through the support 60, and a temperature insulation layer is formed between the lower surface of the hollow plate 30 and the test main board 10. By installing the hollow plate 30 on the test main board 10 and placing the high temperature cover assembly 40 on the hollow plate 30, the high temperature cover assembly 40 is separated from the surface of the test main board 10, the components of the test main board 10 are protected, the heating space of the memory module 50 is reduced, the tightness of the high temperature cover is ensured, and at the same time, the high temperature cover assembly 40 is prevented from wearing the resistor and capacitor components near the memory slot during repeated plugging and unplugging of the memory, and the high temperature environment is prevented from affecting the performance of the resistor and capacitor components near the memory slot.

[0038] like Figure 5As shown, the temperature control module 20 includes a temperature control board for issuing temperature control instructions according to the memory temperature. The temperature control board is connected to the serial port of the test motherboard 10 through a serial port converter, and receives the memory temperature data from the test motherboard 10 through the serial port converter. The temperature control board receives data from the test motherboard 10 through the serial port and the serial port adapter, such as Figure 1 and 6 As shown, one temperature control board can be connected to a plurality of different test mainboards 10 or memory modules 50 at the same time, and receive temperature data of a plurality of memory modules.

[0039] In this embodiment, the temperature control board is an STM8 temperature control board.

[0040] like Figure 3 As shown, the high-temperature cover assembly 40 includes a cover body 41 covering the memory module 50, and a fan 43 and a heating plate 42 arranged on the cover body 41. The fan 43 and the heating plate 42 are electrically connected to the temperature control board. The fan 43 is used to start when the temperature control module 20 issues a cooling command, and continuously extract the air inside the cover body 41 to achieve cooling of the memory module 50; the heating plate 42 is used to start heating when the temperature control module 20 issues a heating command, and increase the internal temperature of the cover body 41.

[0041] Specifically, a mounting through hole is provided on the cover body 41 , and the fan 43 is mounted in the mounting through hole. When the fan 43 is working, the air inside the cover body 41 is drawn out from the mounting through hole.

[0042] Specifically, a memory slot is provided on the test motherboard 10, and the memory slot is connected to an adapter slot, and the memory module 50 is plugged into the adapter slot. By setting the adapter slot, it is possible to avoid wear and tear on resistor and capacitor components near the memory slot during repeated plugging and unplugging of the memory, thereby reducing the service life of the test motherboard 10.

[0043] The present invention arranges a hollow plate 30 above the test mainboard 10, and the top of the memory module 50 passes through the hollow plate 30 and is partially exposed above the hollow plate 30, and a high-temperature cover assembly 40 is placed on the hollow plate 30, thereby reducing the temperature control space of the high-temperature cover assembly 40 and accelerating temperature regulation. At the same time, by arranging the hollow plate 30 on the test mainboard 10, the test mainboard 10 and the high-temperature cover assembly 40 can be effectively separated, thereby preventing the test mainboard 10 from overheating during use, thereby increasing the service life of the test equipment and reducing the test cost.

[0044] Figure 7 FIG. 1 is a flow chart of a memory module test temperature control method provided by an embodiment of the present invention. Figure 7 As shown, the method includes the following steps S110 to S150.

[0045] S110, acquiring memory temperature data of the memory module from the test mainboard and transmitting the data to the temperature control module.

[0046] In this embodiment, a temperature sensor is provided on the temperature sensor, and the temperature sensor is used to obtain the memory temperature data of the memory module and transmit it to the test mainboard. The temperature sensor can measure the temperature of the memory surface, and the test program can be used to access the PCIE address space of the test mainboard to read the temperature data of the temperature sensor, that is, the memory temperature data. After obtaining the memory temperature data, the memory temperature data is sent to the temperature control module through the serial port of the test mainboard. The temperature control module issues a temperature control instruction according to the received memory temperature data, controls the corresponding components to start, and adjusts the test temperature of the memory module. In the process of adjusting the temperature, the temperature data of the memory module can be received at intervals in real time, and the temperature of the memory module can be continuously adjusted.

[0047] refer to Figure 8 In another embodiment of the present invention, steps S111-S113 are also included before step S110.

[0048] S111, placing the hollow plate on the test main board.

[0049] In this embodiment, the hollow plate is arranged above the test mainboard through the support member 60, and a temperature insulation layer is formed between the lower surface of the hollow plate and the test mainboard. By installing the hollow plate on the test mainboard and placing the high temperature cover assembly on the hollow plate, the high temperature cover assembly is separated from the surface of the test mainboard, protecting the components of the test mainboard, reducing the heating space of the memory module, ensuring the tightness of the high temperature cover, and preventing the high temperature cover assembly from wearing the resistor and capacitor components near the memory slot during repeated plugging and unplugging of the memory, and preventing the high temperature environment from affecting the performance of the resistor and capacitor components near the memory slot.

[0050] S112, connecting the memory module to be tested to the test mainboard.

[0051] In this embodiment, a temperature sensor is provided, and the temperature sensor is used to obtain the memory temperature data of the memory module. The temperature sensor can measure the temperature of the memory surface, and the test program can be used to access the PCIE address space of the test motherboard to read the temperature data of the temperature sensor, that is, the memory temperature data. After obtaining the memory temperature data, the memory temperature data is sent to the temperature control module through the serial port of the test motherboard. The temperature control module issues a temperature control instruction according to the received memory temperature data, controls the corresponding components to start, and adjusts the test temperature of the memory module. In the process of adjusting the temperature, the temperature data of the memory module can be received at intervals in real time, and the temperature of the memory module can be continuously adjusted.

[0052] S113, placing a high-temperature cover assembly on the hollow plate and covering the corresponding memory module.

[0053] In this embodiment, the high-temperature cover assembly includes a cover body covering the memory module, and a fan and a heating plate arranged on the cover body. The fan and the heating plate are electrically connected to the temperature control board. The fan is used to start when the temperature control module issues a cooling command, and continuously extract the air inside the cover body to achieve cooling of the memory module; the heating plate is used to start heating when the temperature control module issues a heating command, and increase the temperature inside the cover body.

[0054] S120: Compare the acquired memory temperature data with the target test temperature to obtain a comparison result of the memory temperature and the target test temperature.

[0055] S130. If the comparison result shows that the memory temperature is greater than the target test temperature, the temperature control module sends a cooling instruction to start the fan to cool the memory module.

[0056] S140: If the comparison result shows that the memory temperature is lower than the target test temperature, the temperature control module sends a heating instruction to start the heating plate to heat the memory module.

[0057] In this embodiment, for steps S120-S140, the target test temperature can be a temperature value point or a temperature range. The temperature control module can determine whether the temperature of the memory module currently being tested is too high or too low by comparing the acquired memory temperature data with the target test temperature, and after determining the result, issue a corresponding temperature control instruction, which includes a cooling instruction and a heating instruction. Specifically, if a cooling instruction is issued, the fan is started to cool the memory module; if a heating instruction is issued, the heating plate is started to cool the memory module.

[0058] The present invention arranges a hollow plate above the test mainboard, the top of the memory module passes through the hollow plate and is exposed above the hollow plate, and a high-temperature cover assembly is placed on the hollow plate, thereby reducing the temperature control space of the high-temperature cover assembly and accelerating temperature regulation. At the same time, by arranging the hollow plate on the test mainboard, the test mainboard and the high-temperature cover assembly can be effectively separated, thereby avoiding the test mainboard from overheating during use, increasing the service life of the test equipment, and reducing the test cost.

[0059] See also Fig. 9 , Fig. 9 5 is a schematic block diagram of a computer device provided in an embodiment of the present application. The computer device 500 may be a terminal or a server, wherein the terminal may be an electronic device with communication functions such as a smart phone, a tablet computer, a laptop computer, a desktop computer, a personal digital assistant, and a wearable device. The server may be an independent server or a server cluster composed of multiple servers.

[0060] See also Fig. 9The computer device 500 includes a processor 502 , a memory and a network interface 505 connected via a system bus 501 , wherein the memory may include a non-volatile storage medium 503 and an internal memory 504 .

[0061] The non-volatile storage medium 503 can store an operating system 5031 and a computer program 5032. The computer program 5032 includes program instructions, and when the program instructions are executed, the processor 502 can execute a memory module test temperature control method.

[0062] The processor 502 is used to provide computing and control capabilities to support the operation of the entire computer device 500 .

[0063] The internal memory 504 provides an environment for the operation of the computer program 5032 in the non-volatile storage medium 503. When the computer program 5032 is executed by the processor 502, the processor 502 can execute a memory module test temperature control method.

[0064] The network interface 505 is used to communicate with other devices over the network. Fig. 9 The structure shown in the figure is merely a block diagram of a portion of the structure related to the solution of the present application, and does not constitute a limitation on the computer device 500 to which the solution of the present application is applied. The specific computer device 500 may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0065] The processor 502 is used to run a computer program 5032 stored in the memory.

[0066] It should be understood that in the embodiment of the present application, the processor 502 may be a central processing unit (CPU), and the processor 502 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0067] It can be understood by those skilled in the art that all or part of the processes in the method for implementing the above embodiment can be completed by instructing the relevant hardware through a computer program. The computer program includes program instructions, and the computer program can be stored in a storage medium, which is a computer-readable storage medium. The program instructions are executed by at least one processor in the computer system to implement the process steps of the embodiment of the above method.

[0068] Therefore, the present invention also provides a storage medium. The storage medium may be a computer-readable storage medium.

[0069] The storage medium may be a USB flash drive, a mobile hard disk, a read-only memory (ROM), a magnetic disk, or an optical disk, or any other computer-readable storage medium that can store program codes.

[0070] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in terms of function in the above description. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0071] In the several embodiments provided by the present invention, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of each unit is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0072] The steps in the method of the embodiment of the present invention can be adjusted in order, combined and deleted according to actual needs. The units in the device of the embodiment of the present invention can be combined, divided and deleted according to actual needs. In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0073] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, terminal, or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention.

[0074] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A memory module test temperature control device, characterized in that: It includes a test mainboard, a temperature control module, a high-temperature cover assembly and a hollow plate. The test mainboard is plugged with a plurality of memory modules to be tested. The hollow plate is provided with through holes. The hollow plate is arranged above the test mainboard. The top of the memory module passes through the hollow plate and is partially exposed above the hollow plate. The high-temperature cover assembly is arranged above the hollow plate and is covered around the memory module. The input end of the temperature control module is connected to the test mainboard, and the output end is connected to the high-temperature cover assembly. The temperature control module receives the memory temperature data from the test mainboard, and sends a temperature control instruction to the high-temperature cover assembly to adjust the test temperature of the memory module. The temperature control module includes a temperature control board for issuing temperature control instructions according to the memory temperature; The high temperature cover assembly comprises a cover body covering the memory module, and a fan and a heating plate arranged on the cover body, wherein the fan and the heating plate are both electrically connected to the temperature control board; The hollow plate is arranged above the test main board through a support member, and a temperature insulation layer is formed between the lower surface of the hollow plate and the test main board.

2. The memory module test temperature control device according to claim 1, characterized in that: The temperature control board is connected to the serial port of the test mainboard through a serial port converter, and receives memory temperature data from the test mainboard through the serial port converter; a temperature sensor is provided on the memory module, and the temperature sensor is used to obtain the memory temperature data of the memory module and transmit it to the test mainboard.

3. The memory module test temperature control device according to claim 1, characterized in that: The test mainboard is provided with a memory slot, the memory slot is connected with an adapter slot, and the memory module is plugged into the adapter slot.

4. A memory module test temperature control method, the method being implemented by the memory module test temperature control device according to any one of claims 1 to 3, characterized in that: The method comprises the following steps: Obtain memory temperature data of the memory module from the test motherboard and transmit it to the temperature control module; Compare the acquired memory temperature data with the target test temperature to obtain a comparison result of the memory temperature and the target test temperature; If the comparison result shows that the memory temperature is greater than the target test temperature, the temperature control module sends a cooling instruction to start the fan to cool the memory module; If the comparison result shows that the memory temperature is lower than the target test temperature, the temperature control module sends a heating instruction to start the heating plate to heat the memory module; Before the step of obtaining the memory temperature data of the memory module from the test mainboard and transmitting it to the temperature control module, the method includes: Setting the hollow plate on the test main board; Connect the memory module to be tested to the test motherboard; The high temperature cover component is arranged on the hollow plate and covers the corresponding memory module.

5. A computer device, characterized in that: The computer device includes a memory and a processor, the memory stores a computer program, and the processor implements the memory module test temperature control method as claimed in claim 4 when executing the computer program.

6. A storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the memory module test temperature control method as claimed in claim 4 can be implemented.

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