Semiconductor Etching Equipment

Abstract

The present invention provides a semiconductor etching device, comprising a processing chamber, a conveying mechanism, a transfer chamber, a device front-end module and a front loading chamber, wherein the processing chamber is used for etching semiconductor wafers, the transfer chamber is arranged between the processing chamber and the device front-end module, the front loading chamber is used for connecting the transfer chamber and the device front-end module, the conveying mechanism is used for loading or unloading semiconductor wafers, and the device front-end module is arranged between the conveying mechanism and the front loading chamber; the semiconductor etching device also comprises a cleaning system, and the device front-end module is arranged between the cleaning system and the front loading chamber; the cleaning system comprises a rotatable platform and a liquid supply unit, the rotating platform is used for carrying and rotating semiconductor wafers, and the liquid supply unit is used for supplying deionized water to cooperate with the rotating platform to clean the semiconductor wafers.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor equipment, and in particular to semiconductor etching equipment. Background Art

[0002] In the semiconductor processing process, plasma etching is a common method used to etch semiconductor wafers to form one or more layers of circuits on the semiconductor wafer. After plasma etching, residual particles or fumes will remain on the semiconductor wafer. The residual particles or fumes not only contaminate the etched semiconductor wafer itself, but also contaminate the adjacent wafers stored in the equipment.

[0003] Particle contamination is a major concern during the semiconductor wafer processing process. These contamination particles fall onto unprocessed semiconductor wafers and accumulate, which can easily lead to incomplete etching (or "under-etching") of the contaminated semiconductor wafers. That is, when the etched semiconductor wafers are waiting in the equipment, if the residual particles on the semiconductor wafers are not removed, the residual particles will solidify and affect the processing in the subsequent equipment. Therefore, the residual particles on the semiconductor wafers may lead to a decrease in the production yield and performance of the semiconductor. Summary of the invention

[0004] In view of the above situation, it is necessary to provide a semiconductor etching device capable of removing residual particles on a semiconductor wafer.

[0005] A semiconductor etching device comprises a processing chamber for etching semiconductor wafers; a carrying mechanism for loading or unloading semiconductor wafers; a device front-end module for conveying semiconductor wafers; a transfer chamber arranged between the processing chamber and the device front-end module for transferring semiconductor wafers; and a front-loading chamber for connecting the transfer chamber and the device front-end module, wherein the device front-end module is arranged between the carrying mechanism and the front-loading chamber; the semiconductor etching device also comprises a cleaning system, wherein the cleaning system is connected to the device front-end module, and the device front-end module is arranged between the cleaning system and the front-loading chamber; the cleaning system comprises a rotatable platform and a liquid supply unit, wherein the rotating platform is used to carry and rotate the semiconductor wafer, and the liquid supply unit is used to supply deionized water to cooperate with the rotating platform to clean the semiconductor wafer.

[0006] Optionally, the air pressure of the cleaning system is lower than the air pressure of the equipment front-end module to prevent contamination particles from flowing from the cleaning system into the equipment front-end module.

[0007] Optionally, the cleaning system includes a storage tank for storing deionized water, the liquid supply unit is connected to the storage tank to obtain deionized water, and the cleaning system also includes a drying device for eliminating residual deionized water on the semiconductor wafer.

[0008] Optionally, the cleaning system further comprises a recovery device for recovering used deionized water.

[0009] Optionally, the liquid supply unit is arranged above the rotating platform, and the recovery device is connected to the bottom of the rotating platform.

[0010] Optionally, the drying device includes a heating unit, which is disposed on the rotating platform and is used to heat the semiconductor wafer.

[0011] Optionally, the drying device is disposed on one side of the rotating platform, and is used to provide hot air to the rotating platform to dry the semiconductor wafer.

[0012] Optionally, the cleaning system further comprises a temperature control device, wherein the temperature control device is arranged on the liquid supply unit to adjust the temperature of the deionized water.

[0013] Optionally, a humidity sensor is provided in the front loading chamber for detecting whether water vapor in the cleaning system enters the front loading chamber.

[0014] The semiconductor etching equipment is connected to a cleaning system at the front-end module of the equipment. After being processed, the semiconductor wafer is sent to the cleaning unit by the front-end module of the equipment for cleaning, thereby effectively removing contamination particles on the semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 FIG. 1 is a schematic structural diagram of a semiconductor etching device in a first embodiment.

[0016] Figure 2 for Figure 1 Schematic diagram of the cleaning system in semiconductor etching equipment.

[0017] Figure 3 FIG. 1 is a schematic structural diagram of a cleaning system in a second embodiment.

[0018] Figure 4 It is a schematic structural diagram of the cleaning system in the third embodiment.

[0019] Figure 5 It is a schematic structural diagram of the cleaning system in the fourth embodiment.

[0020] Figure 6 FIG. 4 is a schematic structural diagram of a semiconductor etching device in a fourth embodiment.

[0021] Description of main component symbols:

[0022] Semiconductor Etching Equipment 100 Processing room 1 Transfer Room 2 Transfer mechanism 21 Front loading compartment 3 Humidity sensor 31 Equipment front-end module 4 Robotic Arm 41 Transport mechanism 5 Cleaning system 6 Rotating platform 61 Liquid supply unit 62 Storage slots 63 Drying device 64 Heating unit 641 Drying unit 642 Recovery device 65 Temperature control device 66 Semiconductor Wafer 7 DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a centered element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may also be a centered element. When an element is considered to be "set on" another element, it may be directly set on the other element or there may also be a centered element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.

[0026] The present application provides a semiconductor etching device, comprising a processing chamber for etching semiconductor wafers; a carrying mechanism for loading or unloading semiconductor wafers; a device front-end module for conveying semiconductor wafers; a transfer chamber, arranged between the processing chamber and the device front-end module, for transferring semiconductor wafers; and a front-loading chamber, for connecting the transfer chamber and the device front-end module, the device front-end module being arranged between the carrying mechanism and the front-loading chamber; the semiconductor etching device also comprises a cleaning system, the cleaning system is connected to the device front-end module, the device front-end module is arranged between the cleaning system and the front-loading chamber; the cleaning system comprises a rotatable platform and a liquid supply unit, the rotating platform is used to carry and rotate the semiconductor wafer, and the liquid supply unit is used to supply deionized water to cooperate with the rotating platform to clean the semiconductor wafer.

[0027] The semiconductor etching equipment is connected to a cleaning system at the front-end module of the equipment. After being processed, the semiconductor wafer is sent to the cleaning unit by the front-end module of the equipment for cleaning, thereby effectively removing contamination particles on the semiconductor wafer.

[0028] Some embodiments of the present application are described in detail. In the absence of conflict, the following embodiments and features of the embodiments can be combined with each other.

[0029] First embodiment

[0030] See also Figure 1 and Figure 2 In the first embodiment, the semiconductor etching equipment 100 includes a processing chamber 1, a transfer chamber 2, a front loading chamber 3, a device front end module 4 and a conveying mechanism 5. The processing chamber 1 is used to etch a semiconductor wafer 7. The transfer chamber 2 is arranged between the processing chamber 1 and the device front end module 4, and is used to transfer the semiconductor wafer 7. The front loading chamber 3 is used to connect the transfer chamber 2 and the device front end module 4. The device front end module 4 is arranged between the conveying mechanism 5 and the front loading chamber 3, and is used to transfer the semiconductor wafer 7. The conveying mechanism 5 is used to load or unload the semiconductor wafer 7 from the device front end module 4.

[0031] The semiconductor etching equipment 100 further includes a cleaning system 6, which is connected to the equipment front-end module 4, and the equipment front-end module 4 is disposed between the cleaning system 6 and the front loading chamber 3 to prevent moisture from entering the front loading chamber 3 and thereby polluting the etching environment. The cleaning system 6 includes a rotatable platform 61 and a liquid supply unit 62, wherein the rotating platform 61 is used to carry and rotate the semiconductor wafer 7, and the liquid supply unit 62 is used to supply deionized water to cooperate with the rotating platform 61 to clean the semiconductor wafer 7.

[0032] There may be multiple processing chambers 1, and a transfer mechanism 21 is provided in the transfer chamber 2, and the transfer mechanism 21 is used to sequentially transfer the semiconductor wafer 7 to multiple processing chambers 1 for processing. When the semiconductor wafer 7 completes the processing process, the transfer mechanism 21 takes out the semiconductor wafer 7 from the transfer chamber 2, and after the pre-loading chamber 3 is connected with the processing chamber 1, the transfer mechanism 21 transfers the semiconductor wafer 7 to the pre-loading chamber 3. It can be understood that unprocessed semiconductor wafers can also be moved from the pre-loading chamber 3 to the transfer chamber 2 by the transfer mechanism 21, and after the connection between the pre-loading chamber 3 and the processing chamber 1 is closed, the transfer mechanism 21 sends the unprocessed semiconductor wafers to multiple processing chambers 1 in sequence.

[0033] After the processed semiconductor wafer 7 is sent to the front loading chamber 3, the connection between the front loading chamber 3 and the processing chamber 1 is closed, and the equipment front end module 4 is connected to the front loading chamber 3. A robot arm 41 is provided in the equipment front end module 4, which is used to transfer the processed semiconductor wafer 7 from the front loading chamber 3 to the cleaning system 6. After the semiconductor wafer 7 completes the cleaning process in the cleaning system 6, the robot arm 41 takes the semiconductor wafer 7 out of the cleaning system 6 and transfers it to the wafer box on the conveying mechanism 5, and the conveying mechanism 5 sends the wafer box containing the semiconductor wafer 7 out of the semiconductor etching equipment 100. It can be understood that the conveying mechanism 5 is also used to send unprocessed semiconductor wafers to the equipment front end module 4, and the robot arm 41 directly sends the unprocessed semiconductor wafer into the front loading chamber 3.

[0034] After the semiconductor wafer 7 is sent into the cleaning system 6, the connection between the device front-end module 4 and the cleaning system 6 is closed and sealed to prevent pollutants such as contaminants, deionized water, etc. during the cleaning process from entering the device front-end module 4. Furthermore, the internal air pressure of the cleaning system 6 is lower than the internal air pressure of the device front-end module 4. Once a leak occurs at the connection between the device front-end module 4 and the cleaning system 6, the pressure difference will cause the gas to flow from the device front-end module 4 to the cleaning system 6, thereby preventing pollutants from flowing from the cleaning system 6 into the device front-end module 4.

[0035] The cleaning system 6 includes a cleaning chamber 60 and a storage tank 63. The cleaning chamber 60 is connected to the equipment front-end module 4. The storage tank 63 is used to store deionized water. The liquid supply unit 62 is connected to the storage tank 63 to obtain deionized water. The cleaning system also includes a drying device 64 for removing residual deionized water on the semiconductor wafer 7.

[0036] The rotating platform 61 and the drying device 64 are arranged in the cleaning chamber 60, the storage tank 63 is arranged outside the cleaning chamber 60, and the liquid supply unit 62 includes a plurality of liquid supply pipes for connecting the storage tank 63 and the cleaning chamber 60. In the first embodiment, there are two liquid supply pipes, which are respectively located at the upper end and the lower end of the rotating platform 61. The deionized water in the storage tank 63 flows into the cleaning chamber 60 through the two liquid supply pipes, and is cleaned from the upper surface and the lower surface of the semiconductor wafer 7. At the same time, the rotating platform 61 drives the semiconductor wafer 7 to rotate. A liquid outlet is provided at the lower part of the cleaning chamber 60 for draining out the used deionized water.

[0037] Second embodiment

[0038] See also Figure 1 and Figure 3In the second embodiment, the semiconductor etching equipment 100 includes a processing chamber 1, a transfer chamber 2, a front loading chamber 3, a device front end module 4 and a carrying mechanism 5. The processing chamber 1 is used to etch a semiconductor wafer 7. The transfer chamber 2 is arranged between the processing chamber 1 and the device front end module 4, and is used to transfer the semiconductor wafer 7. The front loading chamber 3 is used to connect the transfer chamber 2 and the device front end module 4. The device front end module 4 is arranged between the carrying mechanism 5 and the front loading chamber 3, and is used to transfer the semiconductor wafer 7. The carrying mechanism 5 is used to load or unload the semiconductor wafer 7 from the device front end module 4. The semiconductor etching equipment 100 also includes a cleaning system 6, which is connected to the device front end module 4, and the device front end module 4 is arranged between the cleaning system 6 and the front loading chamber 3 to prevent moisture from entering the front loading chamber 3, thereby polluting the etching environment. The cleaning system 6 includes a rotatable platform 61 and a liquid supply unit 62 . The rotatable platform 61 is used to carry and rotate the semiconductor wafer 7 . The liquid supply unit 62 is used to supply deionized water to clean the semiconductor wafer 7 in cooperation with the rotatable platform 61 .

[0039] The semiconductor etching device of the second embodiment is substantially the same as the semiconductor etching device of the first embodiment, except that, in the second embodiment, the cleaning system 6 further includes a recovery device 65 for recovering the used deionized water. The liquid supply unit 62 is disposed above the rotating platform 61, and the recovery device 65 is connected to the bottom of the rotating platform 61.

[0040] In the second embodiment, the liquid supply unit 62 includes a liquid supply pipe connected to the top of the cleaning chamber 60. A through groove is opened in the middle of the rotating platform 61, and deionized water flows in from the upper part of the cleaning chamber 60 to clean the upper surface of the semiconductor wafer 7, and then flows through the lower part of the semiconductor wafer 7, and flows from the through groove in the middle of the rotating platform 61 to the lower part of the cleaning chamber 60. The recovery device 65 is connected to the lower part of the cleaning chamber 60 through a recovery pipe, and the used deionized water flows into the recovery device 65 through the recovery pipe to complete the deionized water recovery process. It can be understood that in other embodiments, the number of liquid supply pipes and recovery pipes can be multiple, and this application is not limited to this.

[0041] Third embodiment

[0042] See also Figure 1 and Figure 4In the third embodiment, the semiconductor etching equipment 100 includes a processing chamber 1, a transfer chamber 2, a front loading chamber 3, a device front end module 4 and a carrying mechanism 5. The processing chamber 1 is used to etch a semiconductor wafer 7. The transfer chamber 2 is arranged between the processing chamber 1 and the device front end module 4, and is used to transfer the semiconductor wafer 7. The front loading chamber 3 is used to connect the transfer chamber 2 and the device front end module 4. The device front end module 4 is arranged between the carrying mechanism 5 and the front loading chamber 3, and is used to transfer the semiconductor wafer 7. The carrying mechanism 5 is used to load or unload the semiconductor wafer 7 from the device front end module 4. The semiconductor etching equipment 100 also includes a cleaning system 6, which is connected to the device front end module 4, and the device front end module 4 is arranged between the cleaning system 6 and the front loading chamber 3 to prevent moisture from entering the front loading chamber 3, thereby polluting the etching environment. The cleaning system 6 includes a rotatable platform 61 and a liquid supply unit 62 . The rotatable platform 61 is used to carry and rotate the semiconductor wafer 7 . The liquid supply unit 62 is used to supply deionized water to clean the semiconductor wafer 7 in cooperation with the rotatable platform 61 .

[0043] The semiconductor etching equipment of embodiment three is substantially the same as the semiconductor etching equipment of embodiment two, except that, in the third embodiment, the drying device 64 includes a heating unit 641 and a drying unit 642, wherein the heating unit 641 is disposed on the rotating platform 61 for heating the semiconductor wafer 7, and the drying unit 642 is disposed on one side of the rotating platform 61 for providing hot air to the rotating platform 61 for drying the semiconductor wafer 7.

[0044] Specifically, the heating unit 641 is arranged on the upper end surface of the rotating platform 61. After the semiconductor wafer 7 is cleaned with deionized water, the heating unit 641 is connected to the power supply to generate heat, thereby heating the semiconductor wafer 7 and accelerating the evaporation of the residual liquid on the semiconductor wafer 7. The drying unit 642 is fixed to the side wall of the cleaning chamber 60. After the semiconductor wafer 7 is cleaned with deionized water, the drying unit 642 generates a hot air flow and blows it toward the semiconductor wafer. It can be understood that in other embodiments, the number of the drying units 642 can be multiple, evenly distributed on the inner circumference of the cleaning chamber 60. The heating unit 641 can also be arranged in the rotating platform 61 to heat the semiconductor wafer 7 through the rotating platform 61.

[0045] Fourth embodiment

[0046] See also Figure 5 and Figure 6In the fourth embodiment, the semiconductor etching equipment 100 includes a processing chamber 1, a transfer chamber 2, a front loading chamber 3, a device front end module 4 and a carrying mechanism 5. The processing chamber 1 is used to etch a semiconductor wafer 7. The transfer chamber 2 is arranged between the processing chamber 1 and the device front end module 4, and is used to transfer the semiconductor wafer 7. The front loading chamber 3 is used to connect the transfer chamber 2 and the device front end module 4. The device front end module 4 is arranged between the carrying mechanism 5 and the front loading chamber 3, and is used to transfer the semiconductor wafer 7. The carrying mechanism 5 is used to load or unload the semiconductor wafer 7 from the device front end module 4. The semiconductor etching equipment 100 also includes a cleaning system 6, which is connected to the device front end module 4, and the device front end module 4 is arranged between the cleaning system 6 and the front loading chamber 3 to prevent moisture from entering the front loading chamber 3, thereby polluting the etching environment. The cleaning system 6 includes a rotatable platform 61 and a liquid supply unit 62 . The rotatable platform 61 is used to carry and rotate the semiconductor wafer 7 . The liquid supply unit 62 is used to supply deionized water to clean the semiconductor wafer 7 in cooperation with the rotatable platform 61 .

[0047] The semiconductor etching equipment of embodiment four is substantially the same as the semiconductor etching equipment of embodiment one, except that, in the fourth embodiment, the cleaning system 6 further includes a recovery device 65 and a temperature control device 66, the recovery device 65 is connected to the liquid outlet at the bottom of the cleaning chamber 60, and is used to recover used deionized water, and the temperature control device 66 is arranged on the liquid supply unit 62 to adjust the temperature of the deionized water.

[0048] Specifically, the multiple liquid supply pipes of the liquid supply unit 62 pass through the temperature control device 66. The temperature control device 66 sets a preset value according to the temperature of the semiconductor wafer 7 to be cleaned. The deionized water is heated or cooled to the preset value when flowing through the temperature control device 66, so as to avoid a large difference between the temperature of the deionized water and the temperature of the semiconductor wafer 7, thereby reducing the possibility of cracking the semiconductor wafer.

[0049] A humidity sensor 31 is provided in the pre-loading chamber 3, which is used to detect whether the water vapor in the cleaning system 6 enters the pre-loading chamber 3. Specifically, the humidity sensor 31 detects the gas humidity in the pre-loading chamber 3. If the detection result is greater than or equal to a preset value, it is determined that the water vapor enters the pre-loading chamber 3. The humidity sensor 31 issues an alarm message according to the detection result to remind the staff to clean the pre-loading chamber 3 in time. At the same time, the connection between the pre-loading chamber 3 and the transfer chamber 2 remains locked until the detection result of the humidity sensor 31 is less than the preset value, thereby preventing the water vapor from further contaminating the transfer chamber 2 and the processing chamber 1.

[0050] The above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention is described in detail with reference to the above preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A semiconductor etching device, characterized in that: include a processing chamber for etching semiconductor wafers; A carrying mechanism, used for loading or unloading the semiconductor wafer; A device front-end module, used for conveying the semiconductor wafer; A transfer chamber, disposed between the processing chamber and the equipment front-end module, for transferring the semiconductor wafer; and A front loading chamber, used to connect the transfer chamber and the equipment front end module, the equipment front end module is arranged between the carrying mechanism and the front loading chamber; The semiconductor etching equipment further comprises a cleaning system, wherein the internal air pressure of the cleaning system is lower than the internal air pressure of the front-end module of the equipment, the cleaning system is connected to the front-end module of the equipment, and the front-end module of the equipment is arranged between the cleaning system and the front loading chamber; The cleaning system includes a rotatable platform, a liquid supply unit, a cleaning chamber, a storage tank and a drying device. The rotating platform is used to carry and rotate the semiconductor wafer. The liquid supply unit includes two liquid supply pipes, which are respectively located at the upper end and the lower end of the rotating platform. The storage tank is used to store deionized water. The two liquid supply pipes are connected to the storage tank to obtain the deionized water. The cleaning chamber is connected to the front-end module of the equipment. The deionized water in the storage tank flows into the cleaning chamber through the two liquid supply pipes, and cooperates with the rotating platform to clean the upper and lower surfaces of the semiconductor wafer. The drying device includes a drying unit, which is arranged on one side of the rotating platform and is used to provide hot air to the rotating platform to eliminate the deionized water remaining on the semiconductor wafer.

2. The semiconductor etching equipment according to claim 1, characterized in that The air pressure of the cleaning system is lower than the air pressure of the equipment front-end module to prevent contamination particles from flowing from the cleaning system into the equipment front-end module.

3. The semiconductor etching equipment according to claim 1, characterized in that The cleaning system also includes a recovery device for recovering used deionized water.

4. The semiconductor etching equipment according to claim 1, characterized in that The drying device comprises a heating unit, which is arranged on the rotating platform and is used for heating the semiconductor wafer.

5. The semiconductor etching equipment according to claim 1, characterized in that The cleaning system further comprises a temperature control device, which is arranged on the liquid supply unit to adjust the temperature of the deionized water.

6. The semiconductor etching equipment according to claim 1, characterized in that A humidity sensor is disposed in the front loading chamber to detect whether water vapor in the cleaning system enters the front loading chamber.

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