Three-chamber heat sink case for personal computer

Abstract

The present invention discloses a three-chamber heat dissipation case for a personal computer, comprising: a case frame surrounding a case accommodating space, a right outer plate, a left outer plate, a central solid partition and a slot partition. The central solid partition occupies an entire cross-sectional area in the case accommodating space and divides the case accommodating space into a first case space and a second case space. The slot partition occupies an entire cross-sectional area in the second case space and divides the second case space into a third case space. By gravity and convection force, the heat generated in each case space will not affect each other and can be transmitted to the outside.

Description

Technical Field

[0001] The invention relates to a computer case, and more particularly to a three-chamber heat dissipation case for a personal computer applied to a small-size computer with high-performance hardware. Background Art

[0002] Consumers are demanding small form factor computers with high performance hardware. However, small computers are often unable to cool high power central processing units (CPU's) and graphics processing units (GPU's) at acceptable noise levels. Many computer systems use top-to-bottom fans that blow heat from the CPU and / or GPU to the motherboard components, thus exacerbating the cooling problem of the system. Small computer cases are usually equipped with small diameter high speed fans (e.g., 40mm, 60mm, 80mm), but they generate a lot of noise when running at high speeds.

[0003] How to improve the heat dissipation effect of small computers and reduce the noise generated by the cooling fan is a goal that relevant technical personnel urgently need to work hard on. Summary of the invention

[0004] In view of the above, an object of the present invention is to provide a three-chamber heat dissipation case for a personal computer, comprising a case frame surrounding a case accommodating space, a right outer plate located in a first YZ plane of the three-chamber heat dissipation case, a left outer plate located in a second YZ plane of the three-chamber heat dissipation case, a central solid partition located in the case accommodating space, and a slot partition;

[0005] The three-chamber heat dissipation housing has a housing top located in a first XY plane of the three-chamber heat dissipation housing, a housing bottom located in a second XY plane of the three-chamber heat dissipation housing, a housing front located in a first XZ plane of the three-chamber heat dissipation housing, and a housing rear located in a second XZ plane of the three-chamber heat dissipation housing;

[0006] The central solid partition occupies an entire cross-sectional area in the housing space, and the central solid partition is located in a third YZ plane of the three-chamber heat dissipation housing, wherein the third YZ plane is located in the middle position of the three-chamber heat dissipation housing in the X-axis direction, wherein the central solid partition extends from the top of the housing to the bottom of the housing, and from the front end of the housing to the rear end of the housing; the central solid partition divides the housing space into a first housing space and a second housing space;

[0007] The tank chamber partition is located in the second casing space, occupies an entire cross-sectional area in the second casing space and is located in an XY plane, and separates the second casing space into a third casing space; wherein, the first casing space forms a first heat tank chamber of the three-chamber heat dissipation casing, the second casing space forms a second heat tank chamber of the three-chamber heat dissipation casing; and the third casing space forms a third heat tank chamber of the three-chamber heat dissipation casing.

[0008] Another technical means of the present invention is that the second casing space is used to enclose a mainboard and a central processing unit corresponding to the mainboard.

[0009] Another technical means of the present invention is that the first casing space is used to enclose a graphics processing unit.

[0010] Another technical means of the present invention is that the third casing space is used to enclose a power supply unit.

[0011] Another technical means of the present invention is that the first casing space is used to enclose a first heat dissipation unit.

[0012] Another technical means of the present invention is that the second casing space is used to enclose a second heat dissipation unit.

[0013] Another technical means of the present invention is that the above-mentioned first heat dissipation unit is connected to a water pump so that the coolant liquid flows from a heat source of the three-chamber heat dissipation casing to the first heat dissipation unit, wherein the coolant liquid removes heat from the heat source and the coolant liquid is cooled in the first heat dissipation unit.

[0014] Another technical means of the present invention is that the above-mentioned second heat dissipation unit is connected to a water pump so that the coolant liquid flows from a heat source of the three-chamber heat dissipation casing to the second heat dissipation unit, wherein the coolant liquid removes heat from the heat source and the coolant liquid is cooled in the second heat dissipation unit.

[0015] Another technical means of the present invention is that the above-mentioned three-chamber heat dissipation casing further includes at least one exhaust fan arranged on the top of the casing, wherein the at least one exhaust fan extracts gas from the first heat tank chamber and the second heat tank chamber of the three-chamber heat dissipation casing.

[0016] Another technical means of the present invention is that the three-chamber heat dissipation casing further includes at least one exhaust fan disposed in the third heat tank chamber to provide airflow to the power supply unit according to the internal temperature of the power supply unit.

[0017] Another technical means of the present invention is that the right side outer plate allows airflow to flow from the outside of the three-chamber heat dissipation casing into the three-chamber heat dissipation casing.

[0018] Another technical means of the present invention is that the left outer plate allows airflow to flow from the outside of the three-chamber heat dissipation casing into the three-chamber heat dissipation casing.

[0019] Another technical means of the present invention is to enable airflow to flow from the outside of the three-chamber heat dissipation casing into the three-chamber heat dissipation casing at the bottom of the casing.

[0020] The beneficial effect of the present invention is that the central solid partition and the slot chamber partition divide the casing accommodating space into independent first casing space, second casing space and third casing space, and respectively form a first heat slot chamber for setting a graphics processing unit, a second heat slot chamber for setting a mainboard of a central processing unit and a third heat slot chamber for setting a power supply unit, and transfer heat to the outside by natural gravity and convection. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a left front view of a three-chamber heat dissipation housing according to some embodiments of the present invention;

[0022] Figure 2 is a right front view of the three-chamber heat dissipation housing according to some embodiments of the present invention;

[0023] Figure 3 is a front view illustrating the arrangement of a plurality of radiators in the three-chamber heat dissipation housing according to some embodiments of the present invention;

[0024] Figure 4 is a front view of a first heat tank chamber in the three-chamber heat dissipation housing in detail according to some embodiments of the present invention;

[0025] Figure 5 is a schematic diagram illustrating the flow of air in a three-chamber heat dissipation housing according to some embodiments of the present invention;

[0026] Figure 6 is a schematic diagram illustrating the arrangement of some main heat sources in the three-chamber heat dissipation housing according to some embodiments of the present invention;

[0027] Figure 7 is a schematic diagram illustrating a high-speed peripheral component connection interface wire component according to some embodiments of the present invention;

[0028] Figure 8 is a schematic diagram illustrating usage of a radiator and a liquid cooler of a GPU or a CPU according to some embodiments of the present invention.

[0029] Explanation of symbols in the accompanying drawings:

[0030] 100 case; 101 first heat sink chamber; 102 second heat sink chamber; 103 third heat sink chamber; 104 middle plate or central partition; 105 chamber partition; 106 top opening; 110 opening; 120 GPU heat sink; 122 CPU heat sink; 150 position; 151 position; 152 position; 153 position; 302 convection force; 304 gravity; 403 GPU; 404 liquid cooler; 405 heat sink; 550A airflow; 550B airflow; 551A airflow; 551B airflow; 553A airflow; 553B airflow; 601 motherboard; 602 power supply unit; 602A fan; 603 case exhaust fan; 604A PCle ribbon cable; 604B PCle ribbon cable; 604C PCle ribbon cable; 700 High-speed peripheral component connection interface cable assembly; 702 GPU connector; 800 heat sink; 801 bottom manifold; 802 inlet; 802A water flow; 803 outlet; 803A water flow; 805A water flow; 805B water flow; 806a delivery tube; 806b delivery tube; 807a tab; 807b tab; 808 top manifold; 808A water flow; 810 position. DETAILED DESCRIPTION

[0031] The method, system, user interface and other related aspects of the present invention are described as follows. Please refer to the examples in some embodiments of the present invention and the accompanying drawings. Although the present invention will be described in conjunction with these embodiments, it should be understood that it is not intended to limit the present invention to these specific embodiments. On the contrary, the present invention is intended to cover various replacements, modifications and equivalent modes within the spirit and scope of the present invention. Therefore, the description and drawings of the present invention should be regarded as an illustrative, rather than a restrictive concept.

[0032] In addition, many specific details will be provided in the subsequent description to provide a complete understanding of the present invention. However, for those with ordinary knowledge in the technical field to which the present invention belongs, the present invention can be implemented without these specific details. In addition, in order to avoid obscuring the present invention, examples, methods, procedures, components and networks that are well known to those with ordinary knowledge in the technical field to which the present invention belongs will not be described in detail.

[0033] Figure 11 is a left front view of a three-chamber heat dissipation case 100 (hereinafter referred to as case 100) according to some embodiments of the present invention. The case 100 encloses a computer cooling system and other computer components. The cooling system includes several components that operate simultaneously, which can effectively remove heat from the cooling system at a low noise level. For example, in a non-limiting embodiment, the components of the cooling system may include: a radiator, a water pump, a cold plate, a pipeline, a case exhaust fan and a control system. According to some embodiments of the present invention, the case 100 includes three heat tank chambers, namely: 1) a first heat tank chamber 101 (for example: a graphics processing unit GPU chamber), 2) a second heat tank chamber 102 (for example: a motherboard chamber and its central processing unit CPU), and 3) a third heat tank chamber 103 (for example: a power supply unit chamber). The GPU in the first heat tank chamber 101 generates heat. Similarly, the motherboard and its CPU (not shown) in the second heat tank chamber 102 Figure 1 ) will also generate heat. In the power supply unit (not shown) of the third heat tank chamber 103 Figure 1 ) also generates heat.

[0034] According to some embodiments of the present invention, the case 100 has a top opening 106, on which a case exhaust fan can be mounted. The case 100 is divided in the longitudinal direction by an intermediate plate or a central partition 104. The intermediate plate or the central partition 104 is located in the YZ plane and extends along the Z-axis direction to the height of the case 100. Further, according to some embodiments of the present invention, a slot chamber partition 105 (such as a hard disk tray) separates the second hot slot chamber 102 (mainboard slot) from the third hot slot chamber 103 (power supply unit slot). According to some embodiments of the present invention, the slot chamber partition 105 is a removable baffle located in the XY plane and extends from the Y-axis direction to the depth of the case 100. Therefore, the heat sources of the three hot slot chambers are completely isolated from each other. These embodiments are not limited to Figure 1 The positions of the GPU slot, the motherboard slot and the power supply unit slot relative to each other in the housing are shown. Due to different individual implementations, the positions of the GPU slot, the motherboard slot and the power supply unit slot relative to each other in the housing may vary. Figure 1 It is also explained that the rear end of the housing 100 has an opening 110. According to some embodiments of the present invention, a power supply unit is disposed in the third heat tank chamber 103 of the housing 100, and hot air can be drawn out from the opening 110, so that the hot air in the third heat tank chamber 103 can be discharged. For this part, please refer to Figure 5 Furthermore, the housing 100 may be provided with a plurality of openings or vents on the side thereof, for example, at positions 150, 151, 152, 153 (see Figure 2The openings or vents on the sides of the housing can draw cool air into the housing or exhaust hot air from the housing to the outside environment. Thus, the three heat tank chambers (the first heat tank chamber 101, the second heat tank chamber 102, and the third heat tank chamber 103) can help limit the heat load to the respective controlled locations.

[0035] In the diagram of the housing 100 , not all outer panels of the housing are marked to avoid hiding the internal structure of the housing.

[0036] According to some embodiments of the present invention, the tank chamber baffle 105 is removable and can be more conveniently installed on a hard disk of the case 100. According to some embodiments of the present invention, the removable baffle provides more efficient heat conduction by reducing the volume of the heat tank chamber, thereby increasing the laminar flow through the thermal components on the motherboard.

[0037] Figure 2 FIG. 1 is a right front view of the housing 100 according to some embodiments of the present invention. All outer panels of the housing are not shown to avoid hiding the internal structure of the housing. Figure 2 The rear view of FIG. 1 clearly shows that the first heat tank chamber 101 (e.g., GPU slot) extends from the height of the housing 100. As described above, the middle plate or central partition 104 also extends from the height of the housing 100 and separates the first heat tank chamber 101 from the other two heat tank chambers (the second heat tank chamber 102 and the third heat tank chamber 103). Figure 2 It is also explained that the position 153 with an opening or vent can be set on the side of the case to achieve air circulation. Therefore, the GPU can be located in its heat tank and mounted on the other side of the motherboard, and connected to the motherboard by a flexible cable (such as a high-speed peripheral component interface "PCIe" cable), which can be seen in this part Figure 6 and Figure 7 The configuration of the GPU relative to the motherboard reduces the size of the case along the X-axis (the central partition of the motherboard extends along the Y-axis). Therefore, these configurations can fit into a small-size case.

[0038] Figure 3 FIG. 1 is a front view of the housing, illustrating the arrangement of several heat sinks. All outer panels of the housing are not shown here to avoid hiding the internal structure of the housing. According to some embodiments of the present invention, Figure 3 A GPU (graphics processing unit) radiator 120 and a CPU (central processing unit) radiator 122 are described. The CPU radiator 122 is a part of a CPU liquid cooler, which can be installed inside the second heat tank chamber 102 (motherboard slot). The water barrier and water pump (not shown) of the CPU liquid cooler Figure 3) will be mounted above the CPU to cool the CPU. Similarly, the GPU radiator 120 is a part of a GPU liquid cooler, which can be mounted inside the first heat tank chamber 101 (GPU tank). The water barrier and water pump (not shown) of the GPU liquid cooler Figure 3 ) will be mounted above the GPU to cool the GPU. See Figure 8 As shown, the description of the cooler (GPU radiator 120, CPU radiator 122) can be further understood. The main heat source transfer area can be inside the case (such as the heat from the GPU and CPU can be transferred to the liquid coolant in its associated liquid cooler, and the liquid coolant can be cooled by the individual coolers (GPU radiator 120, CPU radiator 122) and their associated fans). The coolers (GPU radiator 120, CPU radiator 122) transfer the heat to the surrounding air of the first heat tank chamber 101 and the second heat tank chamber 102 in sequence. The heat transfer area can also appear outside the case through the opening of the case 100. For example, a case exhaust fan can be mounted on a top opening 106 and extract heat from the first heat tank chamber and the second heat tank chamber through the top opening 106. Even without a housing exhaust fan, the heat in the first heat tank chamber 101 and the second heat tank chamber 102 will rise due to the convection force 302 and then leave the housing 100 through the top opening 106. In addition, by means of the vent positions 150 and 153 ( Figure 2 , 4 5 and position 153) to draw cold air into the housing 100. Hot air can also be discharged from the housing 100 through the aforementioned vents. In another embodiment, the fan of the power supply unit can draw cold air from the outside of the housing 100 through the vents located at position 150, and can discharge heat from the rear end opening 110 located at the third heat tank chamber 103.

[0039] Figure 4 1 is a front view of the housing, and according to some embodiments of the present invention, the first heat tank chamber 101 is described in detail. All outer panels of the housing are not shown here to avoid hiding the internal structure of the housing. Figure 4 A GPU 403 with a liquid cooler 404 (and its accompanying water pump) is illustrated as being disposed in the first heat sink chamber 101 . Figure 4The GPU heat sink 120 for removing heat from the heat generating liquid cooler is also illustrated as it leaves the GPU liquid cooler 404. After the liquid coolant is cooled by the GPU heat sink 120, the cooled liquid coolant is returned to the water barrier (not shown) located in the GPU liquid cooler 404 to cool the GPU 403. The heat from the GPU heat sink 120 is transferred to the surrounding air of the first heat sink chamber 101. The heated air in the first heat sink chamber 101 passes through the top opening 106 and / or through the vents located at position 153 by passive convection or forced convection (e.g., with the help of an exhaust fan disposed at the opening to draw warm air out of the case) and then leaves the case 100. Figure 4 A heat sink 405 is also illustrated for removing heat from a GPU voltage regulator module "VRM" (and its accompanying cooling fan). The middle plate or central partition 104 separates the heat source of the first heat tank chamber 101 from the heat sources of the second heat tank chamber 102 and the third heat tank chamber 103.

[0040] Figure 5 1 is a diagram illustrating the flow of air in the housing 100 according to some embodiments of the present invention. All outer panels of the housing are not shown here to avoid hiding the internal structure of the housing. With the help of natural convection force 302 in the opposite direction of gravity 304, heat is carried to the outside of the housing through the airflow through the slot chamber. According to some embodiments of the present invention, an exhaust fan may also be set up at the top opening 106 of the housing 100 to extract hot air from the housing 100. The three hot slot chambers (first hot slot chamber 101, second hot slot chamber 102, third hot slot chamber 103) help limit the heat load to individual control areas. In some embodiments, the exhaust fan can be turned off so that the system can help air flow and cooling by convection. Figure 5 The airflow 553A of cold air enters the case 100 through the vent position 153 located on the side of the case. The cold airflow 553A removes heat from the heat source (such as GPU, GPU heat sink, GPU VRM heat sink, etc.) in the first heat tank chamber 101. As the airflow 553A is heated, it rises due to convection and flows out of the first heat tank chamber 101 through the top opening 106 (airflow 553B). Figure 5 It also shows that the cold air flow 551A enters the second heat tank chamber 102 through the vent position 151 located on the side of the housing 100. The cold air flow 551A removes heat from the heat source in the second heat tank chamber 102 (such as the CPU, CPU heat sink, and other heat sources on the motherboard). As the air flow 551A is heated, it rises due to convection and flows out of the second heat tank chamber 102 through the top opening 106 (air flow 551B). In addition, Figure 5The airflow 550A of cold air enters the third heat tank chamber 103 through the vent position 150 located on the side of the housing 100. The cold airflow 550A removes heat from the heat source, such as the power supply unit, in the third heat tank chamber 103. As the airflow 550A is heated, it rises due to convection and flows out of the third heat tank chamber 103 through the opening 110 (airflow 550B).

[0041] Figure 6 It is a schematic diagram illustrating the arrangement of some main heat sources in the casing according to some embodiments of the present invention. Figure 6 It is explained that the middle plate or central partition 104 and the tank chamber partition 105 together isolate the heat sources of the first hot tank chamber 101, the second hot tank chamber 102, and the third hot tank chamber 103 from each other. Figure 6 The main heat source is also illustrated, as well as the GPU 403 and GPUVRM ​​heat sink 405 in the first heat tank chamber 101, the motherboard 601 (and its accompanying CPU) in the second heat tank chamber 102, and the power supply unit 602 (and its built-in fan 602A) in the third heat tank chamber 103. The fan 602A can draw cool air from the outside of the case and exhaust heated air outside the case through the rear opening on the third heat tank chamber 103. Figure 6 It is also explained that a case exhaust fan 603 can be mounted on the top of the case, and when the case exhaust fan 603 is running, the heated air in the first heat tank chamber 101 and the second heat tank chamber 102 can be exhausted. According to some embodiments, when the temperature of the GPU or CPU liquid coolant reaches a certain predetermined threshold, the case exhaust fan 603 will automatically run. Figure 6 Also illustrated are PCle ribbon cables 604A, 604B and 604C used to connect the GPU 403 and the motherboard 601.

[0042] Figure 7 1 is a diagram illustrating a high-speed peripheral component connection interface cable assembly 700 according to some embodiments of the present invention. The high-speed peripheral component connection interface cable assembly 700 includes a GPU connector 702 to connect the GPU 403. The high-speed peripheral component connection interface cable assembly 700 also includes PCle ribbon cables 604A, 604B and 604C to help the GPU 403 connect to the motherboard 601.

[0043] Figure 8 The following is a diagram illustrating the use of a radiator and a liquid cooler for a GPU or a CPU according to some embodiments of the present invention. Figure 8A heat sink 800 is described. The heat sink 800 includes a bottom manifold 801, a top manifold 808, a plurality of ducts 806a, 806b, and a plurality of fins 807a, 807b. The bottom manifold 801 includes an inlet 802 and an outlet 803. The bottom manifold 801 includes an inner dividing wall (not shown) located at position 810. The inner dividing wall divides the bottom manifold into approximately two halves. The duct 806a and the corresponding fins 807a occupy approximately half of the area of ​​the heat sink. The duct 806b and the corresponding fins 807b occupy approximately the other half of the area of ​​the heat sink.

[0044] According to some embodiments of the present invention, heat transfer may occur in the following situations. To further illustrate, the liquid coolant (via a water cooling plate) transfers heat from the CPU, and the hot liquid coolant enters the heat sink 800 from the inlet 802 of the bottom manifold 801. The water flow 802A of the hot liquid coolant is pressurized and transported to the top manifold 808 (water flow 805A) through the plurality of delivery tubes 806a. When the liquid coolant reaches the top manifold 808, it (water flow 808A) will move toward the plurality of delivery tubes 806b. The liquid coolant is thus forced to flow through the plurality of delivery tubes 806b (water flow 805B), and when the liquid coolant flows back to the bottom manifold 801, it will be further cooled by the fins 807b. The fins 807a, 807b effectively increase the surface area of ​​the delivery tubes 806a, 806b to more effectively help the liquid coolant transfer heat to the surrounding air. Therefore, when the liquid coolant flows back to the bottom manifold 801, it is already cooled when it (water flow 803A) flows out of the heat sink 800 through the outlet 803 and returns to the CPU to cool the CPU. Similarly, in the example of a GPU (graphics processing unit), the operation of the GPU heat sink is the same as the operation of the CPU described above.

[0045] The CPU and GPU are each equipped with a unique water-cooling plate assembly, which is directly attached to the main heat source of the CPU and GPU respectively. According to some embodiments of the present invention, each water-cooling plate (for example, one is configured on the CPU and one is configured on the GPU) includes a small space surrounded along its main axis, a metal plate, for example, made of a metal with a thermal conductivity of not less than 50W / mK and not more than 1500W / mK. One side of the metal plate has a series of thin convex plates, usually produced by a micro-knife process, through which liquid can flow and absorb heat from the metal. The water-cooling plate assembly is contained in a housing, which is made of a metal that is not penetrated by liquid coolant and has sufficient structural integrity to withstand the clamping force and the pressure and temperature range during operation.

[0046] According to some embodiments of the present invention, the pipeline used to carry the coolant liquid is made of an elastic rubber, plastic or a Teflon-based material, which is specially designed to meet the low permeability of the coolant elements (generally a combination of water, propylene glycol, corrosion inhibitors and antimicrobial compounds). The length of the pipeline can be extra long to connect other components in the housing as a service network without stopping the cooling solution between the radiator, water pump, housing or water cooling plate.

[0047] The system is designed to utilize convective airflow generated by the thermal chimney effect within the enclosure. The use of one or more cooling fans can significantly increase the thermal capacity of the system (see, for example, Figure 1 According to some embodiments, an exhaust fan may be installed in the top opening 106 of the housing. Installing a fan may also provide cooling airflow to other components that generate heat but are not connected to the coolant liquid cycle. Such components include, but are not limited to, conditioning components, processing components, storage devices, memory, and data interfaces within the housing. The bottom-to-top (relative to the direction of gravity) natural airflow design promotes highly laminar flow on the radiator and components installed inside the housing. The CPU, GPU, and PSU heat loads may be separated into different slots.

[0048] The PSU heat sink draws in cool air from one side of the case and exhausts it at the rear side panel (at the rear of the case). This allows the PSU to maintain cool air from the outside rather than preheated air from the environment inside the case. Using a cool air intake helps reduce the need for fans on the PSU.

[0049] According to some embodiments, the display adapter is in an upside-down configuration within its slot chamber, and heat-generating components (such as voltage regulators and memory) are placed on the surface of the PCB, which is not the GPU itself near the top exhaust fan. These surface components are cooled by a heat sink and fan assembly, which includes aluminum and heat pipes and a fan inside the housing. The heat sink fan circulates air through the heat sink of the GPU assembly, and its near-top exhaust port allows for quick and unobstructed removal of heat from the housing, thereby providing effective cooling for the surface components on the display adapter.

[0050] The display adapter in its slot is also designed to allow stable loading (such as the PCB itself is directly placed on the partition plate) and future upgrade / maintenance. The display adapter in the slot can be replaced by an end user with a moderate technical level.

[0051] According to some embodiments, the automatic cooling system of the display adapter can be completely separated from the main cooling system without affecting operation, so that a computer can be equipped with a display adapter having an integrated cooling system that is separate from the rest of the computer and can cool the display adapter via a heat sink and centrifugal fan assembly.

[0052] The output of the display adapter is bridged with modular input and output components at the front and back of the chassis to upgrade / modify / replace the port groups without affecting the rest of the computer. This enhances the expected upgradeability of the display adapter, as generational changes of the display adapter usually result in changes in the output configuration of the display adapter.

[0053] The cooling system may also include a control system located inside the enclosure that controls the enclosure fan speed by monitoring sensors related to temperature, liquid coolant temperature, or power supply to determine the cooling demand of the cooling system and adjust the fan speed accordingly to provide adequate cooling within the minimum noise level. The control system may have an external data interface or operating computer. The control system may be a discrete component analog system or a digital control system with a logic device or microcontroller, and it can output different voltages to the fan motor or output digital control signals such as pulse width modulation to adjust the fan speed. The control system independently measures the temperature of each fluid circuit, close to its main heat source (CPU, GPU, etc.), and considers each fluid independently when selecting the appropriate fan speed for the entire system. The main technology may include one or more water pumps or one or more tanks, and may rely on remote probes to read temperature, water pump speed and other fluid circuit presence detection. If the controller detects any system water pump or fan failure or any temperature sensor failure out of range temperature value through RPM, one or more LEDs will flash to indicate the error condition to the operator and flag the error to the monitoring software in the operating system.

[0054] According to some embodiments, a three-chamber heat dissipation case includes: 1) a case frame surrounding a case accommodating space, the three-chamber heat dissipation case having a case top located in a first XY plane of the three-chamber heat dissipation case, a case bottom located in a second XY plane of the three-chamber heat dissipation case, a case front located in a first XZ plane of the three-chamber heat dissipation case, and a case rear end located in a second XZ plane of the three-chamber heat dissipation case; 2) a right side outer panel located in a first YZ plane of the three-chamber heat dissipation case; 3) a left side outer panel located in a second YZ plane of the three-chamber heat dissipation case; 4) a central solid partition located in the case accommodating space, the central solid partition occupies an entire cross-sectional area in the case accommodating space, and the central solid partition is located in the three-chamber heat dissipation case. A third YZ plane, wherein the third YZ plane is located in the middle position of the three-chamber heat dissipation casing in the X-axis direction, wherein: the central solid partition extends from the top of the casing to the bottom of the casing, and from the front end of the casing to the rear end of the casing; and the central solid partition divides the casing accommodating space into a first casing space and a second casing space; 5) a slot chamber partition located in the second casing space, the slot chamber partition occupies an entire cross-sectional area in the second casing space, and is located in an XY plane, and divides the second casing space into a third casing space; 6) wherein the first casing space forms a first heat slot chamber of the three-chamber heat dissipation casing, the second casing space forms a second heat slot chamber of the three-chamber heat dissipation casing; and the third casing space forms a third heat slot chamber of the three-chamber heat dissipation casing.

[0055] In summary, the present invention uses the central solid partition and the tank partition 105 to prevent the air in the first heat tank chamber 101, the second heat tank chamber 102 and the third heat tank chamber 103 from circulating with each other, so that the heat generated by the CPU, GPU and the power supply unit will not affect each other. The air is circulated through the vents at the positions 150, 151, 152 and 153 and the influence of the convection force 302 and the gravity 304 to achieve the heat dissipation effect. The heat of the GPU and the CPU is transferred outward by the GPU radiator 120 and the CPU radiator 122, so as to further improve the operating performance of the GPU and the CPU. Therefore, the purpose of the present invention can be achieved.

[0056] For purposes of explanation, the above description has been described with reference to specific embodiments. However, the above illustrative discussion is not intended to be exhaustive or to limit the invention to the form disclosed. Many modifications and variations are possible with reference to the above teachings. The embodiments selected and described are intended to best illustrate the principles of the invention and its practical application, thereby enabling others having ordinary skill in the art to best utilize the invention and various embodiments with various modifications for specific uses.

Claims

1. A three-chamber heat dissipation case for a personal computer, characterized in that: Include: a casing frame surrounding a casing accommodating space, the three-chamber heat dissipation casing having a casing top located in a first XY plane of the three-chamber heat dissipation casing, a casing bottom located in a second XY plane of the three-chamber heat dissipation casing, a casing front located in a first XZ plane of the three-chamber heat dissipation casing, and a casing rear located in a second XZ plane of the three-chamber heat dissipation casing; A right outer panel located on a first YZ plane of the three-chamber heat dissipation housing; A left outer panel located on a second YZ plane of the three-chamber heat dissipation housing; A central solid partition located in the housing space, the central solid partition occupies an entire cross-sectional area in the housing space, and the central solid partition is located in a third YZ plane of the three-chamber heat dissipation housing, wherein the third YZ plane is located in the middle position of the three-chamber heat dissipation housing in the X-axis direction, wherein: The central solid partition extends from the top of the casing to the bottom of the casing, and from the front end of the casing to the rear end of the casing; and The central solid partition divides the housing space into a first housing space and a second housing space; a tank chamber partition located in the second housing space, the tank chamber partition occupying an entire cross-sectional area in the second housing space and located in an XY plane, and separating the second housing space into a third housing space; The first housing space forms a first heat trough chamber of the three-chamber heat dissipation housing, the second housing space forms a second heat trough chamber of the three-chamber heat dissipation housing, and the third housing space forms a third heat trough chamber of the three-chamber heat dissipation housing.

2. The three-chamber heat dissipation case for a personal computer according to claim 1, characterized in that: The second casing space is used to enclose a mainboard and a central processing unit corresponding to the mainboard.

3. The three-chamber heat dissipation case for a personal computer according to claim 1, characterized in that: The first casing space is used to enclose a graphics processing unit.

4. The three-chamber heat dissipation case for a personal computer according to claim 1, characterized in that: The third casing space is used to enclose a power supply unit.

5. The three-chamber heat dissipation case for a personal computer according to claim 1, characterized in that: The first casing space is used to enclose a first heat dissipation unit.

6. The three-chamber heat dissipation case for a personal computer according to claim 1, characterized in that: The second casing space is used to enclose a second heat dissipation unit.

7. The three-chamber heat dissipation case for a personal computer according to claim 5, characterized in that: The first heat dissipation unit is connected to a water pump to allow coolant liquid to flow from a heat source of the three-chamber heat dissipation housing to the first heat dissipation unit, wherein the coolant liquid removes heat from the heat source and the coolant liquid is cooled in the first heat dissipation unit.

8. The three-chamber heat dissipation case for a personal computer according to claim 6, characterized in that: The second heat dissipation unit is connected to a water pump to allow coolant liquid to flow from a heat source of the three-chamber heat dissipation housing to the second heat dissipation unit, wherein the coolant liquid removes heat from the heat source and the coolant liquid is cooled in the second heat dissipation unit.

9. The three-chamber heat dissipation case for a personal computer according to claim 1, characterized in that: It also includes at least one exhaust fan arranged on the top of the casing, wherein the at least one exhaust fan extracts gas from the first heat tank chamber and the second heat tank chamber of the three-chamber heat dissipation casing.

10. The three-chamber heat dissipation case for a personal computer according to claim 1, characterized in that: The invention also comprises at least one exhaust fan arranged in the third heat tank chamber for providing air flow to the power supply unit according to the internal temperature of the power supply unit.

11. The three-chamber heat dissipation case for a personal computer according to claim 1, characterized in that: The right side outer plate allows airflow to flow from the outside of the three-chamber heat dissipation casing into the three-chamber heat dissipation casing.

12. The three-chamber heat dissipation case for a personal computer according to claim 1, characterized in that: The left outer plate allows airflow to flow from the outside of the three-chamber heat dissipation casing into the three-chamber heat dissipation casing.

13. The three-chamber heat dissipation housing for a personal computer according to claim 1, characterized in that: The bottom of the casing allows airflow to flow from the outside of the three-chamber heat dissipation casing into the three-chamber heat dissipation casing.

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