Composite and multi-station printing and full die-cutting UHF label antenna processing equipment and method

Abstract

The present invention provides a composite and multi-station printed full die-cut UHF tag antenna processing equipment and method, involving an UHF tag antenna having an antenna body provided with a chip binding positioning point formed by die-cutting and a chip binding point formed by die-cutting; a second substrate layer or a first substrate layer and a second substrate layer are also pasted on one side of the antenna layer of the antenna body, characterized in that the processing equipment includes a first die-cutting mechanism, a second die-cutting mechanism and a printing mechanism. The present invention solves the problem of the prior art: how to avoid using an etching process to produce chip binding points and chip binding positioning points of UHF electronic tag antennas while saving as much adhesive as possible between the antenna layer and the second substrate layer or between the first substrate layer and the second substrate layer composited on the antenna layer; problem two: how to improve the accuracy of adhesive coating while avoiding coating the entire antenna layer or the first substrate layer with adhesive.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic labels, and in particular to a composite and multi-station printing and full-die-cutting ultra-high frequency label antenna processing device and method. Background Art

[0002] At present, the chip binding points and chip binding positioning points of UHF electronic tag antennas are still produced by etching process. The etching process requires chemical substances such as hydrochloric acid, which has a great impact on the environment. Therefore, how to avoid using etching process to produce chip binding points and chip binding positioning points of UHF electronic tag antennas while saving as much adhesive as possible between the antenna layer and the second substrate layer or between the first substrate layer and the second substrate layer composited on the antenna layer has become an urgent problem to be solved.

[0003] In addition, how to completely avoid the problem of using etching process in the production process of UHF electronic tag antennas, how to prevent the position of the antenna layer from shifting when it moves or transmits during processing, how to help the antenna layer move or transmit better while maintaining tension, how to help the antenna holes, chip binding points and chip binding positioning points to be accurately processed, how to improve the accuracy of adhesive coating while avoiding coating the entire antenna layer or the first substrate layer with adhesive, and how to further accurately determine the chip installation position in addition to using the chip binding points, these have also become problems that need to be solved urgently. Summary of the invention

[0004] The purpose of the present invention is to provide a composite and multi-station printing and full die-cutting UHF tag antenna processing equipment and method, which mainly solves the problem of the above-mentioned prior art: how to avoid using etching technology to produce the chip binding point and chip binding positioning point of the UHF electronic tag antenna while saving as much adhesive as possible between the antenna layer and the second substrate layer or between the first substrate layer and the second substrate layer composited on the antenna layer;

[0005] Problem 2: How to improve the adhesive coating accuracy while avoiding coating the entire antenna layer or the first substrate layer with adhesive;

[0006] Question 3: How to help accurately process antenna holes, chip binding points and chip binding positioning points;

[0007] Question 4: How to accurately determine the chip installation location in addition to using the chip binding point;

[0008] Question 5: How to completely avoid the use of etching technology in the production process of UHF electronic tag antennas?

[0009] Question 6: How to prevent the antenna layer from moving or shifting during transmission during processing?

[0010] Question 7: How to help the antenna layer to move or transmit better while maintaining tension, and provide a fully die-cut UHF electronic tag antenna and its processing equipment and processing technology.

[0011] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a composite and multi-station printing and fully die-cutting UHF label antenna processing equipment, involving an UHF label antenna whose antenna body is provided with a chip binding positioning point formed by die-cutting and a chip binding point formed by die-cutting; one side of the antenna layer of the antenna body is also pasted with a second substrate layer or a first substrate layer and a second substrate layer, and is characterized in that: the composite and multi-station printing and fully die-cutting UHF label antenna processing equipment includes a die-cutting mechanism for die-cutting the chip binding positioning point, chip binding point and the surrounding edges of the UHF label antenna, and a printing mechanism for applying adhesive according to the shape of the antenna body on one side of the antenna layer to be processed or on the side of the first substrate layer where the antenna layer is not pasted.

[0012] Furthermore, the printing mechanism includes a first concave mold printing seat for applying a colored adhesive according to the shape of the antenna body on one side of the antenna layer to be processed or on the side of the first substrate layer to which the antenna layer is not attached, and for simultaneously printing a first positioning mark near the adhesive block corresponding to the shape of the antenna body;

[0013] Or the printing mechanism includes a second concave mold printing seat for printing the first positioning mark and marking block with ink on the side of the antenna layer to be processed or the side of the first substrate layer where the antenna layer is not pasted, a first exposure device for exposing the first positioning mark and marking block so that the first positioning mark and marking block composed of ink can be quickly exposed to dry, and a third concave mold printing seat for applying adhesive according to the shape of the antenna body on the side of the antenna layer to be processed or the side of the first substrate layer where the antenna layer is not pasted according to the marking block.

[0014] Furthermore, the die-cutting mechanism includes a first die-cutting mechanism for die-cutting the chip binding positioning point and the chip binding point of the UHF tag antenna, and a second die-cutting mechanism for die-cutting the surrounding edges of the UHF tag antenna.

[0015] Furthermore, the composite and multi-station printing and full die-cutting UHF label antenna processing equipment also includes an antenna hole processing mechanism for die-cutting the antenna hole of the UHF label antenna, a composite mechanism for composite the second substrate layer and the antenna layer or composite the second substrate layer and the first substrate layer to which the antenna layer has been pasted, a first row of waste rewinding mechanisms for rewinding the waste antenna processed by the first die-cutting mechanism and the second die-cutting mechanism or rewinding the waste antenna and the waste first substrate layer processed by the first die-cutting mechanism and the second die-cutting mechanism, and a third unwinding mechanism for unwinding an isolation layer on the antenna layer or on the second substrate layer;

[0016] The input port of the first concave die printing seat inputs the antenna layer to be processed or the antenna layer to which the first substrate layer has been attached, the output port of the first concave die printing seat corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the compound mechanism, the output port of the compound mechanism corresponds to the input port of the first die-cutting mechanism, the output port of the first die-cutting mechanism corresponds to the input port of the second die-cutting mechanism, and the output port of the second die-cutting mechanism corresponds to the input port of the first waste row winding mechanism and the output port of the third unwinding mechanism;

[0017] Or the input port of the first concave die printing seat inputs the antenna layer to be processed or the antenna layer to which the first substrate layer has been attached, the output port of the first concave die printing seat corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the compound mechanism, the output port of the compound mechanism corresponds to the input port of the second die-cutting mechanism, the output port of the second die-cutting mechanism corresponds to the input port of the first die-cutting mechanism, and the output port of the first die-cutting mechanism corresponds to the input port of the first waste row winding mechanism and the output port of the third unwinding mechanism;

[0018] Or the input port of the second concave die printing seat inputs the antenna layer to be processed or the antenna layer to which the first substrate layer has been pasted, the output port of the second concave die printing seat corresponds to the input port of the first exposure device, the output port of the first exposure device corresponds to the input port of the third concave die printing seat, the output port of the third concave die printing seat corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the composite mechanism, the output port of the composite mechanism corresponds to the input port of the first die-cutting mechanism, the output port of the first die-cutting mechanism corresponds to the input port of the second die-cutting mechanism, and the output port of the second die-cutting mechanism corresponds to the input port of the first waste discharge winding mechanism and the output port of the third unwinding mechanism;

[0019] Or the input port of the second die printing seat inputs the antenna layer to be processed or the antenna layer that has been pasted with the first substrate layer, the output port of the second die printing seat corresponds to the input port of the first exposure device, the output port of the first exposure device corresponds to the input port of the third die printing seat, the output port of the third die printing seat corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the composite mechanism, the output port of the composite mechanism corresponds to the input port of the second die-cutting mechanism, the output port of the second die-cutting mechanism corresponds to the input port of the first die-cutting mechanism, and the output port of the first die-cutting mechanism corresponds to the input port of the first waste winding mechanism and the output port of the third unwinding mechanism.

[0020] Furthermore, the composite and multi-station printing and full-die-cutting UHF label antenna processing equipment also includes a first deflection correction device, which is located before the printing mechanism, that is, the input port of the first deflection correction device inputs the antenna layer to be processed or the antenna layer to which the first substrate layer has been pasted, and the output port of the first deflection correction device corresponds to the input port of the first concave die printing seat or the input port of the second concave die printing seat.

[0021] Furthermore, the composite and multi-station printing and full-die-cutting UHF label antenna processing equipment also includes a fourth convex mold printing seat for printing a second positioning mark on the antenna layer and / or the second substrate layer using ink, and a second exposure device for exposing the second positioning mark so that the second positioning mark composed of ink is quickly exposed and dried, wherein the second positioning mark is used for chip positioning during chip installation and / or binding;

[0022] The output port of the composite mechanism corresponds to the input port of the fourth convex mold printing seat, the output port of the fourth convex mold printing seat corresponds to the input port of the second exposure device, the output port of the second exposure device corresponds to the input port of the first die-cutting mechanism, the output port of the first die-cutting mechanism corresponds to the input port of the second die-cutting mechanism, and the output port of the second die-cutting mechanism corresponds to the input port of the first waste winding mechanism and the output port of the third unwinding mechanism;

[0023] Or the output port of the composite mechanism corresponds to the input port of the fourth punch printing seat, the output port of the fourth punch printing seat corresponds to the input port of the second exposure device, the output port of the second exposure device corresponds to the input port of the second die-cutting mechanism, the output port of the second die-cutting mechanism corresponds to the input port of the first die-cutting mechanism, and the output port of the first die-cutting mechanism corresponds to the input port of the first row of waste winding mechanism and the output port of the third unwinding mechanism.

[0024] Further, the first die-cutting mechanism is composed of a flat-pressing die-cutting mechanism, which is a flat-pressing die-cutting machine including at least one die-cutting tool for flat-pressing and die-cutting the chip binding positioning point and the chip binding point;

[0025] Or the first die-cutting mechanism is composed of a circular knife die-cutting mechanism, which is a circular knife die-cutting machine including at least one rolling cutting tool for circular knife die-cutting chip binding positioning points and chip binding points;

[0026] Or the first die-cutting mechanism is a hybrid die-cutting mechanism composed of a flat die-cutting mechanism and a circular knife die-cutting mechanism, and the hybrid die-cutting mechanism is a hybrid die-cutting machine including at least one die-cutting tool for flat die-cutting the chip binding positioning point or the chip binding point and at least one rolling tool for circular knife die-cutting the chip binding point or the chip binding positioning point;

[0027] The second die-cutting mechanism is a flat die-cutting machine for flat die-cutting the edges of the antenna body, or a circular knife die-cutting machine for circular knife die-cutting the edges of the antenna body;

[0028] The antenna hole processing mechanism is a flat die-cutting machine for flat die-cutting the antenna hole, or a circular knife die-cutting machine for circular knife die-cutting the antenna hole.

[0029] Furthermore, the first die-cutting mechanism for die-cutting the chip binding positioning points and the chip binding points and the second die-cutting mechanism for die-cutting the surrounding edges of the antenna body are combined into a flat die-cutting machine or a circular knife die-cutting machine.

[0030] Furthermore, the composite and multi-station printing and full-die-cutting UHF label antenna processing equipment also includes a first unwinding mechanism for unwinding the antenna layer to be processed or the antenna layer to be processed of the composite first substrate layer, a drying mechanism for drying the antenna layer after the adhesive has been applied according to the shape of the antenna body, or a drying mechanism for drying the antenna layer of the composite first substrate layer after the adhesive has been applied according to the shape of the antenna body, a second deviation correcting device, a first traction device, a second traction device, a second unwinding mechanism for unwinding the second substrate layer, and a finished product winding mechanism for winding the processed antenna layer together with the second substrate layer and the isolation layer, or winding the processed antenna layer together with the first substrate layer and the second substrate layer and the isolation layer;

[0031] The output port of the first unwinding mechanism corresponds to the input port of the first deviation correcting device, the output port of the first concave die printing seat or the output port of the third concave die printing seat corresponds to the input port of the drying mechanism, the output port of the drying mechanism corresponds to the input port of the second deviation correcting device, the output port of the second deviation correcting device corresponds to the input port of the first traction device, the output port of the first traction device corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the composite mechanism, and at the same time, the output port of the second unwinding mechanism corresponds to the input port of the composite mechanism, the output port of the composite mechanism corresponds to the input port of the fourth convex die printing seat, the output port of the fourth convex die printing seat corresponds to the input port of the second exposure device, the output port of the second exposure device corresponds to the input port of the first die-cutting mechanism, the output port of the first die-cutting mechanism corresponds to the input port of the second die-cutting mechanism, the output port of the second die-cutting mechanism corresponds to the input port of the first waste row winding mechanism and the input port of the second traction device, and at the same time, the output port of the third unwinding mechanism corresponds to the input port of the second traction device, and the output port of the second traction device corresponds to the input port of the finished product winding mechanism;

[0032] Or the output port of the first unwinding mechanism corresponds to the input port of the first correcting device, the output port of the first die printing seat or the output port of the third die printing seat corresponds to the input port of the drying mechanism, the output port of the drying mechanism corresponds to the input port of the second correcting device, the output port of the second correcting device corresponds to the input port of the first traction device, the output port of the first traction device corresponds to the input port of the antenna hole processing mechanism, the output port of the antenna hole processing mechanism corresponds to the input port of the composite mechanism, and at the same time, the output port of the second unwinding mechanism corresponds to the input port of the composite mechanism, the output port of the composite mechanism corresponds to the input port of the fourth punch printing seat, the output port of the fourth punch printing seat corresponds to the input port of the second exposure device, the output port of the second exposure device corresponds to the input port of the second die-cutting mechanism, the output port of the second die-cutting mechanism corresponds to the input port of the first die-cutting mechanism, the output port of the first die-cutting mechanism corresponds to the input port of the first waste row winding mechanism and the input port of the second traction device, and at the same time, the output port of the third unwinding mechanism corresponds to the input port of the second traction device, and the output port of the second traction device corresponds to the input port of the finished product winding mechanism.

[0033] Furthermore, there are two chip binding points, and the first die-cutting mechanism is divided into a flat die-cutting machine for flat die-cutting one of the chip binding points or a circular knife die-cutting machine for circular knife die-cutting, and a flat die-cutting machine for flat die-cutting the other chip binding point and the chip binding positioning point or a circular knife die-cutting machine for circular knife die-cutting;

[0034] The output port of the composite mechanism corresponds to the input port of the fourth convex printing seat, the output port of the fourth convex printing seat corresponds to the input port of the second exposure device, the output port of the second exposure device corresponds to the input port of a flat-pressing die-cutting machine or a circular knife die-cutting machine for flat-pressing die-cutting one of the chip binding points, the output port of the flat-pressing die-cutting machine or the circular knife die-cutting machine for flat-pressing die-cutting one of the chip binding points corresponds to the input port of the flat-pressing die-cutting machine or the circular knife die-cutting machine for flat-pressing die-cutting another chip binding point and chip binding positioning point, the output port of the flat-pressing die-cutting machine or the circular knife die-cutting machine for flat-pressing die-cutting another chip binding point and chip binding positioning point corresponds to the input port of the second die-cutting mechanism;

[0035] Or the output port of the composite mechanism corresponds to the input port of the fourth punch printing seat, the output port of the fourth punch printing seat corresponds to the input port of the second exposure device, the output port of the second exposure device corresponds to the input port of a flat-bed die-cutting machine or a circular knife die-cutting machine used for flat-bed die-cutting another chip binding point and chip binding positioning point, the output port of the flat-bed die-cutting machine or the circular knife die-cutting machine used for flat-bed die-cutting another chip binding point and chip binding positioning point corresponds to the input port of the flat-bed die-cutting machine or the circular knife die-cutting machine used for flat-bed die-cutting one of the chip binding points, and the output port of the flat-bed die-cutting machine or the circular knife die-cutting machine used for flat-bed die-cutting one of the chip binding points corresponds to the input port of the second die-cutting mechanism.

[0036] Further, the processing equipment also includes a second row of waste winding mechanism;

[0037] The first die-cutting mechanism comprises a first flat die-cutting machine or a first circular knife die-cutting machine for performing flat die-cutting on one of the chip binding points, and simultaneously performing flat die-cutting on the redundant antennas on both sides of the antenna layer, or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer, and a second flat die-cutting machine or a second circular knife die-cutting machine for performing flat die-cutting on another chip binding point and the chip binding positioning point; the input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the second exposure device, the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism and the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism;

[0038] Or the first die-cutting mechanism includes a first flat die-cutting machine or a first circular knife die-cutting machine for performing flat die-cutting on one of the chip binding points, and simultaneously performing flat die-cutting on the redundant antennas on both sides of the antenna layer, or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer, and a second flat die-cutting machine or a second circular knife die-cutting machine for performing circular die-cutting on another chip binding point and the chip binding positioning point; the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the second exposure device, the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste row winding mechanism and the input port of the second die-cutting mechanism;

[0039] Or the first die-cutting mechanism includes a first flat die-cutting machine for flat die-cutting one of the chip binding points or a first circular knife die-cutting machine for circular knife die-cutting, and a second flat die-cutting machine for flat die-cutting another chip binding point and chip binding positioning point, and simultaneously performing flat die-cutting on redundant antennas on both sides of the antenna layer or the first substrate layer and redundant antennas on both sides of the antenna layer and redundant first substrate layer, or a second circular knife die-cutting machine for circular knife die-cutting, the input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the second exposure device, the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste row winding mechanism and the input port of the second die-cutting mechanism;

[0040] Or the first die-cutting mechanism includes a first flat-press die-cutting machine for flat-pressing die-cutting one of the chip binding points or a first circular knife die-cutting machine for circular knife die-cutting and a second flat-pressing die-cutting machine for flat-pressing die-cutting another chip binding point and chip binding positioning point, and simultaneously performing flat-pressing die-cutting on redundant antennas on both sides of the antenna layer or the first substrate layer and redundant antennas on both sides of the antenna layer and redundant first substrate layer, or a second circular knife die-cutting machine for circular knife die-cutting; the input port of the second flat-pressing die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the second exposure device, the output port of the second flat-pressing die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste discharge winding mechanism and the input port of the first flat-pressing die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat-pressing die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism.

[0041] Furthermore, the processing equipment also includes an antenna hole waste collection device for collecting waste antennas generated after punching by the antenna hole processing mechanism or waste antennas generated after punching and waste first substrate layers; the antenna hole waste collection device is located below the antenna hole processing mechanism; the composite mechanism is also provided with a heating drum for heating the adhesive; the composite mechanism includes a rubber roller for compositeing the second substrate layer with the antenna layer or a rubber roller for compositeing the second substrate layer with the antenna layer of the composite first substrate layer.

[0042] A composite and multi-station printing and full die-cutting UHF tag antenna processing method relates to the above-mentioned composite and multi-station printing and full die-cutting UHF tag antenna processing equipment, and is characterized in that: the processing method includes a process of using a printing mechanism to apply adhesive on one side of the antenna layer to be processed or on the side of the first substrate layer where the antenna layer is not pasted according to the shape of the antenna body, and a process of using a die-cutting mechanism to die-cut the chip binding positioning point, chip binding point and the surrounding edges of the UHF tag antenna.

[0043] Further, the production steps are as follows

[0044] Step 1: The first unwinding mechanism unwinds the antenna layer to be processed or the antenna layer of the composite first substrate layer to the first concave die printing seat, and the first concave die printing seat applies a colored adhesive on one side of the antenna layer to be processed or on the side of the antenna layer of the composite first substrate layer to which the antenna layer is not bonded according to the shape of the antenna body, and simultaneously prints a first positioning mark near the adhesive block coated according to the shape of the antenna body, and then the first concave die printing seat sends the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer after being coated with the adhesive to the drying mechanism, and uses the drying mechanism to dry the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer;

[0045] Or the first unwinding mechanism unwinds the antenna layer to be processed or the antenna layer composited with the first substrate layer to the second concave die printing seat, the second concave die printing seat uses ink to print the first positioning mark and the marking block on one side of the antenna layer to be processed or the side of the first substrate layer where the antenna layer is not pasted, and then the first exposure device exposes the first positioning mark and the marking block so that the first positioning mark and the marking block composed of ink are quickly exposed and dried, and then the third concave die printing seat applies adhesive according to the shape of the antenna body on one side of the antenna layer to be processed or the side of the first substrate layer where the antenna layer is not pasted according to the marking block, and the third concave die printing seat sends the antenna layer coated with the adhesive or the antenna layer composited with the first substrate layer to the drying mechanism, and the drying mechanism is used to dry the antenna layer coated with the adhesive or the antenna layer composited with the first substrate layer;

[0046] Step 2: Send the dried antenna layer or the antenna layer combined with the first substrate layer to a deflection correction device, and use a second deflection correction device to perform reference positioning on the dried antenna layer or the antenna layer combined with the first substrate layer, and correct and / or calibrate its transfer direction;

[0047] Step 3: The antenna layer or the antenna layer composited with the first substrate layer after being corrected by the second correcting device is sent to the first traction device, and the first traction device is used to help the antenna layer or the antenna layer composited with the first substrate layer to be conveyed; the first traction device and the second traction device are used to work together to control the transmission speed of the antenna layer or the antenna layer composited with the first substrate layer, and the tension of the antenna layer or the antenna layer composited with the first substrate layer during the transmission process is stable and each die-cutting position is accurate;

[0048] Step 4: The antenna layer or the antenna layer composited with the first substrate layer after passing through the first traction device is sent to the antenna hole processing mechanism for antenna hole punching. The antenna hole processing mechanism punches the antenna hole on the antenna layer or the antenna layer composited with the first substrate layer;

[0049] Step 5: The antenna layer after the antenna hole is punched or the antenna layer of the composite first substrate layer after the antenna hole is punched is compounded with the second substrate layer of the second unwinding mechanism through a compounding mechanism, that is, the second substrate layer is bonded to the antenna layer or the first substrate layer through an adhesive;

[0050] Step 6: After the second substrate layer is compounded, the antenna layer is first subjected to flat die-cutting and / or circular die-cutting by a first die-cutting mechanism to form chip binding points and chip binding positioning points, and then the antenna on the edges of the antenna body of the antenna layer is subjected to flat die-cutting and / or circular die-cutting by a second die-cutting mechanism to form the outer contour of the antenna body, and then a preliminarily formed antenna body and remaining waste antenna are formed on the second substrate layer, and the remaining waste antenna is rolled up and discharged by a first waste discharge and reeling mechanism;

[0051] Or the antenna layer after the second substrate layer and the first substrate layer are composited is firstly subjected to flat die-cutting and / or circular knife die-cutting by a first die-cutting mechanism to form chip binding points and chip binding positioning points on the first substrate layer and the antenna of the antenna layer, and then the antenna and the first substrate layer are subjected to die-cutting and / or roll-cutting by a second die-cutting mechanism to form the outer contour of the antenna body on the edges of the antenna layer and the first substrate layer composited with the first substrate layer, and then the antenna body of the composite first substrate layer is initially formed on the second substrate layer, as well as the remaining waste antenna and the corresponding remaining waste first substrate layer, and the remaining waste antenna and the corresponding remaining waste first substrate layer are rolled up and discharged by a first waste discharging and winding mechanism;

[0052] or the antenna layer after being compounded with the second substrate layer, firstly, the antenna on the edges of the antenna body of the antenna layer is subjected to flat pressing die cutting and / or circular knife die cutting by the second die-cutting mechanism to form the outer contour of the antenna body, and then, the antenna of the antenna layer is subjected to flat pressing die cutting and / or circular knife die cutting by the first die-cutting mechanism to form chip binding points and chip binding positioning points, and then, a preliminarily formed antenna body and a remaining waste antenna are formed on the second substrate layer, and the remaining waste antenna is rolled up and discharged by the first waste discharging and winding mechanism;

[0053] Or an antenna layer of a composite second substrate layer and a first substrate layer, firstly, the second die-cutting mechanism simultaneously performs flat-pressing die-cutting and / or circular-knife die-cutting on the antenna and the first substrate layer corresponding to the edges of the antenna body of the antenna layer to form the outer contour of the antenna body, and then the first die-cutting mechanism simultaneously performs flat-pressing die-cutting and / or circular-knife die-cutting on the antenna and the first substrate layer of the antenna layer to form chip binding points and chip binding positioning points, and then forms a preliminary formed antenna body of the composite first substrate layer on the second substrate layer, as well as the remaining waste antenna and the corresponding remaining waste first substrate layer, and the remaining waste antenna and the corresponding remaining waste first substrate layer are rolled up and discharged by the first waste discharging and winding mechanism;

[0054] Or the antenna layer after the second substrate layer is composited, or the antenna layer after the second substrate layer and the first substrate layer are composited, firstly passes through the first flat die-cutting machine or the first circular knife die-cutting machine of the first die-cutting mechanism to perform flat die-cutting or circular knife die-cutting on one of the chip binding points, and at the same time, the redundant antennas on both sides of the antenna layer, or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer to form residual antenna waste on both sides or the residual antenna waste on both sides and the first substrate waste, and the residual antenna waste on both sides or the residual antenna waste on both sides and the first substrate waste are rolled up and discharged by the second waste discharging and winding mechanism, and then the first die-cutting mechanism is used to perform flat die-cutting or circular knife die-cutting on the redundant antennas on both sides of the antenna layer or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer. The second flat die-cutting machine or the second circular knife die-cutting machine performs flat die-cutting or circular knife die-cutting on another chip binding point and the chip binding positioning point to jointly form the chip binding point and the chip binding positioning point, and then the second die-cutting mechanism performs flat die-cutting and / or circular knife die-cutting on the antennas at the edges of the antenna body of the antenna layer or the antennas corresponding to the edges of the antenna body of the antenna layer and the first substrate layer to form the outer contour of the antenna body. The remaining antenna waste or the remaining antenna waste and the first substrate waste after the chip binding point, the chip binding positioning point and the outer contour of the antenna body are rolled up and discharged by the first waste discharge and winding mechanism;

[0055] Or the antenna layer after the second substrate layer is composited, or the antenna layer after the second substrate layer and the first substrate layer are composited, firstly passes through the first flat die-cutting machine or the first circular knife die-cutting machine of the first die-cutting mechanism to perform flat die-cutting or circular knife die-cutting on one of the chip binding points, and then the second flat die-cutting machine or the second circular knife die-cutting machine of the first die-cutting mechanism performs flat die-cutting or circular knife die-cutting on another chip binding point and the chip binding positioning point, and at the same time, the redundant antennas on both sides of the antenna layer or the redundant first substrate layer and the redundant antennas on both sides of the antenna layer and the first substrate layer to form the chip binding point, the chip binding positioning point, and the remaining antennas on both sides. The wire waste or the antenna waste remaining on both sides and the first substrate waste are rolled up and discharged by the second waste discharge and reeling mechanism, and then the antennas at the edges of the antenna body of the antenna layer or the antennas corresponding to the edges of the antenna body of the antenna layer and the first substrate layer are simultaneously flat-pressed and / or circularly cut by the second die-cutting mechanism to form the outer contour of the antenna body. The remaining antenna waste or the remaining antenna waste and the first substrate waste after the chip binding point, the chip binding positioning point and the outer contour of the antenna body are processed are rolled up and discharged by the first waste discharge and reeling mechanism;

[0056] Step 7: After the first waste discharge reeling mechanism reels up the waste, the third unwinding mechanism unwinds the isolation layer so that the isolation layer is covered on the antenna of the initially formed antenna body or on the first substrate layer;

[0057] Step 8: The antenna body covered with the isolation layer is sent to the second traction device, and the second traction device is used to help the antenna body covered with the isolation layer to be transferred to the finished product winding mechanism, which is wound up by the finished product winding mechanism to form a die-cut UHF electronic tag antenna product.

[0058] Furthermore, in step one, a correction process of a first correction device is added between the first unwinding mechanism and the first die printing seat or between the first unwinding mechanism and the second die printing seat, that is, the antenna layer unwound by the first unwinding mechanism or the antenna layer of the composite first substrate layer is first passed through the first correction device for reference positioning, and its transfer direction is corrected and / or calibrated, and then the first correction device sends it to the input port of the first die printing seat or the input port of the second die printing seat.

[0059] Furthermore, in step six, a printing process of the second positioning mark of the fourth convex printing seat and a second exposure process of the second exposure device are added between the composite mechanism and the first die-cutting mechanism, that is, the antenna layer after composited with the second substrate layer or the antenna layer after composited with the second substrate layer and the first substrate layer is first sent to the fourth convex printing seat, and the fourth convex printing seat prints the second positioning mark on the antenna layer and / or the second substrate layer using ink, and the second positioning mark is used for chip positioning during chip installation and / or binding, and then the second positioning mark is exposed by the second exposure device so that the second positioning mark composed of ink is quickly exposed and dried, and then the antenna layer printed with the second positioning mark and composited with the second substrate layer or the antenna layer printed with the second positioning mark and composited with the second substrate layer and the first substrate layer is sent to the input port of the first die-cutting mechanism.

[0060] Furthermore, the antenna hole processing mechanism punches antenna holes in the antenna layer by using a flat die cutting process or a circular knife die cutting process;

[0061] In the step 5, the antenna hole processing mechanism performs antenna hole punching, and the waste antenna generated after the punching or the waste antenna generated after the punching and the waste first substrate layer enter the antenna hole waste collection device;

[0062] In the step 5, during the process of the antenna layer after the antenna hole is punched or the antenna layer composited with the first substrate layer being composited with the second substrate layer unrolled by the second unwinding mechanism through the composite mechanism, the heating drum of the composite mechanism synchronously heats the adhesive on the antenna layer, and the second substrate layer is composited with the antenna layer or the second substrate layer is composited with the antenna layer composited with the first substrate layer using a glue stick;

[0063] The temperature range of the heating drum is 50 degrees Celsius to 200 degrees Celsius; the temperature range of the drying mechanism is 40 degrees Celsius to 160 degrees Celsius; the first concave printing seat or the third concave printing seat is used to coat the adhesive on the antenna layer or the first substrate layer containing a diluent solvent.

[0064] Furthermore, the first die-cutting mechanism performs one-time flat-press die-cutting and / or circular-knife die-cutting on the antenna of the antenna layer or the antenna of the antenna layer combined with the first substrate layer and the first substrate layer to form chip binding points and chip binding positioning points;

[0065] Or the first die-cutting mechanism performs flat die-cutting and / or circular die-cutting on the antenna of the antenna layer or the antenna of the antenna layer composite with the first substrate layer and the first substrate layer twice or more to form chip binding points and chip binding positioning points.

[0066] In view of the above technical features, the present invention has the following beneficial effects:

[0067] 1. A fully die-cut UHF electronic tag antenna in the present invention adopts a die-cutting method for chip binding points and chip binding positioning points, such as flat die-cutting and / or circular die-cutting, which can make the fully die-cut UHF electronic tag antenna free from the etching process and can effectively reduce the impact and / or pollution of chemical substances generated by the etching process on the environment.

[0068] 2. The fully die-cut UHF electronic tag antenna in the present invention can also use die-cutting methods for punching antenna holes, such as flat die-cutting and / or circular die-cutting, which can make the fully die-cut UHF electronic tag antenna free from the etching process and effectively reduce the impact and / or pollution of chemicals generated by the etching process on the environment.

[0069] 3. The fully die-cut UHF electronic tag antenna in the present invention can also adopt a die-cutting method for the edges of the antenna body, such as flat die-cutting and / or circular die-cutting, which can make the fully die-cut UHF electronic tag antenna free from the etching process and effectively reduce the impact and / or pollution of the chemical substances generated by the etching process on the environment.

[0070] 4. In the processing equipment of a fully die-cut ultra-high frequency electronic tag antenna in the present invention, the processing equipment positions and processing sequences of the chip binding points, chip binding positioning points and the peripheral edges of the antenna body can be interchanged without affecting the processing effects of the chip binding points, chip binding positioning points and the peripheral edges of the antenna body.

[0071] 5. The processing technology of a fully die-cut UHF electronic tag antenna in the present invention, as long as it includes a processing method for die-cutting the chip binding points and the chip binding positioning points, is included in the protection scope of the present invention. This processing method can help the UHF electronic tag antenna to achieve full die-cutting processing without the aid of any etching process, and can reduce the environmental pollution caused by the production of UHF electronic tag antenna to the lowest point, or even basically harmless.

[0072] 6. The traction mechanism may be composed of at least two traction devices. For example, two traction devices place the die-cutting mechanism (including the antenna hole processing mechanism, the composite mechanism, the first die-cutting mechanism, the second die-cutting mechanism, etc.) between the two traction devices. The two traction devices help the die-cutting mechanism to achieve a good movement or transmission effect of the antenna layer or the antenna layer of the composite first substrate layer or the antenna layer of the composite first substrate layer and the second substrate layer during the die-cutting process, enhance the movement force, and not easily get stuck during the movement. At the same time, the two traction devices straighten or flatten the antenna layer or the antenna layer of the composite first substrate layer or the antenna layer of the composite first substrate layer and the second substrate layer during the die-cutting process of the die-cutting mechanism to maintain good tension, which can facilitate the die-cutting mechanism to perform processing and improve the effect of the die-cutting process. During the processing, the traction mechanism can effectively help the antenna layer to move or transmit better while maintaining tension.

[0073] 7. The second deflection correction device can help correct the moving position of the antenna layer or the composite first substrate layer output from the drying mechanism and coated with adhesive, accurately locate and correct the moving direction, ensure the accurate transmission position of the antenna layer or the composite first substrate layer entering the subsequent processing procedure, and help improve the die-cutting effect and die-cutting accuracy of the subsequent die-cutting mechanism. During the processing, the second deflection correction device can effectively prevent the position of the antenna layer from shifting when it moves or transmits.

[0074] 8. The second waste discharge and winding mechanism can improve the waste discharge effect and improve the product processing quality.

[0075] 9. The antenna hole processing mechanism, the first die-cutting mechanism and the second die-cutting mechanism are used to implement the die-cutting process for the antenna hole, the chip binding point and the chip binding positioning point of the UHF electronic tag antenna, effectively avoiding the use of the etching process, reducing or even completely eliminating the pollution to the environment caused by the etching process. At the same time, when applying the adhesive, a concave die printing seat design (such as the first concave die printing seat and the third concave die printing seat) is adopted to accurately apply the adhesive according to the shape of the antenna layer body (rather than applying the adhesive all over, effectively avoiding applying the adhesive all over the antenna layer or the first substrate layer). That is to say, only the place where the antenna layer body is formed by the final die-cutting is printed or applied with adhesive, and there is no adhesive between the other antenna layer waste and the second substrate layer waste, or there is no adhesive between the first substrate layer waste and the second substrate layer waste compounded on one side of the antenna layer. This will not affect the quality of the final product of the UHF electronic tag antenna, and can effectively save the amount of adhesive used and save production costs.

[0076] 10. The printing mechanism for accurately coating the adhesive and printing the first positioning mark is composed of a first concave mold printing seat. The first concave mold printing seat has the function of accurately coating the adhesive according to the shape of the antenna layer body (in this case, a colored adhesive is used for accurate coating), and also has the function of printing the first positioning mark with ink (preferably UV ink), realizing two functions at one time. In this way, the production efficiency is higher, and the production steps can be adjusted according to customer requirements. At this time, it is also possible to have no exposure device.

[0077] 11. The printing mechanism for accurately applying adhesive and printing the first positioning mark can also be composed of a second concave mold printing seat, a first exposure device and a third concave mold printing seat, wherein the second concave mold printing seat uses ink (preferably UV ink) to print the first positioning mark and the marking block (or several marking blocks) on one side of the antenna layer or on the side of the first substrate layer composited on the antenna layer without the antenna layer attached, and the shape of the marking block is the same as the shape of the antenna layer body, and then the first positioning mark and the marking block are "exposed" by the first exposure device to achieve rapid exposure and drying, which does not affect the subsequent printing or application of adhesive on each marking block by the third concave mold printing seat, thereby improving the accuracy of adhesive application while avoiding the practice of applying adhesive on the antenna layer or the first substrate layer, effectively saving the amount of adhesive used and saving production costs. At this time, the marking block printed by ink needs to be first exposed and dried by the first exposure device (UV lamp, also known as ultraviolet lamp), and the marking block formed after drying can facilitate the adhesive to be attached to the corresponding marking block to form an adhesive block.

[0078] 12. The first positioning mark plays a reference positioning role in the subsequent die-cutting process of the antenna hole processing mechanism, the first die-cutting mechanism and the second die-cutting mechanism to produce the antenna hole, chip binding point and chip binding positioning point of the UHF electronic tag antenna. It is convenient for the antenna hole processing mechanism, the first die-cutting mechanism and the second die-cutting mechanism to use the first positioning mark to perform precise die-cutting of the antenna hole, chip binding point and chip binding positioning point on the antenna layer, thereby improving product processing accuracy and improving product quality.

[0079] 13. The setting of the first correction device can help correct the transportation position of the antenna layer or the antenna layer composited with the first substrate layer that is ready to enter the printing mechanism, and ensure that it enters the printing mechanism at the specified position. This can ensure that the printing mechanism (i.e., the first concave die printing seat or the second concave die printing seat and the third concave die printing seat) can accurately print the first positioning mark, print or apply adhesive according to the shape of the antenna layer body, and ensure the processing accuracy of the printing mechanism.

[0080] 14. The fourth convex mold printing seat and the second exposure device (such as UV lamp) are used to print and quickly dry the second positioning mark after the antenna hole is punched and before the chip binding point and chip binding positioning point die-cutting, which can form the second positioning mark (actually the chip installation position mark) without affecting the subsequent chip binding point and chip binding positioning point die-cutting process. The second positioning mark can help the chip further determine the chip installation position and improve the accuracy of the chip installation position, especially when the chip binding point area is small or large compared to the chip size. The second positioning mark can position the chip installation and help the chip to achieve accurate installation, and the chip installation position accuracy is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] Figure 1 It is a schematic diagram of the structure of a fully die-cut UHF tag antenna in Example 1.

[0082] Figure 2 It is a schematic cross-sectional structure diagram of a fully die-cut UHF electronic tag antenna in Example 1 (excluding the first substrate layer).

[0083] Figure 3 It is a schematic cross-sectional structure diagram of a fully die-cut ultra-high frequency electronic tag antenna in Example 1 (including the first substrate layer).

[0084] Figure 4 It is a structural schematic diagram of a fully die-cut ultra-high frequency electronic tag antenna and a first positioning mark in Example 1;

[0085] Figure 5 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 1 Figure 1 ;

[0086] Figure 6 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 1 Figure 2 ;

[0087] Figure 7 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 2 Figure 1 ;

[0088] Figure 8 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 2 Figure 2 ;

[0089] Fig. 9 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 3 Figure 1 ;

[0090] Fig.10 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 3 Figure 2 ;

[0091] Fig.11 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 4 Figure 1 ;

[0092] Fig.12 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 4 Figure 2 ;

[0093] Fig.13 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 5. Figure 1 ;

[0094] Fig.14 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 5. Figure 2 ;

[0095] Fig.15 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 5. Figure 3 ;

[0096] Fig.16 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 5. Figure 4 ;

[0097] Fig.17 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 5. Figure 5 ;

[0098] Fig.18 This is a schematic diagram of the structure of a composite and multi-station printing and full die-cutting UHF label antenna processing equipment in Example 5. Figure 6 .

[0099] In the figure: 1 is the first unwinding mechanism; 3 is the drying mechanism; 4 is the antenna hole processing mechanism; 5 is the antenna hole waste collection device; 6 is the compound mechanism; 7 is the second unwinding mechanism; 8 is the circular knife die-cutting machine in the first die-cutting mechanism for performing circular knife die-cutting on one of the chip binding points; 9 is the circular knife die-cutting machine in the first die-cutting mechanism for performing circular knife die-cutting on another chip binding point and the chip binding positioning point; 10 is the second die-cutting mechanism; 11 is the first row of waste winding mechanism; 12 is the third unwinding mechanism; 13 is the finished product winding mechanism; 14 is the chip binding positioning point; 15 is the chip binding point; 16 is the antenna hole; 17 is the antenna body; 18 is the aluminum foil; 19 is the first concave die printing Adhesive printed or coated by a brush holder or a third concave die printing holder; 20 is paper as the second substrate layer, 21 is a PET layer as the first substrate layer; 22 is an adhesive pre-laminated with the PET layer and the aluminum foil; 23 is a first traction device; 24 is a second traction device; 25 is a second deviation correction device; 26 is a second waste discharge and winding mechanism; 27 is a first die-cutting mechanism; 28 is a first concave die printing holder; 29 is a second concave die printing holder; 30 is a third concave die printing holder; 31 is a fourth convex die printing holder; 32 is a first exposure device; 33 is a second exposure device; 34 is a first deviation correction device; 36 is a first positioning mark; 37 is a second positioning mark; 38 is a pasting block. DETAILED DESCRIPTION

[0100] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the appended claims of the application equally.

[0101] Specific embodiment 1, see Figures 1 to 6 Embodiment 1 provides a composite and multi-station printing and full die-cutting UHF tag antenna processing equipment, involving an UHF tag antenna having an antenna body 17 provided with a chip binding positioning point 14 formed by a die-cutting method and a chip binding point 15 formed by a die-cutting method; the antenna layer side of the antenna body 17 is also pasted with a second substrate layer or a first substrate layer and a second substrate layer, see Figure 1 , Figure 2 and Figure 3 , characterized in that: the composite and multi-station printing and full die-cutting UHF tag antenna processing equipment includes a first die-cutting mechanism 27 for die-cutting the chip binding positioning point 14 and the chip binding point 15 of the UHF tag antenna, a second die-cutting mechanism 10 for die-cutting the edges around the UHF tag antenna, and a printing mechanism for applying adhesive on one side of the antenna layer to be processed or on the side of the first substrate layer where the antenna layer is not pasted according to the shape of the antenna body.

[0102] The chip binding positioning points 14 and the chip binding points 15 of the UHF electronic tag antenna are manufactured by die-cutting, which can avoid the use of etching process during the production of the chip binding positioning points 14 and the chip binding points 15, and can effectively reduce the pollution of chemical substances to the environment; in addition, the chip binding positioning points 14 and the chip binding points 15 formed by die-cutting have smooth and rounded edges on all sides, without any uneven edge shapes, thereby improving the quality of the UHF electronic tag antenna.

[0103] The edges of the antenna body 17 are formed by die cutting.

[0104] The antenna body 17 is further provided with an antenna hole 16 formed by die cutting.

[0105] That is to say, each part of the UHF electronic tag antenna can be produced by die-cutting, and the entire UHF electronic tag antenna can be produced by die-cutting, which can completely break away from the etching process, minimize the pollution to the environment, and even eliminate chemical pollution.

[0106] The die-cutting method can be flat die-cutting and / or circular die-cutting, and circular die-cutting is also called rolling cutting.

[0107] In the first embodiment, there are two chip binding points 15 and one antenna hole 16 , and the gap formed between the chip binding points 15 connects the antenna hole 16 and the outside of the antenna.

[0108] A second substrate layer or a first substrate layer and a second substrate layer are also pasted on one side of the antenna layer of the antenna body 17. Preferably, the first substrate layer is a polyester film, preferably a PET layer 21 of the first substrate layer, and the second substrate layer is a polyester film or paper 20, wherein the polyester film is preferably a PET layer; the antenna of the antenna layer can be a metal foil, such as aluminum foil, copper foil, etc. In this embodiment 1, the antenna of the antenna layer is preferably aluminum foil 18.

[0109] The composite and multi-station printing and full die-cutting UHF label antenna processing equipment also includes an antenna hole processing mechanism 4 for die-cutting the antenna hole 16 of the UHF label antenna, a composite mechanism 6 for composite the second substrate layer and the antenna layer or composite the second substrate layer and the first substrate layer to which the antenna layer has been pasted, a first row of waste rewinding mechanisms 11 for rolling up the waste antenna processed by the first die-cutting mechanism 27 and the second die-cutting mechanism 10 or rolling up the waste antenna and the waste first substrate layer processed by the first die-cutting mechanism 27 and the second die-cutting mechanism 10, and a third unwinding mechanism 12 for unwinding the isolation layer on the antenna layer; and a first row of waste rewinding mechanisms 11 for rolling up the waste antenna processed by the first die-cutting mechanism 27 and the second die-cutting mechanism 10 and the waste first substrate layer. a first unwinding mechanism 1 for a processed antenna layer or a composite first substrate layer to be processed antenna layer, a drying mechanism 3 for drying the antenna layer after adhesive has been applied according to the shape of the antenna body, or a drying mechanism 3 for drying the antenna layer composite first substrate layer after adhesive has been applied according to the shape of the antenna body, a second deviation correcting device 25, a first traction device 23, a second traction device 24, a second unwinding mechanism 7 for unwinding the second substrate layer, and a finished product winding mechanism 13 for winding the processed antenna layer together with the second substrate layer and the isolation layer, or winding the processed antenna layer together with the first substrate layer, the second substrate layer and the isolation layer;

[0110] The traction mechanism composed of the first traction device 23 and the second traction device 24 places the antenna hole processing mechanism 4, the composite mechanism 6, the first die-cutting mechanism 27 (a circular knife die-cutting machine 8 for performing circular knife die-cutting on one of the chip binding points and a circular knife die-cutting machine 9 for performing circular knife die-cutting on another chip binding point and the chip binding positioning point), the second die-cutting mechanism 10, the first row of waste winding mechanism 11, and the third unwinding mechanism 12 between the first traction device 23 and the second traction device 24 in front and behind to help the antenna layer and / or the first substrate layer and / or the second substrate layer and / or the isolation layer processed by the above-mentioned components to be moved or transported well, and at the same time, it can also help maintain the antenna layer and / or the first substrate layer and / or the second substrate layer and / or the isolation layer with stable and uniform tension during movement, especially the tension of the die-cutting part is required to be stable and uniform, so as to facilitate the corresponding processing operations of the above-mentioned components and ensure the accuracy of the processing operations.

[0111] The printing mechanism is a first concave mold printing seat 28 for applying a colored adhesive on one side of the antenna layer to be processed or on the side of the first substrate layer where the antenna layer is not attached according to the shape of the antenna body and simultaneously printing a first positioning mark 36 near the adhesive block 38 coated according to the shape of the antenna body. The so-called near the adhesive block 38 refers to setting the first positioning mark 36 at a specified distance around or on both sides of the adhesive block 38 or on both sides of the outermost edge. The first positioning mark 36 in this embodiment 1 is set on both sides of the outermost edge of the adhesive block 38, see Figure 4The first positioning mark 36 can provide a positioning basis for the antenna hole processing mechanism 4, the fourth punch printing seat 31, the first module mechanism 27 and the second module mechanism 10 in each subsequent processing process of the antenna hole processing mechanism 4, the fourth punch printing seat 31, the first module mechanism 27 and the second module mechanism 10, thereby improving the accuracy of each processing of the antenna hole processing mechanism 4, the fourth punch printing seat 31, the first module mechanism 27 and the second module mechanism 10 and improving product quality. For example, the outer contour of the specific label antenna on the antenna layer is positioned by the first positioning mark 36, which is also called mold positioning.

[0112] At this time, the first positioning mark 36 can be printed with ink, preferably UV ink, and color (ink or pigment powder, such as red or black, etc.) can be added to the adhesive coated into the adhesive block. Therefore, the printing of the first positioning mark 36 and the coating of the adhesive block 38 can be completed at one time through the first concave mold printing seat 28, that is, the printing of the label antenna pattern and the positioning points (color positions, i.e., the first positioning mark) next to it are realized. The positioning points (color positions) are used for the subsequent antenna hole processing mechanism 4, the fourth convex mold printing seat 31, the first die-cutting mechanism 27, and the second die-cutting mechanism 10 for alignment (color registration) to improve the accuracy of subsequent antenna hole processing, chip binding point processing, and chip binding positioning point processing.

[0113] The groove portion of the first concave die printing seat 28 is used to install adhesive. The shape of the groove portion matches the shape of the antenna body, that is, the shape of each groove portion is the shape of the antenna body to be cut out, and the adhesive is printed in this shape. It is also possible to set multiple groove portions at the same time to realize concave die printing of multiple adhesive blocks 38, which is convenient and saves adhesive.

[0114] See also Figure 5The output port of the first unwinding mechanism 1 corresponds to the input port of the first concave die printing seat 28, the output port of the first concave die printing seat 28 corresponds to the input port of the drying mechanism 3, the output port of the drying mechanism 3 corresponds to the input port of the second correcting device 25, the output port of the second correcting device 25 corresponds to the input port of the first traction device 23, the output port of the first traction device 23 corresponds to the input port of the antenna hole processing mechanism 4, the output port of the antenna hole processing mechanism 4 corresponds to the input port of the compound mechanism 6, and at the same time, the output port of the second unwinding mechanism 7 corresponds to the input port of the compound mechanism 6, the output port of the compound mechanism 6 corresponds to the input port of the first die-cutting mechanism 27, the first die The output port of the cutting mechanism 27 corresponds to the input port of the second die-cutting mechanism 10, the output port of the second die-cutting mechanism 10 corresponds to the input port of the first row of waste winding mechanism 11 and the input port of the second traction device 24, and the output port of the third unwinding mechanism 12 also corresponds to the input port of the second traction device 24, and the output port of the second traction device 24 corresponds to the input port of the finished product winding mechanism 13; in addition, the positions of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 can be interchanged, the corresponding component connection method is adjusted accordingly, and the process order of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 is also interchanged, which does not affect product production and the processing effect is the same.

[0115] As an alternative, see Figure 6The above-mentioned first concave die printing seat 28 can also be replaced by a printing mechanism consisting of a second concave die printing seat 29 for printing a first positioning mark 36 and a marking block with ink on the side of the antenna layer to be processed or the side of the first substrate layer where the antenna layer is not pasted, a first exposure device 32 for exposing the first positioning mark 36 and the marking block so that the first positioning mark 36 and the marking block composed of ink are quickly exposed to dry, and a third concave die printing seat 30 for applying an adhesive according to the shape of the antenna body on the side of the antenna layer to be processed or the side of the first substrate layer where the antenna layer is not pasted according to the marking block. At this time, the output port of the first unwinding mechanism 1 corresponds to the input port of the second concave die printing seat 29, the output port of the second concave die printing seat 29 corresponds to the input port of the first exposure device 32, the output port of the first exposure device 32 corresponds to the input port of the third concave die printing seat 30, and the output port of the third concave die printing seat 30 corresponds to the input port of the drying mechanism 3. The subsequent components and their connection relationships are the same as the above-mentioned scheme and are not repeated. The first positioning mark 36 and the marking block here are formed by the concave printing of the groove part of the second concave printing seat 29. The groove part of the second concave printing seat 29 is used to install ink, preferably UV ink. The shape of the groove part matches the second positioning mark 36 and the shape of the antenna body, that is, the shape of each groove part is the shape of the second positioning mark 36 and the antenna body to be cut out, and the UV ink is printed in this shape. It is also possible to set multiple groove parts at the same time to realize the concave printing of the second positioning mark 36 and multiple marking blocks at the same time, wherein the marking block and the adhesive block 38, that is, the adhesive block 38 is formed after printing or applying the adhesive 19 on the marking block, which is convenient and saves adhesive. The marking block is not shown in the attached figure.

[0116] The groove portion of the third concave die printing seat 30 is used to install adhesive. The shape of the groove portion matches the shape of the antenna body, that is, the shape of each groove portion is the shape of the antenna body to be cut out, and the adhesive is printed in this shape. It is also possible to set multiple groove portions at the same time to realize concave die printing of multiple adhesive blocks 38, which is convenient and saves adhesive.

[0117] The marking block can be composed of surrounding lines that match the shape of the antenna body, or the marking block can be a color block area printed according to the shape of the antenna body, and the color block area has the same shape as the antenna body.

[0118] In addition, in this alternative scheme, the positions of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 can be interchanged, the connection method of the corresponding components can be adjusted accordingly, and the process order of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 can also be interchanged, which does not affect product production and the processing effect is the same.

[0119] The first die-cutting mechanism 27 is composed of a flat-pressing die-cutting mechanism, which is a flat-pressing die-cutting machine including at least one die-cutting tool for flat-pressing and die-cutting the chip binding positioning point 14 and the chip binding point 15;

[0120] Or the first die-cutting mechanism 27 is composed of a circular knife die-cutting mechanism, which is a circular knife die-cutting machine including at least one rolling cutting tool for circular knife die-cutting the chip binding positioning point 14 and the chip binding point 15;

[0121] Or the first die-cutting mechanism 27 is a hybrid die-cutting mechanism composed of a flat die-cutting mechanism and a circular knife die-cutting mechanism, and the hybrid die-cutting mechanism is a hybrid die-cutting machine including at least one die-cutting tool for flat die-cutting the chip binding positioning point 14 or the chip binding point 15 and at least one rolling cutter tool for circular knife die-cutting the chip binding point 14 or the chip binding positioning point 15;

[0122] The second die-cutting mechanism 10 is a flat die-cutting machine for flat die-cutting the edges of the antenna body 17, or a circular die-cutting machine for circular die-cutting the edges of the antenna body 17;

[0123] The antenna hole processing mechanism 4 is a flat die-cutting machine for flat die-cutting the antenna hole 16 , or the antenna hole processing mechanism is a circular knife die-cutting machine for circular knife die-cutting the antenna hole 16 .

[0124] That is to say, the first die-cutting mechanism 27, the second die-cutting mechanism 10, and the antenna hole processing mechanism 4 can select a flat die-cutting mechanism and / or a circular knife die-cutting mechanism to implement the die-cutting process according to actual needs, so as to meet the die-cutting process requirements of the fully die-cut UHF electronic tag antenna, especially the die-cutting process requirements of the chip binding positioning point 14, the chip binding point 15, the edges of the antenna body 17, and the antenna hole 16.

[0125] The processing steps of the above two schemes in this embodiment 1 are as follows:

[0126] Step 1: The first unwinding mechanism 1 unwinds the antenna layer to be processed or the antenna layer of the composite first substrate layer to the first concave mold printing seat 28, and the first concave mold printing seat 28 applies a colored adhesive on one side of the antenna layer to be processed or the side of the antenna layer of the composite first substrate layer where the antenna layer is not bonded according to the shape of the antenna body, and simultaneously prints a first positioning mark 36 near the adhesive block 38 coated according to the shape of the antenna body, and then the first concave mold printing seat 28 sends the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer to the drying mechanism, and uses the drying mechanism to dry the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer;

[0127] Or the first unwinding mechanism 1 unwinds the antenna layer to be processed or the antenna layer of the composite first substrate layer to the second concave mold printing seat 29, and the second concave mold printing seat 29 uses ink to print the first positioning mark 36 and the marking block on one side of the antenna layer to be processed or the side of the first substrate layer where the antenna layer is not pasted, and then the first exposure device 32 exposes the first positioning mark 36 and the marking block so that the first positioning mark 36 and the marking block composed of ink are quickly exposed to dry, and then the third concave mold printing seat 30 applies adhesive according to the shape of the antenna body on one side of the antenna layer to be processed or the side of the first substrate layer where the antenna layer is not pasted according to the marking block, and the third concave mold printing seat 30 sends the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer after being coated with the adhesive to the drying mechanism 3, and the drying mechanism 3 is used to dry the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer.

[0128] Step 2: Send the dried antenna layer or the antenna layer combined with the first substrate layer to the deflection correction device 25, and use the second deflection correction device 25 to perform reference positioning on the dried antenna layer or the antenna layer combined with the first substrate layer, and correct and / or calibrate its transfer direction;

[0129] Step 3: The antenna layer or the antenna layer composited with the first substrate layer after being corrected by the second correcting device 25 is sent to the first traction device 23, and the first traction device 23 is used to help the antenna layer or the antenna layer composited with the first substrate layer to be conveyed; the first traction device 23 and the second traction device 24 work together to control the transmission speed of the antenna layer or the antenna layer composited with the first substrate layer, and the tension of the antenna layer or the antenna layer composited with the first substrate layer during the transmission process is stable and each die-cutting position is accurate;

[0130] Step 4: The antenna layer or the antenna layer composited with the first substrate layer after passing through the first traction device 23 is sent to the antenna hole processing mechanism 4 to punch the antenna hole 16. The antenna hole processing mechanism 4 punches the antenna hole 16 on the antenna layer or the antenna layer composited with the first substrate layer;

[0131] Step 5: The antenna layer after the antenna hole 16 is punched or the antenna layer of the composite first substrate layer after the antenna hole 16 is punched is compounded with the second substrate layer of the second unwinding mechanism 7 by the compounding mechanism 6, that is, the second substrate layer is bonded to the antenna layer or the first substrate layer by an adhesive;

[0132] Step 6: After the antenna layer is compounded with the second substrate layer, the antenna of the antenna layer is firstly subjected to flat die cutting and / or circular die cutting by the first die cutting mechanism 27 to form the chip binding point 15 and the chip binding positioning point 14, and then the antenna of the antenna body 17 of the antenna layer is subjected to flat die cutting and / or circular die cutting by the second die cutting mechanism 10 to form the outer contour of the antenna body 17, and then the antenna body 17 and the remaining waste antenna are formed on the second substrate layer. The remaining waste antenna is rolled up and discharged by the first waste discharging and winding mechanism 11;

[0133] Or the antenna layer after the second substrate layer and the first substrate layer are composited is firstly subjected to flat die-cutting and / or circular die-cutting by the first die-cutting mechanism 27 to simultaneously perform flat die-cutting and / or circular knife die-cutting on the antenna of the first substrate layer and the antenna layer to form the chip binding point 15 and the chip binding positioning point 14, and then the antenna and the first substrate layer are simultaneously subjected to die-cutting and / or roll-cutting by the second die-cutting mechanism 10 to simultaneously perform die-cutting and / or roll-cutting on the antenna at the edges of the antenna body 17 of the antenna layer composited with the first substrate layer to form the outer contour of the antenna body 17, and then the antenna body 17 of the composite first substrate layer, which is initially formed, as well as the remaining waste antenna and the corresponding remaining waste first substrate layer are formed on the second substrate layer, and the remaining waste antenna and the corresponding remaining waste first substrate layer are rolled up and discharged by the first waste discharging and winding mechanism 11;

[0134] In this step six, the processing order of the first die-cutting mechanism 27 and the second die-cutting mechanism 10 can be swapped without affecting the final product obtained by processing. The alternative scheme after replacement is that the antenna layer after compounding the second substrate layer, firstly uses the second die-cutting mechanism 10 to perform flat die-cutting and / or circular knife die-cutting on the antenna on the edges of the antenna body 17 of the antenna layer to form the outer contour of the antenna body 17, and then uses the first die-cutting mechanism 27 to perform flat die-cutting and / or circular knife die-cutting on the antenna of the antenna layer to form the chip binding point 15 and the chip binding positioning point 14, and then forms a preliminary formed antenna body 17 and the remaining waste antenna on the second substrate layer, and the remaining waste antenna is rolled up and discharged by the first waste discharge and reeling mechanism 11; or the antenna layer of the second substrate layer and the first substrate layer is compounded, firstly uses the second die The cutting mechanism 10 simultaneously performs flat die-cutting and / or circular die-cutting on the antenna and the first substrate layer corresponding to the edges of the antenna body 17 of the antenna layer to form the outer contour of the antenna body 17, and then the first die-cutting mechanism 27 simultaneously performs flat die-cutting and / or circular die-cutting on the antenna and the first substrate layer of the antenna layer to form the chip binding point 15 and the chip binding positioning point 14, and then forms a preliminary formed antenna body 17 of the composite first substrate layer on the second substrate layer, as well as the remaining waste antenna and the corresponding remaining waste first substrate layer, and the remaining waste antenna and the corresponding remaining waste first substrate layer are rolled up and discharged by the first waste discharging and winding mechanism 11.

[0135] Step 7: After the first waste discharging and rewinding mechanism 11 rewinds and discharges the waste, the third unwinding mechanism 12 unwinds the isolation layer so that the isolation layer is covered on the antenna of the initially formed antenna body 17 or on the first substrate layer;

[0136] Step eight: The antenna body 17 covered with the isolation layer is sent to the second traction device 24, and the second traction device 24 is used to help the antenna body 17 covered with the isolation layer to be transferred to the finished product winding mechanism 13, and the finished product winding mechanism 13 is wound to form a die-cut UHF electronic tag antenna product.

[0137] When the first substrate layer is not included in the processing of the fully die-cut UHF electronic tag antenna, and the antenna layer is directly processed, the first die printing seat 28 or the third die printing seat 30 applies adhesive 19 on one side of the antenna layer. When the first die-cutting mechanism performs die-cutting on the chip binding positioning point 14 and the chip binding point 15, the second die-cutting mechanism 10 performs die-cutting on the edges of the antenna body 17, and the antenna hole processing mechanism 4 performs die-cutting on the antenna hole 16, only the antenna layer is die-cut, but the second substrate layer is not die-cut. At this time, the adhesive 19 printed or applied by the first die printing seat 28 or the third die printing seat 30 is used to compound the antenna layer and the second substrate layer through the compounding mechanism 7, that is, the antenna layer and the second substrate layer are bonded together by the adhesive 19. The fully die-cut UHF electronic tag antenna product produced under this premise is, from top to bottom, the antenna layer (i.e., aluminum foil 18), the antenna layer is bonded to the second substrate layer (i.e., paper 20) by the adhesive 19 printed or applied by the first die printing seat 28 or the third die printing seat 30, see the attached figure for details. Figure 2 .

[0138] During the processing of the fully die-cut UHF electronic tag antenna, the first substrate layer can be added or omitted. Preferably, the first substrate layer is used to support the antenna on the antenna layer. During the processing of the antenna layer, the first substrate layer protects the antenna. At this time, the first concave die printing seat 28 or the third concave die printing seat 30 applies adhesive on the side of the first substrate layer where the antenna layer is not attached. When the first die-cutting mechanism performs die-cutting on the chip binding positioning point 14 and the chip binding point 15, the second die-cutting mechanism 10 performs die-cutting on the edges of the antenna body 17, and the antenna hole processing mechanism 4 performs die-cutting on the antenna hole 16, the first substrate layer and the antenna layer can be die-cut at the same time, but the second substrate layer is not die-cut. The adhesive 19 printed or applied by the first concave die printing seat 28 or the third concave die printing seat 30 is used to compound the first substrate layer and the second substrate layer through the compounding mechanism 6, that is, the first substrate layer and the second substrate layer are bonded together by the adhesive 19. The finished product of the fully die-cut UHF electronic tag antenna produced under this premise is, from top to bottom, an antenna layer (i.e., aluminum foil 18), an antenna layer pasted and composited with a first substrate layer (the first substrate layer is a PET layer 21, and the pasting and composite here means that the PET layer 21 has been pre-compounded with the aluminum foil 18 by an adhesive 22 used to pre-compound and paste the PET layer 21 and the aluminum foil 18, and then the antenna layer composited with the first substrate layer is unwound into the first concave die printing seat 28 or the second concave die printing seat 29 and the third concave die printing seat 30 by the first unwinding mechanism 1), and the first substrate layer (i.e., PET layer 21) is pasted and composited with the second substrate layer (i.e., paper 20) by the adhesive 19 printed or coated by the first concave die printing seat 28 or the third concave die printing seat 30, see for details. Figure 3 .

[0139] The second deflection-correcting device 25 is used to correct and calibrate the position of the antenna layer or the composite first substrate layer coming out of the drying mechanism 3 when there is a position deviation during the forward movement (i.e., during transportation or movement). In particular, when there is a side position error or side position deviation of the antenna layer or the composite first substrate layer, the second deflection-correcting device 25 plays a correction role, that is, the second deflection-correcting device 25 performs a reference positioning for the antenna layer or the composite first substrate layer coming out of the drying mechanism 3, corrects its moving direction, ensures that its forward direction and the position on both sides are accurate when it enters the first traction device 23, and helps to improve and / or ensure the accuracy of the subsequent processing of the first die-cutting mechanism and / or the second die-cutting mechanism. Or if the antenna layer or the composite first substrate layer has a deviation in the transmission position of the antenna layer or the composite first substrate layer after drying due to thermal expansion in the drying mechanism, the second deflection-correcting device 25 can also perform position correction and position calibration for this.

[0140] The composite mechanism 9 is also provided with a heating drum for heating the adhesive, which facilitates the bonding between the second substrate layer and the side of the first substrate layer to which the antenna layer is not bonded. After passing through the composite mechanism 6, the composite bonding function of the second substrate layer and the first substrate layer can be better achieved; the composite mechanism 6 includes a rubber roller for composite the second substrate layer with the antenna layer or a rubber roller for composite the second substrate layer with the antenna layer of the composite first substrate layer.

[0141] When the antenna layer of the composite first substrate layer after drying by the drying mechanism 2 is punched in the antenna hole processing mechanism 4, the adhesive 19 printed or coated by the first concave mold printing seat 28 or the third concave mold printing seat 30 will not affect the punching, which facilitates the antenna hole punching operation.

[0142] A composite and multi-station printing and full die-cutting UHF label antenna processing equipment and processing method in this embodiment 1 can be processed according to the shape of the antenna body (the shape of the antenna body is not limited to the attached Figure 1 As shown in the figure, it can also be designed into other shapes according to the actual needs of the UHF label, as long as it meets the working requirements of the UHF label) The adhesive is accurately applied to form an adhesive block 38, and other parts that do not constitute the antenna body will not be coated with adhesive. This will effectively avoid adhesive waste and save production costs; in addition, by printing the first positioning mark 36, the processing accuracy of the antenna hole processing mechanism 4, the fourth convex mold printing seat 31, the first module mechanism 27 and the second module mechanism 10 can be effectively improved.

[0143] See also Figure 7 and Figure 8 , Specific embodiment 2, embodiment 2 provides a composite and multi-station printing full die-cutting UHF label antenna processing equipment, the difference between embodiment 2 and embodiment 1 is: between the first unwinding mechanism 1 and the first concave die printing seat 28 (see Figure 7 ) or the first unwinding mechanism 1 and the second concave die printing seat 29 (see Figure 8 ) is additionally provided between the first deflection correcting device 34, which is used to perform reference positioning of the antenna layer unwound by the first unwinding mechanism 1 or the antenna layer of the composite first substrate layer, and correct and / or calibrate its transfer direction, so as to facilitate the subsequent first concave die printing seat 28 or the second concave die printing seat 29 and the third concave die printing seat 30 to more accurately print the first positioning mark 36 on the antenna layer or the antenna layer of the composite first substrate layer and apply the adhesive 19 according to the shape of the antenna body.

[0144] At this time, the output port of the first unwinding mechanism 1 corresponds to the input port of the first deflection correcting device 34, and the output port of the first deflection correcting device 34 corresponds to the input port of the first concave die printing seat 28 or the input port of the second concave die printing seat 29. In step 1 of the processing step, the first unwinding mechanism 1 is also adjusted to unwind the antenna layer to be processed or the antenna layer composited with the first substrate layer to the first deflection correcting device 34, and after the first deflection correcting device corrects the antenna layer to be processed or the antenna layer composited with the first substrate layer, the antenna layer to be processed or the antenna layer composited with the first substrate layer is moved to the first concave die printing seat 28 or the second concave die printing seat 29 for subsequent processing. The subsequent processing steps are the same as the processing steps in Example 1, and will not be repeated here.

[0145] See also Fig. 9 and Fig.10 , Specific embodiment 3, embodiment 3 provides a composite and multi-station printing and full-die-cutting UHF label antenna processing equipment, the difference between embodiment 3 and embodiment 2 is that: when the second die-cutting mechanism 10 is located after the first die-cutting mechanism 27, a fourth convex mold printing seat 31 and a second exposure device 33 are added between the composite mechanism 6 and the first die-cutting mechanism 27, at this time, the output port of the composite mechanism 6 corresponds to the input port of the fourth convex mold printing seat 31, the output port of the fourth convex mold printing seat 31 corresponds to the input port of the second exposure device 33, the output port of the second exposure device 33 corresponds to the input port of the first die-cutting mechanism 27, and the first die-cutting mechanism The output port of 27 corresponds to the input port of the second die-cutting mechanism 10; in step six of the processing step, it is also adjusted to the antenna layer after the second substrate layer is composited or the antenna layer of the second substrate layer and the first substrate layer is composited. The second positioning mark 37 is first printed with ink by the fourth convex printing seat 31, and then the second positioning mark 37 is exposed by the second exposure device 33 so that the second positioning mark 37 composed of ink is quickly exposed and dried, and then processed by the first die-cutting mechanism 27 and the second die-cutting mechanism 10 in sequence. The other process steps are the same as the processing steps in Example 2, and will not be repeated here. When the first concave die printing seat 28 is included, refer to Fig. 9 , when including the second concave die printing seat 29 and the third concave die printing seat 30, see Fig.10 The second positioning mark 37 may be located on the antenna layer and / or the second substrate layer, and the second exposure device may quickly expose and dry ink on a plurality of second positioning marks 37 at the same time.

[0146] The first exposure device and the second exposure device are preferably both UV lamps (ie, ultraviolet lamps), ie, a first UV lamp and a second UV lamp.

[0147] An alternative option is that when the first die-cutting mechanism 27 is located after the second die-cutting mechanism 10, a fourth convex printing seat 31 and a second exposure device 33 are added between the composite mechanism 6 and the second die-cutting mechanism 10. At this time, the output port of the composite mechanism 6 corresponds to the input port of the fourth convex printing seat 31, the output port of the fourth convex printing seat 31 corresponds to the input port of the second exposure device 33, the output port of the second exposure device 33 corresponds to the input port of the second die-cutting mechanism 10, and the output port of the second die-cutting mechanism 10 corresponds to the input port of the first die-cutting mechanism 27; in step six of the processing steps, it is also adjusted to the antenna layer after the composite second substrate layer or the antenna layer of the composite second substrate layer and the first substrate layer. The fourth convex printing seat 31 first prints the second positioning mark 37 with ink, and then the second exposure device 33 exposes the second positioning mark 37 so that the second positioning mark 37 composed of ink is quickly exposed and dried, and then processed by the second die-cutting mechanism 10 and the first die-cutting mechanism 10 in turn. The other process steps are the same as the processing steps in Example 2 and will not be repeated here.

[0148] The second positioning mark 37 can identify the installation position of the chip on the antenna body, and can print a small cross or a small dot or other mark that is conducive to the installation and positioning of the chip for later installation and binding. Especially when the tag antenna body is small and the chip binding point is also small, when the chip installation positioning using the chip binding point is inaccurate, the second positioning mark 37 can be used to calibrate the chip installation position at the same time, which can help the chip to be accurately installed in the specified position, improve the accuracy of chip installation, and improve product quality.

[0149] See also Fig.11 and Fig.12, Specific embodiment 4, embodiment 4 provides a composite and multi-station printing full die-cutting UHF label antenna processing equipment, the difference between embodiment 4 and embodiment 3 is that: a second waste discharge and winding mechanism 26 is added after the first die-cutting mechanism 27, that is, the output port of the first die-cutting mechanism 27 corresponds to the input port of the second waste discharge and winding mechanism 26 and the input port of the second die-cutting mechanism 10, and the output port of the second die-cutting mechanism corresponds to the first waste discharge and winding mechanism 11 and the input port of the second traction device 24. At this time, the first die-cutting mechanism 27 is used to align the two chip binding points 15 and the chip binding positioning point 14, and at the same time, the redundant antennas on both sides of the antenna layer or the first substrate layer and the antenna layer The redundant antennas on both sides and the redundant first substrate layer are subjected to flat die-cutting or circular die-cutting, thereby forming residual antenna waste on both sides or residual antenna waste and first substrate waste on both sides, and the residual antenna waste on both sides or residual antenna waste and first substrate waste are rolled up and discharged through the second waste discharge and winding mechanism 26, and then the antennas on the edges of the antenna body 17 of the antenna layer are subjected to flat die-cutting and / or circular die-cutting by the second die-cutting mechanism 10 to form the outer contour of the antenna body 17, and then the antenna body 17 and the residual waste antenna are initially formed on the second substrate layer, and the residual waste antenna is rolled up and discharged through the first waste discharge and winding mechanism 11. At this time, the other process steps are the same as the processing steps in Example 3, and will not be repeated here. When the first concave mold printing seat 28 is included, refer to Fig.11 , when including the second concave die printing seat 29 and the third concave die printing seat 30, see Fig.12 .

[0150] The second waste discharge and winding mechanism 26 can improve the overall waste discharge and winding effect, discharge waste more cleanly, have a higher product qualification rate, disperse the pressure of the first waste discharge and winding mechanism, and reduce the probability of interruption of the first waste discharge and winding mechanism.

[0151] See also Figures 13 to 18 , Specific embodiment 5, embodiment 5 provides a composite and multi-station printing and full die-cutting UHF label antenna processing equipment, the difference between embodiment 5 and embodiment 4 is:

[0152] The first die-cutting mechanism 27 includes a first flat die-cutting machine or a first circular die-cutting machine (i.e., attached) for flat-pressing and die-cutting one of the chip binding points 15, the redundant antennas on both sides of the antenna layer, or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer. Fig.15 and attached Fig.16 8), and a second flat die cutting machine for flat die cutting another chip binding point 15 and the chip binding positioning point 14 or a second circular knife die cutting machine for circular knife die cutting (i.e., attached Fig.15 and attached Fig.16The input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the second exposure device 33, the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste winding mechanism 26 and the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism 10. At this time, the other process steps are the same as the processing steps in Example 4, and will not be repeated here. When the first concave mold printing seat 28 is included, refer to Fig.15 , when including the second concave die printing seat 29 and the third concave die printing seat 30, see Fig.16 ; Of course, in the present solution, the first flat-bed die-cutting machine for flat-bed die-cutting one of the chip binding points 15, the redundant antennas on both sides of the antenna layer, or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer, or the first circular knife die-cutting machine for circular knife die-cutting, and the second flat-bed die-cutting machine for flat-bed die-cutting another chip binding point 15 and the chip binding positioning point 14, or the second circular knife die-cutting machine for circular knife die-cutting can also be interchanged without affecting product processing.

[0153] Alternatively, the first die-cutting mechanism 27 includes a first flat die-cutting machine for flat die-cutting one of the chip binding points 15 or a first circular knife die-cutting machine for circular knife die-cutting (i.e., attached Fig.17 and attached Fig.18 8), and a second flat die-cutting machine for flat-pressing and die-cutting another chip binding point 15 and the chip binding positioning point 14, and simultaneously performing flat-pressing and die-cutting on the redundant antennas on both sides of the antenna layer or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer, or a second circular knife die-cutting machine for performing circular knife die-cutting (i.e., attached Fig.17 and attached Fig.18 The marking number 9), the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the second exposure device 33, the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste winding mechanism 26 and the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism 10, at this time, the other process steps are the same as the processing steps in Example 4, and will not be repeated here. When the first concave mold printing seat 28 is included, refer to Fig.17 , when including the second concave die printing seat 29 and the third concave die printing seat 30, see Fig.18; In the present solution, the first flat-bed die-cutting machine for flat-bed die-cutting one of the chip binding points 15 or the first circular knife die-cutting machine for circular knife die-cutting and the second flat-bed die-cutting machine for flat-bed die-cutting another chip binding point 15 and the chip binding positioning point 14, and simultaneously the redundant antennas on both sides of the antenna layer or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer or the second circular knife die-cutting machine for circular knife die-cutting can be interchanged without affecting the processing of the product.

[0154] An alternative solution is that the first die-cutting mechanism 27 is divided into a flat die-cutting machine or a circular knife die-cutting machine 8 for flat die-cutting one of the chip binding points 15, and a flat die-cutting machine or a circular knife die-cutting machine 9 for flat die-cutting another chip binding point 15 and the chip binding positioning point 14. In this case, the output port of the second exposure device 33 corresponds to the input port of the flat die-cutting machine or the circular knife die-cutting machine 8 for flat die-cutting one of the chip binding points 15. The flat die-cutting machine for flat die-cutting one of the chip binding points 15 is used to perform flat die-cutting. The output port of the circular knife die-cutting machine 8 for performing circular knife die-cutting corresponds to the input port of the flat die-cutting machine or the circular knife die-cutting machine 9 for performing flat die-cutting on another chip binding point 15 and the chip binding positioning point 14, and the output port of the flat die-cutting machine or the circular knife die-cutting machine 9 for performing flat die-cutting on another chip binding point 15 and the chip binding positioning point 14 corresponds to the input port of the second die-cutting mechanism 10. At this time, the second waste winding mechanism 26 is not included. The other process steps are the same as the processing steps in Example 3, and will not be repeated here. When the first concave mold printing seat 28 is included, refer to Fig.13 , when including the second concave die printing seat 29 and the third concave die printing seat 30, see Fig.14 Of course, the positions of the flat-pressing die-cutting machine or the circular knife die-cutting machine 8 for performing flat-pressing die-cutting on one of the chip binding points 15 in this solution and the flat-pressing die-cutting machine or the circular knife die-cutting machine 9 for performing flat-pressing die-cutting on another chip binding point 15 and the chip binding positioning point 14 can also be interchanged without affecting the processing of the tag antenna.

[0155] The processing equipment also includes an antenna hole waste collection device 5 for collecting waste antennas generated after punching by the antenna hole processing mechanism 4 or waste antennas and waste first substrate layers generated after punching; the antenna hole waste collection device 5 is located below the antenna hole processing mechanism 4; when the antenna hole processing mechanism 4 punches the antenna hole 16 on the antenna layer or the antenna layer of the composite first substrate layer, it directly penetrates the antenna layer or the antenna layer of the composite first substrate layer through die-cutting, and the waste antennas or waste antennas and waste first substrate layers of the corresponding antenna holes after punching enter or fall into the waste collection device 5 together, and the waste collection device 5 is preferably arranged directly below the bottom of the antenna hole processing mechanism 4.

[0156] The antenna hole processing mechanism 4 punches the antenna hole 16 on the antenna layer by using a flat die cutting process or a circular knife die cutting process.

[0157] The temperature range of the drying mechanism 3 is 40 degrees Celsius to 160 degrees Celsius, which helps to dry the adhesive and facilitates the punching operation of the antenna hole 16 of the antenna layer.

[0158] During the process of compounding the antenna layer after the antenna hole 16 is punched or the antenna layer compounded with the first substrate layer with the second substrate layer unrolled by the second unwinding mechanism 7 through the compounding mechanism 6, the heating drum of the compounding mechanism 6 synchronously heats the adhesive on the antenna layer, and the second substrate layer is compounded with the antenna layer or the second substrate layer is compounded with the antenna layer compounded with the first substrate layer using a glue stick.

[0159] The first concave die printing seat 28 or the third concave die printing seat 30 contains a diluent solvent in the adhesive 19 coated on the antenna layer or the first substrate layer. The diluent solvent can dilute the adhesive 19 coated by the first concave die printing seat 28 or the third concave die printing seat 30 to adapt to the needs of full die-cutting ultra-high frequency electronic tag antenna processing.

[0160] Of course, according to actual needs, the first die-cutting mechanism 27 can perform two or more flat die-cutting and / or circular die-cutting on the antenna of the antenna layer or the antenna of the antenna layer combined with the first substrate layer and the first substrate layer to form the chip binding point 15 and the chip binding positioning point 14. Although the operation is more complicated and the steps are more numerous, it can improve the processing accuracy and improve the product quality.

[0161] Specific embodiment 6, embodiment 5 provides a composite and multi-station printing full die-cutting UHF label antenna processing equipment, and the difference between embodiment 5 and the above embodiments is that: the first die-cutting mechanism performs one-time flat press die-cutting and / or circular knife die-cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer and the first substrate layer to form the chip binding point 15 and the chip binding positioning point 14. The chip binding point 15 and the chip binding positioning point 14 are die-cut and formed in one time, with higher precision and higher processing efficiency.

[0162] Specific embodiment 7, embodiment 6 provides a composite and multi-station printing and full die-cutting UHF label antenna processing equipment. The difference between embodiment 6 and the above embodiments is that the first die-cutting mechanism 27 for die-cutting the chip binding positioning point 14 and the chip binding point 15 and the second die-cutting mechanism 10 for die-cutting the edges around the antenna body 17 are combined into a flat die-cutting machine or a circular knife die-cutting machine.

[0163] That is to say, the first die-cutting mechanism 27 and the second die-cutting mechanism 10 are combined into a flat die-cutting machine or a circular knife die-cutting machine, which can complete the flat die-cutting and / or circular knife die-cutting of the chip binding points 15 and the chip binding positioning points 14 at one time, and perform flat die-cutting and / or circular knife die-cutting on the edges of the antenna body 17 of the antenna layer to form the outer contour of the antenna body 17. For example, if all flat die-cutting machines are replaced by circular knife die-cutting machines, it is a similar operation to perform one-time flat die-cutting on the antenna layer to form the chip binding points 15, the chip binding positioning points 14 and the outer contour of the antenna body 17. That is to say, the die-cutting tool of the flat die-cutting machine forms the outer contours of the chip binding points 15, the chip binding positioning points 14 and the antenna body 17 on the antenna layer. The three are die-cut and formed at one time. For example, the thickness of the die-cutting tool blade is controlled so that the die-cutting tool can form a tool mold according to the shape requirements of the outer contour of the chip binding point 15, the chip binding positioning point 14 and the antenna body 17, thereby achieving the purpose of one-time die-cutting and forming the outer contour of the chip binding point 15, the chip binding positioning point 14 and the antenna body 17. For example, the adjacent blades are parallel or the blades have a certain inclination angle to realize the die-cutting of the outer contour of the chip binding point 15, the chip binding positioning point 14 and the antenna body 17, which is particularly suitable for situations where the distance between the chip binding point 15 and the chip binding positioning point 14 and / or between adjacent chip binding points 15 and / or between adjacent chip binding positioning points 14 is small.

[0164] At this time, the antenna layer of the composite second substrate layer or the antenna layer of the composite second substrate layer and the first substrate layer in step 6 enters the input port of a flat die-cutting machine or a circular knife die-cutting machine which is combined by the first die-cutting mechanism and the second die-cutting mechanism 10, and then the antenna layer of the composite second substrate layer or the antenna layer of the composite first substrate layer and the second substrate layer which has been processed by flat die-cutting and / or circular knife die-cutting is outputted from the output port of the flat die-cutting machine or the circular knife die-cutting machine to the input port of the first waste discharge and reeling mechanism 11 and the input port of the first traction device 24, wherein the waste antenna and waste first substrate layer which have been processed by flat die-cutting and / or circular knife die-cutting are discharged and reeled by the first waste discharge and reeling mechanism 11, and the second waste discharge and reeling mechanism 26 does not exist at this time. In this embodiment 6, the processing efficiency is higher, and the outer contours of the chip binding point 15, the chip binding positioning point 14 and the antenna body 17 are die-cut and formed at one time, with higher precision.

[0165] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A composite and multi-station printing and full die-cutting UHF tag antenna processing equipment, involving an UHF tag antenna having an antenna body (17) provided with a chip binding positioning point (14) formed by die-cutting and a chip binding point (15) formed by die-cutting; a second substrate layer or a first substrate layer and a second substrate layer are also adhered to one side of the antenna layer of the antenna body (17), characterized in that: The composite and multi-station printing and full die-cutting UHF tag antenna processing equipment comprises a die-cutting mechanism for die-cutting a chip binding positioning point (14), a chip binding point (15) and the surrounding edges of the UHF tag antenna, and a printing mechanism for applying an adhesive on one side of the antenna layer to be processed or on the side of the first substrate layer to which the antenna layer is not attached according to the shape of the antenna body; The printing mechanism comprises a first concave mold printing seat (28) for applying a colored adhesive according to the shape of the antenna body on one side of the antenna layer to be processed or on the side of the first substrate layer to which the antenna layer is not attached, and for simultaneously printing a first positioning mark (36) near the adhesive block (38) coated according to the shape of the antenna body; Or the printing mechanism comprises a second concave mold printing seat (29) for printing a first positioning mark (36) and a marking block using ink on one side of the antenna layer to be processed or on the side of the first substrate layer to which the antenna layer is not attached, a first exposure device (32) for exposing the first positioning mark (36) and the marking block so that the first positioning mark (36) and the marking block composed of ink are quickly exposed to dry, and a third concave mold printing seat (30) for applying an adhesive according to the shape of the antenna body on the side of the antenna layer to be processed or on the side of the first substrate layer to which the antenna layer is not attached according to the marking block; The gap formed between the chip binding points (15) communicates with the antenna hole (16) and the outside of the antenna; The die-cutting mechanism comprises a first die-cutting mechanism (27) for die-cutting the chip binding positioning point (14) and the chip binding point (15) of the UHF tag antenna, and a second die-cutting mechanism (10) for die-cutting the surrounding edges of the UHF tag antenna; The composite and multi-station printing and full die-cutting UHF label antenna processing equipment also includes an antenna hole processing mechanism (4) for die-cutting an antenna hole (16) of the UHF label antenna, a compounding mechanism (6) for compounding the second substrate layer and the antenna layer or compounding the second substrate layer and the first substrate layer to which the antenna layer has been attached, a first row of waste rewinding mechanisms (11) for rolling up waste antennas processed by the first die-cutting mechanism (27) and the second die-cutting mechanism (10) or rolling up waste antennas and waste first substrate layers processed by the first die-cutting mechanism (27) and the second die-cutting mechanism (10), and a third unwinding mechanism (12) for unwinding an isolation layer on the antenna layer or on the second substrate layer; The input port of the first concave die printing seat (28) inputs the antenna layer to be processed or the antenna layer to which the first substrate layer has been attached, the output port of the first concave die printing seat (28) corresponds to the input port of the antenna hole processing mechanism (4), the output port of the antenna hole processing mechanism (4) corresponds to the input port of the compound mechanism (6), the output port of the compound mechanism (6) corresponds to the input port of the first die-cutting mechanism (27), the output port of the first die-cutting mechanism (27) corresponds to the input port of the second die-cutting mechanism (10), and the output port of the second die-cutting mechanism (10) corresponds to the input port of the first row of waste winding mechanism (11) and the output port of the third unwinding mechanism (12); or the input port of the first concave die printing seat (28) inputs the antenna layer to be processed or the antenna layer to which the first substrate layer has been attached, the output port of the first concave die printing seat (28) corresponds to the input port of the antenna hole processing mechanism (4), the output port of the antenna hole processing mechanism (4) corresponds to the input port of the compound mechanism (6), the output port of the compound mechanism (6) corresponds to the input port of the second die-cutting mechanism (10), the output port of the second die-cutting mechanism (10) corresponds to the input port of the first die-cutting mechanism (27), and the output port of the first die-cutting mechanism (27) corresponds to the input port of the first row of waste winding mechanism (11) and the output port of the third unwinding mechanism (12); or the input port of the second concave die printing seat (29) inputs the antenna layer to be processed or the antenna layer to which the first substrate layer has been attached, the output port of the second concave die printing seat (29) corresponds to the input port of the first exposure device (32), the output port of the first exposure device (32) corresponds to the input port of the third concave die printing seat (30), the output port of the third concave die printing seat (30) corresponds to the input port of the antenna hole processing mechanism (4), the output port of the antenna hole processing mechanism (4) corresponds to the input port of the composite mechanism (6), the output port of the composite mechanism (6) corresponds to the input port of the first die-cutting mechanism (27), the output port of the first die-cutting mechanism (27) corresponds to the input port of the second die-cutting mechanism (10), and the output port of the second die-cutting mechanism (10) corresponds to the input port of the first row of waste winding mechanism (11) and the output port of the third unwinding mechanism (12); or the input port of the second concave die printing seat (29) inputs the antenna layer to be processed or the antenna layer to which the first substrate layer has been attached, the output port of the second concave die printing seat (29) corresponds to the input port of the first exposure device (32), the output port of the first exposure device (32) corresponds to the input port of the third concave die printing seat (30), the output port of the third concave die printing seat (30) corresponds to the input port of the antenna hole processing mechanism (4), the output port of the antenna hole processing mechanism (4) corresponds to the input port of the composite mechanism (6), the output port of the composite mechanism (6) corresponds to the input port of the second die-cutting mechanism (10), the output port of the second die-cutting mechanism (10) corresponds to the input port of the first die-cutting mechanism (27), and the output port of the first die-cutting mechanism (27) corresponds to the input port of the first row of waste winding mechanism (11) and the output port of the third unwinding mechanism (12); The composite and multi-station printing and full die-cutting UHF label antenna processing equipment also includes a first deflection correction device (34), which is located before the printing mechanism, that is, the input port of the first deflection correction device (34) inputs the antenna layer to be processed or the antenna layer to which the first substrate layer has been attached, and the output port of the first deflection correction device (34) corresponds to the input port of the first concave die printing seat (28) or the input port of the second concave die printing seat (29); The composite and multi-station printing and full-die-cutting UHF label antenna processing equipment also includes a fourth convex mold printing seat (31) for printing a second positioning mark (37) on the antenna layer and / or the second substrate layer using ink, and a second exposure device (33) for exposing the second positioning mark (37) so that the second positioning mark (37) composed of ink is quickly exposed and dried, wherein the second positioning mark (37) is used for chip positioning during chip installation and / or binding; The output port of the composite mechanism corresponds to the input port of the fourth convex mold printing seat (31), the output port of the fourth convex mold printing seat (31) corresponds to the input port of the second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of the first die-cutting mechanism (27), the output port of the first die-cutting mechanism (27) corresponds to the input port of the second die-cutting mechanism, and the output port of the second die-cutting mechanism (10) corresponds to the input port of the first row waste winding mechanism (11) and the output port of the third unwinding mechanism (12); Or the output port of the composite mechanism corresponds to the input port of the fourth convex mold printing seat (31), the output port of the fourth convex mold printing seat (31) corresponds to the input port of the second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of the second die-cutting mechanism (10), the output port of the second die-cutting mechanism (10) corresponds to the input port of the first die-cutting mechanism (27), and the output port of the first die-cutting mechanism (27) corresponds to the input port of the first row waste winding mechanism (11) and the output port of the third unwinding mechanism (12); The first die-cutting mechanism (27) is composed of a flat-press die-cutting mechanism, which is a flat-press die-cutting machine comprising at least one die-cutting tool for flat-pressing and die-cutting the chip binding positioning point (14) and the chip binding point (15); Or the first die-cutting mechanism (27) is composed of a circular knife die-cutting mechanism, and the circular knife die-cutting mechanism is a circular knife die-cutting machine including at least one rolling cutting tool for circular knife die-cutting the chip binding positioning point (14) and the chip binding point (15); Or the first die-cutting mechanism (27) is a hybrid die-cutting mechanism composed of a flat die-cutting mechanism and a circular knife die-cutting mechanism, and the hybrid die-cutting mechanism is a hybrid die-cutting machine comprising at least one die-cutting tool for flat die-cutting a chip binding positioning point (14) or a chip binding point (15) and at least one rolling tool for circular knife die-cutting a chip binding point (15) or a chip binding positioning point (14); The second die-cutting mechanism (10) is a flat die-cutting machine for flat die-cutting the edges of the antenna body (17) or a circular die-cutting machine for circular die-cutting the edges of the antenna body (17). The antenna hole processing mechanism (4) is a flat die-cutting machine for flat die-cutting the antenna hole (16), or a circular knife die-cutting machine for circular knife die-cutting the antenna hole (16); A first die-cutting mechanism (27) for die-cutting the chip binding positioning point (14) and the chip binding point (15) and a second die-cutting mechanism (10) for die-cutting the peripheral edges of the antenna body (17) are combined into a flat die-cutting machine or a circular knife die-cutting machine; The composite and multi-station printing and full die-cutting UHF label antenna processing equipment also includes a first unwinding mechanism (1) for unwinding the antenna layer to be processed or the antenna layer to be processed composited with the first substrate layer, a drying mechanism (3) for drying the antenna layer after the adhesive has been applied according to the shape of the antenna body or a drying mechanism (3) for drying the antenna layer composited with the first substrate layer after the adhesive has been applied according to the shape of the antenna body, a second deviation correcting device (25), a first traction device (23), a second traction device (24), a second unwinding mechanism (7) for unwinding the second substrate layer, and a finished product rewinding mechanism (13) for rewinding the processed antenna layer together with the second substrate layer and the isolation layer or rewinding the processed antenna layer together with the first substrate layer and the second substrate layer and the isolation layer; The output port of the first unwinding mechanism (1) corresponds to the input port of the first deflection correcting device (34), the output port of the first concave die printing seat (28) or the output port of the third concave die printing seat (30) corresponds to the input port of the drying mechanism (3), the output port of the drying mechanism (3) corresponds to the input port of the second deflection correcting device (25), the output port of the second deflection correcting device (25) corresponds to the input port of the first traction device (23), the output port of the first traction device (23) corresponds to the input port of the antenna hole processing mechanism (4), the output port of the antenna hole processing mechanism (4) corresponds to the input port of the composite mechanism (6), and the output port of the second unwinding mechanism (7) corresponds to the input port of the composite mechanism (6), and the composite mechanism (6) ) corresponds to the input port of the fourth convex mold printing seat (31), the output port of the fourth convex mold printing seat (31) corresponds to the input port of the second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of the first die-cutting mechanism (27), the output port of the first die-cutting mechanism (27) corresponds to the input port of the second die-cutting mechanism (10), the output port of the second die-cutting mechanism (10) corresponds to the input port of the first waste winding mechanism (11) and the input port of the second traction device (24), and the output port of the third unwinding mechanism (12) corresponds to the input port of the second traction device (24), and the output port of the second traction device (24) corresponds to the input port of the finished product winding mechanism (13); Or the output port of the first unwinding mechanism (1) corresponds to the input port of the first deviation correcting device (34), the output port of the first concave die printing seat (28) or the output port of the third concave die printing seat (30) corresponds to the input port of the drying mechanism (3), the output port of the drying mechanism (3) corresponds to the input port of the second deviation correcting device (25), the output port of the second deviation correcting device (25) corresponds to the input port of the first traction device (23), the output port of the first traction device (23) corresponds to the input port of the antenna hole processing mechanism (4), the output port of the antenna hole processing mechanism (4) corresponds to the input port of the composite mechanism (6), and the output port of the second unwinding mechanism (7) corresponds to the input port of the composite mechanism (6), and the composite mechanism (6) ) corresponds to the input port of the fourth convex mold printing seat (31), the output port of the fourth convex mold printing seat (31) corresponds to the input port of the second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of the second die-cutting mechanism (10), the output port of the second die-cutting mechanism (10) corresponds to the input port of the first die-cutting mechanism (27), the output port of the first die-cutting mechanism (27) corresponds to the input port of the first row waste winding mechanism (11) and the input port of the second traction device (24), and the output port of the third unwinding mechanism (12) corresponds to the input port of the second traction device (24), and the output port of the second traction device (24) corresponds to the input port of the finished product winding mechanism (13).

2. According to claim 1, a composite and multi-station printing and full die-cutting UHF label antenna processing equipment is characterized by: There are two chip binding points (15), and the first die-cutting mechanism (27) is divided into a flat die-cutting machine for flat-pressing die-cutting or a circular knife die-cutting machine (8) for circular knife die-cutting on one of the chip binding points (15), and a flat die-cutting machine for flat-pressing die-cutting or a circular knife die-cutting machine (9) for circular knife die-cutting on the other chip binding point (15) and the chip binding positioning point (14); The output port of the composite mechanism (6) corresponds to the input port of the fourth convex mold printing seat (31), the output port of the fourth convex mold printing seat (31) corresponds to the input port of the second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of a flat die-cutting machine or a circular knife die-cutting machine (8) for flat die-cutting one of the chip binding points (15), and the flat die-cutting machine or the circular knife die-cutting machine (8) for flat die-cutting one of the chip binding points (15) The output port of the circular knife die-cutting machine (8) for performing circular knife die-cutting corresponds to the input port of the flat die-cutting machine for performing flat die-cutting on another chip binding point (15) and a chip binding positioning point (14) or the circular knife die-cutting machine (9) for performing circular knife die-cutting, and the output port of the flat die-cutting machine for performing flat die-cutting on another chip binding point (15) and a chip binding positioning point (14) or the circular knife die-cutting machine (9) for performing circular knife die-cutting corresponds to the input port of the second die-cutting mechanism (10); Or the output port of the composite mechanism (6) corresponds to the input port of the fourth convex mold printing seat (31), the output port of the fourth convex mold printing seat (31) corresponds to the input port of the second exposure device (33), the output port of the second exposure device (33) corresponds to the input port of a flat die-cutting machine or a circular knife die-cutting machine (9) for performing flat die-cutting on another chip binding point (15) and a chip binding positioning point (14), and the input port of the flat die-cutting machine (9) for performing circular knife die-cutting on another chip binding point (15) and a chip binding positioning point (14) The output port of the flat die-cutting machine or the circular knife die-cutting machine (9) for flat die-cutting the chip binding positioning point (14) corresponds to the input port of the flat die-cutting machine or the circular knife die-cutting machine (8) for flat die-cutting one of the chip binding points (15), and the output port of the flat die-cutting machine or the circular knife die-cutting machine (8) for flat die-cutting one of the chip binding points (15) corresponds to the input port of the second die-cutting mechanism (10).

3. According to claim 2, a composite and multi-station printing and full die-cutting UHF label antenna processing equipment is characterized by: The processing equipment also includes a second row of waste winding mechanism (26); The first die-cutting mechanism (27) comprises a first flat die-cutting machine or a first circular knife die-cutting machine for performing flat die-cutting on one of the chip binding points (15), and simultaneously performing flat die-cutting on the redundant antennas on both sides of the antenna layer, or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer, and a second flat die-cutting machine or a second circular knife die-cutting machine for performing flat die-cutting on the other chip binding point (15) and the chip binding positioning point (14); the input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the second exposure device (33), the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste row winding mechanism (26) and the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism (10); Or the first die-cutting mechanism (27) comprises a first flat die-cutting machine or a first circular knife die-cutting machine for performing flat die-cutting on one of the chip binding points (15), and simultaneously performing flat die-cutting on the redundant antennas on both sides of the antenna layer, or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer, and a second flat die-cutting machine or a second circular knife die-cutting machine for performing flat die-cutting on another chip binding point (15) and the chip binding positioning point (14); the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the second exposure device (33), the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second waste row winding mechanism (26) and the input port of the second die-cutting mechanism (10); Or the first die-cutting mechanism (27) comprises a first flat die-cutting machine or a first circular knife die-cutting machine for performing flat die-cutting on one of the chip binding points (15) and a second flat die-cutting machine or a second circular knife die-cutting machine for performing circular die-cutting on another chip binding point (15) and the chip binding positioning point (14), and simultaneously performing flat die-cutting on the redundant antennas on both sides of the antenna layer or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer, wherein the input port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the output port of the second exposure device (33), the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second flat die-cutting machine or the second circular knife die-cutting machine, and the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste row winding mechanism (26) and the input port of the second die-cutting mechanism (10); Or the first die-cutting mechanism (27) comprises a first flat die-cutting machine or a first circular knife die-cutting machine for performing flat die-cutting on one of the chip binding points (15) and a second flat die-cutting machine or a second circular knife die-cutting machine for performing circular die-cutting on another chip binding point (15) and the chip binding positioning point (14), and simultaneously performing flat die-cutting on the redundant antennas on both sides of the antenna layer or the first substrate layer and the redundant antennas on both sides of the antenna layer and the redundant first substrate layer, wherein the input port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the output port of the second exposure device (33), the output port of the second flat die-cutting machine or the second circular knife die-cutting machine corresponds to the input port of the second waste row winding mechanism (26) and the input port of the first flat die-cutting machine or the first circular knife die-cutting machine, and the output port of the first flat die-cutting machine or the first circular knife die-cutting machine corresponds to the input port of the second die-cutting mechanism (10).

4. According to claim 3, a composite and multi-station printing and full die-cutting UHF label antenna processing equipment is characterized by: The processing equipment also includes a waste collection device (5) for collecting waste antennas generated after being punched by the antenna hole processing mechanism (4) or waste antennas generated after being punched and waste antenna holes (16) of the first substrate layer; the antenna hole (16) waste collection device (5) is located below the antenna hole processing mechanism (4); the composite mechanism (6) is also provided with a heating drum for heating the adhesive; the composite mechanism (6) includes a rubber roller for composite the second substrate layer with the antenna layer or a rubber roller for composite the second substrate layer with the antenna layer of the composite first substrate layer.

5. A composite and multi-station printing and full die-cutting UHF label antenna processing method, which relates to a composite and multi-station printing and full die-cutting UHF label antenna processing equipment as claimed in any one of claims 1 to 4, characterized in that: The processing method comprises the steps of applying adhesive on one side of the antenna layer to be processed or on the side of the first substrate layer to which the antenna layer is not attached according to the shape of the antenna body by using a printing mechanism, and the steps of die-cutting the chip binding positioning point (14), the chip binding point (15) and the surrounding edges of the UHF tag antenna by using a die-cutting mechanism; The production steps are as follows: Step 1: The first unwinding mechanism (1) unwinds the antenna layer to be processed or the antenna layer of the composite first substrate layer to the first concave mold printing seat (28), and the first concave mold printing seat (28) applies a colored adhesive on one side of the antenna layer to be processed or the side of the antenna layer of the composite first substrate layer where the antenna layer is not bonded according to the shape of the antenna body, and simultaneously prints a first positioning mark (36) near the adhesive block (38) coated according to the shape of the antenna body, and then the first concave mold printing seat (28) sends the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer to the drying mechanism (3), and the drying mechanism (3) is used to dry the antenna layer coated with the adhesive or the antenna layer of the composite first substrate layer; Or the first unwinding mechanism (1) unwinds the antenna layer to be processed or the antenna layer composited with the first substrate layer to the second concave mold printing seat (29), and the second concave mold printing seat (29) uses ink to print the first positioning mark (36) and the marking block on one side of the antenna layer to be processed or the side of the first substrate layer not pasted with the antenna layer, and then the first exposure device (32) exposes the first positioning mark (36) and the marking block so that the first positioning mark (36) and the marking block composed of ink are quickly exposed to the sun, and then the third concave mold printing seat (30) applies adhesive on the side of the antenna layer to be processed or the side of the first substrate layer not pasted with the antenna layer according to the shape of the antenna body, and the third concave mold printing seat (30) sends the antenna layer coated with the adhesive or the antenna layer composited with the first substrate layer to the drying mechanism (3), and the drying mechanism (3) is used to dry the antenna layer coated with the adhesive or the antenna layer composited with the first substrate layer; Step 2: sending the dried antenna layer or the antenna layer combined with the first substrate layer to the deflection correction device (25), using the second deflection correction device (25) to perform reference positioning on the dried antenna layer or the antenna layer combined with the first substrate layer, and correcting and / or calibrating its transfer direction; Step 3: the antenna layer or the antenna layer of the composite first substrate layer that has been corrected by the second correcting device (25) is sent to the first traction device (23), and the first traction device (23) is used to help the antenna layer or the antenna layer of the composite first substrate layer to be conveyed; the first traction device (23) and the second traction device (24) work together to control the transmission speed of the antenna layer or the antenna layer of the composite first substrate layer, so that the tension of the antenna layer or the antenna layer of the composite first substrate layer during the transmission process is stable and each die-cutting position is accurate; Step 4: The antenna layer or the antenna layer combined with the first substrate layer that has passed through the first traction device (23) is sent to the antenna hole processing mechanism (4) to punch the antenna hole (16); the antenna hole processing mechanism (4) punches the antenna hole (16) on the antenna layer or the antenna layer combined with the first substrate layer; Step 5: the antenna layer after the antenna hole (16) is punched or the antenna layer of the composite first substrate layer after the antenna hole (16) is punched is composited with the second substrate layer of the second unwinding mechanism (7) via the composite mechanism (6), that is, the second substrate layer is bonded to the antenna layer or the first substrate layer via an adhesive; Step 6: After the antenna layer is compounded with the second substrate layer, the antenna of the antenna layer is first subjected to flat die cutting and / or circular die cutting by a first die cutting mechanism (27) to form a chip binding point (15) and a chip binding positioning point (14), and then the antenna body (17) of the antenna layer is subjected to flat die cutting and / or circular die cutting by a second die cutting mechanism (10) to form the outer contour of the antenna body (17), and then a preliminarily formed antenna body (17) and a remaining waste antenna are formed on the second substrate layer, and the remaining waste antenna is rolled up and discharged by a first waste discharge and reeling mechanism (11); or the antenna layer after the second substrate layer and the first substrate layer are composited is firstly subjected to a first die-cutting mechanism (27) to simultaneously perform flat die-cutting and / or circular knife die-cutting on the first substrate layer and the antenna of the antenna layer to form a chip binding point (15) and a chip binding positioning point (14), and then the antenna and the first substrate layer are simultaneously subjected to a second die-cutting mechanism (10) to simultaneously perform die-cutting and / or roller cutting on the antenna at the edges of the antenna body (17) of the composite first substrate layer and the first substrate layer to form the outer contour of the antenna body (17), and then a preliminarily formed antenna body (17) of the composite first substrate layer, as well as a remaining waste antenna and a corresponding remaining waste first substrate layer are formed on the second substrate layer, and the remaining waste antenna and the corresponding remaining waste first substrate layer are rolled up and discharged by a first waste discharging and winding mechanism (11); or the antenna layer after being composited with the second substrate layer, firstly performing flat pressing die cutting and / or circular knife die cutting on the antenna at the edges of the antenna body (17) of the antenna layer by the second die cutting mechanism (10) to form the outer contour of the antenna body (17), then performing flat pressing die cutting and / or circular knife die cutting on the antenna of the antenna layer by the first die cutting mechanism (27) to form the chip binding point (15) and the chip binding positioning point (14), then forming the initially formed antenna body (17) and the remaining waste antenna on the second substrate layer, and then rolling up the remaining waste antenna for waste discharge by the first waste discharge and reeling mechanism (11); or an antenna layer of a composite second substrate layer and a first substrate layer, wherein the antenna and the first substrate layer corresponding to the edges of the antenna body (17) of the antenna layer are simultaneously subjected to flat pressing die cutting and / or circular knife die cutting by a second die-cutting mechanism (10) to form the outer contour of the antenna body (17), and then the antenna and the first substrate layer of the antenna layer are simultaneously subjected to flat pressing die cutting and / or circular knife die cutting by a first die-cutting mechanism (27) to form a chip binding point (15) and a chip binding positioning point (14), and then a preliminarily formed antenna body (17) of the composite first substrate layer, as well as a residual waste antenna and a corresponding residual waste first substrate layer are formed on the second substrate layer, and the residual waste antenna and the corresponding residual waste first substrate layer are rolled up and discharged by a first waste discharging and winding mechanism (11); Or the antenna layer after the second substrate layer is composited, or the antenna layer after the second substrate layer and the first substrate layer are composited, firstly passes through the first flat die-cutting machine or the first circular knife die-cutting machine of the first die-cutting mechanism (27) to perform flat die-cutting or circular knife die-cutting on one of the chip binding points (15), and at the same time, the redundant antennas on both sides of the antenna layer, or the first substrate layer and the redundant antennas on both sides of the antenna layer, and the redundant first substrate layer, to form residual antenna waste on both sides, or residual antenna waste on both sides and the first substrate waste, and the second waste discharge and reeling mechanism (26) is used to reel and discharge the residual antenna waste on both sides, or the residual antenna waste on both sides and the first substrate waste, and then the second flat die-cutting machine or the second circular knife die-cutting machine of the first die-cutting mechanism (27) is used to perform flat die-cutting or circular knife die-cutting on the other chip binding point (15), and at the same time, the redundant antennas on both sides of the antenna layer, or the first substrate layer and the redundant antennas on both sides of the antenna layer, and the redundant first substrate layer, to form residual antenna waste on both sides, or residual antenna waste on both sides and the first substrate waste, and then the second flat die-cutting machine or the second circular knife die-cutting machine of the first die-cutting mechanism (27) is used to perform flat die-cutting or circular knife die-cutting on the other chip binding point (15), and at the same time, the redundant antennas on both sides of the antenna layer, or the redundant antennas on both sides of the first substrate layer, and the redundant antennas on both sides of the antenna layer, and the redundant first substrate layer, and then the redundant antenna waste on both sides of the antenna layer, or the redundant antenna waste on both sides of the antenna layer, and the redundant first substrate layer, and then the redundant antenna waste on both sides of the antenna layer, or the redundant antenna waste on both sides of the antenna layer, and the redundant antenna waste on both sides of the antenna layer, and the redundant antenna waste on A chip binding point (15) and a chip binding positioning point (14) are subjected to flat pressing die cutting or circular knife die cutting to form the chip binding point (15) and the chip binding positioning point (14), and then the antennas at the edges of the antenna body (17) of the antenna layer or the antennas corresponding to the edges of the antenna body (17) of the antenna layer and the first substrate layer are subjected to flat pressing die cutting and / or circular knife die cutting to form the outer contour of the antenna body (17) by a second die cutting mechanism (10); the remaining antenna waste or the remaining antenna waste and the first substrate waste after the outer contour of the chip binding point (15), the chip binding positioning point (14) and the antenna body (17) are processed are rolled up and discharged by a first waste discharge and reeling mechanism (11); Or the antenna layer after the second substrate layer is composited, or the antenna layer after the second substrate layer and the first substrate layer are composited, firstly passes through the first flat die-cutting machine or the first circular knife die-cutting machine of the first die-cutting mechanism (27) to perform flat die-cutting or circular knife die-cutting on one of the chip binding points (15), and then the second flat die-cutting machine or the second circular knife die-cutting machine of the first die-cutting mechanism (27) performs flat die-cutting or circular knife die-cutting on another chip binding point (15) and the chip binding positioning point (14), and at the same time, the redundant antennas on both sides of the antenna layer or the redundant first substrate layer and the redundant antennas on both sides of the antenna layer and the first substrate layer to form the chip binding point (15), the chip binding positioning point (14), and the residual antenna waste on both sides or The antenna waste and the first substrate waste remaining on both sides are rolled up and discharged by the second waste discharge and reeling mechanism (26), and then the antennas on the edges of the antenna body (17) of the antenna layer or the antennas and the first substrate layer corresponding to the edges of the antenna body (17) of the antenna layer are simultaneously flat-pressed and / or circularly cut by the second die-cutting mechanism (10) to form the outer contour of the antenna body (17). The remaining antenna waste or the remaining antenna waste and the first substrate waste after the chip binding point (15), the chip binding positioning point (14) and the outer contour of the antenna body (17) are processed are rolled up and discharged by the first waste discharge and reeling mechanism (11); Step seven: after the first waste discharge reeling mechanism (11) reels up the waste, the third unwinding mechanism (12) unwinds the isolation layer so that the isolation layer covers the antenna of the initially formed antenna body (17) or the first substrate layer; Step eight: the antenna body (17) covered with the isolation layer is sent to the second traction device (24), and the antenna body (17) covered with the isolation layer is sent to the finished product reeling mechanism (13) with the help of the second traction device (24), and the finished product reeling mechanism (13) reels the antenna body (17) to form a die-cut UHF electronic tag antenna finished product; In step one, a first deflection correction process of a first deflection correction device (34) is added between the first unwinding mechanism and the first concave die printing seat (28) or between the first unwinding mechanism and the second concave die printing seat (29), that is, the antenna layer or the antenna layer of the composite first substrate layer unwound by the first unwinding mechanism is first passed through the first deflection correction device (34) for reference positioning, correction and / or calibration of its transfer direction, and then the first deflection correction device (34) delivers it to the input port of the first concave die printing seat (28) or the input port of the second concave die printing seat (29).

6. According to the composite and multi-station printing and full die-cutting UHF label antenna processing method described in claim 5, it is characterized by: In step six, a printing process of a second positioning mark (37) of a fourth convex printing seat (31) and a second exposure process of a second exposure device (33) are added between the composite mechanism and the first die-cutting mechanism (27), that is, the antenna layer after being composited with the second substrate layer or the antenna layer after being composited with the second substrate layer and the first substrate layer is first sent to the fourth convex printing seat (31), and the fourth convex printing seat (31) prints the second positioning mark (37) on the antenna layer and / or the second substrate layer using ink. The second positioning mark (37) is used for chip positioning during chip installation and / or binding. Then, the second exposure device (33) exposes the second positioning mark (37) so that the second positioning mark (37) composed of ink is quickly exposed to dry, and then the antenna layer printed with the second positioning mark (37) and composited with the second substrate layer or the antenna layer printed with the second positioning mark (37) and composited with the second substrate layer and the first substrate layer is sent to the input port of the first die-cutting mechanism (27).

7. A composite and multi-station printing and full die-cutting UHF label antenna processing method according to claim 6, characterized in that: The antenna hole processing mechanism (4) punches the antenna hole (16) in the antenna layer by using a flat die cutting process or a circular knife die cutting process; In the step 5, the antenna hole processing mechanism (4) performs punching of the antenna hole (16), and the waste antenna generated after the punching or the waste antenna and the waste first substrate layer generated after the punching enter the antenna hole (16) waste collection device (5); In the step 5, during the process of the antenna layer after the antenna hole (16) is punched or the antenna layer composited with the first substrate layer being composited with the second substrate layer unwound by the second unwinding mechanism (7) via the composite mechanism (6), the heating drum of the composite mechanism (6) simultaneously heats the adhesive on the antenna layer, and the second substrate layer is composited with the antenna layer or the second substrate layer is composited with the antenna layer composited with the first substrate layer using a glue stick; The temperature range of the heating drum is 50 degrees Celsius to 200 degrees Celsius; the temperature range of the drying mechanism (3) is 40 degrees Celsius to 160 degrees Celsius; the first concave printing seat (28) or the third concave printing seat (30) is used to coat the adhesive on the antenna layer or the first substrate layer containing a diluent solvent.

8. A composite and multi-station printing and full die-cutting UHF label antenna processing method according to any one of claims 5 to 7, characterized in that: The first die-cutting mechanism performs one-time flat-press die-cutting and / or circular-knife die-cutting on the antenna of the antenna layer or the antenna of the antenna layer composited with the first substrate layer and the first substrate layer to form a chip binding point (15) and a chip binding positioning point (14); Or the first die-cutting mechanism (27) performs flat die-cutting and / or circular die-cutting on the antenna of the antenna layer or the antenna of the antenna layer of the composite first substrate layer and the first substrate layer twice or more to form the chip binding point (15) and the chip binding positioning point (14).

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