A high water -resistant, low -mode volume single -component MS sealing, preparation method and application
A technology of MS sealant and low modulus, applied in the field of sealant, can solve the problems of incomplete degassing, uneven mixing, insufficient waterproof performance of seam sealing, etc., and avoid the complexity of on-site construction management and supporting mechanical equipment , Excellent adhesion and sealing and waterproof performance, excellent adhesion and displacement resistance
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2022-01-14
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of sealants, and relates to a high water resistance and low modulus one-component MS sealant, in particular to a high water resistance and low modulus one-component MS sealant, a preparation method and an application thereof. Background technique
[0002] Prefabricated buildings have the advantages of saving energy, saving materials, shortening the construction period and environmental protection. In the 1960s, prefabricated buildings became popular in the Japanese construction industry. So far, prefabricated buildings have also occupied half of the Japanese construction market. The prefabricated building adopts the method of factory prefabrication and on-site assembly. During the assembly process, there will be a seam with a width of 2 to 3 cm, and the seam needs to be filled with a sealant with excellent performance. Ketone sealant, polyurethane sealant and MS sealant, traditional silicone sealant has high...
Examples
Embodiment 1
[0046] A high water resistance, low modulus one-component MS sealant, comprising the following components by weight:
[0047] Basic MS Resins: Molecular Structure
[0048]
[0049] The number average molecular weight is 10000, 50 parts;
[0050] Plasticizer, isononyl cyclohexane-1,2-dicarboxylate (DINCH), 50 parts;
[0051] Inorganic filler, ground calcium carbonate and talcum powder, 150 parts;
[0052] Thixotropic agent, hydrogenated castor oil, 10 parts;
[0053] Weather resistance agent, salicylate UV absorber, benzophenone UV absorber, 8 parts;
[0054] Catalyst, stannous octoate, two (dodecyl sulfide) dibutyl tin, 1 part;
[0055] MS sealant color masterbatch, composed of titanium dioxide, carbon black and diisodecyl phthalate (DIDP) in a mass ratio of 2:1:7, 3 parts;
[0056] Water-resistant adhesive, 5 parts, wherein, described water-resistant adhesive comprises following component, by molar mass part:
[0057] Trifunctional aminosilane coupling agent, γ-amino...
Embodiment 2
[0061] A high water resistance, low modulus one-component MS sealant, comprising the following components by weight:
[0062] Basic MS resin: the molecular structure is:
[0063]
[0064] The number average molecular weight is 10000-28000, 20 parts;
[0065] Plasticizer, diisodecyl phthalate (DIDP), 20 parts;
[0066] Inorganic filler, light calcium carbonate, silicon micropowder, 50 parts;
[0067] Thixotropic agent, fumed silica, organic bentonite, 3 parts;
[0068] Weather resistance agent, hindered amine light stabilizer, 2 parts;
[0069] Catalyst, dibutyltin diacetate, 0.05 part;
[0070] Color masterbatch for MS sealant, composed of titanium dioxide, carbon black and diisodecyl phthalate (DIDP) at a mass ratio of 2:1:7, 0.5 parts;
[0071] Water-resistant adhesive, 1 part, wherein, the water-resistant adhesive includes the following components, in parts by molar mass:
[0072] Trifunctional aminosilane coupling agent, γ-aminopropyltriethoxysilane, N-β-(aminoeth...
Embodiment 3
[0075] Basic MS resin, 25 parts;
[0076] Plasticizer, diisononyl phthalate (DINP), 25 parts;
[0077] Inorganic filler, nano active calcium carbonate, 50 parts;
[0078] Thixotropic agent, polyamide wax, 5 parts; Weather resistance agent, 2 parts;
[0079] MS sealant color masterbatch, 2 parts;
[0080] Water-resistant adhesive, the water-resistant adhesive of embodiment 1, 2 parts;
[0081] Catalyst, dibutyltin dilaurate, 0.5 parts.
[0082] The preparation method of the high water resistance and low modulus one-component MS sealant described in this embodiment is the same as that in Embodiment 1.