Wafer plating equipment

Abstract

The present invention provides a wafer electroplating device. The wafer electroplating device comprises: a plating liquid tank, the plating liquid tank is provided with a stirring device for stirring the plating liquid; a cover, the cover is connected to the plating liquid tank; a wafer, the wafer is rotatably mounted on the cover; and a first driving mechanism, the first driving mechanism is transmission-connected to the wafer, and is used to drive the wafer to rotate circumferentially. In the wafer electroplating device provided by the present invention, during the electroplating process, the stirring device can stir the plating liquid in the plating liquid tank, and the plating liquid is evenly distributed. The first driving mechanism can drive the wafer to rotate, and the metal ions can be more evenly plated on the wafer surface, avoiding uneven plating of metal ions on the wafer surface due to uneven distribution of potential lines. The device is easy to use and has a good electroplating effect.

Description

Technical Field

[0001] The invention relates to wafer electroplating equipment. Background Art

[0002] Some integrated circuit parts require electroplating during production, and the precision of electroplating is very high. In the prior art wafer electroplating equipment, the electroplating solution and the potential lines are unevenly distributed, and the distribution difference is large, resulting in poor electroplating effect, and metal ions cannot be evenly plated on the wafer surface. Summary of the invention

[0003] The first purpose of the present invention is to overcome the deficiencies in the prior art and provide a wafer electroplating device.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0005] According to a first aspect of the present invention, a wafer electroplating device is provided. The wafer electroplating device comprises:

[0006] An electroplating tank, wherein the electroplating tank is provided with a stirring device for stirring the electroplating solution;

[0007] A cover, the cover is connected to the electroplating tank;

[0008] a wafer rotatably mounted on the cover; and

[0009] A first driving mechanism is drivingly connected to the wafer and is used to drive the wafer to rotate circumferentially.

[0010] Optionally, the cover comprises a wafer holder, and the first drive mechanism comprises a first transmission shaft;

[0011] The wafer is circumferentially fixed on the wafer clamp, and the wafer clamp is circumferentially fixed on the first transmission shaft;

[0012] The first driving mechanism is in driving connection with the first transmission shaft, and is used for driving the first transmission shaft to rotate, thereby driving the wafer clamping mechanism and the wafer to rotate.

[0013] Optionally, the cover further comprises a mounting seat, and the mounting seat can be covered on the electroplating liquid tank; the first driving mechanism is mounted on the mounting seat.

[0014] Optionally, the first driving mechanism includes a first rotating motor, a first driving wheel and a first driven wheel;

[0015] The first output shaft of the first rotating motor is circumferentially fixed on the first driving wheel, and is used to drive the first driving wheel to rotate;

[0016] The first driving wheel drives the first driven wheel to rotate through a transmission belt;

[0017] The first driven wheel is circumferentially fixed on the first transmission shaft, and is used to drive the first transmission shaft to rotate.

[0018] Optionally, a wafer accommodating groove is provided on the wafer clamping member, and the wafer is fixedly mounted in the wafer accommodating groove.

[0019] Optionally, the stirring device comprises:

[0020] a third drive mechanism; and

[0021] A rotatable carrying device; a stirring member is mounted on the rotatable carrying device;

[0022] Wherein, the third driving mechanism is transmission connected to the carrying device.

[0023] Optionally, the stirring member includes a first stirring member, and the first stirring member is rotatably mounted on the carrying device;

[0024] The stirring device further comprises a fourth driving mechanism, and the fourth driving mechanism is drivingly connected to the first stirring member.

[0025] Optionally, the fourth driving mechanism is an internal gear; the internal gear is transmission-connected to the first stirring member via an even number of planetary gears.

[0026] Optionally, the internal gear is meshed with the second planetary gear, and the second planetary gear is meshed with the first planetary gear;

[0027] A first mounting frame is fixedly arranged on the carrying device;

[0028] A rotatable first planetary gear shaft is mounted on the first mounting frame, and the first planetary gear and the first stirring member are mounted on the first planetary gear shaft;

[0029] The first mounting frame is provided with a second planetary gear shaft, and the second planetary gear is rotatably mounted on the second planetary gear shaft.

[0030] Optionally, the stirring member further includes a second stirring member, and the internal gear drives the first stirring member and the second stirring member to rotate respectively.

[0031] Optionally, the internal gear is transmission-connected to the second stirring member via an odd number of planetary gears.

[0032] Optionally, a second mounting frame is fixedly provided on the carrying device;

[0033] A rotatable third planetary gear shaft is mounted on the second mounting frame; the third planetary gear and the second stirring member are mounted on the third planetary gear shaft;

[0034] A fourth planetary gear shaft is mounted on the second mounting frame; the fourth planetary gear is rotatably mounted on the fourth planetary gear shaft;

[0035] The second mounting frame is provided with a fifth planetary gear shaft; the fifth planetary gear is rotatably mounted on the fifth planetary gear shaft.

[0036] Optionally, the carrying device has a hollow portion, and the first mounting frame and the second mounting frame are arranged in the hollow portion; the first mounting frame and the second mounting frame extend towards each other.

[0037] Optionally, the bearing device is an external gear; a driving gear is installed on the third output shaft of the third driving mechanism;

[0038] The driving gear is meshed with the intermediate gear, and the intermediate gear is meshed with the external gear of the bearing device; or the driving gear is directly meshed with the bearing device.

[0039] Optionally, the first driving mechanism is also in transmission connection with the stirring member;

[0040] The first driving mechanism drives the wafer to rotate circumferentially, and drives the stirring element to rotate circumferentially.

[0041] Compared with the prior art, in the wafer electroplating equipment provided by the present invention, during the electroplating process, the stirring device can stir the plating liquid in the plating liquid tank, and the plating liquid is evenly distributed. The first driving mechanism can drive the wafer to rotate, and the metal ions can be more evenly plated on the wafer surface, avoiding uneven plating of metal ions on the wafer surface due to uneven distribution of potential lines. The device is easy to use and has a good electroplating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A schematic structural diagram of a wafer electroplating device provided in one embodiment of the present invention.

[0043] Figure 2 for Figure 1 Schematic diagram of the structure of the lid.

[0044] Figure 3 for Figure 2 Bottom view of .

[0045] Figure 4 For along Figure 3 Cross-sectional view along the AA direction.

[0046] Figure 5 for Figure 2Schematic diagram of the structure of the cover after removing part of the mounting seat.

[0047] Figure 6 for Figure 1 Schematic diagram of the partial structure of the stirring device.

[0048] Figure 7 for Figure 6 Schematic diagram after removing the shell.

[0049] Figure 8 for Figure 7 Schematic diagram from another perspective.

[0050] Fig. 9 for Figure 8 Top view of the .

[0051] Fig.10 for Figure 8 Schematic diagram of the structure of the carrying device in.

[0052] Fig.11 for Figure 1 Schematic diagram of the structure of the electroplating tank.

[0053] Fig.12 for Fig.11 Top view of the .

[0054] Fig.13 For along Fig.12 Cross-sectional view along the BB direction. DETAILED DESCRIPTION

[0055] The present invention is described in detail below in conjunction with the accompanying drawings:

[0056] According to an embodiment of the present invention, a wafer electroplating device is provided. Figure 1 As shown, the wafer electroplating equipment includes an electroplating tank, a cover 7 and a wafer 78. The tank wall of the electroplating tank is made of insulating material, and the electroplating tank is used to contain the electroplating solution. The bottom of the electroplating tank is provided with a conductive material, which is an anode. For example, the anode can be an anode mesh structure.

[0057] The cover 7 can be covered on the electroplating tank. For example, the cover 7 can be rotatably mounted on the electroplating tank. The cover 7 is made of insulating material. The wafer 78 can be rotatably mounted on the cover 7. The wafer 78 is made of conductive material and is a cathode. The cover 7 includes a first driving mechanism. The first driving mechanism is transmission-connected to the wafer 78 and is used to drive the wafer 78 to rotate.

[0058] The electroplating tank is provided with a stirring device for stirring the electroplating solution in the electroplating tank. The stirring device is made of insulating material.

[0059] When the cover 7 is connected to the electroplating tank, the anode and cathode wafers 78 are spaced apart from each other. When the wafer electroplating equipment is connected to a power source, a potential difference is generated between the anode and cathode wafers 78 of the wafer electroplating equipment, and metal ions in the electroplating solution in the electroplating tank can swim to the wafers 78, and metal can be electroplated on the wafers 78.

[0060] During the electroplating process of this embodiment, the stirring device can stir the plating liquid in the plating liquid tank so that the plating liquid is evenly distributed. The first driving mechanism can drive the wafer 78 to rotate so that the metal ions can be more evenly plated on the surface of the wafer 78, thereby avoiding uneven plating of metal ions on the surface of the wafer 78 due to uneven distribution of electric potential lines. The invention is easy to use and has a good electroplating effect.

[0061] The structure of the wafer 78 mounted on the cover 7 can be set as required. Figures 2 to 4 As shown, the cover 7 may include a wafer clamp 72 for fixing a wafer 78. The wafer clamp 72 is made of insulating material. The wafer 78 is fixedly mounted on the wafer clamp 72. The wafer 78 is circumferentially fixed relative to the wafer clamp 72. More preferably, a wafer receiving groove may be provided on the wafer clamp 72, and the wafer 78 is fixedly mounted in the wafer receiving groove. The wafer 78 and the wafer clamp 72 can rotate synchronously in the circumferential direction.

[0062] The cover 7 may further include a mounting seat 70. The mounting seat 70 is made of insulating material. The mounting seat 70 is connected to the electroplating tank. The mounting seat 70 is detachably mounted on the electroplating tank, for example, the mounting seat 70 is rotatably connected to the electroplating tank. The first driving mechanism is mounted on the mounting seat 70.

[0063] like Figures 2 to 5 As shown, the first driving mechanism may include a first transmission shaft 89. The first transmission shaft 89 is made of insulating material. The wafer clamping member 72 is circumferentially fixed on the first transmission shaft 89. The first driving mechanism can drive the first transmission shaft 89 to rotate, thereby driving the wafer clamping mechanism to rotate. In this way, the wafer clamping member 72 is rotatably mounted on the mounting seat 70 of the cover 7.

[0064] The first driving mechanism includes a first rotating motor 80, a first driving wheel 82, and a first driven wheel 83. For example, the housing of the rotating motor can be fixedly mounted on the mounting seat 70. The first output shaft 81 of the first rotating motor 80 is circumferentially fixed on the first driving wheel 82, and is used to drive the first driving wheel 82 to rotate. For example, the first driving wheel 82 and the first output shaft 81 can be coaxially fixed. The first driving wheel 82 drives the first driven wheel 83 to rotate through a transmission belt 84. For example, the first driving wheel 82 can be meshed with the transmission belt 84, and the first driven wheel 83 can be meshed with the transmission belt 84. The first driven wheel 83 is circumferentially fixed on the first transmission shaft 89, and is used to drive the first transmission shaft 89 to rotate. For example, the first transmission shaft 89 can be coaxially fixed with the first driven wheel 83.

[0065] When the first driving mechanism is working, it can drive the first output shaft 81 and the first driving wheel 82 to rotate, so that the first driving wheel 82 drives the first driven wheel 83 to rotate through the transmission belt 84, and then drives the first transmission shaft 89, the wafer clamping mechanism and the wafer 78 to rotate synchronously.

[0066] The cover 7 may further include a second driving mechanism. The wafer 78 is fixedly mounted on the wafer clamp 72, and the wafer 78 may be axially fixed relative to the wafer clamp 72. The second driving mechanism is in driving connection with the wafer clamp 72, and is used to drive the wafer clamp 72 and the wafer 78 thereon to reciprocate along the axial direction.

[0067] The second driving mechanism can drive the cathode wafer 78 to move axially, so as to adjust the position of the cathode wafer 78 and the distance between the anode and cathode wafer 78 as needed, thereby adjusting the potential difference between the anode and cathode wafer 78, thereby obtaining a better electroplating effect and high electroplating precision.

[0068] The transmission connection structure between the second driving mechanism and the wafer clamping member 72 can be set as required, as long as the second driving mechanism can drive the wafer clamping member 72 to move axially. Figures 2 to 5 As shown, the wafer clamp 72 can be axially fixed on the first transmission shaft 89. The second driving mechanism can be in transmission connection with the first transmission shaft 89, and is used to drive the first transmission shaft 89 to move axially, thereby driving the wafer clamp 72 and the wafer 78 to move axially.

[0069] The second driving mechanism may include a second rotating motor 90, a second driving wheel 92, a second driven wheel 94 and a bearing seat 95. The second driven wheel 94 is axially fixed on the mounting seat 70. More preferably, the mounting seat 70 may be provided with an axial fixing member 74, and the axial fixing member 74 is provided with two axially spaced blocking members 740; the second driven wheel 94 is axially fixed between the two blocking members 740.

[0070] The bearing seat 95 is circumferentially fixed on the mounting seat 70. The bearing seat 95 is sleeved on the first transmission shaft 89, and a bearing 98 is provided between the bearing seat 95 and the first transmission shaft 89, so that the first transmission shaft 89 can rotate circumferentially relative to the bearing seat 95. The bearing seat 95 is axially fixed relative to the first transmission shaft 89 and can move axially synchronously.

[0071] The second output shaft 91 of the second rotating motor 90 is circumferentially fixed on the second driving wheel 92, and the second output shaft 91 of the second rotating motor 90 can drive the second driving wheel 92 to rotate. For example, the second output shaft 91 and the second driving wheel 92 can be coaxially fixed.

[0072] The second driving wheel 92 is meshed with the second driven wheel 94 to drive the second driven wheel 94 to rotate. The second driving wheel 92 and the second driven wheel 94 can both be set as a gear structure, which is a mutual meshing between the two gears. The second driven wheel 94 is provided with an internal thread, and the bearing seat 95 is provided with an external thread. The internal thread of the second driven wheel 94 is sleeved on the external thread on the bearing seat 95. Since the second driven wheel 94 is axially fixed relative to the mounting seat 70. The bearing seat 95 is circumferentially fixed relative to the mounting seat 70, when the internal thread of the second driven wheel 94 cooperates with the external thread of the bearing seat 95, the bearing seat 95 is only allowed to move in the axial direction. When the second driving wheel 92 drives the second driven wheel 94 to rotate, the bearing seat 95 can be moved in the axial direction through the cooperation of the internal thread of the second driven wheel 94 and the external thread of the bearing seat 95.

[0073] The second rotary motor 90 may be mounted on the mounting seat 70. For example, a housing of the second rotary motor 90 may be fixedly mounted on the mounting seat 70.

[0074] like Figure 5 As shown, a top fixing plate 96 may be fixedly connected to the bearing seat 95. A first guide member 97 is provided on the top fixing plate 96. A second guide member 76 is provided on the mounting seat 70. The second guide member 76 and the first guide member 97 may be provided in a matching shape. The second guide member 76 cooperates with the first guide member 97 to achieve a guiding function, thereby limiting the bearing seat 95 to move in the axial direction.

[0075] Further, the number of the first guide members 97 can be at least two. The number of the second guide members 76 is equal to the number of the first guide members 97 and corresponds to each other. The second guide members 76 cooperate with the corresponding first guide members 97 to fix the bearing seat 95 circumferentially. In this way, the axial seat is circumferentially fixed. When the second driving wheel 92 drives the second driven wheel 94 to rotate, when the internal thread of the second driven wheel 94 cooperates with the external thread of the bearing seat 95, the bearing seat 95 cannot rotate due to being circumferentially fixed, and the bearing seat 95 can only move in the axial direction.

[0076] For example, the first guide member 97 can be configured as a guide post, and the second guide member 76 can be configured as a guide hole; the guide post is inserted into the guide hole. For another example, the first guide member 97 can be configured as a guide hole, and the second guide member 76 can be configured as a guide post; the guide post is inserted into the guide hole.

[0077] It should be noted that the axial seat may also be circumferentially fixed by other means, and this application does not limit it solely.

[0078] When the second driving mechanism is working, the second output shaft 91 of the second rotating motor 90 drives the second driving wheel 92 to rotate, and the second driving wheel 92 drives the second driven wheel 94 to rotate. The second driven wheel 94 drives the bearing seat 95 and the first transmission shaft 89 to move axially through the threaded cooperation, thereby driving the wafer clamping member 72 to move axially.

[0079] like Figures 6 to 9 As shown, the stirring device may include a housing 3, a third driving mechanism 1 and a rotatable carrying device 4. The housing 3 is provided with a groove 31. The housing 3 is made of insulating material. The third driving mechanism 1 includes a third output shaft 11. A driving gear 20 is mounted on the third output shaft 11 of the third driving mechanism 1. The driving gear 20 is an external gear. The driving gear 20 is arranged in the groove 31. For example, the third output shaft 11 and the driving gear 20 may be coaxially arranged to rotate synchronously.

[0080] The carrying device 4 is arranged in the groove 31. The carrying device 4 is made of insulating material. A stirring member is installed on the carrying device 4. The stirring member is made of insulating material. The carrying device 4 is an external gear. The driving gear 20 is meshed with the intermediate gear 22, and the intermediate gear 22 is meshed with the external gear of the carrying device 4. The third driving mechanism 1 can drive the carrying device 4 and the stirring member thereon to rotate through the third output shaft 11, thereby realizing the revolution of the stirring member. In addition, in other embodiments, the carrying device 4 can also be directly meshed with the driving gear 20.

[0081] The specific structure of the stirring member mounted on the carrier device 4 can be set as needed. In this embodiment, a mounting frame is fixedly provided on the carrier device 4. The stirring member is rotatable on the mounting frame. The third driving mechanism drives the carrier device 4 to rotate, thereby driving the stirring member to revolve, and driving the stirring member to rotate.

[0082] Specifically, Fig. 9 As shown, the middle of the carrying device 4 is a hollow structure. The carrying device 4 is provided with a first mounting frame 41 and a second mounting frame 42. The first mounting frame 41 and the second mounting frame 42 are both made of insulating materials. The first mounting frame 41 and the second mounting frame 42 extend toward each other in the hollow part of the carrying device 4.

[0083] The stirring member may include a first stirring member 66. The stirring device further includes a fourth driving mechanism for driving the first stirring member 66 to rotate. The fourth driving mechanism is in transmission connection with the first stirring member 66 and is used to drive the first stirring member 66 to rotate.

[0084] In the example shown in the figure, the fourth driving mechanism can be set as an internal gear 5. A rotatable first planetary gear shaft 611 is mounted on the first mounting frame 41. The first planetary gear shaft 611 is sleeved with a first planetary gear 61 and a first stirring member 66. The first planetary gear shaft 611 and the first planetary gear 61 are both made of insulating materials. The first planetary gear 61 and the first stirring member 66 can achieve synchronous rotation. For example, the first planetary gear 61 and the first stirring member 66 can be coaxially arranged.

[0085] The first mounting frame 41 is provided with a second planetary gear shaft 621. A rotatable second planetary gear 62 is mounted on the second planetary gear shaft 621. The second planetary gear shaft 621 and the second planetary gear 62 are both made of insulating materials. The first planetary gear 61 and the second planetary gear 62 are both external gears, and the first planetary gear 61 and the second planetary gear 62 are meshed with each other. The second planetary gear 62 is meshed with the internal gear 5. The internal gear 5 of the carrying device 4 can drive the first planetary gear shaft 611 and the first stirring member 66 to rotate through the second planetary gear 62.

[0086] The stirring member may also include a first stirring member 68. A rotatable third planetary gear shaft 631 is mounted on the second mounting frame 42. A fourth planetary gear shaft 641 and a fifth planetary gear shaft 651 are also provided on the second mounting frame 42. A third planetary gear 63 and a first stirring member 68 are sleeved and mounted on the third planetary gear shaft 631. A rotatable fourth planetary gear 64 is sleeved and mounted on the fourth planetary gear shaft 641. A rotatable fifth planetary gear 65 is sleeved and mounted on the fifth planetary gear shaft 651. The third planetary gear 63, the fourth planetary gear 64 and the fifth planetary gear 65 are all external gears. The third planetary gear 63, the fourth planetary gear 64 and the fifth planetary gear 65 are meshed in sequence. The fifth planetary gear 65 is meshed with the internal gear 5. The internal gear 5 of the carrying device 4 can drive the third planetary gear 63 and the first stirring member 68 to rotate through the fifth planetary gear 65 and the fourth planetary gear 64 in sequence.

[0087] The internal gear 5 is disposed above the carrier 4 and meshes with the second planetary gear 62 and the fifth planetary gear 65. The internal gear 5 is disposed in the groove 31. For example, the internal gear 5 can be disposed on the inner circumference of the hollow structure of the carrier 4.

[0088] The third driving mechanism 1 can be configured as a servo motor. When in use, the third driving mechanism 1 is started, and its third output shaft 11 drives the driving gear 20 to rotate, and transmits the driving force to the carrying device 4, driving the carrying device 4 to rotate. The driving carrying device 4 drives the first stirring member 66 and the first stirring member 68 to rotate and realize revolution.

[0089] The driving bearing device 4 simultaneously drives the second planetary gear 62 and the fifth planetary gear 65 to move along the circumferential direction of the internal gear 5. During the movement of the second planetary gear 62 and the fifth planetary gear 65 along the circumferential direction of the internal gear 5, since the internal gear 5 is fixed, the second planetary gear 62 and the fifth planetary gear 65 are driven by the internal teeth of the internal gear 5 to rotate around the second planetary gear shaft 621 and the fifth planetary gear shaft 651 respectively. The rotating second planetary gear 62 drives the first planetary gear 61 to rotate, driving the first planetary gear shaft 611 and the first stirring member 66 to rotate. The first stirring member 66 rotates with the first planetary gear shaft 611 as the axis. The rotating fifth planetary gear 65 drives the fourth planetary gear 64 and the third planetary gear 63 to rotate, thereby driving the third planetary gear shaft 631 and the first stirring member 68 to rotate. The first stirring member 68 rotates with the third planetary gear shaft 631 as the axis. The third planetary gear shaft 631, the third planetary gear 63, the fourth planetary gear shaft 641, the fourth planetary gear 64, the fifth planetary gear shaft 651, and the fifth planetary gear 65 are all made of insulating materials. In this way, by using an active fourth driving mechanism and rationally designing the transmission device, the first stirring member 66 and the first stirring member 68 can realize self-rotation respectively.

[0090] like Figure 8 In the example shown, the rotation direction of the first stirring member 66 is set opposite to the rotation direction of the first stirring member 68. For example, when the third driving mechanism 1 drives the carrying device 4 to rotate clockwise, the first stirring member 66 can be driven to rotate in the counterclockwise direction, and the first stirring member 68 can be driven to rotate in the clockwise direction. For another example, when the third driving mechanism 1 drives the carrying device 4 to rotate counterclockwise, the first stirring member 66 can be driven to rotate in the clockwise direction, and the first stirring member 68 can be driven to rotate in the counterclockwise direction.

[0091] The internal gear 5 in this embodiment is connected to the first stirring member 66 through two planetary gears, the second planetary gear 621 and the first planetary gear 611. In addition, the internal gear 5 can be connected to the first stirring member 66 through other even-numbered planetary gears.

[0092] The internal gear 5 in this embodiment is connected to the first stirring member 68 through three planetary gears, namely, the fifth planetary gear 65, the fourth planetary gear 64 and the third planetary gear 63. In addition, the internal gear 5 can be connected to the first stirring member 68 through other odd number of planetary gears.

[0093] Since the internal gear 5 can be connected to the first stirring member 66 through other even-numbered planetary gears and the internal gear 5 can be connected to the first stirring member 68 through other odd-numbered planetary gears, the rotation direction of the first stirring member 66 is always opposite to that of the first stirring member 68.

[0094] In addition, in some other embodiments, a hollow synchronous pulley can be used instead of the carrying device 4. The third driving mechanism 1 drives the carrying device 4 to rotate through the synchronous belt. In this embodiment, the stirring member may include a plurality of stirring paddles. Each stirring paddle may be a linear rod-shaped structure, or a T-shaped structure, or a cubic structure, etc. The plurality of stirring paddles may be arranged at intervals in the circumferential direction. In the example shown in the figure, the first stirring member 81 and the second stirring member 82 each include four stirring paddles of a roughly square structure, and the four stirring paddles are arranged roughly in a cross shape as a whole.

[0095] In addition, in some other examples, the stirring member may also include a stirring paddle, wherein each stirring paddle may be a linear rod structure, or a T-shaped structure, or a cubic structure, etc.

[0096] In addition, in some other examples, the stirring member may include one or more impellers. The impeller may be arranged in an arc or straight structure. When the stirring member includes multiple impellers, the multiple impellers may be arranged in a cross-distribution, for example, the multiple impellers may be arranged in two cross-leafs or three cross-leafs or T-shaped leaves, etc.

[0097] As a preferred embodiment, the rotation direction of the wafer 78 is set opposite to the rotation direction of the carrier 4, so that the rotation direction of the wafer 78 is opposite to the revolution direction of the stirring member. The rotation direction of the wafer 78 and the rotation direction of at least one stirring member can be set opposite to each other. In addition, the rotation direction of the wafer 78 and the rotation direction of the carrier 4 can also be set to be the same.

[0098] In addition, in some other embodiments, the first driving mechanism may also be connected to the stirring member. The first driving mechanism drives the wafer 78 to rotate circumferentially and drives the stirring member to rotate. In this way, the first driving mechanism can simultaneously drive the wafer 78 and the stirring member to rotate. Figures 10 to 12 As shown, a nozzle 32 may be provided on the electroplating tank. The nozzle 32 is configured to spray water onto the surface of the wafer 78. The nozzle 32 is made of an insulating material. For example, the nozzle 32 may be configured as a tube structure. A collecting tank 30 is provided on the inner wall of the electroplating tank.

[0099] When the nozzle 32 sprays water onto the surface of the wafer 78 , the first driving mechanism drives the wafer 78 to rotate, so that the sprayed water on the surface of the wafer 78 is thrown out and collected in the collecting tank 30 .

[0100] In this way, by providing the nozzle 32 and the collecting tank 30 , the surface of the wafer 78 can be cleaned to avoid unnecessary impurities on the surface of the wafer 78 . The surface of the wafer 78 is only plated with the required metal ions, and the electroplating effect of the wafer 78 is better.

[0101] like Fig.12As shown, the collecting tank 30 may be provided with an opening 300. The opening 300 is radially opposite to the wafer 78. When the wafer 78 rotates, the clean water on it can be thrown into the collecting tank 30 to prevent the sprayed water on the surface of the wafer 78 from entering the electroplating liquid tank and mixing with the electroplating liquid, resulting in dilution of the electroplating liquid.

[0102] In order to enable the collection tank 30 to collect the water thrown out when the wafer 78 rotates, the collection tank 30 is extended axially from the opening 300 toward the inside of the electroplating tank. In this way, the collection tank 30 can independently collect the water thrown out when the wafer 78 rotates, and the collected water will not flow out and mix with the electroplating solution in the electroplating tank.

[0103] In a specific embodiment, as shown in the figure, when the nozzle 32 sprays water onto the surface of the wafer 78, the first driving mechanism drives the wafer 78 to rotate, and the water sprayed on the surface of the wafer 78 can be thrown out along the tangential direction of the circumference and collected in the collecting tank 30 to avoid falling into the plating liquid tank and causing dilution of the plating liquid.

[0104] In this embodiment, the second driving mechanism can drive the wafer clamping member 72 and the wafer 78 to move axially, and can drive the wafer 78 to move axially from the electroplating position to the cleaning position.

[0105] When the second driving mechanism drives the wafer 78 to move axially to the electroplating position, the wafer 78 is immersed in the electroplating solution in the electroplating solution tank, and electroplating of the wafer 78 can be achieved.

[0106] When the second driving mechanism drives the wafer 78 to move axially to the cleaning position, the wafer 78 moves axially to the electroplating liquid out of the electroplating liquid tank. At this time, the wafer 78 can be located above the liquid surface of the electroplating liquid and can be cleaned by water sprayed by the nozzle 32.

[0107] In the present invention, during the electroplating process, the stirring device can stir the plating liquid in the plating liquid tank, so that the plating liquid is evenly distributed. The first driving mechanism can drive the wafer to rotate, and the metal ions can be more evenly plated on the wafer surface, thereby avoiding uneven plating of metal ions on the wafer surface due to uneven distribution of potential lines. The invention is easy to use and has a good electroplating effect.

[0108] The second driving mechanism can drive the cathode wafer to move axially, thereby adjusting the position of the cathode wafer and adjusting the distance between the anode and cathode wafers as needed, thereby adjusting the potential difference between the anode and cathode wafers, thereby obtaining a better electroplating effect and high electroplating accuracy.

[0109] By setting up the nozzle and the collection tank, the wafer surface can be cleaned to avoid unnecessary impurities on the wafer surface. The wafer surface is only plated with the required metal ions, and the electroplating effect of the wafer is better.

[0110] The embodiments of the present invention are only used to illustrate the present invention and do not constitute a limitation on the scope of the claims. Other substantially equivalent substitutes that can be thought of by those skilled in the art are all within the protection scope of the present invention.

Claims

1. Wafer electroplating equipment, characterized in that: include: An electroplating liquid tank, wherein the electroplating liquid tank is provided with a stirring device for stirring the electroplating liquid; the stirring device comprises a third driving mechanism and a rotatable carrying device, the third driving mechanism is in transmission connection with the carrying device, and a stirring member is installed on the rotatable carrying device; A cover, the cover is connected to the electroplating tank; a wafer rotatably mounted on the cover; and A first driving mechanism, the first driving mechanism is drivingly connected to the wafer and is used to drive the wafer to rotate circumferentially; The cover includes a wafer holder, and the first drive mechanism includes a first transmission shaft; The wafer is circumferentially fixed on the wafer clamp, and the wafer clamp is circumferentially fixed on the first transmission shaft; The first driving mechanism is in driving connection with the first transmission shaft, and is used for driving the first transmission shaft to rotate, thereby driving the wafer clamping mechanism and the wafer to rotate; The bearing device is an external gear; a driving gear is installed on the third output shaft of the third driving mechanism; the driving gear is meshed with the intermediate gear, and the intermediate gear is meshed with the external gear of the bearing device; or, the driving gear is directly meshed with the bearing device.

2. The wafer electroplating equipment according to claim 1, characterized in that: The cover also includes a mounting seat, which can be covered on the electroplating liquid tank; the first driving mechanism is installed on the mounting seat.

3. The wafer electroplating equipment according to claim 1, characterized in that: The first driving mechanism includes a first rotating motor, a first driving wheel and a first driven wheel; The first output shaft of the first rotating motor is circumferentially fixed on the first driving wheel, and is used to drive the first driving wheel to rotate; The first driving wheel drives the first driven wheel to rotate through a transmission belt; The first driven wheel is circumferentially fixed on the first transmission shaft, and is used to drive the first transmission shaft to rotate.

4. The wafer electroplating equipment according to claim 1, characterized in that: The wafer clamping member is provided with a wafer accommodating groove, and the wafer is fixedly installed in the wafer accommodating groove.

5. The wafer electroplating equipment according to claim 1, characterized in that: The stirring member includes a first stirring member, and the first stirring member is rotatably mounted on the carrying device; The stirring device further comprises a fourth driving mechanism, and the fourth driving mechanism is drivingly connected to the first stirring member.

6. The wafer electroplating equipment according to claim 5, characterized in that: The fourth driving mechanism is an internal gear; the internal gear is transmission-connected to the first stirring member via an even number of planetary gears.

7. The wafer electroplating equipment according to claim 6, characterized in that: The inner gear is meshed with the second planetary gear, and the second planetary gear is meshed with the first planetary gear; A first mounting frame is fixedly arranged on the carrying device; A rotatable first planetary gear shaft is mounted on the first mounting frame, and the first planetary gear and the first stirring member are mounted on the first planetary gear shaft; The first mounting frame is provided with a second planetary gear shaft, and the second planetary gear is rotatably mounted on the second planetary gear shaft.

8. The wafer electroplating equipment according to claim 7, characterized in that: The stirring member further includes a second stirring member, and the internal gear drives the first stirring member and the second stirring member to rotate respectively.

9. The wafer electroplating equipment according to claim 8, characterized in that: The internal gear is transmission-connected to the second stirring member via an odd number of planetary gears.

10. The wafer electroplating equipment according to claim 9, characterized in that: A second mounting frame is fixedly arranged on the carrying device; A rotatable third planetary gear shaft is mounted on the second mounting frame; the third planetary gear and the second stirring member are mounted on the third planetary gear shaft; A fourth planetary gear shaft is mounted on the second mounting frame; the fourth planetary gear is rotatably mounted on the fourth planetary gear shaft; The second mounting frame is provided with a fifth planetary gear shaft; the fifth planetary gear is rotatably mounted on the fifth planetary gear shaft.

11. The wafer electroplating equipment according to claim 10, characterized in that: The carrying device has a hollow portion, and the first mounting frame and the second mounting frame are arranged in the hollow portion; the first mounting frame and the second mounting frame extend toward each other.

12. The wafer electroplating equipment according to claim 1, characterized in that: The first driving mechanism is also in transmission connection with the stirring member; The first driving mechanism drives the wafer to rotate circumferentially, and drives the stirring element to rotate circumferentially.

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