Thin plate-shaped substrate holding device and transport robot having the holding device

Abstract

Provided is a holding device that can reliably hold and transport a thin plate-like substrate after surface treatment without forming a natural oxide film on the treated surface thereof. The holding device (45) includes: a holding component (47) for holding the thin plate-like substrate; a purification plate (46) having a flow path (52) formed therein for circulating the inert gas; and a pipe component for connecting an inert gas supply source and the flow path (52). The purification plate (46) includes a spray port (51) that is connected to the flow path (52) and is disposed on a surface facing the treated surface of the thin plate-like substrate held by the holding component (47) and is used to spray the inert gas onto the treated surface of the thin plate-like substrate. In addition, the holding device (45) includes a lifting mechanism (48) for lifting and lowering the holding component (47) and the purification plate (46) relative to each other.

Description

Technical Field

[0001] The present invention relates to a thin plate-like substrate holding device and a conveying robot having the holding device. In the thin plate-like substrate holding device, the state of the thin plate-like substrate is held inside a conveying device for conveying thin plate-like substrates such as semiconductor wafers, liquid crystal display panels, organic EL display panels, and panels for solar cells, and substances remaining on the surface of the thin plate-like substrate are removed by supplying an inert gas to a processed surface of the thin plate-like substrate. Background Art

[0002] In the past, there was an EFEM (Equipment Front End Module), which was connected to a processing device that performs various processes such as film formation and etching on the surface of a thin plate-shaped substrate such as a semiconductor wafer, and transferred the thin plate-shaped substrate. In order to prevent dust floating in the air from adhering to the thin plate-shaped substrate, a space called a micro-environment space was formed to maintain the internal atmosphere of the device to which the thin plate-shaped substrate was exposed with high cleanliness. The micro-environment space is a space surrounded by an FFU (Fan Filter Unit) set on the ceiling of the EFEM, side walls, and a floor through which air can circulate. The air purified by the FFU fills the interior of the micro-environment space, thereby purifying the atmosphere in the space. In addition, since the filled clean air is discharged to the outside of the micro-environment space through the floor through which air can circulate, the dust generated in the space is also discharged to the outside of the space together with the airflow of the clean air. As a result, the space where the substrate is located can be maintained with high cleanliness at a lower cost than the entire clean plant.

[0003] However, in recent years, the miniaturization of circuit line width has been progressing rapidly, and the problem that the high cleanliness of the micro-environment method in the past cannot be dealt with alone. In particular, there is a problem that the surface of the thin plate-like substrate transported to the closed container undergoes surface treatment by a processing device, and reacts with the oxygen and moisture contained in the air in the micro-environment space to form a natural oxide film. Due to the formation of the natural oxide film, the circuit that should be formed on the surface of the thin plate-like substrate cannot be fully formed, resulting in a failure that cannot ensure the desired operating characteristics. In addition, the chemical substances contained in the reaction gas used by the processing device are carried to the interior of the closed container in a state of being attached to the thin plate-like substrate, contaminating the untreated thin plate-like substrate in the closed container, causing a bad influence on the next processing step, resulting in a deterioration in the yield rate.

[0004] In order to solve the above-mentioned problem, people consider the following atmosphere replacement device, in which the air and pollutants entering the interior of the sealed container are removed by a flow of inert gas, and then the interior of the sealed container is filled with the inert gas, thereby preventing the oxidation of the surface of the thin plate-shaped substrate received in the interior. Patent document 1 discloses the following device, in which inert gas is supplied to the interior of a FOUP (Front Opening Unified Pod) relative to semiconductor wafers loaded in a FOUP as a sealed container from a purification plate that is movable relative to the FOUP, thereby removing pollutants attached to the surface of the semiconductor wafers and replacing the atmosphere inside the FOUP with an inert gas atmosphere. Reference Figure 1 . An element for suppressing the jet force of the inert gas is provided inside the purification plate, and the inert gas can be supplied as a laminar flow. As a result, no dust adheres to the surface of the thin plate-shaped substrate received inside the FOUP, and the oxidation of the surface of the semiconductor wafer can be prevented. However, at present, when miniaturization is highly advanced, it is not enough to simply prevent the oxidation of the surface of the thin plate-shaped substrate received inside the FOUP, and it is also required to prevent oxidation during the transportation of the thin plate-shaped substrate from the processing device in the vacuum atmosphere to the inside of the FOUP.

[0005] Patent Document 2 is used to meet such a demand and is a structure in which a flow path is provided near the microenvironment space, a downward flow of inert gas is generated inside the microenvironment space, and the inert gas is circulated through the flow path. Figure 2 According to this scheme, the downward flow of the inert gas supplied from the FFU is sucked from the gas suction port provided on the bottom plate surface, and then moves upward through the flow path to the FFU, and is supplied to the microenvironment space again. Thus, since the entire microenvironment space is filled with inert gas, even when the thin plate-shaped substrate passes through the microenvironment space, the thin plate-shaped substrate is still not exposed to the atmospheric atmosphere.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: JP Patent No. 5448000

[0009] Patent Document 2: Japanese Patent Application Publication No. 2015-146349 Summary of the invention

[0010] Problems to be solved by the invention

[0011] However, due to the formation of the structure disclosed in patent document 2, various problems arise. First, in order to replace the inside of the microenvironment space by inert gas, a large amount of inert gas must be required, and as a result, the production cost of the semiconductor increases. In addition, in the case of circulating the inert gas inside the microenvironment space, since not only the inert gas, but also the dust and reaction gas components brought into the inside of the microenvironment space on the surface of the thin plate-shaped substrate are circulated inside the device, in order to remove the dust and the residual reaction gas, a pollutant treatment mechanism such as a chemical filter must be newly set. In addition, the chemical filter must be required to be replaced regularly to maintain cleanliness, which also constitutes a major factor in increasing costs. In addition, since a driving mechanism such as a conveying robot is set inside the microenvironment space, the inert gas heated by the heat emitted by the driving mechanism is circulated, and thus, since the temperature in the space rises to above the specified temperature, the possibility of electrical components and the like having malfunctions, etc., must be required to set a cooling mechanism for cooling the circulated inert gas. In addition, there is a problem that the flow rate of the inert gas supplied from the FFU to the inside of the mini-environment space is too low, and the components of the reaction gas remaining in the fine parts of the pattern formed on the thin plate-shaped substrate cannot be removed.

[0012] The present invention is proposed in view of the above-mentioned problems, and its object is to provide a holding device and a conveying robot having the holding device at a low price, in which a thin plate-shaped substrate that has completed the conveying process can be conveyed without exposing its surface to an oxidizing atmosphere.

[0013] Technical solutions to solve problems

[0014] In order to achieve the above-mentioned purpose, the thin plate-like substrate holding device described in claim 1 of the present invention is characterized in that the thin plate-like substrate holding device includes: a purification plate, a flow path for circulating an inert gas is formed inside the purification plate; a pipe component, which connects an inert gas supply source with the above-mentioned flow path; an injection port, which is connected with the above-mentioned flow path and is opened on the surface of the above-mentioned purification plate facing the processed surface of the above-mentioned thin plate-like substrate, and injects the above-mentioned inert gas toward the above-mentioned processed surface of the above-mentioned thin plate-like substrate; a holding component, which is arranged at a position facing the above-mentioned purification plate and holds the above-mentioned thin plate-like substrate; and a first lifting mechanism, which enables the above-mentioned holding component to be lifted and moved relative to the above-mentioned purification plate.

[0015] According to this scheme, the thin plate-shaped substrate holding device can hold the thin plate-shaped substrate by means of the holding member, and can spray inert gas from the purification plate toward the treated surface of the held thin plate-shaped substrate. Thus, by spraying the inert gas, the reactive gas components remaining on the treated surface of the thin plate-shaped substrate after the surface treatment are removed. In addition, since the outward airflow of the inert gas does not intrude into the space formed between the thin plate-shaped substrate and the purification plate during transportation, the malfunction of the natural oxide film is eliminated. In addition, since the holding member is lifted and moved by the first lifting mechanism, the installation action of the thin plate-shaped substrate can be performed by the action of the first lifting mechanism.

[0016] In addition, the thin plate-shaped substrate holding device described in claim 2 of the present invention is characterized in that the thin plate-shaped substrate holding device includes: a purification plate, a flow path for circulating an inert gas is formed inside the purification plate; a pipe component, the pipe component connects the inert gas supply source with the above-mentioned flow path; a jet port, the jet port is connected with the above-mentioned flow path, is opened on the surface of the above-mentioned purification plate facing the processed surface of the above-mentioned thin plate-shaped substrate, and sprays the above-mentioned inert gas toward the above-mentioned processed surface of the above-mentioned thin plate-shaped substrate; a holding component, the holding component is arranged at a position facing the above-mentioned purification plate, and holds the above-mentioned thin plate-shaped substrate; the second lifting mechanism, the second lifting mechanism causes the above-mentioned purification plate to be lifted and moved relative to the above-mentioned holding component. According to the above scheme, since the purification plate is lifted and moved by the second lifting mechanism, it is not necessary to require the lifting mechanism to lift and move the holding component of a complex structure. As a result, the lifting mechanism can be made small and lightweight. In addition, the holding component can be in a form of sucking and holding the thin plate-shaped substrate from below, or in a form of holding the periphery of the thin plate-shaped substrate.

[0017] In addition, the thin plate-shaped substrate holding device described in claim 3 of the present invention is characterized in that the thin plate-shaped substrate holding device includes: a purification plate, a flow path for circulating an inert gas is formed inside the purification plate; a pipe member, the pipe member connects the inert gas supply source with the above-mentioned flow path; an injection port, the injection port is connected with the above-mentioned flow path, and is provided on the surface of the above-mentioned purification plate facing the processed surface of the above-mentioned thin plate-shaped substrate; a holding member, the holding member is provided at a position facing the above-mentioned purification plate, and holds the above-mentioned thin plate-shaped substrate; and a third lifting mechanism, the third lifting mechanism lifts and moves the above-mentioned holding member and the above-mentioned purification plate. In addition, the third lifting mechanism can be a form that lifts and moves the purification plate and the holding member separately, or a form that lifts and moves them simultaneously.

[0018] In addition, it is characterized in that the above-mentioned injection port is formed in a plurality on the above-mentioned purification plate, and a part of the plurality of injection ports is arranged corresponding to the position where the above-mentioned holding member is arranged. According to this scheme, since the pollutants such as dust and fine particles of the reaction gas attached to the holding member can be removed from the holding member by injecting the inert gas toward the holding member in a state where the thin plate-like substrate is not held, it is possible to prevent the pollutants from being transferred to the surface of the thin plate-like substrate. In addition, at least a part of the plurality of injection ports can also be arranged to be inclined toward the outside of the above-mentioned thin plate-like substrate holding device held. Since the injection port is arranged to be inclined from the center of the held thin plate-like substrate toward the outside, the outflow direction of the inert gas is made to flow out toward the outside of the thin plate-like substrate, thereby promoting the outflow of the inert gas to the outside, and the pollutants remaining on the processed surface of the thin plate-like substrate can be removed in a shorter time.

[0019] In addition, the thin plate substrate holding device of the present invention can also be mounted on a thin plate substrate conveying robot, which includes: an advance and retreat device that enables the thin plate substrate holding device to move forward and backward; a rotating mechanism that enables the advance and retreat mechanism to rotate in a horizontal plane; and a lifting mechanism that enables the advance and retreat mechanism to move upward and downward. Thus, the thin plate substrate can be conveyed to a predetermined position while performing a replacement treatment on the processed surface of the thin plate substrate by an inert gas.

[0020] In addition, the thin plate-like substrate conveying device of the present invention is characterized in that it includes: a conveying space in which a thin plate-like substrate conveying robot is arranged; a conveying space forming member, which forms the above-mentioned conveying space; a sealed container opening and closing device, which is fixed to the above-mentioned conveying space forming member, and loads the sealed container receiving the above-mentioned thin plate-like substrate at a specified position to open and close the above-mentioned sealed container; and an FFU, which is fixed to the upper part of the above-mentioned conveying space forming member, and supplies clean air as a downstream to the above-mentioned conveying space. In addition, since the sealed container opening and closing device is a structure that can replace the inside of the sealed container with a specified atmosphere, the thin plate-like substrate can be conveyed without contacting the atmosphere, and the formation of a natural oxide film on the processed surface of the thin plate-like substrate can be prevented at a low cost, and the low cost is lower than the cost of placing the entire conveying space in an inactive gas atmosphere.

[0021] Effects of the Invention

[0022] According to the present invention described above, the processed thin plate-shaped substrate can be transported in a state where the processed surface is partially replaced with atmosphere. This can help reduce costs because it is not necessary to replace the atmosphere of the entire space for transporting the thin plate-shaped substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A cross-sectional view showing a conventional device for replacing the atmosphere inside a FOUP;

[0024] Figure 2 A cross-sectional view showing a conventional device for replacing the atmosphere inside a microenvironment space;

[0025] Figure 3 A cross-sectional view showing a processing system;

[0026] Figure 4 A perspective view showing a processing system;

[0027] Figure 5 is a cross-sectional view showing a transport robot 7 as one embodiment of the present invention;

[0028] Figure 6 A perspective view showing the general structure of FOUP 2;

[0029] Figure 7 A cross-sectional view showing an example of a loading port 5' with a replacement function;

[0030] Figure 8 A perspective view showing a holding device 45 according to an embodiment of the present invention;

[0031] Fig. 9 A cross-sectional view showing a lifting mechanism 48 of the present invention;

[0032] Fig.10 A diagram showing a lifting mechanism 66 of the present invention;

[0033] Fig.11 A diagram showing the operation of the holding device 45 according to one embodiment of the present invention;

[0034] Fig.12 A diagram showing the operation of the holding device 45 according to one embodiment of the present invention;

[0035] Fig.13 A diagram showing the operation of a holding device 45' according to another embodiment of the present invention;

[0036] Fig.14 A diagram showing purification plates 79 and 81 of the present invention;

[0037] Fig.15 A diagram showing purification plates 79' and 81' of the present invention;

[0038] Fig.16 A diagram showing the operation of a holding device 45" according to an embodiment of the present invention;

[0039] Fig.17 A diagram showing the operation of a holding device 45" according to an embodiment of the present invention;

[0040] Fig.18 A diagram showing a lifting mechanism 88 according to an embodiment of the present invention;

[0041] Fig.19 It is a figure which shows the conveyance robots 7a and 7b which are one embodiment of this invention. DETAILED DESCRIPTION

[0042] Hereinafter, a processing system 1 according to an embodiment of the present invention will be described in detail with reference to the drawings. Figure 3 2 is a cross-sectional view showing a processing system 1 according to an embodiment of the present invention. Figure 4 The processing system 1 of this embodiment is a three-dimensional diagram. In addition, the thin plate-shaped substrate to be processed by the processing system 1 of this embodiment is a semiconductor wafer W, but it can also be fully applied to the processing system of other thin plate-shaped substrates. The processing system 1 is set in a factory called a clean room, which is managed according to 0.5 micrometer dust, a relatively clean atmosphere of level 100 and a prescribed room temperature of around 20°C. The processing system 1 of this embodiment is composed of an EFEM 4 and a processing device 3. The EFEM 4 loads the FOUP 2 transported from the previous step, opens its door, and takes the semiconductor wafer W received in the inside of the FOUP 2 between it and the processing device 3. The processing device 3 performs a prescribed treatment on the processed surface (surface) of the semiconductor wafer W. The EFEM 4 of this embodiment includes a loading port 5, a loading port 5' with a replacement function, a microenvironment space 6, a transport robot 7 that transports the semiconductor wafer W in the inside of the microenvironment space 6, and an FFU 8 that supplies the downstream of clean air to the inside of the microenvironment space 6. The processing apparatus 3 of the present embodiment includes a transfer chamber 9 , a vacuum transfer robot 10 that transfers a semiconductor wafer W within a vacuum atmosphere provided in the transfer chamber 9 , a processing chamber 11 , and a load lock chamber 12 .

[0043] The processing device 3 includes: a processing chamber 11, which performs a predetermined treatment of diffusion treatment, etching treatment, and heat treatment on the surface of the semiconductor wafer W in a predetermined environment of a vacuum atmosphere or an inert gas atmosphere; a load lock chamber 12, which is used to transfer the semiconductor wafer W between the processing device 3 and the microenvironment space 6; a transport chamber 9, which is arranged in a manner adjacent to the processing chamber 11 and the load lock chamber 12; and a vacuum transport robot 10, which is arranged in the transport chamber 9 and transports the semiconductor wafer W between the load lock chamber 12 and the processing chamber 11, or between the processing chamber 11 and other processing chambers 11. The processing chamber 11 and the transport chamber 9 are configured to be airtightly locked with the load lock chamber 12 and the transport chamber 9 by a partition member called a slit valve 13. In addition, the load lock chamber 12 and the microenvironment space 6 are configured to be airtightly locked by a partition member called a gate valve 14. In addition, a vacuum pump and a pipe are connected in the processing chamber 11, the transport chamber 9 and the load lock chamber 12. The vacuum pump draws the internal atmosphere to make it in a vacuum state, and the pipe is used to introduce an inactive gas from the outside. In addition, a pipe is connected in the processing chamber 11, and the pipe is used to supply the reaction gas used for various surface treatments. The microenvironment space 6 is a space maintained in a clean atmosphere for transporting semiconductor wafers W. The microenvironment space 6 is formed by a transport space forming component of a wall component 16 for separating a support 15 and the external atmosphere, and an FFU 8 is set in the ceiling part. In the FFU 8, a fan 17 and a high-performance filter 18 are included. The fan 17 supplies air downward toward the microenvironment space 6, and the high-performance filter 18 removes pollutants such as tiny dust and organic matter in the supplied air. In addition, an opening is provided on the bottom surface of the microenvironment space 6, and the opening allows the clean air supplied from the FFU 8 to flow to the outside of the EFEM 4. Through the above scheme, the clean air supplied to the microenvironment space 6 by means of the FFU 8 forms a downward laminar flow inside the microenvironment space 6 and flows to the outside of the device from the opening of the bottom surface. In addition, in the EFEM 4 of this embodiment, the opening ratio of the opening part is adjusted according to the rotation speed of the fan 17 and the plate 20 provided on the bottom surface, thereby, the air pressure inside the microenvironment space 6 can be maintained at a positive pressure of 1.5 Pa compared with the external atmosphere, thereby preventing the intrusion of pollutants and dust from the outside. Through these structures, the dust generated by the driving mechanism of the conveying robot 7 and the like can flow to the outside through the downward laminar flow, and the intrusion of dust from the outside is also prevented. As a result, the inside of the microenvironment space 6 is always maintained in a highly clean atmosphere with a dust level of 0.5 micrometers (micro meter dust) greater than or equal to 1.

[0044] The transport robot 7 is disposed inside the mini-environment space 6 and transports the semiconductor wafer W between the FOUP 2 and the processing device 3 . Figure 5The figure is a cross-sectional view showing the appearance structure of an atmospheric transport robot 7 according to an embodiment of the present invention. The atmospheric transport robot 7 according to the present embodiment is a selectively compliant assembly robot arm (skara) type robot, and is a cleaning robot that can prevent dust from flying. The atmospheric transport robot 7 according to the present embodiment is composed of a base 24 and a barrel 25, and the base 24 is fixed on a bracket 15 provided on the bottom surface of the EFEM 4, and the barrel 25 can be raised and lowered and rotated relative to the base 24. On the base 24, a lifting unit is provided to lift and lower the barrel 25. The barrel 25 is supported on a moving part of the lifting unit via a bracket 19. The lifting unit includes a guide component, a ball screw mechanism and a motor M1, and the guide component guides the barrel 25 in the vertical direction, and the ball screw mechanism lifts and lowers the moving part fixed on the barrel 25 by rotating the screw, and the motor M1 drives the ball screw mechanism. The barrel portion 25 is composed of a barrel holder 27 and a barrel cover 28, the barrel holder 27 being integrally formed on the base end portion of the first arm 26, and the barrel cover 28 being fixed to the barrel holder 27. The second arm 29 is connected to the front end portion of the first arm 26 so as to be rotatable in a horizontal plane via a bearing, and the arm body 22 is constituted by the first arm 26 and the second arm 29. In addition, the barrel holder 27 is rotatably mounted on the bracket 19 via a bearing, and is rotated in a horizontal plane by a motor M2 provided on the bracket 19. As a result, the first arm 26 integrated with the barrel holder 27 also rotates in a horizontal plane together with the barrel holder 27.

[0045] The base end of the second arm 29 is supported rotatably via a bearing at the front end of the first arm 26 (cylindrical support 27). In addition, the wrist block 21 of the holding device 45 as one embodiment of the present invention is connected to the base end of the second arm 29 in a rotatable manner via a bearing. The first arm 26 (cylindrical support 27) is a hollow box-shaped housing inside thereof, and a motor M3 and a transmission mechanism are provided. The motor M3 drives the second arm 29, and the transmission mechanism is a pulley and a belt, which transmits the driving force from the motor 3. Thus, the second arm 29 rotates in a horizontal plane by the operation of the motor M3. In addition, the inside of the second arm 29 also constitutes a hollow box-shaped housing, and a motor M4 and a transmission mechanism called a pulley and a belt are provided inside it. The motor M4 drives the holding device 45, and the transmission mechanism transmits the driving force from the motor M4. Thus, by operating the motor M4, the holding device 45 rotates in a horizontal plane. Here, a structure including a motor M4 for driving the holding device 45 and a transmission mechanism such as a pulley and a belt for transmitting the driving force of the motor M4 is referred to as a wrist driving mechanism.

[0046] Through the above scheme, the first arm 26 and the second arm 29 are linked to each other and rotate in opposite directions, thereby the arm body 22 is bent and the holding device 45 arranged at the front end of the arm body 22 is moved forward and backward. Here, the structure including the motor M2 for driving the first arm 26 and the motor M3 for driving the second arm 29, and the transmission mechanism of the pulley and belt for transmitting the driving force of each motor is called the arm body driving mechanism. In addition, due to the action of the motor M4, it rotates in the direction opposite to the rotation direction of the second arm 29, and the holding device 45 can maintain a posture facing a certain direction. In addition, the following structure is formed, in which each opening of these box-shaped shells is sealed by a cover, and the dust generated by the action of the driving mechanism such as the pulley and belt does not fly to the outside.

[0047] The base cover 23 is installed at a predetermined gap inside the cylinder cover 28 installed on the side of the cylinder 25. The base cover 23 covers the drive unit and electronic components installed on the base 24. The cylinder cover 28 is formed so that even when the cylinder 25 is raised to the highest position, its bottom end is still located below the top end of the base cover 23, so as to prevent dust generated from the motor M1, belt, and pulley mechanism installed on the cylinder 25 and the base 24 from flying to the outside of the atmospheric transport robot 7. In addition, in the transport robot 7 of this embodiment, a joint 40a and a pipe member 44 are provided. The joint 40a is connected to a pipe laid from an inert gas supply source not shown in the figure. The pipe member 44 supplies the inert gas from the joint 40a to the holding device 45. In addition, a filter 40b is provided in the middle of the pipe member 44, and the filter 40b removes dust and impurities included in the inert gas. In addition to the filter 40 b , a temperature regulator for regulating the temperature of the inert gas and an ionizer for performing a static treatment on the inert gas may be provided.

[0048] The transfer robot 7 of this embodiment is connected to a control unit 30, which sends and receives signals with the host PC and controls the operation of each drive unit according to the position data and stepper motor stored by the pre-taught instruction. Figure 3 , Figure 4 The control unit 30 not only controls the operation of the drive unit, but also controls the following, which refers to the control of the electromagnetic valve 55a that switches the supply and isolation of the inert gas, the temperature regulator, the ionizer, etc., which are sent from the electrical components installed in the conveying robot 7 to maintain a suitable state. In addition, the filter 40b of the conveying robot 7 of this embodiment is made of polytetrafluoroethylene (PTFE) and can filter more than 99% of 0.01 micron dust contained in the inert gas. In addition, the filter 40b is not limited to being installed on the main body of the conveying robot 7, but can also be installed inside the wrist block 21.

[0049] Refer to the following Figure 6 , FOUP 2 is described as an example of a sealable container. Figure 6 FOUP 2 is a three-dimensional diagram showing a FOUP 2. FOUP 2 is a sealable container for isolating semiconductor wafers W as received objects from a low-cleanliness external atmosphere by maintaining a highly clean atmosphere inside the container, and for transporting semiconductor wafers W between processing systems 1 disposed inside a clean room. FOUP 2 is composed of a sealable carrier 31, which is a box-shaped container for receiving semiconductor wafers W inside the carrier 31, and a cover 32, and the cover 32 seals the open surface opened in the carrier 31 in an airtight manner. In addition, a plurality of shelf plates 33 are formed on the inner wall of the carrier 31 in a manner spaced at predetermined intervals in the vertical direction, and the shelf plates 33 are used to load semiconductor wafers W in a horizontal state. The semiconductor wafers W are loaded on each shelf plate 33 with the processed surface facing upward. The cover 32 is provided with a locking mechanism, and the cover 32 and the carrier 31 can be engaged and released by moving the locking member 35 in and out relative to the engagement hole 34 formed on the periphery of the opening of the carrier 31. In addition, the locking mechanism is connected to a latch key 36 provided on the cover 32, and the latch key 36 is rotated in a clockwise or counterclockwise direction, thereby allowing the locking member 35 to move in and out. In this way, the carrier 31 and the cover 32 can be switched between a locked state and an unlocked state by rotating the latch key 36 in a predetermined direction. The rotation of the latch key 36 is performed manually or by a cover opening and closing mechanism 43 of the load port 5 described later.

[0050] A component called a retainer 37 is provided on the surface of the cover 32 facing the carrier 31, and the retainer presses the edge of the semiconductor crystal W received in the carrier 31 in the horizontal direction, thereby restricting the movement of the semiconductor wafer W during the transportation of the FOUP 2. In addition, a suction port 38 and a supply port 39 are provided on the bottom surface of the carrier 31, and the suction port 38 sucks the atmosphere into the inside of the FOUP 2, and the supply port 39 supplies the inert gas into the inside of the FOUP 2. The suction port 38 and the supply port 39 are structures that can replace the atmosphere inside the FOUP 2 with an inert gas atmosphere by connecting to the suction nozzle 38' and the supply nozzle 39' provided on the loading port 5, respectively. In addition, the vertical spacing of the shelf plates 33 formed on the carrier 31 in the FOUP 2 is specified by the SEMI (Semiconducor Equipment and Materials International) standard, which is an international standard in the field of semiconductor manufacturing equipment / materials. In the case of a FOUP 2 that receives a semiconductor wafer W having a diameter of 300 mm, the spacing of the shelf plates 33 is specified to be 10 mm. Assuming that the thickness of the shelf plates 33 of about 1 mm specified by SEMI and the thickness of the semiconductor wafer W of about 0.8 mm are deducted from this value, the vertical dimension of the clean plate 46 and the holding member of the holding device of the present invention is about 8 mm.

[0051] Next, the well-known load port 5 and the load port 5 ′ having a replacement function included in the EFEM 4 of the present embodiment will be described. Figure 7 The figure is a cross-sectional view showing an example of a loading port 5' with a replacement function. The loading port 5 is a device fixed to a support 15 forming a microenvironment space 6, and is used to load the FOUP 2 transported from the previous step, and separate the cover 32 that seals the inside of the FOUP 2 from the carrier 31. The loading port 5 is provided with: a stage 41, which loads the FOUP 2 at a specified position through a positioning mechanism; a FIMS door 42, which is integrated with the cover 32 of the FOUP 2; and a cover opening and closing mechanism 43, which is provided on the FIMS door 42 and rotates the latch key 36 provided on the cover 32. In addition, a driving mechanism not shown in the figure is provided on the stage 41 and the FIMS door 42, respectively, which can move the stage 41 and the FIMS door 42 in a specified direction.

[0052] If FOUP 2 is transported to the stage 41, the loading port 5 moves the stage 41 toward the FIMS door 42 so that the cover 32 abuts against the FIMS door 42. Next, the loading port 5 activates the cover opening and closing mechanism 43 to rotate the latch key 36 provided on the cover 32 until the locking part 35 is in an unlocked state, and then moves the stage 41 or the FIMS door 42 to separate the cover 32 from the carrier 31. Then, for the loading port 5, the FIMS door 42 formed integrally with the cover 32 is lowered to a position where it does not hinder the wafer access operation of the transport robot 7, and the stage 41 loaded with the carrier 31 is moved forward to a position where the transport robot 7 can access the semiconductor wafer W. In addition, if the transport of the processed semiconductor wafer W to the carrier 31 is completed, the loading port 5 activates the stage 41 and the FIMS door 42 to seal the opening of the carrier 31 in an airtight manner through the cover 32.

[0053] The loading port 5' is described below. The loading port 5' not only has the function of the ordinary loading port 5 mentioned above, but also has the function of replacing the interior of FOUP 2 with an inert gas atmosphere by supplying an inert gas to the interior of FOUP 2. At least one loading port 5' with the replacement function is provided. The loading port 5' with the replacement function of this embodiment not only has the structure of the ordinary loading port 5, but also has a suction nozzle 38' and a supply nozzle 39'. The suction nozzle 38' is connected to a suction pump not shown in the figure, and the internal atmosphere of FOUP 2 is sucked through the suction port 38 of FOUP 2. In addition, the supply nozzle 39' is connected to an inert gas source not shown in the figure, and the inert gas is filled in the interior of FOUP 2 through the supply nozzle 39 of FOUP 2. In addition, the following structure is formed, wherein a lifting mechanism is provided inside the platform 41, and the lifting mechanism lifts and lowers the suction nozzle 38' and the supply nozzle 39' respectively. When atmosphere replacement is required, the suction nozzle 38' and the supply nozzle 39' are moved upward to be connected to each port 38, 39. When atmosphere replacement is not required, the suction nozzle 38' and the supply nozzle 39' are moved downward.

[0054] In addition, there is also a type that has a cleaning nozzle 91 in addition to the suction nozzle 38' and the supply nozzle 39'. The cleaning nozzle 91 moves upward to a position facing the open surface of the carrier 31 so that the inert gas fills the inside of the carrier 31. The cleaning nozzle 91 is a box-shaped component, and a spray port is opened at a position facing the open surface of the carrier in the component. The cleaning nozzle 91 is connected to an inert gas supply source not shown in the figure. In addition, it is configured in the following manner: when the transport robot 7 is not close to the carrier 31, it moves upward and supplies the inert gas to the inside of the carrier 31. In addition, it is configured in the following manner: when the transport robot 7 approaches the inside of the carrier 31, the supply of inert gas is stopped and the transport robot 7 is moved downward to a position that does not hinder the movement of the transport robot 7. By using these loading ports 5' with replacement functions, the internal atmosphere of the FOUP 2 that receives the semiconductor wafer W that has been processed is an inert gas atmosphere, and the natural oxidation of the processed surface of the semiconductor wafer W can be prevented. In addition, as another embodiment of the loading port 5' with a replacement function, there is a type in which, for example, a nozzle for spraying an inert gas is provided near the opening portion of the carrier 31, etc. However, the loading port 5' with a replacement function mounted on the EFEM 4 of the present invention is not limited to the above-mentioned embodiment, and may be of any type as long as it is a type that can replace the internal atmosphere of the FOUP 2 with an inert gas atmosphere.

[0055] Next, a holding device 45 with a cleaning function according to an embodiment of the present invention will be described. Figure 8 2 is a diagram showing a holding device 45 according to a first embodiment of the present invention. Figure 8 (a) is a view of the holding device 45 viewed from the top surface, Figure 8(b) is a cross-sectional view of the holding device 45 viewed from the side. The holding device 45 of this embodiment includes: a wrist block 21, which is rotatably fixed to the front end of the second arm 29; a purification plate 46, which sprays inert gas toward the processed surface of the semiconductor wafer W; a holding component 47, which holds the semiconductor wafer W; and a lifting mechanism 48, which lifts and lowers the holding component 47. The purification plate 46 of this embodiment is composed of a cleaning portion 49 and a base 50. The cleaning portion 49 is disc-shaped and has a diameter that is substantially the same as the diameter of the semiconductor wafer W. The base 50 is connected to the cleaning portion 49 and fixed to the wrist block 21. A plurality of injection ports 51 are opened at specified positions on the cleaning portion 49, and the injection ports 51 are used to blow inert gas toward the processed surface of the held semiconductor wafer W. The cleaning section 49 supplies inert gas to the entire processed surface of the semiconductor wafer W while blocking the downstream flow of clean air supplied from the FFU 8. In order to avoid collision with the wall surface of a receiving container such as FOUP 2 when inserted into FOUP 2, the diameter of the cleaning section 49 is substantially the same as the diameter of the semiconductor wafer W.

[0056] The purification plate 46 of this embodiment is composed of two parts, an upper part 46a and a lower part 46b. The upper part 46a is formed with a flow path 52 of an inert gas, and the lower part 46b is formed with a plurality of through holes (injection ports) 51 for injecting the inert gas. The through holes (injection ports) 51 opened in the lower part 46b are provided at a position communicating with the flow path 52 when the upper part 46a and the lower part 46b are attached to each other, and the inert gas supplied to the inside of the flow path 52 is supplied from the through holes 51 toward the processed surface of the semiconductor wafer W. In addition, a joint part 54 is installed at a position communicating with the flow path 52 on the upper part 46a, and the pipe part 44 through which the inert gas flows is connected to the joint part 54 via the electromagnetic valve 55a. The base end of the pipe part 44 is connected to an inert gas supply source not shown in the figure via the joint 40a. The electromagnetic valve 55a is configured to open and close the valve according to a control signal sent from the control unit 30, and the supply and stop of the inert gas supplied from the purification plate 46 are controlled by the signal from the control unit 30. In addition, the material of the purification plate 46 of this embodiment is only anodized aluminum, but the present invention is not limited to this, and it is also possible to use materials such as ceramics, carbon, and engineering plastics.

[0057] In addition, the purification plate 46 of the present invention is not limited to the above-mentioned shape, and can be formed to a degree smaller than the diameter of the substrate to be held, or to a degree larger than the diameter of the substrate to be held so as not to collide with the wall of the wafer receiving container or the wafer loading device. In addition, it is not limited to the disc shape, and it is also possible to form a square, rectangular, or hexagonal shape.

[0058] The holding member 47 of the holding device 45 of the present embodiment is in a substantially Y-shaped shape with two branches at the front end, and a suction hole 56 for vacuum suctioning the semiconductor wafer W is formed at each of the two branches at the front end. The suction hole 56 is connected to a vacuum pump via a vacuum flow path 57 formed inside the holding member 47 and a vacuum tube provided in the transport robot 7. In addition, a solenoid valve (not shown) is provided in the vacuum tube, and the solenoid valve is opened and closed by a control signal sent from the control unit 30.

[0059] In addition, the base end portion of the holding member 47 of the present embodiment is fixed to the lifting member 58 of the lifting mechanism 48 that moves the holding member 47 up and down. Fig. 9 : is a cross-sectional view showing the lifting mechanism 48 of the present embodiment. The lifting mechanism 48 of the present embodiment includes two linear shafts 59, which are erected on the bottom plate of the wrist block 21 in parallel with each other; a lifting member 58, which is installed in a manner that it can move through a linear movable bearing 60 within the surface guided by the linear shaft 59; a feed screw 61, which is arranged in parallel with the linear shaft 59 and is screwed with the lifting member 58; and a motor M5, the drive shaft 53a of which is connected to the base end of the feed screw 61, and the feed screw 61 is rotated by rotating the drive shaft 53a, so that the lifting member 58 is moved up and down. In addition, a substantially L-shaped support member 62 is fixed to the wrist block 21. The top ends of the two linear shafts 59 and the body of the motor M5 are fixed to the surface of the support member 62 arranged parallel to the wrist block 21. In addition, limit sensors 63a and 63b are installed on the surface of the support member 62 which is arranged perpendicularly to the wrist block 21. The limit sensors 63a and 63b are used to detect the rising position and the falling position of the lifting member 58. The limit sensors 63a and 63b are transmissive light sensors which react by receiving the light axis projected from the light projecting part through the light-receiving part. The sensor signaling block 64 installed on the lifting member 58 blocks the light axis as the lifting member 58 moves upward and downward, thereby detecting that the lifting member 58 has reached the limit position.

[0060] The motor M5 and the limit sensors 63a and 63b are electrically connected to the control unit 30 via cables. The control unit 30 causes the lifting component 58 to move up and down by sending a specified action signal to the motor M5. In addition, the sensor signal block 64 of the lifting component 58 detects the situation of blocking the optical axis of the limit sensors 63a and 63b, thereby detecting that the lifting component 58 has reached the limit position and stopping the action of the motor M5. In addition, the following structure is formed, in which the motor M5 of the lifting mechanism 48 of the present embodiment is a stepping motor that can control the rotation angle of the drive shaft 53a, and the control unit 30 can move the lifting component 58 to a specified position with high precision. Through this structure, the control unit 30 can move the lifting component 58 and the retaining component 47 fixed to the lifting component 58 to a specified height position.

[0061] In the lifting mechanism 48 of this embodiment, the following form is formed, wherein the motor M5 is operated to rotate the wrist block 59, so that the lifting component 58 screwed with the linear shaft 59 is lifted and moved, thereby lifting and moving the holding component 47. However, the mechanism for lifting the holding component 47 can also be of other forms. Fig.10 The figure is a cross-sectional view showing a lifting mechanism 66 for lifting and lowering the holding member 47. The lifting mechanism 66 of the present embodiment includes: two linear shafts 59, which are erected on the bottom plate of the wrist block 21 in parallel with each other; a lifting member 58', in which the base end of the holding member 47 is fixed within the surface guided by the linear shaft 59, and the lifting member 58' is installed so as to be movable via a linear motion bearing 60; a biasing member 67, which biases the lifting member 58' in the downward direction as viewed from the drawing; a cam member 68, which displaces the vertical position of the lifting member 58' by rotating; and a motor M6, which rotates the cam member 68. In addition, a substantially L-shaped support member 69 is fixed to the wrist block 21, and the top ends of the two linear shafts 59 are fixed to a surface 69a of the support member 69 which is arranged parallel to the bottom plate of the wrist block 21. In addition, similar to the lifting mechanism 48, limit sensors 63a and 63b are installed on the surface of the support member 69 which is arranged perpendicularly to the bottom surface of the wrist block 21. The limit sensors 63a and 63b are used to detect the rising position and the falling position of the lifting member 58. The limit sensors 63a and 63b are transmissive light sensors which react by receiving the light axis projected from the light projecting part through the light receiving part. The sensor signal block 64 installed on the lifting member 58' blocks the light axis by the lifting and lowering movement of the timing member 58, and detects that the lifting member 58 reaches the limit position.

[0062] The cam components 68 of the lifting mechanism 66 of this embodiment are parallel to the bottom plate of the wrist block 21, and all the cam components 68 are fixed to the two ends of the two cam shafts 70 arranged in parallel to each other so as to be located at the same rotational position. The cam shaft 70 is supported on the bottom plate of the wrist block 21 in a freely rotatable manner via a bearing not shown in the figure. In addition, pulleys of the same diameter are coaxially fixed to one end of the two cam shafts 70. In addition, these pulleys and the pulleys fixed to the drive shaft 53b of the motor M6 are respectively hung with a synchronous belt 71. By this scheme, the drive shaft 53b of the motor M6 rotates, thereby, the two cam shafts 70 rotate in the same direction as the rotation direction of the motor M6. In addition, all the cam components 68 fixed to these two cam shafts 70 rotate in the same direction as the rotation direction of the motor M6. The four cam components 68 of the lifting mechanism 66 of this embodiment are substantially oval plate cams, and the lifting component 58' as a follower performs lifting and lowering motion due to the rotation. In addition, the lifting member 58 ′ is biased downward by the biasing member 67 , and the lifting member 58 ′ can accurately follow the change in the lifting amount caused by the rotation of the cam member 68 through the biasing member 67 .

[0063] Fig.10 (a) is a diagram showing the position of the lifting member 58 when the cam member 68 is located at the first rotational position. The first rotational position is a state in which the lifting member 58 is supported on the peripheral portion of the rotation center axis C closest to the cam member 68. At this time, the lifting member 58 is located at the most descended position relative to the wrist block 21. In addition, at this time, the sensor signal block 64 fixed to the lifting member 58' is located at a position that blocks the optical axis of the limit sensor 63b, and the control unit 30 can recognize that the lifting member 58' and the holding member 47 fixed to the lifting member 58' are located at the most descended position. Fig.10 (b) shows the action of motor M6. Fig.10 The state (a) of the drive shaft 53b is rotated 90 degrees in the counterclockwise direction. At this time, the rotation position of the cam component 68 is the second rotation position, and the lifting component 58 is supported on the peripheral portion of the rotation center axis C farthest from the cam component 68. At this time, the lifting component 58 is located at a position where it is lifted and lowered to the maximum extent relative to the wrist block 21. At this time, the sensor signal block 64 is located at a position that blocks the optical axis of the limit sensor 63a, and the control unit 30 can recognize that the lifting component 58 and the holding component 47 fixed to the lifting component 58 are at the maximum lifting position.

[0064] The motor M6 of the lifting mechanism 66 of this embodiment is a stepping motor that is easy to control the angle, and the control unit 30 can move the lifting member 58' and the holding member 47 fixed to the lifting member 58 to the desired rising position and lowering position within the range of the lifting amount of the cam member 68. In addition, the holding device of the present invention is also possible to have a lifting mechanism of a known mechanism such as a cylinder or an electromagnetic actuator in addition to the lifting mechanism using the feed screw 61 and the cam member 68 described above.

[0065] The wrist block 21 of the present invention is described below. The wrist block 21 is a component that supports the purification plate 46 and the lifting mechanism 48. The purification plate 46 and the lifting mechanism 48 of this embodiment are fixed by screws through the wrist block 21. The wrist block 21 of this embodiment is an aluminum box-shaped component, and its base end is connected to the front end of the arm 22 of the conveying robot 7. Inside the wrist block 21, there are solenoid valves 55a and 55b. The solenoid valve 55a controls the supply and locking of the inactive gas of the purification plate 46, and the solenoid valve 55b opens and closes the vacuum pipeline of the holding component 47. The solenoid valves 55a and 55b of this embodiment are well-known solenoid valves, and the flow paths formed inside the solenoid valves 55a and 55b are blocked or opened by electrical signals sent from the control unit 30 provided inside the conveying robot 7. In the transfer robot 7 of the present embodiment, the solenoid valves 55 a and 55 b are provided inside the wrist block 21 . However, the present invention is not limited thereto and the solenoid valves 55 a and 55 b may be provided inside the main body of the transfer robot 7 or inside the arm 22 .

[0066] The holding device 45 of this embodiment can hold the semiconductor wafer W by sucking the inner surface of the semiconductor wafer W with the holding member 47, and can spray inert gas from the purge plate 46 provided above the holding member 47 toward the surface to be processed, which is the surface of the semiconductor wafer W. The inert gas sprayed from the purge plate 46 toward the semiconductor wafer W fills the inside of the space 65 formed by the purge plate 46 and the semiconductor wafer W, and flows to the outside of the space 65 together with the atmosphere remaining in the space 65. In addition, the inert gas is continuously supplied, so that the atmosphere remaining in the inside of the space 65 and the reaction gas components remaining on the circuit layout of the semiconductor wafer W are discharged to the outside of the space 65 together with the inert gas, thereby replacing the inside of the space 65 with the inert gas atmosphere. In addition, since the inert gas supplied to the inside of the space 65 flows to the outside of the space from the gap between the holding device 45 and the thin plate-shaped substrate W in sequence, the flow of the inert gas flowing to the outside acts as a baffle, and the atmosphere is prevented from invading the surface to be processed, which is the top side of the thin plate-shaped substrate W. Thus, since the space 65 is always maintained in an inert gas atmosphere, it is possible to prevent a natural oxide film from being formed on the processed surface of the thin plate-like substrate W. Figure 8(b).

[0067] In the following, the following action is described as an example, which refers to the action of the holding device 45 of the present embodiment to hold the semiconductor wafer W, spray inert gas toward the processed surface of the semiconductor wafer W, and deliver the semiconductor wafer W' received in the carrier 31 of the FOUP 2. In addition, the operator is taught in advance to the appropriate position for each action position of the transport robot 7 and the holding device 45. The conductor wafer W' that has been processed in the previous step is received in the interior of the FOUP 2 and transported to the loading port 5'. If the FOUP 2 is transported, the loading port 5' is filled with inert gas inside the FOUP 2. If the transport instruction of the semiconductor wafer W' received in the interior of the FOUP 2 is received by the upper computer, the loading port 5 separates the cover 32 of the FOUP 2 from the carrier 31, moves the cover 32 downward, and then moves the carrier 31 to a position accessible to the transport robot 7. Next, the control unit 30 operates the driving mechanisms of the transfer robot 7 to move the holding device 45 to a predetermined position, and then operates the arm 22 to move the holding device 45 forward to a position inside the carrier 31 where the semiconductor wafer W′ can be held.

[0068] Fig.11 (a) is a cross-sectional view showing a state in which the holding device 45 moves forward to the inside of the carrier 31 in order to hold the semiconductor wafer W'. The semiconductor wafer W' to be held is loaded in a horizontal state on a shelf plate 33' formed inside the carrier 31. When the holding device 45 moves forward to the inside of the carrier 31, instructions are given in advance in such a manner that the purification plate 46 is located above the target semiconductor wafer W' at a predetermined interval, and in such a manner that the holding component 47 is located below the target semiconductor wafer W' at a predetermined interval. In addition, at this time, the liftable holding component 47 remains in the first position which is lower than the movable range. If the holding device 45 moves to a predetermined position relative to the semiconductor wafer W', then the control unit 30 activates the motor M5 to raise the holding component 47 to a predetermined second position, and also activates the solenoid valve 55a to start supplying inert gas toward the processed surface of the semiconductor wafer W'. Refer to Fig.11 (b). The ascending position of the holding member 47 is a position where the holding member 47 supports the semiconductor wafer W' supported on the shelf plate 33' instead of the shelf plate 33', and is a position where the semiconductor wafer W' is not in contact with the shelf plate 33' when the holding member 47 moves backward. In addition, it is a position where the top surface of the semiconductor wafer W' does not contact the purification plate 46 and is supported on the holding member 47 at a predetermined interval from the purification plate 46.

[0069] If the upward movement of the holding component 47 is completed, the control unit 30 operates the electromagnetic valve 55b to suction and hold the semiconductor wafer W' on the holding component 47. At this time, the control unit 30 determines whether the holding of the semiconductor wafer W' is normally performed based on the value of a pressure sensor not shown in the figure and provided on the vacuum pump. If it is determined that the holding of the semiconductor wafer W' is normally performed, the control unit 30 operates the arm to move the holding component 47 backward relative to the carrier 31, and operates the various driving mechanisms of the transport robot 7 to transport the semiconductor wafer W' to the destination. Fig.11 (c). When the holding device 45 is moved backward relative to the carrier 31, the carrier port 5' is closed relative to the cover 32 of the FOUP 2, and the supply of the inert gas is reopened inside the carrier port 5'. During the transportation of the semiconductor wafer W', the inert gas is continuously supplied from the purge plate 46, thereby preventing the atmosphere inside the EFEM 4 from reaching the processed surface of the semiconductor wafer W', thereby preventing the formation of a natural oxide film on the processed surface of the semiconductor wafer W'.

[0070] In addition, when the holding member 47 is moved upward, the lifting mechanism of the transport robot 7 is maintained in a stopped state and does not perform an upward movement. The holding device 45 mounted on the arm 22 and the purification plate 46 fixed on the holding device 45 do not move upward, and maintain the position when entering the interior of the carrier 31. Therefore, even if the purification plate 46 has the same diameter as the diameter of the semiconductor wafer W, it does not collide with the shelf plate 33 formed inside the carrier 31. In addition, since it is not necessary to consider the gap of the lifting movement, the thickness of the purification plate 46 can be increased to a degree that it does not contact the gap of the shelf plate 33, thereby improving the strength of the purification plate 46. In addition, since the flow path 52 of the inert gas can be increased, a large amount of inert gas can be supplied to the processed surface of the semiconductor wafer W.

[0071] In addition, the timing of starting the injection of the inactive gas may also be the timing before the holding member 47 lifts the semiconductor wafer W', that is, the timing when the holding device 45 enters the interior of the FOUP 2. In addition, preferably, the interval between the semiconductor wafer W' and the purification plate 46 when the holding member 47 holds the semiconductor wafer W' is an interval at which the semiconductor wafer W' does not contact the purification plate 46 even when the semiconductor wafer W' is vibrated in the vertical direction due to the influence of the vibration of the operation of each driving unit of the operation of the transport robot 7.

[0072] The following is a description of the action of the holding component 47 of the present embodiment when loading the held semiconductor wafer W' onto the shelf plate 33' of the carrier 31. The action of loading the semiconductor wafer W' held by the holding component 47 onto the carrier 31 is performed in a sequence that is substantially opposite to the action of sending out the semiconductor wafer W'. In addition, when the holding device 45 loads the semiconductor wafer W' onto the shelf plate 33' of the carrier 31, the holding component 47 moves to the aforementioned second position. First, the control unit 30 activates each driving mechanism of the transport robot 7 to move the purification plate 46 and the holding component 47 to a pre-taught specified position inside the carrier 31. Refer to Fig.12 (a). In addition, the predetermined position is above the shelf plate 33' on which the semiconductor wafer W' is loaded relative to the purification plate 46 and the holding member 47, separated by a predetermined interval, and the shelf plate 33 located directly above the shelf plate 33' is separated by a predetermined interval below. In addition, the inert gas is supplied from the purification plate 46 toward the processed surface of the semiconductor wafer W'.

[0073] Next, the control unit 30 operates the electromagnetic valve 55b to release the vacuum pressure from sucking the semiconductor wafer W'. Then, the control unit 30 operates the motor M5 to lower the holding member 47 to a predetermined first position. Fig.12 (b). Through the descending action of the holding component 47, the semiconductor wafer W' supported on the holding component 47 is transferred from the holding component 47 to the shelf plate 33'. In addition, during this action, since the lifting mechanism of the transport robot 7 is in a stopped state, the purification plate 46 stays at a position between the shelf plate 33' and the shelf plate 33 directly above it. If the descending action of the holding component 47 is completed, the control unit 30 operates the arm to move the holding component 47 backward relative to the carrier 31, and operates the solenoid valve 55a to stop the supply of inactive gas. Next, the various driving mechanisms of the transport robot 7 of the control unit 30 are operated to move the semiconductor wafer W' to a specified waiting position. Refer to Fig.12 (c).

[0074] Next, a holding device 45 ′ including a clamping type holding member 72 according to another embodiment of the present invention will be described. Fig.13 4 is a diagram showing a holding device 45' according to this embodiment. Fig.13 (a) is a view of the holding device 45' viewed from above, Fig.13(b) is a cross-sectional view of the holding device 45' viewed from the side. The holding component 72 of the holding device 45' is a component for holding the peripheral portion of the semiconductor wafer W, and the base end portion is fixed to the lifting component 58. The holding component 72 includes: a holding component body 72a; an abutment component 72b, the abutment component 72b is fixed to the front end of the holding component body 72a; a clamping component 72c, the clamping component 72c holds and opens the semiconductor wafer W by moving forward and backward relative to the semiconductor wafer W; an advance and retreat mechanism 73, the advance and retreat mechanism 73 causes the clamping component 72c to move forward and backward, and the advance and retreat mechanism 73 includes: an advance and retreat plate 74, on which the base end portion of the clamping component 72c is fixed; a biasing component 75, the biasing component 75 biases the advance and retreat plate 74 in the direction of holding the semiconductor wafer W; and a cylinder 76, the cylinder 76 causes the advance and retreat plate 74 to move in a direction away from the semiconductor wafer W. The biasing member 75 of this embodiment is a compression spring, one end of which is fixed to the lifting member 58', and the other end of which is fixed to the advancing and retreating plate 74. Fig.13 In (a), in order to avoid complexity of the figure, the flow path 52 formed on the purification plate 46 is omitted.

[0075] The cylinder 76 and the compressed air supply source are connected via a pipe, and there is a solenoid valve 55c in the middle, which switches the supply and isolation of compressed air. The solenoid valve 55c is electrically connected to the control unit 30, and the control unit 30 controls the advance and retreat movement of the piston rod of the cylinder 76 by switching the opening and closing of the solenoid valve 55c. The solenoid valve 55c is opened to supply compressed air to the cylinder 76, thereby extending the piston rod of the cylinder 76, so that the advance and retreat plate 74 moves in the direction away from the semiconductor wafer W. Through the extension of the piston rod, the semiconductor wafer W held by the clamping component 72c is released. In addition, the control unit 30 stops the supply of compressed air to the cylinder 76 by closing the solenoid valve 55c, and the piston rod retracts. Through the retraction of the piston rod, the advance and retreat plate 74 is biased in the direction of holding the semiconductor wafer W through the biasing component 75, and the semiconductor wafer W is held by the abutting component 72b and the clamping component 72c.

[0076] In the holding member 72 of the present embodiment, since the semiconductor wafer W is held by clamping the periphery of the semiconductor wafer W through the abutting member 72b and the clamping member 72c having a V-shaped notch, it can be held without contacting the outer surface of the wafer and the inner surface of the wafer as the processed surface of the semiconductor wafer W. Thus, it is possible to prevent the failure of the tiny particles and dust of the reaction gas attached to the inner surface of the wafer from being transferred to the inner surface of other semiconductor wafers W. In addition, since the two abutting members 72b are fixed to the front end of the holding member body 72a at intervals, the clamping member 72c moves forward in the direction of pressing the semiconductor wafer W toward the abutting member 72b, thereby holding the semiconductor wafer W, so the semiconductor wafer W is always positioned at the same position relative to the holding member 72. In addition, by increasing the angle of the V-shaped notch of the abutting member 72b and the clamping member 72c, even in the case of the semiconductor wafer W that is bent due to heat treatment, etc., it can still be held normally. In addition, since the materials of the abutting member 72b and the clamping member 72c are members that abut against the peripheral portion of the semiconductor wafer W, it is best to use a hard synthetic resin material with high wear resistance such as PEEK (polyetheretherketone) material, ultra-high molecular polyethylene, and wear-resistant polyester that generates less fine dust when abutting. In addition, in addition to the above-mentioned holding members 47 and 72, for example, a holding member that holds the shape of the semiconductor wafer W, a so-called Bernoulli chuck that holds the bottom surface of the semiconductor wafer W, and a known holding device can also be applied to the present invention.

[0077] Another embodiment of the inert gas injection port 51 and flow path 52 on the purification plate 46 is described below. The purpose of providing the injection port 51 is to allow the particles of the reaction gas remaining on the processed surface of the semiconductor wafer W and the moisture in the atmosphere to flow to the outside of the processed surface of the semiconductor wafer W through the flow of the inert gas. In addition, the inert gas is filled in the space 65 formed by the bottom surface of the purification plate 46 and the processed surface of the semiconductor wafer W, thereby effectively preventing the atmosphere from invading from the outside of the space 65. The configuration of each injection port 51 can be, for example, arranged in a concentric circle from the center of the semiconductor wafer W constituting the object, or can be arranged in a regular or grid-like manner with a predetermined interval in the front, back, left, and right. In addition, the diameter of each injection port 51 can be increased at the middle part of the semiconductor wafer W, and reduced at the peripheral part. In addition, in the holding device of the present invention, the spacing between the holding parts 47, 72 and the purification plate 46 can be appropriately adjusted in a manner that effectively reduces the displacement of the treated surface and prevents the intrusion of the atmosphere from the outside, and guidance is given in advance.

[0078] Furthermore, in addition to the injection port 51 for supplying the inert gas onto the processing surface of the semiconductor wafer W, another injection port 77 for injecting the inert gas toward the holding members 47 and 72 holding the semiconductor wafer W may be provided. Fig.14 (a) is a diagram showing a purification plate 79 having an injection port 77 and a flow path 78 provided at a position corresponding to the suction-type holding member 47, which are added independently of the injection port 51. Fig.14 (b) is a diagram showing a purification plate 81 having an injection port 77' and a flow path 78 provided at a position corresponding to a clamping type holding member 72, which are independent of the injection port 51. In addition, in order to avoid confusion, the injection ports 77 and 77' provided corresponding to the holding members 47 and 72 are indicated by hatching. In the purification plates 79 and 81 of the present embodiment, injection ports 77 and flow paths 78 and 80 for spraying inert gas toward each holding member 47 and 72 are formed independently of the injection port 51 and the flow path 52 for supplying inert gas to the processed surface of the semiconductor wafer W. A joint member 54' is installed at a position in the purification plates 79 and 81 that is connected to each flow path 78 and 80 on the top surface, so that the pipe member 44 through which the inert gas flows is connected to the joint member 54' via the solenoid valve 55d. The base end of the pipe member 44 is connected to an inert gas supply source not shown in the figure via a joint 44a. The control valve 55d is constructed so as to open and close the valve according to a control signal sent from the control unit 30. The signal from the control unit 30 controls the injection and stopping of the inert gas from the purification plates 79 and 81 toward the respective holding components 47 and 72 independently of the inert gas supplied to the processed surface of the semiconductor wafer W.

[0079] The injection of inert gas to each holding component 47, 72 is performed at the moment when each holding component 47, 72 does not hold the semiconductor wafer W. In addition, the injection ports 77, 77' formed on each purification plate 79, 81 are arranged in such a manner that the inert gas is injected toward the position in contact with the semiconductor wafer W in each holding component 47, 72. Thus, the injection of inert gas can remove the tiny particles and dust of the reaction gas attached to the surface of the holding component 47, 72, which holds the semiconductor wafer W whose processing to the processed surface has just been completed. As a result, the tiny particles and dust attached to the holding components 47, 72 can be prevented from being transferred to other semiconductor wafers W. In addition, the position of each holding component 47, 72 when injecting the inert gas toward the holding component 47, 72 corresponding to each purification plate 79, 81 is pre-taught and stored in the control unit 30.

[0080] In addition, in the purification plates 79 and 81 of the present embodiment, the supply lines for spraying inert gas to the spray port 51 and the spray ports 77 and 77' are formed in a separate system, the spray port 51 sprays inert gas to the processed surface of the semiconductor wafer W, and the spray ports 77 and 77' spray inert gas to each holding member 47 and 72, but the supply lines for spraying inert gas to these spray ports 77 and 77' and the spray port 51 may be unified into one. In this case, the arrangement of the spray port 51 for spraying inert gas to the processed surface of the semiconductor wafer W may be arranged to correspond to the arrangement of the holding members 47 and 72. Fig.15 (a) is a diagram showing the injection port 77 and the injection port 51 and the purification plate 79', wherein the injection port 77 corresponds to the holding member 47, the injection port 51 injects an inert gas toward the semiconductor wafer W, and a flow path 52' for supplying the inert gas to these injection ports 77 and 51 is formed in the purification plate 79'. In addition, Fig.15 (b) is a diagram showing the following injection port 77' and injection port 51 and purification plate 81', wherein the injection port 77' and injection port 51 correspond to the retaining component 72, and in the purification plate 81', a flow path 52' is formed for supplying inert gas to these 77', 51. The flow paths 52', 52" are constructed in a manner that can supply inert gas to all of the injection ports 51, 77, 77' formed in the purification plates 79', 81', thereby preventing the internal structure of the purification plates 79', 81' from becoming complicated.

[0081] In the holding devices 45 and 45' of the above-described embodiments, a first lifting mechanism is formed in which the purification plate 46 is fixed to the wrist block 21 and the holding members 47 and 72 are lifted and moved by the lifting mechanisms 48 and 66. However, a second lifting mechanism may be formed in which the holding members 47 and 72 are fixed to the wrist block 21 and the purification plate 46 is lifted and moved by the lifting mechanisms 48 and 66. In the case of the second lifting mechanism, the lifting action for mounting the semiconductor wafer W on the shelf plate 33 is performed by the action of the motor M1 of the lifting unit of the transport robot 7. In addition, by operating the lifting mechanisms 48 and 66 in a direction that offsets the lifting action of the transport robot 7 in conjunction with the action of the motor M1, the purification plate 46 can be positioned at a certain position in the vertical direction.

[0082] Fig.16 1 is a diagram showing the operation of the holding device 45" of the present embodiment when lifting and delivering the semiconductor wafer W' loaded on the shelf 33' of the carrier 31. Fig.17This is a diagram showing the action when the semiconductor wafer W' held by the holding device 45" is loaded onto the shelf plate 33'. In addition, the holding device 45" of the present embodiment is described as a type having a holding component 72 that holds the semiconductor wafer W' by gripping it. In order to deliver the semiconductor wafer W' from the carrier 31, first, the control unit 30 moves the holding device 45" in the following manner: the purification plate 46 is located at a specified position above the semiconductor wafer W' to be delivered, and the holding component 72 is located at a specified position below the semiconductor wafer W'. Refer to Fig.16 (a). In addition, the control unit 30 operates the motor M1 of the transport robot 7, so that the arm 22 and the wrist block 21 and the holding component 72 fixed to the wrist block 21 move upward, and the semiconductor wafer W' supported on the shelf plate 33' is supported on the holding component 72. In addition, the control unit 30 operates the lifting mechanism 48, 66 in conjunction with the upward movement of the holding component 72, so that the purification plate 46 moves downward at the same speed as the upward movement speed of the holding component 72. Fig.16 (b). Through this action, the purification plate 46 maintains the state of being positioned at a predetermined position between the shelf plate 33' and the shelf plate 33 directly above it. Next, after the semiconductor wafer W' is held by the holding mechanism of the holding component 72, the control unit 30 operates the arm 22 to move the holding device 45" backward relative to the carrier 31, and then operates each driving mechanism of the transport robot 7 to transport the semiconductor wafer W' to the predetermined transport destination. Fig.16 (c) Through the above-mentioned operation, the conveying action of the semiconductor wafer W' relative to the carrier 31 is completed.

[0083] In addition, the order of delivering the semiconductor wafer W' held by the holding device 45" into the carrier 31 is basically the opposite order of the above-mentioned delivery process. First, the control unit 30 operates each driving mechanism of the transport robot 7 holding the semiconductor wafer W' to move the purification plate 46 and the holding member 72 to the pre-taught specified position inside the carrier 31. Fig.17 (a). In addition, the prescribed position is the same as in other embodiments, that is, the purge plate 46 and the holding member 72 are located above the shelf plate 33' on which the semiconductor wafer W' is loaded, separated by a prescribed interval, and are located below the shelf plate 33 located directly above the shelf plate 33', separated by a prescribed interval. In addition, when the transport robot 7 holds the semiconductor wafer W', the inactive gas is sprayed from the purge plate 46 toward the processed surface of the semiconductor wafer W'.

[0084] Next, the control unit 30 operates the advance / retract mechanism 73 of the holding member 72 to release the clamping of the semiconductor wafer W', and then operates the motor M1 to move the holding device 45" downward to a predetermined position. In addition, in conjunction with the downward movement of the holding member 72, the control unit 30 operates the lifting mechanisms 48 and 66 to move the purification plate 46 upward at the same speed as the upward movement speed of the holding member 72. Fig.17 (b). By the descending movement of the holding device 45", the semiconductor wafer W' supported on the holding part 72 is transferred to the shelf plate 33'. In addition, by the ascending movement of the purification plate 46, the purification plate 46 maintains the state of being positioned at a specified position between the shelf plate 33' and the shelf plate 33 directly above it. If the descending movement of the holding device 45" is completed, the control unit 30 operates the arm 22 to move the holding device 45" backward from the carrier 31, and stops the supply of the inactive gas. Next, the control unit 30 operates each driving mechanism of the transport robot 7 to move the semiconductor wafer W' to a specified waiting position. Refer to Fig.17 Through the above operations, the operation of feeding the semiconductor wafer W' into the carrier 31 is completed.

[0085] As described above, the purification plate 46 is installed on the lifting mechanism 48, 66 so that it can be lifted and moved. The purification plate 46 can be lifted and moved in the direction of offsetting the lifting movement of the lifting mechanism of the conveying robot 7 by linkage with the action of the lifting mechanism of the conveying robot 7, thereby loading and lifting the semiconductor wafer W' in a state where the purification plate 46 is positioned at a predetermined position. Since the purification plate 46 can be lifted and moved by forming a structure in which the purification plate 46 can be lifted and moved, it is not necessary to lift and move the parts of the mechanism such as the clamping holding member 72, so the structure of the lifting mechanism 48, 66 can be simplified. In addition, since the lifting mechanism 48, 66 does not need to lift the object of the total weight of the holding member 72 and the semiconductor wafer W, which are heavy due to the cylinder 76, etc., but only the purification plate 46, which is light in weight, can be lifted and moved, the lifting mechanism 48, 66 can be further miniaturized and lightweight.

[0086] In the above embodiment, the lifting mechanism 48, 66 lifts and moves any one of the purification plate 46 or the holding member 47, 72, but two lifting mechanisms 48, 66 may be provided, each lifting mechanism separately lifting and moving the purification plate 46 and the holding member 47, 72. In addition, the purification plate 46 and the holding member 47, 72 may be lifted and moved simultaneously by one lifting mechanism 88. Fig.18: is a diagram showing the action of the lifting mechanism 88. The lifting mechanism 88 of the present embodiment includes a feed screw 90 that moves the lifting components 58 and 59 in opposite directions, and the lifting components 58 and 59 that mesh in the corresponding screw directions are arranged on the feed screw 90. Thus, by the clockwise or counterclockwise rotation of the drive shaft of the motor M5, the lifting components 58 and 59, the retaining components 47 and the purification plate 46 fixed to each lifting component move in a direction approaching each other or in a direction away from each other. In addition, the embodiment with the feed screw 90 is an example, and for example, a well-known connecting rod mechanism or the like may also be adopted. By forming the above-mentioned scheme, the carrier 31, the retaining components 47, 72 and the purification plate 46 of the spacing body relative to the vertical direction of the shelf plate 33 can be easily approached.

[0087] In addition, the holding device 45 of the present invention is not limited to the transport robot 7 having a structure capable of driving the arms 26, 29 and the wrist block 21 separately, but can be installed on various forms of transport robots for use. Fig.19 The transport robot 7a is a transport robot 7a as shown in (a). The transport robot 7a is a so-called selective compliance assembly robot arm (skara) type double-arm robot. Two transport robots 7a are provided in a left-right symmetrical manner according to an arm body 22' composed of a bottom side arm 82 and a top side arm 83, and a retaining device 45 as an embodiment of the present invention is rotatably installed at the front end of the corresponding arm body 22'. In addition, the cylinder 84 of the transport robot 7a is a structure that can be lifted and moved relative to the base 85 and rotated in the horizontal plane. The base end of the bottom side arm 82 is rotatably mounted on the cylinder, the base end of the top side arm 83 is rotatably mounted at the front end of the bottom side arm 82, and the retaining device 45 is rotatably mounted at the front end of the top side arm 83. The bottom arm 82, top arm 83 and holding device 45 are connected at a predetermined rotation ratio by belts and pulleys not shown in the figure, thereby the arm body 22' is flexed and extended, thereby making the holding device 45 move forward and backward in a straight line.

[0088] In addition, it can also be used with Fig.19The transport robot 7b is provided with a linear sliding mechanism 86 as in (b). The transport robot 7b is composed of a linear sliding mechanism 86 and a holding device 45. The linear sliding mechanism 86 is fixed on a cylinder 84. The cylinder 84 can be lifted and lowered relative to a base 85 and can rotate in a horizontal plane. The holding device 45 is mounted on a bracket 87. The bracket 87 is fixed to two movable parts of the linear sliding mechanism 86 in a symmetrical manner. On these transport robots 7a and 7b, two holding devices 45 are provided in the same plane and spaced apart in the vertical direction. Thus, the corresponding holding devices 45 can be moved forward and backward respectively. In addition, the holding devices 45, 45', 45" of the present invention can also be used for transport robots of forms other than the above-mentioned transport robots 7, 7a, 7b.

[0089] As mentioned above, the retaining devices 45, 45', 45" of the present invention have been described according to the embodiments. However, the scope of the present invention is not limited thereto, and various modifications can be made without departing from the spirit of the present invention.

[0090] Description of the label:

[0091] Reference numeral 1 denotes a processing system;

[0092] Reference numeral 2 indicates FOUP;

[0093] Reference numeral 3 denotes a processing device;

[0094] Reference numeral 4 indicates EFEM;

[0095] Reference numeral 5 denotes a loading port;

[0096] Reference numeral 5' denotes a load port with a replacement function;

[0097] Reference numeral 6 represents a microenvironment space;

[0098] Reference numerals 7, 7a, 7b denote transport robots;

[0099] Reference numeral 8 indicates FFU;

[0100] Reference numeral 9 denotes a transport chamber;

[0101] Reference numeral 10 denotes a vacuum transport robot;

[0102] Reference numeral 11 denotes a processing chamber;

[0103] Reference numeral 12 denotes a load lock chamber;

[0104] Reference numeral 13 denotes a slit valve;

[0105] Reference numeral 14 denotes a gate valve;

[0106] Reference numeral 15 denotes a bracket;

[0107] Reference numeral 16 denotes a wall member;

[0108] Reference numeral 17 denotes a fan;

[0109] Reference numeral 18 denotes a filter;

[0110] Reference numerals 19 and 87 denote brackets;

[0111] Reference numeral 20 denotes a plate;

[0112] Reference numeral 21 denotes a wrist block;

[0113] Reference numerals 22 and 22' denote arm bodies;

[0114] Reference numeral 23 denotes a base housing;

[0115] Reference numerals 24 and 85 denote a base;

[0116] Reference numeral 25 denotes a barrel portion;

[0117] Reference numeral 26 denotes the first arm;

[0118] Reference numeral 27 denotes a cylinder arm;

[0119] Reference numeral 28 denotes a cylinder outer cover;

[0120] Reference numeral 29 denotes the second arm;

[0121] Reference numeral 30 denotes a control unit;

[0122] Reference numeral 31 denotes a carrier;

[0123] Reference numeral 32 denotes a cover;

[0124] Reference numerals 33 and 33' denote shelf boards;

[0125] Reference numeral 34 denotes a hole;

[0126] Reference numeral 35 denotes a locking member;

[0127] Reference numeral 36 denotes a latch key;

[0128] Reference numeral 37 denotes a retaining member;

[0129] Reference numeral 38 denotes an air intake port;

[0130] Reference numeral 38 'represents an air suction nozzle;

[0131] Reference numeral 39 denotes a supply port;

[0132] Reference numeral 39 'denotes a supply nozzle;

[0133] Reference numeral 40a denotes a joint;

[0134] Reference numeral 40b denotes a filter;

[0135] Reference numeral 41 denotes a station;

[0136] Reference numeral 42 denotes a FIMS door;

[0137] Reference numeral 43 denotes a cover opening and closing mechanism;

[0138] Reference numeral 44 denotes a pipe member;

[0139] Reference numerals 45, 45', 45" denote retaining devices;

[0140] Reference numerals 46, 79, 79', 81, 81' denote purification plates;

[0141] Reference numeral 46a denotes an upper member;

[0142] Reference numeral 46b denotes a lower member;

[0143] Reference numerals 47 and 72 denote retaining members;

[0144] Reference numerals 48, 66, and 88 denote lifting mechanisms;

[0145] Reference numeral 49 denotes a cleaning portion;

[0146] Reference numerals 50 and 55 denote bases;

[0147] Reference numerals 51, 77, 77' denote injection ports;

[0148] Reference numerals 52, 52', 52", 78, and 80 denote flow paths;

[0149] Reference numerals 53, 53a, 53b denote drive shafts;

[0150] Reference numerals 54 and 54' denote joint components;

[0151] Reference numerals 55a, 55b, 55c, and 55d denote solenoid valves;

[0152] Reference numeral 56 denotes a suction connection hole;

[0153] Reference numeral 57 denotes a vacuum flow path;

[0154] Reference numerals 58, 58', and 89 denote lifting components;

[0155] Reference numeral 59 denotes a linear axis;

[0156] Reference numeral 60 denotes a linear motion bearing;

[0157] Reference numerals 61 and 90 denote feed screws;

[0158] Reference numerals 62 and 69 denote supporting members;

[0159] Reference numerals 63a and 63b denote limit sensors;

[0160] Reference numeral 64 denotes a sensor signal transmission block;

[0161] Reference numeral 65 denotes a space;

[0162] Reference numerals 67 and 75 denote biasing members;

[0163] Reference numeral 68 denotes a cam member;

[0164] Reference numeral 69a denotes a surface;

[0165] Reference numeral 70 denotes a camshaft;

[0166] Reference numeral 71 denotes a synchronous belt;

[0167] Reference numeral 72a denotes a retaining member body;

[0168] Reference numeral 72b denotes an abutment member;

[0169] Reference numeral 72c denotes a clamping member;

[0170] Reference numeral 73 denotes an advance and retreat mechanism;

[0171] Reference numeral 74 denotes an advance and retreat plate;

[0172] Reference numeral 76 denotes a cylinder;

[0173] Reference numeral 82 denotes a lower side arm;

[0174] Reference numeral 83 denotes an upper arm;

[0175] Reference numeral 84 denotes a cylinder;

[0176] Reference numeral 86 denotes a linear sliding mechanism;

[0177] Reference numeral 91 denotes a cleaning nozzle;

[0178] Symbol C represents the central axis of rotation;

[0179] Symbols M1, M2, M3, M4, M5, and M6 represent motors;

[0180] Symbols W and W' denote semiconductor wafers.

Claims

1. A thin plate substrate holding device, characterized in that: The thin plate-shaped substrate holding device comprises: a purification plate having a flow path formed inside the purification plate for circulating an inactive gas; a pipe member that connects an inert gas supply source to the flow path; an injection port, the injection port being connected to the flow path and being provided on a surface of the purification plate facing the surface to be processed of the thin plate-shaped substrate; A holding member, which is disposed at a position facing the purification plate and holds the thin plate-shaped substrate; a first lifting mechanism, the first lifting mechanism causing the holding member to move up and down relative to the purification plate, The above-mentioned purification plate has an outer dimension that can enter the gap in the vertical direction of multiple shelf plates. The multiple shelf plates are horizontally formed in a receiving container for receiving the above-mentioned thin plate-like substrate. The purification plate enters the above-mentioned vertical gap without contacting the above-mentioned thin plate-like substrate, and the above-mentioned retaining component and the above-mentioned purification plate are brought close to or away from each other through the above-mentioned first lifting mechanism.

2. A thin plate substrate holding device, characterized in that: The thin plate-shaped substrate holding device comprises: a purification plate having a flow path formed inside the purification plate for circulating an inactive gas; a pipe member that connects an inert gas supply source to the flow path; an injection port, the injection port being connected to the flow path and being provided on a surface of the purification plate facing the surface to be processed of the thin plate-shaped substrate; A holding member, which is disposed at a position facing the purification plate and holds the thin plate-shaped substrate; a second lifting mechanism, the second lifting mechanism causing the purification plate to move upward and downward relative to the holding member, The above-mentioned purification plate has an outer dimension that can enter the gap in the vertical direction of multiple shelf plates. The multiple shelf plates are horizontally formed in a receiving container for receiving the above-mentioned thin plate-like substrate. The purification plate enters the above-mentioned vertical gap without contacting the above-mentioned thin plate-like substrate, and the above-mentioned retaining component and the above-mentioned purification plate are brought close to or away from each other through the above-mentioned second lifting mechanism.

3. A thin plate substrate holding device, characterized in that: The thin plate-shaped substrate holding device comprises: a purification plate having a flow path formed inside the purification plate for circulating an inactive gas; a pipe member that connects an inert gas supply source to the flow path; an injection port, the injection port being communicated with the flow path and being provided on a surface of the purification plate facing the surface to be processed of the thin plate-shaped substrate; A holding member, which is disposed at a position facing the purification plate and holds the thin plate-shaped substrate; a third lifting mechanism, which causes the holding member and the purification plate to move upward and downward; The above-mentioned purification plate has an outer dimension that can enter the gap in the vertical direction of multiple shelf plates. The multiple shelf plates are horizontally formed in a receiving container for receiving the above-mentioned thin plate-like substrate. The purification plate enters the above-mentioned vertical gap without contacting the above-mentioned thin plate-like substrate, and the above-mentioned retaining component and the above-mentioned purification plate are brought close to or away from each other through the above-mentioned third lifting mechanism.

4. The thin plate-shaped substrate holding device according to any one of claims 1 to 3, characterized in that: The holding member holds the thin plate-like substrate by suction from below.

5. The thin plate-shaped substrate holding device according to any one of claims 1 to 3, characterized in that: The holding member holds the peripheral edge of the thin plate-like substrate.

6. The thin plate-shaped substrate holding device according to any one of claims 1 to 5, characterized in that: The injection port is formed in a plurality on the purification plate, and a part of the plurality of injection ports is provided corresponding to a position where the holding member is provided.

7. The thin plate-shaped substrate holding device according to any one of claims 1 to 6, characterized in that: The injection port is formed in a plurality on the purification plate, and at least a part of the plurality of injection ports is provided to be inclined toward the outside of the held thin plate-shaped substrate.

8. A thin plate substrate transport robot, characterized in that: The thin plate-shaped substrate conveying robot comprises: The thin plate-shaped substrate holding device according to any one of claims 1 to 7; An advance and retreat device, which enables the thin plate-shaped substrate holding device to move forward and backward; A slewing mechanism, which enables the advance and retreat mechanism to slew in a horizontal plane; A lifting mechanism is provided to enable the above-mentioned advancing and retreating mechanism to move upward and downward.

9. The thin plate-shaped substrate transport robot according to claim 8, characterized in that: The thin plate-shaped substrate transport robot further includes a pressure accumulator.

10. A thin plate substrate conveying device, characterized in that: The thin plate-shaped substrate conveying device comprises: a transport space in which a thin plate-shaped substrate transport robot according to any one of claims 8 to 9 is arranged; a transport space forming member, the transport space forming member forming the transport space; A closed container opening and closing device, which is fixed to the transport space forming member, loads the closed container receiving the thin plate-like substrate at a predetermined position, and opens and closes the closed container; The FFU is fixed to the upper portion of the transfer space forming member and supplies the clean space as a downstream to the transfer space.

11. The thin plate-like substrate conveying device according to claim 10, characterized in that: The closed container opening and closing device includes an atmosphere replacement device that can replace the interior of the closed container with a predetermined atmosphere.

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