A flexible circuit board and a method for manufacturing the same

Abstract

The invention discloses a flexible circuit board and a manufacturing method thereof. The flexible circuit board adopts a transparent polyester film as a substrate. When the flexible circuit board corrodes copper foil to form a circuit, corresponding light-transmitting areas are reserved on the front and back sides respectively. An LED lamp is welded and fixed at the light-transmitting area on the back side of the flexible circuit board. When the flexible circuit board is powered on, the light of the LED lamp can directly pass through the transparent polyester film to irradiate the front side of the flexible circuit board. The flexible circuit board of the invention adopts a transparent polyester film as a substrate, so that the light of the designed lamp can directly pass through the transparent polyester film to irradiate the front side of the flexible circuit board, and there is no need to punch light-transmitting holes on the flexible circuit board, thereby reducing the production process, improving the production efficiency and reducing the cost.

Description

Technical Field

[0001] The present invention relates to the field of electronic products, in particular to a flexible circuit board and a manufacturing method thereof, which does not require punching of light-transmitting holes on the flexible circuit board and reduces the production process. Background Art

[0002] Flexible printed circuit (FPC), also known as soft circuit board, flexible circuit board, is popular for its excellent characteristics such as light weight, thin thickness, free bending and folding. In order to save space on flexible circuit boards, LED lights are generally set on the back of flexible circuit boards, but light needs to be transmitted to the front of the flexible circuit boards, such as Figure 1 and 2 As shown, the existing flexible circuit board usually uses polyimide 11 as the substrate, but the polyimide 11 is generally yellow and has poor light transmittance. When etching the circuit of the flexible circuit board, it is necessary to reserve a drilling area 13 on the back, and drill a through hole 12 at the drilling area 13, and then install an LED lamp in the through hole 12; the existing method of making a flexible circuit board is as follows:

[0003] S1: Cutting: Use a cutting machine to cut the corresponding size of the substrate as required;

[0004] S2: Drilling conductive hole 4: Drilling conductive hole 4 on the substrate according to the program;

[0005] S3: Copper plating in the hole: copper is plated in the conductive hole 4 to make the upper and lower parts conductive;

[0006] S4: Layout of circuits: Copper foils are attached to the front and back sides of the substrate and the copper foils are etched to form circuits according to the work order requirements. At the same time, a drilling area 13 is reserved in the copper foil area on the front side of the substrate;

[0007] S5: CVL (cover film) bonding: stick the prepared CVL to the substrate with the circuit already prepared;

[0008] S6: CVL pressing: Press the CVL-attached product (i.e. the substrate with CVL attached) with a fast pressing machine according to the required parameters;

[0009] S7: Baking: Baking (i.e. curing) the pressed CVL product in an oven at the required temperature and time;

[0010] S8: Punch positioning holes: Punch the positioning holes required for the subsequent process according to the program;

[0011] S9: Surface treatment: Surface treatment is performed on the copper surface as required;

[0012] S10: Reinforcement and lamination: Lay the reinforcement of corresponding thickness to the corresponding area of ​​the product as required;

[0013] S11: Reinforcement and pressing: Press the reinforced products with a fast pressing machine according to the required parameters;

[0014] S12: Reinforcement baking: bake the pressed and reinforced product in an oven at the required temperature and time (i.e., curing);

[0015] S13: Punching: Punching a through hole 12 that needs to be transparent in the drilling area 13 using a mold;

[0016] S14: welding: welding the LED lamp to the through hole 12;

[0017] S15: Glue: Glue the corresponding glue onto the product;

[0018] S16: Molding: Molding the product into a set shape.

[0019] The above-mentioned method for manufacturing the flexible circuit board has the problems of more steps, low production efficiency and high cost.

[0020] To this end, we have developed a flexible circuit board and a manufacturing method thereof that does not require punching light-transmitting holes on the flexible circuit board, thereby reducing the production process. Summary of the invention

[0021] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a flexible circuit board and a manufacturing method thereof which does not require punching light-transmitting holes on the flexible circuit board and reduces the production process.

[0022] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a flexible circuit board, which adopts a transparent polyester film as a substrate, and when the copper foil of the flexible circuit board is corroded to form a circuit, corresponding light-transmitting areas are reserved on the front and back sides respectively; an LED lamp is welded and fixed to the light-transmitting area on the back side of the flexible circuit board; when the flexible circuit board is powered on, the light of the LED lamp can directly shine through the transparent polyester film to the front side of the flexible circuit board.

[0023] Preferably, the following steps are included:

[0024] S1: Cutting: Use a cutting machine to cut the substrate of corresponding size as required;

[0025] S2: Drilling conductive holes: Drilling conductive holes on the substrate according to the program;

[0026] S3: Copper plating in the hole: Copper is plated in the conductive hole to make it conductive from top to bottom;

[0027] S4: Layout of circuits: Attach copper foil to the front and back sides of the substrate and etch the copper foil to form circuits according to the work order requirements. At the same time, corresponding light-transmitting areas are reserved at the copper foil on the front and back sides of the substrate respectively;

[0028] S5: CVL (cover film) bonding: stick the prepared CVL to the substrate with the circuit already prepared;

[0029] S6: CVL pressing: Press the CVL-attached product (i.e. the substrate with CVL attached) with a fast pressing machine according to the required parameters;

[0030] S7: Baking: Baking (i.e. curing) the pressed CVL product in an oven at the required temperature and time;

[0031] S8: Punch positioning holes: Punch the positioning holes required for the subsequent process according to the program;

[0032] S9: Surface treatment: Surface treatment is performed on the copper surface as required;

[0033] S10: Reinforcement and lamination: Lay the reinforcement of corresponding thickness to the corresponding area of ​​the product as required;

[0034] S11: Reinforcement and pressing: Press the reinforced products with a fast pressing machine according to the required parameters;

[0035] S12: Reinforcement baking: bake the pressed and reinforced product in an oven at the required temperature and time (i.e., curing);

[0036] S13: Fixing: welding and fixing the LED lamp to the light-transmitting area on the back of the substrate;

[0037] S14: Glue: Glue the corresponding glue onto the product;

[0038] S15: Molding: Molding the product into a set shape.

[0039] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0040] The flexible circuit board of the present invention uses a transparent polyester film as a substrate, so that the light of the designed lamp can directly pass through the transparent polyester film to irradiate the front side of the flexible circuit board, without punching light holes on the flexible circuit board, thus reducing the production process, improving production efficiency and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a front schematic diagram of an existing flexible circuit board;

[0042] Figure 2 It is a schematic diagram of the back side of an existing flexible circuit board;

[0043] Figure 3 It is a front schematic diagram of the flexible circuit board of the present invention;

[0044] Figure 4This is a schematic diagram of the back side of the flexible circuit board of the present invention;

[0045] Among them: 1. polyester film; 2. light-transmitting area; 3. circuit; 4. conductive hole; 11. polyimide; 12. through hole; 13. drilling area. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present invention will be described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0047] See also Figure 3-4 The flexible circuit board of the present invention adopts a transparent polyester film 1 as a substrate. When the copper foil of the flexible circuit board is corroded to form a circuit, corresponding light-transmitting areas 2 are reserved on the front and back sides respectively; an LED lamp is welded and fixed at the light-transmitting area 2 on the back side of the flexible circuit board; when the flexible circuit board is powered on, the light of the LED lamp can directly shine through the transparent polyester film 1 to the front side of the flexible circuit board.

[0048] The method for manufacturing a flexible circuit board of the present invention comprises the following steps:

[0049] S1: Cutting: Use a cutting machine to cut the substrate of corresponding size as required;

[0050] S2: Drilling conductive hole 4: Drilling conductive hole 4 on the substrate according to the program;

[0051] S3: Copper plating in the hole: copper is plated in the conductive hole 4 to make the upper and lower parts conductive;

[0052] S4: Layout of circuits: Attach copper foil to the front and back sides of the substrate and etch the copper foil to form circuits according to the work order requirements. At the same time, corresponding light-transmitting areas are reserved at the copper foil on the front and back sides of the substrate respectively;

[0053] S5: CVL (cover film) bonding: stick the prepared CVL to the substrate with the circuit already prepared;

[0054] S6: CVL pressing: Press the CVL-attached product (i.e. the substrate with CVL attached) with a fast pressing machine according to the required parameters;

[0055] S7: Baking: Baking (i.e. curing) the pressed CVL product in an oven at the required temperature and time;

[0056] S8: Punch positioning holes: Punch the positioning holes required for the subsequent process according to the program;

[0057] S9: Surface treatment: Surface treatment is performed on the copper surface as required;

[0058] S10: Reinforcement and lamination: Lay the reinforcement of corresponding thickness to the corresponding area of ​​the product as required;

[0059] S11: Reinforcement and pressing: Press the reinforced products with a fast pressing machine according to the required parameters;

[0060] S12: Reinforcement baking: bake the pressed and reinforced product in an oven at the required temperature and time (i.e., curing);

[0061] S13: welding: welding and fixing the LED lamp to the light-transmitting area 2 on the back of the substrate;

[0062] S14: Glue: Glue the corresponding glue onto the product;

[0063] S15: Molding: Molding the product into a set shape.

[0064] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0065] The flexible circuit board of the present invention uses a transparent polyester film as a substrate, so that the light of the designed lamp can directly pass through the transparent polyester film to irradiate the front side of the flexible circuit board, without punching light holes on the flexible circuit board, thus reducing the production process, improving production efficiency and reducing costs.

[0066] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it. They cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A flexible circuit board and a method for manufacturing the same, characterized in that: The flexible circuit board uses a transparent polyester film as a substrate. When the copper foil of the flexible circuit board is corroded to form a circuit, corresponding light-transmitting areas are reserved on the front and back sides respectively. An LED lamp is welded and fixed to the light-transmitting area on the back side of the flexible circuit board. When the flexible circuit board is powered on, the light of the LED lamp directly shines through the transparent polyester film to the front side of the flexible circuit board. The manufacturing method of the flexible circuit board comprises the following steps: S1: Cutting: Use a cutting machine to cut the substrate of corresponding size as required: transparent polyester film; S2: Drilling conductive holes: Drilling conductive holes on the substrate according to the program; S3: Copper plating in the hole: Copper is plated in the conductive hole to make it conductive from top to bottom; S4: Layout of circuits: Attach copper foil to the front and back sides of the substrate and etch the copper foil to form circuits according to the work order requirements. At the same time, corresponding light-transmitting areas are reserved in the copper foil areas on the front and back sides of the substrate respectively; S5: CVL cover film lamination: Lay the prepared CVL onto the substrate with the circuit already prepared; S6: CVL pressing: Press the CVL products with a fast pressing machine according to the required parameters; S7: Baking: The pressed CVL product is baked and cured in an oven at the required temperature and time; S8: Punch positioning holes: Punch the positioning holes required for the subsequent process according to the program; S9: Surface treatment: Surface treatment is performed on the copper surface as required; S10: Reinforcement and lamination: Lay the reinforcement of corresponding thickness to the corresponding area of ​​the product as required; S11: Reinforcement and pressing: Press the reinforced products with a fast pressing machine according to the required parameters; S12: Reinforcement baking: The pressed and reinforced product is baked and cured in an oven at the required temperature and time; S13: Fixing: welding and fixing the LED lamp to the light-transmitting area on the back of the substrate; S14: Glue: Glue the corresponding glue onto the product; S15: Molding: Molding the product into a set shape.

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