Display device

Abstract

A display device is provided, the display device comprising a display panel and a touch sensing unit located on the display panel, wherein the display panel comprises a substrate layer, a circuit layer located on the substrate layer, an organic light-emitting device layer located on the circuit layer, and a thin film encapsulation layer located on the organic light-emitting device layer, and the touch sensing unit comprises a first conductive pattern located on the display panel, an insulating layer covering the first conductive pattern, and a second conductive pattern. The second conductive pattern is located on the insulating layer, partially intersecting with the first conductive pattern and having a thickness greater than that of the first conductive pattern. The thin film encapsulation layer comprises at least one inorganic thin layer and at least one organic thin layer.

Description

[0001] This application is a divisional application of invention patent application No. 201811442461.9, with the invention name “Display Device”, filed with the China Intellectual Property Office on November 29, 2018. Technical Field

[0002] The present disclosure relates to a display device capable of preventing cracks in an insulating layer included in a touch sensing unit. Background Art

[0003] In the information society, the importance of display devices as visual information transmission media is further highlighted. As display devices, liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting displays (OLEDs), field effect displays (FEDs), and electrophoretic displays (EPDs) are widely used.

[0004] The display device operates by receiving an electrical signal from an external source, and may include a touch screen to sense a touch event occurring on a display panel displaying an image.

[0005] The display device includes various electrode patterns activated by electrical signals. The areas where the electrode patterns are activated display information or respond to touch events. Summary of the invention

[0006] The present disclosure provides a display device capable of preventing cracks from occurring in an insulating layer included in a touch sensing unit.

[0007] The present disclosure also provides a display device capable of preventing a touch sensing unit from being short-circuited.

[0008] An embodiment of the present disclosure provides a display device, which includes a display panel and a touch sensing unit located on the display panel, wherein the touch sensing unit includes: a first conductive pattern located on the display panel, an insulating layer covering the first conductive pattern, and a second conductive pattern located on the insulating layer, wherein the second conductive pattern partially crosses the first conductive pattern and has a thickness greater than that of the first conductive pattern.

[0009] The first conductive pattern and the insulating layer may be directly on the thin film encapsulation layer of the display panel, and the insulating layer may include a first portion on the first conductive pattern and spaced apart from the thin film encapsulation layer, a second portion contacting the thin film encapsulation layer, and a third portion connecting the first portion and the second portion.

[0010] The thickness of the first conductive pattern may be smaller than the thickness of the insulating layer.

[0011] The thickness of the first conductive pattern may be equal to or greater than about 1800 angstroms and equal to or less than about 2100 angstroms, and the thickness of the second conductive pattern may be equal to or greater than about 2700 angstroms and equal to or less than about 3500 angstroms.

[0012] The first conductive pattern may include a first conductive layer located on the display panel, a second conductive layer located on the first conductive layer, and a third conductive layer located on the second conductive layer, the resistivity of the second conductive layer is smaller than the resistivity of the first conductive layer and the third conductive layer, and the thickness of the second conductive layer is greater than the thickness of the first conductive layer and the thickness of the third conductive layer.

[0013] The thickness of the third conductive layer may be greater than the thickness of the first conductive layer.

[0014] The thickness of the third conductive layer may be in a range of about one and a half times to about three times the thickness of the first conductive layer.

[0015] The first conductive layer may have a thickness in a range of about 50 angstroms to about 200 angstroms, the second conductive layer may have a thickness in a range of about 1000 angstroms to about 1800 angstroms, and the third conductive layer may have a thickness in a range of about 250 angstroms to about 350 angstroms.

[0016] The second conductive pattern may include a fourth conductive layer located on the insulating layer, a fifth conductive layer located on the fourth conductive layer, and a sixth conductive layer located on the fifth conductive layer, the resistivity of the fifth conductive layer is smaller than the resistivity of the fourth conductive layer and the sixth conductive layer, and the thickness of the fifth conductive layer is greater than the thickness of the fourth conductive layer and the thickness of the sixth conductive layer.

[0017] The thickness of the second conductive layer may be smaller than the thickness of the fifth conductive layer.

[0018] The thickness of the first conductive layer may be smaller than the thickness of the fourth conductive layer.

[0019] The second conductive pattern may include a first connection portion, a first touch sensor portion connected to each other through the first connection portion, and a second touch sensor portion spaced apart from the first touch sensor portion.

[0020] The first conductive pattern may include a second connection portion that connects the second touch sensor portion and crosses the first connection portion.

[0021] The first conductive pattern may include a second connecting portion connecting the second touch sensor portion, each of the first touch sensor portion and the second touch sensor portion may include a plurality of grid lines defining a plurality of meshes, and the second connecting portion may intersect the grid lines of the first touch sensor portion and the grid lines of the second touch sensor portion.

[0022] The second connection portion may not cross the first connection portion.

[0023] According to the above, the occurrence of cracks of an insulating layer included in a touch sensing unit may be reduced, and thus a short circuit defect of the touch sensing unit may be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other aspects of the present disclosure will become apparent by reference to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0025] Figure 1A is a perspective view showing a display device in a first operation state according to an embodiment of the present disclosure;

[0026] Figure 1B is a perspective view showing a display device in a second operation state according to an embodiment of the present disclosure;

[0027] Figure 1C is a perspective view showing a display device in a third operation state according to an embodiment of the present disclosure;

[0028] Figure 2 is a cross-sectional view showing a display device according to an embodiment of the present disclosure;

[0029] Figure 3A and Figure 3B is a perspective view showing a display device according to an embodiment of the present disclosure;

[0030] Figure 4A and Figure 4B is a perspective view showing a display device according to an embodiment of the present disclosure;

[0031] Figure 5A is a plan view showing a display panel included in a display device according to an embodiment of the present disclosure;

[0032] Figure 5B is a cross-sectional view showing a display module included in a display device according to an embodiment of the present disclosure;

[0033] Fig. 6A is an equivalent circuit diagram of a pixel included in a display device according to an embodiment of the present disclosure;

[0034] Figure 6B is a cross-sectional view showing a portion of a display panel included in a display device according to an embodiment of the present disclosure;

[0035] Figure 6C is a cross-sectional view showing a portion of a display panel included in a display device according to an embodiment of the present disclosure;

[0036] 7A to 7C is a cross-sectional view showing a thin film encapsulation layer included in a display device according to an embodiment of the present disclosure;

[0037] Fig. 8A is a cross-sectional view showing a touch sensing unit included in a display device according to an embodiment of the present disclosure;

[0038] FIG. 8B to FIG. 8E is a plan view showing a touch sensing unit included in a display device according to an embodiment of the present disclosure;

[0039] Figure 8F It is shown Figure 8B A local enlarged view of area A1;

[0040] Fig. 9 It is shown Figure 8B A partial enlarged view of area A2;

[0041] Fig. 10A and Fig. 10B It is along Fig. 9 A cross-sectional view taken along line II';

[0042] Fig.11 is a cross-sectional view showing a touch sensing unit included in a conventional display device;

[0043] FIG. 12A to FIG. 12D is a plan view showing a touch sensing unit included in a display device according to an embodiment of the present disclosure;

[0044] FIG. 13A to FIG. 13C It is shown Fig. 12A A partial enlarged view of area A3;

[0045] Fig.14 is along Fig. 13C A cross-sectional view taken along line II-II';

[0046] Fig.15 is a cross-sectional view showing a portion of a touch sensing unit included in a display device according to an embodiment of the present disclosure;

[0047] Fig.16 is a cross-sectional view illustrating a touch sensing unit included in a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0048] By referring to the following detailed description of the embodiments and the accompanying drawings, the features of the inventive concept and the methods for implementing the inventive concept can be more easily understood. Hereinafter, the exemplary embodiments will be described in more detail with reference to the accompanying drawings, in which the same reference numerals always represent the same elements. However, the present invention can be implemented in various different forms and should not be interpreted as being limited to the embodiments shown here. On the contrary, these embodiments are provided as examples so that the present disclosure will be thorough and complete, and the aspects and features of the present invention will be fully conveyed to those skilled in the art. Therefore, the processes, elements and techniques necessary for those of ordinary skill in the art to fully understand the aspects and features of the present invention may not be described. Unless otherwise stated, the same reference numerals throughout the drawings and written descriptions represent the same elements, and therefore their descriptions will not be repeated. In the drawings, for clarity, the relative sizes of elements, layers and regions may be exaggerated.

[0049] It will be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited to these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the spirit and scope of the present invention, the first element, component, region, layer or part described below may be referred to as a second element, component, region, layer or part.

[0050] In order to easily describe the relationship between one element or feature and another element or feature as shown in the drawings, spatial relative terms such as "below", "below", "below", "below", "above", and "above" may be used herein. In addition to the orientations depicted in the drawings, spatial relative terms are also intended to include different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as being "below" or "below" or "below" other elements or features will then be positioned as being "above" other elements or features. Therefore, the example terms "below" and "below" may include both "above" and "below". The device may be positioned otherwise (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein should be interpreted accordingly.

[0051] It will be understood that when an element, layer, region, or component is referred to as being "on," "connected to," or "coupled to" another element, layer, region, or component, the element, layer, region, or component may be directly on, directly connected to, or directly coupled to the other element, layer, region, or component, or one or more intervening elements, layers, regions, or components may be present. Additionally, it will be understood that when an element or layer is referred to as being "between" two elements or layers, the element or layer may be the only element or layer between the two elements or layers, or one or more intervening elements or layers may also be present.

[0052] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.

[0053] The term used here is only for the purpose of describing specific embodiments, and is not intended to limit the present invention. As used here, unless the context clearly indicates otherwise, the singular form "one (kind)" is intended to also include plural forms. It will also be understood that when the term "comprising" and its variations and "including" and its variations are used in this specification, the characteristics, wholes, steps, operations, elements and / or components stated are explained, but one or more other characteristics, wholes, steps, operations, elements, components and / or their groups are not excluded from existence or addition. As used here, the term "and / or" includes any combination and all combinations of one or more related listed items. When the expression such as "at least one (kind) (person) in ... " is located after a row of elements (elements), the whole row of elements (elements) is modified, rather than the individual elements (elements) of the row being modified.

[0054] As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measurements or calculations that one of ordinary skill in the art would recognize. In addition, the use of "may" when describing embodiments of the present invention refers to "one or more embodiments of the present invention." As used herein, the term "use" and variations thereof may be considered synonymous with the term "utilize" and variations thereof, respectively. In addition, the term "exemplary" is intended to represent an example or illustration.

[0055] When a certain embodiment can be implemented differently, a specific process order can be performed in a different order than described. For example, two consecutively described processes can be performed substantially simultaneously or in a reverse order to the described order.

[0056] Any suitable hardware, firmware (e.g., application specific integrated circuit), software, or a combination of software, firmware, and hardware may be used to implement the electronic or electrical devices and / or any other related devices or components according to the embodiments of the present invention described herein. For example, the various components of these devices may be formed on an integrated circuit (IC) chip or on a discrete IC chip. In addition, the various components of these devices may be formed on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or on a substrate. In addition, the various components of these devices may be processes or threads that run on one or more processors in one or more computing devices, execute computer program instructions, and interact with other system components to perform the various functions described herein. Computer program instructions are stored in a memory, and the computer program instructions may be implemented in a computing device using, for example, a standard storage device (e.g., a random access memory (RAM)). Computer program instructions may also be stored in other non-temporary computer-readable media, such as a CD-ROM or a flash drive, etc. In addition, those skilled in the art should recognize that, without departing from the spirit and scope of the embodiments of the present invention, the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a specific computing device may be distributed in one or more other computing devices.

[0057] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. It will also be understood that, unless explicitly defined as such herein, terms such as those defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense.

[0058] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

[0059] Figure 1A is a perspective view showing a display device DD in a first operation state according to an embodiment of the present disclosure. Figure 1B is a perspective view showing the display device DD in a second operation state according to an embodiment of the present disclosure. Figure 1C is a perspective view showing the display device DD in a third operation state according to an embodiment of the present disclosure.

[0060] Reference Figure 1A, the display surface IS displaying the image IM in the first operating state of the display device DD is substantially parallel to the surface or plane defined by the first direction axis DR1 and the second direction axis DR2. The direction orthogonal to the display surface IS (i.e., the thickness direction of the display device DD) represents the third direction DR3. The front surface (or "upper surface") is distinguished from the rear surface (or "lower surface") by the third direction axis DR3. However, the first direction axis DR1 to the third direction axis DR3 are relative terms to each other, so the first direction axis DR1 to the third direction axis DR3 can be changed to any other direction. In the following, the first direction to the third direction correspond to the directions represented by the first direction axis DR1 to the third direction axis DR3, respectively, and therefore the first direction to the third direction are assigned with the same figure marks as the first direction axis DR1 to the third direction axis DR3.

[0061] Figures 1A to 1C A foldable display device is shown as a representative example of the flexible display device DD, but it should not be limited thereto or thereby. For example, the flexible display device DD may be, for example, a rollable display device, a bendable display device, or a flat rigid display device. The flexible display device DD according to the present embodiment may be applied to large-sized electronic products such as televisions, monitors, etc., and may be applied to small and medium-sized electronic products such as mobile phones, tablet computers, car navigation units, game consoles, smart watches, etc.

[0062] Reference Figure 1A , the display surface IS of the flexible display device DD may include a plurality of regions. The flexible display device DD includes a display region DD-DA displaying an image IM and a non-display region DD-NDA located next to the display region DD-DA. The image IM is not displayed in the non-display region DD-NDA. Figure 1A An image of a vase is shown as the image IM. As an example, the display area DD-DA has a substantially quadrilateral shape and the non-display area DD-NDA surrounds the display area DD-DA, but they should not be limited thereto or thereby. That is, the shape of the display area DD-DA and the shape of the non-display area DD-NDA may be designed relative to each other.

[0063] Reference Figures 1A to 1C The display device DD is divided into a plurality of regions according to its operating state. The display device DD includes a bending region BA that can be bent relative to a bending axis BX, a first non-bending region NBA1 that is not bent, and a second non-bending region NBA2 that is not bent. Figure 1B As shown, the display device DD may be bent inwardly so that the display surface IS of the first non-bending area NBA1 faces the display surface IS of the second non-bending area NDA2. Figure 1C As shown, the display device DD may be bent outwardly to allow the display surface IS to be exposed.

[0064] Figures 1A to 1C Only one bending area BA is shown, but the number of bending areas BA is not limited to one. For example, in this embodiment, the display device DD may include a plurality of bending areas BA. In some embodiments, although the present invention is not limited thereto or thereby, the display device DD may be configured to only repeatedly perform Figure 1A and Figure 1B That is, the bending area BA may be defined to correspond to the user's operation performed on the display device DD. Figure 1B and Figure 1C Unlike the illustration, the bending area BA may be defined to be substantially parallel to the first direction axis DR1, or may be defined in a diagonal direction. The bending area BA may have an area determined according to a curvature radius without being fixed.

[0065] Figure 2 is a cross-sectional view showing a display device DD according to an embodiment of the present disclosure. Figure 2 A cross section defined by the second direction DR2 and the third direction DR3 is shown.

[0066] Reference Figure 2 , the display device DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, a second adhesive member AM2, and a third adhesive member AM3. The display module DM is located between the protective film PM and the optical member LM. The optical member LM is located between the display module DM and the window WM. The first adhesive member AM1 combines the display module DM and the protective film PM. The second adhesive member AM2 combines the display module DM and the optical member LM. The third adhesive member AM3 combines the optical member LM and the window WM. If appropriate, at least one of the first adhesive member AM1, the second adhesive member AM2, and the third adhesive member AM3 may be omitted.

[0067] The protective film PM protects the display module DM. The protective film PM includes a first outer surface OS-L exposed to the outside and an adhesive surface adhered to the first adhesive member AM1. The protective film PM prevents external moisture from entering the display module DM and absorbs external impact.

[0068] The protective film PM may include a plastic film as a base substrate. The plastic film may include one or more of polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), poly(arylene ether sulfone) and mixtures thereof.

[0069] The material of the protective film PM may include a mixed material of an organic material and an inorganic material, and is not limited to a plastic resin. The protective film PM may include a porous organic layer and an inorganic material filled in the pores of the organic layer. The protective film PM may also include a functional layer formed in a plastic film. The functional layer may include a resin layer and may be formed by a coating method. In other embodiments, the protective film PM may be omitted.

[0070] The window WM protects the display module DM from external impact and provides an input surface to the user. The window WM provides a second outer surface OS-U exposed to the outside and an adhesive surface adhered to the third adhesive member AM3. Figures 1A to 1C The shown display surface IS may be the second outer surface OS-U.

[0071] The window WM may include a plastic film. The window WM may have a multilayer structure, which may be a glass substrate, a plastic film or a plastic substrate. The window WM may also include a frame pattern. The multilayer structure of the window WM may be formed by a continuous process or a bonding process using an adhesive.

[0072] The optical member LM reduces reflectivity of external light. The optical member LM may include at least one polarizing film, and may further include a retardation film. In other embodiments, the optical member LM may be omitted.

[0073] The display module DM includes a display panel DP and a touch sensing unit TS. The touch sensing unit TS is directly located on the display panel DP. In the following description, the expression "a first component is directly located on a second component" means that the first component and the second component are formed by a continuous process without being attached to each other by using a separate adhesive layer. According to other embodiments, other layers (e.g., an adhesive layer, a substrate, etc.) may be inserted between the display panel DP and the touch sensing unit TS.

[0074] Hereinafter, the organic light emitting display panel DP will be described as a display panel, but the display panel should not be limited to the organic light emitting display panel DP. The display panel DP may be a liquid crystal display panel, a plasma display panel, an electrophoretic display panel, a micro-electromechanical system (MEMS) display panel, or an electrowetting display panel.

[0075] The organic light emitting display panel DP generates an image IM corresponding to the image data input thereto (refer to Figure 1A The organic light emitting display panel DP includes a first display panel surface BS1 -L and a second display panel surface BS1 -U facing the first display panel surface BS1 -L in the thickness direction DR3 .

[0076] The touch sensing unit TS obtains coordinate information of an external input. The touch sensing unit TS senses the external input in an electrostatic capacitance manner.

[0077] The display module DM according to other embodiments may further include an anti-reflection layer. The anti-reflection layer may include a color filter or a stacked structure of a conductive layer / insulating layer / conductive layer. The anti-reflection layer absorbs external light or polarizes external light to reduce the reflectivity of external light. The anti-reflection layer may be used to replace the function of the optical member LM.

[0078] Each of the first adhesive member AM1, the second adhesive member AM2, and the third adhesive member AM3 may be, but is not limited to, an organic adhesive layer, such as an optically transparent adhesive film (OCA), an optically transparent resin (OCR), or a pressure-sensitive adhesive film (PSA). The organic adhesive layer may include, for example, a polyurethane-based adhesive material, a polyacrylic-based adhesive material, a polyester-based adhesive material, a polyepoxy-based adhesive material, or a polyvinyl acetate-based adhesive material.

[0079] The display device DD may further include a supporting functional layer for maintaining Figure 1A , Figure 1B and Figure 1C The frame structure in the state shown. The frame structure may have a joint structure or a hinge structure.

[0080] Figure 3A and Figure 3B is a perspective view showing a display device DD-1 according to an embodiment of the present disclosure. Figure 3A shows the display device DD-1 in an unbent state, Figure 3B The display device DD-1 is shown in a bent state.

[0081] The display device DD-1 includes a bending area BA and a non-bending area NBA. The non-display area DD-NDA of the display device DD-1 is bent, however, in other embodiments, the bending area of ​​the display device DD-1 may be changed.

[0082] and Figures 1A to 1C Unlike the display device DD shown, the display device DD-1 can be fixed in one state during operation. The display device DD-1 can be Figure 3B The display device DD-1 can be fixed to the frame while being bent, and the frame can be coupled to the housing of the electronic device.

[0083] The display device DD-1 according to this embodiment may have Figure 2 The cross-sectional structure shown in FIG. 1 is substantially the same as the cross-sectional structure shown in FIG. However, the non-bending area NBA and the bending area BA may have different stacking structures from each other. The non-bending area NBA may have a different stacking structure from the bending area BA. Figure 2 The cross-sectional structure shown in FIG. 1 is substantially the same as that shown in FIG. Figure 2The cross-sectional structure shown is different from the cross-sectional structure shown. For example, the optical member LM and the window WM may be omitted from the bending area BA. That is, the optical member LM and the window WM may be located only in the non-bending area NBA. The second bonding member AM2 and the third bonding member AM3 may be omitted from the bending area BA.

[0084] Figure 4A is a perspective view showing a display device DD-2 according to an embodiment of the present disclosure.

[0085] Reference Figure 4A , the display device DD-2 includes a non-curved area (or "plane area") NBA that displays a main image to the front and a curved area (or "side area") BA that displays a sub-image to the side. The sub-image may include an icon for providing information. In this embodiment, the terms "non-curved area NBA and curved area BA" used herein define a display device DD-2 that is configured to include multiple areas of different shapes from each other.

[0086] The bending area BA bent from the non-bending area NBA displays a sub-image toward a fourth direction axis DR4 crossing the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3. However, the first direction axis DR1 to the fourth direction axis DR4 are terms relative to each other, so the first direction axis DR1 to the fourth direction axis DR4 can be changed to any other direction.

[0087] Figure 4B is a perspective view showing a display device DD-3 according to an embodiment of the present disclosure.

[0088] Reference Figure 4B The display device DD-3 includes a non-bending area NBA for displaying a main image forward, and includes a first bending area BA1 and a second bending area BA2 for displaying a sub-image sideways. The first bending area BA1 and the second bending area BA2 are bent from opposite sides of the non-bending area NBA, respectively.

[0089] Figure 5A is a plan view showing an organic light emitting display panel DP included in a display device according to an embodiment of the present disclosure, Figure 5B is a cross-sectional view showing a display module DM included in a display device according to an embodiment of the present disclosure.

[0090] Reference Figure 5A As shown, when viewed in a plan view, the organic light emitting display panel DP includes a display area DA and a non-display area NDA. The display area DA and the non-display area NDA of the organic light emitting display panel DP correspond to the display area DD-DA and the non-display area DD-NDA of the display device DD, respectively (refer to Figure 1A). The display area DA and the non-display area NDA of the organic light emitting display panel DP do not need to be Figure 1A The display area DD-DA and the non-display area DD-NDA of the display device DD are the same, and the display area DA and the non-display area NDA of the organic light emitting display panel DP may be changed according to the structure and design of the organic light emitting display panel DP.

[0091] The organic light emitting display panel DP includes a plurality of pixels PX. A region where the pixels PX are arranged is referred to as a display region DA. In the present embodiment, a non-display region NDA is defined along an edge of the display region DA.

[0092] The organic light emitting display panel DP includes a gate line GL, a data line DL, a light emitting line EL, a control signal line SL-D, an initialization voltage line SL-Vint, a voltage line SL-VDD, and a pad portion PD.

[0093] Each gate line GL is connected to a corresponding pixel of the pixel PX, and each data line DL is connected to a corresponding pixel of the pixel PX. Each luminous line EL is arranged substantially parallel to the corresponding gate line of the gate line GL. The control signal line SL-D applies a control signal to the gate drive circuit GDC. The initialization voltage line SL-Vint applies an initialization voltage to the pixel PX. The voltage line SL-VDD is connected to the pixel PX to apply a first voltage to the pixel PX. The voltage line SL-VDD includes a plurality of lines extending in a first direction DR1 and a plurality of lines extending in a second direction DR2.

[0094] The gate driving circuit GDC is located at a side portion of the non-display area NDA and is connected to the gate line GL and the light emitting line EL. Some of the gate line GL, the data line DL, the light emitting line EL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD are located on the same layer, and other of the gate line GL, the data line DL, the light emitting line EL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD are located on different layers.

[0095] The pad portion PD is connected to one end of the data line DL, one end of the control signal line SL-D, one end of the initialization voltage line SL-Vint, and one end of the voltage line SL-VDD. Figure 5B As shown, the organic light emitting display panel DP includes a base layer / base substrate SUB, a circuit layer DP-CL located on the base layer SUB, an organic light emitting device layer DP-OLED located on the circuit layer DP-CL, and a thin film encapsulation layer TFE located on the organic light emitting device layer DP-OLED.

[0096] The substrate layer SUB includes at least one plastic film. The substrate layer SUB may be a flexible substrate, and may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic hybrid material substrate. The plastic substrate includes at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0097] The circuit layer DP-CL includes a plurality of insulating layers, a plurality of conductive layers and a semiconductor layer. The conductive layer of the circuit layer DP-CL may form a signal line or a control circuit of the pixel PX.

[0098] The organic light emitting device layer DP-OLED may include an organic light emitting diode.

[0099] The thin film encapsulation layer TFE encapsulates the organic light-emitting device layer DP-OLED. The thin film encapsulation layer TFE includes an inorganic layer and an organic layer. The thin film encapsulation layer TFE may include at least two inorganic layers and an organic layer located therebetween. The inorganic layer protects the organic light-emitting device layer DP-OLED from moisture and oxygen, and the organic layer protects the organic light-emitting device layer DP-OLED from foreign matter such as dust. The inorganic layer may include, for example, at least one of a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. The organic layer may include an acrylic organic material, but should not be limited thereto or thereby. According to the present embodiment, the touch sensing unit TS may provide uniform sensitivity by adjusting the thickness of the organic layer.

[0100] The touch sensing unit TS is directly located on the thin film encapsulation layer TFE, but is not limited thereto. The inorganic layer may be located on the thin film encapsulation layer TFE, and the touch sensing unit TS may be located on the inorganic layer. The inorganic layer may be a buffer layer. The inorganic layer may include at least one of a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer, but the inorganic layer should not be limited thereto or thereby. In addition, the inorganic layer may be included in the thin film encapsulation layer TFE, and is not provided as a separate element.

[0101] The touch sensing unit TS includes a touch sensor and a touch signal line. The touch sensor and the touch signal line may have a single-layer structure or a multi-layer structure.

[0102] The touch sensor and the touch signal line may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires and / or graphene. The touch sensor and the touch signal line may include, for example, a metal layer such as molybdenum, silver, titanium, copper, aluminum or an alloy thereof. The touch sensor and the touch signal line may have the same layer structure or different layer structures. The touch sensor layer TS will be described in detail later.

[0103] Fig. 6A is an equivalent circuit diagram of a pixel PX included in a display device according to an embodiment of the present disclosure.

[0104] Fig. 6A An i-th pixel PXi connected to a k-th data line DLk among the data lines DL is shown.

[0105] The i-th pixel PXi includes an organic light emitting diode OLED and a pixel driving circuit for controlling the organic light emitting diode OLED. The pixel driving circuit includes seven thin film transistors T1 to T7 and a storage capacitor Cst. In the present embodiment, the pixel driving circuit includes seven transistors T1 to T7 and a storage capacitor Cst, but in other embodiments, the pixel PXi may include only a first transistor (or "driving transistor") T1, a second transistor (or "switching transistor") T2 and a capacitor Cst as a driving circuit for driving the organic light emitting diode OLED, and the pixel driving circuit may have various configurations.

[0106] The driving transistor controls the driving current applied to the organic light emitting diode OLED. The output electrode of the second transistor T2 is electrically connected to the organic light emitting diode OLED. The output electrode of the second transistor T2 is directly in contact with the anode of the organic light emitting diode OLED, or is connected to the anode of the organic light emitting diode OLED via another transistor, such as a sixth transistor T6.

[0107] The control electrodes of the control transistors receive the control signals. The control signals applied to the i-th pixel PXi include the (i-1)th gate signal Si-1, the i-th gate signal Si, the (i+1)th gate signal Si+1, the data signal Dk and the i-th light emission control signal Ei. In the present embodiment, the control transistors include the first transistor T1 and the third transistor T3 to the seventh transistor T7.

[0108] The first transistor T1 includes an input electrode connected to the kth data line DLk, a control electrode connected to the i-th gate line GLi, and an output electrode connected to the output electrode of the second transistor T2. The first transistor T1 is turned on by a gate signal Si (hereinafter referred to as "the i-th gate signal") applied to the i-th gate line GLi to provide the data signal Dk applied to the k-th data line to the storage capacitor Cst.

[0109] Figure 6B is a cross-sectional view illustrating a portion of a display panel included in a display device according to an embodiment of the present disclosure. Figure 6C is a cross-sectional view showing a portion of a display panel included in a display device according to an embodiment of the present disclosure. In detail, Figure 6B Shown with Fig. 6AThe cross section of the portion of the equivalent circuit corresponding to the first transistor T1 is shown, Figure 6C Shown with Fig. 6A The cross section of the corresponding parts of the second transistor T2, the sixth transistor T6 and the organic light emitting diode OLED of the equivalent circuit shown.

[0110] Reference Figure 6B and Figure 6C , the first transistor T1, the second transistor T2 and the sixth transistor T6 are located on the base layer SUB. The first transistor T1, the second transistor T2 and the sixth transistor T6 have the same structure as each other, so the first transistor T1 will be described in detail, and the repeated details of the second transistor T2 and the sixth transistor T6 will be omitted.

[0111] An upper surface of the base layer SUB is defined by a first direction DR1 and a second direction DR2. The first transistor T1 includes a first input electrode DE1, a first output electrode SE1, a first control electrode GE1, and a first oxide semiconductor pattern OSP1.

[0112] The buffer layer BFL is located on the base layer SUB. The buffer layer BFL improves the bonding force between the base layer SUB and the conductive pattern or the semiconductor pattern. The buffer layer BFL includes an inorganic layer. In other embodiments, a barrier layer may be further located on the base layer SUB to prevent foreign matter from entering. The buffer layer BFL and the barrier layer may be selectively used or omitted.

[0113] The base layer SUB may include a plastic substrate, a glass substrate or a metal substrate. The plastic substrate includes at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin and perylene resin.

[0114] The first oxide semiconductor pattern OSP1 is located on the buffer layer BFL. The first oxide semiconductor pattern OSP1 includes indium tin oxide (ITO), indium gallium zinc oxide (IGZO), zinc oxide (ZnO), or indium zinc oxide (IZO).

[0115] The first insulating layer 10 is located on the buffer layer BFL to cover the first oxide semiconductor pattern OSP1.

[0116] The first control electrode GE is located on the first insulating layer 10, and the second insulating layer 20 is located on the first insulating layer 10 to cover the first control electrode GE1. The second insulating layer 20 provides a flat upper surface / planarized surface. The second insulating layer 20 includes an organic material and / or an inorganic material.

[0117] The first insulating layer 10 and the second insulating layer 20 include an inorganic material, which may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0118] Meanwhile, first and second contact holes CH1 and CH2 are defined by the first and second insulating layers 10 and 20 to expose first and second regions of the first oxide semiconductor pattern OSP1 , respectively. Each of the first and second contact holes CH1 and CH2 penetrates the first and second insulating layers 10 and 20 .

[0119] The first input electrode DE1 and the first output electrode SE1 are positioned on the second insulating layer 20. The first input electrode DE1 and the first output electrode SE1 are connected to the first region and the second region of the first oxide semiconductor pattern OSP1 through the first contact hole CH1 and the second contact hole CH2, respectively.

[0120] The third insulating layer 30 is located on the second insulating layer 20 to cover the first input electrode DE1 and the first output electrode SE1. The third insulating layer 30 provides a flat upper surface. The third insulating layer 30 includes an organic material and / or an inorganic material. The third insulating layer 30 covers the input electrode and the output electrode.

[0121] Figure 6C A sixth transistor T6 is shown having substantially the same structure as the second transistor T2 . However, the structure of the sixth transistor T6 may vary. The sixth transistor T6 includes an input electrode DE6 connected to the output electrode SE2 of the second transistor T2 on the third insulating layer 30 .

[0122] The organic light emitting diode OLED and the pixel defining layer PDL are located on the third insulating layer 30. The anode AE ​​is located on the third insulating layer 30. The anode AE ​​is connected to the sixth output electrode SE6 of the sixth transistor T6 through the seventh contact hole CH7 defined by the third insulating layer 30. The pixel defining layer PDL is provided with an opening OP defined therethrough. At least a portion of the anode AE ​​is exposed through the opening OP of the pixel defining layer PDL.

[0123] When viewed in a plan view, the pixel PX is located in a pixel area of ​​the organic light emitting display panel DP. The pixel area includes a light emitting area PXA and a non-light emitting area NPXA near the light emitting area PXA. The non-light emitting area NPXA is positioned to surround the light emitting area PXA. In the present embodiment, the light emitting area PXA is defined as corresponding to the anode AE, but should not be limited thereto or thereby. The light emitting area PXA may be defined as an area where light is generated. The light emitting area PXA may be defined as corresponding to a portion of the anode AE ​​exposed through the opening OP.

[0124] The hole control layer HCL is commonly located in the light emitting region PXA and the non-light emitting region NPXA. Although not shown in the drawings, a common layer like the hole control layer HCL may be commonly formed in a plurality of pixels PX.

[0125] The organic light emitting layer EML is located on the hole control layer HCL. The organic light emitting layer EML is located only in a region corresponding to the opening OP. That is, the organic light emitting layer EML may be patterned into a plurality of portions, and the portions may be respectively located in the pixels PX.

[0126] The electron control layer ECL is located on the organic light emitting layer EML. The cathode CE is located on the electron control layer ECL. The cathode CE is commonly located in the pixel PX.

[0127] The thin film encapsulation layer TFE is located on the cathode CE. The thin film encapsulation layer TFE is commonly located in the pixel PX. The thin film encapsulation layer TFE includes at least one inorganic layer and at least one organic layer. The thin film encapsulation layer TFE may include a plurality of inorganic layers and a plurality of organic layers alternately stacked with the inorganic layers.

[0128] In the present embodiment, the patterned organic light emitting layer EML is shown as a representative example, but the organic light emitting layer EML may be commonly located in the pixel PX. In this case, the organic light emitting layer EML may generate white light. In addition, the organic light emitting layer EML may have a multi-layer structure.

[0129] In this embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In this embodiment, the cover layer may also cover the cathode CE, and the thin film encapsulation layer TFE may directly cover the cover layer.

[0130] 7A to 7C is a cross-sectional view showing a thin film encapsulation layer included in a display device according to an embodiment of the present disclosure. 7A to 7C The thin film encapsulation layer is described in detail.

[0131] Reference Fig. 7A The thin film encapsulation layer TFE1 includes n inorganic thin layers IOL1 to IOLn, and the first inorganic thin layer IOL1 of the n inorganic thin layers IOL1 to IOLn is located on the cathode CE (refer to Figure 6C ). In addition, the first inorganic thin layer IOL1 may be positioned to directly contact the cathode CE (refer to Figure 6C The first inorganic thin layer IOL1 may be referred to as a “lower inorganic thin layer”, and inorganic thin layers other than the first inorganic thin layer IOL1 among the n inorganic thin layers IOL1 to IOLn may be referred to as an “upper inorganic thin layer”.

[0132] The thin film encapsulation layer TFE1 includes n-1 organic thin layers OL1 to OLn-1, which are alternately arranged with n inorganic thin layers IOL1 to IOLn. The n-1 organic thin layers OL1 to OLn-1 may have a thickness greater than that of the n inorganic thin layers IOL1 to IOLn.

[0133] Each of the n inorganic thin layers IOL1 to IOLn may have a single-layer structure including one material, or may have a multi-layer structure including a plurality of different types of materials. Each of the n-1 organic thin layers OL1 to OLn-1 may be formed by depositing an organic monomer. Each of the n-1 organic thin layers OL1 to OLn-1 may be formed by using an inkjet printing method or by coating a composition including an acrylic monomer. In the present embodiment, the thin film encapsulation layer TFE1 may further include an nth organic thin layer.

[0134] Reference Figure 7B and Figure 7C , the inorganic thin layer included in each of the thin film encapsulation layers TFE2 and TFE3 may include the same inorganic material, or may include inorganic materials different from each other, and may have the same thickness or different thicknesses. The organic thin layer included in each of the thin film encapsulation layers TFE2 and TFE3 may include the same organic material, or may include organic materials different from each other, and may have the same thickness or different thicknesses.

[0135] like Figure 7B As shown, the thin film encapsulation layer TFE2 includes a first inorganic thin layer IOL1, a first organic thin layer OL1, a second inorganic thin layer IOL2, a second organic thin layer OL2 and a third inorganic thin layer IOL3 which are stacked in sequence.

[0136] The first inorganic thin layer IOL1 may have a double-layer structure. The first sub-layer S1 and the second sub-layer S2 of the first inorganic thin layer IOL1 may have different inorganic materials.

[0137] like Figure 7C As shown, the thin film encapsulation layer TFE3 includes a first inorganic thin layer IOL10, a first organic thin layer OL1, and a second inorganic thin layer IOL20 stacked in sequence. The first inorganic thin layer IOL10 may have a double-layer structure. The first sublayer S10 and the second sublayer S20 may have different inorganic materials. The second inorganic thin layer IOL20 may have a double-layer structure. The second inorganic thin layer IOL20 may include a first sublayer S100 and a second sublayer S200 deposited in different environments. The first sublayer S100 may be deposited at a lower power, and the second sublayer S200 may be deposited at a high power. The first sublayer S100 and the second sublayer S200 may include the same inorganic material.

[0138] Fig. 8A is a cross-sectional view illustrating a touch sensing unit included in a display device according to an embodiment of the present disclosure. FIG. 8B to FIG. 8E is a plan view illustrating a touch sensing unit included in a display device according to an embodiment of the present disclosure.

[0139] Reference Fig. 8A , the touch sensing unit TS includes a first conductive pattern TS-CP1, a first insulating layer TS-IL1 (hereinafter referred to as a "first touch insulating layer"), a second conductive pattern TS-CP2, and a second insulating layer TS-IL2 (hereinafter referred to as a "second touch insulating layer"). The first conductive pattern TS-CP1 is directly located on the thin film encapsulation layer TFE, but it should not be limited thereto or thereby. That is, another inorganic layer (e.g., a buffer layer) may also be located between the first conductive pattern TS-CP1 and the thin film encapsulation layer TFE.

[0140] If appropriate, the second insulating layer TS-IL2 may be omitted. A portion of the second conductive pattern TS-CP2 crosses the first conductive pattern TS-CP1. The portion of the second conductive pattern TS-CP2 is insulated from the first conductive pattern TS-CP1 while crossing the first conductive pattern TS-CP1, and the first touch insulating layer TS-IL1 is located between the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2.

[0141] Each of the first and second conductive patterns TS-CP1 and TS-CP2 has a single-layer structure or a multi-layer structure in which a plurality of layers are stacked in the third direction DR3.

[0142] Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 includes an inorganic material or an organic material. The inorganic material includes at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material includes at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin.

[0143] If the first touch insulating layer TS-IL1 is insulated from the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2, the first touch insulating layer TS-IL1 should not be limited to a specific shape. The first touch insulating layer TS-IL1 completely covers the thin film encapsulation layer TFE or includes a plurality of insulating patterns. The insulating patterns overlap the first connection part BR1 and the second connection part BR2 described later.

[0144] In the present embodiment, a double-layer touch sensing unit has been described, but the touch sensing unit should not be limited to the double-layer type. The single-layer touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes a touch sensor and a touch signal line connected to the touch sensor. The single-layer touch sensing unit obtains coordinate information using a self-capacitance method.

[0145] Reference Figure 8B , the touch sensing unit TS includes a first touch electrode TE1 and a second touch electrode TE2. The first touch electrode TE1 includes a first connection portion BR1, a first touch sensing portion SP1 connected by the first connection portion BR1, and a first touch signal line SL1 connected to the first touch sensor portion SP1. The second touch electrode TE2 includes a second connection portion BR2, a second touch sensing portion SP2 connected by the second connection portion BR2, and a second touch signal line SL2 connected to the second touch sensor portion SP2. In addition, a connection electrode TSD may be located between the first touch electrode TE1 and the first touch signal line SL1 and between the second touch electrode TE2 and the second touch signal line SL2 connected to the second touch electrode TE2. The connection electrode TSD is connected to one end of the first touch electrode TE1 and the second touch electrode TE2 to transmit a signal. According to another embodiment, the connection electrode TSD may be omitted.

[0146] The first touch sensor portion SP1 is arranged in the first direction DR1, and the second touch sensor portion SP2 is arranged in the second direction DR2. The first touch sensor portion SP1 is spaced apart from the second touch sensor portion SP2.

[0147] The first touch electrodes TE1 extend in the first direction DR1 and are spaced apart from each other in the second direction DR2. The second touch electrodes TE2 extend in the second direction DR2 and are spaced apart from each other in the first direction DR1.

[0148] Each first connection portion BR1 connects two adjacent first touch sensor portions SP1 among the first touch sensor portions SP1. Each second connection portion BR2 connects two adjacent second touch sensor portions SP2 among the second touch sensor portions SP2. Figure 8B In the figure, parts of the first connection part BR1 and the second connection part BR2 are indicated in bold to help the description.

[0149] The touch sensing unit TS may further include a touch pad portion TS-PD. Each of the first and second touch signal lines SL1 and SL2 may be connected to a corresponding touch pad portion of the touch pad portion TS-PD.

[0150] The first touch sensor portion SP1 is capacitively coupled to the second touch sensor portion SP2. When a touch sensing signal is applied to the first touch sensor portion SP1, a capacitor is formed between the first touch sensor portion SP1 and the second touch sensor portion SP2.

[0151] In the following, reference will be made to Figure 8C and Fig. 8E The touch sensing unit TS is described in more detail.

[0152] Reference Figure 8C , the first conductive pattern TS-CP1 may include a second connection portion BR2. The second connection portion BR2 may be directly formed on the thin film encapsulation layer TFE through a patterning process. That is, the first conductive pattern TS-CP1 may be directly located on the thin film encapsulation layer TFE of the organic light emitting display panel DP.

[0153] The first touch insulating layer TS-IL1 is located on the first conductive pattern TS-CP1. The first touch insulating layer TS-IL1 is directly located on the thin film encapsulation layer TFE of the organic light emitting display panel DP and covers the second connection portion BR2. Fig.8D As shown, a plurality of contact holes CH are defined by the first touch insulating layer TS-IL1 to partially expose the second connection part BR2. The contact holes CH are formed by a photolithography process. The second connection part BR2 of the first conductive pattern TS-CP1 is electrically connected to the second touch sensor part SP2 through the contact holes CH.

[0154] Reference Fig. 8E , the second conductive pattern TS-CP2 is located on the first touch insulating layer TS-IL1. The second conductive pattern TS-CP2 includes a first connection portion BR1, a first touch sensor portion SP1 connected by the first connection portion BR1, and a second touch sensor portion SP2 spaced apart from the first touch sensor portion SP1. As described above, the second touch sensor portion SP2 is electrically connected to the second connection portion BR2 of the first conductive pattern TS-CP1 through a contact hole CH defined by the first touch insulating layer TS-IL1.

[0155] Figure 8F It is shown Figure 8B A partial enlarged view of area A1. Fig. 9 It is shown Figure 8B A partial enlarged view of area A2.

[0156] Reference Figure 8F and Fig. 9, each of the first touch sensor portion SP1 and the second touch sensor portion SP2 may include a plurality of grid lines ML to define a plurality of meshes MH. For example, each grid line ML has a line width of several micrometers. Each of the first touch sensor portion SP1 and the second touch sensor portion SP2 may have a grid shape. Although not shown in detail, the first touch signal line SL1 and the second touch signal line SL2 may have a grid shape. Each of the first touch sensor portion SP1 and the second touch sensor portion SP2 overlaps the non-luminous area NPXA.

[0157] When viewed in a plan view, the meshes MH have sizes different from each other. The meshes MH may correspond to the light-emitting areas PXA one by one, respectively, but they should not be limited thereto or thereby. That is, for example, one mesh may correspond to two or more light-emitting areas PXA. When viewed in a plan view, the light-emitting areas PXA may have sizes different from each other. Accordingly, when viewed in a plan view, the meshes MH may have sizes different from each other. For example, the light-emitting areas PXA may include a red light-emitting area, a green light-emitting area, and a blue light-emitting area, and the light-emitting areas PXA may have different sizes determined according to their colors. However, the light-emitting areas PXA may have the same size as each other, and the meshes MH may have the same size as each other.

[0158] Reference Fig. 9 , the first connection part BR1 may cross the second connection part BR2. The first connection part BR1 and the second connection part BR2 are insulated from each other by the first touch insulation layer TS-IL1 located between the first connection part BR1 and the second connection part BR2, while crossing each other. Fig. 9 In the figure, the first connection part BR1 and the second connection part BR2 are represented by thick lines to facilitate description, but they should not be limited thereto or thereby. For example, the first connection part BR1 may not cross the second connection part BR2, and this structure will be described in detail later.

[0159] like Fig. 9 As shown, each of the first connection portion BR1 and the second connection portion BR2 may have a grid shape. However, in other embodiments, the second connection portion BR2 may not have a grid shape.

[0160] Fig. 10A and 10B It is a cross-sectional view taken along line II' of FIG. 1 .

[0161] Reference Fig. 10A and Fig. 10B , a thickness D1 of the first conductive pattern TS-CP1 is smaller than a thickness D2 of the second conductive pattern TS-CP2. Fig. 10A and Fig. 10BThe illustrated first conductive pattern TS-CP1 corresponds to the second connection portion BR2. A thickness D1 of the first conductive pattern TS-CP1 may be less than a thickness D3 of the first touch insulating layer TS-IL1.

[0162] In this specification, the term "thickness" means an average value or general thickness of thickness in a corresponding component.

[0163] As described above, the first conductive pattern TS-CP1 and the first touch insulating layer TS-IL1 may be directly located on the thin film encapsulation layer TFE of the organic light emitting display panel DP. The first touch insulating layer TS-IL1 has a structure having a step difference. In detail, the first touch insulating layer TS-IL1 is located on the first conductive pattern TS-CP1, and includes a first portion IL-SUB1 spaced apart from the thin film encapsulation layer TFE, a second portion IL-SUB2 in contact with the thin film encapsulation layer TFE, and a third portion IL-SUB3 connecting the first portion IL-SUB1 and the second portion IL-SUB2. The first portion IL-SUB1, the second portion IL-SUB2, and the third portion IL-SUB3 are integrally connected to each other.

[0164] The third portion IL-SUB3 may have a rectangular shape when viewed in cross section, but the shape of the third portion IL-SUB3 should not be limited to the rectangular shape. That is, the third portion IL-SUB3 may have a polygonal shape including an inclined surface when viewed in cross section.

[0165] Fig.11 is a cross-sectional view showing a touch sensing unit included in a conventional display device 1000. In detail, Fig.11 The conventional display device 1000 shown includes a display panel 100 and a touch sensing unit 200 located on the display panel 100 .

[0166] The touch sensing unit 200 of the conventional display device 1000 includes a first conductive pattern 210, an insulating layer 220 covering the first conductive pattern 210, and a second conductive pattern 230 located on the insulating layer 220, and a thickness K1 of the first conductive pattern 210 is substantially equal to or slightly different from a thickness K2 of the second conductive pattern 230. In more detail, the thickness K1 of the first conductive pattern 210, the thickness K3 of the insulating layer 220, and the thickness K2 of the second conductive pattern 230 are substantially equal to or slightly different from each other. The first conductive pattern 210 covered by the insulating layer 220 causes a step difference to occur in the insulating layer 220, and as shown in FIG. Fig.11 As shown in region B, a crack occurs in a region where the step difference exists. Since the crack occurs in the insulating layer 220, the first conductive pattern 210 is electrically connected to a portion of the second conductive pattern 230 intersecting the first conductive pattern 210, and as a result, a short circuit defect (e.g., an electrical short circuit) of the touch sensing unit 200 is generated.

[0167] According to the display device DD of the present disclosure, the thickness D1 of the first conductive pattern TS-CP1 is smaller than the thickness of the conventional first conductive pattern 210, so the step difference occurring in the first touch insulating layer TS-IL1 becomes smaller, thereby minimizing the occurrence of cracks in the insulating layer. In order to effectively achieve the effect, the thickness D1 of the first conductive pattern TS-CP1 may be appropriately smaller than the thickness D3 of the first touch insulating layer TS-IL1. The thickness D3 of the first touch insulating layer TS-IL1 and the thickness D2 of the second conductive pattern TS-CP2 are substantially equal to each other or slightly different from each other. That is, according to the present embodiment, among the first conductive pattern TS-CP1, the first touch insulating layer TS-IL1 and the second conductive pattern TS-CP2, only the thickness D1 of the first conductive pattern TS-CP1 is set to be relatively thin in the display device DD, so the first touch insulating layer TS-IL1 may be prevented from being broken, or the cracks of the first touch insulating layer TS-IL1 may be reduced or minimized.

[0168] For example, the thickness D1 of the first conductive pattern TS-CP1 is equal to or greater than about 1800 angstroms and equal to or less than about 2100 angstroms, and the thickness D2 of the second conductive pattern TS-CP2 is equal to or greater than about 2700 angstroms and equal to or less than about 3500 angstroms. As an example, the thickness D1 of the first conductive pattern TS-CP1 may be about 1950 angstroms, and the thickness D2 of the second conductive pattern TS-CP2 may be about 3100 angstroms, but they should not be limited thereto or thereby.

[0169] In the present embodiment, the thickness D3 of the first touch insulating layer TS-IL1 is equal to or greater than about 2700 angstroms and equal to or less than about 3500 angstroms. As an example, the thickness D3 of the first touch insulating layer TS-IL1 may be about 3100 angstroms, but it should not be limited thereto.

[0170] FIG. 12A to FIG. 12D is a plan view illustrating a touch sensing unit included in a display device according to other embodiments of the present disclosure. FIG. 13A to FIG. 13C It is shown Fig. 12A In detail, Fig.13A Shown included in Fig. 12A The second connection portion BR2 in the first conductive pattern TS-CP1 in the area A3, Fig. 13B The second conductive pattern TS-CP2 in the area A3 is shown, Fig. 13C A stack structure of the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2 is shown.

[0171] As described above, the first connection portion BR1 may not cross the second connection portion BR2. FIG. 12A to FIG. 12D, the second connection portion BR2 does not intersect with the first connection portion BR1, and the second connection portion BR2 intersects with the first touch sensor portion SP1 and the second touch sensor portion SP2. FIG. 13A to FIG. 13C , the first touch sensor portion SP1 includes the grid lines ML defining the mesh MH as described above, and each second connection portion BR2 intersects a portion of the grid lines ML of the first touch sensor portion SP1. The second touch sensor portion SP2 includes the grid lines ML defining the mesh MH as described above, and each second connection portion BR2 intersects a portion of the grid lines ML of the second touch sensor portion SP2. In this case, the second connection portion SP2 may not have a grid shape.

[0172] In addition to the description of the second connecting portion BR2, refer to FIG. 8B to FIG. 8E The description can be applied to FIG. 12A to FIG. 12D The touch sensing unit shown in FIG. 1 is a touch sensing unit, and therefore, reference will be omitted except for the second connecting portion BR2. FIG. 12A to FIG. 12D A detailed description of the touch sensing unit is repeated.

[0173] Fig.14 is along Fig. 13C In addition to the structure (wherein, Fig. 10A and Fig. 10B The second conductive pattern TS-CP2 shown corresponds to the first connecting portion BR1 in the component of the second conductive pattern TS-CP2) and the structure (wherein, Fig.14 In addition to the different features between the second conductive pattern TS-CP2 shown in FIG. 1 and the first touch sensing portion SP1 in the component of the second conductive pattern TS-CP2 corresponding to FIG. Fig. 10A and Fig. 10B The description can be applied to Fig.14 Therefore, although different features will be described, reference will be omitted. Fig.14 A detailed description of the touch sensing unit is repeated.

[0174] Fig.15 is a cross-sectional view illustrating a portion of a touch sensing unit included in a display device according to an embodiment of the present disclosure.

[0175] The first conductive pattern TS-CP1 may have a single-layer structure or a multi-layer structure. Fig.15As shown, the first conductive pattern TS-CP1 may have a three-layer structure. The first conductive pattern TS-CP1 may include a first conductive layer CD1, a second conductive layer CD2, and a third conductive layer CD3. The first conductive layer CD1 is located on the thin film encapsulation layer TFE of the display panel DP, the second conductive layer CD2 is located on the first conductive layer CD1, and the third conductive layer CD3 is located on the second conductive layer CD2. In this case, the entire thickness D1 of the first conductive pattern TS-CP1 corresponds to the sum of the thickness G1 of the first conductive layer CD1, the thickness G2 of the second conductive layer CD2, and the thickness G3 of the third conductive layer CD3.

[0176] The resistivity of the second conductive layer CD2 is less than the resistivity of each of the first conductive layer CD1 and the third conductive layer CD3. That is, the second conductive layer CD2 has excellent conductivity when compared with the conductivity of each of the first conductive layer CD1 and the third conductive layer CD3. As long as the first conductive layer CD1, the second conductive layer CD2 and the third conductive layer CD3 satisfy the above relationship, each of the first conductive layer CD1, the second conductive layer CD2 and the third conductive layer CD3 may include a typical material. For example, each of the first conductive layer CD1, the second conductive layer CD2 and the third conductive layer CD3 may include silver, copper, aluminum, titanium, molybdenum or an alloy thereof. As another example, each of the first conductive layer CD1 and the third conductive layer CD3 may include titanium (Ti), and the second conductive layer CD2 may include aluminum (Al).

[0177] The thickness G2 of the second conductive layer CD2 may be greater than the thickness G1 of the first conductive layer CD1 and the thickness G3 of the third conductive layer CD3. The thickness G2 of the second conductive layer CD2 may be, for example, six times the thickness G1 of the first conductive layer CD1. The thickness G2 of the second conductive layer CD2 may be, for example, four times the thickness G3 of the third conductive layer CD3.

[0178] The thickness G3 of the third conductive layer CD3 may be greater than the thickness G1 of the first conductive layer CD1. The thickness G3 of the third conductive layer CD3 may be, for example, one and a half times the thickness G1 of the first conductive layer CD1. In other embodiments, the thickness G3 of the third conductive layer CD3 may be, for example, one and a half to three times the thickness G1 of the first conductive layer CD1.

[0179] The second conductive layer CD2 is an essential component of the first conductive pattern CP1 used as a conductive pattern, and the first conductive layer CD1 and the third conductive layer CD3 are used as protective layers to protect the second conductive layer CD2 to obtain process stability. In detail, the first conductive layer CD1 protects the second conductive layer CD2 from defects occurring under the touch sensing unit TS, and the third conductive layer CD3 prevents the second conductive layer CD2 from being damaged during the etching process.

[0180] As described above, since the first conductive layer CD1 and the third conductive layer CD3 have different purposes, the first conductive layer CD1 and the third conductive layer CD3 may appropriately have different thicknesses. That is, since the third conductive layer CD3 may appropriately have a predetermined thickness or more so that the second conductive layer CD2 is protected during the etching process, only the thickness G1 of the first conductive layer CD1 is controlled to be small, so the entire thickness D1 of the first conductive pattern CP1 may be less than the entire thickness D2 of the second conductive pattern CP2. However, the thickness G1 of the first conductive layer CD1 may still appropriately have a predetermined thickness or more, for example, the thickness G1 of the first conductive layer CD1 may be about 50 angstroms or more. In the case where the thickness G1 of the first conductive layer CD1 is less than about 50 angstroms, the first conductive layer CD1 may not be used as a protective layer for protecting the second conductive layer CD2.

[0181] For example, the thickness G1 of the first conductive layer CD1 is in the range of about 50 angstroms to about 200 angstroms, the thickness G2 of the second conductive layer CD2 is in the range of about 1000 angstroms to about 1800 angstroms, and the thickness G3 of the third conductive layer CD3 is in the range of about 250 angstroms to about 350 angstroms. In detail, the thickness G1 of the first conductive layer CD1 may be about 150 angstroms, the thickness G2 of the second conductive layer CD2 may be about 1500 angstroms, and the thickness G3 of the third conductive layer CD3 may be about 300 angstroms. However, the thicknesses G1, G2, and G3 of the first conductive layer CD1, the second conductive layer CD2, and the third conductive layer CD3 should not be limited thereto or thereby.

[0182] Fig.16 is a cross-sectional view illustrating a touch sensing unit included in a display device according to an embodiment of the present disclosure.

[0183] Reference Fig.16 , the second conductive pattern TS-CP2 may have a multi-layer structure similar to the first conductive pattern TS-CP1, but it should not be limited thereto or thereby. If the second conductive pattern TS-CP2 is thicker than the first conductive pattern TS-CP1, the second conductive pattern TS-CP2 may have a single-layer structure.

[0184] The second conductive pattern TS-CP2 may have a three-layer structure. The second conductive pattern TS-CP2 may include a fourth conductive layer CD4, a fifth conductive layer CD5, and a sixth conductive layer CD6. The fourth conductive layer CD4 is located on the first touch insulating layer TS-IL1, the fifth conductive layer CD5 is located on the fourth conductive layer CD4, and the sixth conductive layer CD6 is located on the fifth conductive layer CD5. In this case, the entire thickness D2 of the second conductive pattern TS-CP2 corresponds to the sum of the thickness G4 of the fourth conductive layer CD4, the thickness G5 of the fifth conductive layer CD5, and the thickness G6 of the sixth conductive layer CD6.

[0185] The resistivity of the fifth conductive layer CD5 is less than the resistivity of each of the fourth conductive layer CD4 and the sixth conductive layer CD6. That is, when compared with the conductivity of each of the fourth conductive layer CD4 and the sixth conductive layer CD6, the fifth conductive layer CD5 has excellent conductivity. As long as the fourth conductive layer CD4, the fifth conductive layer CD5 and the sixth conductive layer CD6 satisfy the above relationship, each of the fourth conductive layer CD4, the fifth conductive layer CD5 and the sixth conductive layer CD6 may include a typical material. For example, each of the fourth conductive layer CD4, the fifth conductive layer CD5 and the sixth conductive layer CD6 may include silver, copper, aluminum, titanium, molybdenum or an alloy thereof. As another example, each of the fourth conductive layer CD4 and the sixth conductive layer CD6 may include titanium (Ti), and the fifth conductive layer CD5 may include aluminum (Al).

[0186] The thickness G5 of the fifth conductive layer CD5 may be greater than the thickness G4 of the fourth conductive layer CD4 and the thickness G6 of the sixth conductive layer CD6. The thickness G5 of the fifth conductive layer CD5 may be, for example, four times the thickness G4 of the fourth conductive layer CD4. The thickness G5 of the fifth conductive layer CD5 may be, for example, four times the thickness G6 of the sixth conductive layer CD6.

[0187] The fifth conductive layer CD5 is an essential component of the second conductive pattern CP2 used as a conductive pattern, and the fourth conductive layer CD4 and the sixth conductive layer CD6 are used as protective layers to protect the fifth conductive layer CD5 so as to obtain process stability. In detail, the fourth conductive layer CD4 protects the fifth conductive layer CD5 from defects occurring under the second conductive pattern CP2, and the sixth conductive layer CD6 prevents the fifth conductive layer CD5 from being damaged during the etching process.

[0188] The thickness G2 of the second conductive layer CD2 may be smaller than the thickness G5 of the fifth conductive layer CD5. That is, by making the thickness G2 of the second conductive layer CD2 smaller than the thickness G5 of the fifth conductive layer CD5, the entire thickness of the first conductive pattern TS-CP1 may become smaller than the entire thickness of the second conductive pattern TS-CP2.

[0189] The thickness G1 of the first conductive layer CD1 may be smaller than the thickness G4 of the fourth conductive layer CD4. That is, by making the thickness G1 of the first conductive layer CD1 smaller than the thickness G4 of the fourth conductive layer CD4 as the lower protective layer of the second conductive pattern TS-CP2, the entire thickness of the first conductive pattern TS-CP1 may become smaller than the entire thickness of the second conductive pattern TS-CP2.

[0190] For example, the thickness G4 of the fourth conductive layer CD4 is in the range of about 250 angstroms to about 350 angstroms, the thickness G5 of the fifth conductive layer CD5 is in the range of about 2200 angstroms to about 2800 angstroms, and the thickness G6 of the sixth conductive layer CD6 is in the range of about 250 angstroms to about 350 angstroms. In detail, the thickness G4 of the fourth conductive layer CD4 may be about 300 angstroms, the thickness G5 of the fifth conductive layer CD5 may be about 2500 angstroms, and the thickness G6 of the sixth conductive layer CD6 may be about 300 angstroms. However, the thicknesses G4, G5, and G6 of the fourth conductive layer CD4, the fifth conductive layer CD5, and the sixth conductive layer CD6 should not be limited thereto or thereby.

[0191] The display device DD according to the embodiment of the present disclosure can reduce the occurrence of cracks in the insulating layer (eg, the first touch insulating layer TS-IL1) included in the touch sensing unit TS. Therefore, the display device DD according to the embodiment of the present disclosure can reduce the electrical short circuit defect of the touch sensing unit TS.

[0192] Although embodiments of the present invention have been described, it should be understood that the present invention should not be limited to these embodiments, but a person skilled in the art may make various changes and modifications within the spirit and scope of the present invention as defined by the claims and their functional equivalents.

Claims

1. A display device, comprising: Display panel; as well as A touch sensing unit is located on the display panel. Wherein, the display panel comprises: Base layer; A circuit layer, located on the substrate layer; an organic light-emitting device layer, located on the circuit layer; and a thin film encapsulation layer, located on the organic light emitting device layer, and The touch sensing unit comprises: A first conductive pattern, located on the display panel; an insulating layer, covering the first conductive pattern; a second conductive pattern, located on the insulating layer, a portion of the second conductive pattern intersecting the first conductive pattern; and an inorganic layer, directly located between the first conductive pattern and the thin film encapsulation layer, Wherein, the thickness of the first conductive pattern is smaller than the thickness of the second conductive pattern, Wherein, the thin film encapsulation layer comprises at least one inorganic thin layer and at least one organic thin layer, and Each of the at least one inorganic thin layer and the at least one organic thin layer is integrally stacked with the organic light emitting device layer.

2. The display device according to claim 1, wherein: The thin film encapsulation layer comprises: a lower inorganic thin layer, adjacent to the organic light-emitting device layer; and The upper inorganic thin layer is directly located below the touch sensing unit.

3. The display device according to claim 2, wherein: The lower inorganic thin layer includes a first sublayer and a second sublayer stacked sequentially, and The first sublayer and the second sublayer have different inorganic materials.

4. The display device according to claim 1, wherein: The at least one inorganic thin layer includes at least one of silicon nitride, silicon oxynitride, and silicon oxide.

5. The display device according to claim 1, wherein: The thin film encapsulation layer includes a first inorganic thin layer, a first organic thin layer, and a second inorganic thin layer stacked sequentially, and Each of the first inorganic thin layer and the second inorganic thin layer has a two-layer structure.

6. The display device according to claim 5, wherein: The first inorganic thin layer includes a first sublayer and a second sublayer, and the first sublayer and the second sublayer have different inorganic materials.

7. The display device according to claim 5, wherein: The second inorganic thin layer includes a first sublayer and a second sublayer, and the first sublayer and the second sublayer are deposited using the same inorganic material in different environments.

8. The display device according to claim 1, wherein: The second conductive pattern comprises: a first connecting portion; first touch sensor portions connected to each other through the first connecting portion; and a second touch sensor portion spaced apart from the first touch sensor portion, and The first conductive pattern includes a second connection portion connected to the second touch sensor portion.

9. The display device according to claim 1, wherein: The thickness of the first conductive pattern is smaller than the thickness of the insulating layer.

10. The display device according to claim 1, wherein: The thickness of the first conductive pattern is above the following, And the thickness of the second conductive pattern is above the following.

11. The display device according to claim 1, wherein: The first conductive pattern comprises: A first conductive layer, located on the display panel; a second conductive layer, located on the first conductive layer; and a third conductive layer, located on the second conductive layer, The resistivity of the second conductive layer is smaller than the resistivity of the first conductive layer and the third conductive layer. And the thickness of the second conductive layer is greater than the thickness of the first conductive layer and the thickness of the third conductive layer.

12. The display device according to claim 11, wherein: The thickness of the third conductive layer is greater than that of the first conductive layer.

13. The display device according to claim 12, wherein: The thickness of the third conductive layer is not less than 1.5 times and not more than 3 times the thickness of the first conductive layer.

14. The display device according to claim 11, wherein: The thickness of the first conductive layer is to The thickness of the second conductive layer is to and The thickness of the third conductive layer is to 15. The display device according to claim 11, wherein: Each of the first conductive layer and the third conductive layer includes Ti, and The second conductive layer includes Al.

16. The display device according to claim 11, wherein: The second conductive pattern comprises: a fourth conductive layer, located on the insulating layer; a fifth conductive layer, located on the fourth conductive layer; and a sixth conductive layer, located on the fifth conductive layer, The resistivity of the fifth conductive layer is smaller than the resistivity of the fourth conductive layer and the sixth conductive layer. And the thickness of the fifth conductive layer is greater than the thickness of the fourth conductive layer and the thickness of the sixth conductive layer.

17. The display device according to claim 16, wherein: The thickness of the second conductive layer is smaller than the thickness of the fifth conductive layer.

18. The display device according to claim 16, wherein: The thickness of the first conductive layer is smaller than the thickness of the fourth conductive layer.

19. The display device according to claim 16, wherein: The thickness of the fourth conductive layer is to The thickness of the fifth conductive layer is to and The thickness of the sixth conductive layer is to 20. The display device according to claim 16, wherein: Each of the fourth conductive layer and the sixth conductive layer includes Ti, and The fifth conductive layer includes Al.

21. The display device according to claim 8, wherein: Each of the first touch sensor portion and the second touch sensor portion includes a plurality of grid lines defining a plurality of meshes, and The second connection portion crosses the grid lines of the first touch sensor portion and the grid lines of the second touch sensor portion.

22. The display device according to claim 8, wherein: A contact hole is defined in the insulating layer, and The second connection portion is connected to the second touch sensor portion through the contact hole.

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