Crystal cutting device

Abstract

The present invention discloses a crystal cutting device, comprising a pay-off roller, a take-up roller, a cutting wire, a wire net driving mechanism and a crystal fixing device, wherein the cutting wire released by the pay-off roller is wound around the wire net driving mechanism and then wound on the take-up roller; a slot body is provided on the wire net driving mechanism, and the cutting wire is wound along the slot body on the wire net driving mechanism to form a cutting wire net, and the crystal fixing device is located on one side of the cutting wire net, and the crystal fixing device comprises a lifting component and a crystal support, and the crystal fixing device further comprises: a connecting plate, the connecting plate is connected to one end of the lifting component; a deflection adjustment component for driving the connecting plate to deflect to adjust the cutting position of the crystal by the cutting wire net, the deflection adjustment component cooperates with the connecting plate; and a crystal support connecting component, the crystal support connecting component is fixed to the connecting plate, and the crystal support connecting component cooperates with the crystal support. The present invention has the advantage of improving the crystal orientation of the cut silicon wafer.

Description

Technical Field

[0001] The invention relates to the technical field of crystal cutting, and in particular to a crystal cutting device. Background Art

[0002] CN108501232A discloses a cutting method for a diamond wire cutting device for polysilicon, comprising: wire feeding by a wire pay-off roller: the wire pay-off roller and the wire take-up roller rotate, the wire storage section of the wire pay-off roller pays off the wire to the wire take-up roller, the wire arrangement swing arm swings, and under the guidance of the wire arrangement wheel, k kilometers of diamond wire is wound on the wire take-up wheel; wire feeding by a wire take-up wheel: the wire pay-off roller and the wire take-up roller rotate in opposite directions, the wire take-up wheel pays off the wire to the wire pay-off wheel, the wire arrangement swing arm swings, and under the guidance of the wire arrangement wheel, m kilometers of diamond wire is wound on the wire pay-off wheel; wire feeding cutting: the wire take-up wheel continues to pay off n kilometers of diamond wire to the wire pay-off wheel, and at the same time the crystal support descends, so that the crystal rod is pressed down toward the wire net until the crystal rod is cut into several pieces by the wire net. Dry film; pay-off wheel and take-up wheel recycling line: the crystal support rises, driving the crystal rod and the wire mesh to separate, the pay-off roller and the take-up roller rotate, the pay-off wheel pays off the wire to the take-up wheel, so that the (m+n) kilometers of diamond wire on the pay-off wheel are all recovered and wound on the take-up wheel; the take-up wheel then pays off the wire to the pay-off roller storage section, so that the k kilometers of diamond wire on the take-up wheel are all recovered and wound on the pay-off roller storage section; the pay-off roller storage section then pays off the wire to the take-up roller storage section, so that the take-up roller storage section is wound with (kmn) kilometers of diamond wire; the pay-off roller storage section runs empty: the pay-off roller and the take-up roller rotate, and under the guidance of the wire arrangement swing arm, the pay-off roller storage section pays off h kilometers of diamond wire to the take-up roller storage section.

[0003] Due to the various characteristics of crystals (polycrystalline silicon), people have different crystal orientation accuracy requirements for the use of various crystals, and different crystal planes have different hardness, elastic modulus and fracture strength during the cutting process, and the thickness difference and warpage of the cut materials are also very different. For silicon wafers with high cutting requirements (such as silicon wafers used to prepare chips), they need to be cut in a specific way. For the above-mentioned cutting method, although it avoids the problems of TTV, warping and line marks caused by old wire cutting. However, since the positions of the diamond wire and the silicon rod used for cutting in CN108501232A are fixed and cannot be adjusted, the cutting cannot be performed according to the crystal orientation arrangement, resulting in low crystal orientation accuracy of the cut silicon wafer. Summary of the invention

[0004] The invention provides a crystal cutting device which can improve the crystal orientation of a silicon slice.

[0005] The technical solutions to the above technical problems are as follows:

[0006] A crystal cutting device comprises a pay-off roller, a take-up roller, a cutting wire, a wire net driving mechanism and a crystal fixing device. The cutting wire paid out by the pay-off roller passes around the wire net driving mechanism and is then wound on the take-up roller. A groove body is provided on the wire net driving mechanism. The cutting wire is wound along the groove body on the wire net driving mechanism to form a cutting wire net. The crystal fixing device is located on one side of the cutting wire net. The crystal fixing device comprises a lifting component and a crystal support. The crystal fixing device further comprises:

[0007] A connecting plate connected to one end of the lifting component;

[0008] A deflection adjustment component is used to drive the connection plate to deflect so as to adjust the cutting position of the crystal being cut by the cutting wire net, and the deflection adjustment component cooperates with the connection plate;

[0009] The crystal support connecting component is fixed to the connecting plate, and the crystal support connecting component cooperates with the crystal support.

[0010] The present invention drives the connecting plate through the deflection adjustment component, so that the connecting plate deflects, and the crystal support connecting component and the crystal support connected to the crystal support connecting component deflect synchronously with the connecting plate 7, thereby changing the position of the crystal. Since the position of the cutting wire mesh is fixed, when the position of the crystal changes, the position where the crystal is cut by the cutting wire mesh changes. Through such adjustment, the crystal can be cut according to the crystal orientation arrangement, thereby improving the crystal orientation accuracy of the cut silicon wafer.

[0011] In the present invention, the diamond wire is used as the cutting wire and the wire mesh driving mechanism has a structure with two driving rollers, which is particularly suitable for cutting 8-inch crystals. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of a crystal cutting device;

[0013] Figure 2 For Figure 1 A schematic diagram after hiding some parts on the basis;

[0014] Figure 3 For Figure 2 A schematic diagram after hiding some parts on the basis;

[0015] Figure 4 It is an assembly drawing of the connection plate, the crystal support connection component and the guide component;

[0016] Figure 5 A schematic diagram of the structure of the middle guide component;

[0017] Markings in the attached drawings:

[0018] 1 is a pay-off roller, 2 is a take-up roller, 3 is a cutting line, 4 is a rotary drive mechanism, 5 is a transmission roller, 6 is a lifting component, 7 is a connecting plate, 8 is an adjusting block, 8a is a mounting hole, 9 is a first clamping component, 9a is a first supporting portion, 10 is a second clamping component, 10a is a second supporting portion, 10b is a wedge-shaped portion, 11 is a sliding space, 12 is a tightening bolt, 13 is a push-up block, 14 is a guide component, 14a is a first side surface, 14b is a second side surface, 15 is an intermediate connecting component, 16 is a bottom plate, 17 is a resin mounting plate, and A is a crystal. DETAILED DESCRIPTION

[0019] Combine the following Figures 1 to 5 The present invention will be described.

[0020] The crystal cutting device of the present invention comprises a wire-paying roller 1, a wire-taking roller 2, a cutting wire 3, a wire net driving mechanism and a crystal fixing device. The cutting wire 3 paid out by the wire-paying roller 1 is wound around the wire net driving mechanism and then wound on the wire-taking roller 2; the cutting wire 3 preferably adopts a diamond wire. A groove body is provided on the wire net driving mechanism, and the cutting wire 3 is wound along the groove body on the wire net driving mechanism to form a cutting wire net (not shown in the figure). The wire net driving mechanism comprises a rotating driving mechanism 4 and two parallel arranged transmission rollers 5, and the rotating driving mechanism 4 is connected to one of the transmission rollers 5. The rotating driving mechanism 4 preferably adopts a structure composed of a motor and a belt transmission mechanism, and the groove body is arranged on the transmission roller 5.

[0021] The crystal fixing device is located on one side of the cutting wire mesh, and the crystal fixing device includes a lifting component 6 and a crystal support, wherein the lifting component 6 includes a lifting motor, a screw mechanism and a lifting workbench, the lifting motor is connected to the screw mechanism, and the screw mechanism is connected to the lifting workbench. When cutting, the lifting component 6 drives the crystal A along the longitudinal direction ( Figure 1 Feed in the up and down directions.

[0022] The crystal holder includes a guide component 14, an intermediate connecting component 15, a base plate 16 and a resin mounting plate 17. The guide component 14 and the intermediate connecting component 15 are preferably fixed by screws, the intermediate connecting component 15 and the base plate 16 are preferably fixed by screws, the resin mounting plate 17 and the base plate 16 are preferably fixed by bonding, and the resin mounting plate 17 is used to bond and fix the crystal A.

[0023] The crystal fixing device also includes a connecting plate 7, a deflection adjustment component that drives the connecting plate 7 to deflect to adjust the cutting position of the crystal A being cut by the cutting wire mesh, and a crystal support connecting component. The connecting plate 7 is connected to one end of the lifting component 6, and the connecting plate 7 and the lifting component 6 are fixed by fastening bolts. The deflection adjustment component cooperates with the connecting plate 7, the crystal support connecting component is fixed to the connecting plate 7, and the crystal support connecting component cooperates with the crystal support. Preferably, the guide component 14 in the crystal support cooperates with the crystal support connecting component.

[0024] The connecting plate 7 is driven by the deflection adjustment component to make the connecting plate 7 deflect, and the crystal support connecting component and the crystal support connected to the crystal support connecting component deflect synchronously with the connecting plate 7, thereby changing the position of the crystal A. Since the position of the cutting wire mesh is fixed, when the position of the crystal A changes, the position where the crystal A is cut by the cutting wire mesh changes. Through such adjustment, the crystal can be cut according to the crystal orientation arrangement, thereby improving the crystal orientation accuracy of the cut silicon wafer.

[0025] The deflection adjustment components are divided into two groups, each group of deflection adjustment components includes an adjustment block 8 and an adjustment screw (not shown in the figure), the adjustment block 8 is fixedly connected to the lifting component 6, and the adjustment block 8 and the lifting component 6 are preferably fixedly connected by fastening screws, and the adjustment block 8 and the lifting component 6 can also be fixed by rivets or welding. The adjustment block 8 is provided with a mounting hole 8a for connecting the adjustment screw, and the adjustment screw cooperates with the connecting plate 7 to drive the connecting plate 7 to deflect. Preferably, the adjustment screw abuts against the connecting plate 7 during adjustment.

[0026] When the adjusting screws in one set of the yaw adjustment assembly remain stationary, and the adjusting screws in the other set of the yaw adjustment assembly are fed, one end of the connecting plate 7 is subjected to the feeding force of the adjusting screw, so that the connecting plate 7 can yaw with the abutting position of the adjusting screw abutting against the other end as the rotation center. After adjusting to the required position, the connecting plate 7 is fixed to the lifting component 6 with fastening bolts. During the adjustment process, the crystal orientation of crystal A is detected in conjunction with a crystal orientation detection instrument to ultimately determine the position where the connecting plate 7 is fixedly connected to the lifting component 6. The present invention uses the yaw adjustment assembly of the above structure to manually adjust the connecting plate 7, which is conducive to controlling the adjusted position, so that the crystal orientation detection instrument can detect crystal A, which helps to quickly determine the position of crystal A and achieve the purpose of rapid and controllable adjustment.

[0027] The crystal tray connecting assembly includes a first clamping component 9, a second clamping component 10, and a clamping component. The first clamping component 9 has a first supporting portion 9a for supporting the crystal tray, and the first clamping component 9 is fixed to the connecting plate 7. The second clamping component 10 has a second supporting portion 10a for supporting the crystal tray, and the second clamping component 10 is fixed to the connecting plate 7. A sliding space 11 for the crystal tray to slide is formed between the first clamping component 9 and the second clamping component 10. After the guide component 14 in the crystal tray is inserted into the sliding space 11, it is supported by the first supporting portion 9a and the second supporting portion 10a respectively.

[0028] The clamping assembly is arranged on the first clamping part 9 and / or the second clamping part 10. Preferably, the clamping assembly is arranged on the first clamping part 9. After the crystal holder is matched in the sliding space 11, the crystal holder is respectively pressed against the clamping assembly, the connecting plate 7 and the first clamping part 9 or the second clamping part 10. Preferably, a groove is provided on the connecting plate 7, and one end of the crystal holder connecting assembly is matched in the groove and then fixed to the connecting plate 7, that is, one end of the first clamping part 9 and the second clamping part 10 is matched with the groove on the connecting plate 7.

[0029] A wedge-shaped portion 10b is provided at a portion of the second clamping member 10 opposite to the first clamping member 9. At least the first side surface 14a of the portion of the crystal holder located in the sliding space 11 is an inclined surface, and the first side surface 14a is a surface corresponding to the wedge-shaped portion 10b. Preferably, the guide member 14 is located in the sliding space 11, and the first side surface 14a of the guide member 14 is preferably set as an inclined surface, and the first side surface 14a cooperates with the wedge-shaped portion 10b.

[0030] The clamping assembly includes a plurality of clamping bolts 12 threadedly connected to the first clamping part 9 or the second clamping part 10, and a push block 13, one end of the push block 13 cooperates with the clamping bolts 12, and the other end of the push block 13 cooperates with the crystal support, and the surface where the crystal support and the push block 13 cooperate is the second side surface 14b of the crystal support, the second side surface 14b is an inclined surface, and the push block 13 is a wedge-shaped block.

[0031] After cutting one crystal A and replacing it with another one, loosen the tightening bolt 12, take the crystal tray out of the crystal tray connecting assembly, adhere the resin mounting plate 17 bonded with the crystal A to the bottom plate 16, and insert the guide component 14 into the sliding space 11. The guide component 14 is supported by the first support portion 9a and the second support portion 10a respectively. Through the action of the tightening bolt 12 and the abutting block 13, the guide component 14 abuts against the tightening assembly, the connecting plate 7 and the first clamping component 9 or the second clamping component 10 respectively, so that the crystal tray is fixed.

Claims

1. A crystal cutting device, comprising a pay-off roller, a take-up roller, a cutting wire, a wire net driving mechanism and a crystal fixing device, wherein the cutting wire released by the pay-off roller passes around the wire net driving mechanism and is wound on the take-up roller; a groove body is provided on the wire net driving mechanism, and the cutting wire is wound along the groove body on the wire net driving mechanism to form a cutting wire net, and the crystal fixing device is located on one side of the cutting wire net, and the crystal fixing device comprises a lifting component and a crystal support, and is characterized in that: The crystal fixing device also includes: A connecting plate connected to one end of the lifting component; A deflection adjustment component is used to drive the connection plate to deflect so as to adjust the cutting position of the crystal being cut by the cutting wire net, and the deflection adjustment component cooperates with the connection plate; A crystal support connection component, the crystal support connection component is fixed to the connection plate, and the crystal support connection component cooperates with the crystal support; The deflection adjustment components are divided into two groups, each group of deflection adjustment components includes an adjustment block and an adjustment screw, the adjustment block is fixedly connected to the lifting component, a mounting hole for connecting the adjustment screw is provided on the adjustment block, and the adjustment screw cooperates with the connecting plate to drive the connecting plate to deflect; The adjusting screw abuts against the connecting plate during adjustment; The crystal support connection components include: A first clamping component, the first clamping component has a first supporting portion for supporting the crystal support, and the first clamping component is fixed to the connecting plate; A second clamping component, the second clamping component has a second supporting portion for supporting the crystal tray, the second clamping component is fixed to the connecting plate, and a sliding space for the crystal tray to slide is formed between the first clamping component and the second clamping component; A tightening assembly, which is arranged on the first clamping component and / or the second clamping component; After the crystal tray is matched in the sliding space, the crystal tray abuts against the pressing assembly, the connecting plate and the first clamping part or the second clamping part respectively.

2. The crystal cutting device according to claim 1, characterized in that: A wedge-shaped portion is provided at a portion of the second clamping component opposite to the first clamping component, and at least a first side surface of a portion of the crystal holder located in the sliding space is an inclined surface, and the first side surface cooperates with the wedge-shaped portion.

3. The crystal cutting device according to claim 1, characterized in that: The tightening assembly comprises: A plurality of jacking bolts threadably connected to the first clamping member or the second clamping member; A supporting block, one end of which cooperates with the tightening bolt, and the other end of which cooperates with the crystal support.

4. The crystal cutting device according to claim 3, characterized in that: The surface where the crystal holder and the abutting block cooperate is the second side surface of the crystal holder, the second side surface is an inclined surface, and the abutting block is a wedge-shaped block.

5. The crystal cutting device according to claim 1, characterized in that: The connecting plate is provided with a groove, and one end of the crystal support connecting assembly is fitted in the groove and then fixed to the connecting plate.

6. The crystal cutting device according to claim 1, characterized in that: The wire web driving mechanism comprises a rotary driving mechanism and two driving rollers arranged in parallel, wherein the rotary driving mechanism is connected to one of the driving rollers.

7. The crystal cutting device according to claim 1, characterized in that: The cutting wire is a diamond wire.

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