Ultra-low intermodulation product joint grounding structure

Abstract

The present invention discloses a joint grounding structure for ultra-low intermodulation products, which belongs to the field of low intermodulation products. The joint grounding structure for ultra-low intermodulation products includes a cavity, a cavity is provided in the cavity, a cross-shaped plate is connected in the cavity, and a cover plate is provided on the top of the cavity and the cross-shaped plate; an input copper sheet and an output copper sheet corresponding to the input joint and the output joint are provided in the cavity respectively; a first protrusion is connected in the circular groove, and a second protrusion is provided on the first fixing plate and the second fixing plate, the first protrusion and the second protrusion are abutted against each other, and the abutting part is a grounding surface, and the circular groove and the first fixing plate and the circular groove and the second fixing plate constitute a non-grounding area; the present invention solves the problems of unstable and unqualified indicators caused by poor joint grounding in the design process of low intermodulation products, and increases the characteristics of stability, consistency, reliability, operability, low cost, etc.

Description

Technical Field

[0001] The invention relates to the technical field of low intermodulation products, and in particular to a joint grounding structure of an ultra-low intermodulation product. Background Art

[0002] The filter is a filtering circuit composed of capacitors, inductors and resistors; the duplexer is the main accessory of the duplex radio station and repeater station. Its function is to isolate the transmitting and receiving signals to ensure that the receiving and transmitting can work normally at the same time. It is composed of two groups of bandpass filters with different frequencies to prevent the local transmitting signal from being transmitted to the receiver; the coupler, also called an adapter, is a device that transfers power between systems. It can divide one microwave power into several paths in proportion in a microwave system, and can also connect the shafts of the driving device and the driven device in the machinery.

[0003] In the design of filters, duplexers, and couplers, intermodulation indicators are currently required to avoid mutual interference between passbands. Intermodulation itself is a very linear indicator. Since the value of intermodulation cannot be calculated by any software, according to industry experience, the main reasons affecting intermodulation are as follows: poor grounding performance, poor processing accuracy, high cost, difficult to implement and control, and poor grounding due to excessive contact surface during the design process. For this reason, an ultra-low intermodulation product connector grounding structure is proposed to solve such problems. Summary of the invention

[0004] The purpose of the present invention is to solve the problems existing in the prior art and to propose an ultra-low intermodulation product joint grounding structure.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] The ultra-low intermodulation product joint grounding structure comprises a cavity, a cavity is provided in the cavity, a cross-shaped plate is connected in the cavity, and a cover plate is provided on the top of the cavity and the cross-shaped plate;

[0007] The outer wall of the cavity is fixedly connected to a first fixing plate and a second fixing plate, and the first fixing plate and the second fixing plate are respectively fixedly connected to an input connector and an output connector.

[0008] An input copper sheet and an output copper sheet corresponding to the input connector and the output connector are respectively arranged in the cavity;

[0009] A circular groove is provided on the side wall of the cavity, a first protrusion is connected in the circular groove, a second protrusion is provided on the first fixing plate and the second fixing plate, the first protrusion abuts against the second protrusion, and the abutting point is a grounding surface, and a non-grounding area is formed between the circular groove and the first fixing plate and between the circular groove and the second fixing plate.

[0010] Preferably, a first resonant column and a second resonant column are provided in the cavity, and the input copper sheet and the output copper sheet are fixedly connected to the first resonant column and the second resonant column by means of a first copper sheet fixing screw and a second copper sheet fixing screw, respectively.

[0011] Preferably, the input copper sheet and the output copper sheet are both fixedly connected with fixing rods corresponding to the input connector and the output connector.

[0012] Preferably, the cavity is provided with a through hole, and the fixing rod is connected in the through hole.

[0013] Preferably, the cover plate and the top of the cavity are both provided with first threaded holes corresponding to each other, and fastening screws are connected in the first threaded holes.

[0014] Preferably, the cover plate and the cross-shaped plate are both provided with second threaded holes corresponding to each other, the second threaded holes are connected with first tuning screws, and the cover plate is also provided with second tuning screws corresponding to the first resonant column and the second resonant column.

[0015] Preferably, the cross-shaped plate is fixed to an inner wall of one side of the cavity, and the cross-shaped plate and the cavity are integrally formed.

[0016] Preferably, the first fixing plate and the second fixing plate are both provided with a fourth threaded hole, the side wall of the cavity is provided with a third threaded hole corresponding to the position of the fourth threaded hole, the fourth threaded hole and the third threaded hole are respectively threadedly connected with a first joint fixing screw and a second joint fixing screw, the first fixing plate is fixedly connected to the outer wall of the cavity by the first joint fixing screw, and the second fixing plate is fixedly connected to the outer wall of the cavity by the second joint fixing screw.

[0017] Preferably, the first raised surface is 0.05 mm lower than the outer wall surface of the cavity.

[0018] Preferably, the second raised surface is 0.05 mm higher than the outer wall surface of the first fixing plate.

[0019] Compared with the prior art, the present invention provides an ultra-low intermodulation product joint grounding structure, which has the following beneficial effects:

[0020] 1. The connector grounding structure of the ultra-low intermodulation product, when in use, connect the input copper sheet and the output copper sheet to the first resonant column and the second resonant column, fix them by the first copper sheet fixing screw and the second copper sheet fixing screw, then connect the input connector and the output connector to the outer wall of the cavity, fix them by the first connector fixing screw and the second connector fixing screw. At this time, the position where the first protrusion and the second protrusion are against each other is the grounding surface, and the contact mode between the surfaces of the first fixing plate and the second fixing plate on the original input connector and the output connector and the outer wall of the cavity is changed to local constraint, and the contact area is reduced without changing the number and specifications of the original screws. All unit pressures are concentrated on the current small grounding surface, so the grounding performance will be much more stable than the previous large flange surface contact. The design is relatively easy to control product indicators, has high consistency, and has relatively low processing cost and batch cost, and is easy to control. It solves the problems of unstable and unqualified indicators caused by poor connector grounding in the design process of low intermodulation products, and increases the characteristics of stability, consistency, reliability, operability, low cost, etc.

[0021] The parts not involved in the device are the same as the existing technology or can be implemented by using the existing technology. The present invention solves the problems of unstable and unqualified indicators caused by poor joint grounding in the design process of low intermodulation products, and increases the characteristics of stability, consistency, reliability, operability, low cost, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a three-dimensional structural schematic diagram of the ultra-low intermodulation product joint grounding structure proposed by the present invention;

[0023] Figure 2 A schematic diagram of the top view of the grounding structure of the ultra-low intermodulation product proposed by the present invention Figure 1 ;

[0024] Figure 3 A schematic diagram of the top view of the grounding structure of the ultra-low intermodulation product proposed by the present invention Figure 2 ;

[0025] Figure 4 The ultra-low intermodulation product joint grounding structure proposed by the present invention Figure 3 Schematic diagram of the structure of the AA section;

[0026] Figure 5 This is a schematic diagram of the main view of the grounding structure of the ultra-low intermodulation product joint proposed by the present invention;

[0027] Figure 6 This is a three-dimensional structural diagram of the input connector of the connector grounding structure of the ultra-low intermodulation product proposed by the present invention;

[0028] Figure 7This is a structural schematic diagram of a cross-section of the input joint of the ultra-low intermodulation product joint grounding structure proposed by the present invention.

[0029] In the figure: 1, cover plate; 2, cavity; 201, cross-shaped plate; 202, first threaded hole; 203, second threaded hole; 204, through hole; 205, cavity; 206, third threaded hole; 207, circular groove; 208, first protrusion; 3, input connector; 301, first fixing plate; 302, fourth threaded hole; 303, second protrusion; 304, non-grounding area; 305, grounding surface; 4, first connector fixing screw; 5, output connector; 501, second fixing plate; 6, second connector fixing screw; 7, first copper sheet fixing screw; 701, first resonant column; 8, input copper sheet; 9, second copper sheet fixing screw; 901, second resonant column; 10, output copper sheet; 11, first tuning screw; 1101, second tuning screw; 12, fastening screw; 13, fixing rod. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] Example:

[0033] Reference Figure 1-7 The ultra-low intermodulation product joint grounding structure includes a cavity 2, a cavity 205 is provided in the cavity 2, a cross-shaped plate 201 is connected in the cavity 205, and a cover plate 1 is provided on the top of the cavity 2 and the cross-shaped plate 201, and the cavity 2 can be protected by the cover plate 1;

[0034] The outer wall of the cavity 2 is fixedly connected with a first fixing plate 301 and a second fixing plate 501, and the first fixing plate 301 and the second fixing plate 501 are respectively fixedly connected with an input connector 3 and an output connector 5.

[0035] An input copper sheet 8 and an output copper sheet 10 corresponding to the input connector 3 and the output connector 5 are respectively arranged in the cavity 205;

[0036] A circular groove 207 is provided on the side wall of the cavity 2, and a first protrusion 208 is connected inside the circular groove 207. A second protrusion 303 is provided on both the first fixing plate 301 and the second fixing plate 501. The first protrusion 208 abuts against the second protrusion 303, and the abutting point is a grounding surface 305. A non-grounding area 304 is formed between the circular groove 207 and the first fixing plate 301 and between the circular groove 207 and the second fixing plate 501.

[0037] Reference Figure 1 and Figure 3 A first resonant column 701 and a second resonant column 901 are provided in the cavity 205, and the input copper sheet 8 and the output copper sheet 10 are fixedly connected to the first resonant column 701 and the second resonant column 901 by means of a first copper sheet fixing screw 7 and a second copper sheet fixing screw 9 respectively.

[0038] Reference Figure 4 and Figure 7 The input copper sheet 8 and the output copper sheet 10 are both fixedly connected with fixing rods 13 corresponding to the input connector 3 and the output connector 5 .

[0039] Reference Figure 4 and Figure 7 A through hole 204 is provided on the cavity 2, and the fixing rod 13 is connected in the through hole 204. The through hole 204 allows the fixing rod 13 to be easily placed.

[0040] Reference Figure 2 and Figure 5 The cover plate 1 and the top of the cavity 2 are both provided with first threaded holes 202 corresponding to each other, and the first threaded holes 202 are connected with fastening screws 12.

[0041] Reference Figure 1 and Figure 2 The cover plate 1 and the cross-shaped plate 201 are both provided with second threaded holes 203 corresponding to each other, and the first tuning screw 11 is connected in the second threaded hole 203. The cover plate 1 is also provided with a second tuning screw 1101 corresponding to the first resonant column 701 and the second resonant column 901.

[0042] Reference Figure 1 and Figure 2 The cross-shaped plate 201 is fixed to an inner wall of one side of the cavity 205 , and the cross-shaped plate 201 and the cavity 2 are integrally formed.

[0043] Reference Figure 1-7, a fourth threaded hole 302 is provided on the first fixing plate 301 and the second fixing plate 501, and a third threaded hole 206 corresponding to the position of the fourth threaded hole 302 is provided on the side wall of the cavity 2, and a first joint fixing screw 4 and a second joint fixing screw 6 are respectively threadedly connected in the fourth threaded hole 302 and the third threaded hole 206, and the first fixing plate 301 is fixedly connected to the outer wall of the cavity 2 by the first joint fixing screw 4, and the second fixing plate 501 is fixedly connected to the outer wall of the cavity 2 by the second joint fixing screw 6. When in use, the fourth threaded hole 302 on the first fixing plate 301 is aligned with the third threaded hole 206 on the cavity 2, and then the first joint fixing screw 4 is connected in the third threaded hole 206 and the fourth threaded hole 302, so that the first fixing plate 301 can be fixed, and the same method can be used, and then the second fixing plate 501 can be fixed by the second joint fixing screw 6, so that the input connector 3 and the output connector 5 are conveniently connected.

[0044] Reference Figure 1 , Figure 6 and Figure 7 The surface of the first protrusion 208 is 0.05 mm lower than the outer wall surface of the cavity 2.

[0045] Reference Figure 1 , Figure 6 and Figure 7 The surface of the second protrusion 303 is 0.05 mm higher than the outer wall surface of the first fixing plate 301, which can facilitate the matching of the first protrusion 208 and the second protrusion 303 and make the matching more stable.

[0046] In the present invention, when in use, the input copper sheet 8 and the output copper sheet 10 are connected to the first resonant column 701 and the second resonant column 901, and fixed by the first copper sheet fixing screw 7 and the second copper sheet fixing screw 9, and then the input connector 3 and the output connector 5 are connected to the outer wall of the cavity 2, and fixed by the first connector fixing screw 4 and the second connector fixing screw 6. At this time, the position where the first protrusion 208 and the second protrusion 303 are against each other is the grounding surface 305. By changing the contact mode between the surfaces of the first fixing plate 301 and the second fixing plate 501 on the original input connector 3 and the output connector 5 and the outer wall of the cavity 2 to local constraints, the contact area is reduced without changing the original number of screws and screw specifications. All unit pressures are concentrated on the current small grounding surface 305, so the grounding performance will be much more stable than the previous large flange surface contact. The design is relatively easy to control product indicators, has high consistency, and has relatively low processing cost and batch cost. It is easy to control, solves the problems of unstable and unqualified indicators due to poor joint grounding in the design process of low intermodulation products, and increases the characteristics of stability, consistency, reliability, operability, low cost, etc.

[0047] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An ultra-low intermodulation product joint grounding structure, comprising a cavity (2), characterized in that: A cavity (205) is provided in the cavity (2), a cross-shaped plate (201) is connected to the cavity (205), and a cover plate (1) is provided on the top of the cavity (2) and the cross-shaped plate (201); The outer wall of the cavity (2) is fixedly connected with a first fixing plate (301) and a second fixing plate (501); the first fixing plate (301) and the second fixing plate (501) are respectively fixedly connected with an input connector (3) and an output connector (5); and an input copper sheet (8) and an output copper sheet (10) corresponding to the input connector (3) and the output connector (5) are respectively arranged in the cavity (205); The side wall of the cavity (2) is provided with a circular groove (207), a first protrusion (208) is connected inside the circular groove (207), the first fixing plate (301) and the second fixing plate (501) are both provided with a second protrusion (303), the first protrusion (208) and the second protrusion (303) abut against each other, and the abutting part is a grounding surface (305), and the circular groove (207) and the first fixing plate (301) and the circular groove (207) and the second fixing plate (501) form a non-grounding area (304); A first resonant column (701) and a second resonant column (901) are provided in the cavity (205); the input copper sheet (8) and the output copper sheet (10) are fixedly connected to the first resonant column (701) and the second resonant column (901) respectively by means of a first copper sheet fixing screw (7) and a second copper sheet fixing screw (9); The surface of the first protrusion (208) is 0.05 mm lower than the outer wall surface of the cavity (2).

2. The ultra-low intermodulation product joint grounding structure according to claim 1, characterized in that: The input copper sheet (8) and the output copper sheet (10) are both fixedly connected with fixing rods (13) corresponding to the input connector (3) and the output connector (5).

3. The ultra-low intermodulation product joint grounding structure according to claim 2, characterized in that: The cavity (2) is provided with a through hole (204), and the fixing rod (13) is connected in the through hole (204).

4. The ultra-low intermodulation product joint grounding structure according to claim 1, characterized in that: The cover plate (1) and the top of the cavity (2) are both provided with first threaded holes (202) corresponding to each other, and a fastening screw (12) is connected inside the first threaded hole (202).

5. The ultra-low intermodulation product joint grounding structure according to claim 4, characterized in that: The cover plate (1) and the cross-shaped plate (201) are both provided with second threaded holes (203) corresponding to each other, a first tuning screw (11) is connected inside the second threaded hole (203), and the cover plate (1) is also provided with a second tuning screw (1101) corresponding to the first resonant column (701) and the second resonant column (901).

6. The ultra-low intermodulation product joint grounding structure according to claim 5, characterized in that: The cross-shaped plate (201) is fixed to an inner wall of one side of the cavity (205), and the cross-shaped plate (201) and the cavity (2) are integrally formed.

7. The ultra-low intermodulation product joint grounding structure according to claim 1, characterized in that: The first fixing plate (301) and the second fixing plate (501) are both provided with a fourth threaded hole (302), and the side wall of the cavity (2) is provided with a third threaded hole (206) corresponding to the position of the fourth threaded hole (302), and the first joint fixing screw (4) and the second joint fixing screw (6) are respectively threadedly connected in the fourth threaded hole (302) and the third threaded hole (206), and the first fixing plate (301) is fixedly connected to the outer wall of the cavity (2) by the first joint fixing screw (4), and the second fixing plate (501) is fixedly connected to the outer wall of the cavity (2) by the second joint fixing screw (6).

8. The ultra-low intermodulation product joint grounding structure according to claim 1, characterized in that: The surface of the second protrusion (303) is 0.05 mm higher than the outer wall surface of the first fixing plate (301).

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