Bone voiceprint sensor, manufacturing method thereof, and electronic device

Abstract

The present invention discloses a bone voiceprint sensor, a manufacturing method thereof, and an electronic device. The bone voiceprint sensor comprises: a circuit substrate; a housing, the housing cover is arranged on the surface of the circuit substrate and encloses the circuit substrate to form a receiving cavity; a vibration sensing component, the vibration sensing component is arranged in the receiving cavity; and a microphone chip, the microphone chip is arranged on the surface of the circuit substrate facing the receiving cavity and is electrically connected to the circuit substrate, and the projection areas of the microphone chip and the vibration sensing component on the surface of the circuit substrate do not overlap. The technical solution of the present invention can effectively reduce the overall thickness of the bone voiceprint sensor.

Description

Technical Field

[0001] The present invention relates to the field of sensor technology, and in particular to a bone voiceprint sensor and a manufacturing method thereof, and an electronic device. Background Art

[0002] As a vibration sensor, the bone voiceprint sensor usually includes a circuit substrate, a vibration sensing device, and a vibration detection device that converts vibration into an electrical signal. The vibration sensing device has a diaphragm that senses vibration. After receiving external vibration, the diaphragm resonates to generate a resonant air wave. The vibration detection device is a microphone chip that detects the resonant air wave, converts and outputs the vibration signal to achieve the function of vibration sensing. In the related art, the vibration sensing device and the vibration detection device are usually arranged in sequence along the thickness direction, which often makes the overall thickness of the bone voiceprint sensor larger, which is not conducive to its miniaturization. Summary of the invention

[0003] The main purpose of the present invention is to provide a bone voiceprint sensor and a manufacturing method thereof, and an electronic device, aiming to reduce the overall thickness of the bone voiceprint sensor.

[0004] To achieve the above-mentioned purpose, the bone voiceprint sensor proposed in the present invention includes: a circuit substrate; a shell, wherein the shell cover is arranged on the surface of the circuit substrate and is enclosed with the circuit substrate to form a accommodating cavity; a vibration sensing component, wherein the vibration sensing component is arranged in the accommodating cavity; and a microphone chip, wherein the microphone chip is arranged on the surface of the circuit substrate facing the accommodating cavity and is electrically connected to the circuit substrate, and the projection areas of the microphone chip and the vibration sensing component on the surface of the circuit substrate do not overlap.

[0005] In one embodiment, the bone voiceprint sensor also includes a fixing plate, which is fixedly connected to the inner wall of the outer shell and extends toward the circuit substrate; the vibration sensing component has two opposite ends, one end of the vibration sensing component is fixedly connected to the fixing plate, and the other end is fixedly connected to the inner wall of the outer shell, and the microphone chip is arranged on the side of the fixing plate facing away from the vibration sensing component.

[0006] In one embodiment, one end of the fixing plate away from the inner wall of the outer shell is fixedly connected to the circuit substrate, and the fixing plate divides the accommodating cavity into two sub-accommodating cavities; the microphone chip and the vibration sensing component are respectively arranged in the two sub-accommodating cavities, and the circuit substrate is provided with a transmission channel connecting the two sub-accommodating cavities.

[0007] In one embodiment, the transmission channel has two transmission ports, and the two transmission ports are respectively connected to the two sub-accommodating chambers, one of the two transmission ports is arranged corresponding to the microphone chip, and the other one of the two transmission ports is arranged corresponding to the vibration sensing component.

[0008] In one embodiment, the vibration sensing component includes a sensing diaphragm and a mass block arranged on the surface of the sensing diaphragm, the sensing diaphragm has two opposite sides, one end of the sensing diaphragm is fixedly connected to the fixing plate, and the other end is fixedly connected to the inner wall of the shell.

[0009] In one embodiment, an integrated circuit chip is disposed in the circuit substrate, and a surface of the circuit substrate facing the accommodating cavity is provided with an exposure opening for exposing a portion of the integrated circuit chip, and the exposed portion of the integrated circuit chip is electrically connected to the microphone chip via a connecting wire.

[0010] In one embodiment, a surface of the circuit substrate facing away from the accommodating cavity is provided with an exposure opening to expose a portion of the integrated circuit chip.

[0011] The present invention also proposes a method for manufacturing a bone voiceprint sensor, comprising the following steps:

[0012] Making circuit substrates;

[0013] Mounting a microphone chip on the surface of the circuit substrate and electrically connecting the microphone chip to the circuit substrate;

[0014] The vibration sensing component is fixedly mounted on the inner wall surface of the housing;

[0015] The shell is mounted on the surface of the circuit substrate facing the microphone chip, and is enclosed with the circuit substrate to form a accommodating cavity. The microphone chip and the vibration sensing component are both located in the accommodating cavity, and the projection areas of the microphone chip and the vibration sensing component on the surface of the circuit substrate do not overlap.

[0016] In one embodiment, the step of fixing the vibration sensing component on the inner wall surface of the housing includes:

[0017] The fixing plate is mounted on the inner wall surface of the shell, and one side of the vibration sensing component is fixedly connected to the fixing plate, and the other side is fixedly connected to the inner wall surface of the shell.

[0018] In one embodiment, the steps of manufacturing the circuit substrate include:

[0019] Making a transfer channel in the circuit substrate, wherein the transfer channel has two transfer ports penetrating the surface of the circuit substrate;

[0020] The step of mounting the microphone chip on the surface of the circuit substrate includes:

[0021] Mounting a microphone chip on the surface of the circuit substrate facing the transfer port;

[0022] The step of attaching the housing to the surface of the circuit substrate facing the microphone chip and enclosing the housing with the circuit substrate to form a receiving cavity, wherein the microphone chip and the vibration sensing component are both located in the receiving cavity, and the projection areas of the microphone chip and the vibration sensing component on the surface of the circuit substrate do not overlap includes:

[0023] The side of the fixing plate away from the inner wall of the shell is fixedly connected to the circuit substrate, the two transfer ports are respectively located on both sides of the fixing plate, and the microphone chip and the vibration sensing component are respectively located on both sides of the fixing plate.

[0024] In one embodiment, the steps of manufacturing the circuit substrate include:

[0025] Mounting an integrated circuit chip in a circuit substrate, and opening a revealing opening on a surface of the circuit substrate to reveal the integrated circuit chip;

[0026] The step of mounting a microphone chip on the surface of the circuit substrate and electrically connecting the microphone chip to the circuit substrate includes:

[0027] Mounting the microphone chip on the surface of the circuit substrate provided with the exposed opening;

[0028] One end of the connecting wire is connected to the exposed portion of the integrated circuit chip, and the other end is connected to the microphone chip.

[0029] In one embodiment, after the step of mounting the integrated circuit chip in the circuit substrate and opening a revealing opening on the surface of the circuit substrate to reveal the integrated circuit chip, the method further comprises:

[0030] An exposure opening is provided on the surface of the circuit substrate where the exposure opening is not provided, so as to expose a portion of the integrated circuit chip.

[0031] The present invention also proposes an electronic device, which includes a bone voiceprint sensor, and the bone voiceprint sensor includes: a circuit substrate; a shell, the shell cover is arranged on the surface of the circuit substrate and is enclosed with the circuit substrate to form a accommodating cavity; a vibration sensing component, the vibration sensing component is arranged in the accommodating cavity; and a microphone chip, the microphone chip is arranged on the surface of the circuit substrate facing the accommodating cavity and is electrically connected to the circuit substrate, and the projection areas of the microphone chip and the vibration sensing component on the surface of the circuit substrate do not overlap.

[0032] The technical solution of the present invention is to enclose and form a housing cavity by setting the outer shell cover on the surface of the circuit substrate, and at the same time set the vibration sensing component in the housing cavity, set the microphone chip on the surface of the circuit substrate facing the housing cavity, the microphone chip is electrically connected to the circuit substrate, and the projection areas of the microphone chip and the vibration component on the surface of the circuit substrate do not overlap. That is, the microphone chip and the vibration sensing component are located on the same side of the circuit substrate, and the two are not arranged in sequence along the thickness direction, which can effectively reduce the overall thickness of the bone voiceprint sensor and facilitate its miniaturization. In addition, the reduction in the overall thickness of the bone voiceprint sensor will make the space of the housing cavity smaller, thereby effectively improving the sensitivity of the bone voiceprint sensor in sensing and detection, and at the same time improving its response speed in sensing and detection. It can be understood that when using the bone voiceprint sensor, a vibration signal or a pressure signal is input on the side of the shell facing away from the accommodating cavity, and the vibration sensing component will be excited by the vibration signal or the pressure signal and generate vibration. Since the space of the accommodating cavity is small, it will drive the gas in the accommodating cavity to vibrate more quickly and effectively, thereby causing the air pressure in the accommodating cavity to change rapidly, and then causing the microphone chip to vibrate rapidly to convert the vibration signal into an electrical signal and transmit it to the circuit substrate output, and its sensitivity is relatively high. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0034] Figure 1 A schematic cross-sectional view of an embodiment of a bone voiceprint sensor of the present invention;

[0035] Figure 2 A schematic diagram of the steps of a method for manufacturing a bone voiceprint sensor according to an embodiment of the present invention;

[0036] Figure 3 A schematic diagram of the steps of another embodiment of a method for manufacturing a bone voiceprint sensor of the present invention;

[0037] Figure 4 A schematic diagram of the steps of another embodiment of a method for manufacturing a bone voiceprint sensor;

[0038] Figure 5 for Figure 2 A schematic diagram of the cross-sectional structure involved in step S10;

[0039] Figure 6 for Figure 2A schematic diagram of the cross-sectional structure involved in step S10;

[0040] Figure 7 for Figure 2 A schematic diagram of the cross-sectional structure involved in step S10;

[0041] Figure 8 for Figure 4 A schematic diagram of the cross-sectional structure involved in step S12;

[0042] Fig. 9 for Figure 4 A schematic diagram of a cross-sectional structure involved in step S13;

[0043] Fig.10 for Figure 4 A schematic diagram of a top view structure involved in step S11;

[0044] Fig.11 for Figure 4 A schematic cross-sectional view of the structure involved in step S21;

[0045] Fig.12 for Figure 4 A schematic cross-sectional view of the structure involved in step S22;

[0046] Fig.13 for Figure 3 Schematic diagram of the cross-sectional structure involved in step S30a.

[0047] Description of Figure Numbers:

[0048] Label name Label name 100 Bone Voiceprint Sensor 20 shell 10 Circuit board 21 Accommodation cavity 10a Delivery Channel 30 Fixed plate 11 First metal layer 40 Microphone chip 12 First insulation layer 41 Bracket 13 Second insulation layer 42 Microphone diaphragm 131 Exposed mouth 50 Vibration sensor components 14 The third insulating layer 51 Sensing diaphragm 141 Reveal mouth 52 Mass 142 Mounting port 60 Integrated Circuit Chip 15 Second metal layer

[0049] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] It should be noted that all directional indications in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between various components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0052] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0053] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0055] The present invention provides a bone voiceprint sensor 100 .

[0056] Reference Figure 1 In one embodiment of the bone voiceprint sensor 100 of the present invention, the bone voiceprint sensor 100 includes: a circuit substrate 10; a housing 20, the housing 20 is covered on the surface of the circuit substrate 10, and is enclosed with the circuit substrate 10 to form a receiving cavity 21; a vibration sensing component 50, the vibration sensing component 50 is disposed in the receiving cavity 21; and a microphone chip 40, the microphone chip 40 is disposed on the surface of the circuit substrate 10 facing the receiving cavity 21, and is electrically connected to the circuit substrate 10, and the projection areas of the microphone chip 40 and the vibration sensing component 50 on the surface of the circuit substrate 10 do not overlap.

[0057] Specifically, the outer contour of the housing 20 is generally in the shape of a cube, and its material can be metal, plastic or other alloy materials, so that the practicality, reliability and durability of the housing 20 can be ensured. When the housing 20 is a metal housing 20, the housing 20 can be fixed to the surface of the circuit substrate 10 by soldering, so that the housing 20 and the circuit substrate 10 enclose a receiving cavity 21. The vibration component is arranged in the receiving cavity 21 for sensing vibration signals or pressure signals. The microphone chip 40 is usually a MEMS (Microelector Mechanical Systems) microphone chip 40, which is generally mounted on the surface of the circuit substrate 10 facing the receiving cavity 21 by conductive glue, and is electrically connected to the circuit substrate 10 by conductive wire bonding. In addition, the projection areas of the microphone chip 40 and the vibration sensing component 50 on the surface of the circuit substrate 10 do not overlap, that is, the microphone chip 40 and the vibration sensing component 50 are located on the same side of the circuit substrate 10, and the two are not arranged in sequence along the thickness direction, which can effectively reduce the overall thickness of the bone voiceprint sensor 100, which is conducive to its miniaturization development. In addition, the reduction in the overall thickness of the bone voiceprint sensor 100 will make the space of the accommodating cavity 21 smaller, thereby effectively improving the sensitivity of the bone voiceprint sensor 100 in sensing and detection. When the bone voiceprint sensor 100 is used, a vibration signal or a pressure signal is input to the side of the housing 20 facing away from the accommodating cavity 21, and the vibration sensing component 50 is excited by the vibration signal or the pressure signal and generates vibration. Since the space of the accommodating cavity 21 is small, the gas in the accommodating cavity 21 will be driven to vibrate more quickly and effectively, so that the air pressure in the accommodating cavity 21 changes rapidly, and then the microphone chip 40 vibrates rapidly to convert the vibration signal into an electrical signal and transmit it to the circuit substrate 10 for output, and its sensitivity is relatively high.

[0058] The technical solution of the present invention is to enclose and form a housing 21 by placing the housing 20 on the surface of the circuit substrate 10, and to arrange the vibration sensing component 50 in the housing 21, and to arrange the microphone chip 40 on the surface of the circuit substrate 10 facing the housing 21, and to electrically connect the microphone chip 40 to the circuit substrate 10, and the projection areas of the microphone chip 40 and the vibration component on the surface of the circuit substrate 10 do not overlap. That is, the microphone chip 40 and the vibration sensing component 50 are located on the same side of the circuit substrate 10, and the two are not arranged in sequence along the thickness direction, which can effectively reduce the overall thickness of the bone voiceprint sensor 100, and is conducive to its miniaturization. In addition, the reduction in the overall thickness of the bone voiceprint sensor 100 will make the space of the housing 21 smaller, thereby effectively improving the sensitivity of the bone voiceprint sensor 100 in sensing and detection, and at the same time improving its response speed in sensing and detection. It can be understood that when the bone voiceprint sensor 100 is used, a vibration signal or a pressure signal is inputted into the side of the housing 20 facing away from the accommodating cavity 21, and the vibration sensing component 50 is excited by the vibration signal or the pressure signal and generates vibration. Since the space of the accommodating cavity 21 is relatively small, the gas in the accommodating cavity 21 is driven to vibrate more quickly and effectively, thereby causing the air pressure in the accommodating cavity 21 to change rapidly, and then causing the microphone chip 40 to vibrate rapidly, so as to convert the vibration signal into an electrical signal and transmit it to the circuit substrate 10 for output, and its sensitivity is relatively high.

[0059] In one embodiment of the present invention, the bone voiceprint sensor 100 also includes a fixing plate 30, which is fixedly connected to the inner wall of the outer shell 20 and extends toward the circuit substrate 10. The vibration sensing component 50 has two opposite ends, one end of the vibration sensing component 50 is fixedly connected to the fixing plate 30, and the other end is fixedly connected to the inner wall of the outer shell 20. The microphone chip 40 is arranged on the side of the fixing plate 30 facing away from the vibration sensing component 50.

[0060] Here, the fixed connection method between the sensing component and the fixing plate 30 and the inner wall of the shell 20 is usually adhesive bonding, which is simple and effective. Usually, the material of the fixing plate 30 is generally the same as that of the shell 20, so that during production, the shell 20 and the fixing plate 30 can be made into an integrated structure to enhance the stability of the setting of the fixing plate 30, thereby ensuring the stability of the setting of the vibration sensing component 50 and ensuring the effectiveness and reliability of its vibration process. After the shell 20 is fixed to the circuit substrate 10, the microphone chip 40 and the vibration sensing component 50 are located on both sides of the fixing plate 30, which can effectively reduce the overall thickness of the bone voiceprint sensor 100.

[0061] Furthermore, one end of the fixing plate 30 away from the inner wall of the outer shell 20 is fixedly connected to the surface of the circuit substrate 10 facing the accommodating cavity 21. The fixing plate 30 divides the accommodating cavity 21 into two sub-accommodating cavities 21. The microphone chip 40 and the vibration sensing component 50 are respectively arranged in the two sub-accommodating cavities 21. The circuit substrate 10 is provided with a transmission channel 10a connecting the two sub-accommodating cavities 21.

[0062] Here, both ends of the fixing plate 30 are fixed, which can prevent the fixing plate 30 from vibrating when the vibration sensing component 50 vibrates, and effectively improve the stability of the setting of the fixing plate 30. In this way, the fixing plate 30 divides the accommodating chamber 21 into two independent sub-accommodating chambers 21. At this time, the circuit substrate 10 is provided with a transmission channel 10a connecting the two sub-accommodating chambers 21 to transmit air pressure changes. In addition, the microphone chip 40 and the vibration sensing component 50 are respectively located in the two sub-accommodating chambers 21, which can effectively reduce the overall thickness of the bone voiceprint sensor 100.

[0063] It can be understood that when the bone voiceprint sensor 100 is used, a vibration signal or a pressure signal is inputted into the side of the housing 20 facing away from the accommodating chamber 21, and the vibration sensing component 50 is excited by the vibration signal or the pressure signal and vibrates, causing the gas in the sub-accommodating chamber 21 where the vibration sensing component 50 is located to vibrate, thereby causing the air pressure in the sub-accommodating chamber 21 to change, and causing the air pressure in another sub-accommodating chamber 21 to change through the transmission channel 10a, thereby causing the microphone chip 40 located in the other sub-accommodating chamber 21 to vibrate and convert the vibration signal into an electrical signal for output.

[0064] In order to improve the accuracy and sensitivity of the signal detection of the microphone chip 40, and further improve the accuracy and sensitivity of the bone voiceprint sensor 100, the transmission channel 10a has two transmission ports, which are respectively connected to the two sub-accommodating chambers 21, one of the two transmission ports is set corresponding to the microphone chip 40, and the other one is set corresponding to the vibration sensing component 50.

[0065] It should be noted that the transmission channel 10a is roughly U-shaped, with two openings at both ends being two transmission ports, and passes through the surface of the circuit substrate 10. The microphone chip 40 and the vibration sensing component 50 are respectively arranged corresponding to the two transmission ports.

[0066] Please refer to Figure 1 , Fig.11 and Fig.12 The microphone chip 40 includes a bracket 41 and a microphone diaphragm 42 arranged on the bracket 41. The bracket 41 is roughly cylindrical and covers a transfer port.

[0067] Please refer to Figure 1 and Fig.13The vibration sensing component 50 includes a sensing diaphragm 51 and a mass block 52 disposed on the surface of the sensing diaphragm 51 . The sensing diaphragm 51 has two opposite ends. One end of the sensing diaphragm 51 is fixedly connected to the fixing plate 30 , and the other end is fixedly connected to the inner wall of the housing 20 .

[0068] Normally, one end of the sensing diaphragm 51 is fixed to the fixing plate 30 by gluing, and the other end is fixed to the inner wall of the housing 20 by gluing, and the mass block 52 is fixed to the surface of the sensing diaphragm 51 facing away from the circuit substrate 10 by gluing. With such a configuration, when the bone voiceprint sensor 100 is used, a vibration signal or a pressure signal is input to the side of the housing 20 facing away from the accommodating cavity 21, and the sensing diaphragm 51 and the mass block 52 are excited by the vibration signal or the pressure signal and vibrate, causing the gas in the accommodating cavity 21 to vibrate, thereby causing the air pressure in the accommodating cavity 21 to change. The change in air pressure in the accommodating cavity 21 causes the microphone diaphragm 42 of the microphone chip 40 to vibrate, and the microphone chip 40 converts the vibration signal into an electrical signal for output.

[0069] Refer again Figure 1 In one embodiment of the present invention, an integrated circuit chip 60 is disposed in the circuit substrate 10, and the circuit substrate 10 is provided with an exposure opening 141 for exposing a portion of the integrated circuit chip 60, and the exposed portion of the integrated circuit is electrically connected to the microphone chip 40 through a connecting wire.

[0070] The integrated circuit chip 60 is an ASIC (Application Specific Integrated Circuit) chip. By placing the integrated circuit chip 60 in the circuit substrate 10, the overall thickness of the bone voiceprint sensor 100 can be more effectively reduced. It should be noted that by placing the integrated circuit chip 60 in the circuit substrate 10, the integrated circuit chip 60 can be electrically connected through the metal wiring inside the circuit substrate 10, so that the electrical signal can be processed by the integrated circuit chip 60 and then output by the circuit substrate 10. Of course, in order to simplify the setting structure, the integrated circuit chip 60 can be directly used to output the electrical signal. The specific setting is: the surface of the circuit substrate 10 facing away from the accommodating cavity 21 is provided with an exposure port 131 to expose part of the integrated circuit chip 60.

[0071] It should be noted that in some other embodiments of the present invention, the integrated circuit chip 60 may be disposed on the surface of the circuit substrate 10 facing the accommodating cavity 21, and electrically connected to the circuit substrate 10 and the microphone chip 40. Specifically, the integrated circuit chip 60 is mounted on the surface of the circuit substrate 10 using conductive adhesive, and electrically connected to the circuit substrate 10 and the microphone chip 40 through lead operation, and such operation is relatively simple. The microphone chip 40 converts the vibration signal into an electrical signal and transmits the electrical signal to the integrated circuit chip 60, which is processed and output by the integrated circuit chip 60. In addition, an external pad is disposed on the surface of the circuit substrate 10 facing away from the accommodating cavity 21, and the external pad is electrically connected to the integrated circuit chip 60 through the internal metal wiring to output the electrical signal.

[0072] The present invention also provides a method for manufacturing the bone voiceprint sensor 100 .

[0073] Reference Figure 2 , Fig.12 and Fig.13 In one embodiment of a method for manufacturing a bone voiceprint sensor 100 of the present invention, the method comprises the following steps:

[0074] Step S10, manufacturing a circuit substrate 10;

[0075] Step S20, mounting a microphone chip 40 on the surface of the circuit substrate 10, and electrically connecting the microphone chip 40 to the circuit substrate 10;

[0076] Step S30, fixing the vibration sensing component 50 on the inner wall surface of the housing 20;

[0077] In step S40, the housing 20 is mounted on the surface of the circuit substrate 10 facing the microphone chip 40, and is enclosed with the circuit substrate 10 to form a receiving cavity 21, wherein the microphone chip 40 and the vibration sensing component 50 are both located in the receiving cavity 21, and the projection areas of the microphone chip 40 and the vibration sensing component 50 on the surface of the circuit substrate 10 do not overlap.

[0078] Specifically, firstly, a circuit substrate 10 is manufactured, and both surfaces of the circuit substrate 10 are provided with connection pads. Then, the microphone chip 40 is mounted on the surface of the circuit substrate 10 by gluing, and then the microphone chip 40 is electrically connected to the connection pads on the surface of the circuit substrate 10 by wire bonding. Then, the vibration sensing component 50 is installed and fixed on the inner wall surface of the housing 20. Here, the vibration sensing component 50 includes a sensing diaphragm 51 and a mass block 52. The mass block 52 is glued to the surface of the sensing diaphragm 51, and the two sides of the sensing diaphragm 51 are glued and fixed to the inner wall surface of the housing 20. In this way, the installation operation of the vibration sensing component 50 can be completed. Finally, the shell 20 with the vibration sensing component 50 is mounted on the surface of the circuit substrate 10 facing the microphone chip 40. When the shell 20 is a metal shell 20, the shell 20 is soldered to the surface of the circuit substrate 10 using solder paste. After the shell 20 is fixed, it and the circuit substrate 10 enclose a receiving cavity 21. The microphone chip 40 and the vibration sensing component 50 are both located in the receiving cavity 21, and the projection areas of the microphone chip 40 and the vibration sensing component 50 on the surface of the circuit substrate 10 do not overlap, that is, the microphone chip 40 and the vibration sensing component 50 are located on the same side of the circuit substrate 10, and the two are not arranged sequentially along the thickness direction thereof. This can effectively reduce the overall thickness of the bone voiceprint sensor 100, which is conducive to its miniaturization.

[0079] It should be noted that step S30 may be placed before step S10 or step S20, and the order of the steps is not limited, and all are within the protection scope of the present invention.

[0080] Reference Figure 3 and Fig.13 In one embodiment of the present invention, step S30, the step of fixing the vibration sensing component 50 on the inner wall surface of the housing 20, includes:

[0081] Step S30a, installing the fixing plate 30 on the inner wall surface of the housing 20 , fixing one side of the vibration sensing component 50 to the fixing plate 30 , and fixing the other side to the inner wall surface of the housing 20 .

[0082] Here, the fixing plate 30 and the housing 20 are generally processed into an integral structure by injection molding or other processes, and the sensing diaphragm 51 in the vibration sensing component 50 is glued to the fixing plate 30 on one side and glued to the inner wall of the housing 20 on the other side. This operation is relatively simple and effective, and can ensure the vibration stability and reliability of the vibration sensing component 50.

[0083] Reference Figure 4 , Figures 10 to 12 In one embodiment of the present invention, step S10, the step of manufacturing the circuit substrate 10, includes:

[0084] Step S11, making a transfer channel 10a in the circuit substrate 10, wherein the transfer channel 10a has two transfer ports penetrating the surface of the circuit substrate 10;

[0085] Step S20, in the step of mounting the microphone chip 40 on the surface of the circuit substrate 10, comprises:

[0086] Mounting a microphone chip 40 on the surface of the circuit substrate 10 facing the transfer port;

[0087] Step S40, attaching the housing 20 to the surface of the circuit substrate 10 facing the microphone chip 40, and enclosing the housing 20 with the circuit substrate 10 to form a receiving cavity 21, wherein both the microphone chip 40 and the vibration sensing component 50 are located in the receiving cavity 21, and the projection areas of the microphone chip 40 and the vibration sensing component 50 on the surface of the circuit substrate 10 do not overlap, includes:

[0088] Step S40a, fix the side of the fixing plate 30 away from the inner wall of the housing 20 to the circuit substrate 10, the two transfer ports are respectively located on one side of the fixing plate 30, and the microphone chip 40 and the vibration sensing component 50 are respectively located on both sides of the fixing plate 30.

[0089] The steps of manufacturing the circuit substrate 10 will be described in detail below with reference to the accompanying drawings.

[0090] Reference Figure 3 , Figures 5 to 10 Step S10, the steps of making the circuit substrate 10 specifically include:

[0091] (1) depositing a first insulating layer 12 and a second insulating layer 13 on both surfaces of the first metal layer 11;

[0092] (2) etching a portion of the first insulating layer 12 and the corresponding first metal layer 11, and exposing a portion of the second insulating layer 13;

[0093] (3) removing the first insulating layer 12 and depositing a third insulating layer 14, wherein the third insulating layer 14 covers the exposed portion of the second insulating layer 13 and the unetched first metal layer 11;

[0094] (4) etching the third insulating layer 14 and exposing a portion of the second insulating layer 13 to obtain the transfer channel 10a;

[0095] (5) Depositing a second metal layer 15 in the etched region of the third insulating layer 14, wherein the second metal layer 15 covers a portion of the transfer channel 10a.

[0096] Specifically, the first metal layer 11 is usually a copper layer, and the dielectric material layer is pressed on the two surfaces of the copper layer to obtain the first insulating layer 12 and the second insulating layer 13. Then, the first insulating layer 12 is exposed and photolithographically processed, and the first metal layer 11 is wet-etched to expose part of the second insulating layer 13. Then, the second insulating layer 13 is removed, and then the dielectric material layer is pressed to obtain the third insulating layer 14, which completely covers the exposed part of the second insulating layer 13 and the unetched first metal layer 11. Then, the third insulating layer 14 is etched by fixed-point exposure to remove part of the dielectric material to obtain the transfer channel 10a. Then, the second metal layer 15 is deposited in the etched area of ​​the third insulating layer 14, and the second metal layer 15 covers part of the transfer channel 10a, which is used to fix the connection fixed plate 30. Generally, the second metal layer 15 is flush with the unetched surface of the third insulating layer 14, which facilitates the mounting operation of other devices on the surface of the circuit substrate 10.

[0097] Accordingly, refer to Figure 4 , Fig.12 and Figure 1 When the fixing plate 30 is a metal plate, a connection hole is formed by etching the surface of the second metal layer 15. The fixing plate 30 is inserted and fixed in the connection hole to achieve a fixed connection between the fixing plate 30 and the circuit substrate 10. The fixed connection operation is relatively simple and effective.

[0098] Step S10, the step of manufacturing the circuit substrate 10, includes:

[0099] Step S12, installing the integrated circuit chip 60 in the circuit substrate 10, and opening a revealing opening 141 on the surface of the circuit substrate 10 to reveal the integrated circuit chip 60;

[0100] Step S20, in which the microphone chip 40 is mounted on the surface of the circuit substrate 10 and the microphone chip 40 is electrically connected to the circuit substrate 10, includes:

[0101] Step S21, mounting the microphone chip 40 on the surface of the circuit substrate 10 provided with the exposed opening 141;

[0102] Step S22 , connecting one end of the connecting wire to the exposed portion of the integrated circuit chip 60 , and the other end to the microphone chip 40 .

[0103] Specifically, after etching part of the first insulating layer 12 and the corresponding first metal layer 11 and exposing part of the second insulating layer 13 in step (2), the step further includes: placing an integrated circuit chip 60 on the exposed surface of the second insulating layer 13 .

[0104] Correspondingly, step (3), after removing the first insulating layer 12 and depositing the third insulating layer 14, wherein the third insulating layer 14 covers the exposed portion of the second insulating layer 13 and the unetched first metal layer 11, further includes: etching the third insulating layer 14 to obtain an exposed opening 141 to expose a portion of the integrated circuit chip 60.

[0105] It can be understood that the integrated circuit chip 60 is arranged inside the circuit substrate 10 during the manufacturing process of the circuit substrate 10, which can more effectively reduce the overall thickness of the bone voiceprint sensor 100. And the operation is relatively simple and effective. After the third insulating layer 14 is deposited, since the third insulating layer 14 completely covers the integrated circuit chip 60, the third insulating layer 14 is etched at this time to form a revealing opening 141 that reveals part of the integrated circuit chip 60, and then the exposed part of the integrated circuit chip 60 is electrically connected to the microphone chip 40 through a wire bonding operation.

[0106] Furthermore, after the step S12 of installing the integrated circuit chip 60 in the circuit substrate 10 and opening a revealing opening 141 on the surface of the circuit substrate 10 to reveal the integrated circuit chip 60, the method further includes:

[0107] Step S13 , forming an exposure opening 131 on the surface of the circuit substrate 10 where the exposure opening 141 is not provided, so as to expose a portion of the integrated circuit chip 60 .

[0108] Specifically, the surface of the second insulating layer 13 facing away from the integrated circuit chip 60 is etched to obtain an exposure opening 131 , exposing a portion of the integrated circuit chip 60 for outputting electrical signals from the integrated circuit chip 60 .

[0109] Reference Figures 10 to 12 When mounting the microphone chip 40 , the microphone chip 40 is arranged corresponding to a transmission port of the transmission channel 10 a , so that the sensitivity of the bone voiceprint sensor 100 can be improved.

[0110] It should be noted that when the shell 20 is a metal shell 20, the third insulating layer 14 is etched by fixed-point exposure to obtain the transmission channel 10a and the installation port 142. The installation port 142 is roughly annular, and its size is adapted to the opening size of the shell 20. In this way, when mounting the shell 20, solder paste is first sprayed in the installation port 142, and then the shell 20 is fixed by welding. Such operation is relatively simple and can ensure that the shell 20 has a good setting stability.

[0111] The present invention also provides an electronic device, the electronic device includes the bone voiceprint sensor 100 as described above, and the specific structure of the bone voiceprint sensor 100 refers to the above embodiment. Since the electronic device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0112] It should be noted that the electronic device can be a mobile phone, a smart bracelet, a smart watch, a Bluetooth headset, etc. It usually includes a housing 20 and a mainboard disposed in the housing 20, the bone voiceprint sensor 100 is disposed in the housing 20, and the circuit substrate 10 or the integrated circuit chip 60 of the bone voiceprint sensor 100 is electrically connected to the mainboard, so that the corresponding functions of the bone voiceprint sensor 100 can be realized.

[0113] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A bone voiceprint sensor, characterized in that: include: Circuit board; A housing, the housing is disposed on the surface of the circuit substrate and is enclosed with the circuit substrate to form a receiving cavity; A vibration sensing component, wherein the vibration sensing component is disposed in the accommodating cavity; as well as A microphone chip, the microphone chip is disposed on a surface of the circuit substrate facing the accommodating cavity and is electrically connected to the circuit substrate, and the projection areas of the microphone chip and the vibration sensing component on the surface of the circuit substrate do not overlap; The bone voiceprint sensor further includes a fixing plate, which is fixedly connected to the inner wall of the housing and extends toward the circuit substrate; The vibration sensing component has two opposite ends, one end of the vibration sensing component is fixedly connected to the fixing plate, and the other end is fixedly connected to the inner wall of the housing, and the microphone chip is arranged on a side of the fixing plate facing away from the vibration sensing component; One end of the fixing plate away from the inner wall of the housing is fixedly connected to the circuit substrate, and the fixing plate divides the accommodating cavity into two sub-accommodating cavities; The microphone chip and the vibration sensing component are respectively arranged in the two sub-accommodating cavities, and the circuit substrate is provided with a transmission channel connecting the two sub-accommodating cavities; The vibration sensing component includes a sensing diaphragm and a mass block arranged on the surface of the sensing diaphragm. The sensing diaphragm has two opposite ends. One end of the sensing diaphragm is fixedly connected to the fixing plate, and the other end is fixedly connected to the inner wall of the shell.

2. The bone voiceprint sensor according to claim 1, characterized in that: The transmission channel has two transmission ports, and the two transmission ports are respectively connected to the two sub-accommodation chambers. One of the two transmission ports is arranged corresponding to the microphone chip, and the other one is arranged corresponding to the vibration sensing component.

3. The bone voiceprint sensor according to any one of claims 1 to 2, characterized in that: An integrated circuit chip is arranged in the circuit substrate, and a surface of the circuit substrate facing the accommodating cavity is provided with an exposure opening for exposing a part of the integrated circuit chip, and the exposed part of the integrated circuit chip is electrically connected to the microphone chip through a connecting wire.

4. The bone voiceprint sensor according to claim 3, characterized in that: The surface of the circuit substrate facing away from the accommodating cavity is provided with an exposure opening to expose a portion of the integrated circuit chip.

5. A method for manufacturing a bone voiceprint sensor according to any one of claims 1 to 4, characterized in that: The following steps are involved: Making circuit substrates; Mounting a microphone chip on the surface of the circuit substrate and electrically connecting the microphone chip to the circuit substrate; The vibration sensing component is fixedly mounted on the inner wall surface of the housing; The shell is mounted on the surface of the circuit substrate facing the microphone chip, and is enclosed with the circuit substrate to form a accommodating cavity. The microphone chip and the vibration sensing component are both located in the accommodating cavity, and the projection areas of the microphone chip and the vibration sensing component on the surface of the circuit substrate do not overlap.

6. The method for manufacturing the bone voiceprint sensor according to claim 5, characterized in that: The step of fixing the vibration sensing component on the inner wall surface of the housing includes: The fixing plate is mounted on the inner wall surface of the shell, and one side of the vibration sensing component is fixedly connected to the fixing plate, and the other side is fixedly connected to the inner wall surface of the shell.

7. The method for manufacturing the bone voiceprint sensor according to claim 6, characterized in that: The steps of making a circuit substrate include: Making a transfer channel in the circuit substrate, wherein the transfer channel has two transfer ports penetrating the surface of the circuit substrate; The step of mounting the microphone chip on the surface of the circuit substrate includes: Mounting a microphone chip on the surface of the circuit substrate facing the transfer port; The step of attaching the housing to the surface of the circuit substrate facing the microphone chip and enclosing the housing with the circuit substrate to form a receiving cavity, wherein the microphone chip and the vibration sensing component are both located in the receiving cavity, and the projection areas of the microphone chip and the vibration sensing component on the surface of the circuit substrate do not overlap includes: The side of the fixing plate away from the inner wall of the shell is fixedly connected to the circuit substrate, the two transfer ports are respectively located on both sides of the fixing plate, and the microphone chip and the vibration sensing component are respectively located on both sides of the fixing plate.

8. The method for manufacturing a bone voiceprint sensor according to claim 5, characterized in that: The steps of making a circuit substrate include: Mounting an integrated circuit chip in a circuit substrate, and opening a revealing opening on a surface of the circuit substrate to reveal the integrated circuit chip; The step of mounting a microphone chip on the surface of the circuit substrate and electrically connecting the microphone chip to the circuit substrate includes: Mounting the microphone chip on the surface of the circuit substrate provided with the exposed opening; One end of the connecting wire is connected to the exposed portion of the integrated circuit chip, and the other end is connected to the microphone chip.

9. The method for manufacturing the bone voiceprint sensor according to claim 8, characterized in that: After the steps of mounting the integrated circuit chip in the circuit substrate and opening a revealing opening on the surface of the circuit substrate to reveal the integrated circuit chip, the method further includes: An exposure opening is provided on the surface of the circuit substrate where the exposure opening is not provided, so as to expose a portion of the integrated circuit chip.

10. An electronic device, characterized in that: The electronic device comprises the bone voiceprint sensor according to any one of claims 1 to 4.

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