Fingerprint module and manufacturing method thereof, display screen assembly, and electronic device

Abstract

The present invention discloses a fingerprint module and a manufacturing method thereof, a display screen assembly, and an electronic device. The fingerprint module includes a module body and a film layer. The two opposite surfaces of the module body are a first surface and a second surface. At least one of the first surface and the second surface is provided with a film layer to offset at least part of the warping stress of the module body. According to the fingerprint module of the present invention, by providing a film layer on at least one of the first surface and the second surface to offset at least part of the warping stress of the module body, the warping degree of the fingerprint module can be reduced, and the yield and stability of the subsequent product process of the fingerprint module can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of fingerprint devices, and in particular to a fingerprint module and a manufacturing method thereof, a display screen assembly, and an electronic device. Background Art

[0002] In the related art, the fingerprint module will be attached to the structure of the terminal, such as the display screen, which will cause the fingerprint module to deform, that is, the edge of the fingerprint module will be warped. Under strong light, the outline of the fingerprint module can be seen, which will affect the visual appearance of the terminal such as the electronic device and the user experience. Therefore, reducing the warping of the fingerprint module has become an urgent problem to be solved. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a fingerprint module having a small warping degree.

[0004] The present invention also provides a display screen assembly, comprising the above-mentioned fingerprint module.

[0005] The present invention also provides an electronic device, comprising the above display screen assembly.

[0006] The present invention also provides a method for manufacturing a fingerprint module, comprising the above-mentioned fingerprint module.

[0007] The fingerprint module according to the embodiment of the present invention comprises a module body, wherein two opposite surfaces of the module body are a first surface and a second surface; and a film layer, wherein at least one of the first surface and the second surface is provided with the film layer to offset at least part of the warping stress of the module body.

[0008] According to the fingerprint module of the embodiment of the present invention, the film layer is attached to at least one of the first surface and the second surface to offset at least part of the warping stress of the module body, thereby reducing the warping degree of the fingerprint module, and further improving the yield and stability of the subsequent processing of the fingerprint module.

[0009] In some embodiments, the film layer is a silicon dioxide layer or a titanium dioxide layer. The film layer configured in this way has a lower cost and generates a greater stress.

[0010] In some embodiments, the module body includes: a protective layer, a conductive layer, a piezoelectric layer and a substrate stacked in sequence, a conductive circuit is provided between the substrate and the piezoelectric layer, the surface of the substrate away from the piezoelectric layer is the first surface, and the surface of the protective layer away from the conductive layer is the second surface; when the film layer is provided on the first surface, the film layer is a silicon dioxide layer. It can be seen that the silicon dioxide film is tensile stress, and if the warpage of the fingerprint module is to be improved, a silicon dioxide layer needs to be plated on the first surface of the substrate.

[0011] In some embodiments, the module body includes: a protective layer, a conductive layer, a piezoelectric layer and a substrate stacked in sequence, a conductive circuit is provided between the substrate and the piezoelectric layer, the surface of the substrate away from the piezoelectric layer is the first surface, and the surface of the protective layer away from the conductive layer is the second surface; when the film layer is provided on the second surface, the film layer is a titanium dioxide layer. It can be seen that the titanium dioxide film is compressive stress, and if the warping of the fingerprint module is to be improved, a titanium dioxide layer needs to be plated on the second surface of the substrate.

[0012] In some embodiments, the module body includes: the module body includes: a protective layer, a conductive layer, a piezoelectric layer and a substrate stacked in sequence, a conductive circuit is provided between the substrate and the piezoelectric layer, the surface of the substrate away from the piezoelectric layer is the first surface, and the surface of the protective layer away from the conductive layer is the second surface; the film layer includes a first film layer and a second film layer, the first film layer is provided on the first surface, the second film layer is provided on the second surface, the first film layer is a silicon dioxide layer, and the second film layer is a titanium dioxide layer. In this way, the warping of the fingerprint module can also be improved, and the yield and stability of the subsequent product process of the fingerprint module can be improved.

[0013] In some embodiments, the thickness of the film layer is 750nm-1600nm. When the thickness of the film layer is within the above range, the cost is low, and the warping degree of the fingerprint module is low and the reliability is good.

[0014] In some embodiments, the film layer is a film structure made by a coating process, and the coating temperature is 25° C.-110° C., and the stress generated by the coating can be used to reversely flatten the module body.

[0015] In some embodiments, the area of ​​the first surface is 60 square millimeters to 110 square millimeters. The fingerprint module configured in this way has a wide application range, is convenient for reducing costs, and is conducive to the miniaturization design of the fingerprint module.

[0016] In some embodiments, the protective layer is an epoxy resin layer. The protective layer made of epoxy resin has good dimensional stability, high hardness, and good flexibility, and can clearly display the fingerprint texture, thereby ensuring the reliability of the fingerprint module.

[0017] According to an embodiment of the present invention, a display screen assembly comprises a display screen and a fingerprint module, wherein the display screen is an OLED display screen; the fingerprint module is attached to the back of the OLED display screen, and the fingerprint module is the fingerprint module according to any one of claims 1-10.

[0018] The display screen assembly according to the embodiment of the present invention adopts a fingerprint module, so that the fingerprint module has good adhesion to the display screen, and the display screen assembly has good process yield, high clarity and high reliability.

[0019] The electronic device according to the embodiment of the present invention comprises a display screen assembly. The electronic device according to the embodiment of the present invention has a good yield rate, high definition and high reliability.

[0020] According to the manufacturing method of the fingerprint module of the embodiment of the present invention, the thickness of the film layer is 750nm-1600nm, and the manufacturing method includes: when the film layer in the fingerprint module is attached to the module body, the attachment temperature is 25℃-110℃, and the stress generated by the film layer offsets the warping stress of the module body. According to the method of offsetting the warping stress of the embodiment of the present invention, at least part of the warping stress of the module body can be offset, thereby reducing the warping degree of the fingerprint module, and further improving the yield and stability of the subsequent processing of the fingerprint module.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 is a schematic diagram of a film layer under compressive stress according to an embodiment of the present invention;

[0024] Figure 2 is a schematic diagram of the warping direction of the fingerprint module when the film layer is under compressive stress according to an embodiment of the present invention;

[0025] Figure 3 is a schematic diagram of a film layer under tensile stress according to an embodiment of the present invention;

[0026] Figure 4is a schematic diagram of the warping direction of the fingerprint module when the film layer is under tensile stress according to an embodiment of the present invention;

[0027] Figure 5 is a schematic structural diagram of a fingerprint module according to an embodiment of the present invention;

[0028] Figure 6 is a schematic structural diagram of a fingerprint module according to an embodiment of the present invention;

[0029] Figure 7 is a schematic structural diagram of a display screen assembly according to an embodiment of the present invention;

[0030] Figure 8 is a curve diagram showing the relationship between substrate temperature and unit film thickness warpage of a film deposited according to an embodiment of the present invention;

[0031] Fig. 9 is a graph showing the relationship between the height difference of the measured position of the substrate and the warping of the module body according to an embodiment of the present invention;

[0032] Fig.10 is a test image of a fingerprint module under a microscope of a coating layer according to an embodiment of the present invention;

[0033] Fig.11 This is a test image of a fingerprint module without a film layer attached under a microscope according to an embodiment of the present invention.

[0034] Reference numerals:

[0035] Fingerprint module 100; module body 10; first surface 11; second surface 12; protective layer 13; conductive layer 14; piezoelectric layer 15; substrate 16; conductive circuit 17;

[0036] Membrane layer 20;

[0037] Display screen assembly 200 ; display screen 210 ; circuit board 220 ; foam 230 ; cover plate 240 ; adhesive layer 250 . DETAILED DESCRIPTION

[0038] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present invention are described in detail below.

[0039] Reference below Figure 1-Figure 11 The fingerprint module 100 according to the embodiment of the present invention is described. The fingerprint module 100 includes a module body 10 and a film layer 20 .

[0040] Two opposite surfaces of the module body 10 are a first surface 11 and a second surface 12 . A film layer 20 is attached to at least one of the first surface 11 and the second surface 12 to offset at least part of the warping stress of the module body 10 .

[0041] The fingerprint module 100 may be warped toward one side. For example, the edge of the fingerprint module 100 protrudes from the middle of the fingerprint module 100 , resulting in an uneven surface of the fingerprint module 100 . If the warping of the fingerprint module 100 needs to be improved, a tensile stress film or a compressive stress film may be provided on the surface of the fingerprint module 100 .

[0042] It should be noted that the film layer 20 may have a stress F1 on the surface of the module body 10, and the module body 10 may have a stress F2. When the film layer 20 is attached to the module body 10, the stress F1 and the stress F2 form a combined force, and the stress F1 offsets at least part of the stress F2, that is, the setting of the film layer 20 can partially eliminate or completely eliminate the stress F2.

[0043] According to the fingerprint module 100 of the embodiment of the present invention, a film layer 20 is attached to at least one of the first surface 11 and the second surface 12 to offset at least part of the warping stress of the module body 10, thereby reducing the warping degree of the fingerprint module 100, and further improving the yield and stability of the subsequent product process of the fingerprint module 100.

[0044] In some examples, the film layer 20 is a silicon dioxide layer or a titanium dioxide layer. The film layer 20 configured in this way has a low cost and generates a large stress. Of course, in other examples, the film layer 20 can also be made of materials such as silicon dioxide, titanium dioxide, titanium pentoxide, aluminum oxide, and magnesium fluoride.

[0045] In some embodiments, the film layer 20 is a film structure made by a coating process, and the coating temperature is 25° C.-110° C. It can be understood that the coating temperature is the temperature of the substrate 16 during coating. For example, the coating temperature is 100° C., which can reduce production costs and ensure the reliability of the fingerprint module 100, and the stress generated by the coating can be used to reversely flatten the module body 10.

[0046] Combination Figure 5 As shown, the module body 10 includes: a protective layer 13, a conductive layer 14, a piezoelectric layer 15 and a substrate 16 which are stacked in sequence, a conductive line 17 is provided between the substrate 16 and the piezoelectric layer 15, a surface of the substrate 16 which is away from the piezoelectric layer 15 is a first surface 11, and a surface of the protective layer 13 which is away from the conductive layer 14 is a second surface 12; when the film layer 20 is provided on the first surface 11, the film layer 20 is a silicon dioxide layer. Figure 1 The experimental results show that when the silicon dioxide film layer 20 is plated, the edge of the substrate 16 will bend toward the side of the silicon dioxide film. It can be seen that the silicon dioxide film is a tensile stress. If the warping of the fingerprint module 100 is to be improved, a silicon dioxide layer needs to be plated on the first surface 11 of the substrate 16.

[0047] In other embodiments, Figure 6 As shown, the module body 10 includes: a protective layer 13, a conductive layer 14, a piezoelectric layer 15 and a substrate 16 which are stacked in sequence, a conductive circuit 17 is provided between the substrate 16 and the piezoelectric layer 15, and the surface of the protective layer 13 away from the conductive layer 14 is the second surface 12; when the film layer 20 is provided on the second surface 12, the film layer 20 is a titanium dioxide layer. Figure 2 The experimental results show that when the titanium dioxide film 20 is plated, the edge of the substrate 16 will bend toward the side away from the titanium dioxide film. It can be seen that the titanium dioxide film is a compressive stress. If the warping of the fingerprint module 100 is to be improved, a titanium dioxide layer needs to be plated on the second surface 12 of the substrate 16.

[0048] According to one embodiment of the present invention, the module body 10 includes: a protective layer 13, a conductive layer 14, a piezoelectric layer 15 and a substrate 16 which are stacked in sequence, a conductive circuit 17 is provided between the substrate 16 and the piezoelectric layer 15, a surface of the substrate 16 away from the piezoelectric layer 15 is a first surface 11, and a surface of the protective layer 13 away from the conductive layer 14 is a second surface 12; when the film layer 20 is provided on the first surface 11, the film layer 20 is a silicon dioxide layer. The film layer 20 includes a first film layer and a second film layer, the first film layer can be provided on the first surface 11, the second film layer can be provided on the second surface 12, the first film layer is a silicon dioxide layer, and the second film layer is a titanium dioxide layer, thereby improving the warpage of the fingerprint module 100.

[0049] In some embodiments, the substrate 16 may be made of a TFT (Thin Film Transistor) board, a PI (Polyimide) board, or a PET (Polyethyleneterephthalate) board. In this way, the stress generated by the coating can be used to reversely flatten the substrate 16 of the above materials, thereby reducing the warping of the fingerprint module 100.

[0050] In some embodiments, the thickness of the film layer 20 is 750nm-1600nm. When the thickness of the film layer 20 is within the above range, the cost is low, and the warpage of the fingerprint module 100 is low and the reliability is good. For example, the thickness of the film layer 20 is 750nm-950nm or 1400nm-1600nm.

[0051] In some examples, the area of ​​the first surface 11 is 60 square millimeters to 110 square millimeters. For example, the area of ​​the first surface 11 is 64 square millimeters or 100 square millimeters. For example, the first surface 11 is square with a side length of 8 millimeters, and its area is 64 square millimeters; for another example, the first surface 11 is square with a side length of 10 millimeters. The fingerprint module 100 configured in this way has a wide range of applications, is easy to reduce costs, and is conducive to the miniaturization design of the fingerprint module 100.

[0052] In some embodiments, the protective layer 13 is an epoxy resin layer. The epoxy resin layer has excellent bonding strength, good dielectric properties, and small set shrinkage. The protective layer 13 made of epoxy resin has good dimensional stability, high hardness, and good flexibility, and can clearly display the fingerprint texture, thereby ensuring the reliability of the fingerprint module 100.

[0053] In some embodiments, the fingerprint module 100 is an ultrasonic fingerprint module. When the ultrasonic fingerprint module is applied to a terminal, the ultrasonic fingerprint module can be arranged on the back side of the terminal, which improves the aesthetics and reliability, and the ultrasonic fingerprint module has good security. Of course, in other embodiments, the fingerprint module 100 can also be an optical fingerprint module or other fingerprint module. For example, the optical fingerprint module is a large-area optical fingerprint module.

[0054] It is understood that the film layer 20 can be formed using solid materials, and stress can be generated during the coating process. The stress can be divided into compressive stress and tensile stress, such as Figure 1 As shown, the compressive stress has a tendency to expand relative to the surface of the fingerprint module 100, which will cause the fingerprint module 100 to bend downward, that is, forming Figure 2 The status shown. Figure 3 As shown, the tensile stress has a tendency to shrink relative to the surface of the fingerprint module 100, which will cause the fingerprint module 100 to bend inward, that is, forming a Figure 4 The state shown. It is equivalent to a mechanical spring. The mechanical spring theory explains that when the tensile stress generated by the coating is equivalent to the spring being under the action of tension. Therefore, the spring is bound to produce a reaction force for the product to shrink. The film layer 20 produces a tensile stress opposite to the contraction, causing the fingerprint module 100 to bend inward, and vice versa. Compressive stress is generated. Based on the above phenomenon, in order to improve the warping of the fingerprint module 100, the relationship between the stress generated by the film layer 20 of different materials under different conditions and the warping of the module body 10 of the fingerprint module 100 is tested. The fingerprint module 100 of the embodiment of the present invention can be applied to various fields such as TP (touch panel, touch screen), TFT, etc.

[0055] The following describes the experimental test of the fingerprint module 100 according to the embodiment of the present invention, taking the film layer 20 as a silicon dioxide layer and the film layer 20 as a titanium dioxide layer as examples. It can be concluded from the experimental test results that the greater the stress generated by silicon dioxide or titanium dioxide under certain conditions, the easier it is to reduce the warpage of the fingerprint module 100. The test process of the fingerprint module 100 according to the embodiment of the present invention is described in detail below.

[0056] First, it is necessary to determine whether the stress of the material of the film layer 20 is compressive stress or tensile stress, and preliminarily confirm the influence of the temperature of the substrate 16 on the stress of the substrate 16 material. For example, the substrate 16 can be made of white glass made of TFT (Thin Film Transistor), and titanium dioxide and silicon dioxide are plated at different temperatures, wherein the film thickness can be controlled between 750nm-950nm, and the warpage of the coated white glass is measured with a measuring instrument.

[0057] Combination Figure 1-Figure 2 During the test, it was found that the white glass coated with titanium dioxide bent downward, which was compressive stress, and the white glass coated with silicon dioxide bent upward, which was tensile stress.

[0058] According to Table 1 and Figure 8 , when the temperature range is selected to be greater than or equal to 20°C and less than or equal to 110°C, and when the substrate 16 is coated with a titanium dioxide film layer 20, the lower the temperature of the substrate 16, the greater the warpage per unit film thickness, that is, the lower the temperature, the greater the compressive stress generated by the same film thickness, and the more warped the glass. When the temperature range is selected to be greater than or equal to 20°C and less than or equal to 110°C, and when the substrate 16 is coated with a silicon dioxide film layer 20, the higher the temperature of the substrate 16, the greater the warpage per unit film thickness, that is, the higher the temperature, the greater the tensile stress generated by the same film thickness, and the more warped the glass. Among them, warpage per unit film thickness = warpage (um) / film thickness (nm), and temperature refers to the temperature of the substrate 16 during coating.

[0059] Reference Fig. 9 For example, the measuring instrument is a step-type film thickness measuring instrument, model P-17. The substrate 16 is white glass, and the length, width and thickness of the substrate 16 are 10 mm, 10 mm and 90 um, and the curved surface of the substrate 16 faces upward. The starting point and the end point of the test are used as the leveling base points, and the vertical line shown in Table 3 is placed at the highest point of the curve. The data obtained is the warpage of the sample.

[0060] Fig. 9The horizontal axis in is the measurement position (length) of the sample of substrate 16, and the length range is 0mm-9000um. The vertical axis is the height difference between the lowest point (center of substrate 16) in the warping direction of the sample of substrate 16 and the two sides of the warping. The data of the vertical axis is the warping degree of the sample of substrate 16. For example, the coordinate (1000, 9) indicates that the height difference of the sample of substrate 16 at the position of 1000um is 9um.

[0061]

[0062] Table 1

[0063] Thus, according to the test, it can be concluded that the white glass of titanium dioxide bends downward. When the temperature of the substrate 16 is 25°C-110°C during coating, there is warpage, and the lower the temperature, the greater the compressive stress generated by the same film thickness. For example, the titanium dioxide film layer 20 is coated on the second surface 12, and the temperature of the substrate 16 is 25°C during coating. At this time, the warpage of the fingerprint module 100 can be effectively reduced.

[0064] According to the test, it can be concluded that the white glass coated with silicon dioxide is bent upward. When the temperature of the substrate 16 is 25°C-110°C during coating, there is warping, and the higher the temperature, the greater the compressive stress generated by the same film thickness. For example, the titanium dioxide film layer 20 is coated on the second surface 12, and the temperature of the substrate 16 is 110°C during coating. At this time, the warping of the fingerprint module 100 can also be effectively reduced.

[0065] Of course, in the embodiment of the present invention, the temperature of the substrate 16 during coating can be adjusted according to the required reduction of the warpage of the fingerprint module 100. In addition, it should be noted that any temperature between 25°C and 110°C falls within the protection scope of the present invention.

[0066] Secondly, taking the film layer 20 made of titanium dioxide and silicon dioxide as an example, the effect of coating on the performance of the fingerprint module 100 is tested.

[0067] From the above verification, it can be seen that the stress when the film layer 20 is titanium dioxide is compressive stress, and the stress when the film layer 20 is silicon dioxide is tensile stress, and the fingerprint module 100 will warp toward one side of the coating. Therefore, if the warping is to be improved, titanium dioxide needs to be plated on a side of the substrate 16 where the circuit is set, that is, the second surface 12, and silicon dioxide needs to be plated on the side of the substrate 16 away from the piezoelectric layer 15. The fingerprint module 100 plated with titanium dioxide film and the fingerprint module 100 plated with silicon dioxide film are tested below.

[0068] Combined with Table 2, the coating conditions and warpage test results of silicon dioxide and titanium dioxide are as follows. The warpage of the fingerprint module 100 is significantly improved after coating.

[0069]

[0070] Table 2

[0071] Reference Figure 10-11 , Fig.10 This is a test image of the silicon dioxide coated fingerprint module 100 under a microscope. Fig.11 This is a test image of the fingerprint module 100 without silicon dioxide coating under a microscope. By comparing the test images, it can be seen that the test image of the fingerprint module 100 coated with silicon dioxide has a clean background and has no obvious difference from the normal sample without coating. In this way, it can be concluded that the silicon dioxide fingerprint module 100 has a low curling degree and will not affect the reliability of the fingerprint module 100.

[0072] Again, taking the film layer 20 as a silicon dioxide material as an example, the optimal film thickness for improving the warpage of the fingerprint module 100 is tested. The following tests the warpage of the film layer 20 of silicon dioxide material with different film thicknesses at a temperature of 100°C. It should be noted that, taking the ultrasonic fingerprint module 100 with a length of 8mm and a width of 8mm as an example, the length of the first surface 11 of the ultrasonic fingerprint module 100 is 8mm and the width is 8mm, and the warpage range of the module body 10 is 70-80um. At this time, the warpage range of the film layer 20 is 70-80um, and the warpage of the film layer 20 is close to the warpage of the first surface 11. When the warping directions of the two are opposite, the warping stresses can offset each other, thereby improving the flatness of the surface of the module body 10. Of course, in other examples, the film layer 20 of the embodiment of the present invention can also be a module of other sizes.

[0073] Referring to Table 3, in order to improve the warpage, silicon dioxide is plated on the TFT glass surface, the temperature of the substrate 16 is set to 100°C, the thickness of the film layer 20 is controlled between 1400-1600nm, and the warpage of the fingerprint module 100 after coating can be controlled within the range of less than 10um. The test image under the microscope shows that the silicon dioxide film has no effect on the fingerprint module 100.

[0074] The stress generated by the coating is used to reversely flatten the substrate 16, thereby improving the warping of the fingerprint module 100. The film layer 20 can be plated on a substrate 16 of various materials. For example, the substrate 16 can be made of TFT (Thin Film Transistor), PI (Polyimide) or PET (Polyethyleneterephthalate). In this way, the warping of the fingerprint module 100 can be effectively improved, and the reliability of the fingerprint module 100 is good.

[0075]

[0076] Table 3

[0077] The display screen assembly 200 according to the embodiment of the present invention includes a display screen 210 and a fingerprint module 100, wherein the display screen 210 is an OLED display screen 210, and the fingerprint module 100 is attached to the back of the OLED display screen 210. The back side refers to a surface away from the touch surface of the OLED display screen 210. Such a configuration can prevent the fingerprint module 100 from occupying other spaces of the display screen assembly 200. For example, the fingerprint module 100 is an ultrasonic fingerprint module 100, and the ultrasonic fingerprint module 100 can be attached to the back of the OLED display screen 210 through an adhesive layer 250. For example, the adhesive layer 250 can be PSA (pressure sensitive adhesive) or glue.

[0078] According to the display screen assembly 200 of the embodiment of the present invention, by adopting the fingerprint module 100, the fingerprint module 100 and the display screen 210 have good adhesion, and the display screen assembly 200 has good process yield, high clarity and high reliability.

[0079] The electronic device (not shown) according to the embodiment of the present invention includes the display screen assembly 200, and the electronic device has a good yield, high definition and high reliability.

[0080] The manufacturing method of the fingerprint module 100 according to the embodiment of the present invention includes the above-mentioned fingerprint module 100. The thickness of the film layer 20 is 750nm-1600nm, and the manufacturing method includes: when the film layer 20 in the fingerprint module 100 is attached to the module body 10, the attachment temperature is 25℃-110℃, at which time the stress generated by the film layer 20 offsets the warping stress of the module body 10. It should be noted that the temperature refers to the temperature of the substrate 16 of the fingerprint module 100 during attachment.

[0081] The method for offsetting the warping stress according to the embodiment of the present invention can offset at least part of the warping stress of the module body 10, thereby reducing the warping degree of the fingerprint module 100, and further improving the yield and stability of the subsequent product process of the fingerprint module 100.

[0082] Other components of the display screen assembly 200 according to the embodiment of the present invention, such as the foam 230 , the cover plate 240 , the circuit board 220 , and the operation thereof, are well known to those skilled in the art and will not be described in detail herein.

[0083] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0084] In the description of the present invention, "first feature" or "second feature" may include one or more of the features.

[0085] In the description of the present invention, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0086] In the description of the present invention, “on”, “over” and “above” a first feature from a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0087] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0088] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A fingerprint module, characterized in that: include: A module body, wherein two opposite surfaces of the module body are a first surface and a second surface; The module body comprises: a protective layer, a conductive layer, a piezoelectric layer and a substrate which are stacked in sequence, wherein a surface of the substrate away from the piezoelectric layer is the first surface, and a surface of the protective layer away from the conductive layer is the second surface; A film layer, the second surface is provided with the film layer, or the second surface and the first surface are provided with the film layer; In the case where the film layer is attached to the first surface, the film layer provides tensile stress to offset at least part of the warping stress of the module body; When the film layer is attached to the second surface, the film layer provides compressive stress to offset at least part of the warping stress of the module body.

2. The fingerprint module according to claim 1, characterized in that: The film layer is a silicon dioxide layer or a titanium dioxide layer.

3. The fingerprint module according to claim 2, characterized in that: A conductive circuit is provided between the substrate and the piezoelectric layer; When the film layer is disposed on the second surface, the film layer is a titanium dioxide layer.

4. The fingerprint module according to claim 2, characterized in that: A conductive circuit is provided between the substrate and the piezoelectric layer; The film layer includes a first film layer and a second film layer, the first film layer is arranged on the first surface, the second film layer is arranged on the second surface, the first film layer is a silicon dioxide layer, and the second film layer is a titanium dioxide layer.

5. The fingerprint module according to claim 1, characterized in that: The thickness of the film layer is 750nm-1600nm.

6. The fingerprint module according to claim 1, characterized in that: The film layer is a film structure made by a coating process, and the coating temperature is 25°C-110°C.

7. The fingerprint module according to claim 1, characterized in that: The area of ​​the first surface is 60 square millimeters to 110 square millimeters.

8. A display screen assembly, characterized in that: include: A display screen, wherein the display screen is an OLED display screen; A fingerprint module, wherein the fingerprint module is attached to the back of the OLED display screen, and the fingerprint module is the fingerprint module according to any one of claims 1-7.

9. An electronic device, characterized in that: Comprising the display screen assembly according to claim 8.

10. A method for manufacturing a fingerprint module, characterized in that: The fingerprint module is a fingerprint module according to any one of claims 1 to 7, the thickness of the film layer is 750nm-1600nm, and the manufacturing method comprises: When the film layer in the fingerprint module is attached to the module body, the attaching temperature is 25° C.-110° C., at which time the stress generated by the film layer offsets the warping stress of the module body.

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