Method for manufacturing a shaped object and a shaped object manufacturing device

Abstract

The present invention provides a method and apparatus for manufacturing a shaped object. The method comprises: a preparation step of preparing a molding sheet having a substrate and a thermal expansion layer including an adhesive and a thermal expansion material and laminated on a first main surface of the substrate; a substrate heating step of heating the substrate of the molding sheet to a temperature lower than an expansion start temperature at which the thermal expansion material starts to expand; and an expansion step of heating the thermal expansion layer of the molding sheet whose substrate has been heated to a temperature higher than the expansion start temperature at which the thermal expansion material starts to expand so as to expand the thermal expansion layer.

Description

[0001] This application claims priority based on Japanese Patent Application No. 2019-110797 filed on June 14, 2019, and all contents of the basic application are incorporated into this application. Technical Field

[0002] The present invention relates to a method for manufacturing a shaped object and a shaped object manufacturing device. Background Art

[0003] It is known that there is a technology for forming a three-dimensional image by a heat-expandable sheet (for example, Japanese Patent Publication No. 59-35359). In Japanese Patent Publication No. 59-35359, first, an image is formed by a material with high light absorption on a heat-expandable sheet having a foaming layer comprising a substrate sheet and heat-expandable microspheres. Then, by irradiating the heat-expandable sheet with light, the image portion is selectively heated to make the image portion bulge.

[0004] In the manufacturing method of Japanese Patent Publication No. 59-35359, since the heat of heating the image portion is diffused or absorbed by the substrate sheet, the temperature of the foaming layer cannot be fully increased, and the height of the raised portion (convex portion) may be reduced. For example, when the thickness of the substrate sheet is thick, most of the heat generated by light irradiation is diffused or absorbed by the substrate sheet, thereby reducing the height of the raised portion. Summary of the invention

[0005] The present invention is proposed in view of the above-mentioned actual situation, and its object is to provide a method and device for manufacturing a shaped object, which can easily manufacture a shaped object with a convex portion of a relatively high height.

[0006] To achieve the above-mentioned object, a method for manufacturing a shaped object based on the first aspect includes:

[0007] A preparation step of preparing a molded sheet having a substrate and a thermal expansion layer including an adhesive and a thermal expansion material and laminated on a first main surface of the substrate;

[0008] a substrate heating step of heating the substrate of the molding sheet to a temperature lower than an expansion start temperature at which the thermal expansion material starts to expand; and

[0009] The expansion step is to expand the thermal expansion layer of the molded sheet in which the base material has been heated, by heating the thermal expansion layer to a temperature higher than an expansion start temperature at which the thermal expansion material starts to expand.

[0010] A molding device based on a second aspect manufactures a molded object from a molding sheet having a substrate and a thermal expansion layer, wherein the thermal expansion layer includes an adhesive and a thermal expansion material and is laminated on a first main surface of the substrate, the molding device comprising:

[0011] a heating unit that heats the base material of the molding sheet to a temperature lower than an expansion start temperature at which the thermal expansion material starts to expand; and

[0012] The expansion unit heats the thermal expansion layer of the molding sheet to a temperature equal to or higher than an expansion start temperature at which the thermal expansion material starts to expand, thereby expanding the thermal expansion layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram showing a cross section of a molded sheet according to Embodiment 1 of the present invention.

[0014] Figure 2 This is a three-dimensional diagram of a structure according to Embodiment 1 of the present invention.

[0015] Figure 3 Section along line AA Figure 2 A cross-sectional view of the structure shown.

[0016] Figure 4 This is a diagram showing the hardware configuration of the forming device according to the first embodiment of the present invention.

[0017] Figure 5 It is a schematic diagram showing a forming device according to Embodiment 1 of the present invention.

[0018] Figure 6 This is a flowchart showing a method for manufacturing a formed object according to Embodiment 1 of the present invention.

[0019] Figure 7 This is a three-dimensional diagram of a structure according to Embodiment 2 of the present invention.

[0020] Figure 8 Cross-section along line BB Figure 7 A cross-sectional view of the structure shown.

[0021] Fig. 9 This is a diagram showing the hardware configuration of a forming device according to Embodiment 2 of the present invention.

[0022] Fig.10 It is a schematic diagram showing a forming device according to Embodiment 2 of the present invention.

[0023] Fig.11 This is a flowchart showing a method for manufacturing a formed object according to Embodiment 2 of the present invention.

[0024] Fig.12 This is a three-dimensional diagram of a structure according to Embodiment 3 of the present invention.

[0025] Fig.13 Cross-section along line CC Fig.12 A cross-sectional view of the structure shown.

[0026] Fig.14 This is a flowchart showing a method for manufacturing a formed object according to Embodiment 3 of the present invention.

[0027] Fig.15 It is a schematic diagram showing a forming device according to a modified example of the present invention.

[0028] Fig.16 It is a schematic diagram showing a forming device according to a modified example of the present invention. DETAILED DESCRIPTION

[0029] Hereinafter, a method for producing a formed object according to an embodiment of the present invention will be described with reference to the drawings.

[0030] <Implementation method 1>

[0031] In this embodiment, a shaped object 100 is manufactured from a molding sheet 10. The shaped object 100 is used as a decorative sheet, wallpaper, etc. In this specification, a "shaped object" is a sheet with concave and convex shapes (formed) on a specified surface, and the concave and convex constitute geometric shapes, text, patterns, decorations, etc. Here, "decoration" is to remind people of beauty through vision and / or touch. "Shaping (or modeling)" refers to the creation of an object with a shape, and also includes the concept of applying decorative decorations to form decorative decorations. In addition, the shaped object 100 of this embodiment is a three-dimensional object with concave and convex on a specified surface, but in order to distinguish it from a three-dimensional object manufactured by a so-called 3D printer, the shaped object 100 of this embodiment is also called a 2.5-dimensional (2.5D) object or a pseudo-three-dimensional (Pseudo-3D) object. The technology for manufacturing the shaped object 100 of this embodiment is also called 2.5D printing technology or Pseudo-3D printing technology.

[0032] First, refer to Figure 1 The molded sheet 10 is described. Figure 1 As shown, the molded sheet 10 includes a base material 20 and a thermal expansion layer 30 laminated on the first main surface 22 of the base material 20. In the present embodiment, the thermal expansion layer 30 is laminated on the entire first main surface 22.

[0033] The substrate 20 of the molding sheet 10 has a first main surface 22 on which a thermal expansion layer 30 is laminated, and a second main surface 24 located on the opposite side of the first main surface 22. The substrate 20 supports the thermal expansion layer 30. The substrate 20 is formed in a sheet shape, for example. The material constituting the substrate 20 is a thermoplastic resin such as a polyolefin resin (polyethylene (PE), polypropylene (PP), etc.), a polyester resin (polyethylene terephthalate (PET), polybutylene terephthalate (PBT), etc.). The type of material constituting the substrate 20 and the thickness of the substrate 20 are selected according to the purpose of the shaped object 100.

[0034] The thermal expansion layer 30 of the molded sheet 10 is laminated on the first main surface 22 of the substrate 20. The thermal expansion layer 30 includes an adhesive 31 and a thermal expansion material (i.e., the thermal expansion material before expansion) 32a dispersed in the adhesive 31. The adhesive 31 is any thermoplastic resin such as vinyl acetate polymer, acrylic acid polymer, etc. The thermal expansion material 32a is expanded to a size corresponding to the amount of heat (specifically, heating temperature, heating time, etc.) of heating by heating it to a predetermined temperature or above. For example, the thermal expansion material 32a is expanded by heating it to 80°C to 120°C or above. Hereinafter, the temperature at which the thermal expansion material 32a starts to expand is recorded as the expansion start temperature. The thermal expansion material 32a is, for example, a thermally expandable microcapsule.

[0035] Thermally expandable microcapsules are microcapsules in which a foaming agent composed of propane, butane, or other low-boiling point substances is wrapped in a shell made of a thermoplastic resin. The shell of the thermally expandable microcapsule is formed of a thermoplastic resin such as polystyrene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, polyacrylate, polyacrylonitrile, polybutadiene, or copolymers thereof. When the thermally expandable microcapsules are heated to a predetermined temperature (expansion start temperature) or above, the shell softens and the foaming agent vaporizes. The shell expands into a balloon shape due to the pressure of the vaporized foaming agent. The thermally expandable microcapsules expand to about 5 times the particle size before expansion. The average particle size of the thermally expandable microcapsules before expansion is, for example, 5 to 50 μm.

[0036] The thermal expansion layer 30 of the molded sheet 10 expands due to the expansion of the thermal expansion material 32a. However, the thermal expansion layer 30 has irregularities 110 described later formed on the surface 35 opposite to the substrate 20.

[0037] (Shape)

[0038] Next, refer to Figure 2 , Figure 3 The object 100 is described. Figure 2 , Figure 3 As shown, the article 100 includes a substrate 20 and a thermal expansion layer 30 which is stacked on a first main surface 22 of the substrate 20 and has projections and depressions 110 on the side opposite to the substrate 20 .

[0039] The object 100 is a sheet-shaped object having a surface with irregularities 110. Since the structure of the base material 20 of the object 100 is the same as that of the molding sheet 10, the thermal expansion layer 30 of the object 100 will be described here.

[0040] like Figure 3As shown, the thermal expansion layer 30 of the object 100 includes an adhesive 31, a thermal expansion material (i.e., the thermal expansion material before expansion) 32a, and a thermal expansion material 32b that has been expanded. The adhesive 31 of the thermal expansion layer 30 of the object 100 is the same as the adhesive 31 of the thermal expansion layer 30 of the molding sheet 10. In addition, the thermal expansion material 32a of the thermal expansion layer 30 of the object 100 is the same as the thermal expansion material 32a of the thermal expansion layer 30 of the molding sheet 10. The thermal expansion material 32b that has been expanded is the thermal expansion material that has expanded by heating the thermal expansion material 32a to a temperature above the expansion start temperature. The concavoconvex 110 of the thermal expansion layer 30 is composed of a convex portion 112 including the thermal expansion material 32b that has been expanded, and a concave portion 114 including the thermal expansion material 32a before expansion.

[0041] (Method for producing a shape)

[0042] Next, refer to Figures 4 to 6 The method for producing the object 100 will be described. In the present embodiment, the object 100 is produced from a molding sheet 10 in a sheet shape (for example, A4 paper size).

[0043] First, the forming device 300 used in the method for manufacturing the formed object 100 is described. The forming device 300 is used to manufacture the formed object 100 from the molding sheet 10. The forming device 300 is used to manufacture the formed object 100. Figure 4 , Figure 5 As shown, a metal box-shaped frame 301 is provided with conveying rollers 302a, 302b, 304a, 304b for conveying the molding sheet 10 along a conveying path, a heating unit 310 for heating the base material 20 of the molding sheet 10, an expansion unit 320 for expanding the thermal expansion layer 30 of the molding sheet 10, and a control unit 350 for controlling each unit. In addition, for easy understanding, in this specification, Figure 5 The length of the forming device 300 is described with the right direction (right direction of the paper) as the +X direction, the upward direction (upper direction of the paper) as the +Z direction, and the direction perpendicular to the +X direction and the +Z direction (front direction of the paper) as the +Y direction.

[0044] The conveying rollers 302a, 302b, 304a, and 304b of the object 100 are used as conveying units. Figure 5 As shown, the conveying rollers 302a and 302b, and the conveying rollers 304a and 304b form a pair and sandwich the molded sheet 10. The conveying rollers 302a, 302b, 304a, 304b rotate to convey the molded sheet 10 from the -X side to the +X direction.

[0045] In this embodiment, the molded sheet 10 is guided to a conveying guide (not shown) and conveyed from the -X side to the +X direction with the thermal expansion layer 30 facing the +Z direction and the second main surface 24 of the substrate 20 facing the -Z direction.

[0046] The heating unit 310 of the object 100 heats the substrate 20 of the molded sheet 10 being conveyed to a temperature lower than the expansion start temperature. Specifically, the heating unit 310 irradiates infrared rays (electromagnetic waves) from the substrate 20 side (-Z side) of the molded sheet 10 to the substrate 20 of the molded sheet 10 being conveyed, thereby heating the substrate 20 to a temperature lower than the expansion start temperature. In the present embodiment, the heating unit 310 is arranged closer to the -Z side than the conveying path of the molded sheet 10, and irradiates infrared rays from the -Z side, that is, the substrate 20 side.

[0047] The heating unit 310 is, for example, an infrared heater, and includes a cover 311, a lamp 312, a reflector 313, and a fan 314. The cover 311 accommodates the lamp 312, the reflector 313, and the fan 314. The lamp 312 is, for example, a straight-tube-shaped infrared lamp. The lamp 312 irradiates infrared rays to the base material 20 of the molding sheet 10. The reflector 313 reflects the infrared rays from the lamp 312 toward the base material 20 of the molding sheet 10. The fan 314 sends air into the cover 311 and cools the lamp 312 and the reflector 313.

[0048] The expansion unit 320 of the shaped object 100 heats the thermal expansion layer 30 of the molded sheet 10 to a temperature higher than the expansion start temperature to expand the thermal expansion layer 30. Specifically, the expansion unit 320 heats the substrate 20 through the heating unit 310, and irradiates the thermal expansion layer 30 of the molded sheet 10 being conveyed with laser (e.g., carbon dioxide laser). As a result, the thermal expansion layer 30 is heated to a temperature higher than the expansion start temperature, the thermal expansion material 32a of the thermal expansion layer 30 expands and forms the thermal expansion material 32b that has completed expansion, and the thermal expansion layer 30 expands. In this embodiment, the expansion unit 320 is arranged closer to the +Z side than the conveying path of the molded sheet 10, and irradiates the laser from the +Z side, that is, the thermal expansion layer 30 side. In addition, the expansion unit 320 is arranged closer to the +X side than the heating unit 310.

[0049] The expansion unit 320 is, for example, a carbon dioxide laser irradiator. The expansion unit 320 includes a carbon dioxide laser oscillator, a polygon mirror, a lens, etc. (not shown). The expansion unit 320 irradiates the carbon dioxide laser to the position of the convex portion 112 forming the thermal expansion layer 30 by reflecting the carbon dioxide laser oscillated by the carbon dioxide laser oscillator with the polygon mirror and scanning the carbon dioxide laser in the +Y direction and the -Y direction.

[0050] The control unit 350 of the object 100 controls the conveying rollers 302a, 302b, 304a, 304b, the heating unit 310, and the expansion unit 320. Figure 4 As shown, the control unit 350 includes a CPU (Central Processing Unit) 352 that executes various processes, a ROM (Read Only Memory) 354 that stores programs and data, a RAM (Random Access Memory) 356 that stores data, and an input / output interface 358 that inputs and outputs signals between the various units. The functions of the control unit 350 are realized by the CPU 352 executing the program stored in the ROM 354. The input / output interface 358 inputs and outputs signals between the CPU 352, the conveying rollers 302a, 302b, 304a, 304b, the heating unit 310, and the expansion unit 320.

[0051] A method for manufacturing the object 100 will be described. Figure 6 1 is a flow chart showing a method for manufacturing a formed object 100. The method for manufacturing the formed object 100 includes: a preparation step (step S10) of preparing a forming sheet 10 having a substrate 20 and a thermal expansion layer 30 including an adhesive 31 and a thermal expansion material 32a and laminated on a first main surface 22 of the substrate 20; a substrate heating step (step S20) of heating the substrate 20 of the forming sheet 10 to a temperature lower than an expansion start temperature; and an expansion step (step S30) of heating the thermal expansion layer 30 of the forming sheet 10 of the heated substrate 20 to a temperature higher than the expansion start temperature to expand the thermal expansion layer 30.

[0052] In the preparation process (step S10), the molded sheet 10 is prepared. For example, a coating liquid in which the binder 31 and the thermal expansion material 32a are mixed is screen-printed on the first main surface 22 of the substrate 20. Then, the printed coating liquid is dried. The molded sheet 10 is manufactured as described above.

[0053] In the substrate heating process (step S20), first, the molding sheet 10 is set in the molding device 300. Next, the molding sheet 10 is conveyed and infrared rays are irradiated to the substrate 20 of the molding sheet 10 by the heating unit 310 of the molding device 300, thereby heating the substrate 20 to a temperature lower than the expansion start temperature. In the expansion process (step S30), in order to prevent the heat that expands the thermal expansion layer 30 from diffusing to the substrate 20, it is preferred that the substrate 20 is heated to 40°C or more. In addition, in order to prevent the expansion of the thermal expansion layer 30 in this process, it is preferred that the substrate 20 is heated to a temperature lower than 5°C than the expansion start temperature. The temperature of the substrate 20 can be adjusted by controlling the conveying speed of the molding sheet 10 and the energy per unit area and unit time of the infrared rays irradiated by the heating unit 310.

[0054] In the expansion process (step S30), the heated molding sheet 10 of the substrate 20 is transferred and the thermal expansion layer 30 of the molding sheet 10 of the heated substrate 20 is irradiated with laser by the expansion unit 320 of the molding device 300, so that the thermal expansion layer 30 is heated to a temperature higher than the expansion start temperature. As a result, the thermal expansion material 32a of the thermal expansion layer 30 expands, and the thermal expansion material 32b that has been fully expanded is formed, and the thermal expansion layer 30 expands. Figure 5 As shown, the expansion of the thermal expansion layer 30 forms the concavities and convexities 110 on the surface 35 of the thermal expansion layer 30 .

[0055] The shape of the unevenness 110 and the height of the convex portion 112 of the unevenness 110 can be controlled by the intensity and pattern of the laser irradiated to the thermal expansion layer 30 by the expansion unit 320. In the present embodiment, since the substrate 20 is heated to a temperature lower than the expansion start temperature in advance, the heat generated by the thermal expansion layer 30 can be suppressed from diffusing to the substrate 20 by the irradiation of the laser, and the height of the convex portion 112 can be increased. In particular, when the shaped object 100 is manufactured from the molding sheet 10 having a thicker substrate 20 (for example, a thickness of 1 mm or more) by the conventional manufacturing method, since the amount of heat diffused from the thermal expansion layer 30 to the substrate 20 increases, it is difficult to form a higher convex portion 112 by the conventional manufacturing method. Since the manufacturing method of the present embodiment can suppress the diffusion of heat to the substrate 20, the shaped object 100 having a higher convex portion 112 can be manufactured from the molding sheet 10 having a thicker substrate 20.

[0056] In the above manner, the object 100 can be manufactured.

[0057] As described above, in the manufacturing method of the shaped object 100, in the substrate heating step (step S20), the substrate 20 of the molded sheet 10 is heated to a temperature lower than the expansion start temperature. Therefore, in the expansion step (step S30), the heat that expands the thermal expansion layer 30 of the molded sheet 10 can be suppressed from diffusing to the substrate 20, and the height of the convex portion 112 can be increased. The manufacturing method of this embodiment can easily manufacture the shaped object 100 having a higher height of the convex portion 112. In the substrate heating step (step S20), the thermal expansion layer 30 is also heated together with the substrate 20, and since the adhesive 31 of the thermal expansion layer 30 softens, the height of the convex portion 112 can be further increased.

[0058] In this embodiment, the heating unit 310 of the forming device 300 heats the base material 20 of the forming sheet 10 to a temperature lower than the expansion start temperature. In addition, the expansion unit 320 of the forming device 300 heats the heat expansion layer 30 of the forming sheet 10 of the heated base material 20 to a temperature higher than the expansion start temperature to expand the heat expansion layer 30. Therefore, the forming device 300 can suppress the heat that expands the heat expansion layer 30 from diffusing to the base material 20, and can easily manufacture the formed object 100 having the convex portion 112 with a relatively high height.

[0059] <Implementation method 2>

[0060] In the first embodiment, the heating unit 310 of the forming device 300 irradiates infrared rays on the substrate 20 of the forming sheet 10 to heat the substrate 20, but the heating unit 310 may be another unit. In addition, the expansion unit 320 of the forming device 300 irradiates laser light on the thermal expansion layer 30 of the forming sheet 10 to expand the thermal expansion layer 30, but the thermal expansion layer 30 may be expanded by other methods.

[0061] Since the molding sheet 10 of this embodiment is the same as the molding sheet 10 of the first embodiment, here, the shaped object 100 of this embodiment and the method for manufacturing the shaped object 100 will be described.

[0062] like Figure 7 , Figure 8 As shown, the article 100 of this embodiment includes a substrate 20 , a thermal expansion layer 30 laminated on the first main surface 22 of the substrate 20 and having the concavities and convexities 110 on the opposite side of the substrate 20 , and a heat conversion layer 130 laminated on the thermal expansion layer 30 .

[0063] The object 100 of this embodiment is a sheet-like object similar to the object 100 of Embodiment 1. In addition, the object 100 of this embodiment has concavities and convexities 110 on the surface. Similar to Embodiment 1, the concavities and convexities 110 are composed of convex portions 112 and concave portions 114. Since the substrate 20 and the thermal expansion layer 30 of the object 100 of this embodiment are the same as the substrate 20 and the thermal expansion layer 30 of the object 100 of Embodiment 1, the heat conversion layer 130 will be described.

[0064] The heat conversion layer 130 of the object 100 is disposed on the convex portion 112 of the thermal expansion layer 30. The heat conversion layer 130 is stacked on the thermal expansion layer 30 of the molding sheet 10 in a pattern corresponding to the concavoconvex portion 110 to form the concavoconvex portion 110.

[0065] The heat conversion layer 130 converts the irradiated electromagnetic waves into heat and releases the converted heat. Thus, the heat expansion layer 30 (i.e., the heat expansion material 32a) of the molded sheet 10 is heated to a predetermined temperature. The temperature at which the heat expansion layer 30 is heated is controlled by the density of the heat conversion layer 130 including the heat conversion material described later (i.e., the density or concentration of the heat conversion material) and the energy per unit area and per unit time of the electromagnetic waves irradiated to the heat conversion layer 130. Compared with other parts of the molded sheet 10, the heat expansion layer 30 near the heat conversion layer 130 is selectively heated because the heat conversion layer 130 converts the electromagnetic waves into heat more quickly.

[0066] The heat conversion layer 130 is composed of a heat conversion material that converts absorbed electromagnetic waves into heat. The heat conversion material is carbon black, a metal hexaboride compound, a tungsten oxide compound, etc. For example, carbon black absorbs visible light, infrared light, etc. and converts them into heat. In addition, a metal hexaboride compound and a tungsten oxide compound absorb near-infrared light and convert it into heat. Among the metal hexaboride compounds and the tungsten oxide compounds, lanthanum hexaboride (LaB6) and cesium tungsten oxide are preferred because of their high absorptivity in the near-infrared region and high transmittance in the visible region.

[0067] Next, refer to Figures 9 to 11 The method for producing the object 100 will be described. In the present embodiment, the object 100 is produced from a molding sheet 10 in a sheet shape (for example, A4 paper size).

[0068] The forming device 300 used in the method for manufacturing the formed object 100 is described. The forming device 300 is used to manufacture the formed object 100 from the molding sheet 10. Fig. 9 , Fig.10 As shown, the forming device 300 of this embodiment includes a tray 305 for placing the forming sheet 10, a heating unit 310 provided on the tray 305 and heating the base material 20 of the forming sheet 10, and an expansion unit 320 for moving and expanding the thermal expansion layer 30 of the forming sheet 10 in a frame 301. The forming device 300 of this embodiment further includes a moving mechanism 330 for moving the expansion unit 320, and a control unit 350 for controlling each unit.

[0069] The tray 305 of the forming apparatus 300 arranges the forming sheet 10 placed on the bottom plate 306 at a predetermined position of the forming apparatus 300. The forming sheet 10 is placed on the bottom plate 306 of the tray 305 with the substrate 20 facing the bottom plate 306.

[0070] The heating unit 310 of this embodiment is provided on the bottom plate 306 of the tray 305 and heats the base material 20 of the molding sheet 10 to a temperature lower than the expansion start temperature. The heating unit 310 is, for example, an electric heater embedded in the bottom plate 306 .

[0071] The expansion unit 320 of the present embodiment heats the thermal expansion layer 30 of the molded sheet 10 to a temperature above the expansion start temperature while moving so as to expand the thermal expansion layer 30. Specifically, the expansion unit 320 moves the +Z side of the molded sheet 10 of the substrate 20 heated by the heating unit 310 from the +X side to the -X side through the moving mechanism 330. While the expansion unit 320 moves, electromagnetic waves are irradiated on the heat conversion layer 130 stacked on the molded sheet 10. Thus, the expansion unit 320 releases heat from the heat conversion layer 130 and heats the thermal expansion layer 30 of the molded sheet 10 whose substrate 20 has been heated to a temperature above the expansion start temperature. When the thermal expansion layer 30 is heated to a temperature above the expansion start temperature, the thermal expansion material 32a of the thermal expansion layer 30 expands to form the thermal expansion material 32b that has completed expansion, and the thermal expansion layer 30 expands.

[0072] The expansion unit 320 is, for example, a lamp that emits electromagnetic waves. The expansion unit 320 includes a cover 321, a lamp 322, a reflector 323, and a fan 324. The cover 321 accommodates the lamp 322, the reflector 323, and the fan 324. The lamp 322 is a straight tube-shaped halogen lamp. The lamp 322 emits electromagnetic waves in the visible light region (wavelength 380nm to 750nm), the near infrared region (wavelength 750nm to 1400nm), the mid-infrared region (wavelength 1400nm to 4000nm), etc. The reflector 323 reflects the electromagnetic waves from the lamp 322 toward the heat conversion layer 130 of the molding sheet 10. The fan 324 cools the lamp 322 and the reflector 323.

[0073] The moving mechanism 330 of this embodiment moves the expansion unit 320 in the +X direction and the −X direction. The moving mechanism 330 includes, for example, a conveying rail 332 on which the expansion unit 320 is mounted and a stepping motor (not shown) for moving the expansion unit 320 .

[0074] The control unit 350 of this embodiment controls the heating unit 310, the expansion unit 320, and the moving mechanism 330. The control unit 350 includes a CPU 352, a ROM 354, a RAM 356, and an input / output interface 358, similarly to the control unit 350 of the first embodiment. The functions of the control unit 350 are realized by the CPU 352 executing a program stored in the ROM 354.

[0075] A method for manufacturing the object 100 according to this embodiment will be described. Fig.11Flow chart showing the manufacturing method of the shaped object 100 of the present embodiment. The manufacturing method of the shaped object 100 of the present embodiment includes a preparation step (step S10) of preparing the molding sheet 10; a heat conversion layer stacking step (step S15) of stacking the heat conversion layer 130 that converts electromagnetic waves into heat on the heat expansion layer 30 of the molding sheet 10; a substrate heating step (step S20) of heating the substrate 20 of the molding sheet 10 to a temperature lower than the expansion start temperature; and an expansion step (step S30) of heating the heat expansion layer 30 of the molding sheet 10 whose substrate 20 has been heated to a temperature higher than the expansion start temperature to expand the heat expansion layer 30. Since the preparation step (step S10) of the present embodiment is the same as the preparation step (step S10) of the first embodiment, the heat conversion layer stacking step (step S15), the substrate heating step (step S20) and the expansion step (step S30) are described.

[0076] In the heat conversion layer lamination process (step S15), the ink containing the conversion material is printed on the heat expansion layer 30 of the molded sheet 10 by a printing device in a light and dark pattern corresponding to the height of the convex portion 112 of the concave-convex 110 (i.e., a pattern corresponding to the concave-convex 110). Fig.12 As shown, the heat conversion layer 130 is stacked on the heat expansion layer 30. The printing device is, for example, an inkjet printer.

[0077] Here, the amount of heat released from the heat conversion layer 130 depends on the density (or concentration) of the heat conversion material and the energy per unit area and per unit time of the electromagnetic wave. Therefore, the shape of the concavoconvex 110 (the shape and height of the convex portion 112, the shape and depth of the concave portion 114, etc.) can be controlled by the density of the ink containing the heat conversion material and the energy per unit area and per unit time of the irradiated electromagnetic wave.

[0078] return Fig.11 In the substrate heating process (step S20), the molded sheet 10 is placed on the tray 305 of the forming device 300 of the present embodiment, and the substrate 20 of the molded sheet 10 is heated to a temperature lower than the expansion start temperature by the heating unit 310. In the present embodiment, in order to prevent the heat that expands the thermal expansion layer 30 from diffusing to the substrate 20, in the expansion process (step S30), the substrate 20 is preferably heated to 40°C or more. In addition, in order to prevent the thermal expansion layer 30 from expanding in this process, the substrate 20 is preferably heated to a temperature that is 5°C lower than the expansion start temperature.

[0079] Finally, in the expansion process (step S30), the expansion unit 320 of the forming device 300 of the present embodiment is moved and the electromagnetic wave from the expansion unit 320 is irradiated to the heat conversion layer 130 of the molding sheet 10 of the heated substrate 20. Then, the heat released by the heat conversion layer 130 heats the heat expansion layer 30 of the molding sheet 10 to a temperature higher than the expansion start temperature, thereby expanding the heat expansion layer 30. Fig.10 As shown, since the heat conversion layer 130 is stacked in a light-dark pattern corresponding to the height of the protrusion 112, the protrusion 112 is formed on the heat expansion layer 30, and the concavo-convex 110 is formed. In the manufacturing method of the shaped object 100 of this embodiment, since the substrate 20 is heated to a temperature lower than the expansion start temperature in advance, the heat released from the heat conversion layer 130 can be suppressed from diffusing to the substrate 20 by irradiation with electromagnetic waves, and the height of the protrusion 112 can be increased.

[0080] In the above manner, the object 100 can be manufactured.

[0081] As described above, in the manufacturing method of the shaped object 100 of the present embodiment, in the substrate heating step (step S20), since the substrate 20 of the molding sheet 10 is heated to a temperature lower than the expansion start temperature, in the expansion step (step S30), the heat that expands the thermal expansion layer 30 of the molding sheet 10 can be suppressed from diffusing to the substrate 20, and the height of the convex portion 112 can be increased. Therefore, the manufacturing method of the present embodiment can easily manufacture the shaped object 100 having a relatively high convex portion 112. In addition, in the substrate heating step (step S20), since the binder 31 of the thermal expansion layer 30 is softened, the height of the convex portion 112 can be further increased.

[0082] In the forming apparatus 300 of the present embodiment, the heating unit 310 heats the base material 20 of the forming sheet 10 to a temperature lower than the expansion start temperature. In addition, the expansion unit 320 heats the thermal expansion layer 30 of the forming sheet 10 whose base material 20 has been heated to a temperature higher than the expansion start temperature to expand the thermal expansion layer 30. Therefore, the forming apparatus 300 can suppress the heat for expanding the thermal expansion layer 30 from diffusing to the base material 20, and can easily manufacture the formed object 100 having the convex portion 112 with a relatively high height.

[0083] <Implementation method 3>

[0084] In the substrate heating step (step S20) of Embodiment 1 and Embodiment 2, the substrate 20 is heated to a temperature lower than the expansion start temperature. In the substrate heating step (step S20), the temperature at which the substrate 20 is heated may be changed according to the region of the substrate 20. Since the molding sheet 10 of this embodiment is the same as the molding sheet 10 of Embodiment 1, the article 100 and the method for manufacturing the article 100 will be described.

[0085] like Fig.12 , Fig.13 As shown in FIG. 1 , the article 100 of the present embodiment comprises a substrate 20, and a thermal expansion layer 30 laminated on the first main surface 22 of the substrate 20 and having a concavo-convex 110 on the opposite side of the substrate 20. The article 100 of the present embodiment and the article 100 of the first embodiment have different structures of the concavo-convex 110. The other structures of the article 100 of the present embodiment are the same as those of the article 100 of the first embodiment. Fig.13 In the embodiment, the adhesive 31, the thermal expansion material 32a and the thermal expansion material 32b which has completed expansion of the thermal expansion layer 30 are omitted.

[0086] The concavoconvex 110 of this embodiment is composed of a convex portion 112, a convex portion 112a, and a concave portion 114. The convex portion 112 and the concave portion 114 of this embodiment are the same as the convex portion 112 and the concave portion 114 of Embodiment 1. The shapes of the convex portion 112 and the convex portion 112a are different. Specifically, Fig.13 As shown, the inclination angle θ2 of the inclined surface 113a of the convex portion 112a is smaller than the inclination angle θ1 of the inclined surface 113 of the convex portion 112. The other structures of the convex portion 112a are the same as those of the convex portion 112.

[0087] Next, a method for manufacturing the object 100 will be described. In this embodiment, the object 100 is manufactured from a sheet-shaped (for example, A4 paper size) molding sheet 10. In this embodiment, the object 100 is manufactured using the molding device 300 of the first embodiment.

[0088] Fig.14 1 is a flowchart showing a method for manufacturing a shaped object 100. The method for manufacturing a shaped object 100 includes: a preparation step (step S10) of preparing a molding sheet 10; a substrate heating step (step S20) of heating a substrate 20 of the molding sheet 10 to a temperature lower than an expansion start temperature according to a zone change temperature; and an expansion step (step S30) of heating a thermal expansion layer 30 of the molding sheet 10 whose substrate 20 has been heated to a temperature higher than the expansion start temperature to expand the thermal expansion layer 30. Since the preparation step (step S10) of this embodiment is the same as the preparation step (step S10) of the first embodiment, the substrate heating step (step S20) and the expansion step (step S30) are described.

[0089] In the substrate heating step (step S20), similarly to the first embodiment, the substrate 20 of the molded sheet 10 is irradiated with infrared rays by the heating unit 310 of the molding device 300 while the molded sheet 10 is being conveyed, and the substrate 20 is heated to a temperature lower than the expansion start temperature. In this embodiment, the energy per unit area and per unit time of the infrared rays irradiated on the substrate 20 is controlled, and the heating temperature is changed according to the area of ​​the substrate 20. Specifically, Fig.13 The first region 26 a of the substrate 20 corresponding to the convex portion 112 a shown is heated to a temperature lower than the temperature of the second region 26 a of the substrate 20 corresponding to the convex portion 112 .

[0090] return Fig.14 In the expansion process (step S30), similarly to the first embodiment, the molded sheet 10 whose substrate 20 has been heated is conveyed, and the heat expansion unit 320 of the forming device 300 irradiates the heat expansion layer 30 of the molded sheet 10 whose substrate 20 has been heated with laser, and heats the heat expansion layer 30 to a temperature higher than the expansion start temperature. Thus, the heat expansion layer 30 expands and forms the convex portion 112, the convex portion 112a, and the concave portion 114, that is, the concavoconvex portion 110 is formed.

[0091] In the present embodiment, since the temperature of the first region 26a of the substrate 20 is lower than the temperature of the second region 26 of the substrate 20, the amount of heat used to form the convex portion 112a in the third region of the thermal expansion layer 30 corresponding to the first region 26a is greater than the amount of heat used to form the convex portion 112 in the fourth region of the thermal expansion layer 30 corresponding to the second region 26. Therefore, the heat used to form the convex portion 112a is more easily diffused than the heat used to form the convex portion 112, and the inclination angle θ2 of the inclined surface 113a of the convex portion 112a is smaller than the inclination angle θ1 of the inclined surface 113 of the convex portion 112.

[0092] As described above, in the manufacturing method of the article 100 of the present embodiment, in the substrate heating step (step S20), the temperature of the first region 26a and the second region 26 of the substrate 20 is changed to be heated to a temperature lower than the expansion start temperature, so that the inclination angles θ1 and θ2 of the inclined surfaces 113 and 113a of the convex portions 112 and 112a can be changed. That is, the inclination angles θ1 and θ2 of the convex portions 112 and 112a of the thermal expansion layer 30 can be controlled by controlling the difference between the expansion start temperature at which the thermal expansion material 32a starts to expand and the temperature at which the substrate 20 is heated. In addition, the manufacturing method of the article 100 of the present embodiment can easily manufacture the article 100 having the convex portions 112 and 112a with a relatively high height, similarly to the manufacturing methods of the first and second embodiments.

[0093] (Variation Example)

[0094] As mentioned above, although embodiment of this invention is described, various changes can be made without departing from the scope of the gist of this invention.

[0095] For example, the object 100 may be manufactured in a roll shape from the rolled molding sheet 10 .

[0096] The material constituting the substrate 20 is not limited to thermoplastic resins, and may be paper, cloth, etc. The thermoplastic resin constituting the substrate 20 is not limited to polyolefin resins and polyester resins. The thermoplastic resin constituting the substrate 20 may also be polyamide resins, polyvinyl chloride (PVC) resins, polyimide resins, etc.

[0097] In the second embodiment, the heat conversion layer 130 is laminated on the thermal expansion layer 30 of the molded sheet 10, but the heat conversion layer 130 may be laminated on the second main surface 24 of the substrate 20 of the molded sheet 10. In addition, the heat conversion layer 130 may be laminated on a peeling layer provided on the second main surface 24 of the substrate 20 or the thermal expansion layer 30. Thus, the peeling layer can be peeled off from the object 100, and the heat conversion layer 130 can be removed from the object 100.

[0098] The molding sheet 10 and the shaped object 100 may also be formed of layers formed of other arbitrary materials between the layers. For example, a bonding layer may be formed between the substrate 20 and the thermal expansion layer 30 to make the substrate 20 and the thermal expansion layer 30 more closely contact each other. The bonding layer is composed of, for example, a surface modifier.

[0099] Furthermore, a color image may be printed on the object 100. For example, in the object 100 of the first embodiment, a color ink layer composed of four color inks of cyan, magenta, yellow, and black to represent a color image may be stacked on the thermal expansion layer 30.

[0100] In the forming apparatus 300 of the first embodiment, the heating unit 310 irradiates infrared rays to heat the base material 20 of the molding sheet 10 to a temperature lower than the expansion start temperature. The heating unit 310 of the forming apparatus 300 of the first embodiment is not limited thereto. Fig.15 As shown, the heating unit 310 of the forming apparatus 300 of Embodiment 1 may also be a heater having an electric heater 316. The heating unit 310 is disposed on the -Z side of the conveying path of the forming sheet 10. When the forming sheet 10 is conveyed to the +Z side of the heating unit 310, the base material 20 of the forming sheet 10 is heated to a temperature lower than the expansion start temperature by the heating unit 310.

[0101] In the forming apparatus 300 of the second embodiment, the formed sheet 10 on which the heat conversion layer 130 is laminated is placed on the tray 305, but the formed sheet 10 on which the heat conversion layer 130 is laminated may also be conveyed. Fig.16As shown in the figure, the molding device 300 may also include conveying rollers 302a, 302b, 304a, and 304b instead of the tray 305, and a heater including an electric heater 316 as a heating unit 310. As in the first embodiment, the conveying rollers 302a, 302b, 304a, and 304b convey the molding sheet 10. The heating unit 310 is provided on the -Z side of the conveying path of the molding sheet 10. When the molding sheet 10 is conveyed to the +Z side of the heating unit 310, the heating unit 310 heats the base material 20 of the molding sheet 10 to a temperature lower than the expansion start temperature.

[0102] Furthermore, the expansion unit 320 of the forming apparatus 300 of the second embodiment is not limited to a lamp that emits electromagnetic waves, but may also be a laser irradiator.

[0103] As mentioned above, although the preferred embodiment of the present invention was described, the present invention is not limited to the specific embodiment, and the present invention includes the invention described in the scope of the claims and the scope equivalent thereto.

Claims

1. A method for manufacturing a shaped object, comprising: A preparation step of preparing a molding sheet including a substrate and a thermal expansion layer including an adhesive and a thermal expansion material and laminated on a first main surface of the substrate; a substrate heating step of heating the substrate of the molding sheet from a second main surface side opposite to the first main surface to a temperature lower than an expansion start temperature at which the thermal expansion material starts to expand; as well as The expansion step is to heat the thermal expansion layer of the molding sheet, in which the substrate has been heated from the second main surface side, from the first main surface side to a temperature higher than an expansion start temperature at which the thermal expansion material starts to expand, so as to expand the thermal expansion layer.

2. The method for manufacturing a shaped object according to claim 1, wherein: The method comprises a heat conversion layer laminating step in which a heat conversion layer for converting electromagnetic waves into heat is laminated on a second main surface opposite to the first main surface of the substrate or on the thermal expansion layer, In the expansion step, the electromagnetic wave is irradiated to the heat conversion layer.

3. The method for manufacturing a shaped object according to claim 1, wherein: In the substrate heating step, a temperature at which the substrate is heated is changed according to a region of the substrate.

4. The method for manufacturing a shaped object according to claim 1, wherein: In the substrate heating step, the substrate is heated by a heater.

5. The method for manufacturing a shaped object according to claim 2, wherein: In the substrate heating step, the first region of the substrate is heated to a lower temperature than the second region of the substrate, In the expansion step, the heat of expansion of the third region of the thermal expansion layer corresponding to the first region of the substrate is greater than the heat of expansion of the fourth region of the thermal expansion layer corresponding to the second region of the substrate, so that the inclination angle of the convex portion of the third region of the thermal expansion layer after expansion is smaller than the inclination angle of the convex portion of the fourth region of the thermal expansion layer after expansion.

6. The method for manufacturing a shaped object according to claim 2, wherein: In the substrate heating step, the inclination angle of the convex portion of the thermal expansion layer after expansion is controlled by controlling the difference between the expansion start temperature at which the thermal expansion material starts to expand and the temperature at which the substrate is heated.

7. The method for manufacturing a shaped object according to claim 1, wherein: In the substrate heating step, the substrate is heated by a heater; In the expansion step, the thermal expansion layer is heated by irradiating the thermal expansion layer with laser light.

8. The method for manufacturing a shaped object according to claim 1, wherein: In the substrate heating step, the substrate is heated to a temperature 5° C. lower than an expansion start temperature at which the thermal expansion material starts to expand.

9. A forming device for producing a formed object from a forming sheet having a substrate and a heat-expandable layer, wherein the heat-expandable layer comprises an adhesive and a heat-expandable material and is laminated on a first main surface of the substrate, the forming device comprising: a heating unit for heating the base material of the molding sheet from a second main surface side opposite to the first main surface to a temperature lower than an expansion start temperature at which the thermal expansion material starts to expand; as well as The expansion means heats the thermal expansion layer of the molding sheet, in which the substrate is heated from the second main surface side, from the first main surface side to a temperature not lower than an expansion start temperature at which the thermal expansion material starts to expand.

10. The forming device according to claim 9, wherein: The expansion unit expands the thermal expansion layer of the molding sheet in which the base material is heated to a temperature lower than the expansion start temperature.

11. The forming device according to claim 9, wherein: The molded sheet includes a heat conversion layer that converts electromagnetic waves into heat on a second main surface of the substrate opposite to the first main surface or on the thermal expansion layer. The expansion unit irradiates the electromagnetic wave to the heat conversion layer.

12. The forming device according to claim 9, comprising: A heater as the heating unit; a lamp as said expansion unit; as well as a conveying roller for conveying the formed sheet along a conveying path, The heater and the lamp are arranged in this order from upstream to downstream along the conveying path.

13. The forming device according to claim 9, wherein: The heating unit heats the substrate to a temperature 5° C. lower than an expansion start temperature at which the thermal expansion material starts to expand.

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