Hybrid Circuit Board

Abstract

The present application discloses a hybrid circuit board, which relates to the field of circuit boards. The hybrid circuit board of the present application includes a first substrate, a second substrate and at least one bridge connection structure. The first substrate has a mounting hole, and at least one first component is provided on the first substrate; the second substrate is provided in the mounting hole, and at least one second component is provided on the second substrate; the bridge connection structure is provided on the first substrate and the second substrate. The present application forms a hybrid circuit board by splicing a first substrate and a second substrate of different materials. For example, a second component with a relatively high heat dissipation requirement can be placed on the second substrate, and a first component with a low heat dissipation requirement can be placed on the first substrate. Then, the first component and the second component are electrically connected to realize a path through the bridge connection structure. The first substrate and the second substrate of different materials can respectively meet the heat dissipation requirements of the first component and the second component, thereby improving the utilization rate of the board material and reducing the cost to a certain extent.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a hybrid circuit board. Background Art

[0002] Printed Circuit Board (PCB) is used in various electronic devices. It is an important electronic component on which various components can be arranged. Among them, the printed circuit board can be simply called the circuit board. The circuit board will generate heat during operation, which will make the temperature of the circuit board higher. The higher temperature will damage the structure of the circuit board and the components on the circuit board, causing the circuit board and the components on the circuit board to not work properly, so the circuit board needs to be heat-dissipated.

[0003] Multiple components on a circuit board have different requirements for heat dissipation, some have high requirements and some have low requirements, but existing electronic circuit boards are all complete plates. Both components with higher heat dissipation requirements and components with lower heat dissipation requirements are fixed on the same plate. If the entire plate is required to meet the heat dissipation requirements of components with higher heat dissipation requirements, the cost will be high. If the entire plate is required to meet the heat dissipation requirements of components with lower heat dissipation requirements, the heat dissipation requirements of components with higher heat dissipation requirements cannot be met, affecting the operation of the components. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a hybrid circuit board that can have a better heat dissipation effect.

[0005] The embodiment of the present application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a hybrid circuit board, comprising a first substrate, a second substrate, and at least one bridge connection structure, wherein the first substrate has a mounting hole, and at least one first component is disposed on the first substrate; the second substrate is disposed in the mounting hole, and at least one second component is disposed on the second substrate; the bridge connection structure is disposed on the first substrate and the second substrate to electrically connect the first component and the second component. The material of the first substrate is different from the material of the second substrate.

[0007] In one embodiment, the hybrid circuit board further includes a heat sink, and the first substrate and the second substrate are both connected to the heat sink.

[0008] In one embodiment, the mounting hole passes through the upper surface and the lower surface of the first substrate; and a gap is left between the second substrate and the inner surface of the mounting hole.

[0009] In one embodiment, the heat sink has a first surface, the first surface is a plane, and the first substrate and the second substrate are both fixed to the first surface.

[0010] In one embodiment, at least one first connection hole is provided on the first substrate, a first fastener is inserted into the first connection hole, and the first substrate is connected to the heat sink through the first fastener;

[0011] The second substrate is provided with at least one second connection hole, a second fastener is inserted into the second connection hole, and the second substrate is connected to the heat sink through the second fastener.

[0012] In one embodiment, the hybrid circuit board further includes an adhesive, and the adhesive is disposed in the mounting hole and is used to connect the first substrate and the second substrate.

[0013] In one embodiment, each of the bridge connection structures includes a first contact, a second contact and a wire, the first contact is arranged on the first substrate and is electrically connected to the first component; the second contact is arranged on the second substrate and is electrically connected to the second component; the wire is connected to the first contact and the second contact.

[0014] In one embodiment, the second contact is disposed on one side of the second component, and a gap is left between the second contact and the second component.

[0015] In one embodiment, each of the second components includes an LED lamp, a heat dissipation pad and an electric pad, and the LED lamp is fixed to the upper surface of the second substrate through the heat dissipation pad and the electric pad; wherein the second contact is arranged on the electric pad.

[0016] In one embodiment, the material of the first substrate is FR-4 grade material, and the material of the second substrate is metal.

[0017] In one embodiment, a first insulating coating film is disposed on the outer surface of the first substrate, and a second insulating coating film is disposed on the surface of the second substrate where the second component is located.

[0018] The beneficial effects of this application compared with the prior art are:

[0019] The present application forms a hybrid circuit board by splicing a first substrate and a second substrate made of different materials. For example, a second component with relatively high heat dissipation requirements can be placed on the second substrate, and a first component with low heat dissipation requirements can be placed on the first substrate. The first component and the second component are then electrically connected through a bridge connection structure to achieve a pathway. The first substrate and the second substrate made of different materials can respectively meet the heat dissipation requirements of the first component and the second component, thereby improving the utilization rate of the board and reducing the cost to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the structure of a hybrid circuit board shown in one embodiment of the present application.

[0022] Figure 2 A cross-sectional view of a hybrid circuit board shown in one embodiment of the present application.

[0023] Figure 3 A cross-sectional view of a hybrid circuit board shown in one embodiment of the present application.

[0024] Figure 4 A cross-sectional view of a hybrid circuit board shown in one embodiment of the present application.

[0025] Figure 5 A cross-sectional view of a hybrid circuit board shown in one embodiment of the present application.

[0026] Figure 6 A cross-sectional view of a hybrid circuit board shown in one embodiment of the present application.

[0027] Figure 7 A top view of a hybrid circuit board according to an embodiment of the present application.

[0028] Figure 8 A cross-sectional view of a hybrid circuit board shown in one embodiment of the present application.

[0029] Icons: 1-hybrid circuit board; 100-first substrate; 101-first upper surface; 102-first lower surface; 103-first side surface; 110-first component; 120-first connection hole; 130-first fastener; 140-first insulating coating; 150-mounting hole; 151-first inner surface; 200-second substrate; 201-second upper surface; 202-second lower surface; 203-second side surface; 210-second component; 211-LED lamp; 212-heat dissipation pad; 213-electric pad; 220-second connection hole; 230-second fastener; 240-second insulating coating; 300-bridge connection structure; 310-first contact point; 320-second contact point; 330-wire; 400-heat sink; 401-first surface; 500-adhesive. DETAILED DESCRIPTION

[0030] The terms “first”, “second”, “third”, etc. are only used for distinguishing descriptions and do not indicate the order of arrangement, nor can they be understood as indicating or implying relative importance.

[0031] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0032] In the description of the present application, it should be noted that the terms "inside", "outside", "left", "right", "up", "down", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the products of the present application are usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present application.

[0033] In the description of this application, unless otherwise clearly specified and limited, the terms "set", "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements.

[0034] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0035] Please refer to Figure 1, which is a structural schematic diagram of a hybrid circuit board 1 shown in an embodiment of the present application. A hybrid circuit board 1 includes a first substrate 100, a second substrate 200 and at least one bridge connection structure 300. The first substrate 100 has a mounting hole 150, and at least one first component 110 is disposed on the first substrate 100; the second substrate 200 is disposed in the mounting hole 150, and at least one second component 210 is disposed on the second substrate 200; the bridge connection structure 300 is disposed on the first substrate 100 and the second substrate 200 to electrically connect the first component 110 and the second component 210. Among them, the material of the first substrate 100 is different from the material of the second substrate 200.

[0036] In this embodiment, the second component 210 has a higher heat dissipation requirement, the first component 110 has a lower heat dissipation requirement, and the heat dissipation performance of the second substrate 200 is higher than that of the first substrate 100. The second component 210 with a higher heat dissipation requirement is placed on the second substrate 200, and the first component 110 with a lower heat dissipation requirement is placed on the first substrate 100, and then the first component 110 and the second component 210 are electrically connected through the bridge connection structure 300 to achieve a path.

[0037] In another embodiment, the first component 110 has a higher heat dissipation requirement, the second component 210 has a lower heat dissipation requirement, and the heat dissipation performance of the second substrate 200 is lower than that of the first substrate 100. The first component 110 with a higher heat dissipation requirement is placed on the first substrate 100, and the second component 210 with a lower heat dissipation requirement is placed on the second substrate 200, and then the first component 110 and the second component 210 are electrically connected through the bridge connection structure 300 to achieve a path.

[0038] In this embodiment, a hybrid circuit board is formed by splicing a first substrate 100 and a second substrate 200 made of different materials. The first substrate 100 and the second substrate 200 made of different materials can respectively meet the heat dissipation requirements of the first component 110 and the second component 210, thereby improving the utilization rate of the board and reducing the cost to a certain extent. Therefore, the hybrid circuit board of this embodiment can have a good heat dissipation effect, ensuring that the hybrid circuit board and the first component 110 and the second component 210 on the hybrid circuit board are not damaged by high temperature, and ensuring the normal operation of the hybrid circuit board and the first component 110 and the second component 210 on the hybrid circuit board.

[0039] In this embodiment, the first substrate 100 is relatively large, and the second substrate 200 is relatively small. The first substrate 100 is in the shape of a rectangular parallelepiped, the upper surface of the first substrate 100 is referred to as the first upper surface 101, the lower surface of the first substrate 100 is referred to as the first lower surface 102, and the four sides of the first substrate 100 are referred to as the first side surfaces 103. The second substrate 200 is a rectangular parallelepiped structure, the mounting hole 150 is a square hole, the mounting hole 150 passes through the first upper surface 101 and the first lower surface 102, and does not pass through the first side surface 103. The cross-sectional shape of the mounting hole 150 is equal to or similar to the cross-sectional shape of the second substrate 200.

[0040] The thickness of the first substrate 100 may be equal to or different from the thickness of the second substrate 200. The size of the mounting hole 150 may be equal to or different from the size of the second substrate 200.

[0041] In another embodiment, the first substrate 100 is a cylinder, a truncated cone, a triangular prism, a pentagonal prism, a hexagonal prism or other irregular shapes. The second substrate 200 is a cylinder, a truncated cone, a triangular prism, a pentagonal prism, a hexagonal prism or other irregular shapes.

[0042] Please refer to Figure 2 , which is a cross-sectional view of a hybrid circuit board 1 shown in an embodiment of the present application. The second substrate 200 is a rectangular parallelepiped structure, the upper surface of the second substrate 200 is called the second upper surface 201, the lower surface of the second substrate 200 is called the second lower surface 202, and the four side surfaces of the second substrate 200 are called second side surfaces 203. The inner surface of the mounting hole 150 is called the first inner surface 151.

[0043] The size of the mounting hole 150 is larger than that of the second substrate 200 , so that a gap is left between the second side surface 203 of the second substrate 200 and the first inner surface 151 of the mounting hole 150 .

[0044] Since the plate material will expand and contract with temperature, in this embodiment, the size of the mounting hole 150 is larger than the size of the second substrate 200, so that a gap is left between the second side surface 203 of the second substrate 200 and the inner surface of the mounting hole 150. In this way, a gap can be reserved to prevent the first substrate 100 and the second substrate 200 from squeezing each other when the temperature rises, thereby improving the structural stability of the hybrid circuit board.

[0045] Please refer to Figure 3, which is a cross-sectional view of a hybrid circuit board 1 shown in an embodiment of the present application. The hybrid circuit board 1 also includes a heat sink 400, and the first substrate 100 and the second substrate 200 are both connected to the heat sink 400. In this embodiment, the second substrate 200 is arranged in the middle mounting hole 150 of the first substrate 100, and the second substrate 200 and the first substrate 100 are not directly connected to each other, but are indirectly connected through the heat sink 400. Compared with Figure 4 In the illustrated embodiment, the contact area between the second substrate 200 and the first substrate 100 is smaller, the influence of heat conduction between the first substrate 100 and the second substrate 200 is smaller, and the heat dissipation effect is better.

[0046] The upper surface of the heat sink 400 is referred to as a first surface 401 . The first surface 401 is a plane. The first substrate 100 and the second substrate 200 are both fixed to the first surface 401 .

[0047] At least one first connecting hole 120 is provided on the first substrate 100, and a first fastener 130 is inserted into the first connecting hole 120, and the first substrate 100 is connected to the radiator 400 through the first fastener 130; at least one second connecting hole 220 is provided on the second substrate 200, and a second fastener 230 is inserted into the second connecting hole 220, and the second substrate 200 is connected to the radiator 400 through the second fastener 230.

[0048] The first fastener 130 and the second fastener 230 are both screws, the first connection hole 120 and the second connection hole 220 are through holes, and corresponding threaded holes for connection are provided on the first surface 401 of the heat sink 400. There can be one or more first fasteners 130, one or more second fasteners 230, and accordingly, there can be one or more first connection holes 120 and second connection holes 220.

[0049] Please refer to Figure 4 , which is a cross-sectional view of a hybrid circuit board 1 shown in an embodiment of the present application. The hybrid circuit board 1 further includes an adhesive 500, which is disposed in the mounting hole 150 and is used to connect the first substrate 100 and the second substrate 200. The adhesive 500 adheres to the first inner surface 151 of the mounting hole 150 and the second side surface 203 of the second substrate 200, so that the first substrate 100 and the second substrate 200 are connected together.

[0050] The adhesive 500 may be glue. In this embodiment, after the first substrate 100 and the second substrate 200 are directly connected by the adhesive 500 , the first substrate 100 and the second substrate 200 are fixed on the heat sink 400 .

[0051] In one embodiment, the first substrate 100 is connected to the second substrate 200, the first substrate 100 is connected to the heat sink 400 by screws, or the second substrate 200 is connected to the heat sink 400 by screws, or the first substrate 100 and the second substrate 200 are fixed to the heat sink 400 by their own screws.

[0052] Please refer to Figure 5 , which is a cross-sectional view of a hybrid circuit board 1 shown in an embodiment of the present application. The material of the first substrate 100 is FR-4 grade material, and the material of the second substrate 200 is metal. In this embodiment, the second component 210 with high heat dissipation requirements is replaced with a metal substrate with good thermal conductivity, so the heat dissipation effect is better. In one embodiment, the material of the second substrate 200 is copper.

[0053] Each bridge connection structure 300 includes a first contact 310, a second contact 320 and a wire 330. The first contact 310 is arranged on the first substrate 100 and is electrically connected to the first component 110; the second contact 320 is arranged on the second substrate 200 and is electrically connected to the second component 210; the wire 330 is connected to the first contact 310 and the second contact 320.

[0054] Each second component 210 includes an LED lamp 211, a heat dissipation pad 212 and an electric pad 213. The LED lamp 211 is fixed to the upper surface (second upper surface 201) of the second substrate 200 through the heat dissipation pad 212 and the electric pad 213. The first component 110 is a power supply element, which is electrically connected to the LED lamp 211 and is used to supply power to the LED lamp 211. The first component 110 can have a package size such as SOD-123, SOT-23-3, 1206, and / or 0603.

[0055] The second contact point 320 is disposed on the electrical pad 213. In this embodiment, the electrical pad 213 under the LED lamp 211 is led out to the vicinity of the connection between the first substrate 100 and the second substrate 200 through routing, and then a bridge wire 330 is added to lead to the first substrate 100, thereby forming a bridge connection structure 300.

[0056] Please refer to Figure 6 , which is a cross-sectional view of a hybrid circuit board 1 shown in an embodiment of the present application. The second contact 320 is disposed on one side of the second component 210, and a gap is left between the second contact 320 and the second component 210. In this embodiment, the second contact 320 is disposed on the outside of the second component 210 to facilitate connection.

[0057] Please refer to Figure 7, which is a top view of a hybrid circuit board 1 shown in an embodiment of the present application. A plurality of second components 210 are provided and distributed in an array, a plurality of bridge connection structures 300 are provided and distributed in an array, the number of second components 210 can be designed as required, and the number of bridge connection structures 300 can be designed as required. The present application does not limit the number of bridge connection structures 300 and the number of second components 210.

[0058] In one embodiment, the number of the bridge connection structures 300 is equal to the number of the second components 210. In this embodiment, the second components 210 are arranged in two rows, each row having 16 second components 210, and correspondingly, the bridge connection structures 300 are arranged in two rows, each row having 16 bridge connection structures 300, and the two rows of bridge connection structures 300 are respectively located on both sides of the two rows of second components 210.

[0059] Please refer to Figure 8 , which is a cross-sectional view of a hybrid circuit board 1 according to an embodiment of the present application. A first insulating coating film 140 is disposed on the outer surface of the first substrate 100 , and the outer surface of the first substrate 100 includes a first upper surface 101 , a first lower surface 102 and a first side surface 103 .

[0060] The second substrate 200 is provided with a second insulating coating 240 on the surface where the second component 210 is located. The surface of the second substrate 200 where the second component 210 is located refers to the second upper surface 201. In the second substrate 200, the second upper surface 201 is provided with the second insulating coating 240, and the second lower surface 202 is not provided with the second insulating coating 240, so the heat dissipation effect is better.

[0061] The materials of the first insulating coating film 140 and the second insulating coating film 240 can be the same or different. In this embodiment, the first insulating coating film 140 and the second insulating coating film 240 are both insulating varnishes.

[0062] It should be noted that, in the absence of conflict, the features in the embodiments of this application may be combined with each other.

[0063] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A hybrid circuit board, characterized in that: include: A first substrate having a mounting hole, wherein at least one first component is disposed on the first substrate; A second substrate is disposed in the mounting hole, and at least one second component is disposed on the second substrate; as well as at least one bridge connection structure, provided on the first substrate and the second substrate, for electrically connecting the first component and the second component; Wherein, the material of the first substrate is different from the material of the second substrate; The second component has a higher heat dissipation requirement, the first component has a lower heat dissipation requirement, and the heat dissipation performance of the second substrate is higher than the heat dissipation performance of the first substrate; Alternatively, the heat dissipation requirement of the second component is relatively low, the heat dissipation requirement of the first component is relatively high, and the heat dissipation performance of the second substrate is lower than the heat dissipation performance of the first substrate; The mounting hole passes through the upper surface and the lower surface of the first substrate; a gap is left between the second substrate and the inner surface of the mounting hole; Each of the bridge connection structures comprises: A first contact point is disposed on the first substrate and is electrically connected to the first component; a second contact point, disposed on the second substrate and electrically connected to the second component; and A wire is connected to the first contact point and the second contact point.

2. The hybrid circuit board according to claim 1, characterized in that: The hybrid circuit board also includes: A heat sink, wherein the first substrate and the second substrate are both connected to the heat sink.

3. The hybrid circuit board according to claim 2, characterized in that: The heat sink has a first surface, the first surface is a plane, and the first substrate and the second substrate are both fixed to the first surface.

4. The hybrid circuit board according to claim 2, characterized in that: At least one first connecting hole is provided on the first substrate, a first fastener is inserted into the first connecting hole, and the first substrate is connected to the heat sink through the first fastener; The second substrate is provided with at least one second connection hole, a second fastener is inserted into the second connection hole, and the second substrate is connected to the heat sink through the second fastener.

5. The hybrid circuit board according to claim 1, characterized in that: The hybrid circuit board also includes: An adhesive is disposed in the mounting hole and is used to connect the first substrate and the second substrate.

6. The hybrid circuit board according to claim 1, characterized in that: The second contact is arranged at one side of the second component, and a gap is left between the second contact and the second component.

7. The hybrid circuit board according to claim 1, characterized in that: Each of the second components comprises an LED lamp, a heat dissipation pad and an electric pad, wherein the LED lamp is fixed to the second substrate via the heat dissipation pad and the electric pad; Wherein, the second contact point is arranged on the electrical pad.

8. The hybrid circuit board according to claim 1, characterized in that: The material of the first substrate is FR-4 grade material, and the material of the second substrate is metal; The first substrate is provided with a first insulating coating on its outer surface, and the second substrate is provided with a second insulating coating on its surface where the second component is located.

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