Method for manufacturing display device

Abstract

The present disclosure relates to a method for manufacturing a display device, comprising: attaching a protective film to a display panel including a display area and a pad area, wherein the protective film includes an adhesive layer and a protective layer disposed on the adhesive layer; half-cutting the protective film along a cutting line between the display area and the pad area, thereby cutting a total thickness of the protective layer and a partial thickness of the adhesive layer; irradiating a partially cut portion of the adhesive layer with a laser beam along at least a portion of the cutting line; and separating a portion of the protective film corresponding to the pad area along the cutting line.

Description

Technical Field

[0001] Embodiments relate to a method of manufacturing a display device, and more particularly, to a laser device and a method of manufacturing a display device using the laser device. Background Art

[0002] Display devices such as televisions, monitors, smartphones, tablet computers, etc. that display images to users include display panels that display images. Various display panels have been developed, such as liquid crystal display panels, organic light emitting display panels, electrowetting display panels, electrophoretic display panels, etc.

[0003] Recently, along with the technological development of display devices, display devices such as flexible display devices that can be folded or rolled, stretchable display devices having elasticity in at least one direction, etc. are being developed. The display device can be deformed into a predetermined shape, or into various shapes according to user needs.

[0004] A protective film may be attached to a surface of a display panel to prevent the surface of the display panel from being contaminated or damaged during a manufacturing process of the display panel. During the manufacturing process of the display panel, the protective film may be partially or substantially removed. Therefore, a method for separating the protective film attached to the surface of the display panel is being studied. Summary of the invention

[0005] The embodiment provides a method of manufacturing a display device capable of preventing damage to a display panel during a manufacturing process.

[0006] An embodiment provides a laser device used in a method of manufacturing a display device.

[0007] According to an embodiment, a method for manufacturing a display device includes: attaching a protective film to a display panel, wherein the display panel includes a display area and a pad area, and the protective film includes an adhesive layer and a protective layer arranged on the adhesive layer; half-cutting the protective film along a cutting line between the display area and the pad area, wherein a total thickness of the protective layer and a partial thickness of the adhesive layer are cut; irradiating a partially cut portion of the adhesive layer with a laser beam along at least a portion of the cutting line; and separating a portion of the protective film corresponding to the pad area along the cutting line.

[0008] In an embodiment, the wavelength of the laser beam is in the range of 200 nm to 300 nm.

[0009] In an embodiment, the adhesion layer comprises at least one of polyurethane and silicon.

[0010] In an embodiment, an adhesion force of a first portion of the adhesion layer irradiated by the laser beam is smaller than an adhesion force of a second portion of the adhesion layer not irradiated by the laser beam.

[0011] In an embodiment, a carbon concentration in a first portion of the adhesion layer irradiated by the laser beam is less than a carbon concentration in a second portion of the adhesion layer not irradiated by the laser beam, and an oxygen concentration in the first portion of the adhesion layer is greater than a oxygen concentration in the second portion of the adhesion layer.

[0012] In an embodiment, the laser beam may be swung along a width direction of the cutting line while moving along a length direction of the cutting line.

[0013] In an embodiment, the swing amplitude of the laser beam is greater than the width of the cutting line.

[0014] In an embodiment, the remaining thickness of the partially cut adhesive layer is in the range of 40 μm to 60 μm.

[0015] In an embodiment, the display panel includes: a substrate; a display unit disposed on the substrate in the display area; and an encapsulation layer covering the display unit, wherein the cutting line overlaps the encapsulation layer.

[0016] In an embodiment, the substrate comprises flexible glass.

[0017] In an embodiment, the display panel includes at least one inflexible area and at least one bendable area, wherein the at least one inflexible area is a rigid area in which the display panel cannot be folded, and the at least one bendable area is a flexible area in which the display panel can be folded, the cutting line is formed between the at least one inflexible area and the at least one bendable area, the laser beam substantially irradiates the at least one bendable area and forms a hardened portion in the adhesive layer overlapping the at least one bendable area, and the adhesion of the hardened portion of the adhesive layer is less than the adhesion of the remaining portion of the adhesive layer outside the hardened portion, and wherein the separated portion of the protective film corresponds to the at least one bendable area. The method further includes: folding the display panel along the at least one bendable area.

[0018] According to an embodiment, a method for manufacturing a display device includes: attaching a protective film to a mother panel including a plurality of display panels, each of the display panels including a display area and a pad area, wherein the protective film includes an adhesive layer and a protective layer arranged on the adhesive layer; half-cutting the protective film along a plurality of cutting lines between the display area and the pad area of ​​each of the display panels, wherein the total thickness of the protective layer and a portion of the thickness of the adhesive layer are cut; irradiating a partially cut portion of the adhesive layer with a laser beam along at least a portion of each of the cutting lines; and separating portions of the protective film corresponding to each pad area of ​​the plurality of display panels respectively along the cutting lines.

[0019] In an embodiment, the cutting lines surround each display area of ​​the plurality of display panels respectively.

[0020] In an embodiment, each of the cutting lines has a rectangular shape in a plan view, and the laser beam irradiates at least one side of each of the cutting lines.

[0021] In an embodiment, the portions of the protection film respectively corresponding to the pad regions of the display panel are separated simultaneously.

[0022] The laser device according to the embodiment includes: a laser beam generator generating an input laser beam having a wavelength in the range of 200 nm to 300 nm; a stage on which a target substrate is positioned and on which a protective film is attached; and an optical system optically converting the input laser beam into an output laser beam and irradiating the target substrate with the output laser beam.

[0023] In an embodiment, the optical system comprises an optical component, and the optical component is coated so as not to be damaged by the input laser beam.

[0024] In an embodiment, the optical component comprises at least one of a beam expander, a lens, a beam splitter and a mirror.

[0025] In an embodiment, the minimum distance between the optical system and the target substrate is at least 200 mm.

[0026] In an embodiment, the input laser beam is a CO 2 Laser beam.

[0027] In the method of manufacturing a display device according to an embodiment, the protective film can be half-cut, and a laser beam having a predetermined wavelength range can be irradiated to the adhesive layer to reduce the adhesive force of the adhesive layer. Therefore, the protective film can be easily separated from the display panel without damaging the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a plan view showing a step of providing a mother panel according to an embodiment.

[0029] Figure 2 is included in Figure 1 A plan view of the display panel in the mother panel.

[0030] Figure 3 yes Figure 2 A cross-sectional view of a display panel in FIG.

[0031] Figure 4 and Figure 5 A step of attaching a protective film according to an embodiment is shown.

[0032] Figure 6 and Figure 7 A step of half-cutting a protective film according to an embodiment is shown.

[0033] Figure 8 , Fig. 9 , Fig.10 and Fig.11 A step of irradiating a protective film with a laser beam according to an embodiment is shown.

[0034] Fig.12 and Fig.13 A laser device that emits a laser beam applicable to the embodiment is shown.

[0035] Fig.14 and Fig.15 A step of separating the protective film according to the embodiment is shown.

[0036] Fig.16 is a plan view showing a step of cutting a mother panel according to an embodiment.

[0037] Fig.17 , Fig.18 , Fig.19 and Fig. 20 is a cross-sectional view illustrating a method of manufacturing a display device according to another embodiment. DETAILED DESCRIPTION

[0038] Hereinafter, a method of manufacturing a display device and a laser device according to embodiments will be explained in detail with reference to the accompanying drawings.

[0039] In the following, reference will be made to Figures 1 to 16 A method of manufacturing a display device according to an embodiment is described.

[0040] Figure 1 is a plan view illustrating a step of providing a mother panel 100 according to an embodiment.

[0041] Reference Figure 1According to an embodiment, the mother panel 100 includes a plurality of panel areas PNA and a peripheral area PPA. The mother panel 100 includes a plurality of display panels 200 respectively disposed in the panel areas PNA. The display panels 200 are respectively formed in the panel areas PNA by one of a deposition process, a photolithography process, an etching process, etc. The display panels 200 are substantially simultaneously formed by substantially the same process.

[0042] According to an embodiment, the display panels 200 are arranged in a matrix along a first direction DR1 and a second direction DR2 crossing the first direction DR1 . Figure 1 The display panels 200 are shown to be arranged in a 3×3 matrix. However, the embodiments of the present disclosure are not limited thereto, and the display panels 200 may be arranged in an M×N matrix, where M and N are both natural numbers. The peripheral area PPA is located outside the panel area PNA. For example, the peripheral area PPA is located between the panel areas PNA spaced apart from each other and surrounds the panel area PNA.

[0043] According to an embodiment, each display panel 200 includes a display area DA and a non-display area NDA. An image can be displayed in the display area DA. The non-display area NDA is located outside the display area DA. For example, the non-display area NDA surrounds the display area DA. The non-display area NDA includes a pad area PDA.

[0044] Figure 2 is included in Figure 1 FIG. 1 is a plan view of a display panel 200 in a mother panel 100 in FIG.

[0045] Reference Figure 2 According to an embodiment, the display panel 200 includes a plurality of pixels PX, a plurality of lines GL, DL, PL, and FL, a gate driver GDV, and a plurality of pads PD.

[0046] According to an embodiment, pixels PX are disposed in the display area DA. The pixels PX are arranged in a matrix along a first direction DR1 and a second direction DR2. Each pixel PX includes a circuit element and a light emitting element connected to the circuit element.

[0047] According to an embodiment, lines GL, DL, PL, and FL are disposed in a display area DA and a non-display area NDA. Lines GL, DL, PL, and FL include gate lines GL, data lines DL, power lines PL, and fan-out lines FL. Gate lines GL extend along a first direction DR1 and are connected to pixels PX, respectively. Data lines DL and power lines PL extend along a second direction DR2 and are connected to pixels PX, respectively. Fan-out lines FL are connected to data lines DL or power lines PL, respectively.

[0048] According to an embodiment, the gate driver GDV is disposed in the non-display area NDA. The gate driver GDV is connected to the gate lines GL. The gate driver GDV generates gate signals and sequentially outputs the gate signals to the gate lines GL.

[0049] According to an embodiment, the pads PD are arranged in the pad area PDA. The pads PD are respectively connected to the fan-out lines FL. The pads PD are electrically connected to an external device that generates a data signal, a power signal, etc. The pads PD output the data signal to the data line DL through the first group of fan-out lines FL, and output the power signal to the power line PL through the second group of fan-out lines FL.

[0050] Figure 3 yes Figure 2 2 is a cross-sectional view of a display panel 200 in FIG.

[0051] Reference Figure 3 According to an embodiment, the display panel 200 includes a substrate 210, a display unit 220, an encapsulation layer 230, and a pad PD.

[0052] According to an embodiment, the substrate 210 includes one of glass, plastic such as polyimide (PI), etc. In an embodiment, the substrate 210 is flexible. For example, the substrate 210 includes flexible glass. However, in other embodiments, the material of the substrate 210 is not limited thereto.

[0053] According to an embodiment, the display unit 220 is disposed on the substrate 210 in the display area DA. The display unit 220 includes pixels PX and displays an image based on light emitted from each pixel PX. The display unit 220 includes a circuit layer 221 and an emission layer 222.

[0054] According to an embodiment, the circuit layer 221 is disposed on the substrate 210 . The circuit layer 221 includes circuit elements of the pixel PX. The circuit elements included in the circuit layer 221 generate a driving current and provide the driving current to the emission layer 222 .

[0055] According to an embodiment, the emission layer 222 is disposed on the circuit layer 221. The emission layer 222 includes a light-emitting element of the pixel PX. In an embodiment, each light-emitting element is an organic light-emitting element. However, the embodiments of the present disclosure are not limited thereto, and in other embodiments, each light-emitting element may be a liquid crystal element, a quantum dot light-emitting element, etc. The light-emitting element included in the emission layer 222 emits light based on a driving current.

[0056] According to an embodiment, encapsulation layer 230 covers display unit 220. Encapsulation layer 230 is formed on substrate 210 on which display unit 220 is disposed, and encapsulates display unit 220. Encapsulation layer 230 protects light emitting elements of emission layer 222 from influences such as oxygen, external moisture, and the like.

[0057] According to an embodiment, the encapsulation layer 230 includes at least one inorganic layer and at least one organic layer. In an embodiment, the encapsulation layer 230 includes a first inorganic layer covering the display unit 220, an organic layer disposed on the first inorganic layer and formed in the display area DA, and a second inorganic layer covering the organic layer. The edge of the second inorganic layer contacts the edge of the first inorganic layer.

[0058] Figure 4 and Figure 5 A step of attaching the protection film 300 according to an embodiment is shown.

[0059] Reference Figure 4 According to an embodiment, the protective film 300 is attached to the mother panel 100 including the display panel 200. The protective film 300 overlaps the panel area PNA and the peripheral area PPA of the mother panel 100 in a plan view and covers the display panel 200. Therefore, the protective film 300 overlaps the display area DA and the pad area PDA of each display panel 200.

[0060] Reference Figure 5 According to an embodiment, the protective film 300 is attached to the display panel 200. For example, the protective film 300 overlaps the encapsulation layer 230 and the pad PD, and is attached to an upper portion of the encapsulation layer 230. Figure 5 It is shown that the protection film 300 is not attached to the pad PD, however, in other embodiments, the protection film 300 follows the contours of the encapsulation layer 230 and the pad PD and is attached to the pad PD.

[0061] According to an embodiment, the protective film 300 includes an adhesive layer 310 and a protective layer 320 disposed on the adhesive layer 310. The protective film 300 is attached to the display panel 200 such that the adhesive layer 310 contacts the display panel 200. In other words, the protective layer 320 is attached to the display panel 200 through the adhesive layer 310.

[0062] According to an embodiment, the adhesive layer 310 includes an adhesive material. In an embodiment, the adhesive layer 310 includes at least one of polyurethane (PU) and silicon (Si). The thickness of the adhesive layer 310 is in the range of about 65 μm to about 100 μm. The adhesive layer 310 attaches the protective film 300 to the display panel 200.

[0063] According to an embodiment, the protective layer 320 includes a flexible material. For example, the protective layer 320 includes a polymer resin such as polyethylene terephthalate (PET). The thickness of the protective layer 320 is in the range of about 65 μm to about 100 μm. The protective layer 320 prevents moisture, oxygen, etc. from penetrating into the display panel 200 and prevents the display panel 200 from being damaged by external impact.

[0064] Figure 6 and Figure 7 A step of half-cutting the protective film 300 according to an embodiment is shown.

[0065] Reference Figure 6 , according to an embodiment, the protection film 300 is half-cut along the cutting line CL.

[0066] According to an embodiment, a plurality of cutting lines CL for a half-cut protective film 300 are formed on the protective film 300. In a plan view, the cutting lines CL surround the display area DA, respectively. In an embodiment, each cutting line CL may have a rectangular shape in a plan view. Therefore, each cutting line CL is a closed curve. In this case, the areas in the protective film 300 respectively surrounded by the cutting lines CL are referred to as first areas 1A, and the areas outside the first areas 1A in the protective film 300 are referred to as second areas 2A. The first areas 1A overlap with the display areas DA, respectively, in a plan view, and the second areas 2A overlap with the pad areas PDA and the peripheral areas PPA in a plan view. A portion of each cutting line CL is located between the display area DA and the pad area PDA of each display panel 200 in a plan view.

[0067] Reference Figure 7 According to an embodiment, the cutting line CL is located between the display area DA and the pad area PDA, and overlaps the encapsulation layer 230. The protective film 300 is half-cut so that a portion of the thickness of the protective film 300 is cut along the cutting line CL. For example, the protective film 300 is half-cut so that the total thickness of the protective layer 320 and the portion of the thickness of the adhesive layer 310 are cut. The portion of the adhesive layer 310 corresponding to the cutting line CL is cut by a first thickness TH1 from the upper surface of the adhesive layer 310. The portion of the adhesive layer 310 corresponding to the cutting line CL has a second thickness TH2 obtained by subtracting the first thickness TH1 from the total thickness of the adhesive layer 310 relative to the lower surface of the adhesive layer 310. Therefore, the groove GRV corresponding to the cutting line CL is formed in the protective film 300. In an embodiment, the second thickness TH2 is in the range of about 40 μm to about 60 μm.

[0068] In the embodiment, CO 2 The protective film 300 is half-cut by the laser beam LB1. 2 The laser beam LB1 cuts the total thickness of the protective layer 320 from the upper surface of the protective layer 320 toward the lower surface of the protective layer 320 , and cuts a portion of the thickness of the adhesive layer 310 from the upper surface of the adhesive layer 310 toward the lower surface of the adhesive layer 310 .

[0069] Figure 8 , Fig. 9 , Fig.10 and Fig.11A step of irradiating the protective film 300 with the laser beam LB2 according to an embodiment is shown.

[0070] Reference Figure 8 and Fig. 9 According to an embodiment, the protective film 300 is irradiated with a laser beam LB2 along at least a portion of each cutting line CL. The areas of the protective film 300 irradiated by the laser beam LB2 are referred to as laser beam irradiation areas LBA1 and LBA2, and the laser beam irradiation areas LBA1 and LBA2 overlap at least a portion of each cutting line CL, respectively. In an embodiment, when each cutting line CL is surrounded by a rectangular shape in a plan view, the laser beam LB2 is irradiated to at least one side of each cutting line CL. In other words, the laser beam irradiation areas LBA1 and LBA2 overlap at least one side of each cutting line CL in a plan view. For example, when the laser beam LB2 irradiates one of the four sides of each cutting line CL, the laser beam irradiation areas LBA1 and LBA2 are both line segments.

[0071] In the embodiment, the laser beam LB2 irradiates three of the four cutting lines CL individually, such as Figure 8 In other words, the laser beam irradiation area LBA1 corresponding to three of the four cutting lines CL is formed in the protective film 300. For example, the laser beam irradiation area LBA1 is formed in the protective film 300 and has a shape of three sides surrounding the display area DA. However, the embodiment is not limited thereto, and in other embodiments, the laser beam irradiation area LBA1 corresponds to one side or two sides of the display area DA.

[0072] In another embodiment, the laser beam LB2 irradiates a plurality of cutting lines CL as a whole. Fig. 9 . In other words, each laser beam irradiation area LBA2 formed in the protective film 300 corresponds to a plurality of cutting lines CL. For example, the laser beam irradiation area LBA2 is formed in the protective film 300, overlaps with one side of each cutting line CL along the first direction DR1, and has a straight line shape extending along the first direction DR1. In other embodiments, the laser beam irradiation area LBA2 formed in the protective film 300 overlaps with one side of each cutting line CL along the second direction DR2, and has a straight line shape extending along the second direction DR2.

[0073] According to an embodiment, Fig.10 Shows Figure 8 and Fig. 9 The protective film 300 of the display panel 200 attached to the mother panel 100 shown in FIG. 1 is irradiated with the laser beam LB2.

[0074] Reference Fig.10According to an embodiment, the laser beam LB2 irradiated to the protective film 300 swings along the width direction of the cutting line CL while moving along the length direction of the cutting line CL. For example, when the cutting line CL extends along the first direction DR1, the irradiated laser beam LB2 swings along the second direction DR2 while moving along the first direction DR1. Therefore, the path of the laser beam LB2 on the protective film 300 has a zigzag shape.

[0075] According to an embodiment, when the laser beam LB2 is irradiated by the laser device, the alignment margin of the laser device may cause an error between the area to be irradiated by the laser beam LB2 and the area to be actually irradiated by the laser beam LB2. In the comparative example, when the laser beam LB2 is irradiated along the length direction of the cutting line CL without swinging, an error of the laser beam LB2 occurs in a direction perpendicular to the displacement direction of the laser beam LB2. Therefore, the laser beam LB2 partially irradiates the area outside the cutting line CL. However, in the present embodiment, the laser beam LB2 is irradiated along the length direction of the cutting line CL while swinging along the width direction of the cutting line CL, so that although an error of the laser beam LB2 occurs in a direction perpendicular to the displacement direction of the laser beam LB2, the laser beam LB2 basically irradiates the area inside the cutting line CL.

[0076] According to an embodiment, the swing amplitude of the laser beam LB2 is greater than the width CLW of the cutting line CL. Because the swing amplitude of the laser beam LB2 along the width direction of the cutting line CL is greater than the width CLW of the cutting line CL, the width LBAW of the laser beam irradiation area LBA3 is greater than the width CLW of the cutting line CL. For example, the width CLW of the cutting line CL is in the range of about 30 μm to about 300 μm, and the width LBAW of the laser beam irradiation area LBA3 is greater than the width CLW of the cutting line CL. Therefore, although the laser beam LB2 still substantially irradiates the portion of the protective film 300 within the cutting line CL, the area irradiated by the laser beam LB2 (i.e., the laser beam irradiation area LBA3) is still increased.

[0077] Reference Fig.11 According to an embodiment, the laser beam LB2 irradiates the half-cut portion of the adhesion layer 310 having the second thickness TH2 that is not completely cut by half-cutting along the cutting line CL. The laser beam LB2 irradiates the groove GRV of the protective film 300, and the half-cut portion of the adhesion layer 310 is hardened by the laser beam LB2, thereby forming a hardened portion HP.

[0078] According to an embodiment, the laser beam LB2 has a wavelength in the range of about 200 nm to about 300 nm or in the range of about 200 nm to about 280 nm. In other words, the laser beam LB2 is a deep ultraviolet (DUV) laser beam. The DUV laser beam LB2 irradiates the half-cut portion of the adhesive layer 310 to form the hardened portion HP.

[0079] According to an embodiment, when the DUV laser beam LB2 irradiates the adhesion layer 310, the adhesion of the irradiated portion of the adhesion layer 310 is reduced. Therefore, the adhesion of the irradiated first portion of the adhesion layer 310 is smaller than the adhesion of the non-irradiated second portion of the adhesion layer 310. In other words, the adhesion of the hardened portion HP of the adhesion layer 310 is smaller than the adhesion of the remaining portion of the adhesion layer 310 outside the hardened portion HP.

[0080] According to an embodiment, when the DUV laser beam LB2 irradiates the adhesion layer 310, the chemical composition of the irradiated portion of the adhesion layer 310 changes. The concentration of carbon in the irradiated portion of the adhesion layer 310 decreases, and the concentration of oxygen in the irradiated portion of the adhesion layer 310 increases. Therefore, the concentration of carbon in the irradiated first portion of the adhesion layer 310 is less than the concentration of carbon in the non-irradiated second portion of the adhesion layer 310, and the concentration of oxygen in the first portion of the adhesion layer 310 is greater than the concentration of oxygen in the second portion of the adhesion layer 310. In other words, the concentration of carbon in the hardened portion HP of the adhesion layer 310 is less than the concentration of carbon in the remaining portion of the adhesion layer 310 outside the hardened portion HP, and the concentration of oxygen in the hardened portion HP of the adhesion layer 310 is greater than the concentration of oxygen in the remaining portion of the adhesion layer 310 outside the hardened portion HP. The decrease in the carbon concentration and the increase in the oxygen concentration of the adhesion layer 310 result from the decrease in carbon-carbon (CC) bonds and the increase in carbon-oxygen (CO) bonds in the adhesion layer 310 due to the irradiation of the laser beam LB2 to the adhesion layer 310 .

[0081] In the comparative example, when a laser beam having a wavelength greater than about 300 nm (e.g., a near ultraviolet (NUV) laser beam) is irradiated to the uncut adhesive layer 310, the adhesion of the irradiated adhesive layer 310 is not reduced. In addition, the irradiated adhesive layer 310 may be cut or removed, which may damage the encapsulation layer 230 below. However, in the present embodiment, when the DUV laser beam LB2 irradiates the uncut adhesive layer 310, the adhesion of the irradiated adhesive layer 310 is reduced, and the protective film 300 can be easily separated in a subsequent separation process.

[0082] Fig.12 and Fig.13 A laser device 400 emitting a laser beam LB2 according to an embodiment is shown.

[0083] Reference Fig.12 and Fig.13 According to an embodiment, the laser device 400 includes a laser beam generator 410 , a stage 420 , and an optical system 430 .

[0084] According to an embodiment, the laser beam generator 410 generates an input laser beam LBI having a wavelength in a range of about 200 nm to about 300 nm. In an embodiment, the input laser beam LBI is a deep ultraviolet (DUV) laser beam having a wavelength of about 266 nm.

[0085] According to an embodiment, a target substrate having the protective film 300 attached thereto is positioned on the stage 420. The target substrate is the above-described mother panel 100. The stage 420 supports the target substrate.

[0086] According to an embodiment, the optical system 430 optically converts the input laser beam LBI into the output laser beam LBO. The output laser beam LBO is the above-mentioned laser beam LB2 having a wavelength in the range of about 200nm to about 300nm. The optical system 430 irradiates the target substrate on the stage 420 with the output laser beam LBO. The optical system 430 irradiates the output laser beam LBO to a predetermined area in the target substrate.

[0087] According to an embodiment, the optical system 430 includes an optical member that optically converts an input laser beam LBI into an output laser beam LBO and irradiates the output laser beam LBO to a predetermined area in a target substrate. The optical member includes at least one of a beam expander, a lens, a beam splitter, and a reflector. A portion of the input laser beam LBI is reflected by the optical member, and the other portion of the input laser beam LBI is transmitted through the optical member, so that the input laser beam LBI is optically converted into the output laser beam LBO. The optical member is coated so as not to be damaged by the input laser beam LBI. For example, the optical member is coated so as not to be damaged by a deep ultraviolet (DUV) laser beam of 266nm. In addition, the position and angle of the optical member are controlled so that the output laser beam LBO irradiates a predetermined area in the target substrate.

[0088] In an embodiment, the optical system 430 includes beam splitters SPL1, SPL2, SPL3, SPL4 and SPL5, prisms PRM1 and PRM2, a beam expander BEP1, lenses LS1 and LS2, a wavelength selector WSL and a slit SLT. Fig.12 As shown in . The laser beam passing through the optical system 430 is transmitted to the controllers CTR1, CTR2 and CTR3 through the beam splitters SPL3, SPL4 and SPL5, and the controllers CTR1, CTR2 and CTR3 control the position, direction, etc. of the laser beam. In such an embodiment, Fig.12The optical system 430 shown in FIG. 4 is a line beam optical system. The line beam optical system 430 irradiates a target substrate with an output laser beam LBO while the optical system 430 moves.

[0089] exist Fig.13 In another embodiment shown in FIG. 4 , the optical system 430 includes a beam expander BEP2, a first scanner SCAN1, and a second scanner SCAN2. The second scanner SCAN2 includes mirrors MR1 ​​and MR2 and an f-theta lens FTL. The first scanner SCAN1 controls the position of the laser beam passing through the optical system 430 in the z direction, the mirrors MR1 ​​and MR2 control the position of the laser beam passing through the optical system 430 in the x direction and the y direction, and the laser beam passing through the optical system 430 is transmitted through the f-theta lens FTL. In such an embodiment, Fig.13 The optical system 430 shown in FIG. 4 is a spot optical system. The spot optical system 430 irradiates a target substrate with an output laser beam LBO using the moving optical system 430 or the second scanner SCAN2.

[0090] In an embodiment, the minimum distance MD between the optical system 430 and the target substrate is at least about 200 mm. For example, the minimum distance MD is the direct distance between the f-theta lens FTL in the second scanner SCAN2 and the target substrate. When the minimum distance MD is less than about 200 mm, the output laser beam LBO irradiated from the optical system 430 does not cover the entire area of ​​the target substrate.

[0091] Fig.14 and Fig.15 A step of separating the protective film 300 according to an embodiment is shown.

[0092] Reference Fig.14 and Fig.15 According to an embodiment, a portion of the protective film 300 corresponding to the pad area PDA attached to each display panel 200 is separated along each cutting line CL. In such an embodiment, due to the lower adhesion of the hardened portion HP of the adhesive layer 310, the portion of the protective film 300 corresponding to each pad area PDA is easily separated from the display panel 200.

[0093] In an embodiment, the second area 2A of the protective film 300 attached to the mother panel 100 is separated along the cutting line CL. In other words, the second area 2A of the protective film 300 overlapping the plurality of pad areas PDA and the peripheral area PPA is separated from the mother panel 100. Therefore, the portions of the protective film 300 respectively corresponding to the pad areas PDA can be separated substantially at the same time. For example, a separation member such as a separation tape can be attached at one side of the second area 2A of the protective film 300, and a predetermined force applied to the separation member separates the second area 2A of the protective film 300 from the mother panel 100. Therefore, only the first area 1A of the protective film 300 remains on the display panel 200.

[0094] In the comparative example, when the hardened portion HP having reduced adhesion is not formed in the adhesive layer 310, the adhesive layer 310 can be separated using a separation member such as a metal needle to separate the protective film 300 from the mother panel 100. Therefore, the display panel 200 may be damaged by the separation member. When the display panel 200 includes a flexible glass substrate 210, the separation member physically contacts the substrate 210 or applies pressure to the substrate 210, thereby causing damage to the substrate 210. However, in the present embodiment, the adhesive layer 310 includes a hardened portion HP having reduced adhesion, so that the protective film 300 can be easily separated from the mother panel 100 using a separation member such as a separation tape. Therefore, the second region 2A of the protective film 300 can be separated from the mother panel 100 without damaging the display panel 200.

[0095] According to the embodiment, a portion of protective film 300 corresponding to pad area PDA is separated from display panel 200, thereby exposing pads PD of display panel 200. Therefore, subsequent processes such as image quality inspection of display panel 200 through exposed pads PD can be performed.

[0096] Fig.16 is a plan view illustrating a step of cutting the mother panel 100 according to an embodiment.

[0097] Reference Fig.16 According to an embodiment, the mother panel 100 is cut so that the plurality of display panels 200 in the mother panel 100 are separated from each other. The cutting member CT cuts the mother panel 100 while moving along the cutting lines TL, wherein the cutting lines TL are formed along the edges of the display panels 200. Each cutting line TL is formed along one of the first direction DR1 or the second direction DR2. Thus, the plurality of display panels 200 in the mother panel 100 are separated into individual display panels 200. For example, the cutting member CT is a cutting wheel or the like.

[0098] In the following, reference will be made to Figures 17 to 20 A method for manufacturing a display device according to another embodiment is described. Reference will be omitted. Figures 17 to 20 Method for manufacturing a display device and reference Figures 1 to 16 The elements of the method for manufacturing a display device are described in detail with reference to the accompanying drawings.

[0099] Fig.17 , Fig.18 , Fig.19 and Fig. 20 is a cross-sectional view illustrating a method of manufacturing a display device according to another embodiment.

[0100] Reference Fig.17 According to an embodiment, the protective film 300 is attached to the display panel 200 , and the protective film 300 is half-cut.

[0101] According to an embodiment, the display panel 200 has at least one inflexible area and at least one bendable area. The inflexible area is a rigid area in which the display panel 200 is not folded, and the bendable area is a flexible area in which the display panel 200 can be folded. The display panel 200 according to the present embodiment is a foldable display panel, however, the embodiments of the present disclosure are not limited thereto. In another embodiment, the display panel 200 is one of various flexible display panels such as a bendable display panel, a rollable display panel, etc. In an embodiment, the display panel 200 includes a first inflexible area NBA1, a second inflexible area NBA2, a third inflexible area NBA3, a first bendable area BA1, and a second bendable area BA2. The first bendable area BA1 is disposed between the first inflexible area NBA1 and the second inflexible area NBA2, and the second bendable area BA2 is disposed between the second inflexible area NBA2 and the third inflexible area NBA3.

[0102] First, according to an embodiment, the protective film 300 is attached to the display panel 200. The protective film 300 includes an adhesive layer 310 and a protective layer 320 disposed on the adhesive layer 310. The protective film 300 is attached to the display panel 200 such that the adhesive layer 310 contacts the display panel 200.

[0103] Then, according to an embodiment, the protective film 300 is half-cut along the cutting line CL. The cutting line CL is formed between the inflexible area and the bendable area. For example, the cutting line CL is formed between the first inflexible area NBA1 and the first bendable area BA1, between the first bendable area BA1 and the second inflexible area NBA2, between the second inflexible area NBA2 and the second bendable area BA2, and between the second bendable area BA2 and the third inflexible area NBA3. The total thickness of the protective layer 320 is cut along the cutting line CL, but the adhesive layer 310 is not cut or partially cut along the cutting line CL.

[0104] Reference Fig.18 According to an embodiment, a laser beam LB3 is irradiated to the protective film 300. The laser beam LB3 is a deep ultraviolet (DUV) laser beam having a wavelength in the range of about 200 nm to about 300 nm or in the range of about 200 nm to about 280 nm. The laser beam LB3 irradiates the adhesive layer 310 of the protective film 300 to form a hardened portion HP. In an embodiment, the laser beam LB3 substantially irradiates each of the bendable areas BA1 and BA2 to form hardened portions HP overlapping the bendable areas BA1 and BA2, respectively, as shown in FIG. Fig.18 However, the embodiments of the present disclosure are not limited thereto, and in other embodiments, the laser beam LB3 irradiates the portion of the adhesive layer 310 exposed by the cutting line CL to form a hardened portion overlapping the cutting line CL. The adhesion of the irradiated portion of the adhesive layer 310 is reduced, and therefore, the adhesion of the hardened portion HP of the adhesive layer 310 is less than the adhesion of the remaining portion of the adhesive layer 310 outside the hardened portion HP.

[0105] Reference Fig.19 According to the embodiment, the portions of the protective film 300 respectively corresponding to the bendable areas BA1 and BA2 are separated from the display panel 200. Due to the lower adhesion of the hardened portion HP of the adhesive layer 310, the portions of the protective film 300 respectively corresponding to the bendable areas BA1 and BA2 are easily separated from the display panel 200.

[0106] Reference Fig. 20 According to the embodiment, each of the bendable areas BA1 and BA2 of the display panel 200 is folded. Because the portions of the protective film 300 corresponding to the bendable areas BA1 and BA2, respectively, are separated, the stress applied to each of the bendable areas BA1 and BA2 by folding the display panel 200 is reduced, and each of the bendable areas BA1 and BA2 of the display panel 200 is easily folded. In the embodiment, the first and second bendable areas NBA1 and NBA2 are folded outwardly through the first bendable area BA1, and the second and third bendable areas NBA2 and NBA3 are folded inwardly through the second bendable area BA2.

[0107] The method of manufacturing a display device according to an exemplary embodiment can be used by a display device included in a computer, a notebook, a mobile phone, a smart phone, a smart pad, a PMP, a PDA, an MP3 player, etc.

[0108] Although the method of manufacturing a display device and a laser device according to exemplary embodiments have been described with reference to the accompanying drawings, the illustrated embodiments are examples and may be modified and changed by a person of ordinary skill in the relevant technical field without departing from the technical spirit described in the present disclosure.

Claims

1. A method for manufacturing a display device, wherein: The method comprises: Attaching a protective film to a display panel, wherein the display panel includes a display area and a pad area, and the protective film includes an adhesive layer and a protective layer disposed on the adhesive layer; half-cutting the protective film along a cutting line between the display area and the pad area using a CO2 laser beam, wherein the total thickness of the protective layer and a portion of the thickness of the adhesive layer are cut; irradiating a remaining portion of the adhesive layer after the portion of the thickness is cut with a deep ultraviolet laser beam along at least a portion of the cutting line; and separating a portion of the protective film corresponding to the pad area along the cutting line, Wherein, the wavelength of the deep ultraviolet laser beam is in the range of 200nm to 300nm.

2. The method according to claim 1, wherein: The adhesion force of a first portion of the adhesion layer irradiated by the deep ultraviolet laser beam is smaller than the adhesion force of a second portion of the adhesion layer not irradiated by the deep ultraviolet laser beam.

3. The method according to claim 1, wherein: The concentration of carbon in a first portion of the adhesion layer irradiated by the deep ultraviolet laser beam is less than the concentration of carbon in a second portion of the adhesion layer not irradiated by the deep ultraviolet laser beam, and Wherein, a concentration of oxygen in the first portion of the adhesion layer is greater than a concentration of oxygen in the second portion of the adhesion layer.

4. The method according to claim 1, wherein: The deep ultraviolet laser beam moves along the length direction of the cutting line and swings along the width direction of the cutting line.

5. The method according to claim 4, wherein: The swing amplitude of the deep ultraviolet laser beam is greater than the width of the cutting line.

6. The method according to claim 1, wherein: The display panel comprises: substrate; A display unit is disposed on the substrate in the display area; and an encapsulation layer, covering the display unit, Wherein, the cutting line overlaps with the packaging layer.

7. A method for manufacturing a display device, wherein: The method comprises: Attaching a protective film to a mother panel including a plurality of display panels, each of the display panels including a display area and a pad area, wherein the protective film includes an adhesive layer and a protective layer disposed on the adhesive layer; Half-cutting the protective film along a plurality of cutting lines between the display area and the pad area of ​​each of the display panels, wherein the total thickness of the protective layer and a portion of the thickness of the adhesive layer are cut; irradiating a remaining portion of the adhesive layer after the portion of the thickness is cut with a laser beam along at least a portion of each of the cutting lines; and Portions of the protection film respectively corresponding to each pad region of the plurality of display panels are separated along the cutting lines.

8. The method according to claim 7, wherein: The cutting lines respectively surround each display area of ​​the plurality of display panels. wherein each of the cutting lines has a rectangular shape in plan view, and Wherein, the laser beam irradiates at least one side of each of the cutting lines.

9. The method according to claim 7, wherein: The portions of the protection film respectively corresponding to the pad regions of the display panel are simultaneously separated.

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