LED bracket, lamp bead, conductive base, light-emitting unit module and device

Abstract

The present invention provides an LED bracket, a lamp bead, a conductive base, a light-emitting unit module and a device. The conductive base includes at least two metal sheets arranged in an insulated manner. The metal sheets are combined with a colloid used to form a bracket shell to form the LED bracket. The upper surface of at least one metal sheet is used to carry an LED chip. The heat generated by the LED chip during operation can be directly transferred to the metal sheet and quickly dissipated outward through the metal sheet. Since the lower surface and the first side surface of the metal sheet are exposed and are respectively provided with a first recess and a second recess, both of which can be used as pads for external electrical connection, they can be suitable for various application scenarios and are convenient for welding. The provision of the first recess and the second recess can increase the welding area, thereby increasing the welding strength, and excess solder during the welding process can be accommodated in the recess, thereby ensuring the flatness and reliability of the welding.

Description

Technical Field

[0001] The present invention relates to the field of LED (Light Emitting Diode), and in particular to an LED bracket, a lamp bead, a conductive base, a light emitting unit module and a device. Background Art

[0002] At present, the color gamut and brightness required by various display devices are getting higher and higher, and the thickness is getting thinner and thinner. The color gamut and brightness are negatively correlated. The higher the color gamut requirement, the lower the brightness. The brightness of the original single chip package cannot meet the requirements. It is necessary to propose an ultra-thin side-emitting diode with higher brightness when the color gamut is high. To this end, the prior art provides a light-emitting diode with higher brightness when the color gamut is high, see Figure 1 As shown, it includes a plastic substrate 001, a circuit formed on the top surface of the plastic substrate 001 and electrically connected to the LED chip, and a pad 004 arranged on the bottom surface of the plastic substrate 001. The circuit on the top surface of the plastic substrate 001 is electrically connected to the pad 004 through the conductive material in the through hole penetrating the bottom surface. A shell 002 is formed on the plastic substrate 001, and a cavity for placing the LED chip 003 is formed in the shell 002, and the cavity is filled with fluorescent glue 005. Although the light-emitting diode of this structure can improve the brightness, its structure is relatively complex and the cost is high; in addition, due to the placement of two LED chips, the heat generated by the light-emitting diode when working is doubled compared with the light-emitting diode with a single LED chip, and the heat generated by the LED chip in the light-emitting diode is mainly transferred to the pad 004 through the conductive material in the through hole penetrating the plastic substrate 001 for heat dissipation. The heat dissipation path is long and the heat dissipation area is small, resulting in poor heat dissipation effect. Summary of the invention

[0003] The present invention provides an LED bracket, a lamp bead, a conductive base, a light-emitting unit module and a device, which solve the problems of complex structure, high cost and poor heat dissipation of existing light-emitting diodes.

[0004] In order to solve the above technical problems, an embodiment of the present invention provides a conductive base of an LED bracket, wherein the conductive base comprises at least two metal sheets arranged in an insulated and isolated manner, wherein the metal sheets are combined with a colloid used to form a bracket shell to form an LED bracket, and the upper surface of the metal sheet is located at the bottom of a bowl cup formed by the bracket shell and used to place an LED chip, and is at least partially exposed to the outside; the upper surface of at least one of the metal sheets is used to carry the LED chip, and the exposed area of ​​the upper surface of each of the metal sheets is used to be electrically connected to the electrode of the corresponding LED chip;

[0005] At least a portion of the lower surface of the metal sheet is exposed outside the bracket shell, the lower surface is a surface opposite to the upper surface, at least a portion of the first side surface of at least one metal sheet located between the upper surface and the lower surface is exposed outside the bracket shell, at least a portion of the second side surface of at least one metal sheet located between the upper surface and the lower surface is not exposed outside the bracket shell, the first side surface and the second side surface are two opposite side surfaces, the area of ​​the lower surface exposed outside the bracket shell is provided with a first recess for accommodating solder, and the area of ​​the first side surface exposed outside the bracket shell is provided with a second recess for accommodating solder.

[0006] Optionally, the first recess is communicated with the second recess.

[0007] Optionally, the first recess is a first groove or a first hole, and the second recess is a second groove or a second hole.

[0008] Optionally, the area on the upper surface of the metal sheet that is combined with the bracket shell is provided with a rough surface with a concave-convex structure for enhancing the bonding force with the bracket shell, and / or is provided with a bonding hole for the colloid that forms the bracket shell to flow in.

[0009] Optionally, the combining hole is communicated with the first recess.

[0010] Optionally, the end of the combining hole close to the upper surface is the upper end, the end close to the lower surface is the lower end, and the hole diameter of the upper end of the combining hole is larger than the hole diameter of the lower end of the combining hole.

[0011] Optionally, the conductive base includes three metal sheets arranged in sequence, and an exposed area on the upper surface of the middle metal sheet is electrically connected to electrodes corresponding to two LED chips respectively.

[0012] Optionally, the lateral width of the upper end of at least one of the metal sheets close to the upper surface is greater than the lateral width of the first side surface, and a portion of the upper end of the metal sheet is embedded in the bracket housing;

[0013] or,

[0014] At least one of the metal sheets is provided with a protrusion extending outward between the upper surface and the lower surface, and at least a portion of the protrusion is embedded in the bracket shell.

[0015] Optionally, the metal sheet is a copper substrate, and a reflective layer is provided on the upper surface at least in an exposed area.

[0016] In order to solve the above technical problems, an embodiment of the present invention further provides an LED bracket, comprising the conductive base as described above, and also comprising a colloid combined with the conductive base to form the bracket shell.

[0017] Optionally, the colloid is white glue.

[0018] Optionally, the conductive base includes three metal sheets arranged in sequence, and the bracket shell also includes a separation wall arranged on the upper surface of the metal sheet located in the middle, so as to form two isolated bowls on the upper surfaces of the three metal sheets.

[0019] In order to solve the above technical problems, an embodiment of the present invention also provides an LED lamp bead, including the LED bracket as described above, and also including an LED chip arranged in the bowl cup, and a packaging layer arranged in the bowl cup to cover the LED chip, and the electrodes of the LED chip are electrically connected to the corresponding exposed areas on the upper surface of the metal sheet.

[0020] In order to solve the above technical problems, an embodiment of the present invention further provides a light-emitting unit module, including a substrate and a plurality of LED lamp beads as described above, wherein the plurality of LED lamp beads are electrically connected to the substrate.

[0021] In order to solve the above technical problem, an embodiment of the present invention further provides a display device, comprising the light emitting unit module as described above.

[0022] Beneficial Effects

[0023] The present invention provides an LED bracket, a lamp bead, a conductive base thereof, a light-emitting unit module and a device, wherein the conductive base comprises at least two metal sheets arranged in an insulated and isolated manner, the metal sheets are combined with a colloid used to form a bracket shell to form the LED bracket, the upper surface of the metal sheet is located at the bottom of a bowl cup formed by the bracket shell for placing an LED chip, and is at least partially exposed to the outside; the upper surface of at least one metal sheet is used to carry the LED chip, and the exposed area of ​​the upper surface of each metal sheet is used to be electrically connected to the electrode of the corresponding LED chip; at least part of the lower surface of the metal sheet is exposed outside the bracket shell, so that the heat generated by the LED chip during operation can be directly transferred to the metal sheet and quickly dissipated outward through the metal sheet, which greatly shortens the heat dissipation path and greatly increases the heat dissipation area, thereby greatly improving the heat dissipation effect and ensuring the performance of the LED lamp bead;

[0024] In addition, at least a portion of the first side surface of at least one metal sheet between the upper surface and the lower surface is exposed outside the bracket shell, and a second side surface of at least one metal sheet between the upper surface and the lower surface is not exposed outside the bracket shell. The area of ​​the lower surface exposed outside the bracket shell is provided with a first recess for accommodating solder, and the area of ​​the first side surface exposed outside the bracket shell is provided with a second recess for accommodating solder. Since both the lower surface and the first side surface of the metal sheet are exposed, both can be used as pads for external electrical connection. In the side light application scenario, the first side surface can be welded to the outside, or the first side surface and the lower surface can be welded at the same time. In the front light application scenario, the lower surface can be welded, or the lower surface and the first side surface can be welded at the same time. Therefore, it can be applicable to various application scenarios, and welding is convenient. Welding can also be performed on two surfaces as required, which can improve the firmness of welding and thus improve the reliability of the product.

[0025] In addition, since the area of ​​the lower surface of the metal sheet exposed outside the bracket shell is provided with a first recess for accommodating solder, and the area of ​​the first side surface exposed outside the bracket shell is provided with a second recess for accommodating solder, the arrangement of the recess can increase the welding area, thereby increasing the welding strength; and the arrangement of the first recess and the second recess accommodates excess solder in the welding process in the recess, thereby ensuring the flatness and reliability of welding;

[0026] The LED bracket is composed of a conductive base and a bracket shell covering the conductive base, and the LED lamp bead is composed of an LED chip placed in a bowl cup inside the LED bracket, and a packaging layer covering the LED chip. The structure of the LED bracket and the LED lamp bead is simpler than that of the existing bracket and lamp bead, and is easier to manufacture and has lower cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of an existing light emitting diode;

[0028] Figure 2 A schematic diagram of a conductive base in an example provided by an embodiment of the present invention;

[0029] Figure 3-1 A three-dimensional schematic diagram of an LED bracket in an example provided in an embodiment of the present invention Figure 1 ;

[0030] Figure 3-2 A three-dimensional schematic diagram of an LED bracket in an example provided in an embodiment of the present invention Figure 2 ;

[0031] Figure 3-3 A schematic diagram of another conductive base in an example provided in an embodiment of the present invention;

[0032] Figure 4A schematic diagram of a conductive base in another example provided by an embodiment of the present invention;

[0033] Figure 5 A schematic diagram of an LED lamp bead in another example provided in an embodiment of the present invention Figure 1 ;

[0034] Figure 6 A schematic diagram of a conductive base in another example provided by an embodiment of the present invention;

[0035] Figure 7 A schematic diagram of an LED lamp bead in another example provided by an embodiment of the present invention;

[0036] Figure 8 A schematic diagram of a conductive base in another example provided by an embodiment of the present invention;

[0037] Fig. 9 A schematic diagram of an LED lamp bead in another example provided by an embodiment of the present invention;

[0038] Fig.10 A schematic diagram of a conductive base in another example provided in an embodiment of the present invention Figure 1 ;

[0039] Fig.11 A schematic diagram of a conductive base in another example provided in an embodiment of the present invention Figure 2 ;

[0040] Fig.12 Schematic diagram 3 of a conductive base in another example provided by an embodiment of the present invention;

[0041] Fig.13 A schematic diagram of an LED lamp bead in another example provided in an embodiment of the present invention Figure 1 ;

[0042] Fig.14 A schematic diagram of an LED lamp bead in another example provided in an embodiment of the present invention Figure 2 ;

[0043] Fig.15 Schematic diagram 3 of an LED lamp bead in another example provided by an embodiment of the present invention;

[0044] Fig.16 A schematic diagram of a light emitting unit module in another example provided by an embodiment of the present invention;

[0045] Fig.17 A schematic diagram of a display device in yet another example provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the following is a further detailed description of the embodiments of the present invention through specific implementation methods combined with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0047] The present embodiment provides a conductive base for LED brackets and LED lamp beads, so that the LED brackets and lamp beads have simple structures, low costs, good heat dissipation performance, and simple and reliable welding. The conductive base includes at least two metal sheets arranged in an insulated manner, the metal sheets are combined with a colloid used to form a bracket shell to form an LED bracket, the upper surface of the metal sheet is located at the bottom of a bowl formed by the bracket shell to place the LED chip, and is at least partially exposed to the outside; the upper surface of at least one metal sheet is used to carry the LED chip, and the exposed area of ​​the upper surface of each metal sheet is used to electrically connect with the electrode of the corresponding LED chip; at least part of the lower surface of the metal sheet is exposed outside the bracket shell, and the lower surface is the surface opposite to the upper surface, at least part of the first side surface of at least one metal sheet located between the upper surface and the lower surface is exposed outside the bracket shell, and at least one metal sheet located between the upper surface and the lower surface The second side surface is not exposed outside the bracket shell, and the first side surface and the second side surface are two opposite side surfaces. That is, in this embodiment, the upper surface, the lower surface and the first side surface of the metal sheet can be arranged to be at least partially exposed outside the bracket shell, and the other surfaces are covered by the bracket shell, thereby increasing the bonding area between the bracket shell and the metal sheet and improving the bonding strength between the two, thereby improving the reliability of the LED bracket, and at the same time, the LED bracket can also have better airtightness, thereby improving the safety and reliability of the LED product.

[0048] Since the LED chip can be directly arranged on the upper surface of the metal sheet, and the lower surface and the first side surface of the metal sheet are exposed outside the bracket shell, the heat generated by the LED chip during operation can be directly transferred to the metal sheet and quickly dissipated outward through the metal sheet, which greatly shortens the heat dissipation path and increases the heat dissipation area, thereby greatly improving the heat dissipation effect and ensuring the performance of the LED lamp beads.

[0049] In this embodiment, the area of ​​the lower surface of the metal sheet exposed outside the bracket shell is provided with a first recess for accommodating solder, and the area of ​​the first side surface exposed outside the bracket shell is provided with a second recess for accommodating solder. The provision of the first recess and the second recess can increase the welding area, thereby increasing the welding strength; and the provision of the first recess and the second recess can accommodate excess solder in the welding process in the recess, thereby ensuring the flatness and reliability of welding.

[0050] Optionally, in this embodiment, in order to further improve the reliability of welding, a soldering layer for improving welding force can be provided on the metal sheet exposed outside the bracket housing and on the area where welding is required. The soldering layer can be a metal layer, such as a metal plating layer, or other layer structures that can improve welding force. For example, in some examples, a metal plating layer for improving welding force can be provided on at least one side wall of the first groove and the second groove in the above examples. The metal plating layer can be, but is not limited to, a silver plating layer.

[0051] In this embodiment, the LED bracket can be directly composed of at least two metal sheets that are insulated and isolated, and a colloid combined with the metal sheets to form a bracket shell. Compared with the structure of the existing LED bracket, the structure is greatly simplified, so the production process can be simplified, the production efficiency and yield rate can be improved, and the cost can be reduced.

[0052] It should be understood that the number of metal sheets included in an LED bracket in this embodiment can be flexibly set according to the specific application scenario. For example, only two insulated metal sheets can be set, and the bracket shell can only enclose a bowl body, and at least a part of the upper surface of the two insulated metal sheets is exposed at the bottom of the bowl body to carry the LED chip and complete the electrical connection with the electrodes of the LED chip, and the number of LED chips set in the bowl body and the luminous color of the LED chip can be flexibly set according to the needs. For example, it can be set to one, or it can be set to two or three, etc.

[0053] The LED chip in this embodiment can be a flip-chip LED chip, and the two electrodes of the flip-chip LED chip can directly cross over the exposed upper surfaces of two adjacent metal sheets, so as to realize the electrical connection while supporting the LED chip; the LED chip in this embodiment can also be a face-up LED chip, and a face-up LED chip can be set on the upper surface of any one of the metal sheets, or can be set across the upper surfaces of multiple metal sheets at the same time, and the two electrodes of the face-up LED chip are electrically connected to the exposed upper surfaces of the corresponding two metal sheets through leads.

[0054] In some application examples of this embodiment, the conductive base may include three metal sheets arranged in sequence, and the exposed areas on the upper surface of the metal sheet located in the middle are electrically connected to the electrodes corresponding to the two LED chips respectively; the exposed areas on the upper surfaces of the metal sheets located on both sides are electrically connected to the remaining electrodes corresponding to the two LED chips respectively, so as to realize the series connection of the two LED chips. In this example, the three metal sheets may also be located at the bottom of the same bowl. In some other application scenarios of this example, the bracket shell may also include a partition wall arranged on the upper surface of the metal sheet located in the middle to form two isolated bowls on the upper surfaces of the three metal sheets (the partition wall may also not be arranged and a large bowl is formed on the three metal sheets), so that the metal sheet located in the middle spans the bottom of the two isolated bowls, and the two metal sheets of the two are respectively located at the bottom of the two separated bowls. Which structure is used can be flexibly set according to the needs. In this application example, the number and color of LED chips set in a bowl, as well as whether to use a positive LED chip or a flip-chip LED chip, etc., can be flexibly set according to the needs. In some application scenarios of this application example, the first side surface and / or the lower surface of the metal sheet in the middle may not be exposed outside the bracket shell as required. When the first side surface and / or the lower surface of the metal sheet in the middle may be exposed outside the bracket shell as required, during welding, the first side surface and / or the lower surface of the metal sheet in the middle may be selectively welded, or the first side surface and / or the lower surface of the metal sheet in the middle may be selectively not welded, which may be flexibly selected according to the application scenario.

[0055] In this embodiment, the shape of the first recessed portion provided in the area where the lower surface of the metal sheet is exposed outside the bracket shell can be flexibly set, for example, it can be set to but not limited to a first recessed portion or a first hole, and the shape of the second recessed portion for accommodating solder provided in the area where the first side surface is exposed outside the bracket shell can also be flexibly set, for example, it can be set to but not limited to a second recessed portion being a second recessed portion or a second hole. For example, the first recessed portion can be set to a first recessed portion, the second recessed portion can be set to a second recessed portion or a second hole, or the first recessed portion can be set to a first hole, and the second recessed portion can be set to a second recessed portion or a second hole, and the specific configuration can be flexibly set according to the needs.

[0056] In this embodiment, the first concave portion provided on the lower surface of the metal sheet and the second concave portion provided on the first side surface may not be connected. For example, in the application scenario of side light emission, when the first side surface is placed on the welding surface provided with solder as the main mounting surface, the first side surface squeezes the solder on the welding surface, and a part of the solder will overflow along the first side surface. When heated and welded, the solder will gather toward the metal sheet due to the heat, so that the overflowed solder can be preferentially gathered into the first concave portion provided on the lower surface to complete the bonding with the lower surface, and the solder located under the first side surface is bonded with the first surface, thereby realizing the welding of the first side surface and the lower surface and improving the reliability of welding; at the same time, the setting of the first concave portion and the second concave portion can increase the welding area relative to the plane setting method, and the excess solder can be stored in the concave portion, which can further improve the stability of welding and improve the flatness of welding. In the application scenario of positive light emission, the process of welding when the lower surface of the metal sheet is placed on the welding surface provided with solder as the main mounting surface is similar to the welding process in the above-mentioned application scenario of side light emission, which will not be repeated here.

[0057] In this embodiment, the first concave portion provided on the lower surface of the metal sheet and the second concave portion provided on the first side surface can be arranged to communicate with each other. This communicating structure can form a better drainage for the liquid solder and can more reliably ensure that the excess solder is stored in the concave portion. In this embodiment, when the first concave portion and the second concave portion communicate with each other, the communication can be formed inside the metal sheet, or can be formed on the lower surface of the metal sheet and the outer surface of the first side surface, and the structure of the communicating portion between the two can be a groove, or a hole or other structure. For example, in the application scenario of side light, when the first side is placed on the welding surface provided with solder, the first side squeezes the solder on the welding surface. Since the first recess and the second recess are connected, a part of the solder squeezed to the second recess can flow directly into the first recess along the position where the two are connected. Therefore, it can be ensured as much as possible that there is solder in both the first recess and the second recess, thereby ensuring that both the lower surface and the first side are welded; when there is a part of solder that will overflow along the first side, during the heating process, the solder will gather toward the metal sheet due to the heat, and the overflowed solder can also be preferentially gathered into the first recess provided on the lower surface. It can be seen that the setting of the first recess and the second recess being connected can better realize the welding of the first side and the lower surface and improve the reliability of welding. In the application scenario of positive light, the process of welding when the lower surface of the metal sheet is placed on the welding surface provided with solder is similar to the welding process in the above-mentioned application scenario of side light, which will not be repeated here.

[0058] It should be understood that in this embodiment, when the first recess is set as the first recess or the first hole, and the second recess is set as the second recess or the second hole, the specific shapes and sizes of the first recess and the second recess, and the specific shapes and sizes of the second hole and the first hole can be flexibly set according to needs. For ease of understanding, this example is described below in conjunction with several specific setting examples of the accompanying drawings.

[0059] See also Figure 2 to Figure 3-2 A conductive base 1 and an LED bracket are shown, the conductive base 1 comprises a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated, the first metal sheet 11, at least a portion of the upper surface a of the first metal sheet 11 and the third metal sheet 13 are exposed at the bottom of the bowl, and the upper surface a of the second metal sheet 12 is also at least partially exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the first side surface c is a surface located between the upper surface a and the lower surface b. Figure 2 and Figure 3-2 As shown, in this example, the area where the first side surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the first side surface 22 of the bracket housing 2 is provided with a second recess c1 in the shape of a horseshoe groove. Optionally, the area where the first side surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the bracket housing 2 and the second recess is not provided is flush with the first side surface 22 of the bracket housing 2. The area where the lower surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket housing 2 is provided with a first recess b1 in the shape of a square hole. In this example, the first recess b1 is not connected to the second recess c1. Optionally, in this embodiment, the area where the lower surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket housing 2 and the second recess is not provided can also be flush with the lower surface 23 of the bracket housing 2. Figure 3-1 Reference numeral 21 is the upper surface of the bracket shell, and may be parallel to, but not limited to, the upper surface a of the metal sheet.

[0060] For example, see Figure 2-Figure 3-2 As shown, in this example, the left and right sides of the first metal sheet 11 and the third metal sheet 13 are provided with protrusions 3 protruding outward between the upper surface and the lower surface, and the shape and size of the protrusions 3 can be flexibly set. In some examples, the protrusions 3 can be set on only one of the left and right sides of the first metal sheet 11 and the third metal sheet 13, or the protrusions 3 can be flexibly set on at least one of the front, rear, left and right sides of the first metal sheet 11 and the third metal sheet 13 according to needs; the specific setting can be flexibly based on needs. See Figure 3-1 and Figure 3-2As shown, in this embodiment, after the LED bracket is formed, the protrusion 3 set on the metal sheet is embedded in the bracket shell, and at the bottom of the bowl, the colloid 20 constituting the bracket shell is flush with the upper surface a of the metal sheet. Figure 3-2 As shown, there is a colloid 20 between the upper surface a of the metal sheet and the side wall of the bracket housing, and the colloid 20 is arranged flush with the upper surface a. In this setting example, there is no restriction on the setting of the thickness of the side wall of the bracket housing. Under the condition of meeting the strength requirement of the LED bracket, the side wall can be set thinner, thereby reducing the size of the LED bracket as a whole, which is more conducive to its miniaturization. It should be understood that the second metal sheet 12 can be provided with a protrusion 3 in the manner of the first metal sheet 11 or the third metal sheet 13, or the protrusion 3 can be not provided, and it can be flexibly set according to the needs.

[0061] In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheet and the bracket housing, the side surface of the protrusion 3 of at least one metal sheet can be set as an inclined surface, and the inclination angle of the inclined surface can be flexibly set according to needs. For example, see Figure 3-3 As shown, the side surface 31 of the upper protrusion 3 of the first metal sheet 11 and the second metal sheet 13 is an inclined surface. After being combined with the bracket shell, the inclined surface can have a larger contact area with the bracket shell than the structure of the non-inclined surface, and can better withstand the pressure of the bracket shell on the metal sheet, thereby better improving the bonding force between the metal sheet and the bracket shell. Of course, the second metal sheet 12 can also be provided with a structure similar to the protrusion 3 on the first metal sheet 11 and the third metal sheet 13 according to needs.

[0062] See also Figures 4 to 5 Another conductive base 1 and LED bracket shown in the figure, the conductive base 1 also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. At least a portion of the upper surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and the upper surface a of the second metal sheet 12 is also at least partially exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the first side surface c is a surface located between the upper surface a and the lower surface b. Figure 4 and Figure 5As shown, in this example, the area where the first side surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the first side surface 22 of the bracket housing 2 is provided with a second recess c1 in the shape of a horseshoe groove. Optionally, the area where the first side surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the bracket housing 2 and the second recess is not provided is flush with the first side surface 22 of the bracket housing 2. The area where the lower surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket housing 2 is provided with a first recess b1 in the shape of a square hole. In this example, the first recess b1 is connected to the second recess c1. Optionally, in this embodiment, the area where the lower surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are exposed to the lower surface 23 of the bracket housing 2 and the second recess is not provided can also be flush with the lower surface 23 of the bracket housing 2.

[0063] See also Figure 6 to Figure 7 Another conductive base 1 and LED bracket shown in the figure, the conductive base 1 also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. At least a portion of the upper surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and the upper surface a of the second metal sheet 12 is also at least partially exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the first side surface c is a surface located between the upper surface a and the lower surface b. Figure 6 and Figure 7 As shown, in this example, the first side surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the first side surface 22 of the bracket housing 2 and is provided with a second recess c1 in the shape of a circular hole. Optionally, the first side surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the bracket housing 2 and the area without the second recess c1 is flush with the first side surface 22 of the bracket housing 2. The lower surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the lower surface 23 of the bracket housing 2 and is provided with a first recess b1 in the shape of a square hole. Optionally, in this embodiment, the lower surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the lower surface 23 of the bracket housing 2 and the area without the second recess is also flush with the lower surface 23 of the bracket housing 2. In this example, the first recess b1 and the second recess c1 are connected inside the metal sheet.

[0064] See also Figures 8 to 9Another conductive base 1 and LED bracket shown in the figure, the conductive base 1 also includes a first metal sheet 11, a second metal sheet 12 and a third metal sheet 13 which are sequentially insulated and isolated. At least a portion of the upper surface a of the first metal sheet 11, the first metal sheet 11 and the third metal sheet 13 is exposed at the bottom of the bowl, and the upper surface a of the second metal sheet 12 is also at least partially exposed at the bottom of the bowl. The lower surface b is a surface opposite to the upper surface, and the first side surface c is a surface located between the upper surface a and the lower surface b. Figure 8 and Fig. 9 As shown, in this example, the first side surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the first side surface 22 of the bracket housing 2 and is provided with a second recess c1 in the shape of a square groove. Optionally, the first side surface c of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the bracket housing 2 and the area without the second recess c1 is flush with the first side surface 22 of the bracket housing 2. The lower surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the lower surface 23 of the bracket housing 2 and is provided with a first recess b1 in the shape of a square groove. Optionally, in this embodiment, the lower surface b of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 is exposed to the lower surface 23 of the bracket housing 2 and the area without the second recess is also flush with the lower surface 23 of the bracket housing 2. In this example, the first recess b1 and the second recess c1 are connected on the outer surface of the metal sheet.

[0065] It should be understood that the shapes of the first recess and / or the second recess provided on each metal sheet in this embodiment may be the same, or may be at least partially different, and may be flexibly set according to the application scenario. Fig.10 As shown, the second recess c1 provided in the area where the first side c of the first metal sheet 11 is exposed to the bracket housing 2 is a circular hole, and the second recess c1 provided in the area where the first side c of the second metal sheet 12 and the third metal sheet 13 are exposed to the bracket housing 2 is a square groove. Similarly, the setting of the first recess b1 can also be flexibly set according to needs.

[0066] Optionally, in one example of this example, the lateral width of the upper end of at least one metal sheet close to the upper surface may be greater than the lateral width close to the first side surface, so that when the LED bracket is formed, a portion of the upper end of the conductive metal substrate is embedded in the colloid of the bracket shell, thereby improving the stability of the combination between the metal sheet and the bracket shell. Figure 6 In the conductive base shown, the lateral width W1 of the upper end of the third metal sheet 13 is greater than the lateral width W2 of the first side surface. Similarly, the lateral width W1 of the upper ends of the first metal sheet 11 and the second metal sheet 12 may also be greater than the lateral width W2 of the first side surface.

[0067] In some examples of this embodiment, in order to further improve the stability of the combination between the metal sheet and the bracket shell, the side surface of the upper end of at least one metal sheet can be set as an inclined surface, and the inclination angle of the inclined surface can be flexibly set according to the needs. For example, the side surfaces of the upper ends of the first metal sheet 11 and the second metal sheet 13 are inclined surfaces. After being combined with the bracket shell, the inclined surface can have a larger contact area with the bracket shell relative to the structure of the non-inclined surface, and can better withstand the pressure of the bracket shell on the metal sheet, thereby better improving the bonding force between the metal sheet and the bracket shell. Of course, the side surface of the upper end of the second metal sheet 12 can also be set as an inclined surface according to needs.

[0068] Of course, in some application examples, the lateral width of the upper end of the metal sheet near the upper surface and the lateral width of the lower end near the lower surface may be the same or substantially the same, and in this case, the bonding between the bracket housing and the metal sheet bonding area can be achieved through the bonding force between the bracket housing and the metal sheet bonding area. The specific setting can be flexibly made according to the needs.

[0069] Optionally, in order to further enhance the firmness of the bonding between the metal sheet and the bracket shell, a rough surface with a concave-convex structure for enhancing the bonding force with the bracket shell may be provided in the area on the upper surface of the metal sheet that is bonded to the bracket shell (of course, a rough surface with a concave-convex structure for enhancing the bonding force with the bracket shell may also be provided in other areas of the metal sheet that are in contact with the bracket shell), and / or a bonding hole for the colloid that forms the bracket shell to flow in.

[0070] Optionally, in this embodiment, the combining hole provided on the upper surface of the metal sheet may communicate with the first recess provided on the lower surface of the metal sheet, and may also communicate with the second recess provided on the first side surface.

[0071] Optionally, in this embodiment, the end of the combining hole close to the upper surface is the upper end, and the end close to the lower surface is the lower end. The hole diameter of the upper end of the combining hole is larger than the hole diameter of the lower end of the combining hole, that is, there is at least one level of raised surface between the upper end and the lower end of the combining hole, which can further increase the contact area between the combining hole and the colloid used to form the bracket shell, and further increase the bonding strength between the two.

[0072] For example, see the following example of a setup: Fig.11 As shown, the areas on the upper surfaces a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 for contacting with the bracket housing are provided with a rough surface a1 having a concave-convex structure. Fig.12As shown, a coupling hole a2 having a convex structure is provided in the area for contacting with the bracket housing on the upper surface a of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13. Of course, in other setting examples, a rough surface a1 having a concave-convex structure and a coupling hole a2 having a convex structure can also be provided in the area for contacting with the bracket housing on the upper surface a of at least one of the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13.

[0073] This embodiment also provides an LED lamp bead, including the LED bracket shown above, and also including an LED chip arranged in the bowl, the LED chip can be a normal LED chip or a flip-down LED chip, and a packaging layer arranged in the bowl to cover the LED chip, and the electrode of the LED chip is electrically connected to the exposed area on the upper surface of the corresponding metal sheet. The packaging layer in this embodiment can be a fluorescent glue layer, or a combination of a fluorescent glue layer and a transparent glue layer, or a quantum dot QD film, or a combination of a QD film and a transparent glue layer, or a combination of at least two of the fluorescent glue layer, the QD film and the transparent glue layer.

[0074] The LED lamp beads provided in this embodiment are made by using the above-mentioned LED bracket. For ease of understanding, several examples of lamp bead structures are described below.

[0075] See also Fig.13 As shown, the figure shows a transverse cross-sectional view of an LED lamp bead made by using the LED bracket in each of the above examples. It can be seen from the figure that the gaps between the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13 are filled with a colloid forming a bracket shell, and two isolated bowls are formed on the first metal sheet 11, the second metal sheet 12 and the third metal sheet 13, and each bowl is provided with an LED chip 4, and the LED chip is a flip-chip LED chip, and each flip-chip LED chip is arranged across two adjacent metal sheets, and the bowl is filled with a packaging layer 3.

[0076] See also Fig.14 As shown in the figure, it is a transverse cross-sectional view of another LED lamp bead made by using the LED bracket in the above examples. Fig.13 The difference between the lamp beads shown in the figure is that the LED chip 4 arranged in the bowl is a normal LED chip, and the two normal LED chips are arranged on the upper surface of the second metal sheet 12. Of course, it can also be adjusted so that the two normal LED chips are arranged on the upper surfaces of the first metal sheet 11 and the third metal sheet 13 respectively, or one normal LED chip is arranged on the upper surface of the first metal sheet 11, and the other is arranged on the upper surface of the second metal sheet 12, or one normal LED chip is arranged on the upper surface of the third metal sheet 13, and the other is arranged on the upper surface of the second metal sheet 12.

[0077] See also Fig.15 As shown, the LED lamp beads shown in this figure are Fig.13 The difference between the LED lamp beads shown in the figure is that the second metal sheet 12 is omitted. Of course, it should be understood that when more than three LED chips are required to be connected in series, Fig.11 On the basis shown in the figure, a fourth metal sheet, a fourth and fifth metal sheets, etc. are added in sequence, and the specific settings can be flexibly selected according to needs. However, it should be understood that these setting ideas are equivalent replacement settings made based on the structure provided in this embodiment, and are all within the scope of this embodiment.

[0078] The LED lamp beads shown in the above examples are composed of a conductive base and a bracket shell covering the conductive base. The structure is greatly simplified compared to existing light-emitting diodes and the cost is low.

[0079] The metal sheet can simultaneously support the LED chip and realize electrical connection with the LED chip, and can also be used as a pad to realize electrical connection with the outside, with high integration and simple structure;

[0080] Since the LED chip is directly placed on the upper surface of the metal sheet, and the lower surface and the first side surface of the metal sheet are exposed, the heat generated by the LED chip during operation can be directly transferred to the metal sheet and quickly dissipated outward through the metal sheet, thereby improving the performance of the LED lamp beads.

[0081] Since the lower surface and the first side surface of the metal sheet are exposed, both can be used as pads for external electrical connection. In the side light application scenario, the first side surface can be welded to the outside, or the first side surface and the lower surface can be welded at the same time; in the front light application scenario, the lower surface can be welded, or the lower surface and the first side surface can be welded at the same time, and the setting of the first concave part and the second concave part can further improve the reliability and convenience of welding. Therefore, it can be applied to various application scenarios, and welding is convenient. It can also be welded on both surfaces according to needs, which can improve the firmness of welding and thus improve the reliability of the product.

[0082] Optionally, in some examples of this embodiment, only the upper surface, lower surface and first side surface of the metal sheet may be exposed outside the wall, and the other surfaces may be covered by the bracket shell, thereby improving the reliability of the connection between the conductive metal plate and the wall.

[0083] In an application scenario of the present embodiment, the metal sheet may be, but is not limited to, a copper substrate, which has the advantages of low cost, easy processing, good electrical conductivity and thermal conductivity, etc.

[0084] Optionally, in some other application examples of this embodiment, a reflective layer for improving light extraction efficiency may be provided on the upper surface of the metal sheet at least in the exposed area, thereby improving the efficiency of the LED lamp beads. In this embodiment, the reflective layer may be, but is not limited to, a silver layer, and the silver layer may be formed on the copper substrate by, but is not limited to, electroplating, chemical silver plating, and the like.

[0085] It should be understood that the overall shape of the LED bracket in this embodiment can be a strip, a square, a hexagon, etc., and the overall shape of the LED bracket is not limited in this embodiment.

[0086] It should be understood that the metal sheet in this embodiment can be any metal plate that can achieve reliable conductive connection and has a support strength that meets the requirements of the LED bracket; since the metal plate has good heat dissipation performance, it can improve the heat dissipation performance of the LED bracket. Of course, it can also be replaced with other boards of other materials with conductive properties that can meet the above requirements. In this embodiment, the specific shape and size of the metal sheet can be flexibly set according to application requirements, and this embodiment does not limit it.

[0087] In this embodiment, the colloid material forming the bracket housing can also be flexibly selected according to needs, for example, it can be but not limited to thermosetting glue or hot-pressing glue, and can be but not limited to white glue with good reflective performance. For example, in one example, the colloid can be but not limited to epoxy or resin (such as epoxy glue, silicone, resin, etc.) materials.

[0088] This embodiment also provides a light-emitting unit module, which can be used for but not limited to various lighting scenes and / or display scenes, and includes a substrate and a plurality of LED lamp beads as described above, and the plurality of LED lamp beads are electrically connected to the substrate. The LED lamp beads in this embodiment can be front-emitting LED lamp beads or side-emitting LED lamp beads. For an example of a light-emitting unit module, please refer to Fig.16 As shown, the light emitting unit module 5 shown in the figure includes a substrate 52 and a plurality of the above-mentioned side-emitting LED lamp beads 51 arranged on the substrate 52 .

[0089] This embodiment also provides a display device, including the light-emitting unit module described above. The display device can be used for, but not limited to, various displays, mobile phones, PCs, advertising equipment, etc. Fig.17 As shown, it includes an outer frame 6, a film 701 assembled in the outer frame 6, a light guide plate 702, a reflective sheet 703 and a metal back plate 704, and a light emitting unit module 5 corresponding to the film 701, the light guide plate 702, the reflective sheet 703 and the metal back plate 704. It should be understood that Fig.17 What is shown is only an exemplary display device, and the specific structure of the display device can be flexibly arranged and will not be described in detail here.

[0090] The above contents are further detailed descriptions of the embodiments of the present invention in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A conductive base for an LED bracket, characterized in that: The conductive base includes at least two metal sheets arranged in an insulated manner, the metal sheets are combined with a colloid used to form a bracket shell to form an LED bracket, the upper surface of the metal sheet is located at the bottom of a bowl cup formed by the bracket shell for placing an LED chip, and is at least partially exposed to the outside; the upper surface of at least one of the metal sheets is used to carry the LED chip, and the exposed area of ​​the upper surface of each of the metal sheets is used to be electrically connected to the electrode of the corresponding LED chip; At least a portion of the lower surface of the metal sheet is exposed outside the bracket shell, the lower surface is a surface opposite to the upper surface, at least a portion of the first side surface of at least one metal sheet located between the upper surface and the lower surface is exposed outside the bracket shell, at least a portion of the second side surface of at least one metal sheet located between the upper surface and the lower surface is not exposed outside the bracket shell, the first side surface and the second side surface are two opposite side surfaces, the area of ​​the lower surface exposed outside the bracket shell is provided with a first recess for accommodating solder, the area of ​​the first side surface exposed outside the bracket shell is provided with a second recess with a horseshoe-shaped groove for accommodating solder, and the first recess and the second recess are not connected.

2. The conductive base of the LED bracket according to claim 1, characterized in that: The area on the upper surface of the metal sheet that is combined with the bracket shell is provided with a rough surface with a concave-convex structure for enhancing the bonding force with the bracket shell, and / or is provided with a bonding hole for the colloid forming the bracket shell to flow in.

3. The conductive base of the LED bracket according to claim 2, characterized in that: The combining hole communicates with the first recess.

4. The conductive base of the LED bracket according to claim 2, characterized in that: The end of the combining hole close to the upper surface is an upper end, and the end close to the lower surface is a lower end. The hole diameter of the upper end of the combining hole is larger than the hole diameter of the lower end of the combining hole.

5. The conductive base of the LED bracket according to claim 1, characterized in that: The conductive base includes three metal sheets arranged in sequence, and the exposed area on the upper surface of the middle metal sheet is electrically connected to the electrodes corresponding to the two LED chips respectively.

6. The conductive base of the LED bracket according to claim 1, characterized in that: The lateral width of the upper end of at least one of the metal sheets close to the upper surface is greater than the lateral width of the first side surface, and a portion of the upper end of the metal sheet is embedded in the bracket housing; and / or, At least one of the metal sheets is provided with a protrusion extending outward between the upper surface and the lower surface, and at least a portion of the protrusion is embedded in the bracket shell.

7. The conductive base of the LED bracket according to claim 1, characterized in that: The metal sheet is a copper substrate, and a reflective layer is provided on the upper surface at least in the exposed area.

8. An LED bracket, characterized in that it comprises the conductive base of the LED bracket according to any one of claims 1 to 7, and also comprises a colloid combined with the conductive base to form the bracket shell.

9. The LED bracket according to claim 8, characterized in that: The conductive base includes three metal sheets arranged in sequence, and the bracket shell also includes a separation wall arranged on the upper surface of the metal sheet located in the middle, so as to form two isolated bowls on the upper surfaces of the three metal sheets.

10. An LED lamp bead, characterized in that: It includes an LED bracket as described in claim 8 or 9, and also includes an LED chip arranged in the bowl cup, and a packaging layer arranged in the bowl cup to cover the LED chip, and the electrodes of the LED chip are electrically connected to the corresponding exposed areas on the upper surface of the metal sheet.

11. The LED lamp bead according to claim 10, characterized in that: The LED lamp bead is a side-emitting LED lamp bead, and the first side surface is a main mounting surface; Alternatively, the LED lamp bead is a positive light emitting LED lamp bead, and the lower surface is a main mounting surface.

12. A light emitting unit module, characterized in that: It comprises a substrate and a plurality of LED lamp beads as claimed in any one of claims 10 or 11, wherein the plurality of LED lamp beads are electrically connected to the substrate.

13. A display device, characterized in that: It comprises the light emitting unit module as claimed in claim 12.

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