An automatic parallel pressure head on a mobile phone display bonding device

Abstract

The present invention belongs to the technical field of mobile phone display manufacturing, and is particularly an automatic parallel pressure head on a mobile phone display bonding device, comprising a main body connector, a spherical center force point is provided in the main body connector, a heating tube is fixedly installed in the main body connector, a movable attachment clamp is movably installed in the main body connector, a force-bearing pressure head is fixedly installed at the bottom of the movable attachment clamp, and two sliding guide rods are symmetrically slidably installed on the main body connector, the sliding guide rods penetrate the main body connector, and the sliding guide rods are slidably connected to the movable attachment clamp. The present invention solves the problem that the expansion of the part material during heating of the traditional fixed pressure head affects the parallel accuracy of the pressure head, so that the gold particles of the ACF glue can be fully exploded, improving the product quality, and at the same time, the machine operator does not need to adjust the parallelism of the pressure head, reducing the consumption of human resources.

Description

Technical Field

[0001] The invention relates to the technical field of manufacturing mobile phone display screens, and in particular to an automatic parallel pressing head on mobile phone display screen bonding equipment. Background Art

[0002] The bonding head mechanism is widely used in the equipment for the bonding process of the mobile phone screen liquid crystal display module LCM (Liquid Display Module); that is, the assembly that assembles the liquid crystal display, drive circuit, FPC (Flexible Printed Circuit), backlight and other structural parts together. The mechanical connection and electrical conduction between the liquid crystal glass and the drive circuit and FPC in the liquid crystal display are the core parts of LCM production. The production process of liquid crystal glass and FPC is the FOG (Film On Glass) bonding process, that is, the FPC is mounted on the glass panel; and the process equipment in the FOG bonding process will use this head mechanism. The following is the basic process flow:

[0003] 1. ACF pre-lamination: paste ACF of specified length on the ITO end of the LCD glass or the pins of the FPC that need to be bonded;

[0004] 2. Pre-bonding: Use the auxiliary image system on the FOG bonding machine to align the pins of the FPC and the ITO end of the liquid crystal glass, and pre-press to form a preliminary connection;

[0005] 3. Main bonding: Under higher temperature and pressure, the pre-bonded LCM products are subjected to main bonding. The electrical connection between FPC and liquid crystal glass is achieved through the deformation of ACF conductive particles and the rupture of the insulating layer. At the same time, the two different materials, FPC and liquid crystal glass, are connected together through the polymerization and hardening of ACF glue at high temperature to provide sufficient mechanical connection strength.

[0006] The fully automatic COG bonding machine is mainly composed of three units: ACF (anisotropic conductive adhesive or anisotropic conductive film), pre-pressing and main pressing. The main pressing unit is also called the main pressing bonding device, which is used to complete the back-end process of the display screen, namely the main pressing stage. Specifically, the main function of the pressure head of the main pressing bonding device is to provide a movement in the Z-axis direction, so as to apply a force of about 150-300N on the buffer silicone tape, and then transfer it to the glass substrate and IC.

[0007] If you want to make the circuit between the IC and the glass substrate well connected, you need to adjust the pressure head and the screen support surface horizontally. The accuracy of the adjustment directly affects the product effect. Usually, the above-mentioned horizontal adjustment is achieved through a horizontal adjustment mechanism.

[0008] However, in the prior art, the horizontal adjustment mechanism requires the use of many components; and in this pressing stage, the required temperature of the pressure head is as high as 200-420 degrees, and the temperature of the heat insulation board rises sharply. This heat will be transferred to the parts on the upper part of the pressure head, such as the horizontal adjustment structure. The expansion coefficient of the metal material is unstable under the heating state and the influence of the ambient temperature. The parallelism of the mechanism cannot meet the stability requirements under the long-term upper and lower pressure forces, and there will be slight changes from time to time, which directly affects the product yield. The machine operator often has to adjust the parallelism of the mechanism, which wastes a lot of man-hours and directly affects the production capacity. At the same time, in the existing structure, in the LCM product process similar to FOG bonding, the anisotropic conductive glue gold particles are unstable in explosion, and the electronic pin circuit is poorly contacted, which not only reduces the electrical connection conduction strength between the FPC and the liquid crystal glass, but also causes the electrode pins of the FPC and the liquid crystal glass to produce induced open circuits due to the particle situation. Therefore, the existing LCM products bonded by the FOG process have serious quality risks. For this reason, an automatic parallel pressure head on a mobile phone display bonding device is proposed. Summary of the invention

[0009] The purpose of the present invention is to solve the shortcomings of the prior art and to propose an automatic parallel pressure head on a mobile phone display screen bonding device.

[0010] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: an automatic parallel pressure head on a mobile phone display screen bonding device, comprising a main body connecting part, a spherical central force point is provided in the main body connecting part, a heating tube is fixedly installed in the main body connecting part, a movable attached clamp is movably installed in the main body connecting part, a force-bearing pressure head is fixedly installed at the bottom of the movable attached clamp, two sliding guide rods are symmetrically and slidably installed on the main body connecting part, the sliding guide rods penetrate the main body connecting part, and the sliding guide rods are slidably connected to the movable attached clamp, a sliding sleeve on the sliding guide rod is provided with a spring, and a spring retaining ring is fixedly installed at one end of the sliding guide rod.

[0011] Preferably, a groove is provided at the bottom of the main connecting piece, and both sides of the groove are openings, and the inner wall of the groove is movably connected to the movable attachment clamp.

[0012] Preferably, one end of the spring is fixedly connected to the spring retaining ring, and the other end of the spring is fixedly connected to the main body connecting piece.

[0013] Preferably, the main connecting part and the pressure head are both made of tungsten steel.

[0014] Preferably, the spherical central force point is made of a high-strength steel ball.

[0015] Preferably, the spring constant is 10N / m-20N / m.

[0016] Compared with the prior art, the invention has the following beneficial effects: firstly, the device is matched with a main connecting piece, a spherical center force point, a heating pipe, a movable attachment clamp, a force-bearing pressure head, a sliding guide rod and a spring. The main connecting piece is made of tungsten steel and is subjected to vacuum heat treatment, so that the workpiece does not expand during heating. The spherical center force point plays an automatic parallel force-bearing role in the pressure head during the pressure of the bonding contact product. The heating pipe can heat the force-bearing pressure head. The force-bearing pressure head ensures the most ideal contact parallel surface of the gold particles of the bonding product. The movable attachment clamp is pulled down by the sliding guide rod and the spring attachment to limit the front and rear directions of the force-bearing pressure head, and at the same time, the left and right automatic parallel adjustment of the force-bearing pressure head can be achieved. In the bonding process, the force of the force-bearing pressure head is transmitted to the spherical center force point, so as to achieve the purpose of automatically adjusting the parallelism of the pressure head.

[0017] The invention solves the problem that the expansion of the part material during heating of the traditional fixed pressure head affects the parallel accuracy of the pressure head, so that the gold particles of the ACF glue can be fully exploded, the product quality is improved, and the machine operator does not need to adjust the parallelism of the pressure head, reducing the consumption of human resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front view structural stereoscopic schematic diagram of the present invention;

[0019] Figure 2 It is a three-dimensional schematic diagram of the rear structure of the present invention;

[0020] Figure 3 It is a schematic diagram of the self-parallel force bearing structure of the pressure head in the present invention;

[0021] Figure 4 It is a three-dimensional schematic diagram of the cross-sectional structure of the present invention;

[0022] Figure 5 for Figure 3 The cross-sectional structural diagram is shown.

[0023] In the figure: 1. Main connecting part; 2. Spherical center force point; 3. Heating tube; 4. Movable attachment clamp; 5. Force-bearing pressure head; 6. Sliding guide rod; 7. Spring; 8. Spring retaining ring. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0025] Please refer to Figure 1-5The present invention provides a technical solution: an automatic parallel pressure head on a mobile phone display screen bonding device, comprising a main body connector 1, a spherical central force point 2 is provided in the main body connector 1, a heating tube 3 is fixedly installed in the main body connector 1, a movable attachment clamp 4 is movably installed in the main body connector 1, a force pressure head 5 is fixedly installed at the bottom of the movable attachment clamp 4, two sliding guide rods 6 are symmetrically slidably installed on the main body connector 1, the sliding guide rod 6 passes through the main body connector 1, and the sliding guide rod 6 is slidably connected to the movable attachment clamp 4, a spring 7 is slidably sleeved on the sliding guide rod 6, and a spring retaining ring 8 is fixedly installed at one end of the sliding guide rod 6;

[0026] In this embodiment, a groove is provided at the bottom of the main connecting member 1, and both sides of the groove are open, the inner wall of the groove is movably connected to the movable attached clamp 4, one end of the spring 7 is fixedly connected to the spring retaining ring 8, and the other end of the spring 7 is fixedly connected to the main connecting member 1, the main connecting member 1 and the force-bearing pressure head 5 are both made of tungsten steel, the spherical center force point 2 is made of high-strength steel balls, and the stiffness coefficient of the spring 7 is 10N / m-20N / m. The device is matched by the main connecting member 1, the spherical center force point 2, the heating tube 3, the movable attached clamp 4, the force-bearing pressure head 5, the sliding guide rod 6 and the spring 7. The main connecting member 1 is made of tungsten steel and is vacuum heat treated to prevent the workpiece from expanding during heating. The spherical center force point 2 is in contact with the pressure head in the bonding contact production. The product is pressed and stressed and the stress is automatically parallelized. The heating tube 3 can heat the stressed pressure head 5. The stressed pressure head 5 ensures that the gold particles of the connected product are in the most ideal contact with the parallel surface. The movable clamp 4 is pulled down by the sliding guide rod 6 and the spring 7 to limit the front and rear directions of the stressed pressure head 5. At the same time, the stressed pressure head 5 can be automatically adjusted in parallel to the left and right. In the bonding process, the stressed pressure head 5 is subjected to stress and transmitted to the spherical center stress point 2 to achieve the purpose of automatically adjusting the parallelism of the pressure head. The present invention solves the problem that the expansion of the part material during heating of the traditional fixed pressure head affects the parallel accuracy of the pressure head, so that the gold particles of the ACF glue can be fully exploded, the product quality is improved, and the machine operator does not need to adjust the parallelism of the pressure head, reducing the consumption of human resources.

[0027] In this embodiment, the main connecting part 1 is made of tungsten steel and is vacuum heat treated so that the workpiece does not expand during heating. The spherical center force point 2 plays an automatic parallel force-bearing role in the pressure head being pressed in the bonding contact product. The heating tube 3 can heat the force-bearing pressure head 5. The force-bearing pressure head 5 ensures the most ideal contact parallel surface of the gold particles of the bonding product. The movable attached clamp 4 is pulled down by the sliding guide rod 6 and the spring 7 to limit the front and rear directions of the force-bearing pressure head 5, and at the same time can achieve the automatic parallel adjustment of the left and right sides of the force-bearing pressure head 5. In the bonding process, the force of the force-bearing pressure head 5 is transmitted to the spherical center force point 2 to achieve the purpose of automatically adjusting the parallelism of the pressure head.

[0028] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, and they should all fall within the protection scope of the present invention.

Claims

1. An automatic parallel pressure head for mobile phone display screen bonding equipment, comprising a main connecting part (1), characterized in that: The main connecting member (1) is provided with a spherical central force point (2), a heating tube (3) is fixedly installed in the main connecting member (1), a movable auxiliary clamp (4) is movably installed in the main connecting member (1), a force-bearing pressure head (5) is fixedly installed at the bottom of the movable auxiliary clamp (4), two sliding guide rods (6) are symmetrically slidably installed on the main connecting member (1), the sliding guide rods (6) penetrate the main connecting member (1), and the sliding guide rods (6) are slidably connected to the movable auxiliary clamp (4), and a spring (7) is provided on the sliding sleeve of the sliding guide rod (6). A spring retaining ring (8) is fixedly mounted on one end of the sliding guide rod (6); a groove is provided at the bottom of the main connecting member (1), and both sides of the groove are open; the inner wall of the groove is movably connected to the movable attachment clamp (4); one end of the spring (7) is fixedly connected to the spring retaining ring (8); the other end of the spring (7) is fixedly connected to the main connecting member (1); the main connecting member (1) and the force-bearing pressure head (5) are both made of tungsten steel; the spherical center force point (2) is made of a high-strength steel ball; and the spring coefficient of the spring (7) is 10N / m-20N / m.

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