Packaging film

Abstract

The present application relates to a packaging film, an organic electronic device including the same, and a method for manufacturing the organic electronic device using the same, and provides a packaging film that can form a structure that can block moisture or oxygen from the outside from being introduced into the organic electronic device, thereby effectively releasing heat accumulated in the organic electronic device, achieving durable reliability under harsh conditions of high temperature and high humidity, and preventing degradation of the organic electronic device.

Description

Technical Field

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority based on Korean Patent Application No. 10-2018-0065023, filed on June 5, 2018, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0004] The present invention relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same. Background Art

[0005] An organic electronic device (OED) means a device including an organic material layer that generates alternating current of charges using holes and electrons, and examples thereof may include photovoltaic devices, rectifiers, emitters, organic light emitting diodes (OLEDs), and the like.

[0006] Among these organic electronic devices, organic light-emitting diodes (OLEDs) have lower power consumption and faster response speeds than existing light sources, and are advantageous for thinning display devices or lighting equipment. Furthermore, OLEDs have space availability and are therefore expected to be used in a variety of fields, including various portable devices, monitors, notebook computers, and televisions.

[0007] Durability is a crucial issue in the commercialization and expansion of OLED applications. The organic materials and metal electrodes contained in OLEDs can be easily oxidized by external factors, such as moisture. If the heat generated when driving the OLED panel cannot be dissipated smoothly, component degradation due to increased temperature can become a problem. Therefore, various methods have been proposed that can effectively block the penetration of external oxygen and moisture into organic electronic devices, such as OLEDs, while simultaneously effectively dissipating the heat generated by the OLEDs. Summary of the Invention

[0008] Technical issues

[0009] The present application provides an encapsulation film that can form a structure that can block moisture or oxygen from the outside from being introduced into an organic electronic device, thereby effectively releasing heat accumulated in the organic electronic device and maintaining heat resistance durability under harsh conditions such as high temperature and high humidity.

[0010] Technical Solution

[0011] The present application relates to an encapsulation film, which can be applied to an encapsulation layer or to encapsulate an organic electronic device such as an OLED.

[0012] In this specification, the term "organic electronic device" means a product or device having a structure including an organic material layer between a pair of electrodes facing each other, which generates an alternating current using holes and electrons to generate electric charges, and examples thereof may include, but are not limited to, photovoltaic devices, rectifiers, emitters, and organic light-emitting diodes (OLEDs). In one example of the present application, the organic electronic device may be an OLED.

[0013] The exemplary encapsulation film 10 for an organic electronic element includes an encapsulation layer 11 for encapsulating an organic electronic element, and at least two metal layers (a second layer 12 and a first layer 13), such as Figure 1 As shown. The metal layer may be present on the encapsulation layer, but is not limited thereto. The thermal conductivity of at least one of the metal layers may be 50W / m·K to 800W / m·K. The thermal conductivity of at least one of the metal layers may be in the range of 80W / m·K to 800W / m·K. Here, the encapsulation layer may encapsulate the entire surface of the organic electronic element formed on the substrate. By providing an encapsulation film of the above structure, in addition to the moisture blocking properties, the present application can effectively release the heat accumulated in the organic electronic element, can maintain heat resistance and durability under harsh conditions such as high temperature and high humidity, and can prevent residual images (aging) caused by degradation occurring in the organic electronic device. In addition, the encapsulation film of the present application includes two or more metal layers, thereby being able to replace the back cover or inner plate originally included in the organic electronic device (organic electronic device without a back cover or inner plate), and therefore, the encapsulation film can be set at the outermost part of the organic electronic device. That is, the present application can provide a thin organic electronic device without a back cover or inner plate.

[0014] In one embodiment, the metal layer and the encapsulation layer in the encapsulation film of the present application are integrally provided. Conventionally, the encapsulation layer is applied to the organic electronic component first, and then the metal layer is applied separately. However, in the present application, an encapsulation film integrally comprising the metal layer and the encapsulation layer can be applied to the organic electronic component. The integral encapsulation film facilitates processing and minimizes alignment errors in the multilayer structure, thereby achieving a highly reliable encapsulation structure with, for example, dimensional stability.

[0015] As described above, an exemplary packaging film may include at least two metal layers. The metal layer may also include, for example, a first layer having a thermal conductivity of 50 W / m·K to 800 W / m·K, and a second layer having a linear expansion coefficient of 20 ppm / °C or less. The second layer may have a lower thermal conductivity than that of the first layer, and the first layer may have a higher linear expansion coefficient than that of the second layer, but is not limited thereto. Since the packaging film includes at least two or more metal layers, the present application can achieve durable reliability at high temperatures and heat dissipation effects. In one embodiment of the present application, the second layer may be laminated to face the packaging layer, and for example, the packaging layer 11, the second layer 12, and the first layer 13 may be laminated in this order.

[0016] In one embodiment of the present application, the thermal conductivity of the first layer of the metal layer may be 50 W / m·K or greater, 80 W / m·K or greater, 90 W / m·K or greater, 100 W / m·K or greater, 110 W / m·K or greater, 120 W / m·K or greater, 130 W / m·K or greater, 140 W / m·K or greater, 150 W / m·K or greater, 200 W / m·K or greater, or 210 W / m·K or greater. The upper limit of the thermal conductivity is not particularly limited, and it may be 800 W / m·K or less or 700 W / m·K or less. As described above, at least one metal layer has a high thermal conductivity, so that the heat generated at the bonding interface during the metal layer bonding process can be released more quickly. In addition, the high thermal conductivity allows the heat accumulated during the operation of the organic electronic device to be released quickly, so that the temperature of the organic electronic device itself can be kept low and the occurrence of cracks and defects can be reduced. Thermal conductivity can be measured at any temperature in the range of 0°C to 30°C.

[0017] In this specification, the term "thermal conductivity" refers to the degree to which a material can transfer heat by conduction, where the unit can be expressed as W / m·K. The unit represents the degree to which a material transfers heat at the same temperature and distance, and refers to the unit of heat (Watt) to the unit of distance (meter) and the unit of temperature (Kelvin). In this specification, thermal conductivity may refer to thermal conductivity measured according to ISO 22007-2.

[0018] In one example, the encapsulation film of the present application may include not only a first layer having the above-mentioned thermal conductivity range, but also a second layer having a low thermal conductivity relative to the first layer. By including at least two metal layers as above, the present application can achieve the physical properties and thermal conductivity required when applied to the encapsulation of organic electronic components. For example, the linear expansion coefficient of the second layer can be in the range of 20ppm / ℃ or less, 18ppm / ℃ or less, 15ppm / ℃ or less, 13ppm / ℃ or less, 9ppm / ℃ or less, 5ppm / ℃ or less, or 3ppm / ℃ or less. The lower limit of the linear expansion coefficient is not particularly limited, but can be 0ppm / ℃ or greater, or 0.1ppm / ℃ or greater. By controlling the linear expansion coefficient of the second layer, the present application can achieve dimensional stability and durable reliability of the film in a panel driven at high temperatures. The linear expansion coefficient can be measured according to the standards of ASTM E831, ASTM D696 or ISO 11359.

[0019] In one embodiment of the present application, the thickness ratio of the first layer to the second layer in the encapsulation film may be in the range of 1.0 to 40. The lower limit of the thickness ratio is not particularly limited, but may be 1.1, 1.3, 1.5, 1.8, 2.3, 2.8, 3.3, 3.8, 4.3, 4.8, 5.2, 5.8, 6.3, 6.8, 7.0, 7.1, 7.2, 7.3, 7.4, or 7.5. In addition, the upper limit of the thickness ratio is not particularly limited, but may be 39, 38, 37.5, 35, 32, 30, 28, 25, 23, 20, 18, 15, 13, 10, 9, 8, or 7.8. In addition, in one embodiment of the present application, the thickness of the first layer may be in the range of 2 μm to 3,500 μm. The lower limit of the thickness of the first layer may be 4 μm, 6 μm, 10 μm, 25 μm, 35 μm, 45 μm, 100 μm, 500 μm, 1,000 μm, 1,500 μm, 2,000 μm, 2,500 μm, or 2,800 μm. The upper limit of the thickness of the first layer may be 3,300 μm, 3,100 μm, 2,900 μm, 2,600 μm, 2,100 μm, 1,800 μm, 1,200 μm, 800 μm, 400 μm, or 90 μm. Furthermore, the thickness of the second layer may be in the range of 10 μm to 2,500 μm. The lower limit of the thickness of the second layer may be 18 μm, 25 μm, 33 μm, 43 μm, 50 μm, 70 μm, 100 μm, 500 μm, 1,000 μm, 1,500 μm or 2,000 μm, and the upper limit of the thickness of the second layer may be 2,300 μm, 1,800 μm, 1,300 μm, 800 μm, 400 μm or 90 μm. By adjusting the thickness ratio of the two layers, the present application can effectively release heat accumulated in the organic electronic device in a film applied to the encapsulation of the organic electronic element, while maintaining thermal durability and dimensional stability under harsh conditions such as high temperature and high humidity.

[0020] In one embodiment of the present application, the metal layer of the encapsulation film may be transparent or may be opaque. The total thickness of the metal layer of the multilayer structure may be in the range of 3 μm to 6,000 μm, 10 μm to 5,500 μm, 20 μm to 5,000 μm, 30 μm to 4,500 μm or 40 μm to 4,300 μm. By controlling the thickness of the metal layer, the present application can provide an organic electronic device as a thin film while fully realizing the heat dissipation effect. The metal layer may be a thin metal foil or a polymer base layer deposited with a metal. The metal layer is not particularly limited as long as it meets the above-mentioned thermal conductivity or linear expansion coefficient and is a material comprising metal. The metal layer may include any one of a metal, a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, a metal boron oxide and a combination thereof. For example, the metal layer may include an alloy in which one or more metal elements or non-metallic elements are added to a metal, and may include, for example, Invar or stainless steel (SUS). In addition, in one example, the metal layer can include iron, chromium, copper, aluminum, nickel, iron oxide, chromium oxide, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide and combinations thereof. The metal layer can be deposited by the following methods: electrolysis, rolling, thermal evaporation, electron beam evaporation, sputtering, reactive sputtering, chemical vapor deposition, plasma chemical vapor deposition or electron cyclotron resonance source plasma chemical vapor deposition. In one example of the present application, the metal layer can be deposited by reactive sputtering.

[0021] In one embodiment of the present application, two or more metal layers constituting the encapsulation film may be attached by a pressure-sensitive adhesive or adhesive. The two or more metal layers may be laminated via a pressure-sensitive adhesive or adhesive, wherein the material of the pressure-sensitive adhesive or adhesive is not particularly limited, and known materials may be used. In one example, the pressure-sensitive adhesive or adhesive may be an acrylic, epoxy-based, urethane-based, silicone-based, or rubber-based pressure-sensitive adhesive or adhesive. In addition, in one embodiment, the material of the pressure-sensitive adhesive or adhesive may be the same as or different from the material of the encapsulation layer described below.

[0022] In addition, the two or more metal layers constituting the encapsulation film may be directly attached to each other. The meaning of direct attachment herein may mean that the two layers are in contact with each other and attached without any other layer between the two layers. As a method for directly attaching two or more metal layers, methods known in the art may be used. In one example, the two metal layers of the present application may be laminated by a method of directly welding, rolling, casting or extruding one of the two metal layers to the other layer, etc. In addition, the present application is not limited to the above, and a method of depositing the material of another metal layer on one layer of the metal layer is also possible.

[0023] In one embodiment of the present application, the encapsulation layer may be formed as a single layer or two or more layers, and when the encapsulation layer is two or more layers, at least one metal layer may be present between the two or more encapsulation layers. For example, the above-mentioned first layer may be present between the two or more encapsulation layers, wherein the encapsulation film may have a lamination sequence of the second layer, the encapsulation layer, the first layer, and the encapsulation layer. In another example, when two or more first layers are included, it may also have a lamination sequence of the first layer, the second layer, the encapsulation layer, the first layer, and the encapsulation layer.

[0024] In one embodiment, at least one of the metal layers may be magnetic. Since at least one of the metal layers is magnetic, the metal layer can be processed by magnetic force, thereby further improving the processing efficiency. In the present application, the second layer of the metal layer may be magnetic, but is not limited thereto.

[0025] As mentioned above, in one embodiment of the present application, the encapsulation layer can have a single layer or a multilayer structure of two or more. When two or more layers constitute the encapsulation layer, the composition of each layer in the encapsulation layer can be the same or different. In an example, the encapsulation layer can be a pressure-sensitive adhesive layer or an adhesive layer comprising a pressure-sensitive adhesive composition or an adhesive composition.

[0026] In one embodiment of the present invention, the encapsulation layer may comprise an encapsulation resin. The encapsulation resin may comprise a cross-linkable resin or a curable resin.

[0027] In one example, the glass transition temperature of the encapsulating resin may be less than 0° C., less than -10° C., less than -30° C., less than -50° C., or less than -60° C. Here, the glass transition temperature may be the glass transition temperature after curing, and in one embodiment, it may mean the glass transition temperature after curing with a heat release of about 1 J / cm 2 The glass transition temperature of the encapsulating resin after irradiation with ultraviolet rays at an irradiation level of 1000 nm or greater; or the glass transition temperature after ultraviolet irradiation and further thermal curing.

[0028] In one example, the encapsulating resin may include styrene resin or elastomer, polyolefin resin or elastomer, other elastomers, polyoxyalkylene resin or elastomer, polyester resin or elastomer, polyvinyl chloride resin or elastomer, polycarbonate resin or elastomer, polyphenylene sulfide resin or elastomer, a mixture of hydrocarbons, polyamide resin or elastomer, acrylate resin or elastomer, epoxy resin or elastomer, silicone resin or elastomer, fluororesin or elastomer, or a mixture thereof, etc.

[0029] Here, examples of styrene resins or elastomers include styrene-ethylene-butadiene-styrene block copolymers (SEBS), styrene-isoprene-styrene block copolymers (SIS), acrylonitrile-butadiene-styrene block copolymers (ABS), acrylonitrile-styrene-acrylate block copolymers (ASA), styrene-butadiene-styrene block copolymers (SBS), styrene homopolymers, or mixtures thereof. Examples of olefin resins or elastomers include high-density polyethylene resins or elastomers, low-density polyethylene resins or elastomers, polypropylene resins or elastomers, or mixtures thereof. Examples of elastomers include ester thermoplastic elastomers, olefin elastomers, silicone elastomers, acrylic elastomers, or mixtures thereof. In particular, examples of olefin thermoplastic elastomers include polybutadiene resins or elastomers, or polyisobutylene resins or elastomers, and the like. Examples of polyoxyalkylene resins or elastomers include polyoxymethylene resins or elastomers, polyethylene oxide resins or elastomers, or mixtures thereof. Examples of polyester resins or elastomers include polyethylene terephthalate resins or elastomers, polybutylene terephthalate resins or elastomers, or mixtures thereof. Examples of polyvinyl chloride resins or elastomers include polyvinylidene chloride. Examples of hydrocarbon mixtures include hexatriacotane and paraffin. Examples of polyamide resins or elastomers include nylon. Examples of acrylate resins or elastomers include polybutyl (meth)acrylate. Examples of epoxy resins or elastomers include bisphenol types such as bisphenol A, bisphenol F, bisphenol S, and hydrogenated products thereof; novolac types such as phenol novolac or cresol novolac; nitrogen-containing cyclic types such as triglycidyl isocyanurate or hydantoin; alicyclic types; aliphatic types; aromatic types such as naphthalene and biphenyl; glycidyl types such as glycidyl ether, glycidylamine, and glycidyl ester; dicyclic types such as dicyclopentadiene; ester types; ether ester types; or mixtures thereof. Examples of silicone resins or elastomers include polydimethylsiloxane. Examples of fluororesins or elastomers include polytrifluoroethylene resins or elastomers, polytetrafluoroethylene resins or elastomers, polychlorotrifluoroethylene resins or elastomers, polyhexafluoropropylene resins or elastomers, polyvinylidene fluoride, polyvinyl fluoride, polyethylene fluoride, or mixtures thereof.

[0030] The resins or elastomers listed above can also be used in the following ways: for example, by grafting with maleic anhydride, copolymerizing with other resins or elastomers by monomers used to make the resins or elastomers, and modifying with other compounds. Examples of the above other compounds can include carboxyl-terminated butadiene-acrylonitrile copolymers, etc.

[0031] In one example, the encapsulation layer may include, but is not limited to, olefin elastomers, silicone elastomers, acrylic elastomers, or the like as the encapsulation resin.

[0032] In one embodiment of the present invention, the encapsulating resin may be an olefin-based resin. In one example, the olefin-based resin may be a homopolymer of a butene monomer; a copolymer obtained by copolymerizing a butene monomer with another polymerizable monomer; a reactive oligomer using a butene monomer; or a mixture thereof. The butene monomer may include, for example, 1-butene, 2-butene, or isobutylene.

[0033] Other monomers polymerizable with the butene monomer or derivative may include, for example, isoprene, styrene, or butadiene, etc. By using the copolymer, physical properties such as processability and crosslinking degree can be maintained, and thus heat resistance of the adhesive itself can be ensured when applied to an organic electronic device.

[0034] In addition, the reactive oligomer using butene monomer can include butene polymers with reactive functional groups. The weight average molecular weight range of the oligomer can be 500 to 5000. In addition, butene polymers can be combined with other polymers with reactive functional groups. Other polymers can be but are not limited to (meth) alkyl acrylates. The reactive functional groups can be hydroxyl, carboxyl, isocyanate or nitrogen-containing groups. In addition, reactive oligomers and other polymers can be cross-linked by a multifunctional cross-linking agent, and the multifunctional cross-linking agent can be at least one selected from isocyanate cross-linking agents, epoxy cross-linking agents, aziridine cross-linking agents and metal chelate cross-linking agents.

[0035] In one embodiment, the encapsulating resin of the present application may be a copolymer of a diene and an olefin compound containing a carbon-carbon double bond. Here, the olefin compound may include butene, etc., and the diene may be a monomer capable of polymerizing with the olefin compound, such as isoprene or butadiene. For example, the copolymer of an olefin compound containing a carbon-carbon double bond and a diene may be butyl rubber.

[0036] In the encapsulation layer, the weight average molecular weight (Mw) of the resin or elastomer component can reach such an extent that the pressure-sensitive adhesive composition can be formed into a film shape. That is, even if it is in an uncured state at room temperature, the encapsulation layer can be a solid phase or a semi-solid phase. In this specification, room temperature can mean, for example, 15°C to 35°C or about 25°C. In one example, the weight average molecular weight of the resin or elastomer can be about 100,000 to 2,000,000, 120,000 to 1,500,000 or 150,000 to 1,000,000. The term weight average molecular weight herein means the value converted to standard polystyrene measured by GPC (gel permeation chromatography). However, the resin or elastomer does not necessarily have the above-mentioned weight average molecular weight. For example, when the molecular weight of the resin or elastomer component is not at a level sufficient to form a film, a separate binder resin can be blended into the pressure-sensitive adhesive composition.

[0037] In another embodiment, the encapsulation resin according to the present application is a curable resin, which may be, for example, a resin having a glass transition temperature of 85°C or higher after curing. The glass transition temperature may be the glass transition temperature after the encapsulation resin is photocured or thermally cured. The specific type of curable resin usable in the present invention is not particularly limited, and for example, various thermosetting resins or photocurable resins known in the art may be used. The term "thermosetting resin" means a resin that can be cured by appropriate heat application or aging process, and the term "photocurable resin" means a resin that can be cured by irradiation with electromagnetic waves. In addition, the curable resin may be a dual-cure resin including both thermal curing properties and photocuring properties.

[0038] The specific type of curable resin in the present application is not particularly limited, as long as it has the above-mentioned characteristics. For example, the curable resin can be cured to exhibit adhesive properties, which may include such a resin: the resin contains one or more thermosetting functional groups (such as glycidyl, isocyanate, hydroxyl, carboxyl or amide) or contains one or more functional groups that can be cured by irradiation with electromagnetic waves (such as epoxy, cyclic ether, sulfide, acetal or lactone). Specific examples of such resins may include acrylic resins, polyester resins, isocyanate resins or epoxy resins, but are not limited thereto.

[0039] In the present application, as a curable resin, an aromatic or aliphatic; or a linear or branched epoxy resin can be used. In one embodiment of the present invention, an epoxy resin having an epoxy equivalent of 180 g / equivalent to 1,000 g / equivalent containing two or more functional groups can be used. By using an epoxy resin having an epoxy equivalent within the above range, the properties of the cured product, such as adhesion and glass transition temperature, can be effectively maintained. Examples of such epoxy resins can include one or a mixture of two or more of the following: cresol novolac epoxy resin, bisphenol A type epoxy resin, bisphenol A type novolac epoxy resin, phenol novolac epoxy resin, tetrafunctional epoxy resin, biphenyl type epoxy resin, trisphenol methane type epoxy resin, alkyl-modified trisphenol methane epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin or dicyclopentadiene modified phenol type epoxy resin.

[0040] In the present application, as curable resin, the epoxy resin comprising cyclic structure in molecular structure can be used, and the epoxy resin comprising aromatic group (for example, phenyl) can be used.When epoxy resin includes aromatic group, cured product has excellent thermal stability and chemical stability, and shows low moisture absorption simultaneously, thus can improve the reliability of organic electronic device packaging structure.The specific example of the epoxy resin containing aromatic group that can be used in the present invention can be one or both or more of the following mixtures: biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene modified phenol type epoxy resin, based on cresol epoxy resin, based on bisphenol epoxy resin, based on xylene epoxy resin, multifunctional epoxy resin, phenol novolac epoxy resin, trisphenol methane type epoxy resin and alkyl modified trisphenol methane epoxy resin etc., but is not limited to this.

[0041] Furthermore, the encapsulation layer of the present application may include an active energy ray-polymerizable compound that is highly compatible with the encapsulation resin and can form a specific cross-linked structure together with the encapsulation resin.

[0042] For example, depending on the type of encapsulation resin, the encapsulation layer of the present application may contain a multifunctional active energy ray-polymerizable compound that can be polymerized together with the encapsulation resin by irradiation with active energy rays. The active energy ray-polymerizable compound may refer to a compound that contains two or more functional groups that can participate in a polymerization reaction by irradiation with active energy rays, for example, a functional group containing an ethylenically unsaturated double bond (e.g., an acryloyl group or a methacryloyl group) or a functional group such as an epoxy group or an oxetane group.

[0043] As the multifunctional active energy ray-polymerizable compound, for example, multifunctional acrylate (MFA) can be used.

[0044] In addition, the active energy ray-polymerizable compound may be included in an amount of 3 to 30 parts by weight, 5 to 30 parts by weight, 5 to 25 parts by weight, 8 to 20 parts by weight, 10 to 18 parts by weight, or 12 to 18 parts by weight relative to 100 parts by weight of the encapsulating resin. Within the above range, the present application provides an encapsulating film having excellent durability and reliability even under harsh conditions such as high temperature and high humidity.

[0045] A multifunctional active energy ray-polymerizable compound that can be polymerized by irradiation with active energy rays can be used without any limitation. For example, the compound may include 1,4-butanediol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, dicyclopentyl di(meth)acrylate, cyclohexane-1,4-diol di(meth)acrylate, tricyclodecane dimethanol (meth)diacrylate, dimethylol dicyclopentane di(meth)acrylate, neopentyl glycol-modified trimethylolpropane di(meth)acrylate, adamantane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, or a mixture thereof.

[0046] As a polyfunctional active energy ray polymerizable compound, for example, a compound having a molecular weight of less than 1,000 and containing two or more functional groups can be used. In this case, the molecular weight may refer to the weight average molecular weight or the typical molecular weight. The ring structure contained in the polyfunctional active energy ray polymerizable compound may be a carbocyclic structure or a heterocyclic structure; or a monocyclic structure or a polycyclic structure.

[0047] In one embodiment of the present application, the encapsulation layer may further include a free radical initiator. The free radical initiator may be a photoinitiator or a thermal initiator. The specific type of photoinitiator may be appropriately selected taking into account the curing rate and the possibility of yellowing. For example, a benzoin-based photoinitiator, a hydroxyketone-based photoinitiator, an aminoketone-based photoinitiator, or a phosphine oxide-based photoinitiator may be used, and specifically, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propane-1-one, 4-(2- benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyl dimethyl ketal, acetophenone dimethyl ketal, p-dimethylaminobenzoate, oligo[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone] and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, etc.

[0048] The free radical initiator may be included in an amount of 0.2 to 20 parts by weight, 0.5 to 18 parts by weight, 1 to 15 parts by weight, or 2 to 13 parts by weight relative to 100 parts by weight of the active energy ray-polymerizable compound. Thus, the reaction of the active energy ray-polymerizable compound can be effectively induced, and degradation of the physical properties of the encapsulation layer composition due to residual components after curing can be prevented.

[0049] In one embodiment of the present application, depending on the type of resin component contained in the encapsulation layer of the encapsulation film, the encapsulation layer may further include a curing agent. For example, it may further include a curing agent capable of reacting with the encapsulation resin to form a cross-linked structure. In this specification, the term encapsulation resin may be used in the same meaning as the resin component.

[0050] The kind of the curing agent may be appropriately selected and used according to the type of the resin component or the type of the functional group contained in the resin.

[0051] In one example, when the resin component is an epoxy resin, the curing agent is a curing agent for epoxy resin known in the art, and for example, one or two or more of the following can be used: an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent or an acid anhydride curing agent, etc., but is not limited thereto.

[0052] In one example, as the curing agent, an imidazole compound that is solid at room temperature and has a melting point or decomposition temperature of 80° C. or higher can be used. Examples of such compounds include, but are not limited to, 2-methylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 1-cyanoethyl-2-phenylimidazole.

[0053] The content of the curing agent can be selected according to the composition of the composition (e.g., the type or ratio of the encapsulating resin). For example, the curing agent can be included in an amount of 1 to 20 parts by weight, 1 to 10 parts by weight, or 1 to 5 parts by weight relative to 100 parts by weight of the resin component. However, the weight ratio can be changed according to the type and ratio of the encapsulating resin or the functional groups of the resin, or the crosslinking density to be achieved, etc.

[0054] When the resin component is a resin that can be cured by irradiation with active energy rays, for example, a cationic photopolymerization initiator can be used as the initiator.

[0055] As the cationic photopolymerization initiator, As an ionized cationic initiator of salt or organic metal salt series, or a non-ionized cationic photopolymerization initiator of organosilane or latent sulfonic acid series. Salt series initiators include diaryl iodide Salt, triaryl As the initiator of the organic metal salt series, there may be exemplified iron arenes, as the initiator of the organic silane series, there may be exemplified o-nitrobenzyl triarylsilyl ether, triarylsilyl peroxide or acylsilane, and as the initiator of the latent sulfonic acid series, there may be exemplified α-sulfonyloxy ketone or α-hydroxymethyl benzoin sulfonate, but are not limited thereto.

[0056] In one example, as the cationic initiator, an ionizing cationic photopolymerization initiator may be used.

[0057] In one example, the encapsulation layer may further include a tackifier, wherein the tackifier may preferably be a hydrogenated cyclic olefin polymer. As the tackifier, for example, a hydrogenated petroleum resin obtained by hydrogenating a petroleum resin may be used. The hydrogenated petroleum resin may be partially or fully hydrogenated, and may also be a mixture of such resins. Such a tackifier may be selected to have good compatibility with the pressure-sensitive adhesive composition, excellent moisture barrier properties, and low organic volatile components. Specific examples of hydrogenated petroleum resins may include hydrogenated terpene resins, hydrogenated ester resins, or hydrogenated dicyclopentadiene resins. The weight-average molecular weight of the tackifier may be approximately 200 to 5,000. The content of the tackifier may be appropriately adjusted as needed. For example, the content of the tackifier may be selected taking into account the gel content described below, and according to one example, the tackifier may be included in a ratio of 5 to 100 parts by weight, 8 to 95 parts by weight, 10 to 93 parts by weight, or 15 to 90 parts by weight relative to 100 parts by weight of the resin component.

[0058] As described above, the encapsulation layer may further include a moisture adsorbent. In this specification, the term "moisture adsorbent" may mean a chemically reactive adsorbent capable of removing moisture or humidity, for example, by chemically reacting with moisture or humidity that has penetrated the encapsulation film, as described below.

[0059] For example, the moisture adsorbent may be present in the encapsulation layer or the encapsulation film in a uniformly dispersed state. Here, the uniformly dispersed state may mean a state in which the moisture adsorbent is present at the same or substantially the same density even in any part of the encapsulation layer or the encapsulation film. The moisture adsorbents that can be used above may include, for example, metal oxides, sulfates or organic metal oxides, etc. Specifically, examples of sulfates may include magnesium sulfate, sodium sulfate or nickel sulfate, etc., and examples of organic metal oxides may include aluminum oxide octanoate, etc. Here, specific examples of metal oxides may include: phosphorus pentoxide (P2O5), lithium oxide (Li2O), sodium oxide (Na2O), barium oxide (BaO), calcium oxide (CaO) or magnesium oxide (MgO), etc., and examples of metal salts may include: sulfates, such as lithium sulfate (Li2SO4), sodium sulfate (Na2SO4), calcium sulfate (CaSO4), magnesium sulfate (MgSO4), cobalt sulfate (CoSO4), gallium sulfate (Ga2(SO4)3), titanium sulfate (Ti(SO4)2) or nickel sulfate (NiSO4); metal halides, such as calcium chloride (CaCl 2), magnesium chloride (MgCl2), strontium chloride (SrCl2), yttrium chloride (YCl3), copper chloride (CuCl2), cesium fluoride (CsF), tantalum fluoride (TaF5), niobium fluoride (NbF5), lithium bromide (LiBr), calcium bromide (CaBr2), cesium bromide (CeBr3), selenium bromide (SeBr4), vanadium bromide (VBr3), magnesium bromide (MgBr2), barium iodide (BaI2), or magnesium iodide (MgI2); or metal chlorates such as barium perchlorate (Ba(ClO4)2) or magnesium perchlorate (Mg(ClO4)2); etc., but not limited thereto. As a moisture adsorbent that can be included in the encapsulation layer, one or two or more of the above-mentioned components can also be used. In one embodiment, when two or more are used as the moisture adsorbent, calcined dolomite, etc. can be used.

[0060] Such moisture adsorbents can be controlled to an appropriate size depending on the application. In one example, the average particle size of the moisture adsorbent can be controlled to be approximately 10 nm to 15,000 nm. Moisture adsorbents with a size within this range have a moderate reaction rate with moisture and are therefore easy to store. They can also effectively remove moisture without damaging the components being packaged.

[0061] The content of the moisture adsorbent is not particularly limited and can be appropriately selected in consideration of desired barrier properties.

[0062] If necessary, the encapsulation layer can also include a moisture blocker. In this specification, the term "moisture blocker" can mean such a material: it has no reactivity with moisture or has low reactivity, but can physically block or hinder the movement of moisture or moisture in the film. As a moisture blocker, for example, one or two or more of the following can be used: aluminum oxide, clay, talc, needle-shaped silica, plate-shaped silica, porous silica, zeolite, titanium dioxide or zirconium oxide. In addition, the moisture blocker can be surface-treated to promote the penetration of organic matter through an organic modifier. As such an organic modifier, for example, dimethylbenzyl hydrogenated tallow quaternary ammonium, dimethyl hydrogenated tallow quaternary ammonium, methyl tallow bis-2-hydroxyethyl quaternary ammonium, dimethyl hydrogenated tallow 2-ethylhexyl quaternary ammonium, dimethyl dehydrogenated tallow quaternary ammonium or a mixture thereof can be used.

[0063] The content of the moisture blocking agent is not particularly limited and may be appropriately selected in consideration of desired barrier properties.

[0064] In addition to the above-mentioned components, the encapsulation layer may contain various additives according to the application and manufacturing process of the encapsulation film described below. For example, the encapsulation layer may contain a curable material, a crosslinking agent, a filler, etc. in an appropriate content range according to the expected physical properties.

[0065] In one embodiment of the present application, the encapsulation layer may be formed as a single layer structure as described above, or may be formed of two or more layers. When the encapsulation layer is formed of two or more layers, the outermost layer of the encapsulation layer may not contain a moisture adsorbent, or may contain a moisture adsorbent in a lower amount than other encapsulation layers.

[0066] In one example, considering that the encapsulation film is used to encapsulate an organic electronic component, the moisture adsorbent content can be controlled to account for damage to the component. For example, the layer in contact with the component can contain a small amount of moisture adsorbent, or can contain no moisture adsorbent at all. In one example, the encapsulation layer in contact with the component can contain 0% to 20% moisture adsorbent relative to the total mass of the moisture adsorbent in the encapsulation film. Furthermore, the encapsulation layer not in contact with the component can contain 80% to 100% moisture adsorbent relative to the total mass of the moisture adsorbent in the encapsulation film.

[0067] In one example, the encapsulation film of the present application may further include a protective layer formed on the metal layer. The protective layer may include a resin component. The material constituting the protective layer is not particularly limited. In one example, the protective layer may be a waterproof layer capable of blocking moisture penetration. In one example, the resin component constituting the protective layer may include one or more selected from the following: polyorganosiloxane, polyimide, styrene-based resin or elastomer, polyolefin-based resin or elastomer, polyoxyalkylene-based resin or elastomer, polyester-based resin or elastomer, polyvinyl chloride-based resin or elastomer, polycarbonate-based resin or elastomer, polyphenylene sulfide-based resin or elastomer, polyamide-based resin or elastomer, acrylate-based resin or elastomer, epoxy-based resin or elastomer, silicone-based resin or elastomer, and fluorine-based resin or elastomer, but is not limited thereto.

[0068] In one embodiment of the present application, the encapsulation film may further include a pressure-sensitive adhesive or adhesive between the protective layer and the metal layer. The material of the pressure-sensitive adhesive or adhesive is not particularly limited, and known materials can be used. In one example, the pressure-sensitive adhesive or adhesive can be an acrylic, epoxy-based, urethane-based, silicone-based or rubber-based pressure-sensitive adhesive or adhesive. In addition, in one embodiment, the material of the pressure-sensitive adhesive or adhesive can be the same as or different from the material of the encapsulation layer as described above.

[0069] The encapsulation film may further include a base film or a release film (hereinafter, referred to as a "first film"), and the encapsulation film may have a structure in which the encapsulation layer is formed on the base film or the release film. In addition, the structure may further include a base film or a release film (hereinafter, referred to as a "second film") formed on the metal layer.

[0070] The specific type of the first film that can be used in the present application is not particularly limited. In the present application, for example, a general polymer film in this field can be used as the first film. In the present application, for example, as a base film or release film, a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polybutylene film, a polybutadiene film, a polyvinyl chloride film, a polyurethane film, an ethylene-vinyl acetate film, an ethylene-propylene copolymer film, an ethylene-ethyl acrylate copolymer film, an ethylene-methyl acrylate copolymer film or a polyimide film etc. can be used. In addition, a suitable demoulding process can be carried out on one or both sides of the base film or release film of the present application. As an example of a release agent for the demoulding process of the base film, an alkyd series, a silicone series, a fluorine series, an unsaturated ester series, a polyolefin series or a wax series etc. can be used, wherein, in terms of heat resistance, a release agent of an alkyd series, a silicone series or a fluorine series is preferably used, but is not limited thereto.

[0071] In the present application, the thickness of the base film or release film (first film) as above is not particularly limited, and it can be appropriately selected according to the application to which the base film or release film is applied. For example, in the present application, the thickness of the first film can be 10 μm to 500 μm, preferably about 20 μm to 200 μm. If the thickness is less than 10 μm, deformation of the base film may easily occur during the manufacturing process, while if the thickness exceeds 500 μm, the economic efficiency is low.

[0072] The thickness of the encapsulation layer included in the encapsulation film of the present application is not particularly limited, and it can be appropriately selected according to the following conditions in consideration of the application to which the film is applied. The thickness of the encapsulation layer may be 5 μm to 200 μm, preferably 5 μm to 100 μm or so. When the encapsulation layer is multi-layered, the thickness may mean the thickness of the multi-layer. If the thickness of the encapsulation layer is less than 5 μm, it may not exhibit sufficient moisture blocking ability, and if the thickness exceeds 200 μm, it is difficult to ensure processability, and the thickness expansion caused by moisture reactivity is large, so that the deposited film of the organic light-emitting element may be damaged, and the economic efficiency is low.

[0073] The present application also relates to organic electronic devices. Figure 2 As shown, an organic electronic device may include a substrate 21; an organic electronic element 22 formed on substrate 21; and the above-described encapsulation film 10 for an organic electronic element for encapsulating the entire surface of organic electronic element 22. The encapsulation film may encapsulate the entire surface of the organic electronic element formed on the substrate, for example, the entire upper portion and side surfaces. The encapsulation film may include an encapsulation layer comprising a crosslinked or cured pressure-sensitive adhesive composition or adhesive composition. Furthermore, the organic electronic device may be formed such that the encapsulation layer contacts the entire surface of the organic electronic element.

[0074] Here, the organic electronic element may be, for example, an organic light-emitting element.

[0075] The encapsulation layer may be formed as a structural adhesive in an organic electronic device that effectively fixes and supports a substrate and a metal layer while exhibiting excellent moisture barrier properties.

[0076] Furthermore, the encapsulation layer can be formed as a stable encapsulation layer regardless of the form of the organic electronic device (eg, top emission or bottom emission).

[0077] Furthermore, the organic electronic device of the present application may include a protective film. The protective film can prevent damage to the electrodes of the device and can be formed of conventional materials in the art, such as SiNx or Al2O3, which are inorganic materials. The protective film can be a passivation film in which organic and inorganic films are alternately deposited.

[0078] The present application also provides a method for manufacturing an organic electronic device. The manufacturing method may include applying the above-described encapsulation film to a substrate having an organic electronic component formed thereon to cover the organic electronic component. Furthermore, the manufacturing method may also include curing the encapsulation film. The curing step of the encapsulation film may refer to curing of the encapsulation layer, and curing may be performed before or after the encapsulation film covers the organic electronic component.

[0079] In this specification, the term "curing" may mean that the pressure-sensitive adhesive composition of the present invention forms a cross-linked structure by heating or UV irradiation process, etc., thereby being manufactured into the form of a pressure-sensitive adhesive. Alternatively, it may mean that the adhesive composition is cured and attached as an adhesive.

[0080] In one example, in the manufacturing method, an organic electronic element can be formed by forming a transparent electrode on a glass or polymer film serving as a substrate by methods such as vacuum evaporation or sputtering, forming a light-emitting organic material layer composed of, for example, a hole transport layer, a light-emitting layer, and an electron transport layer on the transparent electrode, and then further forming an electrode layer on the light-emitting organic material layer. Subsequently, an encapsulation layer of an encapsulation film can be placed to cover the entire surface of the organic electronic element on the substrate subjected to the above process.

[0081] Beneficial effects

[0082] The encapsulation film of the present application can be used to seal or encapsulate organic electronic devices such as OLEDs. The film can be formed into a structure that can prevent moisture or oxygen from the outside from being introduced into the organic electronic device, thereby effectively releasing heat accumulated in the organic electronic device, achieving durable reliability under harsh conditions of high temperature and high humidity, and preventing degradation of the organic electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0083] Figure 1 is a cross-sectional view illustrating a packaging film according to one example of the present application.

[0084] Figure 2 is a cross-sectional view showing an organic electronic device according to one example of the present application.

[0085] [Explanation of Reference Numerals]

[0086] 10: Encapsulation film for organic electronic components

[0087] 11: Encapsulation layer

[0088] 12: Second floor

[0089] 13: First floor

[0090] 21: Base

[0091] 22: Organic electronic components DETAILED DESCRIPTION

[0092] Hereinafter, the present invention will be described in more detail through examples according to the present invention and comparative examples not according to the present invention, but the scope of the present invention is not limited by the following examples.

[0093] Example 1

[0094] Fabrication of encapsulation layer

[0095] A CaO solution (average particle size less than 5 μm) (50% solids content) was prepared as a moisture adsorbent. Separate solutions (50% solids content) of 200 g of butyl rubber resin (BT-20, Sunwoo Chemtech) and 60 g of DCPD petroleum resin (SU5270, Sunwoo Chemtech) diluted with toluene were prepared and homogenized. To the homogenized solution, 10 g of multifunctional acrylate (trimethylolpropane triacrylate, Miwon) and 3 g of photoinitiator (Irgacure 819, Ciba) were added and homogenized. Then, 100 g of the CaO solution was added and stirred at high speed for 1 hour to prepare an encapsulation layer solution.

[0096] The encapsulation layer solution prepared above was applied to the release surface of the release PET using a comma coater and dried in a dryer at 130° C. for 3 minutes to form an encapsulation layer having a thickness of 50 μm.

[0097] Manufacturing of packaging films

[0098] The release-treated PET attached to the outside of the encapsulation layer produced above was peeled off and roll-laminated at 70°C with a gap of 1 mm to attach 80 μm of SUS430 (the second metal layer, linear expansion coefficient: 11 ppm / °C, thermal conductivity: approximately 25 W / m·K). Subsequently, a 70 μm of aluminum foil (the first metal layer, thermal conductivity: 240 W / m·K) was roll-laminated onto the second layer using a urethane-based pressure-sensitive adhesive to produce an encapsulation film in which the metal layer and the encapsulation layer were laminated in this order (first layer, second layer, and encapsulation layer).

[0099] The manufactured encapsulation film was cut into square sheets using a cutting knife by a wood cutting machine to manufacture a film for encapsulating an organic electronic element.

[0100] Example 2

[0101] A packaging film was manufactured in the same manner as in Example 1, except that the thickness of the aluminum foil (the first layer of the metal layer) was changed to 3 μm.

[0102] Example 3

[0103] A packaging film was manufactured in the same manner as in Example 1, except that the thickness of the aluminum foil (the first layer of the metal layer) was changed to 12 μm.

[0104] Example 4

[0105] A packaging film was manufactured in the same manner as in Example 1, except that the thickness of the aluminum foil (the first layer of the metal layer) was changed to 20 μm.

[0106] Example 5

[0107] A packaging film was manufactured in the same manner as in Example 1, except that the thickness of the aluminum foil (the first layer of the metal layer) was changed to 30 μm.

[0108] Example 6

[0109] A packaging film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was a copper film (thermal conductivity: 390 W / m·K) and the thickness was changed to 3 μm.

[0110] Example 7

[0111] A packaging film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was a copper film and the thickness was changed to 9 μm.

[0112] Example 8

[0113] A packaging film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was a copper film and the thickness was changed to 18 μm.

[0114] Example 9

[0115] A packaging film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was a copper film and the thickness was changed to 50 μm.

[0116] Example 10

[0117] In Example 1, to make the encapsulation layer a two-layer structure, the encapsulation layer solution was applied to release PET to produce two encapsulation layers. Subsequently, an encapsulation film was produced in the same manner as in Example 1, except that the metal layer (second layer), encapsulation layer, metal layer (first layer), and encapsulation layer were laminated in this order, and the thickness of the first layer was changed to 3 μm.

[0118] Example 11

[0119] An encapsulation film was manufactured in the same manner as in Example 10, except that the thickness of the first layer was changed to 5 μm.

[0120] Example 12

[0121] An encapsulation film was manufactured in the same manner as in Example 10, except that the thickness of the first layer was changed to 9 μm.

[0122] Example 13

[0123] An encapsulation film was manufactured in the same manner as in Example 1, except that the thickness of the first layer was changed to 3000 μm.

[0124] Example 14

[0125] An encapsulation film was manufactured in the same manner as in Example 1, except that the thickness of the first layer was changed to 3000 μm and the thickness of the second layer was changed to 2000 μm.

[0126] Example 15

[0127] An encapsulation film was manufactured in the same manner as in Example 1, except that the thickness of the first layer was changed to 200 μm and the thickness of the second layer was changed to 2000 μm.

[0128] Example 16

[0129] An encapsulation film was manufactured in the same manner as in Example 1, except that the thickness of the second layer was changed to 60 μm and the thickness of the first layer was changed to 1 μm in Example 1.

[0130] Example 17

[0131] An encapsulation film was manufactured in the same manner as in Example 10, except that the thickness of the second layer was changed to 60 μm in Example 1 and the thickness of the first layer was changed to 1 μm in Example 1.

[0132] Comparative Example 1

[0133] An encapsulation film was manufactured in the same manner as in Example 1, except that in Example 1 the first layer was not attached.

[0134] Comparative Example 2

[0135] In Example 1, in order to manufacture an encapsulation layer as an organic encapsulation layer with heat dissipation, copper powder (particle size 3 μm) as a heat dissipation filler was introduced in an amount of 10 parts by weight relative to 100 parts by weight of the rubber resin during the rubber resin dispersion process to manufacture the manufactured encapsulation layer, and then an encapsulation film was manufactured in the same manner as in Example 1, except that the first layer was not attached.

[0136] Comparative Example 3

[0137] A packaging film was manufactured in the same manner as in Comparative Example 2, except that graphite (particle diameter 3 μm) was used as the heat-dissipating filler.

[0138] Experimental Example 1-Measurement of Heat Dissipation Performance

[0139] A heating film with a constant calorific value (VOLUN WM-90-P30, size: 15 cm x 25 cm, thickness: 0.25 mm) was placed at the center on 0.7 μm thick glass (30 cm x 50 cm). The PET attached to each encapsulation layer in the encapsulation films produced in the examples and comparative examples was peeled off, and the encapsulation films were laminated at a temperature of 70°C and a gap of 1 mm so that the encapsulation layer was in contact with the top of the glass and the heating film. At this time, the temperature of the center portion of the heating film was measured.

[0140] [Table 1]

[0141] Heat dissipation performance Example 1 59℃ Example 2 95℃ Example 3 66℃ Example 4 60℃ Example 5 57℃ Example 6 90℃ Example 7 75℃ Example 8 68℃ Example 9 45℃ Example 10 89℃ Example 11 83℃ Example 12 75℃ Example 13 43℃ Example 14 41℃ Example 15 46℃ Example 16 97℃ Example 17 97℃ Comparative Example 1 100℃ Comparative Example 2 99℃ Comparative Example 3 99℃

[0142] Experimental Example 2 - Afterimage Measurement

[0143] Devices with organic electronic components attached to the encapsulation films produced in the examples and comparative examples were manufactured in the same manner as in Experimental Example 1, except that a 0.7 μm-thick organic electronic component and a panel glass (125 cm x 79 cm) containing circuitry were used, and no heat-generating film was used. A purple screen was then driven at the center of the panel (15 cm x 15 cm), and the presence of residual images at 85°C after 900 hours was confirmed. The results of residual image occurrence are shown in Table 2.

[0144] [Table 2]

[0145] Afterimage Example 1 Not Appeared Example 2 Not Appeared Example 3 Not Appeared Example 4 Not Appeared Example 5 Not Appeared Example 6 Not Appeared Example 7 Not Appeared Example 8 Not Appeared Example 9 Not Appeared Example 10 Not Appeared Example 11 Not Appeared Example 12 Not Appeared Example 13 Not Appeared Example 14 Not Appeared Example 15 Not Appeared Example 16 Some appear Example 17 Some appear Comparative Example 1 Appear Comparative Example 2 Appear Comparative Example 3 Appear

Claims

1. An encapsulation film for an organic electronic element, comprising an encapsulation layer for encapsulating an organic electronic element, and at least two metal layers, wherein the thermal conductivity of at least one of the metal layers is 50 W / m·K to 800 W / m·K, wherein the metal layer comprises a first layer and a second layer, the thermal conductivity of the first layer is 50 W / m·K to 800 W / m·K, and the linear expansion coefficient of the second layer is 20 ppm / °C or less, wherein the first layer and the second layer are attached to each other by a pressure-sensitive adhesive or an adhesive other than a pressure-sensitive adhesive, such that the first layer, the pressure-sensitive adhesive or the adhesive other than a pressure-sensitive adhesive, and the second layer are sequentially laminated, and The second layer has a thermal conductivity lower than a thermal conductivity of the first layer, and the first layer has a linear expansion coefficient higher than a linear expansion coefficient of the second layer. 2 . The encapsulation film for an organic electronic element according to claim 1 , wherein a thickness ratio of the first layer to the second layer is in the range of 1.0 to 40. 3 . 3 . The encapsulation film for an organic electronic element according to claim 1 , wherein a thickness of the first layer is in the range of 2 μm to 3500 μm. 4 . The encapsulation film for an organic electronic element according to claim 1 , wherein a thickness of the second layer is in the range of 10 μm to 2500 μm. 5 . The encapsulation film for an organic electronic element according to claim 1 , wherein the encapsulation layer is formed of a multilayer of two or more layers. 6 . The encapsulation film for an organic electronic element according to claim 1 , wherein the encapsulation layer is formed of two or more layers and at least one of the metal layers exists between the two or more encapsulation layers. 7 . The encapsulation film for an organic electronic device according to claim 1 , wherein the metal layer comprises any one of metal, metal oxide, metal nitride, metal carbide, metal oxynitride, metal oxyboride, and combinations thereof. 8 . The encapsulating film for an organic electronic element according to claim 1 , wherein a thermal conductivity of at least one of the metal layers is in a range of 80 W / m·K to 800 W / m·K. 9 . The encapsulating film for an organic electronic element according to claim 1 , wherein the encapsulating layer comprises an encapsulating resin and a moisture adsorbent. 10 . The encapsulating film for an organic electronic element according to claim 9 , wherein the encapsulating resin comprises a curable resin or a cross-linkable resin. 11 . The encapsulating film for an organic electronic element according to claim 9 , wherein the moisture adsorbent is a chemically reactive adsorbent. 12 . The encapsulation film for an organic electronic element according to claim 1 , wherein the encapsulation layer encapsulates the entire surface of the organic electronic element formed on the substrate. 13 . The encapsulation film for an organic electronic element according to claim 1 , further comprising a protective layer formed on the metal layer.

14. The encapsulation film for an organic electronic element according to claim 13, wherein the protective layer comprises one or more resin components selected from the group consisting of polyorganosiloxane, polyimide, styrene-based resin or elastomer, polyolefin-based resin or elastomer, polyoxyalkylene-based resin or elastomer, polyester-based resin or elastomer, polyvinyl chloride-based resin or elastomer, polycarbonate-based resin or elastomer, polyphenylene sulfide-based resin or elastomer, polyamide-based resin or elastomer, acrylate-based resin or elastomer, epoxy-based resin or elastomer, silicone-based resin or elastomer, and fluorine-based resin or elastomer.

15. An organic electronic device comprising: substrate; an organic electronic element formed on the substrate; and an encapsulating film for an organic electronic element according to claim 1 for encapsulating the entire surface of the organic electronic element. 16 . A method for manufacturing an organic electronic device, comprising the step of applying the encapsulation film for an organic electronic element according to claim 1 to a substrate having an organic electronic element formed thereon to cover the organic electronic element.

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