Wiring circuit board

Abstract

The wiring circuit board has a plurality of wiring bodies arranged side by side with intervals between them. Each of the plurality of wiring bodies has: an insulating portion; a wiring portion disposed on one side of the insulating portion in the thickness direction; and a support portion disposed on the other side of the insulating portion in the thickness direction, which is made of a metallic material, and the ratio (T / W) of the length T of the support portion in the thickness direction to the length W of the plurality of wiring bodies in the side-by-side direction is 2 or more.

Description

Technical Field

[0001] This invention relates to a wiring circuit board. Background Technology

[0002] A heat dissipation structure is known in the past, in which a heat sink having a flat base and comb-shaped fins extending downward from the lower surface of the base is disposed on the lower surface of a substrate on which a heating element is mounted on the upper surface, so that heat generated from the heating element is released from the fins of the heat sink (see, for example, Patent Document 1 below).

[0003] Existing technical documents

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 55-140255 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] However, higher heat dissipation performance is required in the heat dissipation structure.

[0008] The present invention provides a wiring circuit board with excellent heat dissipation.

[0009] Solution for solving the problem

[0010] The present invention (1) includes a wiring circuit board having a plurality of wiring bodies arranged side by side with a gap between them, each of the plurality of wiring bodies having: an insulating portion; a wiring portion disposed on a surface of the insulating portion in the thickness direction; and a support portion disposed on a surface of the insulating portion in the thickness direction on the other side, formed of a metallic material, wherein the ratio (T / W) of the length T of the support portion in the thickness direction to the length W of the plurality of wiring bodies in the side-by-side direction is 2 or more.

[0011] In this wiring circuit board, since the wiring elements are arranged side by side with intervals between them, efficient heat dissipation can be achieved by using the air between the multiple wiring elements to allow heat convection generated in the wiring section.

[0012] Furthermore, the ratio (T / W) of the length T of the support in the thickness direction to the length W of the multiple wiring elements in the parallel direction is high, exceeding 2, thus increasing the contact area with the air. Therefore, the heat dissipation efficiency based on the aforementioned convection is excellent.

[0013] Furthermore, since the support portion has a high ratio (T / W) of 2 or more and is made of a metallic material, the heat transferred from the wiring portion to the insulation portion can be efficiently released to the other side in the thickness direction.

[0014] Therefore, the wiring in this wiring circuit board has excellent heat dissipation.

[0015] The present invention (2) includes the wiring circuit board of (1), wherein one of the support portions has a side surface facing other support portions adjacent to one of the support portions in the parallel direction, the area of ​​the side surface being greater than or equal to the projected area when the side surface is projected in the parallel direction.

[0016] In this wiring circuit board, the area of ​​the side surface is greater than or equal to the projected area when the side surface is projected in the parallel direction. Therefore, the contact area between the side surface of the support and the air can be reliably increased. Consequently, the heat dissipation efficiency based on convection from the support is superior.

[0017] The present invention (3) includes the wiring circuit board described in (1) or (2), wherein the material of the support portion is metal.

[0018] In this wiring circuit board, since the support part is made of metal, the heat dissipation performance from the support part is excellent.

[0019] The present invention (4) includes a wiring circuit board according to any one of (1) to (3), wherein the wiring circuit board has a connector that connects the ends of the plurality of wiring bodies in an orthogonal direction orthogonal to the parallel direction and the thickness direction, the connector having: a terminal portion that is continuous with the orthogonal end of the wiring portion; and a connection support portion that is continuous with the orthogonal end of the support portion, the connection support portion being continuous in the parallel direction in such a way that it includes the plurality of terminal portions when projected in the thickness direction.

[0020] In this wiring circuit board, since the connection support portion is continuous in the parallel direction in such a way that it includes multiple terminal portions when projected in the thickness direction, the connection support portion can reliably support multiple terminal portions.

[0021] Therefore, in this wiring circuit board, the heat dissipation of the wiring body is excellent, and the mechanical strength of the terminal portion of the connector is also excellent.

[0022] The effects of the invention

[0023] In the wiring circuit board of the present invention, the wiring body has excellent heat dissipation. Attached Figure Description

[0024] Figure 1 This is a top view showing one embodiment of the wiring circuit board of the present invention.

[0025] Figure 2 A and Figure 2 B is Figure 1 The cross-sectional view of the wiring circuit board shown is shown. Figure 2 A represents a sectional view along line AA. Figure 2 B represents a sectional view along line BB. Detailed Implementation

[0026] Overall structure of wiring circuit board

[0027] Reference Figure 1 , Figure 2 A and Figure 2 B will be used to describe one embodiment of the wiring circuit board of the present invention. Furthermore, in Figure 1 In order to clearly show the relative arrangement of the metallic support layer 6 and the conductor layer 8 described later, the substrate insulating layer 7 and the cover insulating layer 9 described later are omitted.

[0028] The wiring circuit board 1 has a surface on one side of the thickness direction and a surface on the other side of the thickness direction, and has a shape extending along a length direction orthogonal to the thickness direction. For example... Figure 1 As shown, the wiring circuit board 1 integrally includes a first connector 2 as an example of a connector, a second connector 3 as an example of a connector, and a wiring body 4. Preferably, the wiring circuit board 1 only has the first connector 2, the second connector 3, and the wiring body 4.

[0029] The first connector 2 forms one end of the wiring circuit board 1 along its length. The first connector 2 has a shape that is generally a rectangular flat plate when viewed from above. The dimensions of the first connector 2 when viewed from above are not particularly limited.

[0030] The second connector 3 forms at the other end of the wiring circuit board 1 along its length and is disposed opposite to the first connector 2 on the other side of its length, separated by a wiring body 4. The second connector 3 has a shape that is generally a rectangular flat plate when viewed from above. The dimensions of the second connector 3 when viewed from above are not particularly limited.

[0031] Wiring body 4 forms the middle (or central) portion of the wiring circuit board 1 along its length. Wiring body 4 is positioned between the first connector 2 and the second connector 3 when viewed from above. Wiring body 4 has a shape that extends along its length. Wiring body 4 connects the first connector 2 and the second connector 3 along its length. Furthermore, multiple wiring bodies 4 are arranged side-by-side, slightly longer than each other, along the short side direction of the wiring circuit board 1 (a direction orthogonal to the length and thickness directions) (an example of the parallel direction of wiring bodies 4). Openings 5 ​​are formed between adjacent wiring bodies 4.

[0032] The opening 5, for example, separates the wiring body 4 in the short side direction of the wiring circuit board 1. The opening 5 has a slit shape that extends in the length direction and penetrates the wiring circuit board 1 in the thickness direction.

[0033] Multiple wiring bodies 4 are connected at one end along their length direction via a first connector 2 along their short side direction. Thus, the multiple wiring bodies 4 are bundled together at one end along their length direction via a first connector 2.

[0034] Furthermore, the other ends of the multiple wiring bodies 4 along their length are connected in the short-side direction by a second connector 3. Thus, the other ends of the multiple wiring bodies 4 along their length are gathered together by a second connector 3.

[0035] The length of the wiring body 4 in the longitudinal direction is the interval between the first connector 2 and the second connector 3 in the longitudinal direction, and the length of the wiring body 4 in the longitudinal direction is appropriately set according to its purpose and use.

[0036] The short-side length of each of the plurality of wiring elements 4 is, for example, 500 μm or less, preferably 300 μm or less, more preferably 100 μm or less, and also, for example, 10 μm or more. The short-side length of the opening 5 is, for example, 10 μm or more, preferably 50 μm or more, more preferably 100 μm or more, and also, for example, 1000 μm or less. The ratio of the short-side length of the wiring element 4 to the short-side length of the opening 5 is, for example, 40 or less, preferably 10 or less, and also, for example, 0.1 or more, preferably 0.5 or more.

[0037] Layer structure of wiring circuit board

[0038] like Figure 2 A and Figure 2 As shown in Figure B, the wiring circuit board 1 has a metallic support layer 6, a base insulating layer 7 disposed on one side of the metallic support layer 6 in the thickness direction, a conductor layer 8 disposed on one side of the base insulating layer 7 in the thickness direction, and a cover insulating layer 9 disposed on one side of the base insulating layer 7 in the thickness direction to partially cover the conductor layer 8. The wiring circuit board 1 preferably has only the metallic support layer 6, the base insulating layer 7, the conductor layer 8, and the cover insulating layer 9.

[0039] A metallic support layer 6 forms the surface on the other side of the wiring circuit substrate 1 in the thickness direction. For example... Figure 1 , Figure 2 A and Figure 2As shown in Figure B, the metal support layer 6 has the same external shape as the wiring circuit board 1. Specifically, the metal support layer 6 has an external shape corresponding to the first connector 2, the second connector 3, and the wiring body 4. In the metal support layer 6, the portion forming the first connector 2 is the first connecting metal portion 13, which is an example of a connecting support portion; the portion forming the second connector 3 is the second connecting metal portion 14, which is an example of a connecting support portion; and the portion forming the wiring body 4 is the wiring body metal portion 15, which is an example of a support portion.

[0040] The first connecting metal portion 13 has a generally flat shape that is continuous in the short side direction, in a top view including a plurality of first terminal portions 11 described later.

[0041] The second connecting metal portion 14 has a generally flat shape that is continuous in the short side direction, in a way that includes a plurality of second terminal portions 12 as described later when viewed from above.

[0042] The wiring body metal portion 15 divides the portion on the other side of the opening 5 in the thickness direction. The wiring body metal portion 15 has a generally rectangular shape that is longer in the thickness direction when cut along the thickness direction and the short side direction (similar to a cross-sectional view).

[0043] In addition, the metal support layer 6 integrally has a surface on one side of the thickness direction, namely the first metal surface 21, a surface on the other side of the thickness direction, namely the second metal surface 22, and a side surface, namely the metal side surface 23, that connects their peripheral edges in the thickness direction.

[0044] The first metal surface 21 and the second metal surface 22 are flat surfaces that are opposite to each other and parallel in the thickness direction.

[0045] The metal side surface 23 is a flat surface that extends straight along the thickness direction. Furthermore, the metal side surface 23 of the wiring body metal portion 15 is also a flat surface that extends straight along the length direction. The metal side surface 23 in the wiring body metal portion 15 has an inner metal side surface 31 facing the opening 5 and an outer metal side surface 32 facing outward in the short side direction.

[0046] The inner metal surface 31 is an example of a side facing another wiring metal portion 15 adjacent to one wiring metal portion 15 in the short-side direction. The two inner metal surfaces 31 facing each other (towards the opening 5) are parallel, and when viewed from above, they are also parallel to the conductor side surface 29 of the main wiring portion 10, which will be described later. Furthermore, since the wiring metal portion 15 is approximately rectangular in cross-section, the area S0 of the inner metal surface 31 is the same as the projected area S1 when the inner metal surface 31 is projected in the short-side direction. The area S0 of the inner metal surface 31 is a value obtained by multiplying the thickness T of the metal support layer 6, which will be described next, by the length in the longitudinal direction.

[0047] The thickness T of the metallic support layer 6 is the distance between the first metal surface 21 and the second metal surface 22 in the direction opposite to each other, and is also the thickness length of the metal side surface 23. Specifically, the thickness T of the metallic support layer 6 is, for example, 30 μm or more, preferably 50 μm or more, preferably 100 μm or more, preferably 250 μm or more, preferably 500 μm or more, preferably 1000 μm or more, and, for example, 10 mm or less.

[0048] The short side length W of the wiring metal portion 15 is appropriately selected from the range exemplified by the short side length of the wiring body 4 described above. Specifically, the short side length W of the wiring metal portion 15 is the same as the short side length of the wiring body 4. Furthermore, in the plurality of wiring bodies 4, the short side length W of the wiring metal portion 15 is the distance (length) between adjacent inner metal surface 31 and outer metal surface 32.

[0049] Furthermore, the ratio (T / W) of the thickness T of the wiring metal portion 15 to the length W of the short side of the wiring metal portion 15 is 2 or more. Moreover, this ratio (T / W) corresponds to the aspect ratio of the cross-section formed by cutting the wiring metal portion 15 along the thickness and short side directions. If the aspect ratio (T / W) is less than 2, the heat generated in the main wiring portion 10 (described later) of the wiring body 4 cannot be efficiently released using the air in the opening 5.

[0050] Furthermore, the aspect ratio (T / W) is preferably 2.5 or more, more preferably 3 or more, and even more preferably 3.5 or more. Additionally, the aspect ratio (T / W) is 1000 or less, and even more preferably 100 or less. If the aspect ratio (T / W) is at or above the aforementioned lower limit, the heat generated in the main wiring section 10 of the wiring body 4 can be efficiently released using the air in the opening 5.

[0051] The material of the metallic support layer 6 can be appropriately selected and used from known or conventional metallic materials (specifically, metallic materials). Specifically, examples of metallic materials include metallic elements classified as Groups 1 to 16 in the periodic table, alloys containing two or more of these metallic elements, etc. Furthermore, the metallic material can also be any of transition metals or typical metals. More specifically, examples of metallic materials include, for instance, Group 2 main metals such as calcium, Group 4 subgroup metals such as titanium and zirconium, Group 5 subgroup metals such as vanadium, Group 6 subgroup metals such as chromium, molybdenum, and tungsten, Group 7 subgroup metals such as manganese, Group 8 (column 8) metals such as iron, Group 8 (column 9) metals such as cobalt, Group 8 (column 10) metals such as nickel and platinum, Group 1 subgroup metals such as copper, silver, and gold, Group 2 subgroup metals such as zinc, Group 3 main metals such as aluminum and gallium, and Group 4 main metals such as germanium and tin. They can be used individually or in combination.

[0052] Furthermore, the first connecting support portion 13, the second connecting support portion 14, and the wiring body metal portion 15 are made of the same material.

[0053] In addition, the metal support layer 6 includes a metal support layer 6 made of metal.

[0054] The thermal conductivity of the metallic support layer 6 is, for example, 5 W / m·K or higher, preferably 10 W / m·K or higher, and more preferably 15 W / m·K or higher, 20 W / m·K or higher, 25 W / m·K or higher, 30 W / m·K or higher, 35 W / m·K or higher, 40 W / m·K or higher, 50 W / m·K or higher, 60 W / m·K or higher, 75 W / m·K or higher, 100 W / m·K or higher, 200 W / m·K or higher, 300 W / m·K or higher, or 350 W / m·K or higher. If the thermal conductivity of the metallic support layer 6 is above or above the aforementioned lower limit, heat transferred from the main wiring portion 10 to the wiring substrate 18 can be efficiently released towards the other side in the thickness direction.

[0055] The thermal conductivity of the metallic support layer 6 was determined using JIS H 7903:2008 (Method for measuring effective thermal conductivity).

[0056] A substrate insulating layer 7 is disposed over the entire surface of, for example, the first metal surface 21 of a metallic support layer 6. Specifically, the substrate insulating layer 7 has an external shape corresponding to the first connector 2, the second connector 3, and the wiring body 4. In the substrate insulating layer 7, the portion forming the first connector 2 is the first connector base 16, the portion forming the second connector 3 is the second connector base 17, and the portion forming the wiring body 4 is the wiring body base 18, which is an example of an insulating portion.

[0057] The first connecting base 16 is disposed on the entire surface of the first metal surface 21 of the first connecting metal part 13. The second connecting base 17 is disposed on the entire surface of the first metal surface 21 of the second connecting metal part 14.

[0058] The base 18 of the wiring body is disposed on the entire surface of the first metal surface 21 of the wiring body metal portion 15. In other words, the wiring body metal portion 15 is disposed on the surface on the other side of the thickness direction of the base 18 of the wiring body (the second base surface 25 described later). In addition, the base 18 of the wiring body, together with the wiring body metal portion 15 and the wiring body covering portion 33 described later, defines the opening portion 5.

[0059] In addition, the substrate insulating layer 7 integrally has a surface on one side in the thickness direction, namely the first substrate surface 24, a surface on the other side in the thickness direction, namely the second substrate surface 25, and a side surface, namely the substrate side surface 26, that connects their peripheral edges in the thickness direction.

[0060] The first base surface 24 is a flat surface parallel to the first metal surface 21.

[0061] The second base surface 25 is a flat surface that contacts the first metal surface 21.

[0062] The substrate side surface 26 is a flat surface extending straight along the thickness direction. Furthermore, the substrate side surface 26 is formed flush with the metal side surface 23 along the thickness direction in the wiring substrate base 18. Additionally, the substrate side surface 26 has a substrate inner side surface 37 formed flush with the metal inner side surface 31 in the wiring substrate base 18. The substrate inner side surface 37 partially defines an opening 5.

[0063] The thickness of the substrate insulating layer 7 is the distance between the first substrate surface 24 and the first metal surface 21 in the directions opposite to each other, and is also the thickness direction length of the substrate side surface 26. Specifically, it is, for example, 1 μm or more, preferably 5 μm or more, and also, for example, 100 μm or less, preferably 50 μm or less. The ratio of the thickness of the substrate insulating layer 7 to the thickness T of the metallic support layer 6 is, for example, 10 or less, preferably 1 or less, more preferably 0.1 or less, and also, for example, 0.005 or more.

[0064] Examples of insulating resins that can be used as the base insulating layer 7 include insulating resins such as polyimide.

[0065] Furthermore, the thermal conductivity of the substrate insulating layer 7 is lower than that of the metallic support layer 6. Specifically, for example, it is 1 W / m·K or less, further 0.5 W / m·K or less, and for example, 0.01 W / m·K or more, preferably 0.1 W / m·K or more.

[0066] The thermal conductivity of the substrate insulating layer 7 was determined using JIS A 1412 (Method for measuring the thermal conductivity of thermal insulating materials).

[0067] The conductor layer 8 is disposed on the first base surface 24 of the substrate insulating layer 7. Specifically, the conductor layer 8 is disposed on the first base surface 24 of the first connection base 16, the second connection base 17 and the wiring base 18.

[0068] In conductor layer 8, the first connector 2 includes the first terminal portion 11 and the first auxiliary wiring portion 19, the second connector 3 includes the second terminal portion 12 and the second auxiliary wiring portion 20, and the wiring body 4 includes the main wiring portion 10, which is an example of a wiring portion.

[0069] Multiple first terminal portions 11 are arranged at intervals along the short side direction of the wiring circuit board 1, corresponding to multiple wiring bodies 4 (main wiring portions 10) within the first connector 2. The multiple first terminal portions 11 are arranged at intervals along the short side direction such that they are included in the first connecting metal portion 13 when projected in the thickness direction.

[0070] The first terminal portion 11 is disposed on the first base surface 24 of the first connecting base 16. The first terminal portion 11 is disposed at one end and the center of the first base surface 24 in the longitudinal direction, so as to ensure an area for the formation of the first auxiliary wiring portion 19 at the other end of the first base surface 24 in the longitudinal direction. The first terminal portion 11 has a shape that is generally rectangular (square pad shape) when viewed from above.

[0071] The first auxiliary wiring section 19 is continuously disposed on the first base surface 24 of the first connecting base 16 within the first connector 2, adjacent to the first terminal section 11. The first auxiliary wiring section 19 has a generally straight shape when viewed from above, extending from the other end edge of the first terminal section 11 in the longitudinal direction. The first auxiliary wiring section 19 connects the other end edge of the first terminal section 11 in the longitudinal direction to one end edge of the main wiring section 10, which will be described next, in the longitudinal direction. The short side length of the first auxiliary wiring section 19 is shorter than the short side length of the first terminal section 11. The ratio of the short side length of the first auxiliary wiring section 19 to the short side length of the first terminal section 11 is, for example, 0.8 or less, preferably 0.5 or less, and, for example, 0.001 or more, preferably 0.01 or more. The short side length of the first auxiliary wiring section 19 is the same as the short side length of the main wiring section 10.

[0072] Multiple second terminal portions 12 are arranged at intervals along the short side direction of the wiring circuit board 1, corresponding to multiple wiring bodies 4 (main wiring portions 10) within the second connector 3. The multiple second terminal portions 12 are arranged along the short side direction such that they are included in the second connector metal portion 14 when projected along the thickness direction. The second terminal portions 12 are disposed on the first base surface 24 of the second connector base base 17. The second terminal portions 12 are disposed at the other end and the center of the first base surface 24 in the longitudinal direction, so as to ensure an area for the formation of the second auxiliary wiring portion 20 at one end of the first base surface 24 in the longitudinal direction. The second terminal portions 12 have a shape that is generally rectangular (square pad shape) when viewed from above.

[0073] The second auxiliary wiring section 20 is continuously disposed on the first base surface 24 of the second connecting base 17 within the second connector body 3, adjacent to the second terminal section 12. The second auxiliary wiring section 20 has a generally straight shape when viewed from above, extending from one end edge of the second terminal section 12 in the longitudinal direction. The second auxiliary wiring section 20 connects one end edge of the second terminal section 12 in the longitudinal direction to the other end edge of the main wiring section 10, which will be described next, in the longitudinal direction. The short side length of the second auxiliary wiring section 20 is shorter than the short side length of the second terminal section 12. The ratio of the short side length of the second auxiliary wiring section 20 to the short side length of the second terminal section 12 is, for example, 0.8 or less, preferably 0.5 or less, and, for example, 0.001 or more, preferably 0.01 or more. The short side length of the second auxiliary wiring section 20 is the same as the short side length of the main wiring section 10.

[0074] The main wiring portion 10 is disposed on the first base surface 24 of the wiring body base 18. Specifically, each of the plurality of main wiring portions 10 is disposed approximately at the center of the short side direction of the first base surface 24 of the plurality of wiring body bases 18. In addition, when projected along the thickness direction, the main wiring portion 10 is included in the wiring body base 18. Specifically, the plurality of main wiring portions 10 are respectively configured such that areas for the formation of the covering insulating layer 9, which will be described next, are secured at both ends of the first base surface 24 of the plurality of wiring body bases 18 in the short side direction.

[0075] The main wiring section 10 and the base of the wiring body 18 (or the metal part of the wiring body 15) are arranged in a 1-to-1 correspondence.

[0076] Furthermore, one end edge of the main wiring section 10 in the longitudinal direction is continuous with the other end edge of the first auxiliary wiring section 19 in the longitudinal direction of the first connector 2. The other end edge of the main wiring section 10 in the longitudinal direction is continuous with one end edge of the second auxiliary wiring section 20 in the longitudinal direction of the second connector 3. Thus, the main wiring section 10, the first auxiliary wiring section 19, and the second auxiliary wiring section 20 together form a shape that is approximately straight when viewed from above, extending in the longitudinal direction, and form wiring that connects the first terminal section 11 and the second terminal section 12 in the longitudinal direction.

[0077] The length of the short side of the main wiring section 10 is, for example, the same as the length of the short side of the first auxiliary wiring section 19 and the second auxiliary wiring section 20.

[0078] The conductor layer 8 integrally has a surface on one side in the thickness direction, namely the first conductor surface 27, a surface on the other side in the thickness direction, namely the second conductor surface 28, and a side surface, namely the conductor side surface 29, that connects their peripheral edges in the thickness direction.

[0079] The first conductor surface 27 is a flat surface parallel to the first base surface 24.

[0080] The second conductor surface 28 is a flat surface that is in contact with the first base surface 24.

[0081] The conductor side 29 is positioned inside the base side 26 when viewed from above. In particular, in each of the plurality of wiring elements 4, the conductor side 29 is positioned inside the base side 26 in the short side direction.

[0082] Examples of materials that can be used as conductor layer 8 include copper, silver, gold, iron, aluminum, chromium, and their alloys. From the viewpoint of obtaining good electrical properties, copper is preferred.

[0083] The thickness of the conductor layer 8 is the distance between the first conductor surface 27 and the first substrate surface 24 in the direction opposite to each other, and is the thickness direction length of the conductor side surface 29. Specifically, it is, for example, 1 μm or more, preferably 5 μm or more, and also, for example, 50 μm or less, preferably 3 μm or less.

[0084] Furthermore, the short side length of the main wiring portion 10 is, for example, 200 μm or less, preferably 100 μm or less, and also, for example, 1 μm or more, preferably 5 μm or more. Additionally, the ratio of the short side length of the main wiring portion 10 to the short side length W of the wiring body metal portion 15 is, for example, 2 or less, preferably 1 or less, and also, for example, 0.01 or more, preferably 0.1 or more.

[0085] The insulating layer 9 is disposed on the first substrate surface 24 such that it covers the first conductor surface 27 and conductor side surface 29 of the first auxiliary wiring portion 19, the second auxiliary wiring portion 20, and the main wiring portion 10. On the other hand, the insulating layer 9 exposes at least the first conductor surface 27 of the first terminal portion 11 and the second terminal portion 12.

[0086] In the covering insulation layer 9, the portion included in the first connector 2 is the first connector cover (in Figure 1 and Figure 2 (Not shown in the diagram), the part included in the second connector 3 is the second connector cover (in... Figure 1 and Figure 2 (Not shown in the figure), the part included in the wiring body 4 is the wiring body cover 33.

[0087] The first connecting cover (not shown) exposes the first terminal portion 11 but covers the first auxiliary wiring portion 19. The second connecting cover exposes the second terminal portion 12 but covers the second auxiliary wiring portion 20, which is not shown.

[0088] The wiring body cover 33 covers the portion of the main wiring portion 10 near the short side in the direction of the first conductor surface 27 and conductor side surface 29, and the portion of the main wiring portion 10 near the short side in the first base surface 24.

[0089] The insulating layer 9 integrally has a surface on one side in the thickness direction, namely the first covering surface 34, a surface on the other side in the thickness direction, namely the second covering surface 35, and a side surface, namely the covering side surface 36, that connects their peripheral edges in the thickness direction.

[0090] The first covering surface 34 is a flat surface parallel to the first conductor surface 27.

[0091] The second covering surface 35 is in contact with the first conductor surface 27 and the conductor side surface 29, and is also in contact with the first base surface 24.

[0092] The cover side 36 is formed flush with the base side 26 of the wiring body base 18 in the thickness direction. In addition, the cover side 36 has a cover inner side 38 formed flush with the inner side 37 of the base in the wiring body cover portion 33.

[0093] Therefore, each of the plurality of wiring bodies 4 has two wiring body side surfaces 50. The wiring body side surface 50 is formed (constructed) by a metal side surface 23, a base side surface 26, and a cover side surface 36, and is continuous in the thickness direction. Therefore, the wiring body 4 has a generally straight shape that extends relatively long in the thickness direction when viewed in section. In addition, the wiring body side surface 50 has an inner wiring body side surface 51 formed by a metal inner side surface 31, a base inner side surface 37, and a cover inner side surface 38 when viewed in section, and this inner wiring body side surface 51 divides an opening 5.

[0094] The thickness of the insulating layer 9 is the distance between the first covering surface 34 and the first conductor surface 27 in the direction opposite to each other. Specifically, it is, for example, 1 μm or more, preferably 5 μm or more, and also, for example, 100 μm or less, preferably 50 μm or less.

[0095] Examples of materials that can be used to cover the insulating layer 9 include insulating resins such as polyimide.

[0096] The thickness of the wiring circuit board 1 is, for example, 10 μm or more, preferably 100 μm or more, and also, for example, 10 mm or less, preferably 1 mm or less.

[0097] To manufacture the wiring circuit board 1, for example, a flat metal sheet is first prepared, and then a base insulating layer 7, a conductor layer 8, and a cover insulating layer 9 with the shapes described above are sequentially formed. Then, the metal sheet is shaped to form a first connecting metal portion 13, a second connecting metal portion 14, and a wiring body metal portion 15, thereby forming a metal support layer 6. The shaped processing is not particularly limited, and examples include etching, laser processing, waterjet (hydraulic knife), and punching.

[0098] Alternatively, a base insulating layer 7, a conductor layer 8, and a cover insulating layer 9 can be sequentially formed on the first metal surface 21 of the metal support layer 6 having the first connecting metal portion 13, the second connecting metal portion 14, and the wiring body metal portion 15.

[0099] Then, as Figure 2 As shown by the imaginary line B, the first element 41 is mounted on the first connector 2, and the second element 42 is mounted on the second connector 3.

[0100] The first element 41 and / or the second element 42 are configured to input and output high current values ​​(e.g., large currents of 1A or more, even 10A or more). Furthermore, the first element 41 has a first electrode 43 disposed on a surface on the other side of the thickness direction. The second element 42 has a second electrode 44 disposed on a surface on the other side of the thickness direction.

[0101] To mount the first element 41 to the first terminal portion 11, the first electrode 43 is electrically connected to the first terminal portion 11. To mount the second element 42 to the second terminal portion 12, the second electrode 44 is electrically connected to the second terminal portion 12.

[0102] Furthermore, in this wiring circuit board 1, since the wiring bodies 4 are arranged side by side with a gap between them, efficient heat dissipation can be achieved by means of the air between the multiple wiring bodies 4 (openings 5) to allow heat convection generated in the main wiring section 10 based on the input of a large current from the first element 41 and / or the second element 42, especially convection along the thickness direction.

[0103] Furthermore, since the aspect ratio (T / W) of the metal portion 15 of the wiring body is relatively high, exceeding 2, the contact area with the air can be increased. Therefore, the heat dissipation efficiency based on the aforementioned convection is excellent.

[0104] Furthermore, since the aspect ratio (T / W) of the wiring body metal portion 15 is relatively high, being 2 or more, and it is made of a metallic material, the heat transferred from the main wiring portion 10 to the wiring body base 18 can be efficiently released to the other side of the thickness direction of the wiring body base 18. Specifically, the heat can be efficiently released from the first metal surface 21 of the wiring body metal portion 15 toward the second metal surface 22 and toward the other side of the thickness direction of the second metal surface 22.

[0105] Therefore, the wiring body 4 of the wiring circuit board 1 has excellent heat dissipation.

[0106] Furthermore, since the material of the wiring body metal portion 15 in this wiring circuit board 1 is metal, the heat dissipation performance of the wiring body metal portion 15 is excellent.

[0107] In addition, in this wiring circuit board 1, the first connecting metal portion 13 is continuous along the short side direction in such a way that it includes a plurality of first terminal portions 11 when projected along the thickness direction. Therefore, the first connecting metal portion 13 can reliably support the plurality of first terminal portions 11.

[0108] The second connecting metal portion 14 is continuous along the short side direction in such a way that it includes a plurality of second terminal portions 12 when projected along the thickness direction. Therefore, the second connecting metal portion 14 can reliably support the plurality of second terminal portions 12.

[0109] Therefore, in this wiring circuit board 1, the wiring body 4 has excellent heat dissipation, and the mechanical strength of the first terminal portion 11 in the first connector 2 and the mechanical strength of the second terminal portion 12 in the second connector 3 are both excellent. Therefore, the connection reliability between the first terminal portion 11 and the second terminal portion 12 is excellent.

[0110] The application of such a wiring circuit board 1 is not particularly limited and can be used in various fields. For example, the wiring circuit board 1 is used in various applications such as wiring circuit boards for electronic equipment (wiring circuit boards for electronic components) and wiring circuit boards for electrical equipment (wiring circuit boards for electrical components). Examples of wiring circuit boards for electronic devices and electrical equipment include, for instance, sensor wiring circuit boards used in sensors such as position information sensors, obstacle detection sensors, and temperature sensors; conveyor wiring circuit boards used in conveyor vehicles such as automobiles, trams, airplanes, and work vehicles; video equipment wiring circuit boards used in video equipment such as flat panel displays, flexible displays, and projection video equipment; communication relay equipment wiring circuit boards used in communication relay equipment such as network equipment and large communication equipment; information processing terminal wiring circuit boards used in information processing terminals such as computers, tablet computers, smartphones, and home game consoles; movable equipment wiring circuit boards used in movable devices such as unmanned aerial vehicles and robots; medical equipment wiring circuit boards used in medical devices such as wearable medical devices and medical diagnostic devices; electrical equipment wiring circuit boards used in electrical equipment such as refrigerators, washing machines, vacuum cleaners, and air conditioning equipment; and video recording electronic equipment wiring circuit boards used in video recording electronic devices such as digital cameras and DVD recording devices.

[0111] Variations

[0112] In the following variations, the same reference numerals are used for components and processes identical to those in the first embodiment described above, and detailed descriptions are omitted. Furthermore, apart from the specifically described content, each variation can achieve the same effect as the first embodiment. Moreover, the first embodiment and variations can be appropriately combined.

[0113] like Figure 2 As shown in Figure A, in one embodiment, the metal side surface 23, the base side surface 26, and the cover side surface 36 are flush, but they may not be flush, that is, they may not be continuous, which is not illustrated. For example, the base side surface 26 and / or the cover side surface 36 may not overlap with the metal side surface 23 when projected along the thickness direction, but may exist offset from the metal side surface 23 to either the outer or inner side in the short side direction, which is not illustrated.

[0114] like Figure 2 As shown in Figure A, in one embodiment, the metal side surface 23 in the wiring body metal portion 15 is a flat surface, but it can also be a curved surface, for example, which is not shown.

[0115] In this modified example, the curved surface, i.e. the metal side surface, has a concave surface that, when viewed in section, curves inward toward the short side as it moves from both ends in the thickness direction toward the center in the thickness direction; this is not illustrated.

[0116] Preferably, the metal side surface has only concave surfaces. That is, when viewed in cross-section, the metal side surface is concave towards the short side as it moves from both ends in the thickness direction toward the center in the thickness direction. Therefore, the short side length of the wiring metal portion decreases as it moves from both ends in the thickness direction toward the center in the thickness direction. When multiple wiring metal portions each have a cross-section that tapers towards the center in the thickness direction, they form a generally drum-shaped (hourglass) shape. In each of the multiple wiring metal portions, two concave surfaces are provided on both sides in the short side direction.

[0117] The area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short side direction. Therefore, the present invention includes the following embodiments in which the area S0 of the metal side surface is greater than or equal to the projected area S1 when the metal side surface is projected in the short side direction. Specifically, this includes both an embodiment in which the area S0 of the metal side surface 23 is the same as the projected area S1 of the metal side surface 23 and a variation in which the area S0 of the metal side surface is larger than the projected area S1 of the metal side surface.

[0118] In this modified example, specifically, the area ratio (S0 / S1) of the metal side surface area S0 to the projected area S1 is, for example, 1.01 or more, preferably 1.1 or more, more preferably 1.2 or more, and even more preferably 1.3 or more. In addition, it is, for example, 2 or less.

[0119] Furthermore, since the length of the metal side surface is the same as the length of the projected surface of the metal side surface, in cross-section, the aforementioned area ratio (S0 / S1) is the same as the length ratio (thickness T / total length L) of the thickness T of the metal support layer 6 (specifically, the thickness distance from one edge to the other edge of the metal side surface) relative to the total length L along the curved surface (concave surface) from one edge to the other edge of the metal side surface. Therefore, the area ratio (S0 / S1) can be obtained as the aforementioned length ratio (thickness T / total length L).

[0120] Furthermore, in the above-mentioned variation, the length W of the short side of the wiring metal part is calculated as the average of the lengths between the two metal side surfaces.

[0121] Furthermore, in this modified example, the metal side surface can have a curved surface, which is not shown in the figure. In this case, one metal side surface integrally has two adjacent concave surfaces in the thickness direction and an ridge line connecting the two concave surfaces in the thickness direction. Thus, the metal side surface is formed as a curved surface. Specifically, one metal side surface has a roughly W-shaped profile in cross-section: an ridge line in the center of the thickness direction, and concave surfaces on both sides of the ridge line. Therefore, each of the multiple wiring metal parts has a cross-sectional shape that connects two drums (hourglasses) in the thickness direction.

[0122] The manufacturing method of the wiring circuit board of the above-described modified example is specifically described. In this manufacturing method, a metallic support layer 6 is formed by, for example, etching (subtractive etching).

[0123] Specifically, firstly, a laminate is prepared, which has a metal sheet and a first metal surface formed on the metal sheet (see reference). Figure 2 A and Figure 2 B) The base insulating layer, conductor layer and covering insulating layer.

[0124] Next, the photoresist is applied to the second metal surface of the metal sheet. The top view shape of the photoresist is, for example, the same as the top view shape of the desired metallic support layer 6, and substantially the same as the top view shape of the base insulating layer and the overlay insulating layer.

[0125] This process produces a resist laminate containing both a laminate and a resist agent.

[0126] Then, the resist laminate is immersed in the etching solution. Specifically, the etching solution is brought into contact with the first metal surface of the metal sheet exposed from the substrate insulating layer and the overlay insulating layer, and the second metal surface exposed from the resist.

[0127] Therefore, in the exposed portion of the second metal surface exposed from the resist, the etching rate at the center of the short side is higher than the etching rate at the two ends of the short side (however, referring to the position further outward in the short side direction than the second metal surface). This is because the etchant is more likely to remain (stagnate) at the two ends of the exposed portion in the short side direction than at the center of the short side direction.

[0128] This situation is the same for the exposed portion of the first metal surface that is exposed from the substrate insulating layer. Furthermore, both the first and second metal surfaces during the etching process are curved surfaces with the central portion in the short side direction recessed towards the inside in the thickness direction.

[0129] Therefore, the etching of the exposed portions of the first and second metal surfaces in the central part along the short side is completed earlier than the etching of the two ends along the short side. Consequently, the first and second metal surfaces disappear more quickly in the central part along the short side compared to the two ends. In other words, an opening is first formed in the central part along the short side, and then the opening expands outwards (towards the two ends) along the short side.

[0130] Thus, a metal side surface with two concave surfaces and ridges is formed. At this point, if etching is completed and the resist is then removed, a wiring circuit board with a deformed example of ridges (a wiring body metal part with the shape of two drums connected together) is obtained.

[0131] On the other hand, if etching continues, the ridges disappear, thus forming a metal side surface that has a concave surface instead of ridges. If the resist is then removed, a wiring circuit board of a modified example (having a wiring metal portion with a cross-section that is approximately drum-shaped) is obtained.

[0132] In these modified wiring circuit boards, the area S0 of the metal side surface is larger than the projected area S1 when the metal side surface is projected in the short side direction.

[0133] Therefore, in one embodiment where the area S0 of the metal side surface 23 is the same as the projected area S1 of the metal side surface 23 (see reference). Figure 2 A) and the variant where the area S0 of the metal side surface is larger than the projected area S1 of the metal side surface: Both of these wiring circuit boards (i.e., wiring circuit boards where the area S0 of the metal side surface 23 is greater than or equal to the projected area S1 of the metal side surface 23) can reliably increase the contact area between the metal side surface and the air. Therefore, the heat dissipation efficiency based on convection from the metal part of the wiring body is even better.

[0134] Especially in these variations, with Figure 2 Compared to the embodiment shown in A, the contact area between the metal side and the air can be reliably increased further. Therefore, the heat dissipation efficiency based on convection from the metal part of the wiring body is even better.

[0135] In another variation, a metal side surface integrally has a concave surface and a convex surface. The concave and convex surfaces are arranged sequentially in the thickness direction.

[0136] In this modified example, in a single wiring metal section, the concave surface on one side of the short side faces the convex surface on the other side of the short side, and the convex surface on one side of the short side faces the concave surface on the other side of the short side; this is not illustrated. Therefore, the wiring metal section has a shape that is approximately the letter S in cross-section.

[0137] In a single wiring metal section, two concave surfaces on one and the other sides in the short-side direction face each other in the short-side direction. Two convex surfaces on one and the other sides in the short-side direction also face each other in the short-side direction, but this is not illustrated.

[0138] In one embodiment, an example of a support portion is the wiring metal portion 15, which is contained within a metal support layer 6 made of metal. However, the support layer may be made of a particulate resin composition, such as a sintered composition including particles and resin with high thermal conductivity, or a ceramic, instead of the metal support layer 6.

[0139] In one embodiment, both the first connector 2 and the second connector 3 are continuous along the short side direction, including the first terminal portion 11 and the second terminal portion 12 when viewed from above. However, for example, one may be continuous along the short side direction while the other is discontinuous, which is not shown. In this case, the other connector is arranged in a plurality of segments spaced apart along the short side direction. For example, both the first connector 2 and the second connector 3 may be divided into a plurality of segments spaced apart along the short side direction, which is not shown.

[0140] In one embodiment, the main wiring section 10 is provided at the base 18 of the wiring body, but for example, multiple sections can also be provided at the base 18 of the wiring body, which are not shown in the figure.

[0141] Furthermore, the above-described invention is provided as an illustrative embodiment of the present invention, but it is merely illustrative and should not be interpreted as limiting. Modifications of the invention that will be apparent to those skilled in the art are included in the foregoing claims.

[0142] Industrial availability

[0143] Wiring circuit boards can be used for various purposes, such as wiring circuit boards for electronic devices and wiring circuit boards for electrical equipment.

[0144] Explanation of reference numerals in the attached figures

[0145] 1. Wiring circuit board; 2. First connector; 3. Second connector; 4. Wiring body; 10. Main wiring section; 11. First terminal section; 12. Second terminal section; 13. First connector metal section; 14. Second connector metal section; 15. Wiring body metal section; 16. First connector base; 17. Second connector base; 18. Wiring body base; 24. First base surface; 25. Second base surface; 31. Metal inner surface.

Claims

1. A wiring circuit board, characterized in that, The wiring circuit board has multiple wiring elements arranged side by side with intervals between them. Each of the plurality of wiring elements has: The base of the wiring body; The main wiring section is disposed on one side of the base portion of the wiring body in the thickness direction; The support portion, which is disposed on the surface of the base portion of the wiring body in the thickness direction, is formed of a metallic material, and the ratio (T / W) of the length T of the support portion in the thickness direction to the length W of the plurality of wiring bodies in the parallel direction is 2 or more. as well as A wiring cover portion is disposed on the thickness-direction side surface of the wiring base portion in such a way that it covers the entire surface or the entire side surface of the main wiring portion.

2. The wiring circuit board according to claim 1, characterized in that, One of the support portions has a side surface facing other support portions adjacent to it in the parallel direction. The area of ​​the side is greater than or equal to the projected area when the side is projected in the parallel direction.

3. The wiring circuit board according to claim 1 or 2, characterized in that, The support is made of metal.

4. The wiring circuit board according to claim 1 or 2, characterized in that, The wiring circuit board has a connector that connects the ends of the plurality of wiring elements in an orthogonal direction orthogonal to the parallel direction and the thickness direction. The connector has: The terminal portion is continuous with the orthogonal end of the main wiring portion; as well as The connecting support portion is continuous with the orthogonal end of the support portion. The connecting support portion is continuous in the parallel direction in such a way that it includes a plurality of the terminal portions when projected in the thickness direction.

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