Heating chamber structure and silicon wafer processing apparatus

Abstract

The application provides a heating cavity structure and a silicon wafer processing device. The heating cavity structure comprises a heating cavity for providing a vacuum environment, a through hole is arranged on the sidewall of the heating cavity, an isolation sleeve pipe extends into the heating cavity through the through hole, at least one end of the isolation sleeve pipe is located outside the heating cavity, a heater is arranged in the isolation sleeve pipe, the lead end of the heater extends out of the end of the isolation sleeve pipe located outside the heating cavity, and a connecting assembly is arranged for fixing the isolation sleeve pipe and the heater. The isolation sleeve pipe and the connecting assembly isolate the internal part of the heating cavity from the heater and the external atmosphere. The application can realize the isolation between the internal vacuum environment and the external atmospheric environment through the cooperation of the isolation sleeve pipe and the connecting assembly, the lead wire of the heater can be connected in the atmospheric environment, the discharge phenomenon is effectively relieved, the use voltage is improved, and the wiring burden of the heater is reduced.

Description

Technical Field

[0001] This application relates to the field of silicon wafer heating equipment technology, and more specifically, to a heating cavity structure and a silicon wafer processing device. Background Technology

[0002] PECVD (Plasma Enhanced Chemical Vapor Deposition) is a commonly used coating method in solar cell production, typically employing PECVD equipment to coat silicon wafers. Existing PECVD equipment often uses infrared heaters for the heating chamber, with the heater leads placed in a vacuum. However, in a vacuum environment, the discharge phenomenon between a high-voltage source and a low-voltage source is particularly severe. To mitigate this issue, voltages generally do not exceed 110V. This results in a significantly higher current load on the infrared heater when connected in a vacuum compared to when connected in the atmosphere, leading to increased wiring load, the need for thicker cables and larger circuit breakers, and an overly complex overall heating chamber structure, thus increasing costs. Summary of the Invention

[0003] According to embodiments of the present invention, it is intended to at least improve one of the technical problems existing in the prior art or related art.

[0004] Therefore, one object of the present invention is to provide a heating cavity structure.

[0005] Another object of the present invention is to provide a silicon wafer processing apparatus.

[0006] To achieve the above objectives, an embodiment of the first aspect of the present invention provides a heating cavity structure, comprising: a heating cavity body for providing a vacuum environment, wherein a through hole is provided on the side wall of the heating cavity body; an isolation sleeve extending into the heating cavity body through the through hole, wherein at least one end of the isolation sleeve is located outside the heating cavity body; a heater, wherein the heating portion of the heater is disposed inside the isolation sleeve, and the lead end of the heater extends out from the end of the isolation sleeve located outside the heating cavity body; and a connecting assembly for fixing the isolation sleeve and the heater; wherein the isolation sleeve and the connecting assembly isolate the interior of the heating cavity body from the heater and the external atmosphere.

[0007] According to an embodiment of the first aspect of the present invention, the heating cavity structure includes a heating cavity body, an isolation sleeve, a heater, and a connecting assembly. The heating cavity body, as the main body of the heating cavity structure, provides a vacuum environment for the silicon wafer heating operation. A through-hole is provided on the side wall of the heating cavity body for accommodating the isolation sleeve. The isolation sleeve extends into the heating cavity body through the through-hole on the side wall, with at least one end of the isolation sleeve located outside the heating cavity body to communicate with the external atmosphere. The heating portion of the heater extends into the isolation sleeve, and the lead end of the heater extends out from the end of the isolation sleeve located outside the heating cavity body for wiring. The connecting assembly is used to fix the isolation sleeve and the heater, and the connection assembly and the isolation sleeve isolate the interior of the heating cavity body from the external atmosphere, while also isolating the heater. When the silicon wafer enters the vacuum environment of the heating cavity along with the silicon wafer carrier, the heater is energized and heats up to heat the silicon wafer. When the heater is located near the bottom of the heating cavity body, a bottom-mounted heating method can be formed, which is beneficial for efficient use of space. Furthermore, the heater can be a rod-shaped or tubular structure to facilitate assembly within the isolation sleeve.

[0008] The heating chamber structure in this solution, by setting up an isolation sleeve and connecting components, allows the heater's lead end to be placed in the atmospheric environment, and achieves isolation between the vacuum environment inside the heating chamber and the external atmospheric environment. This effectively alleviates the discharge phenomenon of high-voltage components to low-voltage components, can increase the operating voltage, reduce the current carried by the cable, thereby reducing the wiring burden of the heater and helping to reduce the difficulty and cost of wiring operations.

[0009] In addition, the heating cavity structure in the above-described technical solution provided in the embodiments of the present invention may also have the following additional technical features:

[0010] In the above technical solution, the connecting component includes: a sealing structure provided on the inner wall of the flange on the isolation sleeve to seal the through hole; a first bracket provided at one end of the isolation sleeve outside the heating chamber, the first bracket being connected to the isolation sleeve and the heater respectively to position the isolation sleeve and the heater and to keep the heater and the isolation sleeve in a non-contact state.

[0011] In this technical solution, the connecting components include a flange and a first support. By installing the flange at a through-hole on the side wall, and fitting the flange onto the isolation sleeve, the sealing structure on the inner side wall of the flange seals the gap between the isolation sleeve and the flange, thereby sealing the through-hole and isolating the heating chamber from the external atmosphere. Simultaneously, the flange also provides some support for the isolation sleeve. It is understood that due to the characteristics and process requirements of PECVD silicon wafer deposition, the silicon wafer cannot be heated in an oxygen-rich environment; otherwise, it will cause process defects and affect the deposition effect. The cooperation between the flange and the isolation sleeve effectively prevents air from flowing into the heating chamber. By installing the first support at the end of the isolation sleeve outside the heating chamber, and connecting the first support to both the isolation sleeve and the heater, the relative position between the isolation sleeve and the heater is restricted, achieving positioning of the isolation sleeve and the heater. At the same time, the first support keeps the heater and the isolation sleeve in a non-contact state, allowing the heat from the heater to dissipate relatively evenly and preventing mutual contact from affecting the heating process.

[0012] In the above technical solution, the first support includes: a first pipe clamp, including a first clamping part and a first adjusting part, the first clamping part being sleeved on the isolation sleeve, and the first adjusting part being used to adjust the size of the first clamping part so that the first clamping part clamps the isolation sleeve; a second pipe clamp, including a second clamping part and a second adjusting part, the second clamping part being sleeved on the heater, and the second adjusting part being used to adjust the size of the second clamping part so that the second clamping part clamps the heater; and a connecting plate, which is fixedly connected to the bottom of the first clamping part and the bottom of the second clamping part respectively, to position the first clamping part and the second clamping part.

[0013] In this technical solution, the first support includes a first pipe clamp, a second pipe clamp, and a connecting plate. The first pipe clamp specifically includes a first clamping part and a first adjusting part. The first clamping part is sleeved on the isolation sleeve, and its size can be adjusted by the first adjusting part connected to it, thereby clamping the isolation sleeve tightly and improving its stability. Similarly, the second pipe clamp includes a second clamping part and a second adjusting part. The second clamping part is sleeved on the heater, and its size can be adjusted by the second adjusting part connected to it, thereby clamping the heater tightly and improving its stability. A connecting plate, fixedly connected to the bottom of both the first and second clamping parts, provides support for both parts, making them an integral unit to prevent relative displacement and achieve positioning.

[0014] In the above technical solution, the first clamping part includes two opposing first arc-shaped plates and a first groove structure. The first adjusting part includes a first locking bolt. The first groove structure is located at the bottom of the two first arc-shaped plates, and the two side plates of the first groove structure are respectively connected to the two first arc-shaped plates. The first locking bolt passes through the two side plates of the first groove structure and is used to adjust the distance between the two first arc-shaped plates so that the two first arc-shaped plates clamp the isolation sleeve. The second clamping part includes two opposing second arc-shaped plates and a second groove structure. The second adjusting part includes a second locking bolt. The second groove structure is located at the bottom of the two second arc-shaped plates, and the two side plates of the second groove structure are respectively connected to the two second arc-shaped plates. The second locking bolt passes through the two side plates of the second groove structure and is used to adjust the distance between the two second arc-shaped plates so that the two second arc-shaped plates clamp the heater. The connecting plate is fixedly connected to the bottom plate of the first groove structure and the bottom plate of the second groove structure respectively by fixing bolts.

[0015] In this technical solution, the first clamping part includes two opposing first arc-shaped plates and a first groove-shaped structure, and the first adjusting part includes a first locking bolt. Correspondingly, the second clamping part includes two opposing second arc-shaped plates and a second groove-shaped structure, and the second adjusting part includes a second locking bolt. Specifically, the top of the first groove-shaped structure is open, and the two side walls of the first groove-shaped structure are respectively connected to the bottom of the two first arc-shaped plates to support the first arc-shaped plates; the open sides of the two first arc-shaped plates are opposite to each other to adapt to the shape of the isolation sleeve, so as to facilitate clamping the isolation sleeve; the first locking bolt passes through the two side walls of the first groove-shaped structure to adjust the distance between the two first arc-shaped plates by tightening and loosening the first locking bolt, and when the first locking bolt is tightened, the two first arc-shaped plates move towards each other to achieve clamping of the isolation sleeve. Similarly, the top of the second groove structure is open, and the two side walls of the second groove structure are respectively connected to the top of the two second arc-shaped plates to support the second arc-shaped plates; the open sides of the two arc-shaped plates are opposite each other to adapt to the shape of the heater so as to clamp the heater; the second locking bolt passes through the two side walls of the second groove structure to adjust the distance between the two second arc-shaped plates by tightening and loosening the second locking bolt, and to make the two second arc-shaped plates move towards each other when the second locking bolt is tightened, thereby clamping the heater.

[0016] The connecting plate is fixedly connected to the base plates of the first and second grooved structures respectively by fixing bolts to achieve positioning of the first and second clamping parts and facilitate disassembly and assembly. Depending on the different sizes of the first and second grooved structures, spacers can be placed between the connecting plate and the first or second grooved structure to facilitate assembly. Specifically, when both the isolation sleeve and the heater are clamped, the isolation sleeve and the heater are coaxial, achieving centered isolation of the heater. The radial distance between the heater and the isolation sleeve is the same, allowing for more even heat dissipation from the heater and further improving the heating effect.

[0017] In the above technical solution, the connecting assembly further includes: a third pipe clamp, which is sleeved on the portion of the isolation sleeve located outside the heating chamber and clamps the isolation sleeve. The third pipe clamp is located between the first support and the flange, and the end of the third pipe clamp near the flange abuts against the flange to axially limit the isolation sleeve; a second support, which is located inside the heating chamber, with its top connected to the isolation sleeve and its bottom connected to the bottom wall of the heating chamber; and a support block, which is located inside the isolation sleeve and below the heater, for providing support for the portion of the heater located inside the isolation sleeve.

[0018] In this technical solution, the connecting assembly also includes a third pipe clamp, a second bracket, and a support block. The third pipe clamp is located between the flange and the first bracket, and is fitted onto the isolation sleeve, clamping it securely. By setting one end of the third pipe clamp close to the flange, it abuts against the flange, thereby axially limiting the third pipe clamp and the isolation sleeve through the flange, preventing axial movement of the isolation sleeve under atmospheric pressure. Since the heating chamber is a vacuum environment, the external atmospheric pressure acting on the isolation sleeve will generate a thrust on the isolation sleeve, causing it to tend to move into the heating chamber. The third pipe clamp effectively prevents axial movement of the isolation sleeve, keeping it stable.

[0019] By installing a second support inside the heating chamber, with its top connected to the isolation sleeve and its bottom connected to the bottom wall of the heating chamber, an additional support point for the isolation sleeve is added. This counteracts the weight of the isolation sleeve, reduces the bending moment it bears, and further improves its stability. The second support can be located in the middle of the isolation sleeve or at the end furthest from the flange.

[0020] By installing support blocks inside the isolation sleeve to provide support for the portion of the heater located inside the isolation sleeve, the heater's own weight can be counteracted, reducing the bending moment borne by the heater and preventing it from tilting, thus improving the heater's stability.

[0021] In the above technical solution, the heating chamber structure further includes: multiple cooling pipes formed in the side wall of the heating chamber, the multiple cooling pipes being spaced apart, and each cooling pipe having a cooling port at both ends communicating with the outside; multiple connecting pipes located on the outside of the side wall of the heating chamber, each connecting pipe having two cooling ports at both ends, so that the multiple cooling pipes are connected end to end in sequence to form a cooling pipe; wherein, the two cooling ports located at the beginning and end of the cooling pipe serve as the coolant inlet and coolant outlet, respectively.

[0022] In this technical solution, multiple cooling pipes are installed within the sidewalls of the heating chamber to provide flow space for the coolant, thereby cooling the heating chamber through the flow of the coolant. Specifically, the multiple cooling pipes are spaced apart, and each cooling pipe has a cooling port at both ends that connects to the outside. Connecting pipes on the sidewalls connect the two cooling ports, enabling communication between the two cooling pipes. Furthermore, multiple connecting pipes sequentially connect the multiple cooling pipes end-to-end, forming a unified cooling pipeline. The cooling ports at both ends of the cooling pipeline can serve as coolant inlets and outlets, respectively, facilitating connections to supply and drainage lines. The multiple cooling pipes can be spaced apart along the height or width of the heating chamber. Further, cooling pipes in adjacent sidewalls can operate independently or be interconnected via connecting pipes, allowing cooling pipes in different sidewalls to form a unified system sharing a coolant inlet and outlet.

[0023] In the above technical solution, the heating cavity structure also includes: a heat insulation plate, which is disposed in the heating cavity and is used to insulate the heating cavity; and a heat insulation plate, which is disposed in the heating cavity and is used to keep the heating cavity warm.

[0024] In this technical solution, heat insulation plates and heat preservation plates are installed inside the heating cavity to achieve heat insulation and heat preservation, which helps to reduce heat loss within the heating cavity. Specifically, the heat insulation plates and heat preservation plates can be arranged inside the heating cavity according to process requirements to avoid interference with other components. For example, the heat insulation plates may include side heat insulation plates, upper heat insulation plates, and lower heat insulation plates; the side heat insulation plates are located near the side wall of the heating cavity, and the heat preservation plates are located on the side of the side heat insulation plates facing away from the side wall of the heating cavity, arranged from the outside inward as side wall, side heat insulation plates, and heat preservation plates. Each side wall is provided with multiple side heat insulation plates to enhance the heat insulation effect. By connecting the upper heat insulation plate and the lower heat insulation plate to the top and bottom walls of the heating cavity respectively, the top and bottom of the heating cavity are insulated respectively, further reducing heat loss.

[0025] Furthermore, the side insulation plates and heat insulation plates are arranged parallel to the corresponding side walls, the upper insulation plate is arranged parallel to the top wall of the heating cavity, and the lower insulation plate is arranged parallel to the bottom wall of the heating cavity.

[0026] In the above technical solution, the heating cavity has inlet and outlet channels on two opposite side walls for the silicon wafer carrier to enter and exit the heating cavity; the heating cavity is equipped with a roller mechanism, and the roller mechanism is located on both sides of the path of the silicon wafer carrier entering and exiting the heating cavity, for carrying and conveying the silicon wafer carrier.

[0027] In this technical solution, entry and exit channels are provided on two opposite side walls of the heating cavity to facilitate the entry and exit of the silicon wafer carrier, thereby transporting the silicon wafers. Within the heating cavity, roller mechanisms are installed on both sides of the path through which the silicon wafer carrier enters and exits the cavity. These roller mechanisms carry and transport the silicon wafer carrier after it enters the heating cavity. Furthermore, the multiple rollers on each roller mechanism are evenly spaced, and the two roller mechanisms are symmetrically arranged, which helps improve the stability of the silicon wafer carrier during transport.

[0028] In the above technical solution, the isolation sleeve is a quartz sleeve; the heater is a tubular infrared heater; and / or there are multiple isolation sleeves, which are equally spaced along the width direction of the heating cavity, and each isolation sleeve has a corresponding heater.

[0029] In this technical solution, a quartz sleeve is used as the isolation sleeve to extend its service life by utilizing its low coefficient of expansion, high temperature resistance, good chemical stability, and electrical insulation properties. A tubular infrared heater is used as the heater, which facilitates assembly between the infrared heater and the quartz sleeve. Furthermore, the good light transmittance of the quartz sleeve allows the infrared rays generated by the heater to penetrate and diffuse outwards, enabling rapid heating of the silicon wafer and rapid cooling after heating, thus improving heating efficiency and convenience.

[0030] By setting multiple isolation sleeves, with each isolation sleeve containing a corresponding heater, the heating area is further increased, and the heating efficiency is improved. By setting multiple isolation sleeves at equal intervals along the width of the heating cavity, the heat from the heater is evenly distributed, preventing excessively high temperatures in local areas of the heating cavity and facilitating uniform heating.

[0031] According to an embodiment of the second aspect of the present invention, a silicon wafer processing apparatus is provided, comprising: a loading chamber, one end of which is provided with a transfer valve, and the other end of which is provided with a vacuum valve, both the transfer valve and the vacuum valve being capable of opening or closing the loading chamber; a heating chamber structure according to any one of the embodiments of the first aspect, wherein the heating chamber body of the heating chamber structure is connected to the end of the loading chamber structure provided with the vacuum valve, and is capable of communicating with the loading chamber through the vacuum valve to heat the silicon wafer entering the heating chamber from the loading chamber; a process chamber connected to the end of the heating chamber body away from the loading chamber, for performing a coating process on the silicon wafer entering the process chamber from the heating chamber body; and a vacuum pumping device connected to the loading chamber, the heating chamber structure, and the process chamber, for performing a vacuum pumping operation.

[0032] According to a second aspect of the present invention, a silicon wafer processing apparatus includes a loading chamber, a vacuum device, a heating chamber structure as described in any of the embodiments of the first aspect above, and a process chamber, for performing PECVD coating on silicon wafers. One end of the loading chamber is provided with a transfer valve for inputting a silicon wafer carrier; the other end of the loading chamber is provided with a vacuum valve; the heating chamber body of the heating chamber structure is connected to the end of the loading chamber with the vacuum valve, and the heating chamber body and the loading chamber are in communication through the vacuum valve; the process chamber is connected to the end of the heating chamber body away from the loading chamber. The vacuum device is connected to the loading chamber, the heating chamber structure, and the process chamber, and is used to perform vacuuming operations on the corresponding chambers as needed during the operation of the silicon wafer processing apparatus.

[0033] Initially, the heating chamber is a vacuum environment with the vacuum valve closed, isolating it from the loading chamber. During operation of the silicon wafer processing equipment, the following process occurs: the transfer valve opens, and the silicon wafer carrier plate, loaded with silicon wafers, enters the loading chamber through the transfer valve. The transfer valve then closes, isolating the loading chamber from the outside atmosphere. The vacuum pump is activated, creating a vacuum environment within the loading chamber. The vacuum valve opens, and the silicon wafer carrier plate carries the silicon wafer through the vacuum valve into the heating chamber. The vacuum valve closes, the heater is activated, and the silicon wafer is heated to the required process temperature. The heater closes, and the silicon wafer carrier plate carries the silicon wafer into the process chamber for coating processing.

[0034] Furthermore, the loading cavity can also use the heating cavity structure in the embodiment of the first aspect above, that is, the silicon wafer processing equipment includes two heating cavity structures, wherein the first heating cavity structure serves as the loading cavity and the second heating cavity structure serves as the heating function, without the need for special design and processing of the loading cavity, which can enhance the versatility of the heating cavity structure.

[0035] Furthermore, the silicon wafer processing equipment in this solution also has all the beneficial effects of the heating cavity structure of any one of the first aspect embodiments described above, which will not be repeated here.

[0036] Additional aspects and advantages of the embodiments of the present invention will become apparent in the following description or may be learned by practice of the invention. Attached Figure Description

[0037] The above and / or additional aspects and advantages of the embodiments of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, wherein:

[0038] Figure 1 A schematic diagram of a heating cavity structure according to an embodiment of the present invention is shown;

[0039] Figure 2 A top view of the internal structure of a heating cavity according to an embodiment of the present invention is shown;

[0040] Figure 3 It shows Figure 2 Enlarged view of section A;

[0041] Figure 4 A cross-sectional view of a heating cavity according to an embodiment of the present invention is shown;

[0042] Figure 5 A schematic diagram of the assembly of an isolation sleeve and a heater according to an embodiment of the present invention is shown;

[0043] Figure 6 It shows Figure 5 The left view;

[0044] Figure 7 It shows Figure 5 BB-direction sectional view in the middle;

[0045] Figure 8 A cross-sectional view of an isolation sleeve according to an embodiment of the present invention is shown;

[0046] Figure 9 A schematic diagram of a first support according to an embodiment of the present invention is shown;

[0047] Figure 10 A schematic diagram of a first support according to an embodiment of the present invention is shown;

[0048] Figure 11 It shows Figure 10 The left view;

[0049] Figure 12 A schematic diagram of a cooling pipe according to an embodiment of the present invention is shown;

[0050] Figure 13 A schematic diagram of a cooling pipe according to an embodiment of the present invention is shown;

[0051] Figure 14A top view of the internal structure of a heating cavity according to an embodiment of the present invention is shown;

[0052] Figure 15 A schematic diagram of a silicon wafer processing apparatus according to an embodiment of the present invention is shown.

[0053] in, Figures 1 to 15 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0054] 1. Heating chamber structure, 11. Heating chamber body, 111. Side wall, 112. Bottom wall, 1121. Through hole, 113. Top cover, 114. Inlet / outlet channel, 12. Isolation sleeve, 13. Heater, 131. Lead wire, 14. Connecting assembly, 141. Flange, 142. First bracket, 1421. First pipe clamp, 1422. First clamping part, 1423. First adjusting part, 1424. First arc plate, 1425. First groove structure, 1426. First locking bolt, 1431. Second pipe clamp, 1432. Second clamping part, 1433. Second adjusting part, 1434. Second arc plate, 1435. Second groove structure, 1436. 1437 Locking bolt, 1441 Pad, 1442 Fixing bolt, 145 Third pipe clamp, 146 Second bracket, 147 Support block, 15 Cooling pipe, 151 Cooling pipe, 152 Connecting pipe, 153 Coolant inlet, 154 Coolant outlet, 155 Cooling port, 156 Plug, 161 Side heat insulation plate, 162 Insulation plate, 163 Upper heat insulation plate, 164 Lower heat insulation plate, 165 Support column, 166 Partition column, 17 Roller mechanism, 2 Silicon wafer carrier, 3 Silicon wafer processing equipment, 31 Loading cavity, 311 Transfer valve, 312 Vacuum valve, 32 Vacuuming device, 33 Process cavity. Detailed Implementation

[0055] To better understand the above-described objectives, features, and advantages of the embodiments according to the present invention, the embodiments according to the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation details. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0056] Many specific details are set forth in the following description in order to provide a full understanding of the embodiments of the present invention. However, the embodiments of the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0057] The following reference Figures 1 to 15 The heating cavity structure and silicon wafer processing apparatus according to some embodiments of the present invention are described.

[0058] Example 1

[0059] This embodiment provides a heating cavity structure 1 for silicon wafer processing equipment. For example... Figure 1 , Figure 2 and Figure 4 As shown, the heating chamber structure 1 includes a heating chamber body 11, an isolation sleeve 12, a heater 13, and a connecting assembly 14.

[0060] The heating chamber 11, as the main body of the heating chamber structure 1, provides a vacuum environment for the silicon wafer heating operation. The heating chamber 11 can be an integral structure or a separate structure with a top cover 113. In the working state, the top cover 113 seals the top of the heating chamber 11, forming a vacuum chamber inside the heating chamber 11. A through hole 1121 is provided on the side wall 111 of the heating chamber 11. The isolation sleeve 12 extends into the heating chamber 11 through the through hole 1121 on the side wall 111, with one end of the isolation sleeve 12 located outside the heating chamber 11 to communicate with the external atmosphere. The heating part of the heater 13 extends into the isolation sleeve 12, forming a nested structure with the isolation sleeve 12. One end of the heater 13 has a lead wire 131 extending from the end of the isolation sleeve 12 located outside the heating chamber 11 for wiring to supply power to the heater 13. The through hole 1121 can be located on the side wall 111 near the bottom, so that the heater 13 is located near the bottom of the heating chamber 11, forming a bottom heating method. Of course, the through hole 1121 can also be located in other positions on the side wall 111. In addition, the heater 13 can be a rod-shaped or tubular structure to facilitate assembly in the isolation sleeve 12. The number of isolation sleeves 12 can be one or more.

[0061] The connecting assembly 14 is used to fix the isolation sleeve 12 and the heater 13. Through the cooperation of the connecting assembly 14 and the isolation sleeve 12, the interior of the heating chamber 11 can be isolated from the external atmosphere, and the heater 13 can be isolated from the vacuum chamber inside the heating chamber 11. During operation, the silicon wafer enters the vacuum chamber of the heating chamber 11 along with the silicon wafer carrier 2, and the heater 13 is energized to generate heat, thereby realizing the vacuum heating of the silicon wafer.

[0062] In this embodiment, the heating cavity structure 1 achieves isolation between the vacuum environment inside the heating cavity 11 and the external atmospheric environment through the cooperation of the isolation sleeve 12 and the connecting component 14. This allows the lead wire 131 of the heater 13 to be wired in the atmospheric environment, effectively alleviating the discharge phenomenon of high voltage body to low voltage body, increasing the operating voltage, reducing the current carried by the cable, thereby reducing the wiring burden of the heater 13, and helping to reduce the difficulty and cost of wiring operation.

[0063] Example 2

[0064] This embodiment provides a heating cavity structure 1, which is a further improvement on the first embodiment.

[0065] The isolation sleeve 12 is specifically a quartz sleeve. Quartz sleeves have a low coefficient of thermal expansion, are resistant to high temperatures, and possess excellent chemical stability and electrical insulation. They are not prone to physical or chemical changes under long-term high-temperature environments, exhibiting high stability and a long service life. The quartz sleeve is made of transparent material, providing excellent light transmittance. The heater 13 is a tubular infrared heater, facilitating nesting and assembly with the quartz sleeve. Furthermore, the infrared rays generated by the heater can penetrate the quartz sleeve and radiate outwards, exhibiting strong thermal conductivity. This allows for rapid heating of the silicon wafer and rapid cooling after heating, improving heating efficiency and convenience.

[0066] like Figure 1 and Figure 2 As shown, there are multiple isolation sleeves 12, each of which contains a nested infrared heater to further increase the heating area and improve heating efficiency. The multiple isolation sleeves 12 are evenly spaced along the width of the heating cavity 11, so that the heat generated by the multiple infrared heaters can be evenly distributed, which is beneficial to achieving uniform heating of the silicon wafer.

[0067] Example 3

[0068] This embodiment provides a heating cavity structure 1, which is a further improvement on the first embodiment.

[0069] like Figures 1 to 3 As shown, the connecting assembly 14 includes a flange 141 and a first bracket 142. The flange 141 is located at a through hole 1121 on the side wall 111, and is fitted onto an isolation sleeve 12, which extends through the flange 141 into the heating chamber 11. A sealing structure (e.g., a sealing ring or gasket) on the inner side wall 111 of the flange 141 seals the gap between the isolation sleeve 12 and the flange 141. This seal, achieved through the flange 141 and the isolation sleeve 12, isolates the internal vacuum environment of the heating chamber 11 from the external atmospheric environment, meeting the characteristics and process requirements of PECVD silicon wafer deposition. This allows the silicon wafer to be heated in a vacuum environment, ensuring the effective deposition of the silicon wafer. Furthermore, the flange 141 also provides some support for the isolation sleeve 12.

[0070] The first support 142 is located at the end of the isolation sleeve 12 outside the heating cavity 11, and is connected to both the isolation sleeve 12 and the heater 13 to position them and prevent relative displacement between them. The first support 142 also ensures that the heater 13 and the isolation sleeve 12 remain in a non-contact state, allowing the heat from the heater 13 to dissipate relatively evenly and preventing contact from affecting the heating process.

[0071] Furthermore, such as Figure 4 and Figure 8 As shown, the connecting assembly 14 also includes a third pipe clamp 145, a second bracket 146, and a support block 147. The third pipe clamp 145 is sleeved on the isolation sleeve 12 and located between the flange 141 and the first bracket 142; the third pipe clamp 145 clamps the isolation sleeve 12, and the end of the third pipe clamp 145 near the flange 141 abuts against the flange 141, so that the flange 141 forms an axial limit on the third pipe clamp 145 and the isolation sleeve 12, preventing the isolation sleeve 12 from moving axially into the heating cavity 11 under atmospheric pressure, which helps to keep the isolation sleeve 12 stable.

[0072] The second support 146 is disposed inside the heating cavity 11. The bottom of the second support 146 is connected to the bottom wall 112 of the heating cavity 11 for fixation, and the top of the second support 146 is connected to the isolation sleeve 12 to serve as a support point to support the isolation sleeve 12, thereby counteracting the weight of the isolation sleeve 12 and reducing the bending moment borne by the isolation sleeve 12, which is beneficial to further improving the stability of the isolation sleeve 12. The top of the second support 146 can be an arc-shaped structure to match the shape of the isolation sleeve 12; furthermore, the arc-shaped structure can be adjusted in size to clamp the isolation sleeve 12 and prevent it from shaking.

[0073] The isolation sleeve 12 is also provided with a support block 147 located below the heater 13; the part of the heater 13 located inside the isolation sleeve 12 rests on the support block 147 to provide support for the heater 13, which can counteract the effect of the heater 13's own weight, reduce the bending moment borne by the heater 13, prevent the heater 13 from tilting, and help improve the stability of the heater 13.

[0074] Example 4

[0075] This embodiment provides a heating cavity structure 1, which is a further improvement on the third embodiment.

[0076] like Figure 9 and Figure 10As shown, the first bracket 142 includes a first pipe clamp 1421, a second pipe clamp 1431, and a connecting plate 1441. The first pipe clamp 1421 specifically includes a first clamping part 1422 and a first adjusting part 1423. The first clamping part 1422 is sleeved on the isolation sleeve 12, and the first adjusting part 1423 is connected to the first clamping part 1422 to adjust the size of the first clamping part 1422 so that the first clamping part 1422 clamps the isolation sleeve 12, thereby improving the stability of clamping the isolation sleeve 12. The second pipe clamp 1431 includes a second clamping part 1432 and a second adjusting part 1433. The second clamping part 1432 is sleeved on the heater 13, and the second adjusting part 1433 is connected to the second clamping part 1432 to adjust the size of the second clamping part 1432 so that the second clamping part 1432 clamps the heater 13, thereby improving the stability of clamping the heater 13. The connecting plate 1441 is fixedly connected to the bottom of both the first clamping part 1422 and the bottom of the second clamping part 1432 to support the first clamping part 1422 and the second clamping part 1432, while connecting the first clamping part 1422 and the second clamping part 1432 into a whole, and positioning the first clamping part 1422 and the second clamping part 1432 to prevent relative displacement between the first clamping part 1422 and the second clamping part 1432.

[0077] Furthermore, such as Figure 10 and Figure 11 As shown, the first clamping part 1422 includes two first arc-shaped plates 1424 and a first groove-shaped structure 1425, and the first adjusting part 1423 includes a first locking bolt 1426. Correspondingly, the second clamping part 1432 includes two second arc-shaped plates 1434 and a second groove-shaped structure 1435, and the second adjusting part 1433 includes a second locking bolt 1436.

[0078] Specifically, the top of the first groove structure 1425 is open, and the two side walls 111 of the first groove structure 1425 are respectively connected to the bottom of the two first arc-shaped plates 1424 to support the first arc-shaped plates 1424; the open sides of the two first arc-shaped plates 1424 are opposite to each other to match the shape of the isolation sleeve 12, and the two first arc-shaped plates 1424 are close to the outer surface of the isolation sleeve 12 to clamp the isolation sleeve 12; the first locking bolt 1426 passes through the two side walls 111 of the first groove structure 1425, and the distance between the two first arc-shaped plates 1424 can be adjusted by tightening and loosening the first locking bolt 1426; when the first locking bolt 1426 is tightened, the two first arc-shaped plates 1424 move towards each other under pressure to clamp the isolation sleeve 12. Similarly, the top of the second groove structure 1435 is open, and the two side walls 111 of the second groove structure 1435 are respectively connected to the top of the two second arc-shaped plates 1434 to support the second arc-shaped plates 1434; the open sides of the two arc-shaped plates are opposite each other to match the shape of the heater 13, and the two second arc-shaped plates 1434 are close to the outer surface of the heater 13 to clamp the heater 13; the second locking bolt 1436 passes through the two side walls 111 of the second groove structure 1435, and the distance between the two second arc-shaped plates 1434 is adjusted by tightening and loosening the second locking bolt 1436; when the second locking bolt 1436 is tightened, the two second arc-shaped plates 1434 move towards each other under pressure to clamp the heater 13. One end of the connecting plate 1441 is fixedly connected to the base plate of the first channel-shaped structure 1425 by a fixing bolt 1442, and the other end of the connecting plate 1441 is fixedly connected to the base plate of the second channel-shaped structure 1435 by another fixing bolt 1442. The connecting plate 1441 realizes the connection and positioning between the first clamping part 1422 and the second clamping part 1432. The height of the second frame structure is smaller than that of the first frame structure. A pad 1437 is provided between the connecting plate 1441 and the base plate of the second channel-shaped structure 1435 to ensure that the second frame structure conforms to the assembly height. When both the isolation sleeve 12 and the heater 13 are clamped, the isolation sleeve 12 and the heater 13 are coaxial, so that the radial distance between the heater 13 and the isolation sleeve 12 is the same, which allows the heat from the heater 13 to be distributed more evenly, thus improving the heating effect.

[0079] Example 5

[0080] This embodiment provides a heating cavity structure 1, which is a further improvement on the first embodiment.

[0081] like Figure 12 and Figure 13As shown, the sidewall 111 of the heating chamber 11 is provided with a cooling pipe 15, which includes a cooling pipe 151 and a connecting pipe 152. Multiple cooling pipes 151 are formed within the sidewall 111 of the heating chamber 11, and the cooling pipes 151 are spaced apart in the height direction. Each cooling pipe 151 has a cooling port 155 at both ends, which passes through the sidewall 111 and communicates with the outside. Both ends of the cooling pipe 151 are provided with plugs 156 along the axial direction. The connecting pipe 152 is located on the outer surface of the sidewall 111, and each connecting pipe 152 is connected to the cooling port 155 of a different cooling pipe 151. Thus, multiple cooling pipes 151 are connected end-to-end through multiple connecting pipes 152, forming a continuous cooling pipe 15 to provide flow space for the coolant, thereby cooling the heating chamber 11 through the flow of the coolant. The cooling ports 155 located at both ends of the cooling pipe 15 serve as the coolant inlet 153 and the coolant outlet 154, respectively, to facilitate connection of the supply pipe and the drain pipe.

[0082] Furthermore, the cooling pipes 15 in two adjacent sidewalls 111 can also be connected to each other through connecting pipes 152, so that the cooling pipes 15 in different sidewalls 111 form a whole and share a coolant inlet 153 and a coolant outlet 154.

[0083] Example 6

[0084] This embodiment provides a heating cavity structure 1, which is a further improvement on the first embodiment.

[0085] like Figure 1 and Figure 2 As shown, the heating cavity 11 is also equipped with a side heat insulation plate 161, a heat insulation plate 162, an upper heat insulation plate 163, and a lower heat insulation plate 164 to provide heat insulation and heat preservation, thereby reducing heat loss within the heating cavity 11. Specifically, the side heat insulation plate 161 is located near the side wall 111 of the heating cavity 11, and the heat insulation plate 162 is located on the side of the side heat insulation plate 161 facing away from the side wall 111 of the heating cavity 11. From the outside to the inside, the sequence is: side wall 111, side heat insulation plate 161, and heat insulation plate 162. Each side wall 111 is provided with two side heat insulation plates 161, and both the side heat insulation plate 161 and the heat insulation plate 162 are arranged parallel to the corresponding side wall 111 to enhance the heat insulation effect.

[0086] like Figure 4As shown, the side heat insulation plate 161 and the insulation plate 162 can be fixed by the support column 165. Spacers 166 are provided between adjacent side heat insulation plates 161 and between side heat insulation plates 161 and insulation plates 162. The spacers 166 are fitted onto the support column 165 to maintain a distance between adjacent side heat insulation plates 161 and between side heat insulation plates 161 and insulation plates 162. The upper heat insulation plate 163 is located at the top of the heating cavity 11 and connected to the top cover 113; the lower heat insulation plate 164 is located at the bottom of the heating cavity 11 and connected to the bottom wall 112. The upper heat insulation plate 163 is parallel to the top cover 113 of the heating cavity 11, and the lower heat insulation plate 164 is parallel to the bottom wall 112 of the heating cavity 11. The upper heat insulation plate 163 and the lower heat insulation plate 164 respectively insulate the top and bottom of the heating cavity 11, further reducing heat loss.

[0087] Example 7

[0088] This embodiment provides a heating cavity structure 1, which is a further improvement on the first embodiment.

[0089] like Figure 4 and Figure 14 As shown, the heating cavity 11 is provided with two inlet and outlet channels 114, which are respectively on two opposite side walls 111 of the heating cavity 11, so as to facilitate the entry and exit of the silicon wafer carrier 2 into and out of the heating cavity 11, and to transport the silicon wafer through the silicon wafer carrier 2; one inlet and outlet channel 114 serves as the inlet and the other inlet and outlet channel 114 serves as the outlet. The silicon wafer carrier 2 enters the heating cavity 11 through the inlet and leaves the heating cavity 11 through the outlet after heating is completed.

[0090] Two roller mechanisms 17 are provided inside the heating chamber 11, respectively located on both sides of the path through which the silicon wafer carrier 2 enters and exits the heating chamber 11. After the silicon wafer carrier 2 enters the heating chamber 11, it is placed on the roller mechanism 17. The roller mechanism 17 supports the silicon wafer carrier 2 and conveys it from the inlet to the outlet through the rotation of the rollers. The multiple rollers on each roller mechanism 17 are evenly spaced, and the two roller mechanisms 17 are symmetrically arranged, which helps to improve the stability of the silicon wafer carrier 2 during the conveying process.

[0091] Example 8

[0092] This embodiment provides a heating cavity structure 1 for silicon wafer processing equipment. The heating cavity structure 1 includes a heating cavity body 11, an isolation sleeve 12, a heater 13, and a connecting assembly 14.

[0093] like Figures 1 to 4As shown, the heating chamber 11, as the main body of the heating chamber structure 1, is used to provide a vacuum environment for the silicon wafer heating operation. The heating chamber 11 can be an integral structure or a split structure with a top cover 113. In the working state, the top cover 113 seals the top of the heating chamber 11, forming a vacuum chamber inside the heating chamber 11. A through hole 1121 is provided on the side wall 111 of the heating chamber 11 near the bottom. The isolation sleeve 12 extends into the heating chamber 11 through the through hole 1121 on the side wall 111, with one end of the isolation sleeve 12 located outside the heating chamber 11 to communicate with the external atmosphere. The heating part of the heater 13 extends into the isolation sleeve 12, forming a nested structure with the isolation sleeve 12. One end of the heater 13 has a lead wire 131 extending from the end of the isolation sleeve 12 located outside the heating chamber 11 to facilitate wiring and power supply to the heater 13.

[0094] The isolation sleeve 12 is specifically a quartz sleeve. Quartz sleeves have a low coefficient of thermal expansion, high temperature resistance, good chemical stability, electrical insulation, and light transmittance. The heater 13 is specifically a tubular infrared heater. The infrared rays generated by the infrared heater can penetrate the quartz sleeve and radiate outwards. It has strong thermal conductivity, enabling rapid heating of the silicon wafer and rapid cooling after heating, which improves heating efficiency and ease of use. Multiple isolation sleeves 12 are used, with one infrared heater nested within each isolation sleeve 12 to further increase the heating area and improve heating efficiency. The multiple isolation sleeves 12 are evenly spaced along the width of the heating cavity 11, allowing the heat generated by the multiple infrared heaters to be evenly distributed, which is beneficial for achieving uniform heating of the silicon wafer.

[0095] The connecting assembly 14 is used to fix the isolation sleeve 12 and the heater 13. Through the cooperation of the connecting assembly 14 and the isolation sleeve 12, the interior of the heating chamber 11 can be isolated from the external atmosphere, and the heater 13 can be isolated from the vacuum chamber inside the heating chamber 11. During operation, the silicon wafer enters the vacuum chamber of the heating chamber 11 along with the silicon wafer carrier 2, and the heater 13 is energized to generate heat, thereby realizing the vacuum heating of the silicon wafer.

[0096] like Figures 1 to 8As shown, the connecting assembly 14 includes a flange 141, a first bracket 142, a third pipe clamp 145, a second bracket 146, and a support block 147. The flange 141 is located at a through hole 1121 on the side wall 111, and is fitted onto the isolation sleeve 12, which extends through the flange 141 into the heating chamber 11. A sealing structure (e.g., a sealing ring or sealing gasket) on the inner side wall 111 of the flange 141 seals the gap between the isolation sleeve 12 and the flange 141. This seal, achieved through the flange 141 and the isolation sleeve 12, isolates the internal vacuum environment of the heating chamber 11 from the external atmospheric environment, meeting the characteristics and process requirements of PECVD silicon wafer deposition. This allows the silicon wafer to be heated in a vacuum environment, ensuring the deposition effect. Furthermore, the flange 141 also provides some support for the isolation sleeve 12.

[0097] The first support 142 is located at the end of the isolation sleeve 12 outside the heating cavity 11, and is connected to both the isolation sleeve 12 and the heater 13 to position them and prevent relative displacement between them. The first support 142 also ensures that the heater 13 and the isolation sleeve 12 remain in a non-contact state, allowing the heat from the heater 13 to dissipate relatively evenly and preventing contact from affecting the heating process.

[0098] Specifically, such as Figures 9 to 11 As shown, the first bracket 142 includes a first pipe clamp 1421, a second pipe clamp 1431, and a connecting plate 1441. The first pipe clamp 1421 specifically includes a first clamping part 1422 and a first adjusting part 1423. The first clamping part 1422 is sleeved on the isolation sleeve 12, and the first adjusting part 1423 is connected to the first clamping part 1422 to adjust the size of the first clamping part 1422 so that the first clamping part 1422 clamps the isolation sleeve 12, thereby improving the stability of clamping the isolation sleeve 12. The second pipe clamp 1431 includes a second clamping part 1432 and a second adjusting part 1433. The second clamping part 1432 is sleeved on the heater 13, and the second adjusting part 1433 is connected to the second clamping part 1432 to adjust the size of the second clamping part 1432 so that the second clamping part 1432 clamps the heater 13, thereby improving the stability of clamping the heater 13. The connecting plate 1441 is fixedly connected to the bottom of both the first clamping part 1422 and the bottom of the second clamping part 1432 to support the first clamping part 1422 and the second clamping part 1432, while connecting the first clamping part 1422 and the second clamping part 1432 into a whole, and positioning the first clamping part 1422 and the second clamping part 1432 to prevent relative displacement between the first clamping part 1422 and the second clamping part 1432.

[0099] The first clamping part 1422 includes two first arc-shaped plates 1424 and a first groove-shaped structure 1425, and the first adjusting part 1423 includes a first locking bolt 1426. Correspondingly, the second clamping part 1432 includes two second arc-shaped plates 1434 and a second groove-shaped structure 1435, and the second adjusting part 1433 includes a second locking bolt 1436. The top of the first groove structure 1425 is open, and the two side walls 111 of the first groove structure 1425 are respectively connected to the bottom of the two first arc-shaped plates 1424 to support the first arc-shaped plates 1424; the open sides of the two first arc-shaped plates 1424 are opposite to each other to match the shape of the isolation sleeve 12, and the two first arc-shaped plates 1424 are close to the outer surface of the isolation sleeve 12 to clamp the isolation sleeve 12; the first locking bolt 1426 passes through the two side walls 111 of the first groove structure 1425, and the distance between the two first arc-shaped plates 1424 can be adjusted by tightening and loosening the first locking bolt 1426; when the first locking bolt 1426 is tightened, the two first arc-shaped plates 1424 move towards each other under pressure to clamp the isolation sleeve 12. Similarly, the top of the second groove structure 1435 is open, and the two side walls 111 of the second groove structure 1435 are respectively connected to the top of the two second arc-shaped plates 1434 to support the second arc-shaped plates 1434; the open sides of the two arc-shaped plates are opposite each other to match the shape of the heater 13, and the two second arc-shaped plates 1434 are close to the outer surface of the heater 13 to clamp the heater 13; the second locking bolt 1436 passes through the two side walls 111 of the second groove structure 1435, and the distance between the two second arc-shaped plates 1434 is adjusted by tightening and loosening the second locking bolt 1436; when the second locking bolt 1436 is tightened, the two second arc-shaped plates 1434 move towards each other under pressure to clamp the heater 13. One end of the connecting plate 1441 is fixedly connected to the base plate of the first channel-shaped structure 1425 by a fixing bolt 1442, and the other end of the connecting plate 1441 is fixedly connected to the base plate of the second channel-shaped structure 1435 by another fixing bolt 1442. The connecting plate 1441 realizes the connection and positioning between the first clamping part 1422 and the second clamping part 1432. The height of the second frame structure is smaller than that of the first frame structure. A pad 1437 is provided between the connecting plate 1441 and the base plate of the second channel-shaped structure 1435 to ensure that the second frame structure conforms to the assembly height. When both the isolation sleeve 12 and the heater 13 are clamped, the isolation sleeve 12 and the heater 13 are coaxial, so that the radial distance between the heater 13 and the isolation sleeve 12 is the same, which allows the heat from the heater 13 to be distributed more evenly, thus improving the heating effect.

[0100] The third pipe clamp 145 is sleeved on the isolation sleeve 12 and located between the flange 141 and the first support 142. The third pipe clamp 145 clamps the isolation sleeve 12, and the end of the third pipe clamp 145 near the flange 141 abuts against the flange 141, so that the flange 141 forms an axial limit on the third pipe clamp 145 and the isolation sleeve 12, preventing the isolation sleeve 12 from moving into the heating cavity 11 in the axial direction under atmospheric pressure, which helps to keep the isolation sleeve 12 stable.

[0101] The second support 146 is disposed inside the heating cavity 11. The bottom of the second support 146 is connected to the bottom wall 112 of the heating cavity 11 for fixation, and the top of the second support 146 is connected to the isolation sleeve 12 to serve as a support point to support the isolation sleeve 12, thereby counteracting the weight of the isolation sleeve 12 and reducing the bending moment borne by the isolation sleeve 12, which is beneficial to further improving the stability of the isolation sleeve 12. The top of the second support 146 can be an arc-shaped structure to match the shape of the isolation sleeve 12; furthermore, the arc-shaped structure can be adjusted in size to clamp the isolation sleeve 12 and prevent it from shaking.

[0102] The support block 147 is located inside the isolation sleeve 12 and below the heater 13. The part of the heater 13 inside the isolation sleeve 12 rests on the support block 147 to provide support for the heater 13, which can counteract the weight of the heater 13, reduce the bending moment borne by the heater 13, prevent the heater 13 from tilting, and improve the stability of the heater 13.

[0103] like Figure 1 and Figure 2 As shown, the heating cavity 11 is also equipped with a side heat insulation plate 161, a heat insulation plate 162, an upper heat insulation plate 163, and a lower heat insulation plate 164 to provide heat insulation and heat preservation, thereby reducing heat loss within the heating cavity 11. Specifically, the side heat insulation plate 161 is located near the side wall 111 of the heating cavity 11, and the heat insulation plate 162 is located on the side of the side heat insulation plate 161 facing away from the side wall 111 of the heating cavity 11. From the outside to the inside, the sequence is: side wall 111, side heat insulation plate 161, and heat insulation plate 162. Each side wall 111 has two corresponding side heat insulation plates 161, and both the side heat insulation plate 161 and the heat insulation plate 162 are arranged parallel to the corresponding side wall 111 to enhance the heat insulation effect. Figure 4As shown, the side heat insulation plate 161 and the insulation plate 162 can be fixed by the support column 165. Spacers 166 are provided between adjacent side heat insulation plates 161 and between side heat insulation plates 161 and insulation plates 162. The spacers 166 are fitted onto the support column 165 to maintain a distance between adjacent side heat insulation plates 161 and between side heat insulation plates 161 and insulation plates 162. The upper heat insulation plate 163 is located at the top of the heating cavity 11 and connected to the top cover 113; the lower heat insulation plate 164 is located at the bottom of the heating cavity 11 and connected to the bottom wall 112. The upper heat insulation plate 163 is parallel to the top cover 113 of the heating cavity 11, and the lower heat insulation plate 164 is parallel to the bottom wall 112 of the heating cavity 11. The upper heat insulation plate 163 and the lower heat insulation plate 164 respectively insulate the top and bottom of the heating cavity 11, further reducing heat loss.

[0104] like Figure 12 and Figure 13 As shown, the sidewall 111 of the heating chamber 11 is provided with a cooling pipe 15, which includes a cooling pipe 151 and a connecting pipe 152. Multiple cooling pipes 151 are formed within the sidewall 111 of the heating chamber 11, and the cooling pipes 151 are spaced apart in the height direction. Each cooling pipe 151 has a cooling port 155 at both ends, which passes through the sidewall 111 and communicates with the outside. Both ends of the cooling pipe 151 are provided with plugs 156 along the axial direction. The connecting pipe 152 is located on the outer surface of the sidewall 111, and each connecting pipe 152 is connected to the cooling port 155 of a different cooling pipe 151. Thus, multiple cooling pipes 151 are connected end-to-end through multiple connecting pipes 152, forming a continuous cooling pipe 15 to provide flow space for the coolant, thereby cooling the heating chamber 11 through the flow of the coolant. The cooling ports 155 located at both ends of the cooling pipe 15 serve as the coolant inlet 153 and the coolant outlet 154, respectively, to facilitate connection of the supply pipe and the drain pipe.

[0105] like Figure 4 and Figure 14As shown, the heating chamber 11 has two inlet / outlet channels 114, located on opposite side walls 111 of the heating chamber 11, to facilitate the entry and exit of the silicon wafer carrier 2 and the transport of silicon wafers via the silicon wafer carrier 2. One inlet / outlet channel 114 serves as the inlet, and the other as the outlet. The silicon wafer carrier 2 enters the heating chamber 11 through the inlet and exits through the outlet after heating. The heating chamber 11 contains two roller mechanisms 17, located on either side of the path through which the silicon wafer carrier 2 enters and exits the heating chamber 11. After the silicon wafer carrier 2 enters the heating chamber 11, it is placed on the roller mechanism 17. The roller mechanism 17 supports the silicon wafer carrier 2 and transports it from the inlet to the outlet through the rotation of the rollers. The multiple rollers on each roller mechanism 17 are arranged at equal intervals, and the two roller mechanisms 17 are arranged symmetrically, which helps to improve the stability of the silicon wafer carrier 2 during the transmission process.

[0106] In this embodiment, the heating cavity structure 1 and the heating cavity 11 achieve isolation between the internal vacuum environment and the external atmospheric environment through the cooperation of the isolation sleeve 12 and the connecting component 14. This allows the lead wire 131 of the heater 13 to be wired in the atmospheric environment, effectively alleviating the discharge phenomenon of high voltage body to low voltage body, increasing the operating voltage, reducing the current carried by the cable, thereby reducing the wiring burden of the heater 13, and helping to reduce the difficulty and cost of wiring operation.

[0107] Example 9

[0108] This embodiment provides a silicon wafer processing device 3, including a loading cavity 31, a vacuum device 32, a heating cavity structure 1 as described in any of the above embodiments, and a process cavity 33, for performing PECVD coating on silicon wafers.

[0109] like Figure 1 , Figure 2 and Figure 15 As shown, a transfer valve 311 is provided at one end of the loading cavity 31 for inputting the silicon wafer carrier 2, and a vacuum valve 312 is provided at the other end of the loading cavity 31; both the transfer valve 311 and the vacuum valve 312 can open or close the loading cavity 31. The heating cavity 11 of the heating cavity structure 1 is connected to the end of the loading cavity 31 equipped with the vacuum valve 312, and the heating cavity 11 can communicate with the loading cavity 31 through the vacuum valve 312. The process cavity 33 is connected to the end of the heating cavity 11 away from the loading cavity 31, and is used for performing coating processes on the silicon wafer. The vacuum pumping device 32 is connected to the loading cavity 31, the heating cavity 11, and the process cavity 33 respectively, and is used to perform vacuum operations on any of the above-mentioned chambers as needed when the silicon wafer processing equipment 3 is working.

[0110] Initially, the heating chamber 11 is in a vacuum environment, the vacuum valve 312 is closed, and the heating chamber 11 is isolated from the loading chamber 31. During production, the silicon wafer processing equipment 3 operates according to the following process: the transfer valve 311 opens, and the silicon wafer carrier 2 loaded with silicon wafers enters the loading chamber 31 through the transfer valve 311; the transfer valve 311 closes, isolating the loading chamber 31 from the outside atmosphere; the vacuum pump 32 is activated, creating a vacuum environment within the loading chamber 31; the vacuum valve 312 opens, and the silicon wafer carrier 2 carries the silicon wafer through the vacuum valve 312 into the heating chamber 11; the vacuum valve 312 closes, the heater 13 is activated, and the silicon wafer is vacuum-heated to raise its temperature to the temperature required for the coating process; the heater 13 closes, and the silicon wafer carrier 2 carries the silicon wafer into the process chamber 33 for coating processing.

[0111] In another implementation of this embodiment, the loading cavity 31 of the silicon wafer processing device 3 can also use the heating cavity structure 1 in any of the above embodiments. That is, the silicon wafer processing device 3 includes two heating cavity structures 1, wherein the first heating cavity structure 1 serves as the loading cavity 31 and the second heating cavity structure 1 serves as the heating function. There is no need to specially design and process the loading cavity 31, which can enhance the versatility of the heating cavity structure 1.

[0112] In the third implementation of this embodiment, the heating cavity structure 1 in any of the above embodiments can be used instead of the loading cavity 31, serving the functions of both loading and heating.

[0113] Furthermore, the silicon wafer processing equipment 3 in this embodiment also has all the beneficial effects of the heating cavity structure 1 in any of the above embodiments, which will not be repeated here.

[0114] The technical solutions of some embodiments of the present invention have been described in detail above with reference to the accompanying drawings. The heating chamber structure achieves isolation between the internal vacuum environment and the external atmospheric environment through the cooperation of the isolation sleeve and the connecting component, so that the heater lead can be wired in the atmospheric environment. This effectively alleviates the discharge phenomenon of high voltage body to low voltage body, can improve the operating voltage, reduce the current carried by the cable, thereby reducing the wiring burden of the heater and helping to reduce the difficulty and cost of wiring operation.

[0115] In embodiments of the present invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise expressly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in embodiments of the present invention according to the specific circumstances.

[0116] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the technical solutions of this application.

[0117] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0118] The above are merely preferred embodiments of the present invention and are not intended to limit the technical solutions of this application. For those skilled in the art, the technical solutions of this application can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the technical solutions of this application should be included within the protection scope of this application.

Claims

1. A heating chamber structure (1), characterized in that The utility model relates to a heating cavity (11) for providing vacuum environment, the side wall (111) of heating cavity (11) is equipped with through -hole (1121), the isolation sleeve pipe (12) is by through -hole (1121) into heating cavity (11) inside, and at least one end of isolation sleeve pipe (12) is located outside heating cavity (11), the heating part of heater (13) is equipped in isolation sleeve pipe (12), and the lead end of heater (13) is by the end of isolation sleeve pipe (12) outside heating cavity (11) and stretches out, connecting assembly (14) is used for fixing isolation sleeve pipe (12) and heater (13), wherein isolation sleeve pipe (12) and connecting assembly (14) make the inside of heating cavity (11) with heater (13) and outside atmosphere isolation, connecting assembly (14) includes: Flange plate (141) is equipped with at through -hole (1121) and is connected with the side wall (111) of heating cavity (11), and flange plate (141) is set up on isolation sleeve pipe (12), and the inner side wall (111) of flange plate (141) is equipped with sealing structure to seal through -hole (1121), First support (142) is equipped with at one end of isolation sleeve pipe (12) outside heating cavity (11), and first support (142) is connected with isolation sleeve pipe (12) and heater (13) respectively to position isolation sleeve pipe (12) and heater (13) and make heater (13) and isolation sleeve pipe (12) between keep non -contact state, First support (142) includes: First pipe clamp (1421) includes first clamping part (1422) and first adjustment part (1423), and first clamping part (1422) is set up on isolation sleeve pipe (12), and first adjustment part (1423) is used for adjusting the size of first clamping part (1422) to make first clamping part (1422) clamp isolation sleeve pipe (12), Second pipe clamp (1431) includes second clamping part (1432) and second adjustment part (1433), and second clamping part (1432) is set up on heater (13), and second adjustment part (1433) is used for adjusting the size of second clamping part (1432) to make second clamping part (1432) clamp heater (13), Connecting plate (1441) is fixedly connected with the bottom of first clamping part (1422) and the bottom of second clamping part (1432) respectively to position first clamping part (1422) and second clamping part (1432). ​ ​ ​ ​ ​ ​ The first clamping part (1422) comprises two oppositely arranged first arc-shaped plates (1424) and a first groove-shaped structure (1425), the first adjusting part (1423) comprises a first locking bolt (1426), the first groove-shaped structure (1425) is arranged at the bottom of the two first arc-shaped plates (1424), the two side plates of the first groove-shaped structure (1425) are connected with the two first arc-shaped plates (1424) respectively, and the first locking bolt (1426) penetrates through the two side plates of the first groove-shaped structure (1425) and is used to adjust the spacing between the two first arc-shaped plates (1424) so that the two first arc-shaped plates (1424) clamp the isolation sleeve (12); The second clamping part (1432) comprises two oppositely arranged second arc-shaped plates (1434) and a second groove-shaped structure (1435), the second adjusting part (1433) comprises a second locking bolt (1436), the second groove-shaped structure (1435) is arranged at the bottom of the two second arc-shaped plates (1434), the two side plates of the second groove-shaped structure (1435) are connected with the two second arc-shaped plates (1434) respectively, and the second locking bolt (1436) penetrates through the two side plates of the second groove-shaped structure (1435) and is used to adjust the spacing between the two second arc-shaped plates (1434) so that the two second arc-shaped plates (1434) clamp the heater (13); The connecting plate (1441) is fixedly connected with the bottom plate of the first groove-shaped structure (1425) and the bottom plate of the second groove-shaped structure (1435) through fixing bolts (1442) respectively; The connecting assembly (14) further comprises: A third pipe clamp (145) is sleeved on the part of the isolation sleeve (12) located outside the heating cavity (11) and clamps the isolation sleeve (12), the third pipe clamp (145) is located between the first support (142) and the flange plate (141), and the end of the third pipe clamp (145) close to the flange plate (141) abuts against the flange plate (141) to axially position the isolation sleeve (12); A second support (146) is arranged in the heating cavity (11), the top of the second support (146) is connected with the isolation sleeve (12), and the bottom of the second support (146) is connected with the bottom wall (112) of the heating cavity (11); A supporting block (147) is arranged in the isolation sleeve (12) and located below the heater (13) to support the part of the heater (13) located in the isolation sleeve (12).

2. The heating chamber structure (1) according to claim 1, characterized in that Further comprising: A plurality of cooling pipes (151) are formed in the side wall (111) of the heating cavity (11), the plurality of cooling pipes (151) are arranged at intervals, and each cooling pipe (151) is provided with cooling ports (155) in communication with the outside at two ends respectively. A plurality of connecting pipes (152) are arranged outside the side wall (111) of the heating cavity (11), and the two ends of each connecting pipe (152) are communicated with two cooling ports (155) to sequentially connect the plurality of cooling pipes (151) and form a cooling pipe (15); The two cooling ports (155) at the head and tail ends of the cooling pipe (15) are respectively used as a cooling liquid inlet (153) and a cooling liquid outlet (154).

3. The heating chamber structure (1) according to claim 1, characterized in that Further comprising: A heat insulation plate is arranged in the heating cavity (11) to insulate the heating cavity (11); A heat preservation plate (162) is arranged in the heating cavity (11) to heat preserve the heating cavity (11).

4. The heating cavity structure (1) according to claim 1, wherein The opposite two side walls (111) of the heating cavity (11) are provided with an access passage (114) for the silicon wafer carrier plate (2) to enter and exit the heating cavity (11); A roller mechanism (17) is arranged in the heating cavity (11), and the roller mechanism (17) is located on both sides of the path of the silicon wafer carrier plate (2) entering and exiting the heating cavity (11) to carry and convey the silicon wafer carrier plate (2).

5. The heating cavity structure (1) according to any one of claims 1 to 4, wherein The isolation sleeve (12) is a quartz sleeve; The heater (13) is a tubular infrared heater; and / or The number of isolation sleeves (12) is multiple, and the multiple isolation sleeves (12) are arranged at equal intervals along the width direction of the heating cavity (11), and one heater (13) is arranged in each isolation sleeve (12).

6. A silicon wafer processing apparatus (3), characterized by Comprising: A loading cavity (31) is provided with a transmission valve (311) at one end and a vacuum valve (312) at the other end, and the transmission valve (311) and the vacuum valve (312) can open or close the loading cavity (31); The heating cavity (11) of the heating cavity structure (1) is connected to one end of the loading cavity (31) provided with the vacuum valve (312), and can communicate with the loading cavity (31) through the vacuum valve (312) to heat the silicon wafer entering the heating cavity (11) from the loading cavity (31); A process cavity (33) is connected to the end of the heating cavity (11) away from the loading cavity (31) to perform a film plating process on the silicon wafer entering the process cavity (33) from the heating cavity (11); A vacuum pumping device (32) is connected to the loading cavity (31), the heating cavity structure (1), and the process cavity (33) to perform vacuum pumping operation.

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