A high energy micro focus X-ray production equipment

Abstract

The present invention discloses a high-energy micro-focus X-ray production device, comprising an electron source component for generating a high-energy electron beam and a rotating target device for being bombarded by the electron beam to generate high-energy X-rays, wherein the high-energy focused electron beam generated by the electron source component bombards the rotating target device to generate high-energy micro-focus X-rays. The present application adopts a specific electron source and a linear accelerator to provide an electron beam with a long macro pulse and a high average current intensity, and then focuses the long macro pulse and high average current intensity electron beam to a relatively small size at a target position through the focusing of a solenoid and a strong focusing quadrupole lens group, and accurately measures and controls the electron beam lateral size through a beam spot measurement component, and controls the beam spot size to less than 0.1 mm, thereby achieving the purpose of outputting high-energy micro-focus X-rays.

Description

Technical Field

[0001] The invention belongs to the field of radiation devices, and in particular relates to a high-energy micro-focus X-ray production device. Background Art

[0002] Industrial Computed Tomography (ICT) is an optimal non-destructive testing method. It can intuitively display the internal structure information of an object, locate defects and measure spatial dimensions. It is widely used in non-destructive testing, non-destructive evaluation and reverse engineering in aerospace, aviation, nuclear power, metallurgy, machinery, electronics, construction and petrochemical industries.

[0003] X-ray sources are the core components of industrial CT imaging, mainly low-energy micro-focus sources, conventional X-ray tube sources and traditional high-energy accelerator sources. Electron beams are used to accelerate the target in an electric field, and the bremsstrahlung is converted into X-rays. Low-energy micro-focus sources (voltage <300kV) have a small focus size and high resolution, but low ray energy and low penetration ability, and are often used for the detection of small non-metallic workpieces. Conventional X-ray tube sources have low energy (up to 600kV) and limited penetration ability, up to 80mm equivalent steel, which limits the detection of large equipment and high-density materials. Traditional high-energy accelerator sources have large focus sizes (about 2.0mm) and low imaging resolution, which is not conducive to the detection of tiny details.

[0004] X-ray detection in the fields of aviation, aerospace, high-end equipment, nuclear power, reactors, cultural relics, etc. requires high-energy radiation sources, high detection resolution, and fast detection speed, and urgently needs high-energy microfocus radiation sources.

[0005] Therefore, the prior art needs to be further developed and improved. Summary of the invention

[0006] In view of the various deficiencies of the prior art and in order to solve the above problems, a high-energy micro-focus X-ray production device is now proposed. The present invention provides the following technical solutions:

[0007] A high-energy micro-focus X-ray production device comprises an electron source assembly for generating a high-energy electron beam and a rotating target device for being bombarded by the electron beam to generate high-energy X-rays. The high-energy focused electron beam generated by the electron source assembly bombards the rotating target device to generate high-energy micro-focus X-rays.

[0008] Furthermore, the electron source assembly includes an electron source for generating an electron beam, a focusing assembly for focusing the electron beam, and a linear accelerator for increasing the energy of the electron beam. The electron beam generated by the electron source is accelerated by the linear accelerator and focused by the focusing assembly, and then bombards the rotating target to generate high-energy microfocus X-rays.

[0009] Furthermore, the focusing assembly includes a solenoid disposed between the electron source and the linear accelerator.

[0010] Furthermore, the focusing assembly includes a strong focusing quadrupole lens group arranged between the linear accelerator and the rotating target.

[0011] Furthermore, the linear accelerator includes a superconducting linear accelerator, a room temperature microwave linear accelerator, or a photocathode DC high voltage electron gun.

[0012] Furthermore, the electron source includes a photocathode microwave electron gun or a cold cathode microwave electron gun.

[0013] Furthermore, the rotating target device includes a rotating target for dispersing electron beam target energy and a beam spot measurement component for measuring the size of the electron beam spot. The rotating target and the beam spot measurement component can move relative to each other so that the electron beam forms a beam spot at the same position of the rotating target and the beam spot measurement component.

[0014] Furthermore, the beam spot measurement assembly includes a beam spot measurement target for forming a beam spot, a measurement assembly for measuring the size of the beam spot, and a vertical movement assembly for limiting the position of the beam spot measurement target, and the beam spot measurement target and the measurement assembly are fixed below the vertical movement assembly.

[0015] Furthermore, the measuring component includes a reflector and an imaging camera, the reflector forms an angle of 45 degrees with the beam spot measurement target, the imaging camera forms an angle of 45 degrees with the reflector, and the imaging camera is perpendicular to the beam spot measurement target.

[0016] Furthermore, the rotating target includes a target plate bombarded by an electron beam to generate X-rays, a horizontal moving component for moving the target plate back and forth, and a rotating component for rotating the target plate. The center of the target plate is fixed on the output shaft of the rotating component, and the rotating component is fixed on the horizontal moving component.

[0017] Beneficial effects:

[0018] The high-energy micro-focus accelerator involved in this application increases the energy of the electron beam and reduces the size of the electron beam focus, which can effectively overcome the contradiction that the current ray source cannot take into account both high ray energy and small focus size, and meet the urgent detection needs of industrial CT systems in high-end precision equipment. A specific electron source and a linear accelerator are used to provide a long macro pulse high average current electron beam, and then through the focusing of a solenoid and a strong focusing quadrupole lens group, the lateral size of the long macro pulse high average current electron beam is focused to a relatively small size at the target position, and the lateral size of the electron beam is accurately measured and controlled through a beam spot measurement component, and the beam spot size is controlled to be below 0.1mm, so as to achieve the purpose of high-energy micro-focus X-ray output. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of a high-energy micro-focus X-ray production device in a specific embodiment of the present invention;

[0020] Figure 2 is a schematic diagram of the working principle of a photocathode microwave electron gun in a specific embodiment of the present invention;

[0021] Figure 3 is a schematic diagram of the working principle of a cold cathode microwave electron gun in a specific embodiment of the present invention;

[0022] Figure 4 1 is a schematic diagram of the pulse time structure of the driving laser generating the driving laser in a specific embodiment of the present invention;

[0023] Figure 5 2 is a schematic diagram of the structure of a strong focusing quadrupole lens group in a specific embodiment of the present invention;

[0024] Figure 6 It is a schematic diagram of the main view of the internal structure and the extreme position of a rotating target device for generating high-energy micro-focus X-rays in a specific embodiment of the present invention;

[0025] Figure 7 It is a schematic diagram of the internal structure of a rotating target device for generating high-energy micro-focus X-rays in a specific embodiment of the present invention from the right side;

[0026] Figure 8 It is a schematic diagram of a beam spot measurement state of a rotating target device for generating high-energy micro-focus X-rays in a specific embodiment of the present invention;

[0027] Fig. 9 It is a schematic diagram of a target shooting state of a rotating target device for generating high-energy micro-focus X-rays in a specific embodiment of the present invention;

[0028] Fig.10 is a schematic diagram of the measurement state of the measurement component in a specific embodiment of the present invention;

[0029] In the attached figure: 1. horizontal moving component; 2. rotating component; 3. target disk; 4. vertical moving component; 5. beam spot measurement component; 6. vacuum chamber; 7. electron beam; 8. beam spot measurement target; 9. reflector; 10. imaging camera; 11. electron source; 12. solenoid; 13. linear accelerator; 14. strong focusing quadrupole lens group; 15. rotating target device; 16. driving laser; 17. photocathode; 18. microwave electron gun; 19. accelerating electric field; 20. cold cathode. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is clearly and completely described below in conjunction with the accompanying drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by ordinary technicians in this field without making creative work should all fall within the scope of protection of this application. In addition, the directional words mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional words used are used to illustrate rather than limit the invention.

[0031] like Figure 1-10 As shown, a high-energy micro-focus X-ray production device includes an electron source 11 component for generating a high-energy electron beam and a rotating target device 15 for being bombarded by the electron beam 7 to generate high-energy X-rays. The high-energy focused electron beam 7 generated by the electron source 11 component bombards the rotating target device 15 to generate high-energy micro-focus X-rays.

[0032] Furthermore, the electron source 11 assembly includes an electron source 11 for generating an electron beam 7, a focusing assembly for focusing the electron beam 7, and a linear accelerator 13 for increasing the energy of the electron beam 7. The electron beam 7 generated by the electron source 11 is accelerated by the linear accelerator 13 and focused by the focusing assembly, and then bombards the rotating target to generate high-energy micro-focus X-rays. The electron beam 7 is generated by a photocathode microwave electron gun, obtains energy gain in a room temperature microwave linear accelerator, and then obtains a small focal spot through the strong focusing effect of a quadrupole lens group. The micro-focus X-rays are generated through the interaction between the electron beam 7 and the X-ray target. The present method can solve the problem that the traditional industrial X-ray source cannot provide high-energy micro-focus X-rays with a high radiation dose rate.

[0033] Furthermore, the focusing assembly includes a solenoid 12 disposed between the electron source 11 and the linear accelerator 13. The solenoid 12 performs transverse focusing on the electron beam 7 at the outlet of the microwave electron gun 18, constrains the beam spot size of the electron beam 7, and suppresses the growth of the transverse emittance of the electron beam 7. The solenoid 12 performs transverse focusing on the electron beam 7 through the magnetic field force, and then enters the room temperature microwave linear accelerator.

[0034] Furthermore, the focusing assembly includes a strong focusing quadrupole lens group 14 disposed between the linear accelerator 13 and the rotating target. The strong focusing quadrupole lens group 14 is composed of a plurality of quadrupole magnets. The focal length of the quadrupole lens group is relatively short, and strong focusing can be achieved, so that the beam spot size of the high-energy electron beam on the X-ray conversion target is focused to a relatively small size, reaching a micro-focus state of less than 0.1 mm. In this embodiment, the high-energy electron beam with an energy of 13MeV is focused by a group of three-unit quadrupole lens groups, and the beam spot size (full width at half maximum) is less than 0.1 mm at a place about 10 cm behind the lens group.

[0035] Furthermore, the linear accelerator 13 includes a superconducting linear accelerator 13 or a room temperature microwave linear accelerator. The room temperature microwave linear accelerator accelerates the low energy electron beam generated by the electron gun to high energy (the low energy electron beam is an electron beam 7 generated by the electron gun but not accelerated by the room temperature microwave accelerator. In the embodiment, the low energy electron beam energy generated by the microwave electron gun 18 is 2-5 MeV; the high energy electron beam is an electron beam 7 accelerated by the microwave linear accelerator, and the high energy electron beam energy is 9-15 MeV). The room temperature microwave linear accelerator operates in a pulsed working mode and is driven by a pulse power source of the corresponding band. The energy of the electron beam 7 can be continuously adjusted by adjusting the gradient of the linear accelerator 13. The room temperature microwave accelerator includes a standing wave accelerator and a traveling wave accelerator. In this embodiment, a standing wave accelerator with an operating frequency of 1.3 GHz is used.

[0036] Further, the electron source 11 includes a photocathode microwave electron gun or a cold cathode microwave electron gun or a photocathode DC high-voltage electron gun. The photocathode microwave electron gun is composed of a driving laser 16, a photocathode 17 and a microwave electron gun 18. The driving laser 16 generates a driving laser to irradiate the photocathode 17 (metal cathode, semiconductor cathode lamp) of the electron gun, and generates electrons through the photoelectric emission effect. The photocathode 17 of the electron gun can generate a low-energy electron beam with megavolt energy under the irradiation of the driving laser. The pulse time structure of the electron beam 7 can be adjusted according to the requirements of the radiation dose. The cold cathode microwave electron gun is composed of a cold cathode 20 and a microwave electron gun 18. The cold cathode 20 generates electrons under the traction of the microwave field. The microwave electric field in the electron gun draws out the electrons and accelerates them to low-energy electrons with quasi-relativistic energy. Further, the electron source 11 can also be a DC photocathode 17 high-voltage electron gun. The driving laser 16 is used to generate a driving laser. The time structure of the driving laser determines the time structure of the electron beam 7. In this embodiment, the driving laser adopts a macro pulse structure, and each macro pulse contains multiple micro pulse structures. The micro-pulse time dimension is in the order of picoseconds (ps), and the micro-pulse repetition frequency is an integer multiple of the microwave period, which ensures the energy consistency of the generated electron beam 7; the macro-pulse time structure is in the order of microseconds, and the repetition frequency is 10 to 100 Hz. The time structure of the driving laser is as follows Figure 4 As shown. In this embodiment, the driving laser adopts a picosecond laser, and the electron gun adopts an L-band (frequency 1.3GHz) photocathode microwave electron gun. In this embodiment, the photocathode 17 material adopts a cesium telluride semiconductor cathode, and the accelerating electric field 19 is a radio frequency electromagnetic field excited by a microwave power source. The photocathode DC high-voltage electron gun includes a driving laser, a cathode and an anode for emitting laser. An extraction electric field is formed between the cathode and the anode. The laser emitted by the driving laser is incident on the cathode to generate electrons. The electrons move to the anode through the extraction electric field, and then are extracted from the anode to obtain an electron beam.

[0037] Furthermore, the rotating target device 15 includes a rotating target for dispersing the energy of the electron beam 7 for targeting and a beam spot measuring component 5 for measuring the size of the beam spot of the electron beam 7. The rotating target and the beam spot measuring component 5 can move relative to each other so that the electron beam 7 forms a beam spot at the same position of the rotating target and the beam spot measuring component 5. Since high-energy microfocus X-rays require the electron beam to hit the target as concentratedly as possible, the target material needs to be able to withstand local instantaneous high-power bombardment, and ordinary target materials are very easy to melt under instantaneous high-power bombardment conditions. This problem can be well avoided by rotating the target disk 3, and there is no need to replace expensive alternative materials. The target materials used in daily life can well adapt to the focused bombardment of high-power and high-energy electron beams. Therefore, it is necessary to add a rotating mechanism to rotate the target disk 3 on the basis of the original target disk 3. However, since the target disk 3 is constantly rotating, it is impossible to know the size of the electron beam spot bombarding the rotating target disk 3, and the size of the beam spot is directly related to the size of the generated X-ray focus. Therefore, it is necessary to add a set of beam spot measurement components 5 that can detect and adjust the beam spot size, so that the beam spot size can be dynamically controlled in real time by adjusting the electron beam emission device.

[0038] Furthermore, the beam spot measurement component 5 includes a beam spot measurement target 8 for forming a beam spot, a measurement component for measuring the size of the beam spot, and a vertical moving component 4 for limiting the position of the beam spot measurement target. The beam spot measurement target 8 and the measurement component are fixed below the vertical moving component 4. The beam spot measurement target 8 and the measurement component are both fixed below the vertical moving component 4 to ensure that the up and down movement of the vertical moving component 4 simultaneously drives the up and down movement of the beam spot measurement target 8 and the measurement component. The positions of the beam spot measurement target 8 and the measurement component are relatively fixed, so as to facilitate the calculation of the size of the beam spot after conversion and facilitate the simultaneous removal of the beam center before target shooting to avoid affecting the target shooting process of the electron beam. Furthermore, the vertical moving component 4 is a vertical locking cylinder, and the end of the telescopic rod of the vertical locking cylinder is fixedly connected with the beam spot measurement target 8. The telescopic length of the cylinder is fixed, thereby ensuring that the movement path of the connected beam spot measurement target 8 is fixed, and the telescopic range of the vertical locking cylinder is just enough to allow the beam spot measurement target 8 to move between the upper and lower limit positions of the vacuum chamber 6, and the beam spot measurement target 8 will not collide with the inner wall of the vacuum chamber 6 due to exceeding the limit position. At the same time, due to the locking effect, after the limit position is in place, it can be ensured that the beam spot measurement target 8 will not be offset during the measurement process or the target plate 3, thereby not affecting the detection process and the target process. Furthermore, the vertical moving component 4 is a manual rod with a limit sleeve, and the limit sleeve is clamped to the manual rod when the manual rod is lifted, and the end of the manual rod is fixedly connected to the beam spot measurement target 8. Without being affected by the limiting sleeve, when the manual rod is pressed downward to the limit position, it is the limit position of the downward movement of the beam spot measurement target 8 fixed at the end of the vertical moving component 4. The manual rod is slowly pulled up until the top of the beam spot measurement target 8 is connected to the top of the inner wall of the vacuum chamber 6, which is the limit position of the upward movement. At this time, the manual rod is clamped from the outside with a limiting sleeve to prevent it from falling and affecting the target shooting of the electron beam.

[0039] Furthermore, the measuring component includes a reflector 9 and an imaging camera 10. The reflector 9 and the beam spot measurement target 8 are at an angle of 45 degrees, and the imaging camera 10 and the reflector 9 are at an angle of 45 degrees, and the imaging camera 10 is perpendicular to the beam spot measurement target 8. The electron beam hits the beam spot measurement target 8 and is irradiated onto the 45-degree reflector 9 through the beam spot measurement target 8. The 45-degree reflector 9 is then reflected and projected onto the imaging camera 10. The reflector 9 performs two 45-degree reflections, thereby projecting the horizontal beam spot into the lens set vertically upward, and then leading out through the signal line for easy observation. Furthermore, the beam spot measurement target 8 is a YAG target. YAG target is a more commonly used target material, which is simple and easy to obtain. When the electron beam hits the YAG target, a fluorescent reaction will be generated, so that the beam spot size can be conveniently measured indirectly by measuring the size of the fluorescent spot.

[0040] Further, the rotating target includes a target plate 3 bombarded by an electron beam to generate X-rays, a horizontal moving component 1 for moving the target plate 3 back and forth, and a rotating component for rotating the target plate 3. The bull's eye of the target plate 3 is fixed on the output shaft of the rotating component 2, and the rotating component 2 is fixed on the horizontal moving component 1. By moving the horizontal moving component 1, the rotating component 2 arranged on the horizontal moving component 1 is driven to move horizontally. The end of the output shaft of the rotating component 2 is fixedly connected to the central axis of the target plate 3. Therefore, the horizontal movement of the rotating component 2 directly drives the horizontal movement of the target plate 3, thereby realizing the mutual movement and giving way between the target plate 3 and the beam spot measurement target 8. Further, the horizontal moving component 1 is a horizontal locking cylinder, and the end of the telescopic rod of the horizontal locking cylinder is fixedly connected to the rotating component 2. The telescopic length of the cylinder is fixed, so as to ensure that the forward and backward movement path of the target disk 3 connected to the end of the output shaft of the rotating component 2 is fixed, and the telescopic range of the horizontal locking cylinder is just enough to make the target disk 3 move between the two extreme positions of the vacuum chamber 6, and the target disk 3 will not collide with the inner wall of the vacuum chamber 6 due to exceeding the extreme position. At the same time, due to the locking effect, after the extreme position is in place, it can be ensured that the target disk 3 will not be offset during the rotation process. Further, the horizontal moving component 1 is a slider and a slide rail with a limit block. The rotating component 2 is fixed on the slider, and the slider can only move back and forth along the axis direction of the output shaft of the rotating component 2 on the slide rail, and limit blocks are set at both ends of the slide rail, so that the target disk 3 connected to the end of the output shaft of the rotating component 2 can only move between the two extreme positions in the vacuum chamber 6, and the target disk 3 will not collide with the inner wall of the vacuum chamber 6 due to exceeding the extreme position. Further, the target disk 3 is a high atomic number target. The target disk 3 can be made of a material with a high atomic number such as tungsten, tantalum, gold, etc., and has a disc-shaped structure. During the rotation process, the electron beam bombards the target disk 3 near the periphery to generate X-rays. The target disk 3 is usually made of a high-Z material with a hard texture, fast heat transfer, and a high melting point, generally tungsten or tantalum. In this embodiment, the target disk 3 uses a tungsten target.

[0041] The target disk 3, the beam spot measurement target 8 and the measurement assembly are all arranged in the same vacuum chamber 6 to ensure that the beam of the electron beam 7 is not deflected by external forces. First, the vertical moving assembly 4 drives the beam spot measurement target 8 to do lifting and lowering movements. When the beam spot measurement target 8 is lifted, it will not interfere with the horizontal movement of the target disk 3. When the target disk 3 moves away from the incident port of the electron beam 7, the vertical moving assembly 4 drops to the limit position, driving the beam spot measurement target 8 to reach the center of the beam. The electron beam 7 hits the beam spot measurement target 8 vertically. The beam measurement target generally uses a YAG target. The electron beam 7 generates fluorescence when it hits the YAG target. A mirror is used for 45° reflection behind the beam spot measurement target 8 to reflect the light spot generated by the electron beam 7 to the charge coupled device (CCD) camera, and then the size of the light spot can be measured through the display of the CCD camera, such as Fig.10As shown. The transmission directions of the YAG target and the electron beam 7 are 90 degrees, so that the spot size of the electron beam 7 on the YAG target is strictly equal to the size of the electron beam 7. After being reflected by the 45-degree reflector 9, the size of the spot image on the CCD is also equal to the size of the electron beam 7, so that the size of the electron beam 7 can be accurately measured. After the beam spot size reaches the use requirements, the beam spot measurement target 8 is lifted. The horizontal moving component 1 is interconnected with the rotating component 2 and the target disk 3, and drives the rotating component 2 and the target disk 3 to move horizontally. When the beam spot measurement target 8 is lifted, the horizontal moving target disk 3 is moved to the extreme position close to the beam flow. At this time, the position of the target disk 3 and the beam spot measurement target 8 when it descends coincide, that is, the position where the YAG target forms the light spot is the same as the position where the target disk 3 forms the beam spot, but the two will not be in this position at the same time. At this time, the real size of the beam spot bombarded on the target disk 3 is the same as the size of the beam spot measured by the measurement target. The above method can accurately measure and control the beam spot size of the electron beam 7 on the target disk 3 to achieve the purpose of micro focus. In this way, the beam spot of the electron beam 7 generated by the electron source can be dynamically adjusted.

[0042] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made within the scope of this application should still fall within the scope of the present invention.

Claims

1. A high energy micro focus X-ray production equipment, characterized in that: It comprises an electron source assembly for generating a high-energy electron beam and a rotating target device for being bombarded by the electron beam to generate high-energy X-rays. The high-energy focused electron beam generated by the electron source assembly bombards the rotating target device to generate high-energy micro-focus X-rays. The rotating target device comprises a rotating target for dispersing the electron beam target energy and a beam spot measurement assembly for measuring the size of the electron beam spot. Both the rotating target and the beam spot measurement assembly can move relative to each other so that the electron beam forms a beam spot at the same position of the rotating target and the beam spot measurement assembly. The beam spot measurement assembly comprises a vertical moving assembly, a beam spot measurement target is fixedly connected to the bottom of the vertical moving assembly, and the vertical moving assembly is a vertical locking cylinder. The beam spot measurement target is fixedly connected to the end of the telescopic rod of the vertical locking cylinder to drive the beam spot measurement target to move in the vacuum chamber.

2. A high energy micro focus X-ray production equipment according to claim 1, characterized in that: The electron source assembly includes an electron source for generating an electron beam, a focusing assembly for focusing the electron beam, and a linear accelerator for increasing the energy of the electron beam. The electron beam generated by the electron source is accelerated by the linear accelerator and focused by the focusing assembly, and then bombards a rotating target to generate high-energy microfocus X-rays.

3. A high energy micro focus X-ray production equipment according to claim 2, characterized in that: The focusing assembly includes a solenoid disposed between the electron source and the linear accelerator.

4. A high energy micro focus X-ray production equipment according to claim 2, characterized in that: The focusing assembly comprises a strong focusing quadrupole lens group arranged between the linear accelerator and the rotating target.

5. The high energy micro focus X-ray production equipment according to claim 2, characterized in that: The linear accelerator includes a superconducting linear accelerator or a room temperature microwave linear accelerator.

6. The high energy micro-focus X-ray production equipment according to claim 2, characterized in that: The electron source includes a photocathode microwave electron gun, a cold cathode microwave electron gun, or a photocathode DC high-voltage electron gun.

7. The high energy micro focus X-ray production equipment according to claim 1, characterized in that: The beam spot measurement component includes a beam spot measurement target for forming a beam spot and a measurement component for measuring the size of the beam spot. The beam spot measurement target and the measurement component are fixed below the vertical moving component.

8. A high energy micro focus X-ray production equipment according to claim 7, characterized in that: The measuring component comprises a reflector and an imaging camera. The reflector forms an angle of 45 degrees with the beam spot measurement target. The imaging camera forms an angle of 45 degrees with the reflector. The imaging camera is perpendicular to the beam spot measurement target.

9. The high energy micro-focus X-ray production equipment according to claim 1, characterized in that: The rotating target comprises a target plate bombarded by an electron beam to generate X-rays, a horizontal moving assembly for moving the target plate back and forth, and a rotating assembly for rotating the target plate. The bull's eye of the target plate is fixed on an output shaft of the rotating assembly, and the rotating assembly is fixed on the horizontal moving assembly.

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