Encapsulated package with carrier, laminate, and member therebetween

Abstract

A method of manufacturing a package (100), wherein the method comprises mounting at least one electronic component (104) on a carrier (102), attaching a laminate (106) to the at least one electronic component (104), and filling at least a portion of a space (110) between the laminate (106) and the carrier (102) with an encapsulant (108), wherein the at least one electronic component (104) is mounted between the laminate (106) and the carrier (102).

Description

Technical Field

[0001] This invention relates to a method for manufacturing a package and a package itself. Background Technology

[0002] A package may include an electronic component, such as a semiconductor chip, mounted on a carrier, such as a lead frame. The package may be implemented as an encapsulated electronic component mounted on a carrier, the electronic component having electrical connections extending from the encapsulant and coupled to electronic peripherals. Within the package, the electronic component may be connected to the carrier via clips or bonding wires.

[0003] However, package manufacturing remains a highly labor-intensive process. Summary of the Invention

[0004] The package needs to be manufactured with a relatively small amount of work.

[0005] According to an exemplary embodiment, a method for manufacturing an encapsulation is provided, wherein the method includes: mounting at least one electronic component on a carrier; attaching a laminate to the at least one electronic component; and filling at least a portion of the space between the laminate and the carrier with an encapsulating agent, wherein the at least one electronic component is mounted between the laminate and the carrier.

[0006] According to another exemplary embodiment, an encapsulation body is provided, comprising: a carrier; at least one electronic component mounted on the carrier; a laminate attached to the at least one electronic component; and an encapsulant filling at least a portion of the space between the laminate and the carrier, wherein the at least one electronic component is mounted between the laminate and the carrier.

[0007] According to an exemplary embodiment, a package is provided that is a hybrid between a laminated structure and a carrier-based structure. For example, the laminate may include an organic material (e.g., a prepreg) that can be interconnected with one or more metal layers (e.g., copper foil) to form the laminate. The carrier may, for example, be a lead frame made of copper. An electronic component, such as a semiconductor chip, may be sandwiched between the laminate and the carrier. This arrangement may be placed at or within an encapsulation tool (e.g., a molding tool) to partially or completely fill the spaces between them with an encapsulating agent (e.g., a molding compound). This manufacturing architecture for producing the package can be performed with lower workload to produce multiple packages in parallel, resulting in high throughput and low cost. Simultaneously, this manufacturing architecture combines the advantages of lamination technology and carrier-based component mounting.

[0008] Description of other exemplary embodiments

[0009] Other exemplary embodiments of the encapsulation and method will be explained below.

[0010] In the context of this application, the term "package" may specifically refer to an electronic device that may include one or more electronic components mounted on a carrier. Optionally, at least a portion of the components of the package may be at least partially encapsulated by an encapsulating agent.

[0011] In the context of this application, the term "electronic component" may specifically cover semiconductor chips (particularly power semiconductor chips), active electronic devices (e.g., transistors), passive electronic devices (e.g., capacitors or inductors or ohmic resistors), sensors (e.g., microphones, light sensors, or gas sensors), actuators (e.g., loudspeakers), and microelectromechanical systems (MEMS). In particular, an electronic component may be a semiconductor chip having at least one integrated circuit element (e.g., a diode or transistor) in its surface portion. The electronic component may be a bare die or may have been packaged or encapsulated.

[0012] In the context of this application, the term "encapsulant" may particularly refer to a substantially electrically insulating and preferably thermally conductive material that surrounds electronic components and carriers and / or portions of a laminate to provide mechanical protection, electrical insulation, and optionally facilitates heat removal during the operation of the package.

[0013] In the context of this application, the term "carrier" can specifically refer to a support structure (preferably, but not necessarily, conductive) that serves as a mechanical support for one or more electronic components and may also facilitate electrical interconnection between the electronic components and the periphery of the package. In other words, a carrier can perform both a mechanical support function and, optionally, an electrical connection function. Preferably, but not necessarily, the carrier can be partially conductive or entirely conductive.

[0014] In the context of this application, the term "laminate" may specifically refer to a flat body (e.g., a sheet) formed from one or more interconnected laminated layers, i.e., layers that can be or have been interconnected by lamination. In particular, a laminate can be a material suitable for adhering together multiple laminated layers, for example, made of the same material. Thus, a laminate can be a sheet-like body made of one or more laminated or laminated layers. The at least one laminated layer can be connected to other layers by lamination, or configured to be connected to other layers by lamination. Lamination can be a connection of laminated layers using elevated temperatures, optionally accompanied by additional mechanical pressure applied to the stacked laminated layers. In particular, such a laminate can be a multilayer stack pressed from one or more dielectric organic layers and / or one or more metal foils. The one or more dielectric laminated layers can be, for example, prepreg layers. A prepreg is a material that includes a resin containing glass fibers. The laminate may also include one or more metal foils, which may be copper foils. More generally, a laminate may include at least one dielectric layer that is capable of curing, polymerizing and / or crosslinking during the lamination process, thereby contributing to adhesion between the multiple layers of a multilayer laminate.

[0015] Specifically, the material of the laminate or laminate can be epoxy resin or other polymers (such as polyimide) or other insulating materials filled with filler particles (especially glass particles, and more particularly glass fibers). Such materials can be provided as prepregs, i.e., as sheets in which the epoxy resin is uncured or not fully cured, so that it can be liquefied by providing heat. In the laminate, such prepreg sheets can be bonded to one or more copper foils attached during lamination. Resin-coated copper (RCC) is a combination of copper foil and uncured epoxy resin that does not contain glass fibers.

[0016] A key aspect of an exemplary embodiment is the formation of a hybrid package comprising a carrier (particularly a structured metal carrier, such as a copper metal carrier, like a lead frame) with one or more attached electronic components (particularly semiconductor dies) and an attached laminate. An encapsulating agent (e.g., a molding compound) can be supplied through one or more openings in the encapsulation tool and one or more openings in the carrier to a cavity that may already contain the laminate (e.g., comprising a prepreg sheet or a prepreg sheet composition thereof, and optionally having copper foil on the prepreg sheet).

[0017] In one embodiment, the carrier is a metallic (particularly structured, and more particularly patterned or etched) carrier, especially a lead frame. For example, the carrier can therefore be a metal sheet that can be structured, for example, by stamping or etching, to obtain a carrier with desired geometry. The carrier can then be assigned to a corresponding laminate and one or more electronic components mounted between the carrier and the laminate. Such a manufacturing architecture is compatible with the simultaneous and efficient mass production of multiple packages.

[0018] In one embodiment, the carrier includes a lead frame, particularly including die pads and a plurality of leads. Such a lead frame can be a sheet-like metal structure that can be patterned to form one or more die pads or mounting segments for mounting one or more electronic components of the package. The lead frame may also include one or more lead segments for providing electrical connection between the package and its electronic environment when the electronic components are mounted on the lead frame. In one embodiment, the lead frame can be a sheet of metal (particularly made of copper) that can be patterned, for example, by stamping or etching. Forming the carrier as a lead frame is cost-effective and a mechanically and electrically advantageous configuration because it combines the low-ohmic connection of at least one electronic component with the robust support capability of the lead frame. Furthermore, due to the high thermal conductivity of the metallic (particularly copper) material of the lead frame, the lead frame can contribute to the thermal conductivity of the package and can dissipate heat generated during the operation of the electronic components. The lead frame can include, for example, aluminum and / or copper.

[0019] Alternatively, the carrier can be implemented as a patterned printed circuit board (PCB). One or more openings can be provided on the PCB to allow the supply of liquid or viscous encapsulating material to the space defined between the at least one electronic component, the carrier, and the laminate.

[0020] In one embodiment, the laminate includes or consists of at least one prepreg layer. For example, the dielectric material of the laminate may be epoxy resin filled with glass fibers. Alternatively, the laminate may include a resin-coated copper (RCC) sheet, i.e., a layer of resin (without glass fibers) and an attached copper foil. Further alternatively, the laminate may include a BF (Build-up Film) layer, which is an epoxy resin composite material. ABF layers exhibit excellent process efficiency, ease of handling, and allow for a high degree of design freedom. However, other suitable dielectric materials may also be used for the dielectric portion of the laminate.

[0021] In one embodiment, the laminate includes at least one copper layer on a sheet comprising a dielectric laminateable material (e.g., at least one prepreg layer). The prepreg layer is commercially available in bulk form and can be attached to one or more carriers having substantially the same dimensions. The prepreg layer may initially be uncured to facilitate attachment to one or more electronic components and / or encapsulants during curing. By applying heat, the prepreg layer can become viscous and thus facilitate interconnection between the components of the package. It is also possible for one or more prepreg layers to interconnect with one or more copper layers.

[0022] In one embodiment, the laminate may include a copper layer. When a laminate having one or more copper layers is used, the copper layers can be used to provide electrical interconnections with electronic components and / or carriers.

[0023] In one embodiment, the encapsulant is a molding compound. In other words, molding can be used to fill the space between the laminate and the carrier, containing one or more electronic components. This is a simple technique that can be implemented reliably and at low cost to fill the space with a molding encapsulant. This improves the mechanical, electrical, and thermal integrity of the package. When encapsulation is achieved by molding, injection molding or transfer molding can be performed, for example. Vacuum molding may be preferred. For example, a properly encapsulated package (particularly electronic components with a carrier and a laminate) can be provided by placing the body between an upper molding tool and a lower molding tool and injecting liquid molding material between the upper and lower molding tools. After the molding material cures, the encapsulant is formed. If desired, the mold can be filled with particles that improve its properties, such as heat dissipation. In other exemplary embodiments, the encapsulant may also be a cast part or may be printed.

[0024] In one embodiment, the at least one electronic component includes at least one pad only on the main surface facing the carrier. Therefore, the electronic component can be positioned such that one or more pads are oriented directly toward the carrier, thereby establishing a direct conductive connection with the carrier. In another embodiment, the at least one electronic component includes at least one pad only on the main surface facing the laminate. In this alternative, one or more pads may be connected to or extend through the conductive material of the laminate. In yet another embodiment, the at least one electronic component includes at least one pad on the main surface facing the carrier and at least one additional pad on the main surface facing the laminate. In this third alternative, the pads are arranged both face up and face down simultaneously. This is an option for, for example, electronic components with vertical current flow. For example, the electronic component may be a transistor chip with a gate pad and a source pad on one main surface and a drain pad on the opposite main surface. Therefore, the combination of laminate technology and metal carrier plate technology allows for simultaneous electrical connection of face-up and face-down pads. The at least one electronic component may also have only one or more face-up pads or only one or more face-down pads.

[0025] In one embodiment, the encapsulant extends vertically beyond, and in particular completely covers, a main surface of the carrier, which is disposed opposite to another main surface of the carrier on which at least one electronic chip is mounted. By taking this measure, the encapsulant itself can be used to create a cost-effective isolation layer on top of the package, which can be manufactured without additional work.

[0026] In one embodiment, at least a portion of a main surface of the carrier is exposed relative to the encapsulant, and this main surface is disposed opposite to another main surface of the carrier on which at least one electronic chip is mounted. By exposing at least a portion of the main surface of the package to the encapsulant, the electrical connection of the fabrication-ready package to the electronic environment is simplified, such as the electrical connection to a mounting base (e.g., a printed circuit board, PCB) on which the package is mounted. Furthermore, this exposed conductive portion of the carrier can aid in heat dissipation and can therefore be used as a cooling feature, which may be advantageous, for example, in power semiconductor technology.

[0027] In one embodiment, the laminate includes a sheet containing a dielectric material (e.g., a prepreg sheet) and a metal layer (e.g., copper foil) on the sheet, and the sheet is disposed between the metal layer and at least one electronic component. For example, the copper foil may be disposed on the surface of the laminate, and electrical connections of one or more electronic components may be disposed on the dielectric sheet, i.e., on the laminated side, rather than on the side with the metal layer.

[0028] In one embodiment, the package includes at least one redistributed layer formed on and / or in a laminate. In the context of this application, the term "redistributed layer" can particularly refer to a layer or a multilayer structure having conductive and electrically insulating portions that facilitates the interface function between the small size of the electronic component and the large size of the external package contact portion. Forming such a redistributed layer on and / or in a laminate can simplify the connection of the package to an electronic environment such as a mounting substrate (e.g., a PCB).

[0029] In one embodiment, the package includes at least one vertical electrical connection element, each extending through at least a portion of the encapsulant and through at least a portion of the laminate. For example, such a vertical electrical connection element can electrically couple the laminate to a carrier. More specifically, the package may include at least one vertical electrical connection element extending through at least a portion of the encapsulant and through at least a portion of the laminate, and electrically coupling the at least one redistribution layer to the carrier. To refine the electrical interconnections within the hybrid package, conductive pillars or through-holes extending through at least a portion of the laminate and / or at least a portion of the encapsulant may be formed. Thus, even complex electrical coupling configurations can be achieved.

[0030] In one embodiment, at least 80%, particularly substantially the entire main surface of at least one electronic component, is attached to the laminate. When a major portion or even substantially the entire main surface area of ​​at least one electronic chip is attached to the laminate, the accumulation of molding compound filler particles in the area between the laminate and the electronic chip can be safely prevented. This prevents compromise to the integrity of the package and the accuracy of the mounting position and orientation of the electronic component on the laminate.

[0031] In one embodiment, the thickness of the support element is in the range of 20 μm to 3 mm, particularly in the range of 100 μm to 500 μm. Support elements of this size can also have length and width dimensions significantly larger than their thickness, thus allowing them to have a plate-like shape.

[0032] In one embodiment, the thickness of the laminate is in the range of 10 μm to 150 μm, particularly in the range of 20 μm to 40 μm. The laminate may be thinner than the carrier.

[0033] In one embodiment, the thickness of at least one electronic component is in the range of 15 μm to 1 mm, particularly in the range of 50 μm to 200 μm. The electronic component, such as a semiconductor diode, may also be thinner than the carrier.

[0034] Specifically, the thickness of the carrier can be greater than the thickness of the laminate, and can be greater than the thickness of at least one electronic component. More specifically, the thickness of the carrier can even be greater than the sum of the thickness of the laminate and the thickness of at least one electronic component. Therefore, among the carrier, laminate, and electronic component, the carrier can be the thickest structure. Traditionally, this can lead to problems with thickness balance. However, according to an exemplary embodiment, such problems do not occur because the encapsulating agent (especially the molding compound) allows for effective balancing of height differences.

[0035] In one embodiment, the package includes at least one additional electronic component mounted on (particularly directly on) or above the encapsulant (e.g., the additional electronic component has one or more additional structures between it and the encapsulant). Specifically, the at least one additional electronic component may be electrically coupled to at least one encapsulated electronic component. Thus, the package can be configured as a system having multiple surface-mount and / or encapsulated electronic components. In particular, the encapsulated electronic components can be electrically coupled to surface-mount electronic components. By taking this approach, even complex electronic assemblies can be manufactured.

[0036] In one embodiment, filling includes molding, particularly vacuum molding. Filling the space between the laminate, carrier, and one or more electronic components with a molding compound is a simple and reliable method to avoid large voids in the fabricated package. Vacuum molding is particularly advantageous in this case because it keeps the residual voids particularly small. Descriptively, the encapsulation tool (e.g., a molding tool surrounding the carrier, laminate, and mounted electronic components) may be provided with one or more openings for supplying precursor material of the encapsulant. The supplied precursor material of the encapsulant (e.g., a liquid molding compound) can then be cured or hardened to form a solid encapsulant.

[0037] In another embodiment, the filling includes printing, particularly inkjet printing, stencil printing, and screen printing. Therefore, the encapsulating material can also be supplied to the encapsulation tool according to the principles of inkjet printing or screen printing. Similarly, through printing, the spaces in the structure between the laminate, carrier, and electronic components can be reliably filled with printed encapsulating material.

[0038] In one embodiment, the method includes: inserting a laminate attached to at least one mounted electronic component into an encapsulation tool to define an encapsulation volume; injecting an encapsulating agent precursor into the encapsulation volume; and then curing the precursor. To ensure compliance with the method, the carrier may be provided with one or more encapsulating agent openings such that the encapsulating agent precursor can flow through the encapsulating agent openings and into the space. Therefore, the method may include filling at least a portion of the space by supplying the encapsulating agent precursor via at least one opening extending through the carrier.

[0039] In one embodiment, the method includes injecting a precursor as particles into the encapsulation volume. Providing a precursor as particles for encapsulation can reduce or even eliminate the risk of bubble formation, as liquid precursors may trap air before a vacuum is applied. Therefore, using particles as precursors for encapsulation can improve the mechanical and electrical integrity, performance, and reliability of the manufactured package.

[0040] In one embodiment, the method includes injecting a precursor into a volume that is more flexible than that of the laminate. Advantageously, the volume of the molded compound preform can be more flexible and resilient than that of the laminate. Therefore, problems such as void formation, stringent leadframe design specifications, and limitations on the thickness of electronic components can be addressed.

[0041] In one embodiment, the method includes manufacturing multiple packages by batch production. For example, packages with a size of 50x150mm can be used. 2 Up to 100x300mm 2 The laminate can be configured with typical panel sizes used in the PCB (Printed Circuit Board) industry, such as 18 inches x 24 inches or 21 inches x 24 inches. Panel sizes can also be 600 x 600 mm. 2 Or larger. Of course, other sizes are also possible. Since the standard size of the prepreg sheet can be larger than the standard size of the leadframe carrier, a single laminate sheet can also be combined with multiple carrier structures. In other words, multiple packages can be formed simultaneously, resulting in high throughput on an industrial scale. For this mass production, multiple electronic components of multiple packages can be sandwiched between the laminate and the carrier. Subsequently, these multiple preforms of multiple packages can be encapsulated with an encapsulating agent in a common process in an encapsulation tool. Electrical connections can then be formed for each of the packages that are still integrally connected. The structure thus obtained can then be separated into individual packages. Each of the packages may include a portion of the laminate, a portion of the carrier, and at least one of the electronic components, as well as a portion of the encapsulating agent. Such a manufacturing process is highly efficient.

[0042] In one embodiment, the carrier includes at least one encapsulation opening at least partially filled with encapsulating agent. The encapsulation opening of the carrier can be used to insert a precursor of the encapsulating agent into the space during encapsulation. Such an encapsulation opening may or may not be part of a fabrication-ready package. For example, these encapsulation openings may also be formed in a production line, where a structure comprising multiple packages to be separated is individualized along the production line after the panel-level package has been manufactured.

[0043] In a preferred embodiment, the encapsulation includes a mixed transition portion located between the laminate and the encapsulant, the transition portion comprising a mixture of the materials of the laminate and the encapsulant. Specifically, the mixed transition portion can bridge or separate the pure laminate material relative to the pure encapsulant material. In terms of the manufacturing process, this structural feature corresponds to performing the method in such a manner that, at the start of the filling, neither the encapsulant material nor the laminate material has cured. At the end of the filling, both the encapsulant material and the laminate material can be fully cured. When the curing (particularly polymerization or crosslinking) of both the encapsulant and dielectric laminate materials (e.g., epoxy resin) is triggered during encapsulation, the flow materials of both the laminate and the encapsulant can fuse or mix, thus forming a mixed region between the pure encapsulant material and the pure laminate material. Highly advantageously, such a transition portion can strongly promote adhesion between the encapsulant and the laminate. By taking this measure, the overall mechanical integrity of the encapsulation can be significantly improved. Advantageously, through fusion, the encapsulating material and the laminate material can flow together during manufacturing to form a single, inseparable structure, thereby significantly improving the robustness of the manufactured package.

[0044] Specifically, the hybrid transition section may have a certain percentage of laminate material and a certain percentage of encapsulating agent material, these percentages varying along the thickness direction of the hybrid transition section. The percentage of encapsulating agent material may decrease from pure encapsulating agent to pure laminate, while the percentage of laminate may increase from pure encapsulating agent to pure laminate. For example, the percentages may decrease continuously between pure encapsulating agent and pure laminate, respectively. Therefore, the hybrid transition section may exhibit a gradient distribution of the percentages of encapsulating agent and laminate material.

[0045] In another embodiment, the encapsulation includes an adhesion promoter at the interface between the laminate and the encapsulant to promote adhesion between the materials of the laminate and the encapsulant. In such an embodiment, the adhesion promoter layer can enhance the adhesion between the materials of the encapsulant (especially molding compounds) and the materials of the laminate (especially prepregs).

[0046] In one embodiment, the package includes a plurality of electronic components. Preferably, the package may include electronic components mounted on a carrier having at least two different thicknesses. The plurality of electronic components of the package can be interconnected via conductive structures of the laminate and / or the carrier, and optionally additional interconnect structures. Because the package design, and particularly its manufacturing method, is appropriately compatible with a plurality of different components of different heights, circuit designers can advantageously increase the flexibility to implement even complex electronic tasks. This increased flexibility is due to the encapsulating agent (especially molding compound) flowing into the empty gaps, even if these gaps are created by electronic components of different height levels.

[0047] In one embodiment, multiple electronic components having at least two different thicknesses are mounted at different vertical heights on a carrier. This can be achieved by having the upper main surfaces of the electronic components with different heights vertically aligned or flush with each other so that they are all in contact with the laminate. For example, this can be achieved by inserting at least a portion of the electronic components into one or more recesses in the carrier for providing height balance.

[0048] In another embodiment, only a portion of a plurality of electronic chips having at least two different thicknesses is mounted to contact the laminate. In such an embodiment, all electronic components are mounted at the same vertical height on their bottom main surface, which contacts the flat carrier.

[0049] In a preferred embodiment, the filling is performed after the attachment and after the mounting. This ensures that encapsulating material can flow into all voids between the carrier, the laminate, and one or more electronic components located between the carrier and the laminate.

[0050] In another embodiment, the filling is performed before the attachment and after the installation. Therefore, the laminate can be attached to the carrier and the upper main surface of the encapsulant after the encapsulant has cured.

[0051] In one embodiment, the package includes a plurality of electronic components mounted on a carrier. Therefore, the package may include a plurality of electronic components (e.g., at least one passive component such as a capacitor and at least one active component such as a semiconductor chip).

[0052] In one embodiment, the connection between the electronic component and the carrier is formed by a connection medium. For example, the connection medium may be a welded structure, a sintered structure, a fused structure, and / or an adhesive structure. Thus, the electronic component can be mounted on the carrier by welding, sintering, or fusion, or by adhesion or adhesive.

[0053] In one embodiment, the at least one electronic component includes at least one of a controller circuit, a driver circuit, and a power semiconductor circuit. All these circuits can be integrated into a single semiconductor chip or integrated into different chips. For example, a corresponding power semiconductor application can be implemented using one or more chips, wherein the integrated circuit elements of such a power semiconductor chip can include at least one transistor (particularly a MOSFET, metal-oxide-semiconductor field-effect transistor), at least one diode, etc. In particular, circuits implementing half-bridge functions, full-bridge functions, etc., can be fabricated.

[0054] As a substrate or wafer for use in semiconductor chips, a semiconductor substrate, namely a silicon substrate, can be used. Alternatively, silicon oxide or other insulating substrates can be provided. Germanium substrates or III-V semiconductor materials can also be implemented. For example, exemplary embodiments can be implemented using GaN or SiC technology.

[0055] The above and other objects, features and advantages of the invention will become apparent from the following description and appended claims in conjunction with the accompanying drawings, in which similar parts or elements are indicated by similar reference numerals. Attached Figure Description

[0056] The accompanying drawings, which are included to provide a further understanding of exemplary embodiments of the invention and form part of the specification, illustrate exemplary embodiments of the invention.

[0057] In the attached diagram:

[0058] Figure 1 A block diagram illustrating a method for manufacturing a package according to an exemplary embodiment is shown.

[0059] Figure 2 A cross-sectional view of a package according to an exemplary embodiment is shown.

[0060] Figure 3 A cross-sectional view of a package according to another exemplary embodiment is shown.

[0061] Figures 4 to 8 It shows the manufacturing process according to Figure 7 and Figure 8 A cross-sectional view of the structure obtained during the encapsulation of other exemplary embodiments shown in the figure.

[0062] Figure 9 A cross-sectional view of the package according to yet another exemplary embodiment is shown.

[0063] Figure 10 A cross-sectional view of the package according to yet another exemplary embodiment is shown.

[0064] Figure 11A cross-sectional view of a package according to another exemplary embodiment is shown.

[0065] Figure 12 A cross-sectional view of the package according to yet another exemplary embodiment is shown.

[0066] Figure 13 A cross-sectional view of the package according to yet another exemplary embodiment is shown.

[0067] Figure 14 The main surface of a batch package according to another exemplary embodiment is shown, the main surface being covered with copper foil.

[0068] Figure 15 It shows that according to Figure 14 The bulk packaged body on the main surface after the copper foil has been removed.

[0069] Figure 16 A cross-sectional view of an encapsulation according to yet another exemplary embodiment is shown, wherein the encapsulated components have different vertical thicknesses.

[0070] Figure 17 A cross-sectional view of an encapsulation according to yet another exemplary embodiment is shown, wherein the encapsulated components have different vertical thicknesses. Detailed Implementation

[0071] The illustrations in the attached figures are schematic and not to scale.

[0072] Before describing the exemplary embodiments in more detail with reference to the accompanying drawings, some general considerations will be summarized based on the extended exemplary embodiments.

[0073] According to an exemplary embodiment, a package having a laminate, at least one electronic component, and (preferably) a metallic carrier can be provided, wherein the gaps within the package can be at least partially filled with an encapsulating agent. More particularly, a panel-level molded-laminated hybrid package can be provided.

[0074] In traditional molded packages, the package density per strip is limited by the standard leadframe strip size. Improved package designs can be achieved by shifting to larger panel formats and primarily applying mass production, which reduces manufacturing workload. Furthermore, chip embedding solutions utilizing leadframes offer excellent electrical and thermal performance, but their workload hinders their widespread adoption.

[0075] Traditional leadframe processes can be used for back-end manufacturing. Each process stage can produce a small number of packages, resulting in a higher workload. Chip-embedded packages can be manufactured in large panels, but the manufacturing workload is very high due to the large workload, with lamination and structuring materials accounting for a significant portion.

[0076] An exemplary embodiment provides a package in which the package, based on a (particularly copper) carrier, has hybrid characteristics of molding and lamination materials. Such a package can be efficiently manufactured with a large panel strategy. The structural elements can be highly comparable to alternative chip-embedded packages. However, the high workload of structured prepregs, their difficulty in adhesion, and the laborious handling can be advantageously replaced by molding (or other types of encapsulation) processes. Simultaneously, prepreg sheets or additional laminates can be used in highly useful locations to allow for a thin layer on top of the chip with very good mechanical properties.

[0077] According to an exemplary embodiment, it is advantageous that only one process is required to handle the metal carrier and the laminate. The material volume and process flow can be advantageously controlled so that most of the chip surface is covered by the laminate material. This prevents large, difficult-to-remove filler particles from molding components and the like from entering this area. Furthermore, the excellent mechanical properties of the laminate can be optimally utilized. On the other hand, the molding compound can fill most of the outer surface to benefit from the inherently flexible volume of the process. Moreover, the laminate has a low coefficient of thermal expansion (CTE) in the z-direction (i.e., the vertical package direction), resulting in lower stress within the package.

[0078] The key feature of the exemplary embodiment is the use of a structured metal carrier (e.g., made of copper, such as a lead frame) with attached bare sheets to be molded into a cavity that already carries the laminate (optionally having copper foil on the prepreg sheet) through an opening.

[0079] It should be noted that the following figures are not drawn to scale. Typical thicknesses of the metal frame panels can range from 20 μm to 3 mm, particularly from 100 μm to 500 μm. Although exemplary embodiments can be implemented with non-distinct package designs, the package design according to an exemplary embodiment can be a QFN package.

[0080] During manufacturing, the assembly of components and carriers can be accomplished by encapsulating at least one electronic component in an upward and / or downward configuration. The upward-facing embodiment may involve additional connections between the lead frame and the redistribution layer, for example, this can be achieved by forming vertical conductive elements through laser drilling and plating. Embodiments with a downward orientation may include an optional second redistribution layer. Processes such as solder masking, plating of solderable coatings, or solder balls or solder arrays can also be implemented.

[0081] Other embodiments may include a single chip with vertical current and formed into a package similar to TDSON Blade3x3 or CanPak. Multi-chip components, such as half-bridges (optionally with drivers), full-bridges, or six-pack bridges (e.g., DrBladex.x, PQFN, VQFN), are particularly advantageous.

[0082] For such an embodiment, the following can be used: multiple islands on the carrier metal (optionally having an upward and downward configuration), a through-hole penetrating the laminate and the molding section, and a second redistribution layer. Additional layers can be added to one or both sides if desired.

[0083] One or both sides of the package can be used, for example, to mount additional (e.g., passive and / or active) components.

[0084] The components or packages of the exemplary embodiments can be used as SMD (surface mount device) components, but due to the thinness of the components, they can also be used as pre-assembly devices for embedding within printed circuit boards (PCBs).

[0085] In different embodiments, electronic components (e.g., any conductor chip) of varying heights can also be encapsulated. In particular, the thickest of these components is advantageously in direct contact with the laminate.

[0086] For example, a lead frame with the electronic components facing down can be provided on a prepreg (covered with copper foil if necessary) and encapsulated (especially molded) through one or more openings in the lead frame. Optionally, the copper can then be removed.

[0087] Figure 1 Block diagram 200 is shown, illustrating a method of manufacturing a package 100 according to an exemplary embodiment. The following reference numerals for the package 100 are taken from... Figure 2 Examples of implementations.

[0088] As shown in box 210, the method includes mounting an electronic component 104 onto a carrier 102. Box 220 illustrates the process of attaching a laminate 106 to the mounted electronic component 104. As shown in box 230, the method further includes filling at least a portion of the space between the laminate 106, where the electronic component 104 is mounted, and the carrier 102 with an encapsulating agent 108.

[0089] Figure 2 A cross-sectional view of a package 100 according to an exemplary embodiment is shown.

[0090] The illustrated package 100 includes a carrier 102. An electronic component 104 is mounted on the carrier 102. Furthermore, the package 100 includes a laminate 106 attached to the electronic component 104. Additionally, an encapsulant 108 is provided, which fills the space between the laminate 106 and the carrier 102 on which the electronic component 104 is mounted.

[0091] Figure 3 A cross-sectional view of a package 100 according to another exemplary embodiment is shown.

[0092] Figure 3 The package 100 includes additional electronic components 118 surface-mounted on the carrier 102 and electrically coupled to the encapsulated electronic components 104. More specifically, Figure 3 An embodiment using a PCB (printed circuit board) as a carrier 102 is shown, the PCB having at least one opening 142 for filling the space therebetween with the material of encapsulant 108. This is schematically shown by arrow 195.

[0093] As shown in detail 197, the encapsulant 100 includes an advantageous but optional adhesion promoter 199 at the interface between the laminate 106 and the encapsulant 108 to promote adhesion between the material of the laminate 106 and the material of the encapsulant 108.

[0094] Furthermore, the package 100 is constructed with a redistribution layer 114 and a through-hole connector. According to Figure 3 The package 100 includes a vertical electrical connection element 116 that extends vertically through the encapsulant 108 and through a portion of the laminate 106. In the illustrated example, the laminate 106 comprises a prepreg layer 120 and one or more optional copper layers 122 attached to the prepreg layer 120. In the illustrated embodiment, the prepreg layer 120 is sandwiched between the copper layers 122 and the electronic component 104. As shown, each electronic component 104 has a plurality of pads 112.

[0095] Figures 4 to 8 A cross-sectional view of the structure obtained during the manufacture of a package 100 according to another exemplary embodiment is shown. Figure 7 The image shows a fabrication-ready package 100, and... Figure 8 A modified version of the manufacturing-ready package 100.

[0096] refer to Figure 4The illustration shows an electronic component 104 mounted on a conductive carrier 102. In the illustrated embodiment, the electronic component 104 may be a semiconductor power chip, more particularly a transistor chip. Each of the electronic components 104 may have three pads 112. More particularly, when the electronic component 104 is implemented as a MOSFET (metal oxide semiconductor field effect transistor) chip, each electronic component 104 may include a gate pad and a source pad on one of its main surfaces. A drain pad may be formed on the opposite main surfaces of each electronic component 104. During operation, each MOSFET-type electronic component 104 may experience vertical current flow, i.e., along the direction of the current flow. Figure 4 The vertical current flows. The vertical thickness L of the electronic component 100 can be, for example, 60 μm. In the illustrated embodiment, all electronic components 104 can have the same vertical thickness L. However, alternatively, it is possible for different electronic components 104 of the same package 100 to have different vertical thicknesses L, and this is fully compatible with the described manufacturing process. The height difference between different electronic components 104 can be understood by referring to... Figure 5 and Figure 6 The molding process described is used to achieve balance.

[0097] The illustrated carrier 102 can be a plate-like structured metal plate (e.g., made of copper), such as a lead frame. The vertical thickness D of the carrier 102 can be, for example, 0.5 mm. Therefore, it can be seen that these figures are not drawn to scale. In many cases, the thickness D of the carrier 102 will be much larger than the thickness L of the electronic component 100. The connection between the carrier 102 and the corresponding pad 112 on the underside of the corresponding electronic component 104 can be achieved, for example, by welding, sintering, fusion, or gluing.

[0098] Descriptively, Figure 4 The structure shown can be obtained by attaching the bare die of electronic component 104 to a carrier 102 implemented as a structured lead frame. Figure 4 The left-side electronic component 104 has a drain pad on its lower main surface and a gate pad and a source pad on its upper main surface. Figure 4 The electronic component 104 in the center and on the right side has a drain pad on its upper main surface and a gate pad and a source pad on its lower main surface.

[0099] Still referencing Figure 4 The carrier 102 includes a plurality of encapsulation openings 142, which are used in the subsequent encapsulation process (compared to...). Figures 5 to 6 (transition), liquid or viscous precursors of encapsulating agents (see transition) Figure 6(See attached figure 108) Insertion is possible through multiple openings 142 Figure 4 and Figure 5 In the gaps between the components shown.

[0100] refer to Figure 5 ,Will Figure 4 The structure shown is flipped upside down (i.e. rotated 180°) and then its bottom side is attached to the laminate 106. By doing so, the previously exposed pad 112 of the electronic component 104 is attached to the laminate 106.

[0101] also, Figure 5 The thickness d of the laminate 106 is shown, which is typically in the range of 20 μm to 40 μm. See also the reference above. Figure 4 The parameters D and L are described below. The largest of these three parameters, d, D, and L, can be D, which is the thickness of the carrier 102. Due to the subsequent encapsulation procedure described below, liquid or viscous encapsulation material can be introduced... Figure 5 The gaps or spaces 110 between the various components of the structure shown are used to balance the thickness difference.

[0102] In the illustrated example, laminate 106 comprises a prepreg layer 120 and an optional copper layer 122 attached to the prepreg layer 120. In the illustrated embodiment, the prepreg layer 120 is sandwiched between the copper layer 122 and the electronic component 104. More generally, laminate 106 may include an organic sheet, such as an organic sheet comprising epoxy resin, and may also include glass cloth to increase the mechanical stability of laminate 106. One or more such prepreg layers 120 may be provided. Depending on the desired application, these one or more prepreg layers 120 may be interconnected with one or more copper layers 122.

[0103] like Figure 5 As shown, essentially the entire main surface of the electronic component 104 is connected to the laminate 106. This is crucial for the subsequent encapsulation process (compare). Figure 6 It has a positive effect and, in particular, can suppress the formation of unwanted voids inside the manufactured package 100.

[0104] As shown in the figure Figure 5 The arrangement can be placed as a whole in an encapsulation tool 159, such as a molding tool, for subsequent encapsulation. The illustrated arrangement formed by the laminate 106 attached to the mounted electronic component 104 can be inserted together into the encapsulation tool 159, which limits the encapsulation volume. Thereafter, an encapsulation process (particularly a molding process) can be performed to completely fill the space with the encapsulating agent 108, particularly a molding compound, preferably. Figure 6The space 110 between the components 102, 104, and 106 of the structure shown. For this purpose, a precursor of the encapsulating agent 108 (e.g., liquid or viscous) can be supplied to the space 110 via one or more supply openings 161 of the encapsulation tool 159 and through an opening 142 in the carrier 102, see [reference]. Figure 5 The arrow in the image.

[0105] Still referencing Figure 5 Electronic component 104 can be simply attached to prepreg layer 120 without curing the prepreg layer 120 during the attachment process. However, electronic component 104 can also be attached to prepreg layer 120 at elevated temperatures, where the material of prepreg layer 120 becomes tacky, thereby facilitating proper attachment of electronic component 104 to laminate 106. Descriptively, electronic component 104 attached to the tacky prepreg layer 120 can be embedded within the prepreg layer 120, thereby improving mechanical integrity. Embedding electronic component 104 within the tacky prepreg layer 120 also prevents relatively large molding compound filler particles from reaching electronic component 104. This safely prevents electronic component 104 from being interfered with by the molding material. Furthermore, the subsequent laser drilling process for forming electrical contacts for external contact with the encapsulated electronic component 104 will not be affected by large molding particles.

[0106] Figure 6 The results of the described encapsulation procedure are shown. Figure 5 After the structure shown is inserted into the encapsulation tool 159 to define the encapsulation volume, a precursor of the encapsulant 108 (particularly an uncured molding compound with filler particles, not shown) can be injected into the encapsulation volume through one or more holes in the encapsulation tool 159. The precursor can then be cured to solidify with the encapsulant 108 and permanently fill the encapsulation volume, including the space 110. Preferably, to avoid void formation, the precursor can be injected into the encapsulation volume as particulate matter. Furthermore, it has proven advantageous to inject the precursor into the encapsulation volume in a volume softer than that of the laminate 106. Preferably, the encapsulation process can be performed by vacuum molding to suppress the formation of undesirable voids within the encapsulant 108. Due to the described encapsulation procedure, the space 110 between the laminate 106 and the carrier 102, where the electronic component 104 is mounted, is filled with the encapsulant 108, which in the illustrated embodiment is a molding compound.

[0107] As an alternative to the described molding process, encapsulation can also be accomplished by inkjet printing via a corresponding opening in the encapsulation tool.

[0108] Refer again Figure 6The molding compound located on top of the carrier 102 can be advantageously used as an insulating layer and can achieve reliable dielectric encapsulation with less effort.

[0109] The materials involved in the described manufacturing process can be handled roll-to-roll, making it fully automated. Using vacuum molding to remove trapped air inside the leadframe carrier 102 may be advantageous. Experiments have shown that, undesirably, using liquid molding compounds in compression molding can pose a risk of bubble formation because the liquid may trap air before a vacuum is applied. Using particulate matter can overcome this problem. It is also advantageous that the volume of the molding compound is more flexible than that of the laminate, as this can suppress or even eliminate issues such as voids, stringent leadframe design specifications, and chip thickness limitations.

[0110] Similarly, Figure 6 As shown, an additional metal layer, such as an additional copper foil 122, can be attached to the upper main surface of the illustrated structure. This additional copper foil 122 or other suitable metal layer can improve the performance of the structure. For example, the additional copper foil 122 or other suitable metal layer can be used to provide electromagnetic shielding for the fabricated package 100 and / or can simplify the attachment of the coolant (not shown) to the package 100, for example, by welding or sintering.

[0111] like Figure 6 As shown in detail 146, the illustrated structure (and thus the manufactured-ready package 100) may include a mixed transition portion 144 at the interface between the prepreg layer 120 of the laminate 106 and the molding encapsulant 108. The mixed transition portion 144 may comprise a mixture of the pure materials of the laminate 106 and the pure materials of the encapsulant 108. The mixed transition portion 144 is highly advantageous because it significantly improves the adhesion between the materials of the encapsulant 108 and the laminate 106. The aforementioned mixed transition portion 144 can be formed by adjusting the manufacturing process such that, at the start of the filling or encapsulation process of filling or encapsulating space 110 with the material of the encapsulant 108, both the materials of the encapsulant 108 and the laminate 106 may not yet be cured. In other words, both the encapsulant 108 material and the prepreg material of the laminate 106 can still be made flowable by providing heat, so that the encapsulant 108 material and the prepreg material of the laminate 106 can become liquid or viscous, and can begin crosslinking, polymerization and / or curing, thereby being mixed in the mixing transition section 144 before finally becoming solid. For the purpose of improving adhesion within the encapsulation, it is also preferable to first form according to... Figure 5 The structure is then modified, and then a molding and curing process is performed.

[0112] refer to Figure 7The redistribution layer 114 can be formed partially on and partially within the laminate 106. This can involve patterning the copper layer 122 of the laminate 106. It can also involve forming openings in the prepreg layer 120 for exposing the pads 112 on the lower main surface of the electronic components 104. The resulting openings can then be filled with a conductive material such as copper, for example, by plating. For example, the redistribution layer 114 can be formed subsequently by copper plating using a photolithography process. Through-holes can also be formed if desired or required. Thus, a redistribution layer 114 is obtained to bridge the smaller dimensions of the chip pads 112 with respect to the larger dimensions of the external contact surfaces of the package 100.

[0113] If there is no desired or necessary exposure of conductive surfaces on the upper main surface, then according to an exemplary embodiment, Figure 7 The structure shown can already be used as the package 100.

[0114] However, alternatively, refer to Figure 8 The upper main surface of the carrier 102 can be exposed by removing the material of the encapsulant 108 above the carrier 102. The result of this process of exposing the upper main surface of the carrier 102 by removing the encapsulant material (e.g., by grinding or milling) is... Figure 8 As shown in the image.

[0115] The illustrated package 100 includes a conductive carrier 102, implemented herein as a copper lead frame. A MOSFET-type power semiconductor electronic component 104 is mounted on the carrier 102, for example, by soldering, sintering, welding, or gluing. A prepreg-based laminate 106 is attached to a pad 112 on the opposite side of the electronic component 104 and provides the basis for the redistribution layer 114. A molding encapsulant 108 fills the gap or space 110 between the laminate 106, in which the electronic component 104 is mounted, and the carrier 102.

[0116] Figure 8 The package 100 shown can be obtained by exposing conductive and thermally conductive structures on two opposite main surfaces of the package 100, for example, by grinding. Thus, a package 100 with double-sided cooling can be obtained, that is, heat generated inside the package 100 can be removed via the two opposite main surfaces during operation.

[0117] like Figure 8 As schematically shown, an additional electrically insulating and thermally conductive layer 140 may be provided on top of the package 100, i.e., an additional layer that partially covers the carrier 102 and partially covers the encapsulant 108. For example, this additional electrically insulating and thermally conductive layer 140 may be a thermal interface material (TIM), which may optionally include filler particles for enhancing the thermal conductivity of the TIM.

[0118] Although it has been referenced Figures 4 to 8 The manufacture of a single package 100 has been described; however, it should be understood that the described manufacturing architecture can be implemented to manufacture multiple packages 100 partially or completely simultaneously through batch manufacturing. For this purpose, the aforementioned carrier 102 can be provided for use with multiple such packages 100. Accordingly, the aforementioned laminate 106 can be provided in a size sufficient to jointly manufacture multiple such packages 100, i.e., in panel form. After such panel-level laminate 106 is processed together with one or more carriers 102 and multiple electronic components 104, and after encapsulating this structure through a common encapsulation process, the resulting structure can be divided into multiple individual packages 100. This can be achieved, for example, by sawing, laser cutting, or etching. Thus, multiple packages 100 can be manufactured on an industrial scale with high productivity and therefore with less work.

[0119] Although not shown, the resulting package 100 can be attached, for example, to a mounting substrate such as a printed circuit board (PCB).

[0120] Figure 9 A cross-sectional view of a package 100 according to another exemplary embodiment is shown. Figure 9 The package 100 includes a vertical electrical connection element 116 that extends vertically through the carrier 102 and through the laminate 106. Figure 9 In the illustrated embodiment, the vertical electrical connection element 116 is a through-hole formed by copper plating. The vertical electrical connection element 116 electrically couples the redistribution layer 114 to the carrier 102.

[0121] Figure 9 A package 100 according to another exemplary embodiment is shown, the package 100 being configured as a half-bridge. For this purpose, the redistribution layer 114 can be further structured. Figure 9 In this embodiment, the left electronic component 104 is configured as a low-side MOSFET chip, the central electronic component 104 is configured as a high-side MOSFET chip, and the right electronic component 104 is configured as a driver chip. Therefore, according to... Figure 9 The electronic device 100 is a half-bridge with a driver, which is realized by a redistribution layer 114 and a through-piece connection in the form of a vertical electrical connection element 116.

[0122] Figure 10 A cross-sectional view of a package 100 according to another exemplary embodiment is shown. Figure 10An example of a half-bridge with a driver chip is shown, implemented by a redistribution layer 114 and a through-piece connection, see vertical electrical connection element 116 connecting the laminate 106 to the carrier 102. Figure 10 This illustrates an embodiment with additional redistribution layers 114, namely, two redistribution layers 114 on the bottom portion of the package 100.

[0123] Figure 11 A cross-sectional view of a package 100 according to another exemplary embodiment is shown. This embodiment illustrates a QFN-type package 100 as a mold-laminate hybrid.

[0124] Figure 12 A cross-sectional view of a package 100 according to another exemplary embodiment is shown. Figure 12 This configuration is shown in which a vertical electrical connection element 116 is implemented to connect the lower main surface to the laminate 106 on the top main surface of the package 100.

[0125] Figure 13 A cross-sectional view of a package 100 according to another exemplary embodiment is shown. Figure 13 The package 100 includes additional electronic components 118 surface-mounted on the encapsulant 108 and electrically coupled to the encapsulated electronic components 104. More specifically, Figure 13 An embodiment is shown in which package 100 is configured as a half-bridge with a driver chip, implemented via a redistribution layer 114 and a through-hole connection. Passive components (e.g., coils) or active components (e.g., light-emitting diodes, laser diodes, or semiconductor dies) or additional packages (e.g., the additional package 100 described herein according to exemplary embodiments) may be provided as additional electronic components 118 located on top.

[0126] Figure 14 The main surface of a package 100 of a batch 150 still integrally connected according to another exemplary embodiment is shown, the main surface being covered by copper foil 122. Figure 15 The following is shown after the copper foil 122 has been removed by etching. Figure 14 A batch of 150 packages with a 100 main surface.

[0127] therefore, Figure 14 and Figure 15 The diagram shows multiple packages 100 that are still connected at the panel level. In the illustrated embodiment, each package 100 corresponds to a half-bridge configuration, as described above. The prepreg material of the laminate 106 is translucent, therefore... Figure 15In the image, one can see the surrounding frame structure of the carrier 102 and the metal parts of each package 100.

[0128] Figure 16 A cross-sectional view of a package 100 according to yet another exemplary embodiment is shown, wherein the embedded components 104 have different vertical thicknesses l and L. Therefore, the package 100 may include a plurality of electronic components 104 with different thicknesses mounted on the same carrier 102, where L > l in the present case. Figure 16 The bottom surface of component 104 is mounted at the same vertical height as the planar support 102. However, depending on the different thicknesses L and l, only one electronic component 104 is mounted to contact the laminate 106. Figure 16 The lower main surface of electronic component 104, rather than the upper main surface, is aligned.

[0129] Figure 17 A cross-sectional view of a package 100 according to yet another exemplary embodiment is shown, wherein the embedded members 104 have different vertical thicknesses l and L. Similarly, according to Figure 17 The package 100 includes electronic components 104 of different thicknesses (L>l) mounted on the same carrier 102. However, according to Figure 17 Electronic components 104 with different thicknesses l and L are mounted at different vertical heights on a carrier 102. For this purpose, the carrier 102 is provided with recesses into which the electronic components 104 with a larger thickness L are inserted. The depth B of the recess satisfies the equation B = L⁻¹. Electronic components 104 with a smaller thickness l are mounted on the planar portion of the carrier 102. Therefore, the recesses balance the thickness difference between the electronic components 104 with different thicknesses l and L, thereby ensuring that the upper main surface of the electronic components 104 can directly contact the planar laminate 106. Figure 17 The upper main surface of electronic component 104, rather than the lower main surface, is aligned.

[0130] It should be noted that the term "comprising" does not exclude other elements or features, and "a" or "an" does not exclude a plurality. Similarly, elements described in different embodiments may be combined. It should also be noted that reference numerals should not be construed as limiting the scope of the claims. Furthermore, the scope of this application is not intended to be limited to specific embodiments of the processes, machines, manufactures, compositions of matter, apparatuses, methods, and steps described in the specification. Therefore, the appended claims are intended to include such processes, machines, manufactures, compositions of matter, apparatuses, methods, or steps within their scope.

Claims

1. A package (100) comprising: • A structured lead frame (102) including at least one opening (142), or a structured printed circuit board (102) including at least one opening (142); • At least one electronic component (104) mounted on the lead frame (102) or the printed circuit board (102); • A laminate (106) attached to at least one electronic component (104); and • Encapsulant (108) filling at least a portion of the space (110) between the laminate (106) and the lead frame (102) or printed circuit board (102), wherein the at least one electronic component (104) is mounted between the laminate (106) and the lead frame (102) or printed circuit board (102), wherein, The at least one electronic component (104) includes at least two pads (112) on the main surface facing the lead frame (102) or the printed circuit board (102), and at least one additional pad (112) on the other main surface facing the laminate (106). The at least two pads (112) located on the main surface facing the lead frame (102) or the printed circuit board (102) are laterally offset in opposite directions relative to the opening (142) in a cross-sectional view of the package (100). The at least one opening (142) is at least partially filled with an encapsulating agent (108).

2. The package (100) according to claim 1, characterized in that, The package (100) includes one of the following features: • The encapsulant (108) extends vertically beyond a main surface of the lead frame (102) or printed circuit board (102), which is disposed opposite to another main surface of the lead frame (102) or printed circuit board (102) on which the at least one electronic component (104) is mounted. • At least a portion of a main surface of the lead frame (102) or printed circuit board (102) is exposed relative to the encapsulant (108), the main surface being disposed opposite to another main surface of the lead frame (102) or printed circuit board (102) on which the at least one electronic component (104) is mounted.

3. The package (100) according to claim 2, characterized in that, The encapsulant (108) completely covers one main surface of the lead frame (102) or printed circuit board (102), which is opposite to another main surface of the lead frame (102) or printed circuit board (102) on which the at least one electronic component (104) is mounted.

4. The package (100) according to any one of claims 1-3, characterized in that, The laminate (106) includes a sheet containing dielectric material and a metal layer located on the sheet, wherein the sheet is disposed between the metal layer and the at least one electronic component (104).

5. The package (100) according to any one of claims 1-3, characterized in that, The package (100) includes a redistribution layer (114) formed on and / or in the laminate (106).

6. The package (100) according to any one of claims 1-3, characterized in that, The package (100) includes a plurality of redistribution layers (114) formed on and / or in the laminate (106).

7. The package (100) according to any one of claims 1-3, characterized in that, The encapsulation (100) includes at least one vertical electrical connection element (116), each vertical electrical connection element (116) extending through at least a portion of the encapsulant (108) and through at least a portion of the laminate (106).

8. The package (100) according to claim 7, characterized in that, The at least one vertical electrical connection element (116) electrically couples the laminate (106) to the lead frame (102) or the printed circuit board (102).

9. The package (100) according to any one of claims 1-3 and 8, characterized in that, The package (100) includes at least one of the following features: • The thickness (D) of the lead frame (102) or printed circuit board (102) is 20 μm to 3 mm; The thickness (d) of the laminate (106) is 10 μm to 150 μm; • The thickness (L) of the at least one electronic component (104) is from 15 μm to 1 mm; • The thickness (D) of the lead frame (102) or printed circuit board (102) is greater than the thickness (d) of the laminate (106) and greater than the thickness (L) of the at least one electronic component (104).

10. The package (100) according to claim 9, characterized in that, The package (100) includes at least one of the following features: • The thickness (D) of the lead frame (102) or printed circuit board (102) is 100 μm to 500 μm; The thickness (d) of the laminate (106) is 20 μm to 40 μm; • The thickness (L) of the at least one electronic component (104) is 50 μm to 200 μm; • The thickness (D) of the lead frame (102) or printed circuit board (102) is greater than the sum of the thickness (d) of the laminate (106) and the thickness (L) of the at least one electronic component (104).

11. The package (100) according to any one of claims 1-3, 8, and 10, characterized in that, The package (100) includes at least one additional electronic component (118) mounted on or above the encapsulant (108), lead frame (102), or printed circuit board (102).

12. The package (100) according to claim 11, characterized in that, The at least one additional electronic component (118) is at least one of an active component and a passive component, and / or the at least one additional electronic component (118) is electrically coupled to the encapsulated at least one electronic component (104).

13. The package (100) according to any one of claims 1-3, 8, 10, and 12, characterized in that, The package (100) includes one of the following features: • The encapsulation body (100) includes a mixing transition portion (144) at the interface between the laminate (106) and the encapsulant (108), wherein the mixing transition portion (144) includes a mixture of the material of the laminate (106) and the material of the encapsulant (108); The encapsulation (100) includes an adhesion promoter (199) at the interface between the laminate (106) and the encapsulant (108) for promoting adhesion between the material of the laminate (106) and the material of the encapsulant (108).

14. The package (100) according to claim 13, characterized in that, The hybrid transition section (144) bridges the pure laminate material with the pure encapsulant material.

15. The package (100) according to any one of claims 1-3, 8, 10, 12, and 14, characterized in that, The package (100) includes a plurality of electronic components (104) mounted on a lead frame (102) or a printed circuit board (102).

16. The package (100) according to claim 15, characterized in that, The plurality of electronic components (104) have at least two different thicknesses (L, l).

17. The package (100) according to claim 16, characterized in that, The package (100) includes at least one of the following features: • Multiple electronic components (104) having at least two different thicknesses (l, L) are mounted at different vertical heights on the lead frame (102) or the printed circuit board (102); Only a portion of the multiple electronic components (104) having at least two different thicknesses (l, L) are mounted to contact the laminate (106).

18. A method for manufacturing a package (100), wherein, The method includes: • Mount at least one electronic component (104) on a lead frame (102) including at least one opening (142) or on a printed circuit board (102) including at least one opening (142); • Attach the laminate (106) to the at least one electronic component (104); and • At least a portion of the space (110) between the laminate (106) and the lead frame (102) or printed circuit board (102) is filled with an encapsulant (108), wherein the at least one electronic component (104) is mounted between the laminate (106) and the lead frame (102) or printed circuit board (102), wherein, The at least one electronic component (104) includes at least two pads (112) on the main surface facing the lead frame (102) or the printed circuit board (102), and at least one additional pad (112) on the other main surface facing the laminate (106). The at least two pads (112) located on the main surface facing the lead frame (102) or the printed circuit board (102) are laterally offset in opposite directions relative to the opening (142) in a cross-sectional view of the package (100). The at least one opening (142) is at least partially filled with an encapsulating agent (108).

19. The method according to claim 18, characterized in that, Filling includes either molding or printing.

20. The method according to claim 19, characterized in that, The molding is vacuum molding, and the printing is one of inkjet printing, stencil printing, and screen printing.

21. The method according to any one of claims 18-20, characterized in that, The method includes: • A laminate (106) is arranged at the encapsulation tool (159), the laminate (106) being attached to at least one electronic component (104) mounted on the lead frame (102) or printed circuit board (102); • Inject the precursor of the encapsulating agent (108) into the encapsulation volume defined by the encapsulation tool (159); The precursor is then cured.

22. The method according to any one of claims 18-20, characterized in that, The method includes manufacturing multiple packages (100) in a mass production manner.

23. The method according to any one of claims 18-20, characterized in that, The method includes one of the following features: The filling is performed after the attachment and after the installation; The filling is performed before the attachment and after the installation.

24. The method according to any one of claims 18-20, characterized in that, The method includes at least one of the following features: • At the start of the filling process, neither the encapsulant (108) nor the laminate (106) has cured. The method includes filling at least a portion of the space (110) by supplying a precursor of encapsulant (108) via the at least one opening (142) extending through the lead frame (102) or printed circuit board (102).

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